CN116137197A - Composite substrate and circuit board - Google Patents
Composite substrate and circuit board Download PDFInfo
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- CN116137197A CN116137197A CN202310424372.6A CN202310424372A CN116137197A CN 116137197 A CN116137197 A CN 116137197A CN 202310424372 A CN202310424372 A CN 202310424372A CN 116137197 A CN116137197 A CN 116137197A
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- composite substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/006—Thin film resistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/01—Mounting; Supporting
- H01C1/012—Mounting; Supporting the base extending along and imparting rigidity or reinforcement to the resistive element
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/16—Resistor networks not otherwise provided for
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
Abstract
The invention provides a composite substrate and a circuit board, wherein the composite substrate comprises a substrate layer and a resistance layer, a plurality of protrusions are arranged on the surface of one side, close to the resistance layer, of the substrate layer, and the roughness Rz of the surface of one side, close to the resistance layer, of the substrate layer is 1 mu m-15 mu m. According to the technical scheme, the sheet resistance uniformity of the resistance layer of the composite substrate is improved, the embedded resistor with higher precision is prepared, and the improvement of the performance of a circuit board and even an electronic element is facilitated.
Description
Technical Field
The invention relates to the technical field of thin film resistors, in particular to a composite base material and a circuit board.
Background
With the rapid development of wireless communication and electronic devices, the electronic devices are evolving towards miniaturization, miniaturization and slimness, which requires that the components inside the electronic devices be as miniaturized and thinned as possible. The resistor element in the electronic equipment is evolved from a plug-in resistor with pins to a chip resistor, and then from the chip resistor to a buried resistor, so that the electronic equipment gradually develops to be light and thin. The application process of the embedded resistor is approximately as follows: and attaching the composite substrate to a circuit board, and etching the embedded resistor through an etching process. The composite substrate comprises a basal layer and a resistance layer positioned on one side surface of the basal layer, and one side surface of the resistance layer, which is far away from the basal layer, is suitable for being attached to a circuit board.
However, the conventional composite substrate has poor sheet resistance uniformity, which is unfavorable for preparing embedded resistors with higher precision.
Disclosure of Invention
Therefore, the technical problem to be solved by the invention is how to improve the sheet resistance uniformity of the embedded resistor, thereby providing a composite substrate and a circuit board.
The first aspect of the invention provides a composite substrate, which comprises a base layer and a first resistance layer, wherein the first resistance layer is arranged on at least one side surface of the base layer in a lamination mode, a plurality of bulges are arranged on one side surface of the base layer facing the first resistance layer, and the roughness Rz of the side surface of the base layer with the bulges is 1 mu m-15 mu m.
Optionally, at least part of the protrusions fulfill the following condition: the average cross-sectional area from the bottom of the protrusion to 1/2 of the height of the protrusion is greater than the average cross-sectional area from the 1/2 of the height of the protrusion to the top of the protrusion.
Optionally, at least part of the protrusions fulfill the following condition: the minimum cross-sectional area from the bottom of the protrusion to 1/2 of the height of the protrusion is greater than or equal to the maximum cross-sectional area from the 1/2 of the height of the protrusion to the top of the protrusion.
Optionally, at least part of the protrusions fulfill the following condition: the minimum value of the width from the bottom of the protrusion to the 1/2 height of the protrusion is not less than the maximum value of the width from the 1/2 height of the protrusion to the top of the protrusion.
Optionally, the average cross-sectional area of the bottom of the protrusion to 1/2 of the height of the protrusion is at least 30% greater than the average cross-sectional area of the protrusion to the top of the protrusion at 1/2 of the height of the protrusion.
Optionally, the minimum cross-sectional area of the bottom of the protrusion to 1/2 of the height of the protrusion is greater than or equal to at least 30% of the protrusion's maximum cross-sectional area to the top of the protrusion at 1/2 of the height of the protrusion.
Optionally, the minimum value of the width from the bottom of the protrusion to 1/2 of the height of the protrusion is not less than at least 30% of the ratio of protrusions from the 1/2 of the height of the protrusion to the maximum value of the width of the top of the protrusion.
Optionally, the maximum value of the width of the 1/2 height of the protrusion is 1 mu m-10 mu m.
Optionally, the height of the protrusion is 1 mu m-15 mu m.
Optionally, the thickness of the first resistance layer is 5nm-3 μm.
Optionally, the thickness of the first resistance layer is 10nm-200nm.
Optionally, the composite substrate further includes a film layer located on a surface of the first resistive layer away from the base layer.
Optionally, the thickness of the film layer is 0.5 μm-100 μm.
Optionally, a conductive layer is disposed on a side of the film layer away from the first resistive layer.
Optionally, the conductive layer is a single-layer conductive layer or a multi-layer conductive layer.
Optionally, a second resistive layer is disposed between the film layer and the conductive layer.
Optionally, the material of the substrate layer is a conductive material or a dielectric material; the conductive material comprises at least one of copper, aluminum, titanium, zinc, iron, nickel, chromium, cobalt, silver, or gold; the material of the resistive layer includes at least one element of Ni, cr, si, P, N, ti, pt, ta, mo, sn or O.
A second aspect of the present invention provides a circuit board comprising the composite substrate described above.
The technical scheme of the invention has the following advantages:
according to the composite substrate and the circuit board provided by the invention, the roughness of the surface of the substrate layer close to the resistor layer is controlled, so that the sheet resistance uniformity of the resistor layer is improved, the embedded resistor with higher precision can be prepared, and the performance of the circuit board and even the electronic element can be improved. In addition, the resistance layer and the basal layer are arranged in the same shape, namely, the resistance layer is in a wavy shape, so that the peeling strength between the composite base material and the circuit board is improved, the composite base material is not easy to peel from the circuit board, and the structural stability of the electronic equipment is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present invention, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
FIG. 1 is a longitudinal cross-sectional SEM scan of a composite substrate;
FIG. 2 is an SEM scan of a protrusion of a composite substrate according to an embodiment of the present invention;
FIG. 3 is a longitudinal cross-sectional SEM scan of a composite substrate according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a lamination relationship of a composite substrate according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of a lamination relationship of another composite substrate according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of a lamination relationship of another composite substrate according to an embodiment of the present invention;
FIG. 7 is a schematic diagram of a lamination relationship of another composite substrate according to an embodiment of the present invention;
reference numerals illustrate:
1-a substrate layer; 11-protrusions; 2-a first resistive layer; 3-a film layer; 4-a conductive layer; 5-a second resistive layer.
Detailed Description
The following description of the embodiments of the present invention will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the invention are shown. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.
In addition, the technical features of the different embodiments of the present invention described below may be combined with each other as long as they do not collide with each other.
It should be understood that, in order to improve the peel strength of the composite substrate and the circuit board, to avoid the separation of the composite substrate and the circuit board, a plurality of protrusions are generally formed on one side surface of the base layer, so that one side surface of the base layer has a certain roughness, so that the resistive layer formed on the rough surface of the base layer presents a corresponding undulating shape.
The applicant has found that, with reference to fig. 1, when the smallest cross-sectional area in the protrusion 11 is located in the middle region of the protrusion 11, and the largest cross-sectional area from the middle region of the protrusion 11 to the top of the protrusion 11 is much larger than the smallest cross-sectional area, it is easy to cause the resistive material to be difficult to deposit relatively uniformly onto the roughened surface of the base layer 1 (see the region outlined by the dotted line in fig. 1), resulting in poor uniformity of the resistive layer deposited on the base layer 1; too much roughness of the base layer can also result in poor deposition uniformity of the resistive layer. The poor deposition uniformity of the resistor layer results in poor sheet resistance uniformity of the resistor layer, which is unfavorable for preparing embedded resistors with higher precision and affects the performance of the circuit board and even the electronic element. It should be noted that, the surface of the substrate layer having the protrusions in fig. 1 is deposited with a resistive layer, but the resistive layer is thin, which cannot be seen in fig. 1.
Based on this, referring to fig. 2-4, the present embodiment provides a composite substrate comprising:
the substrate comprises a substrate layer 1, wherein at least one side surface of the substrate layer 1 is provided with a plurality of bulges 11, and the roughness Rz of the side surface of the substrate layer 1 with the bulges 11 is 1 mu m-15 mu m;
a first resistive layer 2, the first resistive layer 2 is located on a surface of the base layer 1, which has the protrusion 11, and the thickness of the first resistive layer is very thin, and the first resistive layer is in a shape of being covered on the base layer, and the two shapes are basically the same; the roughness of the substrate layer of the present invention is measured from the side of the first resistive layer remote from the substrate layer.
Through setting for the roughness Rz that the stratum basale 1 has the protruding 11 one side surface to be 1 mu m-15 mu m to the sheet resistance homogeneity of first resistive layer 2 has been improved, the embedded resistance that is favorable to preparing to have higher precision is favorable to the promotion of circuit board and even electronic component performance. In addition, the first resistance layer and the basal layer are arranged in the same shape, namely, the first resistance layer is in a wavy shape, so that the peeling strength between the composite base material and the circuit board is improved, the composite base material is not easy to peel from the circuit board, and the structural stability of the electronic equipment is improved.
In order to better achieve the technical effect of the invention and further improve the uniformity of the sheet resistance, in one embodiment, on the basis that the roughness of the substrate layer meets the roughness requirement, at least part of the protrusions meet the following conditions: the average cross-sectional area from the bottom of the protrusion to 1/2 of the height of the protrusion is greater than the average cross-sectional area from the 1/2 of the height of the protrusion to the top of the protrusion, and the extending direction of the protrusion is perpendicular to the substrate layer. Specifically, the ratio of the number of protrusions satisfying the above condition to the total amount of protrusions on one side surface of the base layer may be at least 30%; illustratively, the proportion of the number of projections satisfying the above condition to the total amount of projections on one side surface of the base layer is 50% or more. The larger the ratio of the number of projections satisfying the above condition, the better the sheet resistance uniformity of the first resistance layer.
Preferably, at least part of the protrusions fulfil the following condition: the minimum cross-sectional area from the bottom of the protrusion to the 1/2 height of the protrusion is greater than or equal to the maximum cross-sectional area from the 1/2 height of the protrusion to the top of the protrusion, which allows the resistive material to be easily and uniformly formed on the roughened surface of the base layer, and the uniformity and continuity are further optimized. Specifically, the proportion of the number of protrusions satisfying the above condition to the total amount of protrusions on one side surface of the base layer is at least 30%; illustratively, the proportion of the number of projections satisfying the above condition to the total amount of projections on one side surface of the base layer is 50% or more. The larger the ratio of the number of projections satisfying the above condition, the better the sheet resistance uniformity of the first resistance layer.
More preferably, at least part of the protrusions fulfil the following condition: the minimum value of the width from the bottom of the bulge to the 1/2 height of the bulge is not smaller than the maximum value of the width from the 1/2 height of the bulge to the top of the bulge, and the maximum width of the cross section of each height of the bulge is the width value of the height; at this time, the whole of the protrusion is in a 'mountain shape', the resistance material is more easily and uniformly formed on the rough surface of the substrate layer, and the uniformity and the continuity are better. Specifically, the ratio of the number of protrusions satisfying the above condition to the total amount of protrusions on one side surface of the base layer may be at least 30%; illustratively, the proportion of the number of projections satisfying the above condition to the total amount of projections on one side surface of the base layer is 50% or more. The larger the ratio of the number of projections satisfying the above condition, the better the sheet resistance uniformity of the first resistance layer.
Further, the width of the 1/2 height of the protrusion is 1 mu m-10 mu m. Exemplary, the width of protruding 1/2 high department can be 1 mu m, 2 mu m, 3 mu m, 4 mu m, 5 mu m, 6 mu m, 7 mu m, 8 mu m, 9 mu m, 10 mu m and be located other numerical values of above-mentioned scope. The width at 1/2 height of the protrusion refers to the maximum of the width at 1/2 height cross section of the protrusion.
Further, the height h of the protrusions is 1 mu m-15 mu m. Exemplary, the protruding height can be 1 [ mu ] m, 2 [ mu ] m, 3 [ mu ] m, 4 [ mu ] m, 5 [ mu ] m, 6 [ mu ] m, 7 [ mu ] m, 8 [ mu ] m, 9 [ mu ] m, 10 [ mu ] m, 12 [ mu ] m, 14 [ mu ] m, 15 [ mu ] m and be located other numerical values of above-mentioned scope. The height of the protrusion refers to the distance from the bottom of the protrusion to the top of the protrusion.
In this embodiment, the thickness of the base layer is 2 μm to 100 μm, and the thickness of the base layer is preferably 8 μm to 35 μm. The thickness of the first resistance layer is 5nm-3 μm, and the thickness of the first resistance layer is preferably 10nm-200nm. Illustratively, the thickness of the substrate layer may be 2 [ mu ] m, 4 [ mu ] m, 6 [ mu ] m, 8 [ mu ] m, 10 [ mu ] m, 20 [ mu ] m, 30 [ mu ] m, 35 [ mu ] m, 50 [ mu ] m, 60 [ mu ] m, 80 [ mu ] m or 100 [ mu ] m; the thickness of the first resistor layer is 5nm, 10nm, 25nm, 50nm, 75nm, 100nm, 125nm, 150nm, 175nm, 200nm, 1 [ mu ] m, 1.5 [ mu ] m, 2 [ mu ] m, 2.5 [ mu ] m and 3 [ mu ] m.
In this embodiment, the thickness of the base layer, the thickness of the first resistive layer, the maximum width, and other relevant parameters are all obtained by preparing a composite substrate sample into slices and then measuring the slices in a scanning electron microscope. The magnification of the scanning electron microscope is 2000 times to 70000 times. Fig. 3 shows a longitudinal cross-sectional scan of a composite substrate, the side surface of the base layer of fig. 3 having the protrusions deposited with a first resistive layer, but the first resistive layer is thinner and at a greater magnification, which cannot be seen in fig. 3. Fig. 2 shows a schematic cross-section of a bump, the magnification of fig. 2 being 50000 times, the bump surface in fig. 2 having a resistive layer with a thickness of 58.1nm-61.9 nm.
In this embodiment, the material of the base layer is a conductive material or a dielectric material, and the base layer may be a single-layer structure or a laminated structure. The conductive material includes, but is not limited to, at least one of copper, aluminum, titanium, zinc, iron, nickel, chromium, cobalt, silver and gold, and specifically, the base layer may be copper foil, aluminum foil, titanium foil, zinc foil, iron foil, nickel foil, chromium foil, cobalt foil, silver foil or gold foil, or may be an alloy foil containing at least two of copper, aluminum, titanium, zinc, iron, nickel, chromium, cobalt, silver and gold, or may be a composite foil formed by compositing at least two of copper foil, aluminum foil, titanium foil, zinc foil, iron foil, nickel foil, chromium foil, cobalt foil, silver foil and gold foil. Dielectric materials include, but are not limited to, PET, PP, PS, ABF films, BT resins, polyacrylic acids, polyurethanes, polyimides, and the like. In the base layer having a multilayer structure, materials between different layers may be the same or different.
The first resistor layer is a key functional layer of the composite substrate and is used for realizing the resistor function of the embedded resistor. The first resistance layer can be made of different materials according to the requirements of different functions, and further has different resistance characteristics. Specifically, the material of the first resistive layer includes at least one element of Ni, cr, si, P, N, ti, pt, ta, mo, sn, O. Specifically, the material may be at least one of NiCrSi, niCrAlSi, niP, niCr, alN, tiN, pt, cr, cr-SiO, cr-Si, ti-W, taN, mo and Ni-Sn materials. The first resistive layer may have a single-layer structure or a multilayer structure, and in the first resistive layer having a multilayer structure, materials between different layers may be the same or different.
In this embodiment, at least one process selected from electroplating, electroless plating, physical vapor deposition and chemical vapor deposition is used to form the first resistive layer, where the sheet resistance of the first resistive layer is 1Ω -2000 Ω.
Referring to fig. 5, as an alternative embodiment, the composite substrate further includes a film layer 3 on a surface of the first resistive layer 2 on a side remote from the base layer 1. On one hand, the film layer can protect the first resistance layer 2 and prevent the first resistance layer 2 from being damaged by external force; on the other hand, when the composite substrate is adhered to the circuit board, the film layer can be adhered to the first resistor layer 2 and the circuit board, so that the peeling strength between the composite substrate and the circuit board is further improved, the composite substrate is not easy to peel from the circuit board, and the structural stability of the electronic equipment is improved. In addition, the film layer can be prepared into a foil-covered plate which is directly applied to a PCB hard plate or a soft plate.
Specifically, the thickness of the film layer is 0.5 mu m-100 mu m. Exemplary, the thickness of the film layer may be 2 [ mu ] m, 5 [ mu ] m, 7 [ mu ] m, 10 [ mu ] m, 12 [ mu ] m, 15 [ mu ] m, 20 [ mu ] m, 30 [ mu ] m, 40 [ mu ] m, 55 [ mu ] m, 60 [ mu ] m, 70 [ mu ] m, 80 [ mu ] m, 90 [ mu ] m or 100 [ mu ] m. The film layer is at least one selected from polystyrene thermoplastic resin, vinyl acetate thermoplastic resin, polyester thermoplastic resin, polyethylene thermoplastic resin, polyamide thermoplastic resin, rubber thermoplastic resin, acrylic thermoplastic resin, phenolic thermosetting resin, epoxy thermosetting resin, thermoplastic polyimide thermosetting resin, urethane thermosetting resin, melamine thermosetting resin, alkyd thermosetting resin and ABF resin. Illustratively, the film layer is selected from at least one of modified epoxy resin, modified acrylic resin, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polystyrene, polyvinyl chloride, polysulfone, polyphenylene sulfide, polyether ether ketone, polyphenylene oxide, polytetrafluoroethylene, liquid crystal polymer, polyethylene glycoluril, epoxy glass cloth, BT resin. The specific thickness and materials of the film layer are selected and set by the person skilled in the art according to actual needs.
Further, referring to fig. 6, in one embodiment, on the basis of the film layer 3 disposed in the composite substrate, the conductive layer 4 is disposed on the side of the film layer 3 away from the first resistive layer 2, so as to form a foil-covered board containing the first resistive layer, where the foil-covered board has a four-layer structure and can be directly applied to a hard board or a soft board. Specifically, the conductive layer may be a single-layer structure or a stacked structure of a plurality of layers. That is, the conductive layer may be a copper foil, an aluminum foil, a titanium foil, a zinc foil, an iron foil, a nickel foil, a chromium foil, a cobalt foil, a silver foil, or a gold foil, or may be an alloy foil containing at least two of copper, aluminum, titanium, zinc, iron, nickel, chromium, cobalt, silver, and gold, or may be a composite foil formed by compositing at least two of copper foil, aluminum foil, titanium foil, zinc foil, iron foil, nickel foil, chromium foil, cobalt foil, silver foil, and gold foil. The material of the conductive layer and the material of the base layer may be the same or different, and may be set by those skilled in the art according to actual needs.
Still further, referring to fig. 7, in one embodiment, a second resistive layer 5 is disposed between the film layer 3 and the conductive layer 4, thereby forming an asymmetric structure. The material of the second resistive layer may be the same as or different from the material used for the first resistive layer 2, and those skilled in the art may set the material according to actual needs.
The embodiment also provides a circuit board, which comprises the composite substrate. The circuit board has all the advantages of the composite substrate and is not described herein.
Specific examples and comparative examples are now provided by way of example to support the technical effects of the technical solutions of the present application. The composite base materials in the embodiment and the comparative example comprise a base layer and a first resistance layer, wherein one side surface of the base layer is provided with a plurality of bulges, and the first resistance layer is arranged on one side surface of the base layer with the bulges in a stacking way; the base layer is copper foil with the thickness of 18 mu m, the material of the first resistance layer is NiCr alloy, and the thickness of the first resistance layer is 22nm.
Example 1
In the present embodiment, the roughness Rz of the side surface of the base layer having the projections is 5 μm. The average cross-sectional area from the bottom of the bump to 1/2 of the height of the bump is greater than 60% of the bump ratio of the average cross-sectional area from the 1/2 of the height of the bump to the top of the bump.
Example 2
In the present embodiment, the roughness Rz of the side surface of the base layer having the projections is 5 μm. The minimum cross-sectional area from the bottom of the bump to 1/2 of the height of the bump is greater than or equal to 60% of the bump ratio of the maximum cross-sectional area from the 1/2 of the height of the bump to the top of the bump.
Example 3
In the present embodiment, the roughness Rz of the side surface of the base layer having the projections is 5 μm. The minimum value of the width from the bottom of the bump to the 1/2 height of the bump is not less than 60% of the bump ratio of the maximum value of the width from the 1/2 height of the bump to the top of the bump.
Comparative example 1
The composite substrate provided in this comparative example differs from the composite substrate provided in example 1 only in that: in the composite substrate provided in this comparative example, the roughness Rz of the surface of the side of the base layer having the projections was 0.5 μm.
Comparative example 2
The composite substrate provided in this comparative example differs from the composite substrate provided in example 1 only in that: in the composite substrate provided in this comparative example, the average cross-sectional area from the bottom of the bump to 1/2 of the height of the bump is smaller than the average cross-sectional area from the 1/2 of the height of the bump to the top of the bump.
Comparative example 3
The composite substrate provided in this comparative example differs from the composite substrate provided in example 2 only in that: in the composite substrate provided in this comparative example, the minimum cross-sectional area from the bottom of the bump to 1/2 of the height of the bump is smaller than the maximum cross-sectional area from the 1/2 of the height of the bump to the top of the bump.
Comparative example 4
The composite substrate provided in this comparative example differs from the composite substrate provided in example 3 only in that: in the composite substrate provided in this comparative example, the minimum value of the width from the bottom of the bump to 1/2 of the height of the bump is smaller than the maximum value of the width from the 1/2 of the height of the bump to the top of the bump.
Comparative example 5
The composite substrate provided in this comparative example differs from the composite substrate provided in example 1 only in that: in the composite substrate provided in this comparative example, the roughness Rz of the surface of the side of the base layer having the projections was 20 μm.
Test examples
The composite substrates provided in examples 1-3 and comparative examples 1-5 were subjected to sheet resistance uniformity test and peel force test. In the process of testing the sheet resistance uniformity, firstly testing the sheet resistances M at different positions of the composite substrate, uniformly distributing sheet resistance test points on the surface of the composite substrate, wherein the number of the sheet resistance test points is 20, and then calculating the average sheet resistance M at different positions of the composite substrate ave And selecting the maximum value M of the sheet resistance max Sum sheet resistance minimum value M min Then, calculating an upper limit value of sheet resistance uniformity and a lower limit value of sheet resistance uniformity: upper limit value of sheet resistance uniformity= (M max -M ave )/ M ave X 100%; lower limit value of sheet resistance uniformity= (M min -M ave )/ M ave X 100%; the test results are shown in Table 1:
table 1 results comparison table
As can be seen from table 1, the technical solution in this embodiment satisfies the peeling force applied, and at the same time, the uniformity is more prominent, and the performance is more stable.
It is apparent that the above examples are given by way of illustration only and are not limiting of the embodiments. Other variations or modifications of the above teachings will be apparent to those of ordinary skill in the art. It is not necessary here nor is it exhaustive of all embodiments. While still being apparent from variations or modifications that may be made by those skilled in the art are within the scope of the invention.
Claims (18)
1. The composite substrate is characterized by comprising a substrate layer and a first resistor layer, wherein the first resistor layer is arranged on at least one side surface of the substrate layer in a stacked mode, the substrate layer faces one side surface of the first resistor layer and is provided with a plurality of protrusions, and the roughness Rz of one side surface of the protrusions of the substrate layer is 1-15 mu m.
2. The composite substrate of claim 1, wherein at least a portion of the protrusions satisfy the following condition: the average cross-sectional area from the bottom of the protrusion to 1/2 of the height of the protrusion is greater than the average cross-sectional area from the 1/2 of the height of the protrusion to the top of the protrusion.
3. The composite substrate of claim 1, wherein at least a portion of the protrusions satisfy the following condition: the minimum cross-sectional area from the bottom of the protrusion to 1/2 of the height of the protrusion is greater than or equal to the maximum cross-sectional area from the 1/2 of the height of the protrusion to the top of the protrusion.
4. The composite substrate of claim 1, wherein at least a portion of the protrusions satisfy the following condition: the minimum value of the width from the bottom of the protrusion to the 1/2 height of the protrusion is not less than the maximum value of the width from the 1/2 height of the protrusion to the top of the protrusion.
5. The composite substrate of claim 2 wherein the average cross-sectional area of the bottom of the protrusions to 1/2 of the height of the protrusions is at least 30% greater than the ratio of protrusions of the average cross-sectional area to the top of the protrusions at 1/2 of the height of the protrusions.
6. A composite substrate according to claim 3, wherein the ratio of protrusions having a minimum cross-sectional area from the bottom of the protrusions to 1/2 of the height of the protrusions is at least 30% greater than or equal to the maximum cross-sectional area from the 1/2 of the height of the protrusions to the top of the protrusions.
7. The composite substrate of claim 4 wherein the ratio of protrusions having a minimum of the width from the bottom of the protrusions to 1/2 of the height of the protrusions is not less than at least 30% of the maximum of the width from the 1/2 of the height of the protrusions to the top of the protrusions.
8. The composite substrate of claim 4, wherein the maximum value of the width at 1/2 height of the protrusions is 1-10 μm.
9. The composite substrate according to any one of claims 1-8, wherein the height of the protrusions is 1 μm-15 μm.
10. The composite substrate according to any one of claims 1 to 8, wherein the thickness of the first resistive layer is 5nm to 3 μm.
11. The composite substrate of claim 10, wherein the first resistive layer has a thickness of 10nm to 200nm.
12. The composite substrate of any one of claims 1-8, further comprising a film layer on a side surface of the first resistive layer remote from the base layer.
13. The composite substrate of claim 12, wherein the film layer has a thickness of 0.5 μιη to 100 μιη.
14. The composite substrate of claim 12, wherein a side of the film layer remote from the first resistive layer is provided with a conductive layer.
15. The composite substrate of claim 14, wherein the conductive layer is a single conductive layer or a plurality of conductive layers.
16. The composite substrate of claim 14, wherein a second resistive layer is disposed between the film layer and the conductive layer.
17. The composite substrate according to any one of claims 1-8, wherein the material of the base layer is a conductive material or a dielectric material; the conductive material comprises at least one of copper, aluminum, titanium, zinc, iron, nickel, chromium, cobalt, silver, or gold; the material of the resistive layer includes at least one element of Ni, cr, si, P, N, ti, pt, ta, mo, sn or O.
18. A circuit board comprising the composite substrate of any one of claims 1-17.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310424372.6A CN116137197A (en) | 2023-04-20 | 2023-04-20 | Composite substrate and circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310424372.6A CN116137197A (en) | 2023-04-20 | 2023-04-20 | Composite substrate and circuit board |
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| CN116137197A true CN116137197A (en) | 2023-05-19 |
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|---|---|---|---|
| CN202310424372.6A Pending CN116137197A (en) | 2023-04-20 | 2023-04-20 | Composite substrate and circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116612952A (en) * | 2023-06-27 | 2023-08-18 | 广州方邦电子股份有限公司 | Thin film resistor and circuit board |
| CN116798713A (en) * | 2023-07-05 | 2023-09-22 | 广州方邦电子股份有限公司 | Thin film resistor and circuit board |
| CN116798714A (en) * | 2023-06-30 | 2023-09-22 | 广州方邦电子股份有限公司 | Composite metal foil and circuit board |
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| CN114554686A (en) * | 2020-11-19 | 2022-05-27 | 广州方邦电子股份有限公司 | Composite metal foil and circuit board |
| CN114953640A (en) * | 2022-05-27 | 2022-08-30 | 广州方邦电子股份有限公司 | Flexible metal-clad plate, electronic device and manufacturing method of flexible metal-clad plate |
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| JP2014116456A (en) * | 2012-12-10 | 2014-06-26 | Maruwa Co Ltd | Chip resistor, current sensor device, and manufacturing method of chip resistor |
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| CN116612952A (en) * | 2023-06-27 | 2023-08-18 | 广州方邦电子股份有限公司 | Thin film resistor and circuit board |
| CN116798714A (en) * | 2023-06-30 | 2023-09-22 | 广州方邦电子股份有限公司 | Composite metal foil and circuit board |
| CN116798713A (en) * | 2023-07-05 | 2023-09-22 | 广州方邦电子股份有限公司 | Thin film resistor and circuit board |
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