CN116121720A

CN116121720A - Magnetron sputtering coating device

Info

Publication number: CN116121720A
Application number: CN202310156456.6A
Authority: CN
Inventors: 张殷; 孙紫娟; 徐胜; 孙伟; 李景会; 何龙
Original assignee: Suzhou Lanchuang Technology Co ltd
Current assignee: Suzhou Lanchuang Technology Co ltd
Priority date: 2023-02-23
Filing date: 2023-02-23
Publication date: 2023-05-16

Abstract

The invention relates to a magnetron sputtering coating device, which comprises: an outer housing; the inner cylinder body is arranged in the outer shell, a working cavity is defined between the outer wall of the inner cylinder body and the inner wall of the outer shell, and the working cavity is used for placing a substrate; the first mounting piece is connected with the inner cylinder body, the first mounting piece is concavely arranged towards the inner wall direction of the inner cylinder body relative to the working cavity, the first mounting piece is provided with a first mounting cavity, the first mounting cavity is communicated with the working cavity, and in a working state, the first mounting cavity is in a vacuum state; and the first target is arranged in the first mounting cavity. The working cavity is communicated with the first installation cavity and is in a vacuum state, and one side of the inner wall of the inner cylinder body can be in an atmospheric state, so that the volume of the vacuum chamber is reduced greatly, the energy consumption of the vacuum pump body and heating is reduced greatly, the production cost is reduced, and the economic benefit is improved.

Description

Magnetron sputtering coating device

Technical Field

The invention relates to the technical field of magnetron sputtering coating, in particular to a magnetron sputtering coating device.

Background

With the development of automatic processing technology, a film plating machine technology is developed. The existing coating machine mainly comprises the following types: PVD (Physical Vapor Deposition ) equipment mainly comprises a magnetron sputtering coating machine, an ion sputtering coating machine and an electron gun evaporation coating machine. There are also conventional CVD (Chemical Vapor Deposition ) and ALD (Atomic Layer Deposition, atomic layer deposition) coating machines. The magnetron sputtering technology can prepare decorative films, hard films, corrosion-resistant friction films, superconducting films, magnetic films and optical films, and various films with special functions, is an effective film deposition method, and is widely applied to various industrial fields. The magnetron sputtering ion plating technology is that on the basis of the common magnetron sputtering technology, the surface of a workpiece to be plated is biased, metal ions are deposited on the surface of the workpiece under the action of a biasing electric field, and the film quality and the film base binding force are far better than those of the common magnetron sputtering plating technology.

In the prior art, the magnetron sputtering coating machine has the general structure that a plane target is installed on a bottom plate, a cylindrical target or a strip target is installed on the periphery of a top plate installation substrate or a cavity, and a cylindrical substrate is installed in the middle, wherein the area of the substrate with the plane substrate structure is not easy to be large, the substrate with the plane substrate structure is vertical to the cylindrical substrate structure, and the whole cavity structure is large, so that the coating efficiency is low, and the power consumption is high.

Disclosure of Invention

Based on the above, it is necessary to provide a magnetron sputtering coating device, which can effectively reduce the production energy consumption and the production cost.

The technical scheme is as follows: a magnetron sputtering coating device, the magnetron sputtering coating device comprising: an outer housing; the inner cylinder body is arranged in the outer shell, a working cavity is defined between the outer wall of the inner cylinder body and the inner wall of the outer shell, and the working cavity is used for placing a substrate; the first mounting piece is connected with the inner cylinder body, the first mounting piece is concavely arranged towards the inner wall direction of the inner cylinder body relative to the working cavity, the first mounting piece is provided with a first mounting cavity, the first mounting cavity is communicated with the working cavity, and in a working state, the first mounting cavity is in a vacuum state; and the first target is arranged in the first mounting cavity.

According to the magnetron sputtering coating device, in the working process, one or more than two substrates are placed in the working cavity at the same time, so that the substrates can move in the working cavity, and the first target is placed in the first mounting cavity, so that the occupied space of the device is reduced. The working cavity can be used for placing a substrate with a large enough area, so that the magnetron sputtering coating efficiency of the substrate is improved. And moreover, the working cavity is communicated with the first installation cavity and is in a vacuum state, and one side of the inner wall of the inner cylinder body can be in an atmospheric state, so that the volume of the vacuum chamber is greatly reduced, vacuum pumping equipment with lower pumping speed can be equipped, the energy consumption of the vacuum pump body and heating is greatly reduced, the production cost is reduced, and the economic benefit is improved.

In one embodiment, the magnetic control detection coating device further comprises a conveying member, wherein the conveying member is arranged in the working cavity and is used for carrying the substrate so that the substrate moves in the working cavity.

In one embodiment, the cross-sectional profile of the outer shell is circular, the cross-sectional profile of the inner cylinder is circular, the cross-sectional profile of the working cavity is circular, and the transport member moves circumferentially in the circular working cavity with the substrate.

In one embodiment, the inner cylinder is further provided with an inner cover, the inner cover is covered at one end of the inner cylinder facing the opening of the working cavity, the inner cover is in sealing fit with the edge of the inner cylinder, and the first target is connected with the inner cover.

In one embodiment, the magnetron sputtering coating device further comprises a second mounting piece and a second target, the second mounting piece and the first mounting piece are arranged on the inner cylinder body at intervals, the second mounting piece is arranged in a manner that the working cavity is sunken towards the inner wall of the inner cylinder body, the second mounting piece is provided with a second mounting cavity, and the second target is arranged in the second mounting cavity.

In one embodiment, the first target is a cylindrical target or a strip target, and the first target is rotationally connected with the inner wall of the first mounting cavity.

In one embodiment, the second target is a cylindrical target or a strip target, and the second target is rotationally connected with the inner wall of the second mounting cavity.

In one embodiment, the number of the first targets is more than two, and the more than two first targets are arranged in the first mounting cavity at intervals.

In one embodiment, the number of the second targets is more than two, and the more than two second targets are arranged in the second mounting cavity at intervals.

In one embodiment, the magnetron sputtering coating device further comprises a sputtering source, wherein the sputtering source is arranged on the inner cylinder and is communicated with the working cavity, and the sputtering source is used for auxiliary coating of the substrate.

In one embodiment, the magnetron sputtering coating device further comprises an optical monitoring module, wherein the optical monitoring module is installed on the outer shell and/or the inner cylinder, the optical monitoring module is communicated with the working cavity, and the optical monitoring module is used for monitoring the thickness of the coating.

In one embodiment, the magnetron sputtering coating device further comprises a cover plate assembly, wherein the cover plate assembly can be connected to the outer shell in an openable and closable manner, and in an opened state, the cover plate assembly is separated from sealing fit with the cavity opening of the working cavity, and in a closed state, the cover plate assembly is in sealing fit with the cavity opening of the working cavity

Drawings

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention.

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of an overall structure of a magnetron sputtering coating device according to an embodiment;

FIG. 2 is a schematic diagram showing an internal structure of a magnetron sputtering coating device according to an embodiment;

fig. 3 is a schematic structural diagram of an inner cylinder of a magnetron sputtering coating device according to an embodiment.

Reference numerals illustrate:

100. a magnetron sputtering coating device; 110. an outer housing; 111. a working chamber; 120. an inner cylinder; 121. an inner cover body; 130. a first mounting member; 131. a first mounting cavity; 132. a first target; 140. a second mounting member; 141. a second mounting cavity; 142. a second target; 150. a cover plate assembly; 200. a substrate.

Detailed Description

In order that the above objects, features and advantages of the invention will be readily understood, a more particular description of the invention will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the invention, whereby the invention is not limited to the specific embodiments disclosed below.

In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present invention.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present invention, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.

In the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present invention, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.

The magnetron sputtering technology can prepare decorative films, hard films, corrosion-resistant friction films, superconducting films, magnetic films and optical films, and various films with special functions, is an effective film deposition method, and is widely applied to various industrial fields. The magnetron sputtering ion plating technology is that on the basis of the common magnetron sputtering technology, the surface of a workpiece to be plated is biased, metal ions are deposited on the surface of the workpiece under the action of a biasing electric field, and the film quality and the film base binding force are far better than those of the common magnetron sputtering plating technology.

Based on this, it is necessary to provide a magnetron sputtering coating device 100 capable of effectively reducing the production energy consumption and the production cost.

Referring to fig. 1, fig. 2 and fig. 3, fig. 1 shows an overall structure of a magnetron sputtering coating device 100 according to an embodiment of the invention; FIG. 2 is a schematic diagram showing the internal structure of a magnetron sputtering coating device 100 according to an embodiment of the invention; fig. 3 is a schematic view illustrating the internal structure of the inner cylinder 120 of the magnetron sputtering coating device 100 according to an embodiment of the invention. An embodiment of the present invention provides a magnetron sputtering coating device 100, where the magnetron sputtering coating device 100 includes: an outer case 110; an inner cylinder 120, a first mount 130, and a first target 132. The inner cylinder 120 is disposed inside the outer casing 110, and a working chamber 111 is defined between an outer wall of the inner cylinder 120 and an inner wall of the outer casing 110, and the working chamber 111 is used for placing the substrate 200. The first mounting piece 130 is connected with the inner cylinder 120, and the first mounting piece 130 is arranged in a recessed manner relative to the working cavity 111 towards the inner wall direction of the inner cylinder 120, the first mounting piece 130 is provided with a first mounting cavity 131, and the first mounting cavity 131 is communicated with the working cavity 111. In the working state, the first installation cavity 131 is in a vacuum state, and the first target 132 is disposed in the first installation cavity 131.

In the above-mentioned magnetron sputtering coating device 100, in the working process, one or more than two substrates 200 are simultaneously placed in the working chamber 111, so that the substrates 200 can move in the working chamber 111, and the first target 132 is placed in the first mounting chamber 131, which is beneficial to reducing the occupied space of the device. The working chamber 111 can accommodate a substrate 200 with a large enough area, which is beneficial to improving the magnetron sputtering coating efficiency of the substrate 200. And, the working chamber 111 is communicated with the first installation chamber 131 and is in a vacuum state, and one side of the inner wall of the inner cylinder 120 can be in an atmospheric state, so that the volume of the vacuum chamber is reduced greatly, the vacuum pumping equipment with lower pumping speed can be provided, the energy consumption of the vacuum pump body and heating is reduced greatly, the production cost is reduced, and the economic benefit is improved.

Alternatively, the inner cylinder 120 and the inner wall of the outer housing 110 may be fixedly connected or detachably connected.

In one embodiment, referring to fig. 2 and 3, the inner cylinder 120 is detachably connected to the bottom wall of the outer housing 110. For example, the inner cylinder 120 and the outer housing 110 are detachably connected to the bottom wall of the outer housing 110 by means of a snap-fit, a plug-in, a pin-in, a screw connection, a bolt connection, a magnetic connection, or the like. Thus, the magnetron sputtering coating device 100 is convenient to assemble and produce, convenient to maintain and low in production and maintenance cost.

In one embodiment, the magnetron inspection plating device further includes a transporting member (not shown) disposed inside the working chamber 111, and the transporting member is used to carry the substrate 200 so as to move the substrate 200 in the working chamber 111. In this way, the substrate 200 is placed on the transport member and circumferentially arranged around the inner cylinder 120, so that the transport member carries the substrate 200 to automatically move during processing, and the substrates undergo processing at different stations respectively, and the processing mode similar to the assembly line is beneficial to improving the working efficiency.

Alternatively, the transportation member may be mounted in the working chamber 111 in such a manner that the transportation member is disposed on the bottom wall of the working chamber 111, and the inner cylinder 120 is disposed adjacent to or spaced apart from the transportation member. For example, the transport member is a conveyor belt having jigs, and each substrate 200 is disposed on a corresponding jig. Or the transport member is mounted on the inner cylinder 120 and moves on the circumferential outer wall of the inner cylinder 120, thereby driving the substrate 200 to move. It is also possible that the transport member is provided on the inner wall of the outer case 110 to move on the circumferential inner wall of the outer case 110, thereby moving the substrate 200.

Alternatively, the outer contour of the outer housing 110 may be circular, rectangular, triangular, regular polygonal, or other irregular shape. The outer contour of the inner cylinder 120 may be circular, rectangular, triangular, regular polygonal, or other irregular shape.

Specifically, referring to fig. 2 and 3, the cross-sectional profile of the outer housing 110 is circular, the cross-sectional profile of the inner cylinder 120 is circular, the cross-sectional profile of the working chamber 111 is circular, and the carrier substrate 200 for transportation circumferentially moves in the circular working chamber 111. In this way, the plurality of substrates 200 are arranged and rotated along the circumferential direction of the inner cylinder 120, so that the magnetron sputtering coating process can be performed on the plurality of substrates 200 successively, the annular working cavity 111 enables the substrates 200 to be surrounded for a circle, a large enough coating area is ensured, further improvement of coating efficiency is facilitated, and production cost is reduced. The present embodiment provides only a specific shape selection of the outer casing 110 and the inner casing 120, but is not limited thereto.

In one embodiment, referring to fig. 1, the inner cylinder 120 is further provided with an inner cap 121, the inner cap 121 is covered on an end of the inner cylinder 120 facing the working cavity 111, the inner cap 121 is in sealing fit with an edge of the inner cylinder 120, and the first target 132 is connected with the inner cap 121. In this way, on the one hand, the inner space of the inner cylinder 120 can be isolated from the working chamber 111 by the inner cover 121, thereby reducing the volume of the vacuum working chamber 111. In addition, the inner lid 121 can also be used to mount the first target 132.

Further, when the first target 132 is rotationally connected to the inner cover 121, the first target 132 can rotate relative to the substrate 200, which is beneficial to enlarging the coating area and realizing curved surface coating. Specifically, the rotation axis direction of the first target 132 is parallel to the axis direction of the inner cylinder 120.

In one embodiment, referring to fig. 2 and 3, the magnetron sputtering apparatus 100 further includes a second mounting member 140 and a second target 142. The second mounting piece 140 and the first mounting piece 130 are arranged on the inner cylinder 120 at intervals, the second mounting piece 140 is arranged in a concave manner relative to the working cavity 111 towards the inner wall direction of the inner cylinder 120, the second mounting piece 140 is provided with a second mounting cavity 141, and the second target 142 is arranged in the second mounting cavity 141. In this way, the substrate 200 can be subjected to the film plating of the first target 132 and the second target 142 respectively in the same process during the transportation process in the working chamber 111, which is beneficial to further improving the film plating rate and improving the productivity.

Alternatively, the shape of the first target 132 may be a planar target, a cylindrical target, a strip target, a cylindrical planar target, or other target types.

In one embodiment, referring to fig. 3, the first target 132 is a cylindrical target. The first target 132 is rotatably connected to the inner wall of the first mounting chamber 131. In particular in fig. 3, the first target 132 is a cylindrical target. Therefore, the coating has good uniformity, and when the bullnose rotates, the surface of the target can be uniformly sputtered layer by layer, pits are avoided, and the target utilization rate is improved. The present embodiment only provides a material selection for the first target 132, but is not limited thereto.

Alternatively, the type of first target 132 may be a metal target, an alloy target, an inorganic nonmetallic target, a composite target, or other target types.

Further, referring to fig. 2 and 3, the number of the first targets 132 is more than two, and more than two first targets 132 are disposed at intervals in the first mounting cavity 131. For example, referring to fig. 2, the number of first targets 132 is two. Thus, the two first targets 132 work, which is beneficial to increasing the coating area and coating rate, thereby being beneficial to improving the productivity.

Alternatively, the shape of the second target 142 may be a planar target, a cylindrical target, a strip target, a cylindrical planar target, or other target types.

In one embodiment, referring to fig. 3, the second target 142 is a cylindrical target. The second target 142 is rotatably connected to the inner wall of the second mounting chamber 141. In particular in fig. 3, the second target 142 is a cylindrical target. Therefore, the coating has good uniformity, and when the bullnose rotates, the surface of the target can be uniformly sputtered layer by layer, pits are avoided, and the target utilization rate is improved. The present embodiment only provides a material selection for the second target 142, but is not limited thereto.

Alternatively, the type of second target 142 may be a metal target, an alloy target, an inorganic nonmetallic target, a composite target, or other target types.

In one embodiment, referring to fig. 2 and 3, the number of the second targets 142 is more than two, and more than two second targets 142 are disposed at intervals in the second mounting cavity 141. For example, referring to fig. 2, the number of first targets 132 is two. Thus, the two first targets 132 work, which is beneficial to increasing the coating area and coating rate, thereby being beneficial to improving the productivity.

In one embodiment, the magnetron sputtering coating device 100 further includes a sputtering source (not shown in the drawing) disposed on the inner cylinder 120 and in communication with the working chamber 111, the sputtering source being used to assist in coating the substrate 200. Alternatively, the sputter source may be an auxiliary ion source or other type of sputter source. Thus, in the magnetron sputtering coating process, the electromagnetic radiation is reduced, and the coating quality is improved.

In one embodiment, the magnetron sputtering coating device 100 further includes an optical monitoring module (not shown in the drawing), wherein the optical monitoring module is mounted on the outer housing 110 and/or the inner cylinder 120, and the optical monitoring module is in communication with the working chamber 111, and the optical monitoring module is used for monitoring the thickness of the coating. Specifically, the outer housing 110 is provided with a first mounting hole, the inner cylinder 120 is provided with a second mounting hole opposite to the first mounting hole, and the first mounting hole and the second mounting hole are both communicated with the working chamber 111. The optical monitoring module comprises a transmitting piece and a receiving piece, wherein the transmitting piece is arranged on the first mounting hole, and the receiving piece is arranged on the second mounting hole. Therefore, through the optical monitoring control, the thickness of the coating film can be monitored in the coating process, and the process quality of the magnetron sputtering coating film is ensured.

It should be noted that, in this embodiment, a beam of white light is emitted to the surface of the film by using an optical interferometry, and when the white light is incident into the film sample, the reflection spectrum or the transmission spectrum from the sample has a direct relation with the thickness of the film, and the thickness of the film can be measured by detecting interference fringes of the reflected light or the transmitted light.

In one embodiment, the magnetron sputtering coating device 100 further includes a frame (not shown) and a gas supply chamber (not shown) connected between the outer housing 110 and the frame, and the gas supply chamber is in communication with the working chamber 111, and is used to provide isolation gas and/or process gas to the working chamber 111. Therefore, in the magnetron sputtering coating process, a corresponding working environment can be provided for the working cavity 111 through the air supply chamber, and the air supply chamber structure arranged between the outer shell 110 and the frame is beneficial to improving the structural compactness and reducing the overall volume of the magnetron sputtering coating device 100.

Magnetron sputtering coating is mostly carried out in the presence of a reaction gas, and the stability and optical constants of the compound deposited film depend on the type of gas and the cathode material. The common reactant gas is oxygen, and the common cathode materials are iron, nickel, copper lead, and the like, and sometimes, electro-gold, platinum, palladium, indium, and other metals. The oxide formed by reactive sputtering is a coating material having absorption and not very high refractive index.

In one embodiment, referring to fig. 1, the magnetron sputtering coating device 100 further includes a cover assembly 150, where the cover assembly 150 is connected to the outer housing 110 in an openable manner, and in an opened state, the cover assembly 150 is disengaged from sealing engagement with the cavity opening of the working chamber 111, and in a closed state, the cover assembly 150 is in sealing engagement with the cavity opening of the working chamber 111. Thus, the openable cover plate assembly 150 is provided to facilitate the convenience of operation when the substrate 200 is placed and taken out, and to improve the working efficiency.

Specifically, referring to fig. 1, the cover assembly 150 includes a cover body and a driving member (not shown), the driving member is disposed on the frame and spaced from the outer housing 110, the cover body is connected to an output end of the driving member, and the driving member drives the cover body to move between a first working position and a second working position. Therefore, through the driving function of the driving piece, the cover plate body can be enabled to move, and therefore automatic opening and closing of the cover plate body are achieved.

Alternatively, the driving means may be motor driven, cylinder driven, hydraulic driven or other driving means.

Specifically, the driving member is an air pump. Therefore, the cover plate body is driven by the air pump to rotate, so that the cover plate body is in an opened and closed state on the outer shell 110, the operation is simple, and the tightness between the cover plate body and the working cavity 111 is guaranteed. The present embodiment provides only one specific embodiment of the driving member, but is not limited thereto.

In one embodiment, the magnetron sputtering coating device 100 further includes an exhaust pipe (not shown in the drawing), the inner cylinder 1202 is provided with an exhaust hole, the exhaust pipe is disposed on a side of the inner cylinder 120 facing away from the working chamber 111, and the exhaust pipe is communicated with the working chamber 111 through the exhaust hole. Thus, the working cavity 111 can be vacuumized through the exhaust pipe, and the exhaust pipe is arranged on one side of the inner wall of the inner cylinder 120, so that the inner space of the inner cylinder 120 can be fully utilized, the structural compactness is improved, and the whole volume of the device is reduced.

In one embodiment, the magnetron sputtering apparatus 100 further includes a plurality of moving wheels (not shown in the drawings), and the plurality of moving wheels are connected to the bottom wall of the frame at intervals. Thus, the overall movement of the magnetron sputtering coating device 100 is facilitated, and the installation convenience is improved. Specifically, the moving wheel is a universal wheel.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.

Claims

1. A magnetron sputtering coating device, characterized in that the magnetron sputtering coating device comprises:

an outer housing;

the inner cylinder body is arranged in the outer shell, a working cavity is defined between the outer wall of the inner cylinder body and the inner wall of the outer shell, and the working cavity is used for placing a substrate; the first mounting piece is connected with the inner cylinder body, the first mounting piece is concavely arranged towards the inner wall direction of the inner cylinder body relative to the working cavity, the first mounting piece is provided with a first mounting cavity, the first mounting cavity is communicated with the working cavity, and in a working state, the first mounting cavity is in a vacuum state; a kind of electronic device with high-pressure air-conditioning system

The first target is arranged in the first mounting cavity.

2. The magnetron sputtering coating device according to claim 1, further comprising a transport member disposed inside the working chamber, the transport member being configured to carry the substrate so as to move the substrate within the working chamber.

3. The magnetron sputtering coating device according to claim 2, wherein the cross-sectional profile of the outer case is circular, the cross-sectional profile of the inner cylinder is circular, the cross-sectional profile of the working chamber is circular, and the transport member moves circumferentially in the circular working chamber with carrying the substrate.

4. The magnetron sputtering coating device according to claim 1, wherein the inner cylinder is further provided with an inner cover, the inner cover is covered at one end of the inner cylinder facing the opening of the working chamber, the inner cover is in sealing fit with the edge of the inner cylinder, and the first target is connected with the inner cover.

5. The magnetron sputtering coating device according to claim 1, further comprising a second mounting piece and a second target, wherein the second mounting piece and the first mounting piece are arranged on the inner cylinder body at intervals, the second mounting piece is arranged in a manner that the second mounting piece is sunken towards the inner wall of the inner cylinder body relative to the working cavity, the second mounting piece is provided with a second mounting cavity, and the second target is arranged in the second mounting cavity.

6. The magnetron sputtering coating device according to claim 5, wherein the first target is a cylindrical target or a strip target, and the first target is rotatably connected with the inner wall of the first mounting cavity; and/or the number of the groups of groups,

the second target is a cylindrical target or a strip target, and the second target is rotationally connected with the inner wall of the second mounting cavity.

7. The magnetron sputtering coating device according to claim 5, wherein the number of the first targets is two or more, and the two or more first targets are arranged at intervals in the first mounting cavity; and/or the number of the groups of groups,

the number of the second targets is more than two, and the second targets are arranged in the second mounting cavity at intervals.

8. The magnetron sputtering coating device according to claim 1, further comprising a sputtering source disposed on the inner cylinder and in communication with the working chamber, the sputtering source being configured to assist in coating the substrate.

9. The magnetron sputtering coating device according to claim 1, further comprising an optical monitoring module mounted on the outer housing and/or the inner cylinder, and the optical monitoring module is in communication with the working chamber, the optical monitoring module being configured to monitor a coating thickness.

10. The magnetron sputtering coating device according to any one of claims 1 to 9, further comprising a cover plate assembly, wherein the cover plate assembly is connected to the outer housing in an openable and closable manner, and in an opened state, the cover plate assembly is disengaged from sealing engagement with the cavity opening of the working chamber, and in a closed state, the cover plate assembly is in sealing engagement with the cavity opening of the working chamber.