CN116113207A - Cooling system and cooling method for electronic equipment - Google Patents

Cooling system and cooling method for electronic equipment Download PDF

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Publication number
CN116113207A
CN116113207A CN202211612293.XA CN202211612293A CN116113207A CN 116113207 A CN116113207 A CN 116113207A CN 202211612293 A CN202211612293 A CN 202211612293A CN 116113207 A CN116113207 A CN 116113207A
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Prior art keywords
cooling
cooling medium
boiling
medium
cooling channel
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周尧
吴波
杨雨薇
赵亮
王滨
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Xian Aeronautics Computing Technique Research Institute of AVIC
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Xian Aeronautics Computing Technique Research Institute of AVIC
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20381—Thermal management, e.g. evaporation control
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention provides a cooling method and a cooling system for electronic equipment, wherein the method comprises the steps of controlling a low-boiling-point cooling medium and a high-boiling-point cooling medium to flow at respective initial mass flow rates when the electronic equipment works; and acquiring heat flux density and temperature signals of the electronic equipment in real time, and adjusting the cooling medium of the low-boiling-point cooling medium and/or the mass flow rate of the high-boiling-point cooling medium in real time. The cooling system comprises an electronic module, a cooling channel positioned in the electronic module, a temperature sensor and a controller. The cooling channels comprise a first cooling channel and a second cooling channel, and cooling media with different boiling points flow in the first cooling channel and the second cooling channel. The controller is used for controlling the on-off of the first cooling channel and the flow rate of the cold medium liquid and/or controlling the on-off of the second cooling channel and the flow rate of the cold medium liquid. The system and the method can solve the problems of unstable boiling heat exchange and low reliability of the traditional boiling heat exchange, and can meet the heat dissipation requirement of the high heat flux electronic module.

Description

Cooling system and cooling method for electronic equipment
Technical Field
The invention relates to the technical field of electronic equipment thermal management, in particular to a cooling system and a cooling method for electronic equipment.
Background
Along with the rapid development of microelectronic technology, electronic systems are continuously developed towards miniaturization, integration and high density, and along with the continuous increase of functional density and continuous reduction of volume of electronic systems, the heat flow density of electronic equipment is higher and higher. When the electronic equipment is in operation, the internal electronic components can convert power supply into heat, and the heat must be timely emitted, otherwise, the temperature of the components is too high, and the reliability of the components is further reduced rapidly. The temperature of the electronic components must be controlled within a certain range by a suitable means.
At present, the traditional heat dissipation technology of the electronic equipment comprises natural heat dissipation, forced air cooling, liquid cooling and the like, wherein the natural heat dissipation is realized through natural convection of air, and the heat dissipation capacity is the lowest; the forced air cooling adopts a fan to drive air to flow, so that the forced air cooling performs forced convection heat exchange with electronic equipment, and the heat dissipation capacity is high; the liquid cooling uses liquid as working medium, and transfers heat through the convective heat exchange between the liquid and the heat source, so that the liquid cooling has high convective heat exchange coefficient and the highest heat dissipation capacity.
Furthermore, as the temperature increases, it may cause a boiling phenomenon, which is a vaporization process in the form of bubbles inside the liquid, which is a phase change process. The phase change latent heat in the boiling and vaporizing process of the liquid can absorb a large amount of heat, and the generated bubbles can form severe disturbance on the liquid, and the heat transfer coefficient is very high.
As the boiling heat exchange process is a very complex physical process, along with the continuous improvement of the heat flux density, the heat exchange between the cooling medium and the surface of the heat source can be in the single-phase convection, nuclear boiling, transition boiling and membranous boiling states in sequence. When the single relative flow direction is developed in a nucleate boiling state, the heat transfer coefficient is rapidly increased, and the heat exchange performance is greatly improved; however, as the heat flux density increases further, when the critical heat flux density (CHF) is exceeded, a transition boiling state is entered at this time, and the heat transfer coefficient decreases rapidly.
In actual cooling, if the heat flux density exceeds the critical heat flux density, heat transfer is rapidly deteriorated, the heat source temperature will be increased rapidly, and a "evaporating-dry" phenomenon may occur, which may further cause burning of the cooling object, and cause a safety problem.
Disclosure of Invention
In order to solve the problems of unstable boiling heat exchange, low reliability, evaporation to dryness phenomenon and the like, which cause low cooling efficiency, burning of cooling objects and the like, the invention designs a cooling system and a cooling method for electronic equipment, which have strong heat dissipation capacity, can save the use amount of cooling medium, can reduce the cooling area and volume, can solve the problems of unstable boiling heat exchange and low reliability in the prior art, and can meet the heat dissipation requirement of a high heat flux electronic module.
The technical scheme for realizing the aim of the invention is as follows:
in a first aspect, the present invention provides a cooling method for an electronic device, comprising the steps of:
step 1, when the electronic equipment works, controlling a low-boiling-point cooling medium and a high-boiling-point cooling medium to flow at respective initial mass flow rates;
and 2, acquiring heat flux density and temperature signals of the electronic equipment in real time, and adjusting the cooling medium of the low-boiling-point cooling medium and/or the mass flow rate of the high-boiling-point cooling medium in real time.
Further, in the step 2, the method for acquiring the heat flux density and the temperature signal of the electronic device in real time and adjusting the mass flow rate of the cooling medium of the low boiling point cooling medium and/or the high boiling point cooling medium in real time includes:
step 2.1, acquiring heat flux density and temperature signals of the electronic equipment in real time;
step 2.2, when the heat flux density of the electronic device is at q 0 And q 1 Between them, and the temperature gradually reaches T s0 When the low boiling point cooling medium and the high boiling point cooling medium are controlled to flow at the respective initial mass flow rates；
Step 2.3, when the heat flux density of the electronic device is at q 1 And q 2 In between, and the temperature gradually rises to T s1 Gradually increasing the mass flow rate of the low boiling point cooling medium;
step 2.4, when the heat flux density of the electronic device is at q 2 And q 3 In between, and the temperature gradually rises to T s2 When the low-boiling-point cooling medium flows at the maximum mass flow rate, the mass flow rate of the high-boiling-point cooling medium is gradually increased;
step 2.5, when the heat flux density of the electronic device is at q 2 And q 3 In between, and the temperature gradually rises to T s3 When the low boiling point cooling medium and the high boiling point cooling medium are both controlled to flow at the maximum mass flow rate.
Further, a temperature difference between the low boiling point cooling medium and the high boiling point cooling medium is 10 ℃ or more.
Further, the above-mentioned low boiling point cooling medium and the above-mentioned high boiling point cooling medium include any two of water, mineral oil, and fluorinated liquid.
In a second aspect, the invention provides a cooling system for an electronic device, comprising an electronic module, a cooling channel positioned in the electronic module, and a temperature sensor.
The cooling channels comprise a first cooling channel and a second cooling channel, and cooling media with different boiling points circulate in the first cooling channel and the second cooling channel.
The cooling system further comprises a controller, wherein the controller is electrically connected with the temperature sensor, the first liquid inlet component and the second liquid inlet component and is used for controlling the on-off of the first cooling channel and the flow rate of cold medium liquid and/or controlling the on-off of the second cooling channel and the flow rate of cold medium liquid according to temperature signals of electronic components collected by the temperature sensor.
Further, one end of the first cooling channel is connected with a first liquid inlet component, the other end of the first cooling channel is connected with a first liquid outlet component, and a first condenser is arranged between the first liquid inlet component and the first liquid outlet component.
One end of the second cooling channel is connected with a second liquid inlet component, the other end of the second cooling channel is connected with a second liquid outlet component, and a second condenser is arranged between the second liquid inlet component and the second liquid outlet component.
Further, the first liquid inlet component and the second liquid inlet component both comprise a medium pipeline and a water pump positioned on the medium pipeline.
Further, the electronic module comprises a cover plate, a module box body and a plurality of connectors.
Further, the first cooling channel and the second cooling channel are each disposed crosswise in the electronic module in a meandering reciprocating structure.
Further, the flow direction of the cooling medium in the first cooling channel is the same as or opposite to the flow direction of the cooling medium in the second cooling channel.
Further, the electronic module is made of high-heat-conductivity materials.
Compared with the prior art, the invention has the beneficial effects that: the cooling system and the cooling method of the electronic equipment designed by the invention adopt a liquid boiling heat exchange mode to dissipate heat of the electronic equipment, have the advantages of strong heat dissipation capacity, saving the use amount of cooling medium and reducing the volume of cooling area, can solve the problems of unstable traditional boiling heat exchange and low reliability, and can meet the heat dissipation requirement of the high heat flux electronic module.
Drawings
In order to more clearly illustrate the technical solution of the embodiments of the present invention, the drawings that are needed in the description of the embodiments will be briefly described.
FIG. 1 is a functional block diagram of a cooling system for an electronic device in an embodiment;
FIG. 2 is a perspective view of an electronic module in an embodiment;
FIG. 3 is a schematic diagram showing the distribution of electronic components on a cartridge body in an embodiment;
FIG. 4 is a schematic view of a structure of a module case according to an embodiment;
FIG. 5 is a distribution of electronic components on an electronic assembly in an embodiment;
1, an electronic module; 2. a blower; 3. a first condenser; 4. a second condenser; 5. a second water pump; 6. a first water pump; 7. a first cable; 8. a controller; 9. a second cable; 10. a third cable; 11. a first liquid inlet pipe; 12. a second liquid inlet pipe; 13. a first liquid outlet pipe; 14. a third liquid inlet pipe; 15. a fourth liquid inlet pipe; 16. a second liquid outlet pipe; 101. a cover plate; 102. a first inlet; 103. a second inlet; 104. a first outlet; 105. a second outlet; 106. a module case; 106A, sealing the cover plate; 106B, a box body; 107. an electronic component; 1071. an electronic component; 108. a joint; 1061. a first cooling channel; 1062. and a second cooling channel.
Detailed Description
The invention will be further described with reference to specific embodiments, and advantages and features of the invention will become apparent from the description. These examples are merely exemplary and do not limit the scope of the invention in any way. It will be understood by those skilled in the art that various changes and substitutions of details and forms of the technical solution of the present invention may be made without departing from the spirit and scope of the present invention, but these changes and substitutions fall within the scope of the present invention.
Example 1:
the embodiment designs a cooling method for electronic equipment, which comprises the following steps:
and 1, controlling the low-boiling-point cooling medium and the high-boiling-point cooling medium to flow at the respective initial mass flow rates when the electronic equipment works.
Wherein the temperature difference between the low boiling point cooling medium and the high boiling point cooling medium is more than or equal to 10 ℃.
Meanwhile, in order to ensure the safety of the system, the boiling point ranges of the low-boiling-point cooling medium and the high-boiling-point cooling medium selected in the step are 50-125 ℃.
Optionally, the low-boiling-point cooling medium and the high-boiling-point cooling medium comprise any two of water, mineral oil and fluoridation liquid, and other cooling mediums with boiling points in the range of 50-125 ℃ can be selected.
And 2, acquiring heat flux density and temperature signals of the electronic equipment in real time, and adjusting the cooling medium of the low-boiling-point cooling medium and/or the mass flow rate of the high-boiling-point cooling medium in real time.
The method for acquiring the heat flux density and the temperature signal of the electronic equipment in real time and adjusting the mass flow rate of the cooling medium of the low-boiling-point cooling medium and/or the mass flow rate of the high-boiling-point cooling medium in real time comprises the following steps:
step 2.1, acquiring heat flux density and temperature signals of the electronic equipment in real time;
step 2.2, when the heat flux density of the electronic device is at q 0 And q 1 Between them, and the temperature gradually reaches T s0 When the low boiling point cooling medium and the high boiling point cooling medium are controlled to flow at respective initial mass flow rates.
In the step, as the temperature rises, the low-boiling-point cooling medium gradually starts to nucleate boiling in the channel where the low-boiling-point cooling medium is located, at the moment, the heat transfer coefficient is rapidly increased, the heat exchange capacity is also greatly improved, and the low-boiling-point cooling medium can emit more heat, so that the temperature control of electronic components is realized. Meanwhile, the high-boiling-point cooling medium is still in a single-phase convection heat exchange state in the channel where the high-boiling-point cooling medium is located, the heat transfer coefficient of the high-boiling-point cooling medium is relatively low, and certain heat can be emitted.
In this process, the low boiling point cooling medium plays a major role in heat dissipation, and the high boiling point cooling medium plays only a small role in heat dissipation.
Step 2.3, when the heat flux density of the electronic device is at q 1 And q 2 In between, and the temperature gradually rises to T s1 The mass flow rate of the low boiling point cooling medium is gradually increased.
In this step, as the heat flux density of the electronic device gradually increases, the boiling state of the low boiling point cooling medium gradually changes to the liquid film convection boiling, wet steam heat exchange or even superheated steam heat exchange state, and the heat transfer coefficient will rapidly decrease, resulting in temperature increase. At this time, the high boiling point cooling medium starts to nucleate boiling in the channel where the high boiling point cooling medium is located, at this time, along with the slight rise of the temperature, the heat transfer coefficient is rapidly increased, the heat exchange quantity is also greatly increased, the further rise of the temperature is restrained, the cooling function of the high boiling point cooling medium is gradually increased, and the cooling function of the low boiling point cooling medium is gradually decreased.
At the same time, as the temperature gradually increases to the value T s1 In the above case, the flow rate of the low boiling point cooling medium is gradually increased under the condition of ensuring that the flow rate of the high boiling point cooling medium is unchanged, so as to ensure that the low boiling point cooling medium is in a main cooling function. When the mass flow rate of the low-boiling-point cooling medium is gradually increased to v a1 When the system is in a state of stable temperature, the low-boiling-point cooling medium which is in a convection boiling state, a wet steam heat exchange state and even a superheated steam heat exchange state is gradually converted to a nucleate boiling state, so that the heat dissipation capacity of the low-boiling-point cooling medium is improved, and the system is ensured to be in a state of stable temperature.
Step 2.4, when the heat flux density of the electronic device is at q 2 And q 3 In between, and the temperature gradually rises to T s2 When the low boiling point cooling medium is flowing at the maximum mass flow rate, the mass flow rate of the high boiling point cooling medium is gradually increased.
In this step, as the heat flux density of the electronic device further increases to q 2 And q 3 Between, and the temperature rises to T s2 At this point the low-boiling cooling medium has reached the maximum mass flow velocity flow v a1 The low-boiling-point cooling medium is at the maximum flow rate, the high-boiling-point cooling medium is at the initial flow rate, and the flow rate of the high-boiling-point cooling medium needs to be gradually adjusted at the moment, so that the cooling duty ratio of the high-boiling-point cooling medium is gradually increased, and the cooling effect of the system is ensured.
Step 2.5, when the heat flux density of the electronic device is at q 2 And q 3 In between, and the temperature gradually rises to T s3 When the low boiling point cooling medium and the high boiling point cooling medium are both controlled to flow at the maximum mass flow rate.
In this step, with further increases in heat flux density and temperature, the system reaches a maximum heat dissipation capacity at which both the low boiling point cooling medium and the high boiling point cooling medium have flowed at maximum mass flow rates.
In this embodiment, the flow rate control strategy of the low boiling point cooling medium and the high boiling point cooling medium, and the critical values of each stage and temperature of the heat flux density may be obtained through pre-experiment calibration, so as to form a control instruction loaded into the controller, and the calibration flow is as follows:
a. during the experiment, a high-temperature-resistant heating body is adopted to simulate an actual chip so as to avoid burning out the chip at too high temperature;
b. the system is placed in an initial working state, and the flow rates of the low-boiling-point cooling medium and the high-boiling-point cooling medium are respectively set to be m a0 、m b0 And applying power P to the electronic device (where P should be as small as possible);
c. gradually adjusting the power P, wherein the adjustment amplitude is as small as possible each time, and observing the change condition of the temperature t acquired by the temperature sensor after each adjustment;
d. when the temperature T rises rapidly, the temperature value T before the rapid rise is recorded 1 ；
e. The flow rate of the low boiling point cooling medium is set to be m a1 ，m a1 ＞m a0 ；
f. Continuously adjusting the power P, adjusting the amplitude as small as possible each time, and observing the change condition of the temperature t acquired by the temperature sensor after each time of adjustment;
g. when the temperature T rises rapidly, the temperature value T before the rapid rise is recorded 2 ；
h. The flow rate of the low boiling point cooling medium is set to be the maximum value m a2 ，m a2 ＞m a1 ＞m a0 ；
i. Continuously adjusting the power P, adjusting the amplitude as small as possible each time, and observing the change condition of the temperature t acquired by the temperature sensor after each time of adjustment;
j. when the temperature T rises rapidly, the temperature value T before the rapid rise is recorded 3 ；
k. The flow rate of the high boiling point cooling medium is set to be m b1 ，m b1 ＞m b0 ；
Continuously adjusting the power P, adjusting the amplitude as small as possible each time, and observing the change condition of the temperature t acquired by the temperature sensor after each time of adjustment;
m. when the temperature T rises rapidly, recording the temperature value T before the rapid rise 4 ；
n, setting the maximum flow of the high boiling point cooling medium to be m b2 ，m b2 ＞m b1 ＞m b0 ；
Continuously adjusting the power P, adjusting the amplitude as small as possible each time, and observing the change condition of the temperature t acquired by the temperature sensor after each time of adjustment;
p. when the temperature T rises rapidly, recording the temperature value T before the rapid rise 5 。
According to the cooling method, the electronic module is cooled by adopting two cooling mediums with different boiling points, when the heat flux density and the heat source power consumption are continuously increased, the two cooling mediums are alternately in a boiling heat exchange state, so that the range of boiling heat exchange of a single cooling medium is enlarged, and the problems of unstable boiling heat exchange of the single cooling medium, easiness in oscillation and fluctuation and the like are solved. In addition, the control strategy is adopted to control the system, the two cooling media alternately bear main heat dissipation tasks, and the flow of the pump is regulated to further widen the boiling heat exchange range of the cooling media, so that the heat dissipation capacity and the reliability of the traditional liquid cooling heat dissipation are improved.
Example 2:
the present embodiment provides a cooling system for an electronic device, and referring to fig. 1, the cooling system includes an electronic module 1, a cooling channel located in the electronic module 1, a temperature sensor, a controller 8, a liquid inlet component, a liquid outlet component, and a fan 2.
Referring to fig. 1, the cooling channels include a first cooling channel 1061 and a second cooling channel 1062, and cooling mediums with different boiling points flow in the first cooling channel 1061 and the second cooling channel 1062, for example, a low boiling point cooling medium flows in the first cooling channel 1061, and a high boiling point cooling medium flows in the second cooling channel 1062.
Optionally, the first cooling channel 1061 and the second cooling channel 1062 are disposed in a zigzag reciprocating structure and are disposed in the electronic module 1. For example, the first cooling channel 1061 and the second cooling channel 1062 may be configured in a densely-meandering reciprocating shape in the vicinity of the heat source to increase the length, and the distance between them is at least less than 2mm, and may be parallel or spiral. And the cross-sectional shape may be rectangular, circular or other shapes, which may be the same or different. The width of the channel is less than 3mm, and the surface of the channel can be a pit, a slit or a porous surface so as to increase the formation of a vaporization core during boiling.
Optionally, referring to fig. 1, one end of the first cooling channel 1061 is connected with a first liquid inlet component of the liquid inlet component, the other end is connected with a first liquid outlet component of the liquid outlet component, and a first condenser 3 is disposed between the first liquid inlet component and the first liquid outlet component. One end of the second cooling channel 1062 is connected with a second liquid inlet component of the liquid inlet component, the other end is connected with a second liquid outlet component of the liquid outlet component, and a second condenser 4 is arranged between the second liquid inlet component and the second liquid outlet component.
Optionally, the flow direction of the cooling medium in the first cooling channel 1061 is the same as or opposite to the flow direction of the cooling medium in the second cooling channel 1062.
Optionally, the first liquid inlet component and the second liquid inlet component each include a medium pipeline and a water pump located on the medium pipeline. Referring to fig. 1, the first liquid inlet assembly includes a first liquid inlet pipe 11, a first water pump 6, a second liquid inlet pipe 12, and the first liquid outlet assembly includes a first liquid outlet pipe 13. The second liquid inlet pipe 12 is communicated with the first cooling channel 1061 through a first inlet 102 on the electronic module 1, and the first liquid outlet pipe 13 is communicated with the first cooling channel 1061 through a first outlet 104.
Referring to fig. 1, the second liquid inlet assembly includes a third liquid inlet pipe 14, a second water pump 5, and a fourth liquid inlet pipe 15, and the second liquid outlet assembly includes a second liquid outlet pipe 16. The third liquid inlet pipe 14 is communicated with the second cooling channel 1062 through the second inlet 103 on the electronic module 1, and the second liquid outlet pipe 16 is communicated with the second cooling channel 1062 through the second outlet 105.
In one embodiment, the first water pump 6 and the second water pump 5 may be of centrifugal type, gear type, or the like, and the flow rate may be adjusted within a certain range.
In one embodiment, the temperature sensor may be a K-type thermocouple, a T-type thermocouple, a temperature measuring chip, 1 or more temperature measuring chips, and may be disposed on the surface or inside the module case 106 or on an electronic component.
Referring to fig. 2 to 5, the electronic module 1 includes a cover plate 101, a plurality of connectors, and a module case 106, wherein the cover plate 101 is detachably fixed to the module case 106 by screws; the electronic assembly 107 includes at least 1 electronic component 1071, and each electronic component may be in direct contact with the module case 106 or may be in contact with other thermally conductive materials.
Referring to fig. 2 and 4, the module case 106 is made of a material with high thermal conductivity, such as aluminum alloy, copper, etc., and includes a sealing cover plate 106A and a case 106B, and the sealing cover plate 106A and the case 106B are integrated by welding, such as vacuum brazing, and sealing is achieved. The first inlet 102, the second inlet 103, the first outlet 104 and the second outlet 105 are arranged on the box body 106B, the first cooling channel 1061 and the second cooling channel 1062 are processed on the box body 106B, the first inlet 102, the second inlet 103, the first outlet 104 and the second outlet 105 of the box body 106B are all provided with connectors 108, and the connectors 108 are connected with the channels through pipelines to realize the flow of cooling medium.
Referring to fig. 1, the number of fans 2 may be 1 or more, which are located above the first condenser 3 and the second condenser 4, and the first condenser 3 and the second condenser 4 may be cooled using the same fan or different fans.
Referring to fig. 1, the controller 8 is electrically connected to the temperature sensor, the first liquid inlet component, and the second liquid inlet component, and is configured to control the on/off of the first cooling channel 1061 and the flow rate of the cooling medium liquid, and/or control the on/off of the second cooling channel 1062 and the flow rate of the cooling medium liquid according to the temperature signal of the electronic component collected by the temperature sensor. Specifically, the controller 8 is electrically connected to the first water pump 6 via the first cable 7, to the second water pump 5 via the second cable 9, and to the temperature sensor via the third cable 10.
The core of the cooling system and the method is that two cooling mediums with different boiling points are adopted to cool electronic components, when the heat flux density and the heat source power consumption are continuously increased, the two cooling mediums are alternately in a boiling heat exchange state, the boiling heat exchange range of a single cooling medium is enlarged, and the problems that the boiling heat exchange of the single cooling medium is unstable, and the single cooling medium is easy to vibrate and fluctuate are solved. In addition, the system is controlled by adopting a control strategy, the main heat dissipation task can be alternately borne by two cooling media, and the flow of the pump is regulated so as to further widen the boiling heat exchange range of the cooling media. The heat dissipation capacity and the reliability of the traditional liquid cooling heat dissipation are improved.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the invention.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.

Claims (10)

1. A cooling method for an electronic device, comprising the steps of:
step 1, when the electronic equipment works, controlling a low-boiling-point cooling medium and a high-boiling-point cooling medium to flow at respective initial mass flow rates;
and 2, acquiring heat flux density and temperature signals of the electronic equipment in real time, and adjusting the cooling medium of the low-boiling-point cooling medium and/or the mass flow rate of the high-boiling-point cooling medium in real time.
2. The cooling method for an electronic apparatus according to claim 1, characterized in that: in step 2, acquiring heat flux density and temperature signals of the electronic device in real time, and adjusting mass flow rate of the cooling medium of the low boiling point cooling medium and/or the cooling medium of the high boiling point cooling medium in real time, including:
step 2.1, acquiring heat flux density and temperature signals of the electronic equipment in real time;
step 2.2, when the heat flux density of the electronic device is at q 0 And q 1 Between them, and the temperature gradually reaches T s0 Controlling the low boiling point cooling medium and the high boiling point cooling medium to flow at respective initial mass flow rates;
step 2.3, when the heat flux density of the electronic device is at q 1 And q 2 In between, and the temperature gradually rises to T s1 Gradually increasing the mass flow rate of the low boiling point cooling medium;
step 2.4, when the heat flux density of the electronic device is at q 2 And q 3 In between, and the temperature gradually rises to T s2 When the low-boiling-point cooling medium flows at the maximum mass flow rate, the mass flow rate of the high-boiling-point cooling medium is gradually increased;
step 2.5, when the heat flux density of the electronic device is at q 2 And q 3 In between, and the temperature gradually rises to T s3 When the low boiling point cooling medium and the high boiling point cooling medium are both controlled to flow at the maximum mass flow rate.
3. The cooling method for an electronic apparatus according to claim 1, wherein a temperature difference between the low-boiling-point cooling medium and the high-boiling-point cooling medium is 10 ℃ or more.
4. A cooling method for an electronic apparatus according to claim 1 or 3, wherein the low boiling point cooling medium and the high boiling point cooling medium include any two of water, mineral oil, and a fluorinated liquid.
5. A cooling system for electronic equipment, comprising an electronic module (1), and a cooling channel and a temperature sensor which are positioned in the electronic module (1), wherein the cooling channel comprises a first cooling channel (1061) and a second cooling channel (1062), and cooling media with different boiling points are circulated in the first cooling channel (1061) and the second cooling channel (1062);
the cooling system further comprises a controller (8), wherein the controller (8) is electrically connected with the temperature sensor, the first liquid inlet component and the second liquid inlet component, and is used for controlling the on-off of the first cooling channel (1061) and the flow rate of cold medium liquid and/or controlling the on-off of the second cooling channel (1062) and the flow rate of cold medium liquid according to temperature signals of electronic components collected by the temperature sensor.
6. A cooling system for an electronic device as recited in claim 5, wherein: one end of the first cooling channel (1061) is connected with a first liquid inlet component, the other end of the first cooling channel is connected with a first liquid outlet component, and a first condenser (3) is arranged between the first liquid inlet component and the first liquid outlet component;
one end of the second cooling channel (1062) is connected with a second liquid inlet component, the other end of the second cooling channel is connected with a second liquid outlet component, and a second condenser (4) is arranged between the second liquid inlet component and the second liquid outlet component.
7. A cooling system for an electronic device as recited in claim 5, wherein: the first liquid inlet component and the second liquid inlet component both comprise a medium pipeline and a water pump positioned on the medium pipeline.
8. A cooling system for an electronic device as recited in claim 5, wherein: the electronic module (1) comprises a cover plate (101), a module box body (106) and a plurality of connectors.
9. A cooling system for an electronic device as recited in claim 5, wherein: the first cooling channel (1061) and the second cooling channel (1062) are each arranged crosswise in a meandering reciprocating structure within the electronic module (1).
10. A cooling system for an electronic device as recited in claim 5, wherein: the direction of flow of the cooling medium in the first cooling channel (1061) is the same as or opposite to the direction of flow of the cooling medium in the second cooling channel (1062).
CN202211612293.XA 2022-12-15 2022-12-15 Cooling system and cooling method for electronic equipment Pending CN116113207A (en)

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CN202211612293.XA CN116113207A (en) 2022-12-15 2022-12-15 Cooling system and cooling method for electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202211612293.XA CN116113207A (en) 2022-12-15 2022-12-15 Cooling system and cooling method for electronic equipment

Publications (1)

Publication Number Publication Date
CN116113207A true CN116113207A (en) 2023-05-12

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CN202211612293.XA Pending CN116113207A (en) 2022-12-15 2022-12-15 Cooling system and cooling method for electronic equipment

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