CN116108781A - Method, device, equipment and medium for checking co-lay part - Google Patents

Method, device, equipment and medium for checking co-lay part Download PDF

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CN116108781A
CN116108781A CN202310179730.1A CN202310179730A CN116108781A CN 116108781 A CN116108781 A CN 116108781A CN 202310179730 A CN202310179730 A CN 202310179730A CN 116108781 A CN116108781 A CN 116108781A
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document
lay
target
information
inspection
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郭丹萍
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Zhengzhou Yunhai Information Technology Co Ltd
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Zhengzhou Yunhai Information Technology Co Ltd
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/32—Circuit design at the digital level
    • G06F30/33—Design verification, e.g. functional simulation or model checking
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2115/00—Details relating to the type of the circuit
    • G06F2115/12—Printed circuit boards [PCB] or multi-chip modules [MCM]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/30—Computing systems specially adapted for manufacturing

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  • General Engineering & Computer Science (AREA)
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Abstract

The application discloses a method, a device, equipment and a medium for checking co-lay parts, which relate to the technical field of pcb design and comprise the following steps: respectively acquiring a schematic diagram document and a corresponding co-lay part list in a PCB design document to obtain a first part document and a second part document; comparing and checking the first part document and the second part document, and deleting co-lay part information which is consistent in comparison in the first part document and the second part document to obtain a first target part document and a second target part document; and generating a co-lay part inspection result based on the first target part document and the second target part document. Furthermore, the inspection of the co-lay part can be completed in the mode, the condition of inspection errors caused by human error missed inspection or wrong inspection is avoided, and the time cost of manual inspection is reduced.

Description

Method, device, equipment and medium for checking co-lay part
Technical Field
The invention relates to the technical field of pcb design, in particular to a method, a device, equipment and a medium for checking a co-lay part.
Background
In the latest platform design, the number of the co-lay parts is up to 500, the traditional method is that an EE engineer firstly manually sorts and outputs a list of the parts needing the co-lay, and then goes to the ten-lay parts on the main control board to compare and check whether the co-lay is needed according to the list, and the check requirement of the co-lay parts is required to be completely corresponding to the schematic diagram and the PCB design, namely, the number of the co-lay parts is completely corresponding to the position number of the co-lay, the check of the unidirectional output is not only time-consuming, but also only ensures that the design of the PCB comprises the co-lay of the schematic diagram, and the number of the PCB design is not more than the design requirement of the co-lay of the schematic diagram, and the situation that the co-lay is missed or misplaced easily due to human errors can be eliminated.
In summary, how to complete the inspection requirement of rapidly inspecting whether the co-lay part of the schematic diagram is consistent with the co-lay part in the pcb design diagram, and output the co-lay part information of the inconsistent schematic diagram and pcb design diagram, reduces the workload of hardware engineers, and improves the inspection efficiency and accuracy.
Disclosure of Invention
In view of the above, the present invention aims to provide a method, an apparatus, a device, and a medium for inspecting co-lay parts, which can complete the inspection requirement for inspecting whether the co-lay parts in the schematic diagram are consistent with the co-lay parts in the pcb design diagram, and output the co-lay part information inconsistent with the pcb design diagram, thereby reducing the workload of hardware engineers and improving the inspection efficiency and accuracy. The specific scheme is as follows:
in a first aspect, the present application discloses a method for inspecting co-lay parts, including:
respectively acquiring a schematic diagram document and a corresponding co-lay part list in a PCB design document to obtain a first part document and a second part document; the first part document is a schematic diagram co-lay part document, and the second part document is a PCB design co-lay part document;
performing comparison verification on the first part document and the second part document, and deleting co-lay part information consistent in comparison in the first part document and the second part document to obtain a first target part document and a second target part document;
and generating a co-lay part inspection result based on the first target part document and the second target part document.
Optionally, the obtaining the co-lay part list in the schematic diagram document and the corresponding PCB design document to obtain the first part document and the second part document includes:
scanning the schematic diagram document, extracting first co-lay part information carrying target part attributes, and generating a first part document according to the first co-lay part information by a text format;
executing a preset co-lay part inspection instruction, deriving second co-lay part information in the PCB design document, and respectively storing the second part information in different worksheets; a second part document is generated based on the second part information.
Optionally, before the scanning the schematic document, the method further includes:
and selecting a target part to be co-lay from the principle image file, and adding attributes to the target part to obtain a first co-lay part.
Optionally, the executing the preset co-lay part inspection instruction, and deriving the second co-lay part information in the PCB design document includes:
and executing a preset co-lay part inspection instruction, and deriving the part name and the corresponding center coordinate of the second co-lay part in the PCB design document.
Optionally, the second part information is respectively stored in different worksheets; generating a second part document based on the second part information, comprising:
selecting a target worksheet, setting the central coordinate of a second co-lay part in the target worksheet as a reference coordinate, inquiring the coordinate identical to the reference coordinate from the worksheets except the target worksheet, and recording a bit number corresponding to the coordinate;
and splicing the bit numbers to generate a second part document.
Optionally, the comparing and checking the first part document and the second part document, deleting co-lay part information with consistent comparison in the first part document and the second part document, including:
and storing the first co-lay part information and the second co-lay part information in the same target table in a separate row, and deleting the same co-lay part information in the first co-lay part information and the second co-lay part information by using a de-duplication instruction.
Optionally, the generating a co-lay part inspection result based on the first target part document and the second target part document includes:
and respectively extracting residual co-lay part information in the first target part document and the second target part document, and generating a co-lay part inspection result based on the residual co-lay part information.
In a second aspect, the application discloses a co-lay part inspection device comprising:
the document acquisition module is used for respectively acquiring a schematic diagram document and a corresponding co-lay part list in the PCB design document so as to obtain a first part document and a second part document; the first part document is a schematic diagram co-lay part document, and the second part document is a PCB design co-lay part document;
the information verification module is used for carrying out comparison verification on the first part document and the second part document, and deleting co-lay part information consistent in comparison in the first part document and the second part document so as to obtain a first target part document and a second target part document;
and the part inspection module is used for generating a co-lay part inspection result based on the first target part document and the second target part document.
In a third aspect, the present application discloses an electronic device comprising:
a memory for storing a computer program;
and a processor for executing the computer program to implement the steps of the disclosed co-lay part inspection method.
In a fourth aspect, the present application discloses a computer-readable storage medium for storing a computer program; wherein the computer program when executed by the processor implements the steps of the previously disclosed co-lay part inspection method.
From this, the application discloses a co-lay part inspection method, including: respectively acquiring a schematic diagram document and a corresponding co-lay part list in a PCB design document to obtain a first part document and a second part document; the first part document is a schematic diagram co-lay part document, and the second part document is a PCB design co-lay part document; performing comparison verification on the first part document and the second part document, and deleting co-lay part information consistent in comparison in the first part document and the second part document to obtain a first target part document and a second target part document; and generating a co-lay part inspection result based on the first target part document and the second target part document. It can be seen that by using the co-lay part list corresponding to the principle image file and the co-lay part list corresponding to the PCB design file to be obtained independently, and performing comparison and verification operation on the obtained part list, the identical part information in the two part lists is obtained by using the comparison instruction in the table, the identical part information indicates that the part corresponding to the part information meets the current inspection requirement, the identical part information in the two part lists is removed, the rest part information is correspondingly arranged to form two part files, the part information contained in the part files is the part information corresponding to the part which does not meet the inspection requirement, and further, the inspection of the co-lay part can be completed in the mode, the condition of inspection errors caused by human error and missed inspection or wrong inspection is avoided, and the time cost of manual inspection is reduced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present invention, and that other drawings can be obtained according to the provided drawings without inventive effort for a person skilled in the art.
FIG. 1 is a flow chart of a method for inspecting co-lay parts disclosed in the present application;
FIG. 2 is a schematic diagram of the acquisition of part information in a schematic diagram document disclosed in the present application;
FIG. 3 is a schematic diagram of the extraction result of part information in a schematic diagram document disclosed in the present application;
FIG. 4 is a flowchart of a specific co-lay part inspection method disclosed herein;
FIG. 5 is a schematic diagram of a process for comparing part information in a document disclosed in the present application;
FIG. 6 is a schematic diagram of a comparison result of part information in a document disclosed in the present application;
FIG. 7 is a schematic structural diagram of a co-lay part inspection device disclosed in the present application;
fig. 8 is a block diagram of an electronic device disclosed in the present application.
Detailed Description
The following description of the technical solutions in the embodiments of the present application will be made clearly and completely with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the latest platform design, the number of the co-lay parts is up to 500, the traditional method is that an EE engineer firstly manually sorts and outputs a list of the parts needing the co-lay, and then goes to the ten-lay parts on the main control board to compare and check whether the co-lay is needed according to the list, and the check requirement of the co-lay parts is required to be completely corresponding to the schematic diagram and the PCB design, namely, the number of the co-lay parts is completely corresponding to the position number of the co-lay, the check of the unidirectional output is not only time-consuming, but also only ensures that the design of the PCB comprises the co-lay of the schematic diagram, and the number of the PCB design is not more than the design requirement of the co-lay of the schematic diagram, and the situation that the co-lay is missed or misplaced easily due to human errors can be eliminated.
Therefore, the application discloses a co-lay part inspection scheme, which can finish the inspection requirement of rapidly inspecting whether the co-lay part of the schematic diagram is consistent with the co-lay part in the pcb design diagram, and output the co-lay part information inconsistent with the pcb design diagram, thereby reducing the workload of hardware engineers and improving the inspection efficiency and accuracy.
Referring to FIG. 1, the embodiment of the invention discloses a method for inspecting co-lay parts, which comprises the following steps:
step S11: respectively acquiring a schematic diagram document and a corresponding co-lay part list in a PCB design document to obtain a first part document and a second part document; the first part document is a schematic diagram co-lay part document, and the second part document is a PCB design co-lay part document.
In the embodiment, the schematic diagram document is scanned, first co-lay part information carrying the attribute of the target part is extracted, and the first co-lay part information is generated into a first part document according to a text format; it can be understood that by triggering the instruction for exporting the co-lay document, the background can be controlled to automatically scan the whole schematic diagram document, extract all device names with the attribute of CL, and present the device names in the form of the first part document in txt format. Specifically, the CL attribute is a target part attribute. Wherein, co-lay refers to the design of 2 or more device stitch bonding pads during PCB design, and only one of the device stitch bonding pads is actually printed at last, which is simply described as follows: and a group of signal wires realize different functions or modes through different components. And the co-lay part is a component for realizing different functions at the same position in the PCB design.
In this embodiment, a preset co-lay part inspection instruction is executed, second co-lay part information in the PCB design document is derived, and the second part information is stored in different worksheets respectively; a second part document is generated based on the second part information. It can be understood that clicking a click button for starting execution of a preset co-lay part inspection instruction through the human-computer interaction interface performs a corresponding operation to obtain the second part document.
In this embodiment, before the schematic diagram document is scanned, a target part to be co-lay is selected from the schematic diagram document, and attribute addition is performed on the target part to obtain a first co-lay part. It will be appreciated that 2 developments were made to the cadence language, creating the following 3 modules in turn: the device selection module is used for selecting the device, the co-lay attribute module is added, the co-lay document module is exported, specifically, the device selection module is clicked, the software can automatically call related skip, and then the device needing co-lay is selected in the schematic diagram, as shown in the following figure 2, and the PC339, PC341 and PC343 selected in the frame can be selected; clicking a 'add co-lay attribute' module, and automatically adding a 'CL' attribute on the selected part by software, wherein the attribute value is part position number splicing, such as 'PC 339-PC341-PC 343'; after all the co-lay attributes of the schematic diagram are added, clicking the "export co-lay document" module generates a "sch_co-lay.txt" document shown in the following fig. 3 under the root directory of the schematic diagram, wherein the "sch_co-lay.txt" document is a first part document, and the first part document specifically includes the number of page codes where the co-lay part is required to be located, the name of the co-lay part carrying the CL attribute, and the like. For example: the part information of the part to be co-lay designed in the current schematic diagram is as follows: R1-R3 in page 25, C123-C122 in page 30, PC229-PC341-PC343 in page 34, PR12-PR43 in page 120, etc.
Step S12: and comparing and checking the first part document and the second part document, and deleting co-lay part information which is consistent in comparison in the first part document and the second part document to obtain a first target part document and a second target part document.
In this embodiment, comparing and checking the obtained first part document and second part document, wherein the comparison content is whether the part information of the to-be-co-lay part in the two documents and the part information of the co-lay part subjected to the PCB design are consistent, if so, the to-be-co-lay part in the schematic diagram is indicated to have completed the PCB design, and if not, the first case is divided into two cases, namely, the to-be-co-lay part in the schematic diagram does not find the corresponding part information in the second part document, namely, the part information of the to-be-co-lay part appears in the first part document and does not appear in the second part document, and at the moment, the PCB design of the to-be-co-lay part is indicated to be not performed in the PCB design document corresponding to the second part document; in the second case, that is, the co-lay part designed in the PCB does not find the corresponding part information in the first part document, the part information of the co-lay part designed in the PCB design document appears in the second part document and does not appear in the first part document, and at this time, the part information of the co-lay part designed in the schematic diagram document corresponding to the first part document is indicated to be missing, for example: schematic page numbers where the parts are located, part names, etc. Then, the two parts documents are deleted respectively of the same parts information generated after the above comparison and verification to obtain a first target part document and a second target part document which do not contain the same parts information. A fixed attribute is added to a device needing a co-lay through a skill language, and the device with the fixed attribute can be completely finished through a traversing searching method.
Step S13: and generating a co-lay part inspection result based on the first target part document and the second target part document.
In this embodiment, an inspection result document is generated according to a first target part document and a second target part document, specifically, part information, which is used for representing that the inspection requirements are not met, in the first target document and the second target document is extracted in a concentrated manner, and is correspondingly sorted, and a co-lay part inspection result is output in a table form.
From this, the application discloses a co-lay part inspection method, including: respectively acquiring a schematic diagram document and a corresponding co-lay part list in a PCB design document to obtain a first part document and a second part document; the first part document is a schematic diagram co-lay part document, and the second part document is a PCB design co-lay part document; performing comparison verification on the first part document and the second part document, and deleting co-lay part information consistent in comparison in the first part document and the second part document to obtain a first target part document and a second target part document; and generating a co-lay part inspection result based on the first target part document and the second target part document. It can be seen that by using the co-lay part list corresponding to the principle image file and the co-lay part list corresponding to the PCB design file to be obtained independently, and performing comparison and verification operation on the obtained part list, the identical part information in the two part lists is obtained by using the comparison instruction in the table, the identical part information indicates that the part corresponding to the part information meets the current inspection requirement, the identical part information in the two part lists is removed, the rest part information is correspondingly arranged to form two part files, the part information contained in the part files is the part information corresponding to the part which does not meet the inspection requirement, and further, the inspection of the co-lay part can be completed in the mode, the condition of inspection errors caused by human error and missed inspection or wrong inspection is avoided, and the time cost of manual inspection is reduced.
Referring to fig. 4, an embodiment of the present invention discloses a specific co-lay part inspection method, and compared with the previous embodiment, the present embodiment further describes and optimizes a technical solution. Specific:
step S21: and acquiring a co-lay part list in the schematic diagram document to obtain a first part document.
In step S21, the detailed processing procedure is referred to the above disclosed embodiments, and will not be described herein.
Step S22: and executing a preset co-lay part inspection instruction, and deriving the part name and the corresponding center coordinate of the second co-lay part in the PCB design document.
In this embodiment, a preset co-lay part inspection instruction is executed, specifically, a co-lay check module is clicked to start part information acquisition operation of a PCB design document, and it should be noted that the implementation steps of the background of the co-lay check module are as follows: the names and the center coordinates of all devices in the derived PCB design document are stored in different sheets, and it can be understood that the names of the parts and the center coordinates of the parts are derived and stored in different sheets by deriving the part information of all the parts contained in the PCB design document, so as to obtain the part information of all the parts.
Step S23: selecting a target worksheet, setting the central coordinate of a second co-lay part in the target worksheet as a reference coordinate, inquiring the coordinate identical to the reference coordinate from the worksheets except the target worksheet, and recording a bit number corresponding to the coordinate; and splicing the bit numbers to generate a second part document.
In this embodiment, the center coordinates of the parts in one sheet are used as reference targets, and a vlookup command is used to find the coordinates identical to the coordinates in the other sheet, and record the corresponding bit numbers; and repeating the steps to finish the coordinate comparison of all the parts. It can be understood that by searching and comparing the same coordinates in different sheets, all the part information with the central position coordinates as a unified target is determined, so that the part information of the co-lay part designed in the PCB design document can be determined, and the central coordinates of the whole device of the PCB are derived, because the central coordinates of the co-lay devices are the same, the same bit number and the corresponding coordinates of the coordinates can be obtained by using a vlookup command. Specifically, the position numbers of the co-lay parts with the same center coordinates and the center coordinates are recorded and stored to generate a second part document, specifically, the position numbers with the same coordinates of the PCB design document are spliced by using "-", the document name of the second part document is recorded as "pcb_co-lay.txt", and it is noted that the part name of the co-lay part is the position number.
Step S24: and storing the first co-lay part information and the second co-lay part information in the same target table in a separate row, and deleting the same co-lay part information in the first co-lay part information and the second co-lay part information by using a deleting repeated item instruction.
In this embodiment, the page of the obtained schematic diagram and the corresponding co-lay device names are respectively stored in the following column a and column B shown in fig. 5, the co-lay device bit number and the corresponding coordinates in the PCB design document obtained in the step D are respectively stored in the following column C and column D shown in fig. 5, the information in the column B and the column C can be deleted by deleting the command of the repeated item under the table data, then the remaining information in the column B is the co-lay design with more schematic diagrams than the PCB, and the remaining information in the column C is the co-lay design in the PCB which does not meet the requirements of the schematic diagram, for example: from the data display in the table data, it can be seen that R1-R3, C123-C122, PR12-PR43 in columns B and C of the table are the same part names in both columns, and correspondingly, the (x 1, y 1), (x 2, y 2), (x 5, y 5) in columns 25, 30, 120 and D in the page number of the schematic diagram in column A and the same part names in columns B and C are deleted. It should be noted that the first part list and the second part list of the schematic diagram document and the PCB design document need to be recorded in the same format, and then the two part lists are stored in a table, and then the method of deleting the repeated items in the table is utilized to obtain the inspection result.
Step S25: and respectively extracting residual co-lay part information in the first target part document and the second target part document, and generating a co-lay part inspection result based on the residual co-lay part information.
In this embodiment, the operation of extracting the residual part information is performed on the two target documents, specifically, by opening the software designed by the PCB, clicking the previously embedded "colay check" module, clicking the "colay check" again, a dialog box for performing the next level of man-machine interaction is displayed, the operation is performed according to the step of selecting the second part document storage path-clicking check-clicking and deriving, after the operation is completed, the residual information in column B and the corresponding information in column a of fig. 5 are extracted, the residual information in column C and the corresponding information in column D are extracted, and the inspection result as shown in fig. 6 can be obtained. Wherein the viewing the results comprises: the PCB design document does not meet the bit number and the coordinate of the schematic diagram co-lay design, and also comprises the bit number of which required co-lay is not designed in the PCB in the schematic diagram and the corresponding schematic diagram page number.
Therefore, through secondary development of cadence language, list of co-lay parts of the schematic diagram and the PCB design document is automatically obtained respectively, then the two list documents are copied to different columns in the table, and the command of deleting repeated items under the function of table data is utilized, so that whether the schematic diagram and the co-lay parts of the PCB design document are completely corresponding can be rapidly and accurately checked, further, the position numbers and the coordinates of the co-lay design of the schematic diagram are not met by the PCB design document, and the position numbers of co-lay required by which are not designed in the PCB and the corresponding schematic diagram page numbers in the schematic diagram can be obtained, thereby being convenient for EE engineers and layout engineers to correct and compare the schematic diagram and the PCB design.
Referring to fig. 7, an embodiment of the present invention discloses a co-lay part inspection apparatus, including:
a document acquisition module 11, configured to acquire a schematic diagram document and a corresponding co-lay part list in a PCB design document, respectively, so as to obtain a first part document and a second part document; the first part document is a schematic diagram co-lay part document, and the second part document is a PCB design co-lay part document;
an information verification module 12, configured to perform a comparison verification on the first part document and the second part document, and delete co-lay part information that is consistent in comparison in the first part document and the second part document, so as to obtain a first target part document and a second target part document;
a part inspection module 13 for generating a co-lay part inspection result based on the first target part document and the second target part document.
The document acquisition module 11 is specifically configured to scan the schematic diagram document, extract first co-lay part information carrying the attribute of the target part, and generate a first part document according to a text format from the first co-lay part information; it can be understood that by triggering the instruction for exporting the co-lay document, the background can be controlled to automatically scan the whole schematic diagram document, extract all device names with the attribute of CL, and present the device names in the form of the first part document in txt format. Specifically, the CL attribute is a target part attribute. Wherein, co-lay refers to the design of 2 or more device stitch bonding pads during PCB design, and only one of the device stitch bonding pads is actually printed at last, which is simply described as follows: and a group of signal wires realize different functions or modes through different components. And the co-lay part is a component for realizing different functions at the same position in the PCB design. Executing a preset co-lay part inspection instruction, deriving second co-lay part information in the PCB design document, and respectively storing the second part information in different worksheets; a second part document is generated based on the second part information. It can be understood that clicking a click button for starting execution of a preset co-lay part inspection instruction through the human-computer interaction interface performs a corresponding operation to obtain the second part document. Before scanning the schematic diagram document, selecting a target part to be co-lay from the schematic diagram document, and adding attributes to the target part to obtain a first co-lay part. It will be appreciated that 2 developments were made to the cadence language, creating the following 3 modules in turn: the device selection module is used for selecting the device, the co-lay attribute module is added, the co-lay document module is exported, specifically, the device selection module is clicked, the software can automatically call related skip, and then the device needing co-lay is selected in the schematic diagram, as shown in the following figure 2, and the PC339, PC341 and PC343 selected in the frame can be selected; clicking a 'add co-lay attribute' module, and automatically adding a 'CL' attribute on the selected part by software, wherein the attribute value is part position number splicing, such as 'PC 339-PC341-PC 343'; after all the co-lay attributes of the schematic diagram are added, clicking the "export co-lay document" module generates a "sch_co-lay.txt" document shown in the following fig. 3 under the root directory of the schematic diagram, wherein the "sch_co-lay.txt" document is a first part document, and the first part document specifically includes the number of page codes where the co-lay part is required to be located, the name of the co-lay part carrying the CL attribute, and the like. For example: the part information of the part to be co-lay designed in the current schematic diagram is as follows: R1-R3 in page 25, C123-C122 in page 30, PC229-PC341-PC343 in page 34, PR12-PR43 in page 120, etc.
The information verification module 12 is specifically configured to compare and verify the acquired first part document and second part document, where the comparison content is whether the part information of the to-be-co-lay part in the two documents and the part information of the co-lay part subjected to PCB design are consistent, if so, it indicates that the to-be-co-lay part in the schematic diagram has completed PCB design, and if not, it is divided into two cases, where the first case is that the to-be-co-lay part in the schematic diagram does not find the corresponding part information in the second part document, that is, the part information of the to-be-co-lay part appears in the first part document and does not appear in the second part document, and at this time, it indicates that the PCB design of the to-be-co-lay part is not performed in the PCB design document corresponding to the second part document; in the second case, that is, the co-lay part designed in the PCB does not find the corresponding part information in the first part document, the part information of the co-lay part designed in the PCB design document appears in the second part document and does not appear in the first part document, and at this time, the part information of the co-lay part designed in the schematic diagram document corresponding to the first part document is indicated to be missing, for example: schematic page numbers where the parts are located, part names, etc. Then, the two parts documents are deleted respectively of the same parts information generated after the above comparison and verification to obtain a first target part document and a second target part document which do not contain the same parts information. A fixed attribute is added to a device needing a co-lay through a skill language, and the device with the fixed attribute can be completely finished through a traversing searching method.
From this, the application discloses obtaining the schematic diagram file and the corresponding co-lay part list in the PCB design file respectively, so as to obtain the first part file and the second part file; the first part document is a schematic diagram co-lay part document, and the second part document is a PCB design co-lay part document; performing comparison verification on the first part document and the second part document, and deleting co-lay part information consistent in comparison in the first part document and the second part document to obtain a first target part document and a second target part document; and generating a co-lay part inspection result based on the first target part document and the second target part document. It can be seen that by using the co-lay part list corresponding to the principle image file and the co-lay part list corresponding to the PCB design file to be obtained independently, and performing comparison and verification operation on the obtained part list, the identical part information in the two part lists is obtained by using the comparison instruction in the table, the identical part information indicates that the part corresponding to the part information meets the current inspection requirement, the identical part information in the two part lists is removed, the rest part information is correspondingly arranged to form two part files, the part information contained in the part files is the part information corresponding to the part which does not meet the inspection requirement, and further, the inspection of the co-lay part can be completed in the mode, the condition of inspection errors caused by human error and missed inspection or wrong inspection is avoided, and the time cost of manual inspection is reduced.
In some embodiments, the document obtaining module 11 may specifically include:
the document generation sub-module is used for scanning the schematic diagram document, extracting first co-lay part information carrying the attribute of the target part, and generating a first part document according to the first co-lay part information and the text format;
executing a preset co-lay part inspection instruction, deriving second co-lay part information in the PCB design document, and respectively storing the second part information in different worksheets; a second part document is generated based on the second part information.
In some embodiments, the co-lay part inspection apparatus may specifically include:
and the attribute adding unit is used for selecting a target part to be co-lay from the principle image file, and adding attributes to the target part to obtain a first co-lay part.
In some embodiments, the document generation sub-module may specifically include:
the first information acquisition unit is used for executing a preset co-lay part inspection instruction and deriving the part name and the corresponding center coordinate of the second co-lay part in the PCB design document.
In some embodiments, the document generation sub-module may specifically include:
a second information obtaining unit, configured to select a target worksheet, set a center coordinate of a second co-lay part in the target worksheet as a reference coordinate, query a worksheet except the target worksheet for a coordinate identical to the reference coordinate, and record a bit number corresponding to the coordinate;
and splicing the bit numbers to generate a second part document.
In some embodiments, the information verification module 12 may specifically include:
and storing the first co-lay part information and the second co-lay part information in the same target table in a separate row, and deleting the same co-lay part information in the first co-lay part information and the second co-lay part information by using a de-duplication instruction.
In some embodiments, the part inspection module 13 may specifically include:
and respectively extracting residual co-lay part information in the first target part document and the second target part document, and generating a co-lay part inspection result based on the residual co-lay part information.
Further, the embodiment of the present application further discloses an electronic device, and fig. 8 is a block diagram of an electronic device 20 according to an exemplary embodiment, where the content of the figure is not to be considered as any limitation on the scope of use of the present application.
Fig. 8 is a schematic structural diagram of an electronic device 20 according to an embodiment of the present application. The electronic device 20 may specifically include: at least one processor 21, at least one memory 22, a power supply 23, a communication interface 24, an input output interface 25, and a communication bus 26. The memory 22 is used for storing a computer program, and the computer program is loaded and executed by the processor 21 to implement relevant steps in the co-lay part inspection method disclosed in any of the foregoing embodiments. In addition, the electronic device 20 in the present embodiment may be specifically an electronic computer.
In this embodiment, the power supply 23 is configured to provide an operating voltage for each hardware device on the electronic device 20; the communication interface 24 can create a data transmission channel between the electronic device 20 and an external device, and the communication protocol to be followed is any communication protocol applicable to the technical solution of the present application, which is not specifically limited herein; the input/output interface 25 is used for acquiring external input data or outputting external output data, and the specific interface type thereof may be selected according to the specific application requirement, which is not limited herein.
Processor 21 may include one or more processing cores, such as a 4-core processor, an 8-core processor, etc. The processor 21 may be implemented in at least one hardware form of DSP (Digital Signal Processing ), FPGA (Field-Programmable Gate Array, field programmable gate array), PLA (Programmable Logic Array ). The processor 21 may also comprise a main processor, which is a processor for processing data in an awake state, also called CPU (Central Processing Unit ); a coprocessor is a low-power processor for processing data in a standby state. In some embodiments, the processor 21 may integrate a GPU (Graphics Processing Unit, image processor) for rendering and drawing of content required to be displayed by the display screen. In some embodiments, the processor 21 may also include an AI (Artificial Intelligence ) processor for processing computing operations related to machine learning.
The memory 22 may be a carrier for storing resources, such as a read-only memory, a random access memory, a magnetic disk, or an optical disk, and the resources stored thereon may include an operating system 221, a computer program 222, and the like, and the storage may be temporary storage or permanent storage.
The operating system 221 is used for managing and controlling various hardware devices on the electronic device 20 and the computer program 222, so as to implement the operation and processing of the processor 21 on the mass data 223 in the memory 22, which may be Windows Server, netware, unix, linux, etc. The computer program 222 may further include a computer program that can be used to perform other specific tasks in addition to the computer program that can be used to perform the co-lay part inspection method performed by the electronic device 20 as disclosed in any of the previous embodiments. The data 223 may include, in addition to data received by the electronic device and transmitted by the external device, data collected by the input/output interface 25 itself, and so on.
Further, the application also discloses a computer readable storage medium for storing a computer program; wherein the computer program when executed by the processor implements the co-lay part inspection method disclosed above. For specific steps of the method, reference may be made to the corresponding contents disclosed in the foregoing embodiments, and no further description is given here.
In this specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, so that the same or similar parts between the embodiments are referred to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant points refer to the description of the method section.
Those of skill would further appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both, and that the various illustrative elements and steps are described above generally in terms of functionality in order to clearly illustrate the interchangeability of hardware and software. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the solution. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application. The steps of a method or algorithm described in connection with the embodiments disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of the two. The software modules may be disposed in Random Access Memory (RAM), memory, read Only Memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art.
Finally, it is further noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The co-lay part inspection method, device, equipment and medium provided by the invention are described in detail, and specific examples are applied to illustrate the principle and the implementation mode of the invention, and the description of the examples is only used for helping to understand the method and the core idea of the invention; meanwhile, as those skilled in the art will have variations in the specific embodiments and application scope in accordance with the ideas of the present invention, the present description should not be construed as limiting the present invention in view of the above.

Claims (10)

1. The method for inspecting the co-lay part is characterized by comprising the following steps of:
respectively acquiring a schematic diagram document and a corresponding co-lay part list in a PCB design document to obtain a first part document and a second part document; the first part document is a schematic diagram co-lay part document, and the second part document is a PCB design co-lay part document;
performing comparison verification on the first part document and the second part document, and deleting co-lay part information consistent in comparison in the first part document and the second part document to obtain a first target part document and a second target part document;
and generating a co-lay part inspection result based on the first target part document and the second target part document.
2. The method for inspecting co-lay parts according to claim 1, wherein the obtaining the co-lay parts list in the schematic document and the corresponding PCB design document to obtain the first part document and the second part document respectively includes:
scanning the schematic diagram document, extracting first co-lay part information carrying target part attributes, and generating a first part document according to the first co-lay part information by a text format;
executing a preset co-lay part inspection instruction, deriving second co-lay part information in the PCB design document, and respectively storing the second part information in different worksheets; a second part document is generated based on the second part information.
3. The co-lay part inspection method of claim 2, wherein prior to the scanning the schematic document, further comprising:
and selecting a target part to be co-lay from the principle image file, and adding attributes to the target part to obtain a first co-lay part.
4. The method for inspecting co-lay parts according to claim 2, wherein the executing the preset co-lay part inspection instruction to derive the second co-lay part information in the PCB design document includes:
and executing a preset co-lay part inspection instruction, and deriving the part name and the corresponding center coordinate of the second co-lay part in the PCB design document.
5. The co-lay part inspection method according to claim 2, wherein the second part information is stored in different worksheets, respectively; generating a second part document based on the second part information, comprising:
selecting a target worksheet, setting the central coordinate of a second co-lay part in the target worksheet as a reference coordinate, inquiring the coordinate identical to the reference coordinate from the worksheets except the target worksheet, and recording a bit number corresponding to the coordinate;
and splicing the bit numbers to generate a second part document.
6. The co-lay part inspection method according to claim 1, wherein the performing a comparison check on the first part document and the second part document, deleting co-lay part information consistent with the comparison in the first part document and the second part document, comprises:
and storing the first co-lay part information and the second co-lay part information in the same target table in a separate row, and deleting the same co-lay part information in the first co-lay part information and the second co-lay part information by using a de-duplication instruction.
7. The co-lay part inspection method according to any one of claims 1 to 6, wherein the generating a co-lay part inspection result based on the first target part document and the second target part document includes:
and respectively extracting residual co-lay part information in the first target part document and the second target part document, and generating a co-lay part inspection result based on the residual co-lay part information.
8. A co-lay part inspection apparatus, comprising:
the document acquisition module is used for respectively acquiring a schematic diagram document and a corresponding co-lay part list in the PCB design document so as to obtain a first part document and a second part document; the first part document is a schematic diagram co-lay part document, and the second part document is a PCB design co-lay part document;
the information verification module is used for carrying out comparison verification on the first part document and the second part document, and deleting co-lay part information consistent in comparison in the first part document and the second part document so as to obtain a first target part document and a second target part document;
and the part inspection module is used for generating a co-lay part inspection result based on the first target part document and the second target part document.
9. An electronic device, comprising:
a memory for storing a computer program;
a processor for executing the computer program to implement the steps of the co-lay part inspection method as claimed in any one of claims 1 to 7.
10. A computer-readable storage medium storing a computer program; wherein the computer program when executed by a processor implements the steps of the co-lay part inspection method of any one of claims 1 to 7.
CN202310179730.1A 2023-02-28 2023-02-28 Method, device, equipment and medium for checking co-lay part Pending CN116108781A (en)

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Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310179730.1A CN116108781A (en) 2023-02-28 2023-02-28 Method, device, equipment and medium for checking co-lay part

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