CN116100936A - Electronic component circuit board printer - Google Patents
Electronic component circuit board printer Download PDFInfo
- Publication number
- CN116100936A CN116100936A CN202310157197.9A CN202310157197A CN116100936A CN 116100936 A CN116100936 A CN 116100936A CN 202310157197 A CN202310157197 A CN 202310157197A CN 116100936 A CN116100936 A CN 116100936A
- Authority
- CN
- China
- Prior art keywords
- cavity
- electronic component
- plate
- solder paste
- rod
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/14—Details
- B41F15/40—Inking units
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/08—Machines
- B41F15/0881—Machines for printing on polyhedral articles
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to the technical field of electronic elements, in particular to an electronic element circuit board printer which comprises a base and side plates, wherein two groups of side plates are arranged on two sides of the base, a hydraulic telescopic rod is connected between the two groups of side plates through a transmission mechanism, a connecting piece is connected below the hydraulic telescopic rod, an upper barrel part is detachably connected below the connecting piece, and a lower inserting rod is inserted below the upper barrel part; the liquid outlet channel is formed in the lower inserting rod, and two groups of first chambers are formed in the bottom of the lower inserting rod. The invention can print the circuit board in a sealed state, prevent the solder paste from being polluted by dust, ensure the purity of the solder paste, simultaneously ensure the solder paste in the first cavity to be pressurized at any time, fill up the solder paste in the first cavity when passing through the concave part, ensure the printing effect, simultaneously automatically retract unused solder paste, timely complete material recovery, automatically seal the discharge port after printing, and ensure the sealing effect of the solder paste when being stored.
Description
Technical Field
The invention relates to the technical field of electronic elements, in particular to an electronic element circuit board printer.
Background
The circuit board is a composite board for mounting electronic components, and the circuit board is required to be coated with solder paste at the mounting position by a printing machine before being welded.
Existing circuit board printers: the device consists of a transmission mechanism and a scraping plate, wherein a large amount of solder paste is coated on the surface of the scraping plate, and part of solder paste stays in the concave part when the scraping plate passes through the concave installation part;
the existing circuit board printer has the defects that:
the solder paste is directly adhered on the surface of the scraping plate and is exposed in the air for a long time, and a large amount of dust adhered in the solder paste can be brought into the mounting groove to influence the subsequent hot welding of the electronic components;
a large amount of solder paste can remain on the surface of the scraping plate after each use, and the solder paste cannot be collected in time after long-time exposure in the air, so that the subsequent use cannot be performed, and the cost of raw materials is increased;
because the depth of the concave part is different, only a thin layer of solder paste is left when the scraping plate passes through the concave part, and the printing is insufficient.
There is therefore a need for an electronic component board printer that addresses the above-described problems.
Disclosure of Invention
In order to solve the problems, the invention provides an electronic element circuit board printer which can solve the problem that the existing greenhouse provided in the background art is difficult to cover a film.
In order to achieve the above purpose, the present invention provides the following technical solutions: the electronic element circuit board printer comprises a base and side plates, wherein two groups of side plates are arranged on two sides of the base, a hydraulic telescopic rod is connected between the two groups of side plates through a transmission mechanism, a connecting piece is connected below the hydraulic telescopic rod, an upper barrel part is detachably connected below the connecting piece, and a lower inserting rod is inserted below the upper barrel part;
a liquid outlet channel is formed in the lower inserted link, two groups of first chambers are formed in the bottom of the lower inserted link, and liquid outlet holes are formed between the two groups of first chambers and the liquid outlet channel;
the lower inserted link is T-shaped as a whole, and the left and right sides of the top of the lower inserted link are attached to the inner wall of the upper cylinder;
the bending part at the top of the lower inserted link and the bottom of the upper barrel part are provided with a second cavity, the inner wall of the second cavity is provided with a second spring, and two ends of the second spring are respectively connected with the lower inserted link and the upper barrel part.
Preferably, a baffle is inserted into the first chamber, and a first spring is connected between the baffle and the inner wall of the first chamber.
Preferably, a sliding groove is formed in the top wall of the first chamber, and a sliding block mounted on the baffle is connected inside the sliding groove in a sliding mode.
Preferably, a sealing groove is formed in the side wall of the top of the lower inserting rod, and a sealing gasket is inserted into the sealing groove.
Preferably, the top of the upper cylinder part is open, and a cover plate for sealing is covered.
Preferably, the side wall of the upper cylinder part is connected with a pressure cylinder, a connecting pipe is inserted at the bottom of the pressure cylinder, the other end of the connecting pipe is inserted in the second cavity, and a sealing plate is inserted in the pressure cylinder.
Preferably, the sealing plate divides the pressure cylinder into an upper cavity and a lower cavity, nitrogen is injected into the upper cavity, a third spring is arranged in the lower cavity, and two ends of the third spring are connected to the sealing plate and the bottom wall of the pressure cylinder.
Preferably, the transmission mechanism comprises a threaded rod connected to the side plate through a bearing, the outer wall of the threaded rod is connected with a top plate through threads, the right side is provided with an output motor in a surface mounting mode, the output end of the output motor is connected to the threaded rod, and guide rods penetrating through the top plate are arranged between the two groups of side plates.
Compared with the prior art, the invention has the beneficial effects that:
this electronic component circuit board printing machine is through being provided with hydraulic telescoping rod, the connecting piece, go up the bobbin, insert the pole down, the drain passageway, go out liquid hole and first cavity down, go up bobbin and insert the pole down and go out the cream when taking place relative movement automatically, can print the circuit board under the sealed state, avoid the solder paste to be infected with the dust, guarantee the purity of solder paste, the solder paste in the first cavity receives pressure constantly simultaneously, can be filled with it when passing through the depressed part, guarantee the printing effect, simultaneously can be with the automatic material recovery of retrieving of unused solder paste, in time accomplish, and the discharge gate can self-sealing after the printing is accomplished, guarantee the sealed effect of solder paste when preserving.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic view of the present invention in perspective cross-sectional view at the top of the cartridge and the bottom of the insert;
FIG. 3 is a schematic view of a perspective cutaway exploded view of the lower insert of the present invention;
fig. 4 is an enlarged schematic view of the structure of fig. 3 a according to the present invention.
Description of the drawings: 110. a base; 120. a side plate; 130. a threaded rod; 140. a top plate; 150. an output motor; 160. a guide rod; 210. a hydraulic telescopic rod; 220. a connecting piece; 230. an upper barrel part; 231. a cover plate; 240. a lower insert rod; 241. a liquid outlet channel; 242. a first chamber; 243. a baffle; 244. a liquid outlet hole; 245. a first spring; 246. a chute; 247. a slide block; 248. sealing grooves; 249. a sealing gasket; 250. a second chamber; 260. a second spring; 270. a connecting pipe; 280. a pressure cylinder; 290. a sealing plate; 291. and a third spring.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
As shown in fig. 1-4, in the embodiment of the present invention: the utility model provides an electronic component circuit board printer, including base 110 and curb plate 120, two sets of curb plates 120 are installed in the base 110 both sides, be connected with hydraulic telescoping rod 210 through drive mechanism between two sets of curb plates 120, drive mechanism can control the transmission of hydraulic telescoping rod 210, and hydraulic telescoping rod 210 below is connected with connecting piece 220, connecting piece 220 below detachable is connected with upper cylinder 230, connecting piece 220 and upper cylinder 230 pass through bolted connection, can dismantle at any time and overhaul, and upper cylinder 230 below inserts and is equipped with lower inserted bar 240;
a liquid outlet channel 241 is formed in the lower insert rod 240, two groups of first chambers 242 are formed in the bottom of the lower insert rod 240, and a liquid outlet hole 244 is formed between the two groups of first chambers 242 and the liquid outlet channel 241; the upper barrel part 230, the liquid outlet channel 241, the liquid outlet hole 244 and the first cavity 242 are communicated with each other, solder paste can enter the first cavity 242 from the upper barrel part 230 through the liquid outlet channel 241 and the liquid outlet hole 244, and the solder paste can finish printing when passing through the mounting groove in the first cavity 242;
the lower insert rod 240 is in a T shape as a whole, and the left and right sides of the top of the lower insert rod 240 are attached to the inner wall of the upper cylinder 230, so that the tightness between the upper cylinder 230 and the lower insert rod 240 during relative movement is ensured;
the second chamber 250 is formed at the bending position of the top of the lower insert rod 240 and the bottom of the upper cylinder 230, and a second spring 260 is disposed on the inner wall of the second chamber 250, two ends of the second spring 260 are respectively connected to the lower insert rod 240 and the upper cylinder 230, the second chamber 250 generates negative pressure when the upper cylinder 230 and the lower insert rod 240 relatively move, and the second spring 260 deforms.
In a specific operation, the output end of the hydraulic telescopic rod 210 can push the upper cylinder 230 and the lower insert rod 240 to move downwards, the lower insert rod 240 stops moving after being attached to the circuit board, the upper cylinder 230 can move downwards, at this time, relative displacement occurs between the upper cylinder 230 and the lower insert rod 240, compared with the upper cylinder 230, the lower insert rod 240 moves upwards to squeeze solder paste into the first cavity 242 to be contacted with the circuit board after passing through the liquid outlet channel 241 and the liquid outlet hole 244, along with the left and right movement of the lower insert rod 240, the first cavity 242 is filled with solder paste rapidly when encountering a depression, the side wall of the lower insert rod 240 is finished to ensure that solder paste does not overflow, waste is avoided, the second cavity 250 is enlarged and negative pressure is generated, the second spring 260 is extruded to deform, after printing is finished, the output end of the hydraulic telescopic rod 210 drives the upper cylinder 230 and the lower insert rod 240 to move upwards, the second spring 260 acts on the lower insert rod 240 to enable solder paste to be attached to the circuit board when the upper cylinder 240 is attached to the inside of the first cavity 242, the negative pressure is generated inside the upper cylinder 230 and the first cavity 242 is sucked into the liquid outlet hole 244 again after the solder paste is sucked into the first cavity 230.
The baffle 243 is inserted in the first cavity 242, a first spring 245 is connected between the baffle 243 and the inner wall of the first cavity 242, the baffle 243 is extruded to the side when solder paste enters the first cavity 242, the first spring 245 is extruded to deform, when the solder paste is recovered, the baffle 243 is reset due to elastic force generated by the first spring 245, the baffle 243 can extrude the solder paste from the liquid outlet 244 to the liquid outlet channel 241 in the resetting process, the solder paste recovery work is completed in an auxiliary mode, the baffle 243 is attached to the liquid outlet 244 after resetting, sealing of the liquid outlet 244 is completed, and sealing effect of the solder paste in storage is guaranteed.
The top wall of the first chamber 242 is provided with the chute 246, the inside of the chute 246 is slidably connected with the sliding block 247 installed on the baffle 243, and the baffle 243 moves along the track of the chute 246 along with the sliding block 247 when moving, so that the stability of the track when the baffle 243 moves is ensured.
The sealing groove 248 is formed in the side wall of the top of the lower insert rod 240, the sealing gasket 249 is inserted in the sealing groove 248, and the sealing gasket 249 is installed in an interlayer mode, so that the tightness between the lower insert rod 240 and the inside of the upper barrel 230 is ensured.
The top of the upper cylinder 230 is open, and is covered with a cover plate 231 for sealing, and a worker can fill the interior of the upper cylinder 230 with solder paste by removing the cover plate 231.
The side wall of the upper cylinder part 230 is connected with a pressure cylinder 280, a connecting pipe 270 is inserted at the bottom of the pressure cylinder 280, the other end of the connecting pipe 270 is inserted in the second chamber 250, a sealing plate 290 is inserted in the pressure cylinder 280, the sealing plate 290 divides the pressure cylinder 280 into an upper cavity and a lower cavity, nitrogen is injected into the upper cavity, a third spring 291 is arranged in the lower cavity, and two ends of the third spring 291 are connected to the sealing plate 290 and the bottom wall of the pressure cylinder 280.
During specific operation, negative pressure is generated in the second chamber 250, so as to drive the sealing plate 290 to move downwards in the pressure cylinder 280, at this time, the nitrogen in the upper cavity is pulled, the third spring 291 in the lower cavity is extruded to deform, and when the relative movement force generated between the lower insert rod 240 and the upper cylinder 230 disappears, the resetting property of the nitrogen and the elastic force of the third spring 291 pull the lower insert rod 240 and the upper cylinder 230 to reset, thereby assisting the upper cavity of the upper cylinder 230 to recover solder paste.
The transmission mechanism comprises a threaded rod 130 connected to the side plates 120 through bearings, the outer wall of the threaded rod 130 is in threaded connection with a top plate 140, an output motor 150 is mounted on the surface of the right side plate 120, the output end of the output motor 150 is connected to the threaded rod 130, and a guide rod 160 penetrating through the top plate 140 is arranged between the two groups of side plates 120.
In a specific operation, when the lower insert rod 240 is attached to the circuit board and solder paste enters the first cavity 242, the output motor 150 is started, the output end of the output motor 150 drives the threaded rod 130 to rotate, and the threaded rod 130 is in threaded connection with the top plate 140, so that the top plate 140 can be driven to move left and right along the stable track of the guide rod 160.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (8)
1. The utility model provides an electronic component circuit board printer, includes base (110) and curb plate (120), two sets of curb plate (120) are installed in base (110) both sides, its characterized in that: a hydraulic telescopic rod (210) is connected between the two groups of side plates (120) through a transmission mechanism, a connecting piece (220) is connected below the hydraulic telescopic rod (210), an upper barrel part (230) is detachably connected below the connecting piece (220), and a lower inserting rod (240) is inserted below the upper barrel part (230);
a liquid outlet channel (241) is formed in the lower insert rod (240), two groups of first chambers (242) are formed in the bottom of the lower insert rod (240), and liquid outlet holes (244) are formed between the two groups of first chambers (242) and the liquid outlet channel (241);
the lower inserted link (240) is T-shaped as a whole, and the left and right sides of the top of the lower inserted link (240) are attached to the inner wall of the upper cylinder (230);
the bending part at the top of the lower inserted link (240) and the bottom of the upper cylinder (230) are provided with a second cavity (250), the inner wall of the second cavity (250) is provided with a second spring (260), and two ends of the second spring (260) are respectively connected with the lower inserted link (240) and the upper cylinder (230).
2. An electronic component board printer according to claim 1, wherein: a baffle plate (243) is inserted into the first chamber (242), and a first spring (245) is connected between the baffle plate (243) and the inner wall of the first chamber (242).
3. An electronic component board printer according to claim 2, wherein: a sliding groove (246) is formed in the top wall of the first chamber (242), and a sliding block (247) mounted on the baffle plate (243) is connected inside the sliding groove (246) in a sliding mode.
4. An electronic component board printer according to claim 2, wherein: a sealing groove (248) is formed in the side wall of the top of the lower inserting rod (240), and a sealing gasket (249) is inserted into the sealing groove (248).
5. An electronic component board printer according to claim 4, wherein: the top of the upper cylinder (230) is open, and a cover plate (231) for sealing is covered.
6. An electronic component board printer according to claim 2, wherein: the side wall of the upper cylinder part (230) is connected with a pressure cylinder (280), a connecting pipe (270) is inserted at the bottom of the pressure cylinder (280), the other end of the connecting pipe (270) is inserted in the second chamber (250), and a sealing plate (290) is inserted in the pressure cylinder (280).
7. An electronic component board printer according to claim 6, wherein: the sealing plate (290) divides the pressure cylinder (280) into an upper cavity and a lower cavity, nitrogen is injected into the upper cavity, the lower cavity is provided with a third spring (291), and two ends of the third spring (291) are connected to the sealing plate (290) and the bottom wall of the pressure cylinder (280).
8. An electronic component board printer according to claim 2, wherein: the transmission mechanism comprises a threaded rod (130) connected to the side plate (120) through a bearing, the outer wall of the threaded rod (130) is in threaded connection with a top plate (140), an output motor (150) is mounted on the surface of the side plate (120), the output end of the output motor (150) is connected to the threaded rod (130), and guide rods (160) penetrating through the top plate (140) are arranged between the two groups of side plates (120).
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CN202310157197.9A CN116100936B (en) | 2023-02-23 | 2023-02-23 | Electronic component circuit board printer |
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CN202310157197.9A CN116100936B (en) | 2023-02-23 | 2023-02-23 | Electronic component circuit board printer |
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CN116100936B CN116100936B (en) | 2023-09-01 |
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Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
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DE4139357A1 (en) * | 1991-11-29 | 1993-06-03 | Vdo Schindling | Solder applying device for restricted areas of PCB's - has pivotable lever squeezing press to provide solder in cooperation with screen printing masks |
US20020117063A1 (en) * | 2001-01-25 | 2002-08-29 | Seiichi Miyahara | Screen printer and screen printing method |
CN208175119U (en) * | 2018-03-28 | 2018-11-30 | 北京达博长城锡焊料有限公司 | A kind of automatic extrusion device for high collapsing property of heat resistanceheat resistant lead-free tin cream |
CN209775797U (en) * | 2018-12-03 | 2019-12-13 | 重庆锐翰科技有限公司 | Solder paste printing device with SPI self-checking function for FPC (Flexible printed Circuit) circuit board processing |
CN211662816U (en) * | 2019-12-20 | 2020-10-13 | 天津联展电子科技有限公司 | Clean type solder paste printing machine |
CN212446691U (en) * | 2020-05-29 | 2021-02-02 | 天津乾宇电子股份有限公司 | Scraper structure of extruding tin paste type tin paste printing machine |
CN113573490A (en) * | 2021-09-23 | 2021-10-29 | 深圳市凯泰精密设备有限公司 | Soldering paste coating and reflow soldering all-in-one machine of printed circuit board |
CN214646643U (en) * | 2021-04-14 | 2021-11-09 | 昆山卓力达精密金属部品有限公司 | Ladder steel mesh production facility |
CN215835618U (en) * | 2021-05-19 | 2022-02-15 | 华冠科技(河源)有限公司 | Solder paste printing device based on SMT paster production line |
CN216885753U (en) * | 2022-02-09 | 2022-07-05 | 大连谷隆电子有限公司 | High-precision full-automatic solder paste printing machine |
CN114713530A (en) * | 2022-04-18 | 2022-07-08 | 郭洋 | Through-hole solder paste printing device |
CN115195274A (en) * | 2021-04-08 | 2022-10-18 | 长兴迪能建材有限公司 | Silk screen printing device for glass processing |
CN115696754A (en) * | 2022-11-02 | 2023-02-03 | 苏州东岱电子科技有限公司 | Screen printing process for PCB electronic circuit board |
-
2023
- 2023-02-23 CN CN202310157197.9A patent/CN116100936B/en active Active
Patent Citations (13)
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DE4139357A1 (en) * | 1991-11-29 | 1993-06-03 | Vdo Schindling | Solder applying device for restricted areas of PCB's - has pivotable lever squeezing press to provide solder in cooperation with screen printing masks |
US20020117063A1 (en) * | 2001-01-25 | 2002-08-29 | Seiichi Miyahara | Screen printer and screen printing method |
CN208175119U (en) * | 2018-03-28 | 2018-11-30 | 北京达博长城锡焊料有限公司 | A kind of automatic extrusion device for high collapsing property of heat resistanceheat resistant lead-free tin cream |
CN209775797U (en) * | 2018-12-03 | 2019-12-13 | 重庆锐翰科技有限公司 | Solder paste printing device with SPI self-checking function for FPC (Flexible printed Circuit) circuit board processing |
CN211662816U (en) * | 2019-12-20 | 2020-10-13 | 天津联展电子科技有限公司 | Clean type solder paste printing machine |
CN212446691U (en) * | 2020-05-29 | 2021-02-02 | 天津乾宇电子股份有限公司 | Scraper structure of extruding tin paste type tin paste printing machine |
CN115195274A (en) * | 2021-04-08 | 2022-10-18 | 长兴迪能建材有限公司 | Silk screen printing device for glass processing |
CN214646643U (en) * | 2021-04-14 | 2021-11-09 | 昆山卓力达精密金属部品有限公司 | Ladder steel mesh production facility |
CN215835618U (en) * | 2021-05-19 | 2022-02-15 | 华冠科技(河源)有限公司 | Solder paste printing device based on SMT paster production line |
CN113573490A (en) * | 2021-09-23 | 2021-10-29 | 深圳市凯泰精密设备有限公司 | Soldering paste coating and reflow soldering all-in-one machine of printed circuit board |
CN216885753U (en) * | 2022-02-09 | 2022-07-05 | 大连谷隆电子有限公司 | High-precision full-automatic solder paste printing machine |
CN114713530A (en) * | 2022-04-18 | 2022-07-08 | 郭洋 | Through-hole solder paste printing device |
CN115696754A (en) * | 2022-11-02 | 2023-02-03 | 苏州东岱电子科技有限公司 | Screen printing process for PCB electronic circuit board |
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