CN116100186A - Lead-free soldering tin alloy and tin spraying process thereof - Google Patents
Lead-free soldering tin alloy and tin spraying process thereof Download PDFInfo
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- CN116100186A CN116100186A CN202211557839.6A CN202211557839A CN116100186A CN 116100186 A CN116100186 A CN 116100186A CN 202211557839 A CN202211557839 A CN 202211557839A CN 116100186 A CN116100186 A CN 116100186A
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- tin
- air knife
- lead
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- circuit board
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a lead-free soldering tin alloy, which comprises the following preparation raw materials in percentage by weight: 0.05-0.09% copper, 0.05-0.3% nickel, 0.06-0.12% germanium, 0.0005-0.001% gallium, tin being the balance. The invention adopts copper, nickel, germanium and gallium with proper weight ratio to realize good welding of tin metal, avoids participation of lead metal, improves safety in the processing process, increases wetting effect of solder on a printed circuit board by introducing LCN-407,Dynol604,CO 977 synergistic effect into soldering flux, increases spreading uniformity of solder on the surface of the printed circuit board, and improves adhesive force of the solder and the printed circuit board.
Description
Technical Field
The invention relates to a lead-free soldering tin alloy and a tin spraying process thereof, and relates to B23K, in particular to the field of soldering processes.
Background
The printed circuit board is an important part of the electronic industry, from watches, mobile phones to computers, electronic communication equipment and military weapons are not involved in the printed circuit board, along with the continuous progress of technology, the electronic equipment is smaller and smaller in size, the circuit wiring density required to be arranged is higher and higher, and the technical difficulty is higher and higher, so that the soldering process of the printed circuit board is required to be operated more and more precisely, and new requirements are put forward for the soldering flatness and the adhesion performance of the printed circuit board.
Chinese patent No. CN201811459393.7 discloses a method for improving the flatness of a tin-plated surface, which comprises mixing a tin-plated material and a copper-removing agent effectively and fully by means of three-dimensional stirring, thereby removing surface impurities of a PCB, improving the solderability of the PCB, and improving the flatness of the surface of the board, but the adhesion between the solder and the PCB is poor, and the solder is polluted by the mixture of the tin-plated material and the copper-removing agent, which affects the quality of the solder for long-time continuous operation. The Chinese patent No. CN202111306801. X discloses a tin spraying method for solving the warpage of a PCB, which is characterized in that suspension cooling is added to the PCB after tin spraying, the problem of backward warpage deformation of the PCB caused by temperature dip is reduced, but the occupied area is increased due to suspension cooling, and the production efficiency is reduced.
Disclosure of Invention
In order to improve the adhesive force between the solder alloy material and the printed circuit board and improve the flatness of the printed circuit board after tin spraying, the first aspect of the invention provides a lead-free solder alloy, which comprises the following preparation raw materials in percentage by weight: 0.05-0.09% copper, 0.05-0.3% nickel, 0.06-0.12% germanium, 0.0005-0.001% gallium, tin being the balance.
As a preferred embodiment, the preparation raw materials comprise the following components in percentage by weight: 0.07% copper, 0.07-0.25% nickel, 0.09-0.11% germanium, 0.0006-0.009% gallium, tin balance.
As a preferred embodiment, the preparation raw materials comprise the following components in percentage by weight: 0.07% copper, 0.15% nickel, 0.1% germanium, 0.005% gallium, tin balance.
In a second aspect, the invention provides a process for spraying tin using a lead-free solder alloy, comprising the steps of:
(1) Pickling, water washing and blow drying the printed circuit board;
(2) Immersing the dried printed circuit board into a soldering flux liquid tank for 1-3s;
(3) Carrying out lead-free solder alloy tin spraying on the printed circuit board treated in the step 2 in a tin spraying machine, wherein the temperature of a tin bath of the tin spraying machine is 250-270 ℃, an air filter is arranged in the tin spraying machine, air draft needs to be carried out before operation, tin spraying is carried out, and the tin spraying machine removes redundant tin through an air knife in a nozzle;
(4) And cooling the printed circuit board after tin spraying, soaking and flushing with hot water, and drying.
As a preferred embodiment, the acid washing in the step 1 is hydrochloric acid washing, and the mass fraction of the hydrochloric acid is 8-15%.
As a preferred embodiment, the soldering flux comprises, by weight, 2-3.5% of an acidic activator, 0.1-1% of a surfactant, 1-3% of a cosolvent, 0.1-0.3% of a film forming agent, and the balance of water.
As a preferred embodiment, the acidic activator is selected from one or a combination of several of succinic acid, glutaric acid, itaconic acid, sebacic acid, pimelic acid, malic acid, and citric acid.
As a preferred embodiment, the acidic activator is a combination of succinic acid, sebacic acid, itaconic acid.
As a preferred embodiment, the weight ratio of the succinic acid, the glutaric acid and the itaconic acid is 1: (1-3): (0.3-1.5).
As a preferred embodiment, the surfactant is a nonionic surfactant, preferably, the nonionic surfactant is an aliphatic nonionic surfactant.
As a preferred embodiment, the aliphatic nonionic surfactant is selected from one or a combination of several of fatty alcohol polyoxyethylene ether, alkylphenol polyoxyethylene ether, fatty acid polyoxyethylene ether, alkyl polyoxyethylene ether and polyoxyethylene alkylamide.
As a preferred embodiment, the surfactant is a combination of alkyl polyoxyethylene ether and polyhydric alcohol polyoxyethylene ether, alkylphenol polyoxyethylene ether.
As a preferred embodiment, the surfactant is a combination of LCN-407,Dynol604,CO 977.
As a preferred embodiment, the weight ratio of LCN-407,Dynol604,CO 977 is 1:1: (3-5).
As a preferred embodiment, the weight ratio of LCN-407,Dynol604,IgepalCO 977 is 1:1:4.
as a preferred embodiment, the cosolvent is selected from one or a combination of several of ethanol, propanol, butanol, acetone, toluene isobutyl ketone, ethyl acetate and butyl acetate.
As a preferred embodiment, the co-solvent is a combination of ethylene glycol, acetone and butylene glycol.
As a preferred embodiment, the weight ratio of ethylene glycol, acetone and butanediol is 1: (0.3-0.5): (0.5-1.5).
As a preferred embodiment, the weight ratio of ethylene glycol, acetone and butanediol is 1:0.4:1.
as a preferred embodiment, the film forming agent is polyvinyl alcohol JL-25E.
The applicant finds that in the experimental process, the wettability of the solder to the printed circuit board can be improved by adding the soldering flux, the adhesive force of the solder on the printed circuit board can be increased, the solder can be uniformly distributed on the printed circuit board, and the board with uniform and even thickness can be formed. Meanwhile, the soldering flux is inorganic, has good volatility, and after being soaked by the soldering flux, the soldering flux is easy to volatilize and remove, so that the pollution to tin liquid in the subsequent step is reduced. The applicant finds that the adoption of the synergy of LCN-407,Dynol604,CO 977 in the experimental process can improve the flowing wettability of the solder alloy material on the printed circuit board, reduce the surface tension of the printed circuit board and ensure that the compatibility of the printed circuit board and the solder alloy material is better. And LCN-407,Dynol604,CO 977 has lower synergistic effect foamability, and foam is not easy to adhere to the surface of the printed circuit board after the printed circuit board is soaked, so that the adhesive force between the soldering tin material and the printed circuit board is further improved. And the cosolvent is the combination of glycol, acetone and butanediol, and the cosolvent compounded by the glycol, the acetone and the butanediol can increase the solubility of the soldering flux, can be uniformly spread on the surface of the printed circuit board, and improves the uniform effect of the surface treatment of the board. And the introduction of the soldering flux can increase the volatility of the soldering flux, so that the board can be quickly volatilized after being taken out of the soldering flux groove, and the soldering flux is prevented from entering the tin groove to pollute the soldering flux.
As a preferred embodiment, the air flow in the air filter is 1.9-4m 3 /min, saidThe temperature of the front air knife and the rear air knife in the nozzle is 310-330 ℃.
As a preferred embodiment, the temperature of the front and rear air knives in the nozzle is 320 DEG C
As a preferred embodiment, the distance between the front air knife and the air knife is 0.25-0.3mm, the angle between the front air knife and the air knife is 1-3 degrees, the angle between the front air knife and the air knife is 3-5 degrees, the distance between the front air knife and the rear air knife is 12-30mm, the front knife is 3-5mm higher than the rear knife, and the pressure of the air knife is 2-6kg/cm 2 The pressure of the front air knife is 0.1-0.5kg/cm smaller than that of the rear air knife 2 。
Compared with the prior art, the invention has the following effects:
(1) According to the lead-free soldering tin alloy, the soldering tin material does not contain lead, and copper, nickel, germanium and gallium with proper weight ratio are adopted to realize good welding of tin metal, so that the participation of lead metal is avoided, and the safety of the processing process is improved.
(2) According to the tin spraying process of the lead-free solder alloy, the LCN-407,Dynol604,CO 977 synergistic effect is introduced into the soldering flux, so that the wetting effect of the solder on the printed circuit board is improved, the spreading uniformity of the solder on the surface of the printed circuit board is improved, and the adhesive force of the solder and the printed circuit board is improved.
(3) According to the tin spraying process of the lead-free soldering tin alloy, the combination of ethylene glycol, acetone and butanediol is introduced into the soldering flux, so that the volatility of the soldering flux is improved, the printed circuit board can be quickly volatilized after the soldering flux is soaked, the soldering flux is reduced to be brought into a tin groove, the tin material is polluted, and the tin soldering quality of the printed circuit board in continuous soldering tin for a long time is reduced.
Detailed Description
The present invention will be specifically described below by way of examples. It is noted herein that the following examples are given solely for the purpose of further illustration and are not to be construed as limitations on the scope of the invention, as will be apparent to those skilled in the art in light of the foregoing disclosure.
In addition, the raw materials used are commercially available unless otherwise indicated.
Example 1
The lead-free soldering tin alloy comprises the following preparation raw materials in percentage by weight: 0.07% copper, 0.15% nickel, 0.1% germanium, 0.005% gallium, tin balance.
A process for tin spraying using a lead-free solder alloy, comprising the steps of:
(1) Pickling, water washing and blow drying the printed circuit board;
(2) Immersing the dried printed circuit board into a soldering flux liquid tank for 2s;
(3) Carrying out lead-free solder alloy tin spraying on the printed circuit board treated in the step 2 in a tin spraying machine, wherein the temperature of a tin bath of the tin spraying machine is 260 ℃, an air filter is arranged in the tin spraying machine, air draft needs to be carried out before operation, tin spraying is carried out, and the tin spraying machine removes redundant tin through an air knife in a nozzle;
(4) And cooling the printed circuit board after tin spraying, soaking and flushing with hot water, and drying.
The pickling in the step 1 is hydrochloric acid pickling, and the mass fraction of hydrochloric acid is 10%.
The soldering flux comprises 2.8 weight percent of acid activator, 0.5 weight percent of surfactant, 2 weight percent of cosolvent, 0.2 weight percent of film forming agent and the balance of water.
The acid activator is a combination of succinic acid, sebacic acid and itaconic acid, and the weight ratio is 1:2:1.
the surfactant is a combination of LCN-407,Dynol604,IgepalCO 977, and the weight ratio is 1:1:4. the LCN-407 is purchased from Qingdao sea-Lyen chemical technology Co., ltd, the Dynol604 is purchased from Yingchuang (American air chemical), and the IgepalCO 977 is purchased from Soxhlet.
The cosolvent is a combination of ethylene glycol, acetone and butanediol, and the weight ratio is 1:0.4:1.
the film former is polyvinyl alcohol JL-25E, available from JVP Co., ltd.
The air flow in the air filter was 2.5m 3 Wind in front and back direction in the nozzleThe temperature of the knife was 320 ℃.
The distance between the front air knife and the air knife edge is 0.28mm, the angle between the front air knife and the air knife edge is 2 degrees, the angle between the front air knife and the air knife edge is 4 degrees, the distance between the front air knife and the rear air knife edge is 15mm, the front knife edge is 4mm higher than the rear knife edge, and the pressure of the air knife is 5kg/cm 2 The pressure of the front air knife is 0.4kg/cm smaller than that of the rear air knife 2 。
Example 2
The specific steps of the lead-free solder alloy and the tin spraying process thereof are the same as those of the embodiment 1, and the difference is that the acid activator is a combination of succinic acid, glutaric acid and itaconic acid.
Example 3
The specific steps of the lead-free solder alloy and the tin spraying process thereof are the same as those of the embodiment 1, wherein the surfactant is a combination of PEG-400 and Dynol 604.
Example 4
The specific steps of the lead-free soldering tin alloy and the tin spraying process thereof are the same as those of the embodiment 1, and the difference is that the cosolvent is a combination of ethylene glycol, propylene glycol and butanediol.
Performance testing
1. Adhesion test: the thickness of the IMC layer after soldering was tested, and then the solder layer was placed in an environment of 150℃for 538 hours, and the thickness change of the IMC layer was observed.
2. Flatness test: the solder alloys of examples 1 to 4 and the tin spraying process were used to obtain a solder layer, and the surface flatness of the solder layer was observed.
The test results are shown in Table 1.
TABLE 1
Claims (10)
1. The lead-free soldering tin alloy is characterized by comprising the following preparation raw materials in percentage by weight: 0.05-0.09% copper, 0.05-0.3% nickel, 0.06-0.12% germanium, 0.0005-0.001% gallium, tin being the balance.
2. The lead-free solder alloy of claim 1, wherein the raw materials for preparation comprise, in weight percent: 0.07% copper, 0.07-0.25% nickel, 0.09-0.11% germanium, 0.0006-0.009% gallium, tin balance.
3. A process for tin spraying using the lead-free solder alloy according to any one of claims 1-2, characterized by comprising the steps of:
(1) Pickling, water washing and blow drying the printed circuit board;
(2) Immersing the dried printed circuit board into a soldering flux liquid tank for 1-3s;
(3) Carrying out lead-free solder alloy tin spraying on the printed circuit board treated in the step 2 in a tin spraying machine, wherein the temperature of a tin bath of the tin spraying machine is 250-270 ℃, an air filter is arranged in the tin spraying machine, air draft needs to be carried out before operation, tin spraying is carried out, and the tin spraying machine removes redundant tin through an air knife in a nozzle;
(4) And cooling the printed circuit board after tin spraying, soaking and flushing with hot water, and drying.
4. A process for tin spraying using a lead-free solder alloy according to claim 3, wherein the acid washing in step 1 is hydrochloric acid washing, and the mass fraction of hydrochloric acid is 8-15%.
5. The process of claim 3, wherein the flux comprises, by weight, 2-3.5% of an acidic activator, 0.1-1% of a surfactant, 1-3% of a cosolvent, 0.1-0.3% of a film former, and the balance of water.
6. The process of claim 5, wherein the acid activator is selected from one or more of succinic acid, glutaric acid, itaconic acid, sebacic acid, pimelic acid, malic acid, and citric acid.
7. The process of claim 5, wherein the surfactant is a nonionic surfactant, preferably an aliphatic nonionic surfactant.
8. The process of claim 7, wherein the aliphatic nonionic surfactant is selected from one or more of fatty alcohol polyoxyethylene ether, alkylphenol polyoxyethylene ether, fatty acid polyoxyethylene ether, alkyl polyoxyethylene ether, and polyoxyethylene alkylamide.
9. A process for spraying tin with a lead-free solder alloy according to claim 3, wherein the air flow in the air filter is 1.9-4m 3 And/min, wherein the temperature of the front air knife and the rear air knife in the nozzle is 310-330 ℃.
10. A process for spraying tin by using lead-free solder alloy according to claim 3, wherein the distance between the front air knife and the air knife is 1-3 °, the angle between the front air knife and the air knife is 3-5 °, the distance between the front air knife and the rear air knife is 12-30mm, the front knife is 3-5mm higher than the rear knife, and the air knife pressure is 2-6kg/cm 2 The pressure of the front air knife is 0.1-0.5kg/cm smaller than that of the rear air knife 2 。
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211557839.6A CN116100186A (en) | 2022-12-06 | 2022-12-06 | Lead-free soldering tin alloy and tin spraying process thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211557839.6A CN116100186A (en) | 2022-12-06 | 2022-12-06 | Lead-free soldering tin alloy and tin spraying process thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117082757A (en) * | 2023-08-31 | 2023-11-17 | 涟水县苏杭科技有限公司 | Single ion pollution control method applied to PCB tin spraying |
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- 2022-12-06 CN CN202211557839.6A patent/CN116100186A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117082757A (en) * | 2023-08-31 | 2023-11-17 | 涟水县苏杭科技有限公司 | Single ion pollution control method applied to PCB tin spraying |
| CN117082757B (en) * | 2023-08-31 | 2024-04-12 | 涟水县苏杭科技有限公司 | Single ion pollution control method applied to PCB tin spraying |
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