CN116095451A

CN116095451A - Lens driving assembly, chip driving assembly and camera module

Info

Publication number: CN116095451A
Application number: CN202111296600.3A
Authority: CN
Inventors: 请求不公布姓名
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2021-11-03
Filing date: 2021-11-03
Publication date: 2023-05-09

Abstract

The invention discloses a lens driving assembly, a chip driving assembly and a camera shooting module, wherein the camera shooting module comprises an optical lens, a photosensitive assembly, a lens driving assembly and a chip driving assembly, the optical lens is drivably arranged on the lens driving assembly, the photosensitive assembly is drivably arranged on the chip driving assembly, and the chip driving assembly is positioned below the lens driving assembly and enables the optical lens to be kept on a photosensitive path of the photosensitive assembly. The lens driving component is arranged to drive the optical lens to translate to realize anti-shake and drive the optical lens to move along the optical axis direction to realize focusing. The chip driving component is arranged to drive the photosensitive component to translate to realize translational anti-shake and/or drive the photosensitive component to rotate to realize rotational anti-shake.

Description

Lens driving assembly, chip driving assembly and camera module

Technical Field

The present invention relates to optical imaging devices, and more particularly to a lens driving assembly, a chip driving assembly, and a camera module.

Background

With the popularity of mobile electronic devices, related technologies of camera modules applied to mobile electronic devices for helping users acquire images have been rapidly developed and advanced. Currently, in the market, consumers have increasingly higher and diversified functions of camera modules configured in mobile electronic devices (such as smartphones), for example, anti-shake functions of the camera modules are required to obtain better imaging effects.

When the mobile electronic device is used for shooting, the shooting effect is reduced due to physiological tremble with a certain frequency and shake generated by movement of a human body under normal conditions, and especially for ordinary consumers, the mobile electronic device lacks professional training and is easier to shake and has larger shake amplitude. Mobile electronic devices are therefore often equipped with anti-shake motors (i.e., drive assemblies) to drive the optical lens to move to perform anti-shake functions.

Along with the imaging quality requirement of the camera module becoming higher, the volume and the weight of the optical lens become larger, the driving force requirement on the driving component becomes higher, and the occupied volume of the anti-shake motor is correspondingly increased along with the increase of the lens. However, the current trend of the mobile electronic device to be light and thin has a great limitation on the volume of the camera module, which results in that the camera module cannot meet the configuration requirements of the electronic device. In other words, in the trend of the optical lens toward larger volume and weight, the driving force provided by the driving component is difficult to increase correspondingly. Under the premise of limited driving force, the heavier the lens is, the shorter the stroke of the driving component capable of driving the optical lens to move is, and the anti-shake capacity is affected. In addition, the heavier the optical lens, the slower the driving assembly can drive the optical lens to move, and the longer the optical lens reaches a predetermined compensation position, which also affects the anti-shake effect.

Disclosure of Invention

An object of the present invention is to provide a lens driving assembly, a chip driving assembly and a camera module, wherein the lens driving assembly can realize focusing and anti-shake of the camera module.

An object of the present invention is to provide a lens driving assembly, a chip driving assembly and a camera module, wherein the lens driving assembly can drive an optical lens of the camera module to translate, and the chip driving assembly can drive a photosensitive assembly of the camera module to translate and/or rotate, so as to improve an anti-shake effect of the camera module.

An object of the present invention is to provide a lens driving assembly, a chip driving assembly and an image capturing module, wherein the chip driving assembly can drive the photosensitive assembly to move and/or rotate while the lens driving assembly drives the optical lens to translate, so that the anti-shake effect of the image capturing module can be greatly improved.

An object of the present invention is to provide a lens driving assembly, a chip driving assembly and a camera module, wherein the lens driving assembly and the chip driving assembly can be magnetically isolated, so that magnetic interference of the lens driving assembly and the chip driving assembly is avoided to ensure reliability and stability of the camera module.

According to one aspect of the present invention, there is provided a lens driving assembly, comprising:

a lens focusing magnetism isolating unit;

a lens focusing outer frame;

a lens focusing inner frame, wherein the lens focusing inner frame is suspended at the side of the lens focusing outer frame, and the lens focusing inner frame is provided with a containing cavity;

the lens anti-shake carrier is suspended in the accommodating cavity of the lens anti-shake inner frame;

the lens focusing driving unit comprises at least one lens focusing magnet and at least one lens focusing coil which are corresponding to each other, wherein the lens focusing magnet is arranged in the lens focusing inner frame, and the lens focusing coil is arranged in the lens focusing outer frame; the lens focusing magnetism isolating unit is positioned at the bottom of the lens focusing magnet.

According to one embodiment of the invention, the lens focusing magnetism isolating unit shields at least three fourths of the area of the lens focusing magnet.

According to one embodiment of the present invention, the lens driving assembly further includes at least one lens focusing magnetic conductive unit, the lens focusing magnetic conductive unit is disposed at the lens focusing inner frame, and the lens focusing magnetic conductive unit and the lens focusing magnet correspond to each other.

According to an embodiment of the present invention, the lens driving assembly further includes a lens driving base and a lens driving housing mounted to the lens driving base to form an accommodating space between the lens driving housing and the lens driving base, wherein the lens focusing outer frame, the lens focusing inner frame and the lens focusing carrier are held in the accommodating space.

According to one embodiment of the present invention, the lens driving housing is made of non-magnetic stainless steel.

According to one embodiment of the present invention, the lens driving base further includes a base magnetism isolating element, wherein the base magnetism isolating element is disposed on the lens driving base.

According to an embodiment of the present invention, the lens driving assembly further includes a lens anti-shake driving unit, wherein the lens anti-shake driving unit includes at least two lens anti-shake magnets and at least two lens anti-shake coils, the lens anti-shake magnets are disposed on the lens anti-shake carrier, and the lens anti-shake coils are disposed on the lens focusing inner frame.

According to one embodiment of the present invention, the lens driving assembly further includes at least one lens anti-shake magnet unit and a lens anti-shake support unit, wherein the lens anti-shake magnet unit is disposed at a top of a lens anti-shake inner frame of the lens anti-shake inner frame, and the lens anti-shake magnet unit and the lens anti-shake magnet correspond to each other so as to generate a magnetic attraction force therebetween in a height direction, wherein the lens anti-shake support unit is disposed between the lens anti-shake carrier and the top of the lens focusing inner frame, so as to suspend the lens anti-shake carrier in the accommodating cavity of the lens focusing inner frame.

According to one embodiment of the present invention, the lens anti-shake supporting unit includes at least three lens anti-shake rails and at least three lens anti-shake balls, wherein each of the lens anti-shake rails includes a lower groove rail and an upper groove rail, the lower groove rail is formed on a carrier top surface of the lens anti-shake carrier, the upper groove rail is formed on an inner frame bottom surface of the lens focusing inner frame, the lower groove rail and the upper groove rail correspond to each other and extend in directions perpendicular to each other, and a bottom and a top of the lens anti-shake balls are rollably held on the lower groove rail and the upper groove rail, respectively.

According to one embodiment of the present invention, the lens driving assembly further includes at least one lens focusing magnetic attraction unit and a lens focusing support unit, wherein the lens focusing magnetic attraction unit is disposed at the lens focusing outer frame, and the lens focusing magnetic attraction unit and the lens focusing magnet correspond to each other so as to generate a magnetic attraction force in a horizontal direction therebetween, and the lens focusing support unit is disposed between the lens focusing outer frame and a side portion of the lens focusing inner frame, so as to suspend the lens focusing inner frame at a side portion of the lens focusing outer frame.

According to an embodiment of the present invention, the lens focusing support unit includes at least two lens focusing rails and at least two lens anti-shake balls, wherein each of the lens focusing rails includes an inner groove rail and an outer groove rail, the inner groove rail is formed at a side portion of the lens focusing inner frame, the outer groove rail is formed at the lens focusing outer frame, the inner groove rail and the outer groove rail correspond to each other and have the same extending direction, and the inner and outer portions of the lens focusing balls are rollably held at the inner groove rail and the outer groove rail, respectively.

According to an embodiment of the present invention, the lens anti-shake driving unit includes two lens anti-shake magnets, and an included angle formed between extension directions of the two lens anti-shake magnets is smaller than 180 °.

According to an embodiment of the present invention, the lens anti-shake driving unit includes four lens anti-shake magnets, two lens anti-shake magnets are disposed side by side on the far side of the lens anti-shake carrier, and the other two lens anti-shake magnets are disposed on two sides of the lens anti-shake carrier, respectively.

According to one embodiment of the present invention, the height position of the lens anti-shake magnet is lower than the height position of the lens focusing magnet.

According to one embodiment of the present invention, the center of the lens anti-shake magnet is higher than the center of the lens focusing magnet.

According to another aspect of the present invention, the present invention further provides an image capturing module, which includes:

a photosensitive component;

an optical lens, wherein the optical lens is held in a photosensitive path of the photosensitive assembly; and

a lens driving assembly, wherein the lens driving assembly further comprises:

a lens focusing magnetism isolating unit;

a lens focusing outer frame;

the lens anti-shake carrier is suspended in the accommodating cavity of the lens anti-shake inner frame, the lens anti-shake carrier is provided with a carrier channel, and the optical lens is arranged in the carrier channel of the lens anti-shake carrier;

According to one embodiment of the present invention, the camera module further includes a chip driving assembly, the photosensitive assembly is drivably disposed on the chip driving assembly, and the chip driving assembly is located below the lens driving assembly.

According to one embodiment of the present invention, the lens driving assembly further comprises a base magnetism isolating element, wherein the base magnetism isolating element is disposed on the lens driving base.

According to one embodiment of the present invention, the chip driving assembly further includes:

at least one chip anti-shake magnetic conduction component;

the chip anti-shake fixing part is provided with an accommodating cavity and a top opening communicated with the accommodating cavity;

A chip anti-shake movable part suspended in the accommodation cavity of the chip anti-shake fixing part; and

the chip anti-shake driving part comprises a plurality of chip anti-shake magnets and a plurality of chip anti-shake coils which are oppositely arranged, wherein the chip anti-shake magnets are respectively arranged on the chip anti-shake fixing part, the chip anti-shake coils are respectively arranged on the chip anti-shake movable part, and the chip anti-shake magnetic conduction component is covered on the anti-shake magnets.

According to one embodiment of the present invention, the chip anti-shake magnetic conductive member is disposed at the chip anti-shake fixing portion, and the chip anti-shake magnet is disposed at the chip anti-shake magnetic conductive member such that the chip anti-shake magnet is disposed at the chip anti-shake fixing portion through the chip anti-shake magnetic conductive member.

According to one embodiment of the present invention, the chip anti-shake fixing portion includes a base and an upper cover, the base and the upper cover are mounted in a snap fit manner, wherein the chip magnetic conductive member is disposed on the upper cover, and the chip anti-shake magnet is disposed on the chip anti-shake magnetic conductive member.

According to an embodiment of the present invention, the upper cover and the lens driving base are mounted; alternatively, the upper cover and the lens driving base are integrated.

Drawings

Fig. 1A is a schematic perspective view of an image capturing module according to a preferred embodiment of the present invention.

Fig. 1B shows a cross-sectional view of the camera module.

Fig. 2 shows a perspective view of a lens driving assembly of the camera module.

Fig. 3A and 3B show exploded views of the lens driving assembly of the camera module, respectively, from different perspectives.

Fig. 4 is an enlarged schematic view of a partial position of fig. 3B.

Fig. 5A shows a cross-sectional view of one position of the lens drive assembly of the camera module.

Fig. 5B is an enlarged schematic view of a partial position of fig. 5A.

Fig. 6A shows a cross-sectional view of another position of the lens drive assembly of the camera module.

Fig. 6B is an enlarged schematic view of a partial position of fig. 6A.

Fig. 7A shows a cross-sectional view of another position of the lens drive assembly of the camera module.

Fig. 7B is an enlarged schematic view of a partial position of fig. 7A.

Fig. 8 shows a perspective view of a chip driving assembly of the camera module.

Fig. 9A and 9B show exploded views of the chip driving assembly of the camera module, respectively, from different perspectives.

Fig. 10A and 10B show cross-sectional views of different positions of the chip driving assembly of the camera module, respectively.

Fig. 11 is a perspective view showing a partial structure of the chip driving assembly of the camera module.

Fig. 12 shows a top view of a partial structure of the chip driving assembly of the camera module.

Fig. 13 is a plan view showing a partial structure of a modified example of the chip driving assembly of the camera module.

Fig. 14A shows a cross-sectional view of a position of a modified example of the lens driving assembly of the image pickup module.

Fig. 14B is an enlarged schematic view of the partial position of fig. 14A.

Fig. 15A and 15B are exploded views showing different angles of view of the lens driving assembly of the camera module, respectively.

Fig. 16A and 16B are exploded views respectively showing different angles of view of another lens driving assembly of the image pickup module.

Fig. 16C is a perspective view showing a partial structure of the lens driving assembly of the image pickup module.

Fig. 17A shows a cross-sectional view of another position of the lens drive assembly of the camera module.

Fig. 17B is an enlarged schematic view of a partial position of fig. 17A.

Fig. 18A shows a cross-sectional view of another position of the lens driving assembly of the camera module.

Fig. 18B is an enlarged schematic view of a partial position of fig. 18A.

Fig. 19A shows a cross-sectional view of another position of the lens driving assembly of the camera module.

Fig. 19B is an enlarged schematic view of a partial position of fig. 19A.

Fig. 20A shows a cross-sectional view of another position of the lens drive assembly of the camera module.

Fig. 20B is an enlarged schematic view of the partial position of fig. 20A.

Fig. 21A and 21B show exploded views of different views of another drive assembly of the camera module, respectively.

Fig. 22A and 22B show cross-sectional views of different positions of the chip driving assembly of the camera module, respectively.

Fig. 23 shows a cross-sectional view of a modified example of the chip driving assembly of the camera module.

Fig. 24 shows an exploded view of another modified example of the chip driving assembly of the camera module.

Fig. 25 shows an exploded view of another modified example of the chip driving assembly of the camera module.

Fig. 26 shows an exploded view of another modified example of the chip driving assembly of the camera module.

Fig. 27A shows the current direction and the force direction when an anti-shake movable portion of the chip driving assembly of the camera module translates in the X-axis direction.

FIG. 27B is a schematic cross-sectional view of the A-A position of FIG. 27A.

Fig. 28A shows a current direction and a force direction when the anti-shake movable portion of the chip driving assembly of the camera module translates in the Y-axis direction.

FIG. 28B is a schematic cross-sectional view of the B-B position of FIG. 28A.

Fig. 29A shows a current direction and a force receiving direction when the anti-shake movable portion of the chip driving assembly of the camera module rotates in the Z-axis direction.

FIG. 29B is a schematic cross-sectional view of the B-B position of FIG. 29A.

Fig. 30 shows a cross-sectional view of a modified example of the camera module.

Detailed Description

Before any embodiments of the invention are explained in detail, it is to be understood that the invention is not limited in its application to the details of construction and the arrangement of components set forth in the following description or illustrated in the following drawings. The invention is capable of other embodiments and of being practiced or of being carried out in various ways. Also, it is to be understood that the phraseology and terminology used herein is for the purpose of description and should not be regarded as limiting. The use of "including," "comprising," or "having" and variations thereof herein is meant to encompass the items listed thereafter and equivalents thereof as well as additional items. Unless specified or limited otherwise, the terms "mounted," "connected," "supported," and "coupled" and variations thereof are used broadly and encompass both direct and indirect mountings, connections, supports, and couplings. Furthermore, "connected" and "coupled" are not restricted to physical or mechanical connections or couplings.

Also, in the present disclosure, the terms "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are merely for convenience in describing the present disclosure and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus the above terms should not be construed as limiting the present disclosure; in a second aspect, the terms "a" and "an" should be understood as "at least one" or "one or more", i.e. in one embodiment the number of one element may be one, while in another embodiment the number of the element may be plural, the term "a" should not be construed as limiting the number.

Referring to fig. 1 to 12 of the drawings, an image capturing module according to a preferred embodiment of the present invention will be disclosed and described in the following description, wherein the image capturing module includes a lens assembly 20, a photosensitive assembly 30, and a lens driving assembly 40, the lens assembly 20 includes an optical lens 21, the optical lens 21 is disposed on the lens driving assembly 40 to maintain the optical lens 21 on a photosensitive path of the photosensitive assembly 30 by the lens driving assembly 40, and the lens driving assembly 40 is disposed to drive the optical lens 21 to translate to realize anti-shake of the image capturing module and drive the optical lens 21 to move along an optical axis direction of the image capturing module to realize focusing of the image capturing module.

Preferably, referring to fig. 1 and 8, the camera module further includes a chip driving assembly 10, wherein the photosensitive assembly 30 is drivably disposed on the chip driving assembly 10, so that the photosensitive assembly 30 is driven by the chip driving assembly 10 to move to realize anti-shake of the camera module.

In other words, in this specific example of the image capturing module of the present invention, the chip driving assembly 10 is configured to drive the photosensitive assembly 30 to move, and the lens driving assembly 40 is configured to drive the optical lens 21 to move, thereby greatly improving the anti-shake effect of the image capturing module.

The lens driving assembly 40 includes a lens anti-shake carrier 410, a lens focusing inner frame 420 and a lens focusing outer frame 430, wherein the optical lens 21 is disposed on the lens anti-shake carrier 410, the lens anti-shake carrier 410 is drivably connected to the lens focusing inner frame 420, and the lens focusing inner frame 420 is drivably connected to the lens focusing outer frame 430, wherein the lens focusing outer frame 430 can be directly or indirectly disposed on the photosensitive assembly 30, so that the lens driving assembly 40 can maintain the optical lens 21 on the photosensitive path of the photosensitive assembly 30.

When the lens focusing inner frame 420 is kept stationary and the lens anti-shake carrier 410 is driven to move relative to the lens focusing inner frame 420, the lens anti-shake carrier 410 can drive the optical lens 21 to move relative to the photosensitive assembly 30 in a direction perpendicular to the optical axis of the image capturing module, so as to realize anti-shake of the image capturing module, that is, the optical lens 21 can be translated. In other words, the lens anti-shake carrier 410 can form a movable portion of a lens anti-shake portion 41 of the lens driving assembly 40, so that the lens anti-shake carrier 410 forms a lens anti-shake movable unit 411 of the lens anti-shake portion 41, and accordingly, the lens focusing inner frame 420 can form a fixed portion of the lens anti-shake portion 41 of the lens driving assembly 40, so that the lens focusing inner frame 420 forms a lens anti-shake fixed unit 412 of the lens anti-shake portion 41.

When the lens focusing outer frame 430 is kept stationary and the lens focusing inner frame 420 is driven to move relative to the lens focusing outer frame 430, the lens focusing inner frame 420 drives the optical lens 21 to move in the optical axis direction of the camera module through the lens anti-shake carrier 410 so as to realize focusing of the camera module. In other words, the lens focusing inner frame 420 can form the movable portion of a lens focusing portion 42 of the lens driving assembly 40, so that the lens focusing inner frame 420 forms a lens focusing movable unit 421 of the lens focusing portion 42, and accordingly, the lens focusing outer frame 430 can form the fixed portion of the lens focusing portion 42, so that the lens focusing outer frame 430 forms a lens focusing fixed unit 422 of the lens focusing portion 42.

That is, the lens driving assembly 40 includes a lens anti-shake portion 41 and the lens focusing portion 42. The lens anti-shake unit 41 includes the lens anti-shake movable unit 411 and the lens anti-shake fixing unit 412, the optical lens 21 is disposed on the lens anti-shake movable unit 411, and when the lens anti-shake movable unit 411 is driven to move relative to the lens anti-shake fixing unit 412 in a direction perpendicular to an optical axis of the image capturing module, the image capturing module implements anti-shake. The lens focusing part 42 includes the lens focusing movable unit 421 and the lens focusing fixed unit 422, and the image capturing module achieves focusing when the lens focusing movable unit 421 is driven to move in a direction of an optical axis of the image capturing module relative to the lens focusing fixed unit 422.

Specifically, the lens anti-shake movable unit 411 includes the lens anti-shake carrier 410, the lens anti-shake fixing unit 412 includes the lens focusing inner frame 420, the lens focusing movable unit 421 includes the lens focusing inner frame 420, and the lens focusing fixing unit 422 includes the lens focusing outer frame 430, that is, the lens focusing inner frame 420 serves as part of the lens anti-shake portion 41 and the lens focusing portion 42 at the same time, so that the lens driving assembly 40 has a compact structure, thereby facilitating reduction of the overall volume of the image capturing module.

With continued reference to fig. 3A to 7B, the lens anti-shake unit 41 further includes a lens anti-shake driving unit 413, where the lens anti-shake driving unit 413 includes at least two lens anti-shake magnets 4131 and at least two lens anti-shake coils 4132, each lens anti-shake magnet 4131 is respectively disposed on the lens anti-shake carrier 410, each lens anti-shake coil 4132 is respectively disposed on the lens focusing inner frame 420, and each lens anti-shake magnet 4131 corresponds to each lens anti-shake coil 4132, so that when each lens anti-shake coil 4132 is energized to make each lens anti-shake coil 4132 generate a magnetic field, the magnetic field of each lens anti-shake coil 4132 interacts with the magnetic field of each lens anti-shake magnet 4131 to drive the lens anti-shake carrier 410 to drive the optical lens 21 to translate along a direction perpendicular to the optical axis of the camera module, thereby realizing anti-shake of the camera module.

It should be noted that, for the lens anti-shake carrier 410, both in the process of implementing anti-shake of the camera module and in the process of implementing focusing of the camera module, the lens anti-shake carrier 410 needs to be changed in position; for the lens focusing inner frame 420, the lens focusing inner frame 420 needs to be changed in position only in the process of focusing by the camera module, and the lens focusing inner frame 420 is kept still in the process of anti-shake by the camera module. Based on this, the image capturing module of the present invention can simplify the circuit design of the image capturing module and ensure the reliability of the image capturing module in the use process by disposing each of the lens anti-shake magnets 4131 on the lens anti-shake carrier 410 and disposing each of the lens anti-shake coils 4132 on the lens focusing inner frame 420.

However, in other examples of the image pickup module of the present invention, each of the lens anti-shake magnets 4131 of the lens anti-shake driving unit 413 may be disposed at the lens focusing inner frame 420, and accordingly, each of the lens anti-shake coils 4132 may be disposed at the lens anti-shake carrier 410.

Further, with continued reference to fig. 3A-4, the lens anti-shake carrier 410 has a carrier top surface 4101, a carrier bottom surface 4102 opposite to the carrier top surface 4101, and a carrier channel 4103 extending from the carrier top surface 4101 to the carrier bottom surface 4102, wherein the lens anti-shake carrier 410 surrounds the optical lens 21 to allow the optical lens 21 to be disposed in the carrier channel 4103 of the lens anti-shake carrier 410. Preferably, an outer wall of the optical lens 21 and an inner wall of the lens anti-shake mount 410 for forming the mount channel 4103 are attached to fix the optical lens 21 to the lens anti-shake mount 410.

The lens focusing inner frame 420 comprises a lens focusing inner frame top 4201 and a lens focusing inner frame peripheral portion 4202, and the lens focusing inner frame 420 has a receiving cavity 4203, wherein the lens focusing inner frame top 4201 has an inner frame top surface 42011, an inner frame bottom surface 42012 opposite the inner frame top surface 42011, and an inner frame channel 42013 extending from the inner frame top surface 42011 to the inner frame bottom surface 42012, wherein the lens focusing inner frame peripheral portion 4202 integrally extends downward from the inner frame bottom surface 42012 of the lens focusing inner frame top 4201 to form the receiving cavity 4203 between the lens focusing inner frame top 4201 and the lens focusing inner frame peripheral portion 4202, wherein the inner frame channel 42013 of the lens focusing inner frame top 4201 and the receiving cavity 4203 are in communication. The lens anti-shake carrier 410 is suspended in the accommodating cavity 4203 of the lens focusing inner frame 420 and driven to move within the accommodating cavity 4203 of the lens focusing inner frame 420, the inner frame bottom surface 42012 of the lens focusing inner frame top 4201 corresponds to the carrier top surface 4101 of the lens anti-shake carrier 410, wherein the optical lens 21 is movably held in the inner frame channel 42013 of the lens focusing inner frame top 4201 such that the lens focusing inner frame top 4201 surrounds the optical lens 21.

It will be appreciated that the lens focusing inner frame top 4201 has a gap between an inner wall defining the inner frame channel 42013 and an outer wall of the optical lens 21 to allow the optical lens 21 to translate to achieve anti-shake of the camera module.

Each of the lens anti-shake magnets 4131 of the lens anti-shake driving unit 413 is disposed on the carrier top surface 4101 of the lens anti-shake carrier 410, and each of the lens anti-shake coils 4132 is disposed on the inner frame bottom surface 42012 of the lens focusing inner frame top 4201, respectively, so that:

on the one hand, each lens anti-shake magnet 4131 and each lens anti-shake coil 4132 can be respectively adjacent to ensure that the magnetic field generated by the lens anti-shake coils 4132 when energized and the magnetic field of the lens anti-shake magnet 4131 can interact, so as to provide enough driving force to drive the lens anti-shake carrier 410 to drive the optical lens 21 to translate in the direction perpendicular to the optical axis of the image pickup module, so as to realize anti-shake of the image pickup module;

on the other hand, each of the lens anti-shake magnets 4131 and each of the lens anti-shake coils 4132 can be held between the lens anti-shake carrier 410 and the lens focusing inner frame top 4201 so that each of the lens anti-shake magnets 4131 and each of the lens anti-shake coils 4132 are away from the photosensitive assembly 30, thereby reducing magnetic interference of magnetic fields of the lens anti-shake magnets 4131 overflowing in the direction of the photosensitive assembly 30 on circuit boards, photosensitive elements, and the like of the photosensitive assembly 30 and the chip driving assembly 10.

Preferably, the lens anti-shake carrier 410 further has at least two anti-shake magnet grooves 4104, each of the anti-shake magnet grooves 4104 extends from the carrier top surface 4101 to the carrier bottom surface 4102, wherein each of the lens anti-shake magnets 4131 is respectively embedded in each of the anti-shake magnet grooves 4104 of the lens anti-shake carrier 410, and each of the lens anti-shake magnets 4131 is respectively disposed on the lens anti-shake carrier 410. Also, by respectively inserting each of the lens anti-shake magnets 4131 into each of the anti-shake magnet grooves 4104 of the lens anti-shake carrier 410, the height position of the lens anti-shake magnets 4131 can be reduced, thereby facilitating the reduction of the height dimension of the lens driving assembly 40.

It should be noted that, by respectively embedding each of the lens anti-shake magnets 4131 into each of the anti-shake magnet grooves 4104 of the lens anti-shake carrier 410, the top surface of the lens anti-shake magnet 4131 may be lower than the carrier top surface 4101 of the lens anti-shake carrier 410, or the top surface of the lens anti-shake magnet 4131 may be flush with the carrier top surface 4101 of the lens anti-shake carrier 410. It is understood that the top surface of the lens anti-shake magnet 4131 may be higher than the carrier top surface 4101 of the lens anti-shake carrier 410 by respectively embedding each of the lens anti-shake magnets 4131 into each of the anti-shake magnet grooves 4104 of the lens anti-shake carrier 410.

Alternatively, in other examples of the image capturing module of the present invention, each of the lens anti-shake magnets 4131 may be directly attached to the carrier top surface 4101 of the lens anti-shake carrier 410, respectively.

With continued reference to fig. 1 to 12, in this specific example of the image pickup module of the present invention, the number of the lens anti-shake magnets 4131 and the lens anti-shake coils 4132 of the lens anti-shake driving unit 413 are two. The two lens anti-shake magnets 4131 are fixed at corners of both ends of the same side of the lens anti-shake carrier 410, and the two lens anti-shake magnets 4131 are axisymmetrically arranged such that the two lens anti-shake magnets 4131 provide a symmetrical magnetic field, so that the lens anti-shake driving unit 413 composed of the two lens anti-shake magnets 4131 and the two lens anti-shake coils 4132 provides a driving force in a direction perpendicular to the optical axis of the image pickup module.

In other words, the two lens anti-shake magnets 4131 and the two lens anti-shake coils 4132 of the lens anti-shake driving unit 413 can cooperate with each other to be adapted to provide driving forces along the X-axis direction and the Y-axis direction for driving the lens anti-shake carrier 410 to move relative to the lens focusing inner frame 420 in a plane defined by the X-axis and the Y-axis, thereby achieving anti-shake of the image capturing module. It will be appreciated that the optical axis of the camera module is perpendicular to the plane defined by the X-axis and the Y-axis.

It is understood that, for the lens anti-shake carrier 410, the corners of the two ends of the same side are respectively provided with one anti-shake magnet recess 4104, and the two anti-shake magnet recesses 4104 are axially symmetrically arranged, so that the two lens anti-shake magnets 4131 embedded in the two anti-shake magnet recesses 4104 of the lens anti-shake carrier 410 are axially symmetrically arranged.

Preferably, referring to fig. 3A and 3B, an included angle between the extending direction of the two lens anti-shake magnets 4131 and the X-axis of the lens anti-shake driving unit 413 is 45 °, that is, the extending directions of the two lens anti-shake magnets 4131 are perpendicular to each other, so that: on the one hand, the lens anti-shake driving unit 413 can provide a symmetrical magnetic field to smoothly drive the lens anti-shake carrier 410 to move relative to the lens focusing inner frame 420 in a plane defined by the X axis and the Y axis, so as to realize anti-shake of the image capturing module; on the other hand, the lens anti-shake driving unit 413 can provide a sufficient driving force for driving the lens anti-shake carrier 410 to move relative to the lens focusing inner frame 420 in a plane defined by the X-axis and the Y-axis, so as to improve the sensitivity of the image capturing module in anti-shake.

Accordingly, the extending direction and X-axis of the two lens anti-shake coils 4132 of the lens anti-shake driving unit 413 are 45 °, and each lens anti-shake coil 4132 corresponds to each lens anti-shake magnet 4131, respectively, to ensure that the lens anti-shake driving unit 413 can provide a sufficient driving force when each lens anti-shake coil 4132 is powered.

Alternatively, in other examples of the image capturing module of the present invention, the extending direction of the two lens anti-shake magnets 4131 of the lens anti-shake driving unit 413 and the angle of the X axis may be other angles smaller than 90 °.

With continued reference to fig. 1 to 12, the lens anti-shake unit 41 further includes a lens anti-shake circuit board 414, two lens anti-shake coils 4132 are respectively fixed to and electrically connected to the lens anti-shake circuit board 414, the lens anti-shake circuit board 414 is fixed to the inner frame bottom surface 42012 of the lens focusing inner frame top 4201, and thus the two lens anti-shake coils 4132 are disposed on the lens focusing inner frame 420 through the lens anti-shake circuit board 414. The image capturing module supplies power to each of the lens anti-shake coils 4132 through the lens anti-shake circuit board 414 to generate a magnetic field, so that the magnetic field of each of the lens anti-shake coils 4132 and the magnetic field of each of the lens anti-shake magnets 4131 interact to drive the lens anti-shake carrier 410 to move relative to the lens focusing inner frame 420 on a plane defined by an X axis and a Y axis, so as to realize anti-shake of the image capturing module.

Preferably, the lens anti-shake circuit board 414 is a flexible circuit board (FPC), so that the lens anti-shake circuit board 414 has a thin thickness dimension, thereby advantageously reducing the overall height dimension of the lens driving assembly 40.

With continued reference to fig. 1 to 12, the lens anti-shake unit 41 further includes at least two lens anti-shake position sensing elements 415, and each lens anti-shake position sensing element 415 is disposed in the middle of each lens anti-shake coil 4132 and is electrically connected to the lens anti-shake circuit board 414, so that each lens anti-shake position sensing element 415 senses the translational direction and distance of the optical lens 21 by the lens anti-shake carrier 410 in a manner of sensing the position of each lens anti-shake magnet 4131. Specifically, the lens anti-shake position sensor 415 is mounted on the lens anti-shake circuit board 414, and the lens anti-shake position sensor 415 is disposed and electrically connected to the lens anti-shake circuit board 414.

Preferably, the lens anti-shake portion 41 includes two lens anti-shake position sensing elements 415, each lens anti-shake position sensing element 415 being held between each lens anti-shake coil 4132 and surrounded by the lens anti-shake coils 4132, respectively, so that: on the one hand, the lens anti-shake portion 41 can ensure that the lens anti-shake position sensing element 415 is opposite to the lens anti-shake magnet 4131, so as to facilitate improvement of sensing accuracy; on the other hand, the configuration of the lens anti-shake portion 41 can be made more compact by disposing the lens anti-shake position sensing element 415 at the intermediate position of the lens anti-shake coil 4132, thereby optimizing the configuration of the lens driving assembly 40.

Alternatively, in other examples of the image capturing module of the present invention, the lens anti-shake position sensing element 415 may be located outside the lens anti-shake coil 4132.

It should be noted that the type of the lens anti-shake position sensor 415 is not limited in the camera module of the present invention. For example, the lens anti-shake position sensing element 415 may be, but is not limited to, a hall element.

With continued reference to fig. 1 to 12, the lens anti-shake unit 41 further includes at least one lens anti-shake magnetic attraction unit 416 and a lens anti-shake support unit 417. The lens anti-shake magnet attraction unit 416 is disposed at the lens focusing inner frame top 4201 of the lens focusing inner frame 420, and each of the lens anti-shake magnets 4131 of the lens anti-shake driving unit 413 corresponds to the lens anti-shake magnet attraction unit 416, respectively, such that the lens anti-shake magnet attraction unit 416 and the lens anti-shake magnet 4131 attract each other due to magnetic attraction force, so that the lens anti-shake carrier 410 and the lens focusing inner frame top 4201 of the lens focusing inner frame 420 have a tendency to approach each other. The lens anti-shake supporting unit 417 is disposed between the carrier top surface 4101 of the lens anti-shake carrier 410 and the inner frame bottom surface 42012 of the lens focusing inner frame top 4201 to prevent the lens anti-shake carrier 410 and the lens focusing inner frame top 4201 of the lens focusing inner frame 420 from adhering to each other. With the above structure, the lens anti-shake carrier 410 is suspended in the accommodating cavity 4203 of the lens focusing inner frame 420.

Further, the lens anti-shake supporting unit 417 includes at least three lens anti-shake rails 4171 and at least three lens anti-shake balls 4172. Each of the lens anti-shake rails 4171 includes a lower groove rail 41711 and an upper groove rail 41712, wherein the lower groove rail 41711 is formed on the carrier top surface 4101 of the lens anti-shake carrier 410, the upper groove rail 41712 is formed on the inner frame bottom surface 42012 of the lens focusing inner frame top 4201 of the lens focusing inner frame 420, the position of the lower groove rail 41711 corresponds to the position of the upper groove rail 41712, and the extending direction of the lower groove rail 41711 and the extending direction of the upper groove rail 41712 are perpendicular to each other and are in a cross shape. The bottom and top of the lens anti-shake ball 4172 are received in the lower groove rail 41711 and the upper groove rail 41712 of the lens anti-shake rail 4171, respectively, and are allowed to roll along the lower groove rail 41711 and the upper groove rail 41712, respectively, such that the lens anti-shake ball 4172 is rollably held between the lens anti-shake carrier 410 and the lens focusing inner frame top 4201 to prevent the lens anti-shake carrier 410 and the lens focusing inner frame top 4201 of the lens focusing inner frame 420 from being attached to each other, thereby suspending the lens anti-shake carrier 410 from the receiving cavity 4203 of the lens focusing inner frame 420. Also, by allowing the extending direction of the lower groove rail 41711 and the extending direction of the upper groove rail 41712 to be perpendicular to each other, interference can be avoided when the lens anti-shake carrier 410 is driven to translate in a plane defined by the X-axis and the Y-axis by the lens anti-shake driving unit 413.

Preferably, the diameters of the lens anti-shake balls 4172 of the lens anti-shake support unit 417 are the same, so that flatness of the carrier top surface 4101 of the lens anti-shake carrier 410 and the inner frame bottom surface 42012 of the lens focusing inner frame top 4201 can be ensured.

In this specific example of the image pickup module of the present invention shown in fig. 1 to 12, the lens anti-shake supporting unit 417 includes four lens anti-shake rails 4171 and four lens anti-shake balls 4172, wherein the lower groove rails 41711 of the four lens anti-shake rails 4171 are formed at four corners of the lens anti-shake carrier 410, respectively, and the upper groove rails 41712 of the four lens anti-shake rails 4171 are formed at four corners of the lens focusing inner frame top 4201, respectively, such that the four lens anti-shake balls 4172 are held between the lens anti-shake carrier 410 and the lens focusing inner frame top 4201 at the four corners of the lens anti-shake carrier 410, respectively. That is, the lens anti-shake balls 4172 may be circumferentially spaced around the optical lens 21, so that: on the one hand, the lens anti-shake driving unit 413 can smoothly drive the lens anti-shake carrier 410 to drive the optical lens 21 to move relative to the lens focusing inner frame 420 on a plane defined by the X axis and the Y axis, and on the other hand, in the process that the lens anti-shake carrier 410 drives the optical lens 21 to move, the lens anti-shake carrier 410 and the optical lens 21 can be prevented from tilting.

With continued reference to fig. 1 to 12, the lens anti-shake unit 41 further includes four lens anti-shake units 418 disposed on an outer wall of the lens anti-shake carrier 410 for limiting a translational range of the lens anti-shake carrier 410 in the accommodating cavity 4203 of the lens focusing inner frame 420.

Preferably, the outer wall of the lens anti-shake carrier 410 has four V-shaped carrier grooves 4105, and the extending direction of the two groove walls 4106 of the lens anti-shake carrier 410 for forming the carrier grooves 4105 and the included angle of the X-axis are both 45 °, wherein each group of the lens anti-shake and anti-shake units 418 respectively includes two anti-shake protrusions 4180, and each of the anti-shake protrusions 4180 of the lens anti-shake units 418 is respectively provided to each of the groove walls 4106 of the lens anti-shake carrier 410, such that the extending direction of each of the anti-shake protrusions 4180 and the included angle of the X-axis are both 45 °. Accordingly, the lens focusing inner frame peripheral portion 4202 of the lens focusing inner frame 420 includes four "V" -shaped stopper projections 42021 which extend downward integrally from the lens focusing inner frame top portion 4201, respectively, and the extending directions of the two stopper walls 42022 of the lens focusing inner frame peripheral portion 4202 for forming the stopper projections 42021 and the included angle of the X-axis are both 45 °. Each of the limit projections 42021 of the lens focus inner frame peripheral portion 4202 is respectively provided to each of the carrier grooves 4104 of the lens anti-shake carrier 410, each of the anti-shake protrusions 4180 faces the two limit walls 42022 of the lens focus inner frame peripheral portion 4202 for forming the limit projection 42021, and a gap is provided between each of the anti-shake protrusions 4180 and each of the limit walls 42022, such that: on the one hand, the lens anti-shake mount 410 is allowed to translate within the accommodation cavity 4203 of the lens focusing inner frame 420 to realize anti-shake of the camera module, and on the other hand, the anti-shake bump 4180 prevents the lens focusing inner frame peripheral portion 4202 and the lens anti-shake mount 410 from directly colliding.

With continued reference to fig. 3A and 3B, in this specific example of the image capturing module according to the present invention, four sets of the lens anti-shake impact units 418 are sequentially defined as a first anti-shake impact unit 4181, a second anti-shake impact unit 4182, a third anti-shake impact unit 4183, and a fourth anti-shake impact unit 4184 in a counterclockwise direction, wherein the first anti-shake impact unit 4181 and the second anti-shake impact unit 4182 are respectively located at opposite ends of one of the lens anti-shake magnets 4131, and the second anti-shake impact unit 4182 and the fourth anti-shake impact unit 4184 are respectively located at opposite ends of the other lens anti-shake magnet 4131. Preferably, the first and fourth

anti-shake impact units

4181 and 4184 are axisymmetrically arranged, and the second and third

anti-shake impact units

4182 and 4183 are axisymmetrically arranged.

Alternatively, in other examples of the camera module of the present invention, each of the anti-shake bump protrusions 4180 of the lens anti-shake bump unit 418 is provided to each of the limit protrusions 42021 of the lens focus inner frame peripheral portion 4202, respectively, and the anti-shake bump protrusions 4180 are held between the limit walls 42022 and the groove walls 4106.

Alternatively, in other examples of the image pickup module of the present invention, each of the anti-shake protrusions 4180 of at least one set of the lens anti-shake protrusions 418 is provided to each of the groove walls 4106 of the lens anti-shake carrier 410, respectively, each of the anti-shake protrusions 4180 of the other lens anti-shake protrusions 418 is provided to each of the limit protrusions 42021 of the lens focusing inner frame peripheral portion 4202, respectively, and the anti-shake protrusions 4180 are held between the limit walls 42022 and the groove walls 4106.

With continued reference to fig. 1 to 12, the lens focusing part 42 further includes a lens focusing driving unit 423, wherein the lens focusing driving unit 423 includes at least one lens focusing magnet 4231 and at least one lens focusing coil 4232, each lens focusing magnet 4231 is fixed to the lens focusing inner frame peripheral portion 4202 of the lens focusing inner frame 420, each lens focusing coil 4232 is fixed to the lens focusing outer frame 430, and each lens focusing magnet 4231 and each lens focusing coil 4232 correspond to each other, such that when each lens focusing coil 4232 is energized to generate a magnetic field by each lens focusing coil 4232, the magnetic field of each lens focusing coil 4232 and the magnetic field of each anti-shake focusing magnet 4231 interact to drive the lens focusing inner frame 420 to drive the lens anti-shake carrier 410 and the optical lens 21 to move along the optical axis direction of the image pickup module, thereby realizing the image pickup module.

It should be noted that, during the focusing process of the camera module, the lens focusing outer frame 430 is kept still, and the lens focusing inner frame 420 needs to be driven to move relative to the lens focusing outer frame 430. Based on this, the image capturing module of the present invention can simplify the circuit design of the image capturing module and ensure the reliability of the image capturing module in the process of being used by providing each lens focusing magnet 4231 in the lens focusing inner frame 420 and each lens focusing coil 4232 in the lens focusing outer frame 430.

However, in other examples of the image pickup module of the present invention, each of the lens focusing magnets 4231 of the lens focusing driving unit 423 may be provided to the lens focusing outer frame 430, and accordingly, each of the lens focusing coils 4232 may be provided to the lens focusing inner frame peripheral portion 4202 of the lens focusing inner frame 420.

With continued reference to fig. 3A and 3B, the lens focus inner frame peripheral portion 4202 of the lens focus inner frame 420 further includes a lens focus inner frame side portion 42023 integrally extending downwardly from the lens focus inner frame top portion 4201, each of the lens focus magnets 4231 being respectively disposed at the lens focus inner frame side portion 42023. The lens focusing outer frame 430 and the lens focusing inner frame side 42023 of the lens focusing inner frame 420 are disposed opposite to each other to allow each of the lens focusing coils 4232 disposed at the lens focusing outer frame 430 and each of the lens focusing magnets 4231 disposed at the lens focusing inner frame side 42023 to correspond to each other.

Specifically, in this specific example of the image pickup module of the present invention shown in fig. 1 to 12, the number of the lens focusing magnets 4231 and the lens focusing coils 4232 of the lens focusing driving unit 423 is two, wherein the two lens focusing magnets 4231 are respectively fixed to both end portions of the same side of the lens focusing inner frame side 42023, and accordingly, the two lens focusing coils 4232 are respectively fixed to both end portions of the lens focusing outer frame 430, such that the two lens focusing coils 4232 and the two lens focusing magnets 4231 respectively correspond.

Preferably, the lens focusing inner frame peripheral portion 4202 further has two focusing magnet grooves 42024 respectively formed at both ends of the same side of the lens focusing inner frame side portion 42023, wherein each of the lens focusing magnets 4231 is respectively fitted into each of the focusing magnet grooves 42024 of the lens focusing inner frame peripheral portion 4202, thus respectively disposing each of the lens focusing magnets 4231 at the lens focusing inner frame side portion 42023. Further, by fitting each of the lens focusing magnets 4231 into each of the focusing magnet grooves 42024 of the lens focusing inner frame peripheral portion 4202, respectively, the length-width dimension of the lens driving assembly 40 can be reduced.

It should be noted that, by embedding each lens focusing magnet 4231 into each focusing magnet groove 42024 of the lens focusing inner frame peripheral portion 4202, the lens focusing magnet 4231 may protrude from the lens focusing inner frame side portion 42023, or the lens focusing magnet 4231 may be flush with the lens focusing inner frame side portion 42023, or the lens focusing magnet 4231 may be recessed from the lens focusing inner frame side portion 42023.

Alternatively, in other examples of the image pickup module of the present invention, each of the lens focusing magnets 4231 may be directly attached to the surface of the lens focusing inner frame side 42023, respectively.

With continued reference to fig. 1 to 12, the lens focusing portion 42 further includes a lens focusing circuit board 424, and two lens focusing coils 4232 are respectively fixed to and electrically connected to the lens focusing circuit board 424, and the lens focusing circuit board 424 is fixed to the lens focusing outer frame 430, so that the two lens focusing coils 4232 are fixed to the lens focusing outer frame 430 through the lens focusing circuit board 424. The camera module generates a magnetic field by supplying power to each lens focusing coil 4232 through the lens focusing circuit board 424, so that the magnetic field of each lens focusing coil 4232 and the magnetic field of each lens focusing magnet 4231 interact to drive the lens focusing inner frame 420 to drive the lens anti-shake carrier 410 and the optical lens 21 to move along the optical axis direction of the camera module, thereby realizing focusing of the camera module.

Specifically, the lens focusing frame 430 has a frame outer side 4301, a frame inner side 4302 opposite to the frame outer side 4301, and two focusing coil through holes 4303, the two focusing coil through holes 4303 are axisymmetric, and the two focusing coil through holes 4303 extend from the frame outer side 4301 to the frame inner side 4302 at opposite ends of the lens focusing frame 430. The lens focusing circuit board 424 is attached to the outer frame side 4301 of the lens focusing outer frame 430, and each lens focusing coil 4232 is held in each of the focusing coil through holes 4303 of the lens focusing outer frame 430, respectively, so that two lens focusing coils 4232 are fixed to the lens focusing outer frame 430 through the lens focusing circuit board 424.

Preferably, the lens focusing circuit board 424 is a flexible circuit board (FPC) to facilitate reducing the length-width dimension of the lens driving assembly 40.

Further, the lens focusing circuit board 424 includes a mounting portion 4241, and the two lens focusing coils 4232 are respectively mounted on the mounting portion 4241, so that the two lens focusing coils 4232 are respectively fixed and electrically connected to the lens focusing circuit board 424, and the mounting portion 4241 is mounted on the outer frame side 4301 of the lens focusing outer frame 430.

The lens focusing circuit board 424 further includes at least one connection portion 4242 integrally extended from the mounting portion 4241 and electrically connected to the lens anti-shake circuit board 414. For example, in this specific example of the camera module shown in fig. 1 to 12, the number of the connection portions 4242 of the lens focusing circuit board 424 is one, which is substantially "U" -shaped, wherein the connection portions 4242 are arranged at the inner frame bottom surface 42012 of the lens focusing inner frame 420 in such a manner as to surround the accommodation cavity 4203 of the lens focusing inner frame 420, and the free ends of the connection portions 4242 are connected to the inner frame bottom surface 42012 of the lens focusing inner frame 420, so that the length of the connection portions 4242 can be increased, and accordingly, the deformation amplitude of the connection portions 4242 can be increased.

In other words, when the lens focusing driving unit 423 drives the lens focusing inner frame 420 to move along the optical axis of the image capturing module relative to the lens focusing outer frame 430, the lens focusing inner frame 420 can drive the connecting portion 4242 of the lens focusing circuit board 424 to deform, and by setting the connecting portion 4242 to be in a "U" shape to increase the length of the connecting portion 4242, on one hand, the influence of the lens focusing circuit board 424 on the movement range of the lens focusing inner frame 420 can be reduced, and on the other hand, the influence of the circuit design and reliability of the lens focusing circuit board 424 can be reduced.

It should be noted that the electrical connection manner of the lens anti-shake circuit board 414 and the lens focusing circuit board 424 is not limited in the camera module of the present invention. For example, in an alternative example, after the lens anti-shake circuit board 414 is attached to the inner frame bottom surface 42012 of the lens focusing inner frame 420 and the free ends of the connection portions 4242 of the lens focusing circuit board 424 are attached to the inner frame bottom surface 42012 of the lens focusing inner frame 420, the free ends of the connection portions 4242 of the lens anti-shake circuit board 414 and the lens focusing circuit board 424 are connected by connecting wires to electrically connect the lens anti-shake circuit board 414 and the lens focusing circuit board 424. In another alternative example, the lens focusing inner frame 420 is embedded with a conductive body (e.g., a lead wire or the lens anti-shake magnet attraction unit 416) or the surface of the lens focusing inner frame 420 is provided with a conductive body, wherein the conductive body and the lens anti-shake circuit board 414 are conducted when the lens anti-shake circuit board 414 is attached to the inner frame bottom surface 42012 of the lens focusing inner frame 420, and the conductive body and the free end of the connection portion 4242 are conducted when the free end of the connection portion 4242 of the lens focusing circuit board 424 is attached to the inner frame bottom surface 42012 of the lens focusing inner frame 420, thus electrically connecting the lens anti-shake circuit board 414 and the lens focusing circuit board 424.

In the image capturing module of the present invention, the lens focusing magnet 4231 and the lens focusing coil 4232 of the lens focusing driving unit 423 are disposed opposite to each other on the outer side of the lens focusing inner frame side 42023, the lens anti-shake magnet 4131 and the lens anti-shake coil 4132 of the lens anti-shake driving unit 413 are disposed opposite to the inner frame bottom surface 42012 of the lens focusing inner frame top 4201, and the lens anti-shake magnet 4131 of the lens anti-shake driving unit 413 is disposed on the lens anti-shake carrier 410. In an alternative example, the center of the lens anti-shake magnet 4131 is higher than the center of the lens focusing magnet 4231, so as to increase the distance between the lens anti-shake magnet 4131 and the photosensitive assembly 30 located below the lens driving assembly 40, and reduce the magnetic interference of the lens anti-shake magnet 4131 on the circuit board, the photosensitive element, etc. of the photosensitive assembly 30 or on the chip driving assembly 10. In addition, the center of the lens anti-shake magnet 4131 is higher than the center of the lens focusing magnet 4231, so that the distance between the lens anti-shake coil 4132 and the lens anti-shake magnet 4131 is prevented from being too large, and the magnetic field force provided by the lens anti-shake magnet 4131 to the lens anti-shake coil 4132 is increased, so that the anti-shake effect of the lens anti-shake portion 21 is reduced. In another alternative example, the height position of the lens anti-shake magnet 4131 is lower than the height setting of the lens focusing magnet 4232, reducing the height dimension of the lens anti-shake carrier 410, and reducing the height position of the lens focusing inner frame 420, thereby reducing the height of the lens driving assembly 40.

With continued reference to fig. 1 to 12, the lens focusing part 42 further includes a lens focusing sensing unit 425, wherein the lens focusing sensing unit 425 includes a lens focusing sensing magnet 4251 and a lens focusing position sensing element 4252, the lens focusing sensing magnet 4251 is fixed to the lens focusing inner frame side 42023 of the lens focusing inner frame 420, the lens focusing position sensing element 4252 is fixed to and electrically connected to the lens focusing circuit board 424, and the lens focusing position sensing element 4252 corresponds to the lens focusing sensing magnet 4251. The lens focus position sensing element 4252 is adapted to obtain the position of the lens focus inner frame 420 by sensing the position change of the lens focus sensing magnet 4251.

It should be noted that the type of the lens focusing position sensing element 4252 is not limited in the camera module of the present invention. For example, in one alternative example, the lens focus position sensing element 4252 may be a hall element. In another alternative example, the lens focus position sensing element 4252 may be a focus driving chip adapted to control the current of the lens focus coil 4232 while acquiring a change in the position of the lens focus sensing magnet 4251.

Specifically, the lens focusing inner frame peripheral portion 4202 of the lens focusing inner frame 420 further has a sensing magnet Dan Aocao 42025 formed in the middle of the lens focusing inner frame side portion 42023, and between the two focusing magnet grooves 42024, the lens focusing sensing magnet 4251 is embedded in the sensing magnet Dan Aocao 42025 of the lens focusing inner frame 420. The lens focusing housing 430 has a sensing element through hole 4304 extending from the housing outer side 4301 to the housing inner side 4302 in the middle of the lens focusing housing 430, the lens focusing position sensing element 4252 is attached to the lens focusing circuit board 424, and the lens focusing position sensing element 4252 is held in the sensing element through hole 4304 of the lens focusing housing 430.

With continued reference to fig. 1 to 12, the lens focusing part 42 further includes at least one lens focusing magnet 426 and a lens focusing support 427. The lens focusing magnet unit 426 is fixed to the mounting portion 4241 of the lens focusing circuit board 424, and each of the lens focusing magnets 4231 of the lens focusing drive unit 423 corresponds to the lens focusing magnet unit 426, respectively, such that the lens focusing magnet unit 426 and the lens focusing magnet 4231 are attracted to each other due to magnetic attraction force, so that the lens focusing inner frame peripheral portion 42023 of the lens focusing inner frame 420 and the lens focusing outer frame 430 have a tendency to approach each other. The lens focus support unit 427 is disposed between the lens focus inner frame peripheral portion 42023 and the lens focus outer frame 430 to prevent the lens focus inner frame side portion 42023 of the lens focus inner frame 420 and the lens focus outer frame 430 from adhering to each other. With the above-described structure, the lens focusing inner frame 420 is suspended from the side of the lens focusing outer frame 430.

Preferably, the lens focusing magnet unit 426 is fixed to a side of the mounting portion 4241 of the lens focusing circuit board 424 with respect to the lens focusing coil 4232 such that the lens focusing coil 4232 is located between the lens focusing magnet 4231 and the lens focusing magnet unit 426.

Alternatively, in other examples of the camera module of the present invention, the lens focusing magnetically attractive unit 426 is fixed to the outer frame side 4301 of the lens focusing outer frame 430.

Further, the lens focus support unit 427 includes at least two lens focus rails 4271 and at least three lens focus balls 4272. Each lens focusing rail 4271 comprises an inner groove rail 42711 and an outer groove rail 42712, the inner groove rail 42711 is formed on the lens focusing inner frame side 42023 and is located on the outer side of the lens focusing magnet 4231, the outer groove rail 42712 is formed on the outer frame inner side 4302 of the lens focusing outer frame 430 and is located on the outer side of the lens focusing coil 4232, and the inner groove rail 42711 and the outer groove rail 42712 respectively extend along the height direction of the camera module to form an "i" shape, that is, the inner groove rail 42711 and the outer groove rail 42712 respectively extend along the Z-axis direction. The inside and outside of the lens focus ball 4272 are respectively received in the inner groove rail 42711 and the outer groove rail 42712 of the lens focus rail 4271, such that the lens focus ball 4272 is rollably held between the lens focus inner frame side 42023 and the lens focus outer frame 430 to prevent the lens focus inner frame side 42023 and the lens focus outer frame 430 of the lens focus inner frame 420 from being attached to each other, thereby suspending the lens focus inner frame 420 from the side of the lens focus outer frame 430. And, the lens focusing inner frame 420 is allowed to move relative to the lens focusing outer frame 430 along the height direction of the camera module in a manner that allows the inner groove rail 412711 and the outer groove rail 42712 to extend along the height direction of the camera module, respectively.

Preferably, in this specific example of the image capturing module shown in fig. 1 to 12, the lens focusing support unit 427 includes two lens focusing rails 4271 and four lens focusing balls 4272, where the two lens focusing rails 4271 are arranged in an axisymmetric manner, and each lens focusing rail 4271 accommodates two lens focusing balls 4272 therein, so that it is advantageous to ensure that the lens focusing drive unit 423 smoothly drives the lens focusing inner frame 420 to move relative to the lens focusing outer frame 430 along the height direction of the image capturing module.

Preferably, the lens focus balls 4272 of the lens focus support unit 427 have the same diameter, so that flatness of the lens focus inner frame side 42023 of the lens focus inner frame 420 and the outer frame inner side 4302 of the lens focus outer frame 430 can be ensured.

With continued reference to fig. 3A to 4, the lens focusing rail 4271 includes at least one spacer 42713, and the spacer 42713 is disposed at a middle portion of the inner groove rail 42711 for separating the two lens focusing balls 4272, thereby reducing interference between the two lens focusing balls 4272 disposed at the same lens focusing rail 4271 to ensure reliability and stability of the lens driving assembly 40.

Alternatively, in other examples of the camera module of the present invention, the spacer 42713 can be provided at the middle of the outer groove rail 42712 for spacing the two lens focus balls 4272 apart. Alternatively, one of the spacers 42713 is provided at the middle of the inner groove rail 42711 and the middle of the outer groove rail 42712 of the lens focus rail 4271, respectively, for separating the two lens focus balls 4272.

Alternatively, in other examples of the camera module of the present invention, the lens focus ball 4272 may be bonded or welded to the inner groove rail 42711 of the lens focus rail 4271, or the lens focus ball 4272 may be bonded or welded to the outer groove rail 42712 of the lens focus rail 4271.

In addition, in some examples of the image capturing module of the present invention, the lens focus ball 4272 of the lens focus support unit 427 may have a size smaller than or equal to the lens shake ball 4172 of the lens shake support unit 417, it being understood that the lens focus ball 4272 may be reduced in size to reduce the lens focus rail 4271, and thus the length-width (i.e., lateral) of the lens driving assembly 40. For example, in one specific example of the image pickup module of the present invention, the lens focus ball 4272 of the lens focus support unit 427 has a diameter of 0.7mm, and the lens anti-shake ball 4172 of the lens anti-shake support unit 417 has a diameter of 0.8mm.

In still other examples of the image pickup module of the present invention, the lens focus ball 4272 of the lens focus support unit 427 may have a size larger than the lens anti-shake ball 4172 of the lens anti-shake support unit 417, which is advantageous in reducing the height dimension (i.e., longitudinal dimension) of the lens driving assembly 40 by reducing the lens anti-shake ball 4172.

In addition, the height position of the lens anti-shake balls 4172 of the lens anti-shake supporting unit 417 is interposed between the two lens focusing balls 4272 of the lens focusing supporting unit 427 located on the same lens focusing rail 4271, in such a way that the height position of the lens anti-shake carrier 410 can be lowered, thereby facilitating the reduction of the height dimension of the lens driving assembly 40.

With continued reference to fig. 1 to 12, the lens focusing part 42 further includes at least one lens focusing anti-collision unit 428 disposed on the inner frame top surface 42011 of the lens focusing inner frame 420 for limiting the movement range of the lens focusing inner frame 420 and protecting the lens focusing inner frame 420. Preferably, the number of the lens focusing anti-collision units 428 is more than two. For example, in one specific example of the camera module of the present invention, the number of the lens focusing anti-collision units 428 is two, which protrude from the inner frame top surface 42011 of the lens focusing inner frame 420 respectively and are located on the same side.

With continued reference to fig. 1 to 12, the lens focusing fixing unit 422 further includes a lens driving base 440 and a lens driving housing 450, the lens driving base 440 has a base channel 441, the lens driving housing 450 has a housing channel 451, wherein the lens driving housing 450 is mounted on the lens driving base 440 to form a receiving space 460 between the lens driving housing 450 and the lens driving base 440, and the base channel 441 of the lens driving base 440 and the housing channel 451 of the lens driving housing 450 correspond to each other and are respectively communicated with the receiving space 460. The lens focusing frame 430 is fixed to the lens driving base 440 by bonding or integral injection molding and is located in the accommodating space 460, wherein two openings of the carrier channel 4103 of the lens anti-shake carrier 410 correspond to the base channel 441 of the lens driving base 440 and the housing channel 451 of the lens driving housing 450, respectively, such that the light emitting side and the light entering side of the optical lens 21 can correspond to the base channel 441 of the lens driving base 440 and the housing channel 451 of the lens driving housing 450, respectively.

Preferably, the lens driving housing 450 is made of stainless steel that is non-magnetic, so that the lens driving housing 450 has high strength and a thin size to achieve a good protection effect. And by selecting a non-magnetic stainless steel material to make the lens driving housing 450, on one hand, no mutual magnetic attraction is generated between the lens driving housing 450 and the lens anti-shake magnet 4131, no mutual magnetic attraction is generated between the lens driving housing 450 and the lens focusing magnet 4231, and on the other hand, the lens driving housing 450 can provide a metal shielding effect for the lens anti-shake magnet 4131 and the lens focusing magnet 4231.

Preferably, one side of the lens driving housing 450 has a housing notch 452, and the lens focusing magnet 426 may be accommodated in the housing notch 452 of the lens driving housing 450, thereby advantageously reducing the length-width dimension (i.e., the lateral dimension) of the lens driving assembly 40.

With continued reference to fig. 7A and 7B, the lens focusing portion 42 further includes at least one lens focusing magnetic isolation unit 429, where the lens focusing magnetic isolation unit 429 is located at the bottom of the lens focusing magnet 4231 to block at least a portion of the bottom of the lens focusing magnet 4231, so that the lens focusing magnetic isolation unit 429 can isolate the magnetic field of the lens focusing magnet 4231, thereby reducing the magnetic interference of the lens focusing magnet 4231 on the circuit board, photosensitive element, and other elements of the photosensitive assembly 30 located below the lens driving assembly 40, and avoiding the lens focusing magnet 4231 from being attracted by the magnetic element located below the lens driving assembly 40, so as to reduce the effect of lens focusing.

Preferably, the lens focusing magnetism isolating unit 429 covers at least three fourths of the area of the lens focusing magnet 4231 to improve the magnetism isolating effect of the lens focusing magnetism isolating unit 429.

It should be noted that the number of the lens focusing magnetic isolation units 429 is not limited in the image capturing module of the present invention, and only needs to cover the bottom of the lens focusing magnet 4231. For example, in some examples, the number of lens focus magnet spacers 429 may be less than the number of lens focus magnets 4231, such that at least one lens focus magnet spacer 429 is disposed at the bottom of at least two lens focus magnets 4231. Specifically, in the image capturing module having two lens focusing magnets 4231, the number of the lens focusing magnetism isolating units 429 may be one, so that the two lens focusing magnets 4231 respectively correspond to different positions of the lens focusing magnetism isolating units 429. In other examples, the number of lens focusing magnetism blocking units 429 is identical to the number of lens focusing magnetite 4231, so that the bottom of each lens focusing magnetite 4231 is provided with one lens focusing magnetism blocking unit 429 respectively.

Preferably, a gap is provided between the lens focusing magnetism isolating unit 429 and the lens focusing magnet 4231 to reduce the magnetic force leaked from the lens focusing magnet 4231, thereby enhancing the magnetism isolating effect.

Preferably, the lens focusing magnetic shielding unit 429 is disposed at the lens focusing inner frame 420, so that the lens focusing magnetic shielding unit 429 is held at the bottom of the lens focusing magnet 4231 by the lens focusing inner frame 420.

It should be noted that the manner in which the lens focusing magnetic isolation unit 429 is disposed at the lens focusing inner frame 420 is not limited in the image capturing module of the present invention. For example, in some examples, the lens focus magnet isolation unit 429 is provided to the lens focus inner frame 420 by bonding. In other examples, the lens focus magnetic isolation unit 429 is disposed to the lens focus inner frame 420 by insert molding.

With continued reference to fig. 3A and 3B, the lens focusing portion 42 further includes at least one lens focusing magnetically conductive unit 4210, the lens focusing magnetically conductive unit 4210 is disposed on the lens focusing inner frame 420, and the lens focusing magnetically conductive unit 4210 and the lens focusing magnet 4231 correspond to each other, so that the lens focusing magnetically conductive unit 4210 enhances the magnetic field that the lens focusing magnet 4231 can act on the lens focusing coil 4232.

It should be noted that the manner in which the lens focusing magnetic conductive unit 4210 is disposed at the lens focusing inner frame 420 is not limited in the image capturing module of the present invention. For example, in some examples, the lens focusing magnetically permeable unit 4210 is disposed on the lens focusing inner frame 420 by bonding. In other examples, the lens focusing magnetically permeable unit 4210 is disposed on the lens focusing inner frame 420 by insert molding.

Preferably, the lens focusing magnetic conductive unit 4210 connects the lens anti-shake magnetic attraction unit 416 and the lens focusing magnetic isolation unit 429. More preferably, the lens anti-shake magnetic attraction unit 416, the lens focusing magnetic conduction unit 4210 and the lens focusing magnetic isolation unit 429 are integrally formed by magnetic conduction materials.

Alternatively, the lens anti-shake magnetic attraction unit 416, the lens focusing magnetic conduction unit 4210 and the lens focusing magnetic isolation unit 429 are independent from each other, and the lens anti-shake magnetic attraction unit 416, the lens focusing magnetic conduction unit 4210 and the lens focusing magnetic isolation unit 429 may be embedded with the lens focusing inner frame 420 through an insert molding process, so that the lens anti-shake magnetic attraction unit 416, the lens focusing magnetic conduction unit 4210 and the lens focusing magnetic isolation unit 429 are fixed to the lens focusing inner frame 420.

Alternatively, the lens focusing magnetic shielding unit 429 and the lens focusing magnetic conducting unit 4210 are integrally formed by magnetic conducting materials, the lens anti-shake magnetic attraction unit 416 is independent of the lens focusing magnetic shielding unit 429 and the lens focusing magnetic conducting unit 4210, and the lens anti-shake magnetic attraction unit 416, the lens focusing magnetic conducting unit 4210 and the lens focusing magnetic shielding unit 429 can be embedded with the lens focusing inner frame 420 through an insert injection molding process, so that the lens anti-shake magnetic attraction unit 416, the lens focusing magnetic conducting unit 4210 and the lens focusing magnetic shielding unit 429 are fixed on the lens focusing inner frame 420.

It will be appreciated that in this specific example of the image capturing module shown in fig. 1 to 12, the lens anti-shake magnets 4131 of the lens anti-shake driving unit 413 and the lens focusing magnets 4231 of the lens focusing driving unit 423 are respectively located on opposite sides of the lens driving assembly 40, and the magnetic field direction of the lens focusing magnets 4231 and the magnetic field direction of the lens anti-shake magnets 4131 are perpendicular to each other, so that the internal structure of the lens driving assembly 40 is reasonably arranged to facilitate reducing the size of the lens driving assembly 40 and reducing the magnetic field interference between the lens focusing magnets 4231 and the lens anti-shake magnets 4131. In other words, the lens anti-shake magnets 4131 of the lens anti-shake driving unit 413 are located on one side of the optical lens 21, and the lens focusing magnets 4231 of the lens focusing driving unit 423 are located on the opposite side of the optical lens 21.

Alternatively, in other examples of the image pickup module of the present invention, the lens anti-shake magnets 4131 of the lens anti-shake driving unit 413 and the lens focusing magnets 4231 of the lens focusing driving unit 423 are adjacent. In other words, the lens anti-shake magnets 4131 of the lens anti-shake driving unit 413 and the lens focusing magnets 4231 of the lens focusing driving unit 423 are located on the same side of the optical lens 21.

Referring to fig. 8 to 12, the chip driving assembly 10 includes a chip anti-shake fixing portion 11, a chip anti-shake movable portion 12, and a chip anti-shake driving portion 13. The chip anti-shake fixing portion 11 has a housing cavity 1101 and a top opening 1102 connected to the housing cavity 1101, wherein the photosensitive assembly 30 is disposed on the chip anti-shake movable portion 12, the chip anti-shake movable portion 12 is suspended in the housing cavity 1101 of the chip anti-shake fixing portion 11, and the top opening 1102 of the chip anti-shake fixing portion 11 corresponds to the photosensitive assembly 30, and the chip anti-shake driving portion 13 is configured to drive the chip anti-shake movable portion 12 to perform translational and/or rotational movement with respect to the chip anti-shake fixing portion 11, so as to implement translational anti-shake and/or rotational anti-shake of the camera module. Further, the chip anti-shake fixing portion 11 includes a base 111 and an upper cover 112, the top opening 1102 is formed in the upper cover 112, the base 111 and the upper cover 112 are snappingly mounted to form the receiving cavity 1101 between the base 111 and the upper cover 112, and the receiving cavity 1101 thus formed between the base 111 and the upper cover 112 communicates with the top opening 1102 formed in the upper cover 112.

The chip anti-shake movable portion 12 and the chip anti-shake driving portion 13 are respectively accommodated in the accommodating cavity 1101 of the chip anti-shake fixing portion 11, so that the chip anti-shake fixing portion 11 forms the appearance of the chip driving assembly 10, in such a way that, on one hand, the chip anti-shake fixing portion 11 can prevent the chip anti-shake movable portion 12 and the chip anti-shake driving portion 13 from being collided to play a role of protecting the chip anti-shake movable portion 12 and the chip anti-shake driving portion 13, and on the other hand, the base 111 and the upper cover 112 of the chip anti-shake fixing portion 11 cooperate with each other to form the closed accommodating cavity 1101, so as to prevent pollutants such as dust from entering the accommodating cavity 1101 of the chip anti-shake fixing portion 11 to pollute the photosensitive element 32 and reduce stray light.

Preferably, the materials of the base 111 and the upper cover 112 of the chip anti-shake fixing part 11 may be metal materials to secure the strength of the chip driving assembly 10. For example, the materials of the base 111 and the upper cover 112 of the chip anti-shake fixing portion 11 may be stainless steel nonmagnetic materials.

It is understood that the base 111 and the upper cover 112 of the chip anti-shake fixing portion 11 remain stationary when the camera module performs an anti-shake function, so that the chip anti-shake fixing portion 11 forms a stator.

With continued reference to fig. 8 to 12, the photosensitive assembly 30 includes a circuit board 31 and a photosensitive element 32 connected to the circuit board 31, wherein the circuit board 31 is disposed on the chip anti-shake movable portion 12 to dispose the photosensitive assembly 30 on the chip anti-shake movable portion 12.

The photosensitive assembly 30 further includes a series of electronic components 33, which may be, but are not limited to, resistors, capacitors, processors, etc., wherein these electronic components 33 are mounted to the circuit board 31.

In addition, the photosensitive assembly 30 may also include a filter, such as an infrared cut filter, that is held in the photosensitive path of the photosensitive element 32.

Referring to fig. 8 to 12, the circuit board 31 has two extension arms 311, and the two extension arms 311 extend to the outside of the chip anti-shake fixing portion 11 through the connection positions of the base 111 and the upper cover 112 on opposite sides of the circuit board 31 and further extend upwards, so that stability and resistance reduction can be ensured when the chip anti-shake movable portion 12 is driven by the chip anti-shake driving portion 13 to perform translational and/or rotational movement in the receiving cavity 1101 of the chip anti-shake fixing portion 11. Alternatively, two of the extension arms 311 can extend to the outside of the chip anti-shake fixing portion 11 via the connection position of the base 111 and the upper cover 112 at the adjacent both sides of the circuit board 31 and further extend upward.

With continued reference to fig. 8 to 12, the chip anti-shake movable portion 12 includes a chip anti-shake movable carrier 121 and a set of chip anti-shake balls 122, wherein a set of the chip anti-shake balls 122 is rollably disposed between the chip anti-shake movable carrier 121 and the upper cover 112, so that the chip anti-shake movable portion 12 and the chip anti-shake fixing portion 11 are in point friction contact, thereby ensuring that the chip anti-shake driving portion 13 smoothly drives the chip anti-shake movable portion 12 to perform translational and/or rotational movement with respect to the chip anti-shake fixing portion 11.

Specifically, the chip anti-shake movable carrier 121 has a carrier front surface 1211, a carrier back surface 1212 opposite the carrier front surface 1211, and a carrier opening 1213 extending from the carrier front surface 1211 to the carrier back surface 1212. The circuit board 31 of the photosensitive assembly 30 is disposed on the carrier back surface 1212 of the chip anti-shake movable carrier 121, and the photosensitive element 32 of the photosensitive assembly 30 corresponds to the carrier opening 1213 of the chip anti-shake movable carrier 121, so that incident light is allowed to reach the photosensitive element 32 through the carrier opening 1213 of the chip anti-shake movable carrier 121.

The circuit board 31 of the photosensitive assembly 30 and the base 111 of the chip anti-shake fixing portion 11 have a gap therebetween, and a set of chip anti-shake balls 122 are rollably disposed between the carrier front surface 1211 of the chip anti-shake movable carrier 121 and the inner wall of the upper cover 112, so that the chip anti-shake movable portion 12 and the chip anti-shake fixing portion 11 are in point friction contact, and thus the chip anti-shake driving portion 13 smoothly drives the chip anti-shake movable portion 12 to perform translational and/or rotational movement with respect to the chip anti-shake fixing portion 11.

Alternatively, in some specific examples of the camera module of the present invention, the photosensitive member 30 can be inserted into the carrier opening 1213 of the chip anti-shake movable carrier 121 to facilitate reducing the height dimension of the camera module. In other words, the chip anti-shake movable carrier 121 is disposed around the photosensitive assembly 30. At this time, on the one hand, a gap is formed between the carrier back 1212 of the chip anti-shake movable carrier 121 and the base 111 of the chip anti-shake fixing portion 11, and on the other hand, a set of chip anti-shake balls 122 capable of rolling is disposed between the carrier front 1211 of the chip anti-shake movable carrier 121 and the inner wall of the upper cover 112 of the chip anti-shake fixing portion 11, so as to suspend the chip anti-shake movable portion 12 in the accommodating cavity 1101 of the chip anti-shake fixing portion 11, so as to ensure that the chip anti-shake driving portion 13 can smoothly drive the chip anti-shake movable portion 12 to perform translational and/or rotational movement with respect to the chip anti-shake fixing portion 11.

Alternatively, in some specific examples of the camera module of the present invention, the circuit board 31 of the photosensitive assembly 30 is mounted to the carrier front surface 1211 of the chip anti-shake movable carrier 121. At this time, on the one hand, a gap is provided between the carrier back surface 1212 of the chip anti-shake movable carrier 121 and the base 111 of the chip anti-shake fixing portion 11, and on the other hand, a set of chip anti-shake balls 122 capable of rolling is provided between the carrier front surface 1211 of the chip anti-shake movable carrier 121 and the inner wall of the upper cover 112 of the chip anti-shake fixing portion 11, and the set of chip anti-shake balls 122 ensure a gap between the photosensitive assembly 30 and the upper cover 112, so as to suspend the chip anti-shake movable portion 12 in the housing cavity 1101 of the chip anti-shake fixing portion 11, so as to ensure that the chip anti-shake driving portion 13 can smoothly drive the chip anti-shake movable portion 12 to perform translational and/or rotational movement with respect to the chip anti-shake fixing portion 11. It is understood that in these examples in which the circuit board 31 of the photosensitive assembly 30 is mounted to the carrier front surface 1211 of the chip anti-shake movable carrier 121, the chip anti-shake movable carrier 121 may not need to be provided with the carrier opening 1213.

With continued reference to fig. 8 to 12, the chip anti-shake driving portion 13 includes a plurality of chip anti-shake magnets 131 and a plurality of chip anti-shake coils 132, where the chip anti-shake magnets 131 are respectively disposed on the chip anti-shake fixing portion 11, the chip anti-shake coils 132 are respectively disposed on the chip anti-shake movable portion 12, and the chip anti-shake magnets 131 and the chip anti-shake coils 132 correspond to each other, and magnetic fields generated after the chip anti-shake coils 132 are energized and magnetic fields of the chip anti-shake magnets 131 can interact to drive the chip anti-shake movable portion 12 to perform translational and/or rotational movements with respect to the chip anti-shake fixing portion 11, so as to implement translational anti-shake and/or rotational anti-shake of the camera module. For example, the chip anti-shake magnets 131 and the chip anti-shake coils 132 of the chip anti-shake driving portion 13 can interact to drive the chip anti-shake movable portion 12 to generate a translational motion along the X-axis direction and/or the Y-axis direction relative to the chip anti-shake fixing portion 11 so as to implement a translational anti-shake of the camera module. The chip anti-shake magnets 131 and the chip anti-shake coils 132 of the chip anti-shake driving part 13 can interact to drive the chip anti-shake movable part 12 to generate rotary motion around the Z-axis direction relative to the chip anti-shake fixing part 11 so as to realize rotary anti-shake of the camera module.

Preferably, in the camera module shown in fig. 2 to 8, the chip anti-shake magnets 131 of the chip anti-shake driving section 13 are respectively disposed on the upper cover 112 of the chip anti-shake fixing section 11, and correspondingly, the chip anti-shake coils 132 of the chip anti-shake driving section 13 are respectively disposed on the chip anti-shake movable section 12, and each of the chip anti-shake magnets 131 and each of the chip anti-shake coils 132 are in one-to-one correspondence. For example, as seen from the direction shown in fig. 2, the chip anti-shake magnet 131 is located above the chip anti-shake coil 132, that is, the chip anti-shake magnet 131 and the chip anti-shake coil 132 are disposed up and down.

Further, the chip driving assembly 10 includes at least one chip anti-shake magnetic conductive member 14, and the chip anti-shake magnetic conductive member 14 is covered above the chip anti-shake magnet 131, so that: on the one hand, the chip anti-shake magnetic conductive member 14 can strengthen the magnetic field strength downwards (i.e. in the direction of the chip anti-shake coil 132), so that the chip anti-shake driving portion 13 has enough driving force to drive the chip anti-shake movable portion 12 to perform translational and/or rotational movement relative to the chip anti-shake fixing portion 11, and on the other hand, the chip anti-shake magnetic conductive member 14 can avoid magnetic leakage in the direction of the lens driving assembly 40 to interfere with the magnetic field of the lens driving assembly 40.

Specifically, the chip anti-shake magnetic conductive member 14 is disposed on the upper cover 112 of the chip anti-shake fixing portion 11, and the chip anti-shake magnet 131 is disposed on the chip anti-shake magnetic conductive member 14, that is, the chip anti-shake magnet 131 is disposed on the upper cover 112 by being disposed on the chip anti-shake magnetic conductive member 14, so that the chip anti-shake magnetic conductive member 14 can be held between the chip anti-shake magnet 131 and the upper cover 112. Through such a structural design, the chip anti-shake magnetic conductive member 14 allows the magnetic force lines of the chip anti-shake magnet 131 to concentrate toward the chip anti-shake coil 132, so as to increase the magnetic field strength of the chip anti-shake driving portion 13, and reduce the magnetic field strength of the lens driving assembly 40, thereby avoiding magnetic interference to the lens driving assembly 40.

More specifically, the chip anti-shake magnetic conductive member 14 has a quadrilateral structure when the plane is seen along the optical axis side of the camera module, the area of the chip anti-shake magnetic conductive member 14 is greater than or equal to the area of the chip anti-shake magnet 131, and the chip anti-shake magnetic conductive member 14 completely covers the chip anti-shake magnet 141131, so that the chip anti-shake magnetic conductive member 14 can effectively prevent the magnetic force of the chip anti-shake magnet 131 from leaking. In other words, the chip anti-shake magnetic conductive member 14 covers the surface of the chip anti-shake magnet 131 facing the lens driving assembly 40. For example, in a specific example of the camera module of the present invention, the chip anti-shake magnetic conductive member 14 has the same shape as the chip anti-shake magnet 131, that is, the chip anti-shake magnetic conductive member 14 is a square plate, which is covered over the chip anti-shake magnet 131 to completely cover the upper surface of the chip anti-shake magnet 131.

Preferably, in this specific example of the camera module of the present invention shown in fig. 8 to 12, the chip anti-shake magnet conductive member 14 has a shape different from that of the chip anti-shake magnet 131, for example, the chip anti-shake magnet conductive member 14 has a "U" shape having an opening, which is capable of covering not only the upper surface of the chip anti-shake magnet 131 but also at least a part of the opposite sides of the chip anti-shake magnet 131 so as to concentrate magnetic lines of force of the chip anti-shake magnet 131 toward the direction of the chip anti-shake coil 132.

It should be noted that, the corresponding relationship between the number of the anti-shake magnetic conductive members 14 and the number of the anti-shake magnets 131 is not limited in the camera module of the present invention. For example, in the specific example of the camera module of the present invention shown in fig. 8 to 12, the number of the chip anti-shake magnet conductive members 14 is identical to the number of the chip anti-shake magnets 131, so that one chip anti-shake magnet conductive member 14 may be respectively covered above each of the chip anti-shake magnets 131, and thus the chip anti-shake magnet conductive members 14 and the chip anti-shake magnets 131 may be in one-to-one correspondence. Alternatively, in other examples of the camera module of the present invention, the number of the chip anti-shake magnet conductive members 14 is smaller than the number of the chip anti-shake magnets 131, so that one chip anti-shake magnet conductive member 14 can be covered over at least two chip anti-shake magnets 131.

As will be appreciated by those skilled in the art, referring to fig. 5 and 6, the photosensitive element 32 of the photosensitive assembly 30 is rectangular in shape with four sides. For convenience of description and understanding, four sides of the photosensitive element 32 are sequentially defined as a first chip side 321, a second chip side 322, a third chip side 323, and a fourth chip side 324 in a clockwise direction, and a coordinate system is established with a center point of the photosensitive element 32 as an origin, a direction parallel to the first chip side 321 and the third chip side 323 as an X-axis direction, a direction parallel to the second chip side 322 and the fourth chip side 324 as a Y-axis direction, and a direction perpendicular to a photosensitive surface of the photosensitive element 32 as a Z-axis direction.

According to the arrangement positions of the chip anti-shake coils 132 of the chip anti-shake driving portion 13, the chip anti-shake coils 132 form a first coil set 133, a second coil set 134 and a third coil set 135, wherein the first coil set 133 is arranged along the Y-axis direction in the plane where the X-axis and the Y-axis are located, the second coil set 134 and the third coil set 135 are respectively arranged along the X-axis direction, and the second coil set 134 and the third coil set 135 are located on opposite sides of the photosensitive element 32, so that the chip anti-shake coils 132 of the chip anti-shake driving portion 13 are wound around the photosensitive element 32 of the photosensitive assembly 30. Preferably, the second coil set 134 and the third coil set 135 are symmetrical with respect to the Y-axis. It is understood that the second coil set 134 and the third coil set 135 are located at opposite sides of the top opening 1102 of the chip anti-shake fixing portion 11.

The number of the chip anti-shake coils 132 constituting the first coil group 133 is at least one, the number of the chip anti-shake coils 132 constituting the second coil group 134 is at least two, and the number of the chip anti-shake coils 132 constituting the third coil group 135 is at least two. Preferably, in this specific example of the camera module shown in fig. 8 to 12, the number of the chip anti-shake coils 132 constituting the first coil group 133, the second coil group 134, and the third coil group 135 is two.

Specifically, the two chip anti-shake coils 132 that constitute the first coil group 133 are defined as a first coil 1321 and a second coil 1322, respectively, the first coil 1321 and the second coil 1322 being disposed opposite and parallel along the Y-axis direction; the two chip anti-shake coils 132 constituting the second coil set 134 are defined as a third coil 1323 and a fourth coil 1324, respectively, the third coil 1323 and the fourth coil 1324 being disposed opposite and parallel to each other along the X-axis direction; the two chip anti-shake coils 132 constituting the third coil group 135 are defined as a fifth coil 1325 and a sixth coil 1326, respectively, the fifth coil 1325 and the sixth coil 1326 being disposed opposite and in parallel.

In other words, the first coil 1321 and the second coil 1322 are disposed at the fourth chip side 324 and the second chip side 322 of the photosensitive element 32, respectively, and the first coil 1321 and the second coil 1322 are parallel to the fourth chip side 324 and the second chip side 322 of the photosensitive element 32, respectively. The third coil 1323 and the fifth coil 1325 are disposed on the first chip side 321 of the photosensitive element 32, respectively, and the third coil 1323 and the fifth coil 1325 are parallel to the first chip side 321 of the photosensitive element 32, respectively. The fourth coil 1324 and the sixth coil 1326 are disposed on the third chip side 324 of the photosensitive element 32, respectively, and the fourth coil 1324 and the sixth coil 1326 are parallel to the third chip side 323 of the photosensitive element 32, respectively.

In this specific example of the image pickup module of the present invention shown in fig. 8 to 12, the first coil 1321 and the second coil 1322 constituting the first coil group 133 are respectively disposed at opposite sides of the photosensitive element 32 in the Y-axis direction, and the third coil 1323 and the fourth coil 1324 constituting the second coil group 134 and the fifth coil 1325 and the sixth coil 1326 constituting the third coil group 135 are respectively disposed at four corners of the photosensitive element 32 in the X-axis direction. For example, the first coil 1321 is disposed adjacent to the third coil 1323 and the fourth coil 1324, respectively, and the first coil 1321 is perpendicular to the third coil 1323 and the fourth coil 1324, respectively, and accordingly, the second coil 1322 is disposed adjacent to the fifth coil 1325 and the sixth coil 1326, respectively, and the second coil 1322 is perpendicular to the fifth coil 1325 and the sixth coil 1326, respectively. In other words, the second coil set 134 and the third coil set 135 are further from the center of the photosensitive element 32 than the first coil set 133, and the moment is larger, so that the second coil set 134 and the third coil set 135 cooperate with each other to more easily drive the chip anti-shake movable portion 12 to perform a rotational movement with respect to the chip anti-shake fixing portion 11, so as to achieve a rotational anti-shake.

Specifically, the first coil 1321 and the second coil 1322 that constitute the first coil group 133 are the same in size, the third coil 1323 and the fourth coil 1324 that constitute the second coil group 134 and the fifth coil 1325 and the sixth coil 1326 that constitute the third coil group 135 are the same in size, and the first coil 1321 and the second coil 1322 are larger in size than the third coil 1323, the fourth coil 1324, the fifth coil 1325 and the sixth coil 1326, wherein the first coil 1321 and the second coil 1322 mutually cooperate to drive the chip anti-shake movable portion 12 in translational movement relative to the chip anti-shake fixing portion 11 in the X-axis direction, and the third coil 1323, the fourth coil 1324, the fifth coil 1325 and the sixth coil 1326 mutually cooperate to drive the chip anti-shake movable portion 12 in translational movement relative to the chip anti-shake fixing portion 11 in the Y-axis direction or the chip anti-shake fixing portion 12 in rotational movement relative to the chip anti-shake fixing portion 11 in the Y-axis direction. It will be appreciated that the first coil 1321 and the second coil 1322 have larger dimensions to ensure that they have larger thrust to drive the chip anti-shake movable portion 12 to perform a translational movement along the X-axis direction relative to the chip anti-shake fixing portion 11.

Alternatively, in other examples of the camera module of the present invention, the first and

second coils

1321 and 1322 constituting the first coil group 133, the third and

fourth coils

1323 and 1324 constituting the second coil group 134, and the fifth and

sixth coils

1325 and 1326 constituting the third coil group 135 may be the same size.

Preferably, the geometric centers of the first coil 1321 and the second coil 1322 constituting the first coil group 133 are coincident with the center of the chip anti-shake driving section 13, that is, the distance between the center of the first coil 1321 and the center of the photosensitive element 32 (origin of coordinate axes) and the distance between the center of the second coil 1322 and the center of the photosensitive element 32 are coincident, so that it can be ensured that the resultant force generated by the first coil 1321 and the second coil 1322 is still located at the center of the chip anti-shake driving section 13 to avoid the first coil 1321 and the second coil 1322 from generating unnecessary torque.

For example, in a specific example of the image pickup module of the present invention, the center of the first coil 1321 and the center of the second coil 1322 coincide with each other when viewing the plane thereof along the optical axis side of the image pickup module, so that a line between the center of the first coil 1321 and the center of the second coil 1322 passes through the center of the photosensitive element 32 and is parallel to the X-axis direction.

In another specific example of the camera module of the present invention, when the plane is viewed along the optical axis side of the camera module, the center of the first coil 1321 and the center of the second coil 1322 have a certain eccentricity, and the eccentric direction of the center of the first coil 1321 and the center of the second coil 1322 may be the positive direction of the Y axis or the negative direction of the Y axis, wherein a line between the center of the first coil 1321 and the center of the second coil 1322 passes through the center of the photosensitive element 32 and intersects the X axis direction. That is, in this embodiment of the camera module of the present invention, the center of the first coil 1321 may be biased toward the positive direction of the Y-axis, and accordingly, the center of the second coil 1322 may be biased toward the negative direction of the Y-axis, and the distance from the center of the first coil 1321 to the X-axis and the distance from the center of the second coil 1322 to the X-axis are the same, so that it is ensured that the resultant force generated by the first coil 1321 and the second coil 1322 is located at the center of the chip anti-shake driving section 13. Alternatively, the center of the first coil 1321 may be biased toward the negative Y-axis direction, and accordingly, the center of the second coil 1322 may be biased toward the positive Y-axis direction, and the distance from the center of the first coil 1321 to the X-axis is the same as the distance from the center of the second coil 1322 to the X-axis direction, so that the resultant force generated by the first coil 1321 and the second coil 1322 can be ensured to be located at the center of the chip anti-shake driving part 13.

In addition, the chip anti-shake coils 132 of the chip anti-shake driving section 13 are each hollow plane coils, which form one coil plane 13201 and one coil space 13202. Preferably, the coil plane 13201 of the first coil 1321, the coil plane 13201 of the second coil 1322, the coil plane 13201 of the third coil 1323, the coil plane 13201 of the fourth coil 1324, the coil plane 13201 of the fifth coil 1325, and the coil plane 13201 of the sixth coil 1326 are flush, so that the chip anti-shake driving section 13 can drive the chip anti-shake movable section 12 to translate in a plane XOY formed by an X axis and a Y axis.

Further, the chip anti-shake movable carrier 121 has a plurality of placement bits 1210, the number of the placement bits 1210 is identical to the number of the chip anti-shake coils 132, and each of the placement bits 1210 is used for placing each of the chip anti-shake coils 132, respectively.

According to the arrangement positions of the arrangement bits 1210, these arrangement bits 1210 form a first position group 12101, a second position group 12102, and a third position group 12103, wherein each of the arrangement bits 1210 constituting the first position group 12101 is respectively arranged at opposite sides in the Y-axis direction, and each of the arrangement bits 1210 constituting the second position group 12102 and the third position group 12103 is respectively arranged at four corners in the X-axis direction.

Further, each of the placement bits 1210 constituting the first position group 12101 is disposed along the Y-axis direction, each of the placement bits 1210 constituting the second position group 12102 is disposed along the X-axis direction, each of the placement bits 1210 constituting the third position group 12103 is disposed along the X-axis direction, and each of the placement bits 1210 constituting the second position group 12102 is disposed opposite to each other along the Y-axis direction, each of the placement bits 1210 constituting the third position group 12103 is disposed opposite to each other along the Y-axis direction. Preferably, each of the placement bits 1210 constituting the second position group 12102 is symmetrical with respect to the Y-axis, and each of the placement bits 1210 constituting the third position group 12103 is symmetrical with respect to the Y-axis.

The shape of the mounting position 1210 is the same as that of the chip anti-shake coil 132 so that the chip anti-shake coil 132 is mounted on the mounting position 1210. The placement bits 1210 have a rectangular or approximately rectangular structure as viewed from the optical axis side of the camera module, wherein the long side of each placement bit 1210 constituting the first position group 12101 is parallel to the Y-axis direction, the long side of each placement bit 1210 constituting the second position group 12102 and the long side of each placement bit 1210 constituting the third position group 12103 are parallel to the X-axis direction, and the long side of each placement bit 1210 constituting the first position group 12101 is perpendicular to the long side of each placement bit 1210 constituting the second position group 12102 and the third position group 12103, respectively.

In some examples of the camera module of the present invention, the placement site 1210 may be a planar placement site, such that the chip anti-shake coil 132 can be directly disposed on the surface of the placement site 1210. In other examples of the camera module of the present invention, the placement bits 1210 may be recessed placement bits such that the chip anti-shake coil 132 can be embedded in the placement bits 1210 to reduce the height of the chip driving assembly 10. In other examples of the camera module of the present invention, the placement bits 1210 may be through-hole placement bits such that the chip anti-shake coil 132 can be embedded in the placement bits 1210 to reduce the height of the chip driving assembly 10.

According to the positions of the chip anti-shake magnets 131 of the chip anti-shake driving portion 13, the chip anti-shake magnets 131 form a first magnet set 136, a second magnet set 137 and a third magnet set 138, wherein the first magnet set 136 is disposed along the Y axis direction on the plane where the X axis and the Y axis are located, the second magnet set 137 and the third magnet set 138 are disposed along the X axis direction, and the second magnet set 137 and the third magnet set 138 are located on opposite sides of the photosensitive element 32, so that the chip anti-shake magnets 131 of the chip anti-shake driving portion 13 encircle the periphery of the photosensitive element 32 of the photosensitive assembly 30. Preferably, the second magnet group 137 and the third magnet group 138 are symmetrical with respect to the Y axis.

The number of the chip anti-shake magnets 131 constituting the first magnet group 136 is at least one, the number of the chip anti-shake magnets 131 constituting the second magnet group 137 is at least two, and the number of the chip anti-shake magnets 131 constituting the third magnet group 138 is at least two. Preferably, in the specific example of the camera module shown in fig. 8 to 12, the number of the chip anti-shake magnets 131 constituting the first magnet group 136, the second magnet group 137, and the third magnet group 138 is two.

Specifically, the two chip anti-shake magnets 131 that make up the first magnet group 136 are defined as a first magnet 1311 and a second magnet 1312, respectively, the first magnet 1311 and the second magnet 1312 being disposed opposite and parallel to each other along the Y-axis direction, and the first magnet 1311 and the first coil 1321 being disposed opposite, and the second magnet 1312 and the second coil 1322 being disposed opposite. The two chip anti-shake magnets 131 that constitute the second magnet group 137 are defined as a third magnet 1313 and a fourth magnet 1314, respectively, the third magnet 1313 and the fourth magnet 1314 being disposed opposite and parallel to each other along the X-axis direction, and the third magnet 1313 and the third coil 1323 being disposed opposite, and the fourth magnet 1314 and the fourth coil 1324 being disposed opposite to each other. The two chip anti-shake magnets 131 constituting the third magnet group 138 are defined as a fifth magnet 1315 and a sixth magnet 1316, respectively, the fifth magnet 1315 and the sixth magnet 1316 being disposed opposite and parallel to each other along the X-axis direction, and the fifth magnet 1315 and the fifth coil 1325 being disposed opposite, and the sixth magnet 1316 and the sixth coil 1326 being disposed opposite to each other.

In other words, the first magnet 1311 and the second magnet 1312 are disposed on the fourth chip side 324 and the second chip side 322 of the photosensitive element 32, respectively, and the first magnet 1311 and the second magnet 1312 are parallel to the fourth chip side 324 and the second chip side 322 of the photosensitive element 32, respectively. The third magnet 1313 and the fifth magnet 1315 are disposed on the first chip side 321 of the photosensitive element 32, respectively, and the third magnet 1313 and the fifth magnet 1315 are parallel to the first chip side 321 of the photosensitive element 32, respectively. The fourth magnet 1314 and the sixth magnet 1316 are respectively disposed at the third chip side 323 of the photosensitive element 32, and the fourth magnet 1314 and the sixth magnet 1316 are respectively parallel to the third chip side 323 of the photosensitive element 32.

In this specific example of the image pickup module of the present invention shown in fig. 8 to 12, the first magnet 1311 and the second magnet 1312 constituting the first magnet group 136 are provided on opposite sides of the photosensitive element 32 in the Y-axis direction, respectively, and the third magnet 1313 and the fourth magnet 1314 constituting the second magnet group 137 and the fifth magnet 1315 and the sixth magnet 1316 constituting the third magnet group 138 are provided at four corners of the photosensitive element 32 in the X-axis direction, respectively. For example, the first magnet 1311 is disposed adjacent to the third magnet 1313 and the fourth magnet 1314, respectively, and the first magnet 1311 is perpendicular to the third magnet 1313 and the fourth magnet 1314, respectively, and the second magnet 1312 is disposed adjacent to the fifth magnet 1315 and the sixth magnet 1316, respectively, and the second magnet 1312 is perpendicular to the fifth magnet 1315 and the sixth magnet 1316, respectively.

Specifically, the first magnet 1311 and the second magnet 1312 that constitute the first magnet group 136 have the same size, the third magnet 1313 and the fourth magnet 1314 that constitute the second magnet group 137, and the fifth magnet 1315 and the sixth magnet 1316 that constitute the third magnet group 138 have the same size, and the first magnet 1311 and the second magnet 1312 have larger sizes than the third magnet 1313, the fourth magnet 1314, the fifth magnet 1315, and the sixth magnet 1316, wherein the first magnet 1311 and the second magnet 1312 cooperatively drive the chip anti-shake driving portion 13 to perform translational movement in the X-axis direction with respect to the chip anti-shake fixing portion 11, and the third magnet 1313, the fourth magnet 1314, the fifth magnet 1315, and the sixth magnet 1316 cooperatively drive the chip anti-shake driving portion 13 to perform translational movement in the Y-axis direction with respect to the chip anti-shake fixing portion 11 or the chip anti-shake driving portion 13 to perform translational movement in the Z-axis direction with respect to the chip anti-shake driving portion 11. It will be appreciated that the first magnet 1311 and the second magnet 1312 have a larger size to ensure that they have a larger thrust force to drive the chip anti-shake movable portion 12 to perform a translational movement along the X-axis direction with respect to the chip anti-shake fixing portion 11.

Alternatively, in other examples of the camera module of the present invention, the first magnet 1311 and the second magnet 1312 that constitute the first magnet group 136, the third magnet 1313 and the fourth magnet 1314 that constitute the second magnet group 137, and the fifth magnet 1315 and the sixth magnet 1316 that constitute the third magnet group 138 may be the same size.

In a specific example of the camera module of the present invention, the chip anti-shake magnet 131 of the chip anti-shake driving section 13 is a monopole magnet having one N pole and one S pole, which are disposed in a horizontal direction and face the chip anti-shake coil 132. Alternatively, in some other examples of the camera module of the present invention, the chip anti-shake magnet 131 of the chip anti-shake driving section 13 is a bipolar magnet having two N poles and two S poles, the N poles and the S poles of the first set of poles being disposed in a horizontal direction and facing the chip anti-shake coil 132, the S poles of the second set of poles being disposed at the bottom of the N poles of the first set of poles, the N poles of the second set of poles being disposed at the bottom of the S poles of the first set of poles, such that the S poles and the N poles of the second set of poles are disposed in a horizontal direction and away from the chip anti-shake coil 132.

It should be noted that, in this specific example of the image capturing module of the present invention, the first coil 1321 and the second coil 1322 that constitute the first coil group 133 correspond to the first magnet 1311 and the second magnet 1312 that constitute the first magnet group 136, respectively, such that when the first coil 1321 and the second coil 1322 are energized, the magnetic field generated by the first coil 1321 and the magnetic field generated by the first magnet 1311 cooperate with each other and the magnetic field generated by the second coil 1322 and the magnetic field generated by the second magnet 1312 cooperate with each other to enable the chip anti-shake movable section 12 to be driven to translate in the X-axis direction, so as to achieve translational anti-shake in the X-axis direction. The third coil 1323 and the fourth coil 1324 which constitute the second coil group 134 correspond to the third magnet 1313 and the fourth magnet 1314 which constitute the second magnet group 137, respectively, the fifth coil 1325 and the sixth coil 1326 which constitute the third coil group 135 correspond to the fifth magnet 1315 and the sixth magnet 1316 which constitute the third coil group 138, respectively, such that when the second coil group 134 and the third coil group 135 are energized with the same current and the same value, the second coil group 134 and the second coil group 137 cooperate with each other and the third coil group 135 and the third coil group 138 cooperate with each other to be able to drive the chip anti-shake movable portion 12 to translate in the Y-axis direction, to realize translational anti-shake in the Y-axis direction, and when the second coil group 134 and the third coil group 135 are energized with opposite currents but the same value, the second coil group 134 and the third coil group 135 cooperate with each other to be able to realize rotational anti-shake around the Z-axis portion 12.

Preferably, the translational stroke of the chip anti-shake driving section 13 in the X-axis and Y-axis directions is ±235 μm, and the rotational stroke around the Z-axis direction is ±1°.

With continued reference to fig. 8 to 12, the chip anti-shake movable portion 12 further includes a chip anti-shake electrical connection portion 123, wherein the chip anti-shake coils 132 of the chip anti-shake driving portion 13 are respectively connected to the chip anti-shake electrical connection portion 123, so as to supply power to the chip anti-shake coils 132 through the chip anti-shake electrical connection portion 123. Preferably, the chip anti-shake electrical connection portion 123 is electrically connected to the circuit board 31 of the photosensitive assembly 30.

Preferably, the chip anti-shake electrical connection 123 is a frame-shaped structure forming a connection opening 1231, wherein the chip anti-shake electrical connection 123 is attached to the carrier back surface 1212 of the chip anti-shake movable carrier 121, and the connection opening 1231 of the chip anti-shake electrical connection 123 and the carrier opening 1213 of the chip anti-shake movable carrier 121 correspond to and communicate with each other, wherein the circuit board 31 of the photosensitive assembly 30 is fixed to the chip anti-shake electrical connection 123 such that incident light is allowed to reach the photosensitive element 32 through the carrier opening 1213 of the chip anti-shake movable carrier 121 and the connection opening 1231 of the chip anti-shake electrical connection 123.

Alternatively, in other examples of the camera module of the present invention, the chip anti-shake movable portion 12 may not be provided with the chip anti-shake electrical connection portion 123, and the chip anti-shake coils 132 of the chip anti-shake driving portion 13 may be respectively attached to the circuit board 31 of the photosensitive assembly 30 to supply power to the chip anti-shake coils 132 through the circuit board 31. At this time, the circuit board 31 of the photosensitive assembly 30 may be directly attached to the carrier back 1212 of the chip anti-shake movable carrier 121.

With continued reference to fig. 8 to 12, the chip anti-shake movable carrier 121 has a plurality of carrier notches 1214, and the carrier notches 1214 extend from the carrier front surface 1211 to the carrier back surface 1212, respectively, wherein the chip anti-shake coils 132 of the chip anti-shake driving portion 13 are held by the carrier notches 1214 of the chip anti-shake movable carrier 121, respectively, such that the chip anti-shake coils 132 of the chip anti-shake driving portion 13 can extend toward the chip anti-shake magnet 131 through the plurality of carrier notches 1214 of the chip anti-shake movable carrier 121 on the basis that the chip anti-shake electrical connection portion 123 is mounted on the carrier back surface 1212 of the chip anti-shake movable carrier 121. That is, the carrier notches 1214 of the chip anti-shake movable carrier 121 can form the mounting positions 1210 for mounting the chip anti-shake coils 132, respectively.

It should be noted that the shape of the carrier notch 1214 of the chip anti-shake movable carrier 121 is not limited in the camera module of the present invention.

Preferably, in this embodiment of the camera module of the present invention, the chip anti-shake coils 132 of the chip anti-shake driving unit 13 are respectively attached to the chip anti-shake electrical connection units 123, and the chip anti-shake coils 132 can be respectively held by the carrier notches 1214 of the chip anti-shake movable carrier 121 by attaching the chip anti-shake electrical connection units 123 to the carrier back surface 1212 of the chip anti-shake movable carrier 121.

Alternatively, in other examples of the image pickup module of the present invention, the chip anti-shake coils 132 of the chip anti-shake driving section 13 are fixed to the chip anti-shake movable carrier 121, respectively, and the chip anti-shake coils 132 may be connected to the chip anti-shake electrical connection section 123 or to the circuit board 31 by connection wires. At this time, the chip anti-shake movable carrier 121 may not be provided with the carrier notch 1214.

With continued reference to fig. 8 to 12, the chip driving assembly 10 further includes at least one chip anti-shake magnetic attraction member 15, wherein the chip anti-shake magnetic attraction member 15 is disposed on the chip anti-shake movable portion 12, and a position of the chip anti-shake magnetic attraction member 15 corresponds to a position of the chip anti-shake magnet 131 of the chip anti-shake driving portion 13, so that the chip anti-shake magnetic attraction member 15 and the chip anti-shake magnet 131 can cooperate with each other to generate a magnetic attraction force in a Z-axis direction so as to suspend the chip anti-shake movable portion 12 in the accommodating cavity 1101 of the chip anti-shake fixing portion 11.

In other words, the magnetic attraction force generated by the chip anti-shake magnet 131 of the chip anti-shake magnetic attraction member 15 and the chip anti-shake driving portion 13 in the Z-axis direction can ensure that a set of the chip anti-shake balls 122 of the chip anti-shake movable portion 12 always abuts against the upper cover 112 of the chip anti-shake fixing portion 11, and since the chip anti-shake movable portion 12 is provided with a set of the chip anti-shake balls 122 capable of rolling between the carrier front surface 1211 of the chip anti-shake movable carrier 121 and the inner wall of the upper cover 112, point friction contact is formed between the chip anti-shake movable portion 12 and the chip anti-shake fixing portion 11, in this way, the chip anti-shake driving portion 13 can smoothly drive the chip anti-shake movable portion 12 to make translational and/or rotational movement with respect to the chip anti-shake fixing portion 11, so as to achieve translational anti-shake and/or rotational anti-shake of the camera module.

Preferably, the chip anti-shake movable carrier 121 has a set of holding grooves 1215 formed on the carrier front surface 1211 of the chip anti-shake movable carrier 121, wherein the chip anti-shake balls 122 are rollably held in the holding grooves 1215 of the chip anti-shake movable carrier 121, in such a manner that the chip anti-shake balls 122 are prevented from being disengaged from between the chip anti-shake movable carrier 121 and the upper cover 112 when the chip anti-shake driving part 13 drives the chip anti-shake movable part 12 to perform translational and/or rotational movement with respect to the chip anti-shake fixing part 11, thereby ensuring reliability and stability of the camera module. Specifically, when the chip anti-shake driving section 13 drives the chip anti-shake movable carrier 121 of the chip anti-shake movable section 12 to perform translational and/or rotational movement with respect to the chip anti-shake fixing section 11, the movement locus of the chip anti-shake balls 122 can be restricted within the holding groove 1215 of the chip anti-shake movable carrier 121 so that the chip anti-shake balls 122 always support the chip anti-shake movable carrier 121 and the upper cover 112 of the chip anti-shake fixing section 11.

That is, the holding grooves 1215 of the chip anti-shake movable carrier 121 and the chip anti-shake balls 122 can form a chip anti-shake support 17 of the chip driving assembly 10, that is, the chip anti-shake support 17 includes a set of the chip anti-shake balls 122 and has a set of the holding grooves 1215, wherein one set of the holding grooves 1215 is formed in the carrier front surface 122 of the chip anti-shake movable carrier 121, respectively, and one set of the chip anti-shake balls 122 is rollably held in the holding grooves 1215 and is located between the chip anti-shake movable carrier 121 and the upper cover 112, respectively, so that the chip anti-shake support 17 can support the chip anti-shake movable carrier 121 and the upper cover 112. The chip anti-shake balls 122 are movable along a plane formed by the X-axis and the Y-axis within the holding groove 1215 to provide a moving space for the movement of the chip anti-shake movable portion 12.

Further, the chip anti-shake movable carrier 121 has at least one extension pillar 1216, the holding groove 1215 is formed in the extension pillar 1216, and an opening of the holding groove 1215 faces the upper cover 112 of the chip anti-shake fixing portion 11. The depth of the holding groove 1215 is less than or equal to the diameter of the chip anti-shake ball 122, so that at least a portion of the chip anti-shake ball 122 may protrude from the holding groove 1215, and the height position of the chip anti-shake ball 122 is greater than the height position of the chip anti-shake coil 132, so that the chip anti-shake ball 122 can be in point frictional contact with the extension posts 1216 and the upper cover 112 of the chip anti-shake movable carrier 121, respectively.

It will be appreciated that, by the above-described structural design, the upper portion of the chip anti-shake ball 122 faces the plane formed by the inner wall of the upper cover 112, and the lower portion of the chip anti-shake ball 122 faces the recess formed by the holding groove 1215, so that: on the one hand, the chip anti-shake ball 122 can roll between the chip anti-shake movable carrier 121 and the upper cover 112, and on the other hand, the holding groove 1215 can limit the chip anti-shake ball 122 so as to prevent the chip anti-shake ball 122 from falling off, thereby ensuring the reliability of the camera module.

It is understood that the chip anti-shake balls 122 allow a gap between the chip anti-shake magnet 131 and the chip anti-shake coil 132 to avoid direct contact between the chip anti-shake magnet 131 and the chip anti-shake coil 132. Preferably, a gap formed between the chip anti-shake magnet 131 and the chip anti-shake coil 132 ranges from 0.05mm to 0.5mm to ensure good electromagnetic induction between the chip anti-shake magnet 131 and the chip anti-shake coil 132.

Further, the chip driving assembly 10 includes at least three chip anti-shake supporting parts 17 to ensure smooth translation and rotation of the chip anti-shake movable part 12 along the X-axis and the Y-axis, and around the Z-axis. That is, the chip anti-shake movable portion 12 includes at least three chip anti-shake balls 122, and the chip anti-shake movable carrier 121 has at least three holding grooves 1215.

Preferably, in this specific example of the camera module shown in fig. 8 to 12, the chip driving assembly 10 includes four chip anti-shake supporting portions 17 disposed between the first position group 12101 and the second position group 12102 and between the second position group 12102 and the third position group 12103, respectively. That is, the four chip anti-shake supporting portions 17 of the chip driving assembly 10 are respectively located at the four corners of the chip anti-shake movable portion 12 to provide a smoother support for the chip anti-shake movable portion 12, and make full use of the internal space of the chip driving assembly 10 to make the structure of the chip driving assembly 10 more compact. Alternatively, in still other examples of the camera module of the present invention, the chip anti-shake support 17 of the chip driving assembly 10 may be a slider slidably held between the chip anti-shake movable carrier 121 and the upper cover 112 for smoothly supporting the chip anti-shake movable portion 12. With continued reference to fig. 8 to 12, the chip driving assembly 10 includes four chip anti-shake magnetic attraction members 15, and each of the chip anti-shake magnetic attraction members 15 is disposed at each corner of the chip anti-shake movable portion 12, so that the flatness of the chip anti-shake movable portion 12 can be ensured, and the optical axis of the image capturing module can be perpendicular to the photosensitive surface of the photosensitive element 32 of the photosensitive assembly 30.

With continued reference to fig. 8 to 12, in this specific example of the camera module of the present invention, the chip anti-shake magnetic attraction member 15 is provided to the chip anti-shake electrical connection 123 to optimize the structure of the camera module. Alternatively, in other examples of the camera module of the present invention, the chip anti-shake magnetic attraction member 15 may be disposed at the chip anti-shake movable carrier 121, or the chip anti-shake magnetic attraction member 15 may be disposed at the circuit board 31 of the photosensitive assembly 30, or the chip anti-shake magnetic attraction member 15 may be disposed between the chip anti-shake movable carrier 121 and the chip anti-shake electrical connection 123, or the chip anti-shake magnetic attraction member 15 may be disposed between the chip anti-shake electrical connection 123 and the circuit board 31.

In addition, in some examples of the camera module of the present invention, the chip anti-shake magnet attraction member 15 and the chip anti-shake magnet 131 of the chip anti-shake driving section 13 may be perfectly aligned, i.e., the chip anti-shake magnet attraction member 15 may be located directly under the chip anti-shake magnet 131 of the chip anti-shake driving section 13. In other examples of the camera module of the present invention, the chip anti-shake magnet attraction member 15 and the chip anti-shake magnet 131 of the chip anti-shake driving section 13 may not be perfectly aligned, and there is some deviation therebetween.

It will be appreciated that when the chip anti-shake driving portion 13 drives the chip anti-shake movable portion 12 to perform translational and/or rotational movement with respect to the chip anti-shake fixing portion 11, the chip anti-shake magnetic attraction member 15 may perform translational and/or rotational movement with respect to the chip anti-shake fixing portion 11 synchronously, and at this time, some deviation may also occur between the chip anti-shake magnetic attraction member 15 and the chip anti-shake magnet 131, but the plane of the chip anti-shake magnetic attraction member 15 and the plane of the chip anti-shake magnet 131 are always parallel, that is, the plane of the chip anti-shake magnetic attraction member 15 and the plane of the chip anti-shake magnet 131 are always orthogonal to the Z-axis, so that the chip anti-shake magnetic attraction member 15 and the chip anti-shake magnet 131 may cooperate with each other to generate magnetic attraction force in the Z-axis direction, which means that the plane of the chip anti-shake magnetic attraction member 15 and the plane of the chip anti-shake magnet 131 are vertical, including, but not limited to, the vertical direction and the oblique direction.

With continued reference to fig. 8 to 12, the chip driving assembly 10 further includes at least three chip anti-shake position sensing elements 16 that sense positional information of the chip anti-shake movable portion 12 in X-axis translation, Y-axis translation, and Z-axis rotation by sensing positional information of the first magnet set 136, the second magnet set 137, and the third magnet set 138, respectively.

Preferably, three of the chip anti-shake position sensing elements 16 are respectively defined as a first sensing element 161, a second sensing element 162 and a third sensing element 163. The first sensing element 161 is disposed in the coil space 13202 of the first coil 1321 to correspond to the first magnet 1311, wherein the first sensing element 161 is configured to sense a magnetic field change when translating in the X-axis direction. The second sensing element 162 is disposed in the coil space 13202 of the fourth coil 1324 to correspond to the fourth magnet 1314, wherein the second sensing element 162 is configured to sense a magnetic field change during translation in the Y-axis direction. The third sensing element 163 is disposed in the coil space 13202 of the fifth coil 1325 to correspond to the fifth magnet 1315, wherein the second sensing element 162 and the third sensing element 163 are configured to sense a change in a magnetic field when rotated in the Z-axis direction.

Preferably, the chip anti-shake position sensing element 16 is mounted to the chip anti-shake electrical connection 123.

In the camera module of the present invention, the first coil group 133, the second coil group 134 and the third coil group 135 of the chip anti-shake driving part 13 are independently controlled coil groups, so only three chip anti-shake position sensing elements 16 are required to be provided, so that the number of elements of the chip driving assembly 10 can be reduced, and the sensing of translational anti-shake and/or rotational anti-shake is realized by using a small number of interfaces, which is beneficial to reducing the size of the chip driving assembly 10, and the internal space of the chip driving assembly 10 can be fully utilized, so that the chip driving assembly 10 has compact structure.

It should be noted that, in some embodiments of the camera module of the present invention, the chip anti-shake position sensing element 16 may be a hall element. In other embodiments of the camera module of the present invention, the chip anti-shake position sensing element 16 may be a driving IC adapted to control the current of the chip anti-shake coil 132 while acquiring the position change of the chip anti-shake magnet 131. Specifically, after the camera module has opened the anti-shake function, the chip anti-shake position sensing element 16 is capable of sensing the current positions of the first magnet set 136, the second magnet set 137 and the third magnet set 138, and driving the chip anti-shake movable portion 12 to move to the sensed central position by controlling the currents of the first coil set 133, the second coil set 134 and the third coil set 135, and after the camera module has closed the anti-shake function, returning the chip anti-shake movable portion 12 to the initial position by the reactive force of the circuit board 31 of the photosensitive assembly 30 (i.e., the elastic force accumulated by the elastic deformation of the circuit board 31 when the chip anti-shake movable portion 12 is translated and/or rotated).

Fig. 13 shows a modified example of the camera module of the present invention, unlike the camera module shown in fig. 1 to 12, in this modified example of the camera module shown in fig. 13, the first coil group 133 includes four anti-shake coils 132, wherein two of the anti-shake coils 132 constituting the first coil group 133 are disposed symmetrically with respect to each other at one end of the second chip side 322 and the fourth chip side 324 of the photosensitive element 32, and the other two of the anti-shake coils 132 are disposed symmetrically with respect to each other at the other end of the second chip side 322 and the fourth chip side 324 of the photosensitive element 32. The four holding grooves 1215 of the chip anti-shake movable carrier 121 are formed in the middle portions of the first chip side 321, the second chip side 322, the third chip side 323, and the fourth chip side 324 of the photosensitive element 32, respectively, such that the four balls 122 are rollably held between the carrier front surface 1211 of the chip anti-shake movable carrier 121 and the inner wall of the upper cover 112 in the middle portions of the first chip side 321, the second chip side 322, the third chip side 323, and the fourth chip side 324 of the photosensitive element 32, respectively.

Fig. 9A and 9B show a modified example of the camera module according to the present invention, unlike the camera module shown in fig. 1 to 12, in this specific example of the camera module shown in fig. 9A and 9B, the lens focus fixing unit 422 further includes a base magnetism blocking member 470, the base magnetism blocking member 470 being provided to the lens driving base 440 so as to hold the base magnetism blocking member 470 at the bottom of the lens shake preventing magnets 4131 of the lens shake preventing driving unit 413 by the lens driving base 440, thereby reducing a magnetic field of the lens shake preventing magnets 4131 overflowing in the direction of the photosensitive assembly 30, and further reducing magnetic interference of the magnetic field to a circuit board, a photosensitive element, etc. of the photosensitive assembly 30.

It should be noted that the manner in which the base magnetism isolating element 470 is disposed on the lens driving base 440 is not limited in the image capturing module of the present invention. For example, the base magnetic shielding member 470 may be provided to the lens driving base 440 by means of adhesion, or the base magnetic shielding member 470 may be provided to the surface or inside of the lens driving base 440 by means of insert molding.

Fig. 15A and 15B are diagrams showing the image pickup module according to another preferred embodiment of the present invention, unlike the image pickup module shown in fig. 1 to 12, in this specific example of the image pickup module shown in fig. 15A and 15B, the number of the lens focusing magnets 4231 and the lens focusing coils 4232 of the lens focusing driving unit 423 is one, the lens focusing magnets 4231 are provided in the middle of the lens focusing inner frame peripheral portion 42023 of the lens focusing inner frame 420, and the lens focusing coils 4232 are provided in the middle of the lens focusing outer frame 430. Accordingly, the middle portion of the lens focusing housing 430 has one of the coil through holes 4304 for accommodating the lens focusing coil 4232.

Preferably, the lens focusing part 42 may include one lens focusing position sensing element 4252 which is disposed at an outer side of the lens focusing coil 4232, and the lens focusing position sensing element 4252 corresponds to the lens focusing magnet 4231, such that the lens focusing position sensing element 4252 acquires the position of the lens focusing inner frame 420 by sensing the position change of the lens focusing magnet 4231.

Alternatively, in other examples of the camera module of the present invention, the lens focus position sensing element 4252 may be located in the middle of the lens focus coil 4232. By disposing the lens focus position sensing element 4252 in the middle of the lens focus coil 4232, the lens focus position sensing element 4252 can be surrounded by the lens focus coil 4232 such that: on the one hand, the lens focusing part 42 can ensure that the lens focusing position sensing element 4252 is opposite to the lens focusing magnet 4231, so as to be beneficial to improving the sensing precision; on the other hand, by disposing the lens focus position sensing element 4252 at the intermediate position of the lens focus coil 4232, the structure of the lens focus portion 42 can be made more compact, thereby optimizing the structure of the lens driving assembly 40.

Unlike the image pickup module shown in fig. 1 to 12, in this preferred example of the image pickup module shown in fig. 16A to 20B, the lens anti-shake driving unit 413 includes four lens anti-shake magnets 4131 and four lens anti-shake coils 4132, wherein the four lens anti-shake magnets 4131 are sequentially defined as a first anti-shake magnet 4131a, a second anti-shake magnet 4131B, a third anti-shake magnet 4131c, and a fourth anti-shake magnet 4131d, and wherein the four lens anti-shake coils 4132 are sequentially defined as a first anti-shake coil 4132a, a second anti-shake coil 4132B, a third anti-shake coil 4132c, and a fourth anti-shake coil 4132d.

The first, second, third and fourth

anti-shake magnets

4131a, 4131b, 4131c and 4131d are respectively fixed to the lens anti-shake carrier 410, the first, second, third and fourth

anti-shake coils

4132a, 4132b, 4132c and 4132d are respectively fixed to the lens focusing inner frame 420, wherein the first and first

anti-shake magnets

4131a and 4132a correspond to each other, the second and second

anti-shake magnets

4131b and 4132b correspond to each other, the third and third

anti-shake coils

4131c and 4132c correspond to each other, the fourth

anti-shake magnets

4131d and 4132d correspond to each other, thus, when the first anti-shake coil 4132a, the second anti-shake coil 4132b, the third anti-shake coil 4132c and the fourth anti-shake coil 4132d are respectively energized to generate magnetic fields, the magnetic fields of the first anti-shake coil 4132a, the second anti-shake coil 4132b, the third anti-shake coil 4132c and the fourth anti-shake coil 4132d interact with the magnetic fields of the first anti-shake magnet 4131a, the second anti-shake magnet 4131b, the third anti-shake magnet 4131c and the fourth anti-shake magnet 4131d to drive the lens anti-shake carrier 410 to drive the optical lens 21 to translate in a plane perpendicular to the optical axis of the image capturing module, so as to realize anti-shake of the image capturing module.

Preferably, the carrier top surface 4101 of the lens anti-shake carrier 410 is provided with four anti-shake magnet grooves 4104 for accommodating the first anti-shake magnet 4131a, the second anti-shake magnet 4131b, the third anti-shake magnet 4131c and the fourth anti-shake magnet 4131d, respectively. Based on the positions of the first, second, third, and fourth

anti-shake magnets

4131a, 4131b, 4131c, and 4131d, four of the anti-shake magnet grooves 4104 are defined as a first magnet groove 4104a, a second magnet groove 4104b, a third magnet groove 4104c, and a fourth magnet groove 4104d in this order.

In other words, the first anti-shake magnet 4131a is received in the first magnet recess 4104a of the lens anti-shake carrier 410, the second anti-shake magnet 4131b is received in the second magnet recess 4104b of the lens anti-shake carrier 410, the third anti-shake magnet 4131c is received in the third magnet recess 4104c of the lens anti-shake carrier 410, and the fourth anti-shake magnet 4131d is received in the fourth magnet recess 4104d of the lens anti-shake carrier 410.

The lens anti-shake carrier 410 has a proximal side 41001, a distal side 41002, and two side 41003, the proximal side 41001 and the distal side 41002 correspond, the two side 41003 correspond, and opposite ends of the two side 41003 extend to be connected to ends of the proximal side 41001 and the distal side 41002, respectively. The side of the lens anti-shake holder 410 near the lens focusing outer frame 430 is defined as the near side 41001, and correspondingly, the side of the lens anti-shake holder 410 far from the lens focusing outer frame 430 is defined as the far side 41002, and the other two sides of the lens anti-shake holder 410 are defined as the side 41003.

The second magnet groove 4104b and the third magnet groove 4104c are provided side by side at the distal side 41002 of the lens anti-shake carrier 410, the first magnet groove 4104a is provided at one of the side 41003 of the lens anti-shake carrier 410, the fourth magnet groove 4104d is provided at the other of the side 41003 of the lens anti-shake carrier 410, and the first magnet groove 4104a and the second magnet groove 4104b are parallel to each other, so that the second anti-shake magnet 4131b and the third anti-shake magnet 4131c are provided side by side at the distal side 41002 of the lens anti-shake carrier 410, the first anti-shake magnet 4131a is provided at one of the side 41003 of the lens anti-shake carrier 410, the fourth anti-shake magnet 4131d is provided at the other of the side 41003 of the lens anti-shake carrier 410, and the first anti-shake magnet 4131a and the fourth anti-shake magnet 4131d are parallel to each other. It is understood that the first anti-shake magnet 4131a and the second anti-shake magnet 4131b are disposed adjacent to each other, and the third anti-shake magnet 4131c and the fourth anti-shake magnet 4131d are disposed adjacent to each other.

Preferably, the extending direction of the first anti-shake magnet 4131a and the extending direction of the second anti-shake magnet 4131b are perpendicular to each other, the extending direction of the third anti-shake magnet 4131c and the extending direction of the fourth anti-shake magnet 4131d are perpendicular to each other, the first anti-shake magnet 4131a and the fourth anti-shake magnet 4131d are axisymmetrically arranged, and the second anti-shake magnet 4131b and the third anti-shake magnet 4131c are axisymmetrically arranged.

Preferably, the second and third

anti-shake magnets

4131b, 4131c have smaller dimensions than the first and fourth

anti-shake magnets

4131a, 4131d, which is advantageous for reducing the lateral dimensions of the lens anti-shake carrier 410, and thus the lens driving assembly 420.

Alternatively, in other examples of the image capturing module of the present invention, the distal side 41002 of the lens anti-shake carrier 410 may be provided with one of the anti-shake magnet grooves 4104 and one of the lens anti-shake magnets 4131, in which case the size of the lens anti-shake magnet 4131 provided at the distal side 41002 of the lens anti-shake carrier 410 is identical to the size of the lens anti-shake magnet 4131 provided at the side 41003 of the lens anti-shake carrier 410. It is understood that in this embodiment, the lens anti-shake driving unit 413 includes three lens anti-shake magnets 4131 and three lens anti-shake coils 4132.

The first anti-shake coil 4132a, the second anti-shake coil 4132b, the third anti-shake coil 4132c, and the fourth anti-shake coil 4132d are all fixed to the inner frame bottom surface 42012 of the lens focusing inner frame top 4201 of the lens focusing inner frame 420 through the lens anti-shake circuit board 414. For example, the first, second, third and fourth

anti-shake coils

4132a, 4132b, 4132c and 4132d are respectively mounted to the lens anti-shake circuit board 414, the lens anti-shake circuit board 414 is fixed to the inner frame bottom surface 42012 of the lens focusing inner frame top 4201 of the lens focusing inner frame 420, so that the first, second, third and fourth

anti-shake coils

4132a, 4132b, 4132c and 4132d are fixed to the inner frame bottom surface 42012 of the lens focusing inner frame top 4201 of the lens focusing inner frame 420 through the lens anti-shake circuit board 414.

With continued reference to fig. 16A to 20B, the lens anti-shake portion 41 further includes two lens anti-shake position sensing elements 415 fixedly disposed on the lens anti-shake circuit board 414, respectively, and one lens anti-shake position sensing element 415 is disposed in the middle of the second anti-shake coil 4132B for sensing a position change of the second anti-shake magnet 4131B, and the other lens anti-shake position sensing element 415 is disposed outside the fourth anti-shake coil 4132d for sensing a position change of the fourth anti-shake magnet 4131d, thereby obtaining a position of the lens anti-shake carrier 410.

With continued reference to fig. 16A to 20B, the first, second, third and fourth

anti-shake impact units

4181, 4182, 4183 and 4184 of the lens anti-shake section 41 are disposed at four sides of the lens anti-shake carrier 410, respectively, and the first, second, third and fourth

anti-shake impact units

4181, 4182, 4183 and 4184 include two anti-shake protrusions 4180 protruding from the sides of the lens anti-shake carrier 410, respectively.

In this specific example of the image pickup module of the present invention shown in fig. 16A to 20B, the lens anti-shake magnet attraction unit 416 fixed to the lens focusing inner frame 420 is disposed above four lens anti-shake magnets 4131, that is, the first anti-shake magnet 4131a, the second anti-shake magnet 4131B, the third anti-shake magnet 4131c, and the fourth anti-shake magnet 4131d correspond to different positions of the lens anti-shake magnet attraction unit 416, respectively, so that the lens anti-shake magnet attraction unit 416 and the lens anti-shake magnet 4131 are attracted to each other due to magnetic attraction force, and the lens anti-shake carrier 410 is suspended in the accommodating chamber 4203 of the lens focusing inner frame 420 by the lens anti-shake support unit 417.

Preferably, the lens anti-shake magnet unit 416 is provided to electrically connect the lens anti-shake circuit board 414 and the lens focusing circuit board 424. Specifically, referring to fig. 16C, the lens anti-shake magnet unit 416 includes four conductive members 4161 that are respectively defined as a first conductive member 4161a, a second conductive member 4161b, a third conductive member 4161C and a fourth conductive member 4161d, wherein the first conductive member 4161a and the second conductive member 4161b are respectively disposed above the first anti-shake magnet 4131a and the second anti-shake magnet 4131b, thereby providing magnetic attraction force on the first anti-shake magnet 4131a and the second anti-shake magnet 4131b, and the third conductive member 4161C and the fourth conductive member 4161d are respectively disposed above the third anti-shake magnet 4131C and the fourth anti-shake magnet 4131d, thereby providing magnetic attraction force on the third anti-shake magnet 4131C and the fourth anti-shake magnet 4131 d.

Preferably, the first, second, third and fourth

conductive members

4161a, 4161b, 4161c and 4161d are respectively embedded in the lens focusing inner frame 420 by insert molding, and the first, second, third and fourth

conductive members

4161a, 4161b, 4161c and 4161d are not connected to the lens focusing magnetically conductive unit 4210. The first conductive member 4161a, the second conductive member 4161b, the third conductive member 4161c and the fourth conductive member 4161d have first ends electrically connected to the lens anti-shake circuit board 414 by welding or the like, and second ends electrically connected to the lens focusing circuit board 424 by welding or the like, so that the lens anti-shake magnetic attraction unit 416 electrically connects the lens anti-shake circuit board 414 and the lens focusing circuit board 424.

The connecting portions 4242 of the lens focusing circuit board 424 are distributed along four sides of the inner frame top surface 42011 of the lens focusing inner frame 420, and circumferentially surround the inner frame channels 42013 of the lens focusing inner frame 420.

Further, the connecting portion 4242 of the lens focusing circuit board 424 includes a movable electrical connecting portion 42421 and four deformed electrical connecting portions 42422, the movable electrical connecting portion 42421 is fixed to the lens focusing inner frame 420 and is electrically connected to the lens anti-shake magnetic attraction unit 416, and the four deformed electrical connecting portions 42422 are electrically connected to the mounting portion 4241 and the movable electrical connecting portion 42421. When the lens focusing inner frame 420 is driven to move along the optical axis direction of the image capturing module relative to the lens focusing outer frame 430, the four deformed electrical connection portions 42422 can reduce the movement obstruction of the lens focusing circuit board 424 to the lens focusing inner frame 420, so that the lens focusing inner frame 420 can be smoothly driven.

Specifically, four of the deformed electrical connection portions 42422 are defined as a first connection portion 42422a, a second connection portion 42422b, a third connection portion 42422c and a fourth connection portion 42422d in this order, wherein the first connection portion 42422a and the third connection portion 42422c are disposed in an axisymmetric manner, and the second connection portion 42422b and the fourth connection portion 42422d are disposed in an axisymmetric manner, wherein the first connection portion 42422a and the second connection portion 42422b are connected and serve to conduct the mounting portion 4241 and the movable electrical connection portion 42421, and correspondingly, the third connection portion 42422c and the fourth connection portion 42422d are connected and serve to conduct the mounting portion 4241 and the movable electrical connection portion 42421.

Fig. 21A to 22B illustrate another embodiment of the camera module according to the present invention, which is different from the camera module illustrated in fig. 1 to 12 in the specific structure of the chip driving assembly 10. Specifically, in this specific example of the camera module shown in fig. 21A to 22B, the chip anti-shake magnets 131 of the chip anti-shake driving section 13 are respectively disposed on the chip anti-shake movable section 12, the chip anti-shake coils 132 are respectively disposed on the chip anti-shake fixing section 11, and the chip anti-shake magnets 131 and the chip anti-shake coils 132 correspond to each other, wherein magnetic fields generated after the chip anti-shake coils 132 are energized and the magnetic fields of the chip anti-shake magnets 131 can interact to drive the chip anti-shake movable section 12 to perform translational and/or rotational movements with respect to the chip anti-shake fixing section 11, thereby realizing translational anti-shake and/or rotational anti-shake of the camera module. For example, the chip anti-shake magnets 131 and the chip anti-shake coils 132 of the chip anti-shake driving portion 13 can interact to drive the chip anti-shake movable portion 12 to generate a translational motion along the X-axis direction and/or the Y-axis direction relative to the chip anti-shake fixing portion 11 so as to implement a translational anti-shake of the camera module. The chip anti-shake magnets 131 and the chip anti-shake coils 132 of the chip anti-shake driving part 13 can interact to drive the chip anti-shake movable part 12 to generate rotary motion around the Z-axis direction relative to the chip anti-shake fixing part 11 so as to realize rotary anti-shake of the camera module.

Preferably, in the camera module shown in fig. 21A to 22B, the chip anti-shake magnets 131 of the chip anti-shake driving section 13 are respectively provided to the chip anti-shake movable carrier 121 of the chip anti-shake movable section 12, and correspondingly, the chip anti-shake coils 132 of the chip anti-shake driving section 13 are respectively provided to the upper cover 112 of the chip anti-shake fixing section 11, and each of the chip anti-shake magnets 131 and each of the chip anti-shake coils 132 are in one-to-one correspondence.

Preferably, the chip anti-shake magnets 131 of the chip anti-shake driving section 13 are mounted to the mounting positions 1210 of the chip anti-shake movable carrier 121, respectively.

With continued reference to fig. 21A to 22B, the chip anti-shake electrical connection 123 is attached to the inner wall of the upper cover 112, and the connection opening 1231 of the chip anti-shake electrical connection 123 and the top opening 1102 of the chip anti-shake fixing portion 11 are corresponding and communicating, so as to avoid that the chip anti-shake electrical connection 123 blocks light entering the inside of the chip driving assembly 10 through the top opening 1102 of the chip anti-shake fixing portion 11. The chip anti-shake coils 132 of the chip anti-shake driving part 13 may be respectively attached to the chip anti-shake electrical connection parts 123, so as to arrange the chip anti-shake coils 132 on the upper cover 112 through the chip anti-shake electrical connection parts 123.

In addition, the chip anti-shake electrical connection 123 may have a plurality of escape positions 1232, and the size of the escape positions 1232 is larger than the size of the extension posts 1216 of the chip anti-shake movable carrier 121, so as to ensure that the chip anti-shake movable portion 12 can be driven to translate along the X-axis and/or Y-axis directions and/or rotate around the Z-axis directions.

Alternatively, in other examples of the camera module of the present invention, the camera module may not be provided with the chip anti-shake electrical connection portion 123, but the chip anti-shake coils 132 of the chip anti-shake driving portion 13 are directly provided to the upper cover 112, and the chip anti-shake coils 132 are connected to the circuit board 31 of the photosensitive assembly 30 through connection wires.

With continued reference to fig. 21A to 22B, the chip anti-shake magnetic attraction members 15 of the chip driving assembly 10 are respectively disposed on the upper cover 112 of the chip anti-shake fixing portion 11, and the positions of the chip anti-shake magnetic attraction members 15 and the chip anti-shake magnets 131 of the chip anti-shake driving portion 13 correspond to each other, so that the chip anti-shake magnetic attraction members 15 and the chip anti-shake magnets 131 can cooperate with each other to generate magnetic attraction force in the Z-axis direction so as to suspend the chip anti-shake movable portion 12 in the housing cavity 1101 of the chip anti-shake fixing portion 11.

Alternatively, in other examples of the camera module of the present invention, the chip anti-shake magnetic attraction members 15 of the chip driving assembly 10 may be disposed at the chip anti-shake electrical connection 123, or the chip anti-shake magnetic attraction members 15 may be disposed between the chip anti-shake electrical connection 123 and the upper cover 112.

In this modified example of the camera module shown in fig. 23, the chip anti-shake magnetic conductive member 14 of the chip driving assembly 10 is located below the chip anti-shake magnet 131, so that: on the one hand, the chip anti-shake magnetic conductive member 14 can strengthen the magnetic field strength upwards (i.e. the direction in which the chip anti-shake coil 132 is located), so that the chip anti-shake driving portion 13 has enough driving force to drive the chip anti-shake movable portion 12 to perform translational and/or rotational movement relative to the chip anti-shake fixing portion 11; on the other hand, the chip shake preventing magnetic conductive member 14 can prevent the magnetic field of the chip shake preventing magnet 131 from leaking out, while avoiding interference with the circuit board 31 and the photosensitive element 32 of the photosensitive assembly 30.

Specifically, the chip anti-shake magnetic conductive member 14 is disposed on the chip anti-shake movable carrier 121, and the chip anti-shake magnet 131 is disposed on the chip anti-shake magnetic conductive member 14, that is, the chip anti-shake magnet 131 is disposed on the chip anti-shake movable carrier 121 by being disposed on the chip anti-shake magnetic conductive member 14.

It should be noted that, the manner in which the chip anti-shake magnetic conductive member 14 is disposed on the chip anti-shake movable carrier 121 is not limited in the camera module of the present invention. For example, in some embodiments of the camera module of the present invention, after the chip anti-shake magnetic conductive member 14 and the chip anti-shake movable carrier 121 are formed separately, the chip anti-shake magnetic conductive member 14 may be disposed on the chip anti-shake movable carrier 121 by means of glue bonding. In other embodiments of the camera module of the present invention, the chip anti-shake movable carrier 121 may be integrally formed with the chip anti-shake magnetic conductive member 14 during injection molding of the chip anti-shake movable carrier 121, so that the chip anti-shake magnetic conductive member 14 is disposed on the chip anti-shake movable carrier 121.

Unlike the camera module shown in fig. 1 to 12, in this modified example of the camera module shown in fig. 24, the chip driving assembly 10 may not be provided with the chip anti-shake magnet member 15 and the chip anti-shake balls 122 may not be provided between the chip anti-shake movable carrier 121 and the upper cover 112. Specifically, the chip driving assembly 10 further includes a suspension portion 18 for suspending the chip anti-shake movable portion 12 from the receiving cavity 1101 of the chip anti-shake fixing portion 11.

Specifically, the suspension portion 18 includes at least three suspension elements 181 having elasticity, wherein the top end of each suspension element 181 is connected to the upper cover 112 of the chip anti-shake fixing portion 11, and the bottom end of each suspension element 181 is connected to the chip anti-shake movable carrier 121 of the chip anti-shake movable portion 12, so that the chip anti-shake movable portion 12 is suspended in the accommodating cavity 1101 of the chip anti-shake fixing portion 11 by the suspension elements 181.

When the chip anti-shake coil 132 of the chip anti-shake driving portion 13 is energized to allow the chip anti-shake coil 132 and the chip anti-shake magnet 131 to cooperate with each other to drive the chip anti-shake movable portion 12 to perform translational and/or rotational movement with respect to the chip anti-shake fixing portion 11, the chip anti-shake fixing portion 11 drives the suspension elements 181 to deform the suspension elements 181. Accordingly, when the chip anti-shake coil 132 of the chip anti-shake driving portion 13 is powered off, the suspension elements 181 can drive the chip anti-shake movable portion 12 to return to the initial position during the process of restoring to the initial state.

Preferably, the suspension portion 18 includes four suspension elements 181, the top ends of the four suspension elements 181 are respectively connected to four corners of the upper cover 112, and the bottom ends of the four suspension elements 181 are respectively connected to four corners of the chip anti-shake movable carrier 121, so that the four suspension elements 181 of the suspension portion 18 can cooperate with each other to ensure that the chip anti-shake movable portion 12 translates and/or rotates stably in the accommodating cavity 1101 of the chip anti-shake fixing portion 11. At this time, each of the chip anti-shake coils 132 of the chip anti-shake driving section 13 is disposed at each side of the chip anti-shake movable section 12, respectively, to form avoidance.

Optionally, in other examples of the camera module of the present invention, top ends of the four suspension elements 181 of the suspension 18 are respectively connected to middle portions of four sides of the upper cover 112, and bottom ends of the four suspension elements 181 are respectively connected to middle portions of four sides of the chip anti-shake movable carrier 121, so that the four suspension elements 181 of the suspension 18 can cooperate with each other to ensure that the chip anti-shake movable portion 12 translates and/or rotates stably in the housing cavity 1101 of the chip anti-shake fixing portion 11. At this time, each of the chip anti-shake coils 132 of the chip anti-shake driving section 13 is disposed at each corner of the chip anti-shake movable section 12, respectively, to form avoidance.

It should be noted that the type of the suspension element 181 of the suspension 18 is not limited in the camera module of the present invention, and for example, the suspension element 181 may be a suspension wire, a spring, a shrapnel, a fold line body, or the like. Unlike the camera module shown in fig. 21A to 22B, in this modified example of the camera module shown in fig. 25, the chip driving assembly 10 may not be provided with the chip anti-shake magnet member 15 and the chip anti-shake balls 122 may not be provided between the chip anti-shake movable carrier 121 and the upper cover 112. Specifically, similar to the camera module shown in fig. 24, in this specific example of the camera module shown in fig. 25, the chip driving assembly 10 suspends the chip anti-shake movable portion 12 in the accommodation chamber 1101 of the chip anti-shake fixing portion 11 by the suspending portion 18.

Alternatively, in other examples of the camera module of the present invention, the chip driving assembly 10 includes two suspension portions 18, wherein the top ends of the suspension elements 181 of one suspension portion 18 are connected to the upper cover 112, the bottom ends are connected to the chip anti-shake movable carrier 121, the top ends of the suspension elements 181 of the other suspension portion 18 are connected to the chip anti-shake movable carrier 1212, and the bottom ends are connected to the base 111, so that the two suspension portions 18 cooperate with each other to be able to suspend the chip anti-shake movable portion 12 in the housing cavity 1101 of the chip anti-shake fixing portion 11.

Fig. 26 shows another preferred example of the camera module of the present invention, the chip anti-shake magnetic attraction member 15 is disposed on the chip anti-shake movable portion 12, and the chip anti-shake magnetic attraction member 15 and the chip anti-shake magnet 131 correspond to each other to generate magnetic attraction in the Z-axis direction so that the chip anti-shake movable portion 12 has a tendency to approach the upper cover 112 of the chip anti-shake fixing portion 11, wherein the top ends of the suspension elements 181 of the suspension portion 18 are connected to the chip anti-shake movable carrier 121 of the chip anti-shake movable portion 12, and the bottom ends are connected to the base 111 of the chip anti-shake fixing portion 11 to prevent the chip anti-shake movable portion 12 from moving in the direction of the chip anti-shake fixing portion 11, in such a manner that the chip anti-shake movable portion 12 can be suspended in the receiving chamber 1101 of the chip anti-shake fixing portion 11.

Fig. 27A to 29B show the current direction and the force direction of each of the chip anti-shake coils 132 of the chip anti-shake driving section 13 when the chip anti-shake movable section 12 translates in the X-axis direction, translates in the Y-axis direction, and rotates around the Z-axis direction, in which the first coil 1321 and the second coil 1322 are connected in series, the third coil 1323 and the fourth coil 1324 are connected in series, and the fifth coil 1325 and the sixth coil 1326 are connected in series.

Referring to fig. 27A and 27B, when the first coil 1321 is energized with a clockwise current and the second coil 1322 is energized with a counterclockwise current, the first coil 1321 and the second coil 1322 receive lorentz force under the action of a magnetic field, so that the chip anti-shake movable portion 12 drives the photosensitive assembly 30 to translate along the negative direction of the X axis to compensate, so as to implement the translation anti-shake of the camera module in the X axis direction.

With continued reference to fig. 27A, arrow I indicates the current direction and symbol F indicates the stress condition of the chip anti-shake coil 132. In the process of translational anti-shake in the X-axis direction, the magnitudes of currents flowing through the first coil 1321 and the second coil 1322 are the same, and at this time, the magnitudes of stresses of the first coil 1321 and the second coil 1322 are the same and the directions are the same.

Conversely, when the first coil 1321 is energized with a counterclockwise current and the second coil 1322 is energized with a clockwise current, the first coil 1321 and the second coil 1322 are subjected to lorentz force under the action of the magnetic field, so that the chip anti-shake movable portion 12 drives the photosensitive assembly 30 to translate along the positive direction of the X axis to compensate, so as to realize the translation anti-shake of the image capturing module in the X axis direction.

Referring to fig. 28A and 28B, when the third coil 1323 is energized with a clockwise current, the fourth coil 1324 is energized with a counterclockwise current, the fifth coil 1325 is energized with a clockwise current, and the sixth coil 1326 is energized with a counterclockwise current, the third coil 1323, the fourth coil 1324, the fifth coil 1325, and the sixth coil 1326 are subjected to lorentz force under the action of a magnetic field, so that the chip anti-shake movable portion 12 drives the photosensitive assembly 30 to translate along the positive direction of the Y axis to compensate, so as to implement the translation anti-shake of the image capturing module in the Y axis direction.

With continued reference to fig. 28A, arrow I indicates the current direction and symbol F indicates the stress condition of the chip anti-shake coil 132. In the process of the translational shake prevention in the Y-axis direction, the magnitudes of currents flowing through the third coil 1323, the fourth coil 1324, the fifth coil 1325 and the sixth coil 1326 are the same, and at this time, the magnitudes of stresses of the third coil 1323, the fourth coil 1324, the fifth coil 1325 and the sixth coil 1326 are the same and the directions are the same.

Conversely, when the third coil 1323 is energized with a counterclockwise current, the fourth coil 1324 is energized with a clockwise current, the fifth coil 1325 is energized with a counterclockwise current, and the sixth coil 1326 is energized with a clockwise current, the third coil 1323, the fourth coil 1324, the fifth coil 1325, and the sixth coil 1326 are subjected to lorentz force under the action of the magnetic field, so that the chip anti-shake movable portion 12 drives the photosensitive assembly 30 to translate along the negative direction of the Y axis to compensate, so as to implement the translation anti-shake of the camera module in the Y axis direction.

Referring to fig. 29A and 29B, when the third coil 1323 is energized with a clockwise current, the fourth coil 1324 is energized with a counterclockwise current, the fifth coil 1325 is energized with a counterclockwise current, and the sixth coil 1326 is energized with a clockwise current, the third coil 1323, the fourth coil 1324, the fifth coil 1325, and the sixth coil 1326 are subjected to lorentz force under the action of a magnetic field, so that the chip anti-shake movable portion 12 drives the photosensitive assembly 30 to rotate clockwise around the Z axis direction to compensate, so as to implement rotational anti-shake in the Z axis direction of the camera module.

With continued reference to fig. 29A, arrow I indicates the current direction and symbol F indicates the stress condition of the chip anti-shake coil 132. In the process of rotation anti-shake in the Z-axis direction, the currents flowing into the third coil 1323 and the fifth coil 1325 are the same and opposite in direction, the currents flowing into the fourth coil 1324 and the sixth coil 1326 are the same and opposite in direction, so that the second coil group 134 located on the fourth chip side 324 of the photosensitive element 32 and the third coil group 135 located on the second chip side 322 of the photosensitive element 32 are stressed by the same magnitude but opposite in direction, that is, the fifth coil 1325 and the sixth coil 1326 located on the second chip side 322 of the photosensitive element 32 are stressed by the force along the negative direction of the Y-axis, and the third coil 1323 and the fourth coil 1324 located on the fourth chip side 324 of the photosensitive element 32 are stressed by the force along the positive direction of the Y-axis, thereby realizing the rotation movement of the chip anti-shake movable portion 12 around the Z-axis direction, and further realizing the rotation anti-shake of the camera module.

Conversely, when the third coil 1323 is energized with a counterclockwise current, the fourth coil 1324 is energized with a clockwise current, the fifth coil 1325 is energized with a clockwise current, and the sixth coil 1326 is energized with a reverse pointer current, the third coil 1323, the fourth coil 1324, the fifth coil 1325, and the sixth coil 1326 are subjected to lorentz force under the action of a magnetic field, so that the chip anti-shake movable portion 12 drives the photosensitive assembly 30 to rotate counterclockwise around the Z axis direction to compensate, thereby realizing the rotation anti-shake in the Z axis direction of the camera module.

Further, when the chip anti-shake movable portion 12 drives the photosensitive assembly 30 to translate along the X-axis direction, the first sensing element 161 can sense a significant magnetic field change and feed back the magnetic field change. When the chip anti-shake movable portion 12 drives the photosensitive assembly 30 to translate along the Y-axis direction and rotate around the Z-axis direction, the first sensing element 161 fails to sense a significant magnetic field change, the second sensing element 162 and the third sensing element 163 can sense a significant magnetic field change, an average value of the sum of the sensing values of the second sensing element 162 and the third sensing element 163 is taken as a compensation value for the magnetic field change translated along the Y-axis direction, and an average value of the difference of the sensing values of the second sensing element 162 and the third sensing element 163 is taken as a compensation value for the magnetic field change rotated around the Z-axis direction, wherein the sensing value is positive in the positive direction and negative in the negative direction.

Fig. 30 shows a modified example of the camera module of the present invention, unlike the camera module shown in fig. 1 to 12 in which the lens driving base 440 of the lens driving assembly 40 is attached to the upper cover 112 of the chip driving assembly 10, in this specific example of the camera module shown in fig. 30, the lens driving assembly 40 may not have the lens driving base 440, but the lens driving housing 450 of the lens driving assembly 40 is directly attached to the upper cover 112 of the chip driving assembly 10, so that the height dimension of the camera module can be further reduced.

It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are by way of example only and are not limiting. The objects of the present invention have been fully and effectively achieved. The functional and structural principles of the present invention have been shown and described in the examples and embodiments of the invention may be modified or practiced without departing from the principles described.

Claims

1. A lens driving assembly, comprising:

a lens focusing magnetism isolating unit;

a lens focusing outer frame;

2. The lens driving assembly according to claim 1, wherein the lens focusing magnetism blocking unit blocks at least three-fourths of an area of the lens focusing magnet.

3. The lens driving assembly according to claim 1, further comprising at least one lens focusing magnetically permeable unit disposed at the lens focusing inner frame, and the lens focusing magnetically permeable unit and the lens focusing magnet are corresponding to each other.

4. The lens driving assembly according to claim 1, further comprising a lens driving base and a lens driving housing mounted to the lens driving base to form an accommodating space between the lens driving housing and the lens driving base, wherein the lens focusing outer frame, the lens focusing inner frame and the lens focusing carrier are held in the accommodating space.

5. The lens driving assembly of claim 4, wherein the lens driving housing is a non-magnetically conductive stainless steel material.

6. The lens driving base of claim 4, further comprising a base magnetic shielding element, wherein the base magnetic shielding element is disposed on the lens driving base.

7. The lens driving assembly according to any one of claims 1 to 6, further comprising a lens anti-shake driving unit, wherein the lens anti-shake driving unit comprises at least two lens anti-shake magnets and at least two lens anti-shake coils corresponding to each other, the lens anti-shake magnets being disposed on the lens anti-shake carrier, the lens anti-shake coils being disposed on the lens focusing inner frame.

8. The lens driving assembly of claim 7, further comprising at least one lens anti-shake magnet unit and a lens anti-shake support unit, wherein the lens anti-shake magnet unit is disposed at a top of a lens anti-shake inner frame of the lens anti-shake inner frame, and the lens anti-shake magnet unit and the lens anti-shake magnet correspond to each other so as to generate a magnetic attraction force therebetween in a height direction, wherein the lens anti-shake support unit is disposed between the lens anti-shake carrier and the top of the lens focusing inner frame so as to suspend the lens anti-shake carrier in the accommodation chamber of the lens focusing inner frame.

9. The lens driving assembly of claim 8, wherein the lens anti-shake supporting unit comprises at least three lens anti-shake rails and at least three lens anti-shake balls, wherein each of the lens anti-shake rails comprises a lower groove rail and an upper groove rail, the lower groove rail is formed on a carrier top surface of the lens anti-shake carrier, the upper groove rail is formed on an inner frame bottom surface of the lens focusing inner frame, the lower groove rail and the upper groove rail correspond to each other and extend in directions perpendicular to each other, and the bottom and the top of the lens anti-shake balls are rollably held on the lower groove rail and the upper groove rail, respectively.

10. The lens driving assembly according to any one of claims 1 to 6, further comprising at least one lens focusing magnetic attraction unit and a lens focusing support unit, wherein the lens focusing magnetic attraction unit is disposed at the lens focusing outer frame, and the lens focusing magnetic attraction unit and the lens focusing magnet correspond to each other so that a magnetic attraction force in a horizontal direction is generated therebetween, wherein the lens focusing support unit is disposed between the lens focusing outer frame and the lens focusing inner frame side portion of the lens focusing inner frame so as to suspend the lens focusing inner frame side of the lens focusing outer frame.

11. The lens driving assembly of claim 10, wherein the lens focusing support unit comprises at least two lens focusing rails and at least two lens anti-shake balls, wherein each of the lens focusing rails comprises an inner groove rail and an outer groove rail, the inner groove rail is formed at a side of the lens focusing inner frame, the outer groove rail is formed at the lens focusing outer frame, the inner groove rail and the outer groove rail correspond to each other and have the same extending direction, wherein the inner and outer parts of the lens focusing balls are rollably held at the inner groove rail and the outer groove rail, respectively.

12. The lens driving assembly according to claim 7, wherein the lens anti-shake driving unit comprises two lens anti-shake magnets, and an angle formed between extension directions of the two lens anti-shake magnets is smaller than 180 °.

13. The lens driving assembly according to claim 7, wherein the lens anti-shake driving unit includes four lens anti-shake magnets, two of the lens anti-shake magnets being disposed side by side on a far side of the lens anti-shake carrier, and the other two of the lens anti-shake magnets being disposed on both sides of the lens anti-shake carrier, respectively.

14. The lens driving assembly according to claim 7, wherein a height position of the lens anti-shake magnet is lower than a height position of the lens focusing magnet.

15. The lens driving assembly according to claim 14, wherein a center of the lens anti-shake magnet is higher than a center of the lens focusing magnet.

16. A camera module, its characterized in that includes:

a photosensitive component;

a lens driving assembly, wherein the lens driving assembly further comprises:

A lens focusing magnetism isolating unit;

a lens focusing outer frame;

17. The camera module of claim 16, further comprising a chip driving assembly, the photosensitive assembly being drivably disposed on the chip driving assembly, wherein the chip driving assembly is disposed below the lens driving assembly.

18. The camera module of claim 17, wherein the lens drive assembly further comprises a lens drive base and a lens drive housing, the lens drive housing being mounted to the lens drive base to form a receiving space between the lens drive housing and the lens drive base, wherein the lens focus outer frame, the lens focus inner frame, and the lens focus carrier are retained in the receiving space.

19. The camera module of claim 18, wherein the lens driving housing is a non-magnetically permeable stainless steel material.

20. The camera module of claim 18, wherein the lens driving assembly further comprises a base magnetically isolated element, wherein the base magnetically isolated element is disposed on the lens driving base.

21. The camera module of claim 17, wherein the chip drive assembly further comprises:

at least one chip anti-shake magnetic conduction component;

22. The camera module of claim 18, wherein the chip drive assembly further comprises:

at least one chip anti-shake magnetic conduction component;

23. The camera module of claim 21, wherein the chip anti-shake magnet conductive member is disposed at the chip anti-shake fixing portion, the chip anti-shake magnet being disposed at the chip anti-shake magnet conductive member such that the chip anti-shake magnet is disposed at the chip anti-shake fixing portion through the chip anti-shake magnet conductive member.

24. The camera module of claim 22, wherein the chip anti-shake fixing portion comprises a base and an upper cover, the base and the upper cover being snappingly mounted, wherein the chip magnetic conductive member is disposed on the upper cover, and the chip anti-shake magnet is disposed on the chip anti-shake magnetic conductive member.

25. The camera module of claim 24, wherein the upper cover and the lens drive base are mounted; alternatively, the upper cover and the lens driving base are integrated.