CN116093734A - Laser chip aging monitoring device based on double MPDs (MPDs) monitoring - Google Patents

Abstract

The invention relates to the field of laser chip detection, in particular to a laser chip aging monitoring device based on dual MPD monitoring. The laser chip aging monitoring device includes a laser chip carrier, an MPD chip carrier, a coupling lens holder and a base; wherein, the laser chip carrier and two MPD chip carriers are respectively arranged side by side on the base; the coupling lens holder includes two The MPD chip carrier is loaded with an MPD chip, and the laser chip carrier is loaded with a laser chip to be monitored. The beneficial effect of the present invention is that, compared with the prior art, the present invention provides a laser chip aging monitoring device, which can quickly, conveniently and accurately realize the aging monitoring of the laser chip, and provide aging function and testing for the type selection of the laser chip to be tested. Function.

Description

A laser chip aging monitoring device based on dual MPD monitoring

technical field

The invention relates to the field of laser chip detection, in particular to a laser chip aging monitoring device based on dual MPD monitoring.

Background technique

In the development of optical communication products, it is often necessary to select laser chips, and it is necessary to verify laser chips from different manufacturers, or different styles of laser chips from the same manufacturer.

The current detection device, on the one hand, is difficult to take into account the aging and monitoring functions, and on the other hand, the disassembly and assembly of the laser chip is also very troublesome, which is not conducive to popularization.

Contents of the invention

The technical problem to be solved by the present invention is to provide a laser chip aging monitoring device based on dual MPD monitoring in view of the above-mentioned defects of the prior art, which solves the problem that it is difficult to take care of aging and monitoring functions on the one hand, and that the disassembly and assembly of the laser chip is difficult on the other hand. Very troublesome, not conducive to the problem of promotion.

The technical solution adopted by the present invention to solve the technical problem is: provide a laser chip aging monitoring device based on dual MPD monitoring, the laser chip aging monitoring device includes a laser chip carrier, an MPD chip carrier, a coupling lens bracket and a base; wherein,

The laser chip carrier and the two MPD chip carriers are respectively arranged side by side on the base, and the laser chip carrier is arranged between the two MPD chip carriers;

The coupling lens bracket includes two legs, and the coupling lenses are arranged on the two legs, and are fixed on the base and respectively arranged between the laser chip carrier and an MPD chip carrier;

The MPD chip carrier is loaded with an MPD chip, and the laser chip carrier is loaded with a laser chip to be monitored. After the laser chip is powered on, it generates a laser beam and emits it in two directions, forward and backward. One beam is coupled to an MPD chip through a coupling lens. And another light beam is coupled to another MPD chip through another coupling lens.

Among them, the preferred solution is: the base is provided with the first gold-plated wiring and the second gold-plated wiring as the electrical signal line of the laser chip, and the two pads of the laser chip are bound to the first gold-plated wiring and the second gold-plated wiring through gold wires. On the second gold-plated wiring; or, the laser chip carrier is provided with a first conductive layer, a pad of the laser chip is connected to the first conductive layer, and is bound to the first gold-plated wiring by a gold wire, and the other welding pad of the laser chip is connected to the first conductive layer. The pad is bonded to a second gold-plated trace with gold wire.

Wherein, the preferred scheme is: the base is provided with the third gold-plated wiring and the fourth gold-plated wiring as the MPD chip acquisition circuit, the MPD chip carrier is provided with the fifth gold-plated wiring and the sixth gold-plated wiring, the MPD chip The two pads are bound to the fifth gold-plated trace and the sixth gold-plated trace through gold wires. When the MPD chip carrier is fixed to the base, the fifth gold-plated trace is connected to the third gold-plated trace, and the sixth The gold-plated trace is connected to the fourth gold-plated trace.

Among them, the preferred solution is: when the MPD chip carrier is fixed to the base, the fifth gold-plated wiring is connected to the third gold-plated wiring through conductive glue, and the sixth gold-plated wiring is connected to the fourth gold-plated wiring through conductive glue. .

Among them, the preferred solution is: the MPD chip carrier includes a first end face fixed with the base and a second end face for installing the MPD chip, the first end face and the second end face are two vertical end faces, the fifth gold-plated wiring and the second end face The six gold-plated traces are all routed along the first end surface and the second end surface.

Among them, the preferred solution is: the coupling lens bracket is a U-shaped structure, the legs are the two sides of the U-shaped structure, mounting holes are provided on the legs, and the coupling lens is installed in the mounting hole or at the hole; wherein, the MPD chip The receiving end face, the coupling lens and the emitting port of the laser chip are on the same straight line.

Among them, a preferred solution is: a collimating lens is arranged in the direction of the support feet facing the laser chip carrier, and a coupling lens is arranged in the direction of the support feet facing the MPD chip carrier.

Among them, the preferred solution is: the ratio of the forward light emission and the back light emission of the laser chip is X:Y; wherein, X/Y is greater than 1.

The beneficial effect of the present invention is that, compared with the prior art, the present invention provides a laser chip aging monitoring device, which can quickly, conveniently and accurately realize the aging monitoring of the laser chip, and provide aging function and testing for the type selection of the laser chip to be tested. Function.

Description of drawings

The present invention will be further described below in conjunction with accompanying drawing and embodiment, in the accompanying drawing:

Fig. 1 is a schematic structural view of a laser chip aging monitoring device of the present invention;

Fig. 2 is a side structural schematic diagram of a laser chip aging monitoring device of the present invention;

Fig. 3 is the structural representation of laser chip carrier and laser chip of the present invention;

Fig. 4 is the structural representation of MPD chip carrier and MPD chip of the present invention;

Fig. 5 is a structural schematic diagram of the coupling lens holder of the present invention;

Fig. 6 is a schematic structural view of the base of the present invention.

Detailed ways

Now in conjunction with the accompanying drawings, the preferred embodiments of the present invention will be described in detail.

As shown in FIG. 1 and FIG. 2 , the present invention provides a preferred solution of an aging monitoring device for a laser chip 120 .

A laser chip 120 aging monitoring device based on dual MPD monitoring, the laser chip 120 aging monitoring device includes a laser chip carrier 110, an MPD chip carrier 210, a coupling lens holder 300 and a base 400; wherein, the laser chip carrier 110 and two MPD chips The carriers 210 are arranged side by side on the base 400 respectively, and the laser chip carrier 110 is arranged between the two MPD chip carriers 210; the coupling lens holder 300 includes two legs 310, and the coupling lens 311 is arranged on the two legs 310, and fixed On the base 400 and respectively arranged between the laser chip carrier 110 and an MPD chip carrier 210; the MPD chip carrier 210 is loaded with the MPD chip 220, the laser chip carrier 110 is loaded with the laser chip 120 to be monitored, and the laser chip 120 is placed on After electrification, laser beams are generated and emitted in forward and backward directions respectively. One beam is coupled to an MPD chip 220 through a coupling lens 311 , and the other beam is coupled to another MPD chip 220 through another coupling lens 311 .

Specifically, the laser chip 120 to be monitored is installed on the laser chip carrier 110 first, as the aging monitoring object of the laser chip 120 aging monitoring device, to realize the aging function and testing function, specifically, the laser chip 120 can be energized and aged, At the same time, the laser chip 120 is tested for various required parameters, the parameters of the laser are obtained through the MPD chip 220, and the changes in performance parameters are obtained. Time, some require to be carried out at a specific temperature, this process is called the aging of the laser chip 120, through aging, the performance of the laser chip 120 (such as luminous power, threshold current and other parameters) will change or crack. Of course, the aging test belongs to the conventional testing scheme, and the main improvement of the present invention is to provide a laser chip 120 aging monitoring device, which can quickly, conveniently and accurately realize the aging monitoring of the laser chip 120, and provide aging control for the type selection of the laser chip 120 to be tested. function and test function.

Using the base 400 as the fixing and electrical connection of each functional component, the laser chip carrier 110 and the two MPD chip carriers 210 are arranged side by side on the base 400 respectively, and the laser chip carrier 110 is arranged between the two MPD chip carriers 210, and the base 400 is provided with various routing structures, which are respectively electrically connected to the laser chip 120 on the laser chip carrier 110, and continuously powers up the laser chip 120, so that the laser chip 120 can generate laser light after power-on; on the other hand, the MPD is continuously obtained The signal collected by the chip 220 , the MPD chip 220 obtains the laser beam emitted by the laser chip 120 , so as to judge the parameter change of the laser chip 120 . Wherein, the MPD is a monitor photodiode. After the laser beam of the laser chip 120 is incident on the light-receiving end surface 221 of the MPD, internal parameters of the laser, such as optical power, are obtained.

And, in order to facilitate optical path setting and light convergence, that is, the laser beam of the laser chip 120 is converged onto the MPD chip 220 , the optical path between the laser chip 120 and the MPD chip 220 is established through the coupling lens holder 300 . According to the relative position distance of the two MPD chips 220 and the laser chip 120, the positions of the two feet 310 of the coupling lens holder 300 are constructed, so that two optical paths are directly set through the coupling lens holder 300, that is, the two feet of the coupling lens holder 300 310 are respectively inserted between the laser chip 120 and any one MPD chip 220, so that the laser chip 120, the legs 310 and the MPD chip 220 are in a straight line, preferably, two MPD chips 220, two legs 310 and the laser chip 120 are set on a straight line.

The specific working method is as follows: after the laser chip 120 is installed on the laser chip carrier 110, other functional modules are also installed, that is, the laser chip carrier 110, the MPD chip carrier 210, and the coupling lens holder 300 are all arranged on the base 400 and the circuit connections are also completed. After the setting is completed, the base 400 is connected to the relevant external detection devices and power supply, continuously powers up the laser chip 120 and detects the parameter data collected by the MPD chip 220; The front and rear two laser emission ports of the chip 120 emit outwards, one light beam is coupled to an MPD chip 220 through a coupling lens 311, and the other light beam is coupled to another MPD chip 220 through another coupling lens 311, by obtaining two parameter information of each MPD chip 220, so as to obtain the parameter changes of the two laser beams.

In one embodiment, the light emitting ratio of the laser chip 120 from the forward direction to the rear direction is X:Y; wherein, X/Y is greater than 1. Preferably, the light output ratio of the laser chip 120 is 7:3, and the output power of the laser chip 120 is the forward output light. This is caused by the characteristics of the laser chip 120, and because of the characteristics of the laser chip 120, the double MPD chip 220 of the present application is used to monitor the dual laser beams simultaneously. Further, the photosensitivity of the two MPD chips 220 can be properly adjusted according to the ratio of light emitted to improve detection accuracy.

As shown in FIG. 3 and FIG. 6 , the present invention provides a preferred embodiment in which a first gold-plated trace 410 and a second gold-plated trace 420 are disposed on the base 400 .

The base 400 is provided with a first gold-plated wiring 410 and a second gold-plated wiring 420 as the electrical signal lines of the laser chip 120, and the external control circuit and the laser chip 120 are realized through the first gold-plated wiring 410 and the second gold-plated wiring 420. Specifically provide two sets of connection schemes for the electrical connection between them.

Option 1, the two pads of the laser chip 120 are bound to the first gold-plated wiring 410 and the second gold-plated wiring 420 through gold wires. For connection, the two pads of the laser chip 120 are respectively connected to the corresponding first gold-plated wiring 410 and the second gold-plated wiring 420 through gold wires, and the conductive efficiency is improved through gold wire binding, which is also convenient for connection operations.

Solution 2, the laser chip carrier 110 is provided with a first conductive layer, a pad of the laser chip 120 is connected to the first conductive layer, and is bound to the first gold-plated wiring 410 through a gold wire, and the other pad of the laser chip 120 is It is bound to the second gold-plated trace 420 through a gold wire. Compared with the first solution, the second solution is to use the laser chip carrier 110 as a conductor, and connect the first conductive layer to a pad 121 of the laser chip 120 by setting the first conductive layer, and increase the distance between the two gold wires during the actual connection process. , to facilitate the binding of gold wires and place interference between two gold wires.

As shown in FIG. 4 and FIG. 6 , the present invention provides a preferred embodiment in which a third gold-plated trace 430 and a fourth gold-plated trace 440 are disposed on the base 400 .

The base 400 is provided with the third gold-plated wiring 430 and the fourth gold-plated wiring 440 as the acquisition circuit of the MPD chip 220, the MPD chip carrier 210 is provided with the fifth gold-plated wiring 231 and the sixth gold-plated wiring 232, and the MPD chip 220 The two pads are bound to the fifth gold-plated wire 231 and the sixth gold-plated wire 232 through the gold wire 10, and when the MPD chip carrier 210 is fixed to the base 400, the fifth gold-plated wire 231 and the third gold-plated wire The wire 430 is connected, and connects the sixth gold-plated wire 232 with the fourth gold-plated wire 440 .

Since the laser chip 120 is constantly replaced to test different laser chips 120, it is more appropriate to need gold wire bonding after the laser chip 120 is replaced, and the MPD chip carrier 210 and the MPD chip 220 are necessary structures for the testing process, so It is not necessary to disassemble the structure, so in actual use, the MPD chip carrier 210 can be directly provided with the fifth gold-plated wiring 231 and the sixth gold-plated wiring 232, and the two pads of the MPD chip 220 are bound to the sixth gold-plated wiring through the gold wire 10. On the fifth gold-plated wire 231 and the sixth gold-plated wire 232, the MPD chip carrier 210 is directly connected to the third gold-plated wire 430 through the fifth gold-plated wire 231, and is connected to the fourth gold-plated wire 440 through the sixth gold-plated wire 232. The connection is to realize the connection between the MPD chip 220 and the third gold-plated wire 430 and the fourth gold-plated wire 440 to realize data collection.

In one embodiment, when the MPD chip carrier 210 is fixed to the base 400, the fifth gold-plated wire 231 and the third gold-plated wire 430 are connected by conductive glue, and the sixth gold-plated wire 232 is connected to the fourth gold-plated wire. 440 is connected by conductive glue, the conductive glue is preferably silver glue, and it is pasted by a patch method to improve the electrical connection performance of the two. In this way, as long as the MPD chip carrier 210 and the MPD chip 220 are connected and fixed, the follow-up only needs to It only needs to install the MPD chip carrier 210, and the overall installation method is relatively simple, fast and convenient.

In one embodiment, the MPD chip carrier 210 includes a first end surface fixed to the base 400 and a second end surface on which the MPD chip 220 is mounted, the first end surface and the second end surface are two vertical end surfaces, and the fifth gold-plated wiring 231 and the sixth gold-plated wiring 232 are both laid along the first end surface and the second end surface. By making the fifth gold-plated wires 231 and the sixth gold-plated wires 232 be arranged along two vertical end faces, patch mounting can be directly realized when the MPD chip carrier 210 is fixed, and at the same time, the MPD chip 220 can also be placed upright. The laser beam of the laser chip 120 is accurately incident on the light-receiving end surface 221 of the MPD chip 220 .

As shown in FIG. 5 , the present invention provides a preferred embodiment in which the coupling lens holder 300 is a U-shaped structure.

The coupling lens holder 300 is a U-shaped structure, and the legs 310 are the two sides of the U-shaped structure. Mounting holes are provided on the legs 310, and the coupling lens 311 is installed in the mounting holes or at the opening; wherein, the light of the MPD chip 220 The receiving end face 221 , the coupling lens 311 and the output port of the laser chip 120 are on the same straight line. The arrangement of the coupling lens holder 300 facilitates the direct establishment of the overall optical path, especially when replacing the laser chip 120 , it is convenient for disassembly and assembly.

A collimating lens 312 is disposed on the supporting leg 310 toward the laser chip carrier 110 , and a coupling lens 311 is disposed on the direction toward the MPD chip carrier 210 of the supporting leg 310 . Specifically, the laser beam sent by the laser chip 120 is sequentially collimated by the collimator lens 312 , coupled by the coupling lens 311 , and incident on the MPD chip 220 of the MPD chip carrier 210 .

The above are only the best embodiments of the present invention, and are not used to limit the scope of the present invention. All equivalent changes or modifications made according to the patent scope of the present invention are covered by the present invention.

Claims (8)

1. A laser chip aging monitoring device based on dual MPD monitoring, characterized in that, the laser chip aging monitoring device comprises a laser chip carrier, an MPD chip carrier, a coupling lens support and a base; wherein, The laser chip carrier and the two MPD chip carriers are respectively arranged side by side on the base, and the laser chip carrier is arranged between the two MPD chip carriers; The coupling lens bracket includes two legs, and the coupling lenses are arranged on the two legs, and are fixed on the base and respectively arranged between the laser chip carrier and an MPD chip carrier; The MPD chip carrier is loaded with an MPD chip, and the laser chip carrier is loaded with a laser chip to be monitored. After the laser chip is powered on, the laser beam is generated and emitted in two directions forward and backward respectively. The lens is coupled to one MPD chip, and another said light beam is coupled to another MPD chip through another coupling lens. 2. The laser chip aging monitoring device according to claim 1, characterized in that: the base is provided with a first gold-plated wire and a second gold-plated wire as the electrical signal line of the laser chip, and the laser chip's The two pads are bound to the first gold-plated wiring and the second gold-plated wiring through gold wires; or, the laser chip carrier is provided with a first conductive layer, and a pad of the laser chip is connected to the first conductive layer , and is bound to the first gold-plated wiring through a gold wire, and the other pad of the laser chip is bound to the second gold-plated wiring through a gold wire. 3. The laser chip aging monitoring device according to claim 1, characterized in that: the base is provided with the third gold-plated wiring and the fourth gold-plated wiring as the MPD chip acquisition circuit, and the MPD chip carrier is laid There are the fifth gold-plated wiring and the sixth gold-plated wiring, the two pads of the MPD chip are bound to the fifth gold-plated wiring and the sixth gold-plated wiring through gold wires, and the MPD chip carrier is fixed to the base When connecting the fifth gold-plated wire to the third gold-plated wire, and connect the sixth gold-plated wire to the fourth gold-plated wire. 4. The laser chip aging monitoring device according to claim 3, characterized in that: when the MPD chip carrier is fixed to the base, the fifth gold-plated wiring and the third gold-plated wiring are connected by conductive glue, and the second The sixth gold-plated wire is connected to the fourth gold-plated wire through conductive glue. 5. The laser chip aging monitoring device according to claim 3 or 4, characterized in that: the MPD chip carrier includes a first end face fixed to the base and a second end face for installing the MPD chip, the first end face Two end faces perpendicular to the second end face, the fifth gold-plated trace and the sixth gold-plated trace are laid along the first end face and the second end face. 6. The laser chip aging monitoring device according to claim 1, characterized in that: the coupling lens bracket is a U-shaped structure, the legs are the two sides of the U-shaped structure, and mounting holes are provided on the legs , the coupling lens is installed in the installation hole or at the hole; wherein, the receiving end surface of the MPD chip, the coupling lens and the output port of the laser chip are on the same straight line. 7. The laser chip aging monitoring device according to claim 1 or 6, wherein a collimating lens is arranged in the direction of the legs toward the laser chip carrier, and the coupling lens is arranged in the direction of the legs toward the MPD chip carrier . 8 . The laser chip aging monitoring device according to claim 1 , characterized in that: the ratio of forward light emission and back light emission of the laser chip is X:Y; wherein X/Y is greater than 1. 9 .

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