CN116090146A - Method and device for determining junction temperature curve of chip, electronic equipment and storage medium - Google Patents
Method and device for determining junction temperature curve of chip, electronic equipment and storage medium Download PDFInfo
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Abstract
The method, the device, the electronic equipment and the storage medium for determining the junction temperature curve of the chip determine the first thermal impedance model parameter of the chip based on the vehicle speed information; and determining a real-time power loss of the chip based on the electrical parameter; inputting the first thermal impedance model parameters and the real-time power loss into a preset Foster model, and determining a first real-time temperature rise curve of a radiator table corresponding to the chip; determining a second real-time temperature rise curve of the chip at the junction of the chip shell and the radiator, and determining a third real-time temperature rise curve of the chip at the junction of the chip shell and the radiator; determining a fourth real-time temperature rise curve of the chip based on the first real-time temperature rise curve, the second real-time temperature rise curve and the third real-time temperature rise curve; and determining a junction temperature curve of the chip based on the fourth real-time temperature rise curve and the cooling working medium temperature.
Description
Technical Field
The present disclosure relates to the field of rail transit technologies, and in particular, to a method and apparatus for determining a junction temperature curve of a chip, an electronic device, and a storage medium.
Background
In the prior art, when the junction temperature of a device is calculated or the device is selected, the junction temperature is calculated according to a steady-state thermal path model mostly when the heat radiation resistance is unchanged under the assumption that the heating power of the device is constant. This is not a true reflection of the true junction temperature of the device at the time of actual operation. And the adopted radiator radiates heat by means of running wind generated in the running process of the vehicle aiming at the running wind-cooled converter IGBT module. Because the wind speed changes along with the speed of the vehicle, the performance of the radiator changes along with the speed of the vehicle, the method provided in the prior art has low precision when calculating the junction temperature of the chip of the running air-cooled converter IGBT module, and causes large type selection margin when performing devices.
Disclosure of Invention
In order to solve the above problems, the present application provides a method, an apparatus, an electronic device, and a storage medium for determining a junction temperature curve of a chip.
The application provides a method for determining a junction temperature curve of a chip, which comprises the following steps:
acquiring speed information of a train, cooling working medium temperature of a running air-cooled converter of the train and electrical parameters of a chip of the running air-cooled converter; determining a first thermal impedance model parameter of a radiator table corresponding to the chip based on the vehicle speed information; and determining a real-time power loss of the chip based on the electrical parameter;
Inputting the first thermal impedance model parameters and the real-time power loss into a preset Foster model, and determining a first real-time temperature rise curve of a radiator table corresponding to the chip;
determining a second real-time temperature rise curve of the chip at the junction of the chip shell and the radiator, and determining a third real-time temperature rise curve of the chip at the junction of the chip shell and the radiator; determining a fourth real-time temperature rise curve of the chip based on the first real-time temperature rise curve, the second real-time temperature rise curve and the third real-time temperature rise curve;
and determining a junction temperature curve of the chip based on the fourth real-time temperature rise curve and the cooling working medium temperature.
In some embodiments, the determining, based on the vehicle speed information, a first thermal impedance model parameter of a radiator mesa corresponding to the chip includes:
and determining a first thermal impedance model parameter of the chip based on the vehicle speed information and a first corresponding relation between the pre-established vehicle speed information and the second thermal impedance model parameter.
In some embodiments, the method further comprises:
measuring wind speed distribution information of the surface of a radiator of the running air-cooled converter under different vehicle speed information;
determining a second corresponding relation between the wind speed distribution information and different vehicle speed information;
Acquiring temperature rise curves of the chips at the table top of the radiator under different vehicle speed information, wherein the temperature rise curves are obtained through experiments under the condition that the power loss is preset loss and the wind speed distribution information is met;
fitting calculation is carried out by adopting the Foster model based on the temperature rise curve, so that second thermal impedance model parameters of the radiator table corresponding to the chip under different vehicle speed information are obtained;
and establishing a first corresponding relation between different vehicle speed information and the second thermal impedance model parameter.
In some embodiments, the determining a second real-time temperature rise profile at the crust of the chip comprises:
acquiring reference thermal impedance model parameters of the chip crusting place;
and inputting the reference thermal impedance model parameters and the real-time power loss at the chip crusting position into the Foster model to determine a second real-time temperature rise curve at the chip crusting position.
In some embodiments, the determining a third real-time temperature rise profile of a junction of the shell of the chip and the heat sink includes:
acquiring parameters of heat conducting materials at the joint of the shell of the chip and the radiator;
determining a reference thermal impedance model parameter at the junction of the shell of the chip and the heat sink based on the thermally conductive material parameter;
And inputting the reference thermal impedance model parameters and the real-time power loss based on the connection position of the shell of the chip and the radiator into the Foster model, and determining a third real-time temperature rise curve of the connection position of the shell of the chip and the radiator.
In some embodiments, the Foster model is;
wherein DeltaT is a temperature rise curve, P is power loss, and the thermal impedance model parameter is R 1 …R n And τ 1 …τ n N is the order of a steady-state model, R n Is thermal resistance τ n Is a time constant.
In some embodiments, the method further comprises:
recommending a chip model based on a junction temperature curve of a chip under the condition that the speed information of the train, the temperature of a cooling working medium and the electrical parameters of the chip of the running air-cooled converter are simulation data;
and under the condition that the speed information of the train, the temperature of the cooling working medium and the electrical parameters of the chip of the running air-cooled converter are measured data, transmitting a junction temperature curve of the chip to a monitoring system.
The embodiment of the application provides a device for determining a junction temperature curve of a chip, which comprises the following steps:
the first acquisition module is used for acquiring speed information of a train, cooling working medium temperature of a running air-cooled converter of the train and electrical parameters of a chip of the running air-cooled converter;
The first determining module is used for determining first thermal impedance model parameters of the radiator table corresponding to the chip based on the vehicle speed information; and determining a real-time power loss of the chip based on the electrical parameter;
the second determining module is used for inputting the first thermal impedance model parameters and the real-time power loss into a preset Foster model and determining a first real-time temperature rise curve of a radiator table corresponding to the chip;
the third determining module is used for determining a second real-time temperature rise curve of the crusting position of the chip and determining a third real-time temperature rise curve of the connecting position of the shell of the IGBT chip and the radiator;
a fourth determining module, configured to determine a fourth real-time temperature rise curve of the chip based on the first real-time temperature rise curve, the second real-time temperature rise curve, and the third real-time temperature rise curve;
and a fifth determining module, configured to determine a junction temperature curve of the IGBT chip based on the fourth real-time temperature rise curve and the cooling medium temperature.
The embodiment of the application provides electronic equipment, which comprises a memory and a processor, wherein the memory is stored with a computer program, and the computer program executes the method for determining the junction temperature curve of the chip according to any one of the above when being executed by the processor.
Embodiments of the present application provide a storage medium storing a computer program executable by one or more processors for implementing a method for determining a junction temperature curve of a chip according to any one of the above.
According to the method, the device, the electronic equipment and the storage medium for determining the chip junction temperature curve, speed information of a train, cooling working medium temperature of a running air-cooled converter of the train and electrical parameters of a chip of the running air-cooled converter are obtained; determining a first thermal impedance model parameter of the chip based on the vehicle speed information; and determining a real-time power loss of the chip based on the electrical parameter; inputting the first thermal impedance model parameters and the real-time power loss into a preset Foster model, and determining a first real-time temperature rise curve of a radiator table corresponding to the chip; determining a second real-time temperature rise curve of the chip at the junction of the chip shell and the radiator, and determining a third real-time temperature rise curve of the chip at the junction of the chip shell and the radiator; determining a fourth real-time temperature rise curve of the chip based on the first real-time temperature rise curve, the second real-time temperature rise curve and the third real-time temperature rise curve; and finally, determining a junction temperature curve of the chip based on the fourth real-time temperature rise curve and the cooling working medium temperature, so that the calculation accuracy of the junction temperature of the chip of the running air-cooled converter can be improved.
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The present application will be described in more detail hereinafter based on embodiments and with reference to the accompanying drawings.
Fig. 1 is a schematic implementation flow chart of a method for determining a junction temperature curve of a chip according to an embodiment of the present application;
fig. 2 is a schematic implementation flow chart for establishing a first correspondence according to an embodiment of the present application;
fig. 3 is a schematic structural diagram of a device for determining a junction temperature curve of a chip according to an embodiment of the present application;
fig. 4 is a schematic diagram of a composition structure of an electronic device according to an embodiment of the present application.
In the drawings, like parts are given like reference numerals, and the drawings are not drawn to scale.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the present application more apparent, the present application will be described in further detail with reference to the accompanying drawings, and the described embodiments should not be construed as limiting the present application, and all other embodiments obtained by those skilled in the art without making any inventive effort are within the scope of the present application.
In the following description, reference is made to "some embodiments" which describe a subset of all possible embodiments, but it is to be understood that "some embodiments" can be the same subset or different subsets of all possible embodiments and can be combined with one another without conflict.
If a similar description of "first\second\third" appears in the application document, the following description is added, in which the terms "first\second\third" are merely distinguishing between similar objects and do not represent a particular ordering of the objects, it being understood that the "first\second\third" may be interchanged in a particular order or precedence, where allowed, so that the embodiments of the application described herein can be implemented in an order other than that illustrated or described herein.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing embodiments of the present application only and is not intended to be limiting of the present application.
Before describing a method for determining a junction temperature curve of a chip provided in an embodiment of the present application, a brief description will be given of problems in the related art and in the related art.
Based on the problems existing in the related art, the embodiment of the application provides a method for determining a junction temperature curve of a chip, and the method is applied to electronic equipment, such as a computer, a mobile terminal and the like. The function implemented by the method for determining a chip junction temperature curve provided in the embodiment of the present application may be implemented by calling a program code by a processor of an electronic device, where the program code may be stored in a computer storage medium, and fig. 1 is a schematic implementation flow diagram of the method for determining a chip junction temperature curve provided in the embodiment of the present application, and as shown in fig. 1, includes:
Step S101, acquiring speed information of a train, cooling medium temperature of a running air-cooled converter of the train and electric parameters of a chip of the running air-cooled converter.
In the embodiment of the application, the train can be an urban rail train, a high-speed train and the like. The train adopts a running air-cooled converter, namely, the IGBT module is radiated through a running air-cooled radiator, and the chips in the IGBT module comprise IGBT chips and diode chips. The IGBT module is arranged on a table board arranged on the radiator. In the embodiment of the application, for the running air-cooled radiator, the cooling air of the radiator changes in real time in the running process of the vehicle, and the performance of the radiator, namely the thermal impedance model changes in real time.
In this embodiment of the present application, the cooling medium temperature is the temperature of the cooling medium adopted by the radiator, and in this embodiment of the present application, the cooling medium is usually air, i.e. the cooling medium temperature may be regarded as the air temperature. In some embodiments, the cooling medium may also be a cooling fluid.
In an embodiment of the present application, the electrical parameter may include: voltage, current, power, etc.
In the embodiment of the application, the electronic equipment can acquire the speed information of the train, the cooling working medium temperature of the running air-cooled converter of the train and the electrical parameters of the IGBT chip of the running air-cooled converter through the input of the input equipment, wherein the input equipment can be a keyboard, a mouse, voice input equipment and the like; the input of the external storage device can be used for obtaining the data, and the external storage device can be a U disk, a mechanical hard disk and the like; or may be obtained by means of network reception, such as the internet, a local area network; or may be obtained by reading local data, etc.
In some embodiments, the electronic device may be connected to the collecting device, and obtain, through the collecting device, vehicle speed information of the train, a cooling medium temperature of a running air-cooled converter of the train, and an electrical parameter of a chip of the running air-cooled converter.
In this embodiment of the present application, the speed information of the train, the temperature of the cooling working medium, and the electrical parameters of the IGBT chip of the running air-cooled converter may be simulation data, and in some embodiments, the speed information of the train, the temperature of the cooling working medium, and the electrical parameters of the chip of the running air-cooled converter may be measured data.
In this embodiment of the present application, the chip may be a diode chip, an IGBT chip, or any other chip.
Step S102, determining a first thermal impedance model parameter of a radiator table corresponding to the chip based on the vehicle speed information; and determining a real-time power loss of the chip based on the electrical parameter.
In this embodiment of the present application, a correspondence between vehicle speed information and a second thermal impedance model parameter is pre-stored in an electronic device, and after determining the vehicle speed information, the first thermal impedance model parameter of the radiator mesa corresponding to the chip may be determined based on the vehicle speed information and a first correspondence between the pre-established vehicle speed information and the second thermal impedance model parameter.
In the embodiment of the application, the real-time power loss of the chip can be calculated based on the electrical parameters.
Step S103, inputting the first thermal impedance model parameters and the real-time power loss into a preset Foster model, and determining a first real-time temperature rise curve of a radiator table corresponding to the chip.
In this embodiment of the present application, the preset Foster model is predetermined, a temperature rise curve at the surface of the radiator table may be obtained through an experiment, and then the initial Foster model parameters are trained through a fitting curve determined by the initial Foster model and a temperature rise curve at the surface of the radiator table obtained through the experiment, so that the approach degree between the training of the fitting curve and the training of the temperature rise curve at the surface of the radiator table obtained through the experiment, that is, the fitting degree is greater than a preset value, where the preset value may be 99%. The Foster model is described in expression (1);
wherein, the liquid crystal display device comprises a liquid crystal display device,delta T is temperature rise curve, P is power loss, and thermal impedance model parameter is R 1 …R n And τ 1 …τ n N is the order, R n Is thermal resistance τ n Is a time constant.
In this embodiment of the present application, n is an order, and when a fitting curve and an experiment acquire a temperature rise curve at a radiator table top to fit, when a degree of approach between the fitting curve and the experiment acquire the temperature rise curve at the radiator table top, that is, a fitting degree is greater than a preset value, n takes a minimum value, so that computational complexity can be reduced.
In this embodiment of the present application, the Foster model may be considered as a model of a calculation relationship among parameters of a reaction temperature rise curve, a power loss and a thermal impedance model, and after any two parameters are determined, other corresponding parameters may be calculated.
In this embodiment of the present application, after the first thermal impedance model parameter and the real-time power loss are determined, a first real-time temperature rise curve of the radiator mesa corresponding to the chip may be obtained by calculation.
Step S104, determining a second real-time temperature rise curve of the chip at the junction of the shell and the radiator, and determining a third real-time temperature rise curve of the chip at the junction of the shell and the radiator.
In this embodiment of the present application, in view of the vehicle speed information, the cooling working medium temperature of the running air-cooled converter of the train, and the electrical parameters of the chip of the running air-cooled converter being measured data, the element information of the converter is determined, and the second real-time temperature rise curve at the crusting position of the chip may be stored in the electronic device by performing calculation in advance, and at the same time, the third real-time temperature rise curve at the junction of the shell of the chip and the radiator may also be predetermined and stored in the electronic device.
In some embodiments, for the case that the vehicle speed information, the cooling medium temperature of the running air-cooled converter of the train and the electrical parameters of the chip of the running air-cooled converter are simulation data, a second real-time temperature rise curve of the crusted part of the chip can be determined according to the parameters of the running air-cooled converter used in simulation, and a third real-time temperature rise curve of the junction of the shell of the chip and the radiator can be determined.
Step S105, determining a fourth real-time temperature rise curve of the chip based on the first real-time temperature rise curve, the second real-time temperature rise curve and the third real-time temperature rise curve.
In this embodiment of the present application, a fourth real-time temperature rise curve of the chip may be calculated according to the thermal network model based on the first real-time temperature rise curve, the second real-time temperature rise curve, and the third real-time temperature rise curve.
Illustratively, when the chip is a diode chip, a fourth real-time temperature profile of the diode chip can be represented by the following expression (2):
z D (t)＝u(t)+v D (t)+w(t) (2)；
wherein z is D (t) is the fourth real-time temperature curve of the diode chip, u (t) is the first real-time temperature rise curve, v D And (t) is a second real-time temperature rise curve, and w (t) is a third real-time temperature rise curve.
When the chip is an IGBT chip, a fourth real-time temperature profile of the IGBT chip can be expressed by expression (3):
z J (t)＝u(t)+v J (t)+w(t) (3)；
wherein z is J (t) is a fourth real-time temperature curve of the IGBT chip, u (t) is a first real-time temperature rise curve, v J And (t) is a second real-time temperature rise curve, and w (t) is a third real-time temperature rise curve.
And S106, determining a junction temperature curve of the chip based on the fourth real-time temperature rise curve and the cooling working medium temperature.
For a traveling air-cooled radiator, the cooling medium temperature is air temperature, typically approximately ambient temperature, and for a cold liquid radiator, the cooling medium temperature is coolant temperature.
With the above example in mind, when the chip is an IGBT chip, determining the junction temperature curve of the chip based on the fourth real-time temperature rise curve and the cooling medium temperature may be calculated by expression (4):
Z J (t)＝z J (t)+T(t) (4)；
wherein Z is J And (T) is the junction temperature curve of the IGBT chip, and T (T) is the temperature of the cooling working medium.
When the chip is a diode chip, determining a junction temperature curve of the chip based on the fourth real-time temperature rise curve and the cooling medium temperature, and calculating by an expression (5):
Z D (t)＝z D (t)+T(t) (5)；
wherein Z is D And (T) is the junction temperature curve of the diode chip, and T (T) is the temperature of the cooling working medium.
According to the method for determining the chip junction temperature curve, speed information of a train, cooling working medium temperature of a running air-cooled converter of the train and electric parameters of a chip of the running air-cooled converter are obtained; determining a first thermal impedance model parameter of the chip based on the vehicle speed information; and determining a real-time power loss of the chip based on the electrical parameter; inputting the first thermal impedance model parameters and the real-time power loss into a preset Foster model, and determining a first real-time temperature rise curve of a radiator table corresponding to the chip; determining a second real-time temperature rise curve of the chip at the junction of the chip shell and the radiator, and determining a third real-time temperature rise curve of the chip at the junction of the chip shell and the radiator; determining a fourth real-time temperature rise curve of the chip based on the first real-time temperature rise curve, the second real-time temperature rise curve and the third real-time temperature rise curve; and finally, determining a junction temperature curve of the chip based on the fourth real-time temperature rise curve and the cooling working medium temperature, so that the calculation accuracy of the junction temperature of the chip of the running air-cooled converter can be improved.
In some embodiments, before step S102 "determine the first thermal impedance model parameter of the radiator mesa corresponding to the chip based on the vehicle speed information", the step of establishing the first correspondence is performed, and fig. 2 is a schematic implementation flow diagram for establishing the first correspondence, as shown in fig. 2, including:
Step S1, measuring wind speed distribution information of the surface of a radiator of the running air-cooled converter under different vehicle speed information.
In the embodiment of the application, a plurality of wind speed test points are arranged on the surface of the radiator and used for testing and representing the wind speed distribution of the radiator. And actually measuring wind speed distribution information of each test point under different vehicle speed information.
S2, determining a second corresponding relation between wind speed distribution information and different vehicle speed information;
in the embodiment of the application, the wind speed distribution information and different vehicle speed information can be further discretized, so that a second corresponding relation between the wind speed distribution information and the vehicle speed information can be established; the second correspondence is found in expression (6):
v 1 ＝f 1 (V)，v 2 ＝f 2 (V)，…，v n ＝f n (V)(6)；
in the formula, v 1 ，v 2 ，…，v n And the vehicle speed is the vehicle speed of the wind speed test point, and V is the actual vehicle speed information.
In the actual test process, different vehicle speed working conditions are tested as much as possible, and the test vehicle speed interval is reduced. Meanwhile, the air flow is unstable, and the wind speed at the same speed can be disturbed to a certain extent. Therefore, it is necessary to extend the test time as much as possible, and determine the value having the maximum probability of occurrence of the wind speed distribution value at a specific vehicle speed as the wind speed distribution at that vehicle speed by means of big data analysis.
If the wind speed v of a specific test point p p The relation of the corresponding vehicle speed V has an inverse function, such as an expression (7), namely when the actual wind speed of the test point is known, the corresponding vehicle speed V can be unique, and then the wind speeds of all other wind speed test points can be determined. Therefore, the corresponding relation can be simplified, and after simplification, the expression (8) is referred, namely, the wind speed of the point is used for establishing a one-to-one corresponding relation with the vehicle speed, so that the data of all other wind speed test points are determined:
and step S3, acquiring temperature rise curves of the chips at the table top of the radiator under different vehicle speed information, wherein the temperature rise curves are obtained through experiments under the condition that the power loss is preset loss and the wind speed distribution information is met.
In the present embodiment, 1 thermoelectric arrangement is arranged at each of the mesas of the heat spreader, i.e., at the positions directly under the m elements, when obtained through experiments. According to the lumped parameter method, the position represents the temperature of the radiator table surface at the element, and the position with the maximum theoretical analysis element substrate temperature can be corresponding to the position, or the position with the average theoretical analysis as the substrate temperature can be corresponding to the position. The heating blocks with the same area are used for replacing elements, and a test air duct, a fan and the like are adjusted, so that the wind speed distribution of the radiator in the laboratory environment is consistent with the on-site wind speed distribution as much as possible, and the wind speed distribution is met. And respectively testing temperature rise curves of the m element radiator table tops under the condition of preset loss P at different vehicle speeds.
And S4, carrying out fitting calculation by adopting the Foster model based on the temperature rise curve to obtain second thermal impedance model parameters of the radiator table surface corresponding to the chip under different vehicle speed information.
In the embodiment of the application, according to the temperature rise curve, the following n-order Foster model is respectively used for fitting, so that the characteristic parameters R of m elements under different vehicle speeds can be obtained 1 …R n ，τ 1 …τ n : for expression of the Foster model see (9):
in the expression, delta T is a temperature rise curve, P is power loss, and the thermal impedance model parameter is R 1 …R n And τ 1 …τ n N is the order, R n Is thermal resistance τ n As a function of the time constant,under the condition that the closeness between the fitted curve and the actually measured curve, namely the fitting degree is larger than a preset value (for example, 99%), n is the minimum value, n is the order, and t is the time. Namely, the computational complexity is reduced under the condition of meeting the application requirements.
And S5, establishing a first corresponding relation between different vehicle speed information and the second thermal impedance model parameters.
In the embodiment of the application, the n-order Foster model characteristic parameters R of m elements 1 …R n ，τ 1 …τ n Under the condition of vehicle speed determination, there is a uniquely determined value. The first correspondence between the second thermal impedance characteristic parameter of each element and the different vehicle speed information can be represented by functional relations (10) and (11), see the functional relations:
R 1 ＝g 1 (V)，R 2 ＝g 2 (V)，…，R n ＝g n (V) (10)；
τ 1 ＝h 1 (V)，τ 2 ＝h 2 (V)，…，τ n ＝h n (V) (11)；
The functional relation formulas (10) and (11) can be represented by a numerical list, and when the functional relation formulas are called, the characteristic parameter values under the specific vehicle speed can be obtained by adopting a difference method, and the functional relation formulas can also be fitted into a mathematical expression to directly calculate the thermal impedance characteristic parameter values under the specific vehicle speed.
Meanwhile, if the relation between the wind speed information of a specific test point p and the vehicle speed information has an inverse function, the parameters R, tau and the characteristic point vehicle speed v can be deduced and established p Namely, a first correspondence of different vehicle speed information with the second thermal impedance model parameter, the first correspondence being referred to expressions (12) and (13), as follows:
in some embodiments, step S104, determining a second real-time temperature rise profile at the crust of the chip may be accomplished by:
step S41, obtaining reference thermal impedance model parameters at the chip crust.
In the embodiment of the application, the reference thermal impedance model parameters of the chip of the device can be detected through the device manual and then input into the electronic equipment, so that the electronic equipment acquires the reference thermal impedance model parameters.
And step S42, inputting the reference thermal impedance model parameters and the real-time power loss at the chip crusting position into the Foster model to determine a second real-time temperature rise curve at the chip crusting position.
In some embodiments, step S104, and determining a third real-time temperature rise curve at the junction of the shell of the chip and the heat sink may be implemented by:
step S43, obtaining heat conduction material parameters of the joint of the shell of the chip and the radiator;
illustratively, the thermally conductive material may be a thermally conductive silicone grease.
Step S44, determining reference thermal impedance model parameters of the connection part of the shell of the chip and the radiator based on the heat conduction material parameters.
And step S45, inputting the real-time power loss into the Foster model based on the reference thermal impedance model parameters of the connection part of the shell of the chip and the radiator, and determining a third real-time temperature rise curve of the connection part of the shell of the chip and the radiator.
In some embodiments, after step S105, the method further comprises:
step S106, recommending a chip model based on a junction temperature curve of a chip under the condition that the speed information of the train, the temperature of a cooling working medium and the electrical parameters of the chip of the running air-cooled converter are simulation data;
step S107, under the condition that the speed information of the train, the temperature of the cooling working medium and the electrical parameters of the chip of the running air-cooled converter are measured data, the junction temperature curve of the chip is sent to a monitoring system.
According to the method for determining the junction temperature curve of the chip, the wind speed distribution at the running air-cooled radiator is achieved through actually measuring different vehicle speeds in the running process of the vehicle. And determining the corresponding relation between the wind speed distribution and the vehicle speed V from the angle with the maximum occurrence probability by adopting an analysis means of the big data based on a large amount of data obtained by the test. Therefore, the influence of numerous uncertainty factors such as weather, road conditions and the like on the test result is weakened. Through experimental simulation, the wind speed distribution on the surface of the radiator is as consistent as possible with the vehicle speed distribution, and the temperature rise curve corresponding to a specific vehicle speed under the condition that the heating power is constant at P is tested; fitting the temperature rise curve according to the Foster model to obtain a characteristic parameter R 1 …R n ，τ 1 …τ n The characteristic parameters of the m test positions represent the heat dissipation effects of different positions of the radiator at a specific vehicle speed; characteristic parameter R 1 …R n ，τ 1 …τ n The corresponding relation with the vehicle speed V is expressed by a functional relation; based on the real-time speed of the line, the characteristic parameter R under any speed can be obtained according to a difference method or by directly substituting into a function expression 1 …R n ，τ 1 …τ n The method comprises the steps of carrying out a first treatment on the surface of the Based on the real-time characteristic parameters, according to the Foster model, a temperature rise response curve of the temperature rise at the table surface of the radiator to the real-time loss P can be obtained. And decomposing the heat transfer link according to the analysis of the thermal path model, and obtaining the real-time response of the temperature rise of the chip junction-shell to the real-time loss, and the real-time response of the temperature rise of the shell-radiator to the real-time loss. And combining the temperature rise response curves of different links of heat transfer to obtain a chip temperature rise response curve. In the embodiment of the application, a steady-state temperature rise curve is obtained through actually measured wind speed distribution and laboratory simulation, and the corresponding relation between the vehicle speed and the heat dissipation effect is built based on different vehicle speed Foster models, so that the chip temperature rise curve under the complex working conditions of vehicle speed change and heating loss change is obtained.
The method for determining the junction temperature curve of the chip provided by the embodiment of the invention adopts a big data analysis method, combines test and test simulation, and combines actual measurement and theoretical analysis to realize rapid and accurate calculation of the junction temperature of the chip. The method can be used for calculating a chip real-time junction temperature curve based on the electrical simulation line data during design, and making reference to device model selection. The method can be used for calculating the real-time junction temperature of the chip based on actually measured line data (such as vehicle speed, voltage, current and the like) and feeding the real-time junction temperature back to a monitoring system when the vehicle runs. The method can also be used for analyzing the service life of the device, analyzing the real-time state of the junction temperature of the device based on a large amount of collected line real-time data, and analyzing the service life of the device by combining a device service life prediction model.
Based on the foregoing embodiments, the embodiments of the present application provide a device for determining a junction temperature curve of a chip, where each module included in the device and each unit included in each module may be implemented by a processor in a computer device; of course, the method can also be realized by a specific logic circuit; in practice, the processor may be a central processing unit (CPU, central Processing Unit), a microprocessor (MPU, microprocessor Unit), a digital signal processor (DSP, digital Signal Processing), or a field programmable gate array (FPGA, field Programmable Gate Array), or the like.
An embodiment of the present application provides a device for determining a junction temperature curve of a chip, and fig. 3 is a schematic structural diagram of the device for determining a junction temperature curve of a chip provided in the embodiment of the present application, as shown in fig. 3, a device 300 for determining a junction temperature curve of a chip includes:
the first obtaining module 301 is configured to obtain speed information of a train, a cooling medium temperature of a running air-cooled converter of the train, and an electrical parameter of a chip of the running air-cooled converter;
a first determining module 302, configured to determine a first thermal impedance model parameter of a radiator mesa corresponding to the chip based on the vehicle speed information; and determining a real-time power loss of the chip based on the electrical parameter;
a second determining module 303, configured to input the first thermal impedance model parameter and the real-time power loss to a preset Foster model, and determine a first real-time temperature rise curve of a radiator mesa corresponding to the chip;
a third determining module 304, configured to determine a second real-time temperature rise curve at a junction of the shell of the chip, and determine a third real-time temperature rise curve at a junction of the shell of the IGBT chip and the heat sink;
a fourth determining module 305, configured to determine a fourth real-time temperature rise curve of the chip based on the first real-time temperature rise curve, the second real-time temperature rise curve, and the third real-time temperature rise curve;
And a fifth determining module 306, configured to determine a junction temperature curve of the IGBT chip based on the fourth real-time temperature rise curve and the cooling medium temperature.
In some embodiments, the first determination module 302 includes:
and the first determining unit is used for determining the first thermal impedance model parameters of the radiator table corresponding to the chip based on the vehicle speed information and the first corresponding relation between the pre-established vehicle speed information and the second thermal impedance model parameters.
In some embodiments, the apparatus 300 for determining a junction temperature curve of a chip further includes:
the measuring module is used for measuring the wind speed distribution information of the surface of the radiator of the running air-cooled converter under different vehicle speed information;
the sixth determining module is used for determining a second corresponding relation between the wind speed distribution information and different vehicle speed information;
the acquisition module is used for acquiring temperature rise curves of the chips at the table top of the radiator under different vehicle speed information, wherein the temperature rise curves are obtained through experiments under the condition that the power loss is preset loss and the wind speed distribution information is met;
the fitting module is used for carrying out fitting calculation by adopting the Foster model based on the temperature rise curve to obtain second thermal impedance model parameters of the radiator table surface corresponding to the chip under different vehicle speed information;
The building module is used for building a first corresponding relation between different vehicle speed information and the second thermal impedance model parameters.
In some embodiments, the third determination module 304 includes:
the first acquisition unit is used for acquiring reference thermal impedance model parameters at the chip crust;
and the first calculation unit is used for inputting the reference thermal impedance model parameters at the chip crusting position and the real-time power loss into the Foster model to determine a second real-time temperature rise curve at the chip crusting position.
In some embodiments, the third determination module 304 further comprises:
the second acquisition unit is used for acquiring heat conduction material parameters of the joint of the shell of the chip and the radiator;
a second calculation unit for determining a reference thermal impedance model parameter at the junction of the shell of the chip and the heat sink based on the thermally conductive material parameter;
and the third calculation unit is used for inputting the real-time power loss into the Foster model based on the reference thermal impedance model parameters of the connection position of the shell of the chip and the radiator, and determining a third real-time temperature rise curve of the connection position of the shell of the chip and the radiator.
In some embodiments, the Foster model is; 
Wherein DeltaT is a temperature rise curve, P is power loss, and the thermal impedance model parameter is R 1 …R n And τ 1 …τ n N is the order, R n Is thermal resistance τ n Is a time constant.
In some embodiments, the apparatus 300 for determining a junction temperature curve of a chip further includes:
the recommending module is used for recommending the model of the chip based on the junction temperature curve of the chip under the condition that the speed information of the train, the temperature of the cooling working medium and the electrical parameters of the chip of the running air-cooled converter are simulation data;
and the sending module is used for sending the junction temperature curve of the chip to the monitoring system under the condition that the speed information of the train, the temperature of the cooling working medium and the electrical parameters of the chip of the running air-cooled converter are measured data.
In the embodiment of the present application, if the method for determining development parameters described above is implemented in the form of a software functional module, and sold or used as a separate product, the method may also be stored in a computer readable storage medium. Based on such understanding, the technical solutions of the embodiments of the present application may be essentially or partly contributing to the prior art, and the computer software product may be stored in a storage medium, and include several instructions to cause a computer device (which may be a personal computer, a server, or a network device, etc.) to execute all or part of the methods described in the embodiments of the present application. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read Only Memory (ROM), a magnetic disk, an optical disk, or other various media capable of storing program codes. Thus, embodiments of the present application are not limited to any specific combination of hardware and software.
Accordingly, an embodiment of the present application provides a storage medium having a computer program stored thereon, wherein the computer program, when executed by a processor, implements the steps in the method for determining a junction temperature curve of a chip provided in the above embodiment.
The embodiment of the application provides electronic equipment; fig. 4 is a schematic diagram of a composition structure of an electronic device according to an embodiment of the present application, as shown in fig. 4, the electronic device 400 includes: a processor 401, at least one communication bus 402, a user interface 403, at least one external communication interface 404, a memory 405. Wherein communication bus 402 is configured to enable connected communications between these components. The user interface 403 may include a display screen, and the external communication interface 404 may include a standard wired interface and a wireless interface, among others. The processor 401 is configured to execute a program for determining a chip junction temperature curve stored in a memory, so as to implement the steps in the method for determining a chip junction temperature curve provided in the above-described embodiment.
The description of the electronic device and the storage medium embodiments above is similar to that of the method embodiments described above, with similar advantageous effects as the method embodiments. For technical details not disclosed in the embodiments of the computer apparatus and the storage medium of the present application, please refer to the description of the method embodiments of the present application.
It should be appreciated that reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment of the present application. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. It should be understood that, in various embodiments of the present application, the sequence numbers of the foregoing processes do not mean the order of execution, and the order of execution of the processes should be determined by the functions and internal logic thereof, and should not constitute any limitation on the implementation process of the embodiments of the present application. The foregoing embodiment numbers of the present application are merely for describing, and do not represent advantages or disadvantages of the embodiments.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
In the several embodiments provided in this application, it should be understood that the disclosed apparatus and method may be implemented in other ways. The above described device embodiments are only illustrative, e.g. the division of the units is only one logical function division, and there may be other divisions in practice, such as: multiple units or components may be combined or may be integrated into another system, or some features may be omitted, or not performed. In addition, the various components shown or discussed may be coupled or directly coupled or communicatively coupled to each other via some interface, whether indirectly coupled or communicatively coupled to devices or units, whether electrically, mechanically, or otherwise.
The units described above as separate components may or may not be physically separate, and components shown as units may or may not be physical units; can be located in one place or distributed to a plurality of network units; some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
In addition, each functional unit in each embodiment of the present application may be integrated in one processing unit, or each unit may be separately used as one unit, or two or more units may be integrated in one unit; the integrated units may be implemented in hardware or in hardware plus software functional units.
Those of ordinary skill in the art will appreciate that: all or part of the steps for implementing the above method embodiments may be implemented by hardware related to program instructions, and the foregoing program may be stored in a computer readable storage medium, where the program, when executed, performs steps including the above method embodiments; and the aforementioned storage medium includes: a mobile storage device, a Read Only Memory (ROM), a magnetic disk or an optical disk, or the like, which can store program codes.
Alternatively, the integrated units described above may be stored in a computer readable storage medium if implemented in the form of software functional modules and sold or used as a stand-alone product. Based on such understanding, the technical solutions of the embodiments of the present application may be essentially or partly contributing to the prior art, embodied in the form of a software product stored in a storage medium, comprising several instructions for causing a controller to execute all or part of the methods described in the embodiments of the present application. And the aforementioned storage medium includes: various media capable of storing program codes, such as a removable storage device, a ROM, a magnetic disk, or an optical disk.
The foregoing is merely an embodiment of the present application, but the protection scope of the present application is not limited thereto, and any person skilled in the art can easily think about changes or substitutions within the technical scope of the present application, and the changes and substitutions are intended to be covered in the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (10)
1. The method for determining the junction temperature curve of the chip is characterized by comprising the following steps of:
acquiring speed information of a train, cooling working medium temperature of a running air-cooled converter of the train and electrical parameters of a chip of the running air-cooled converter; determining a first thermal impedance model parameter of a radiator table corresponding to the chip based on the vehicle speed information; and determining a real-time power loss of the chip based on the electrical parameter;
inputting the first thermal impedance model parameters and the real-time power loss into a preset Foster model, and determining a first real-time temperature rise curve of a radiator table corresponding to the chip;
determining a second real-time temperature rise curve of the chip at the junction of the chip shell and the radiator, and determining a third real-time temperature rise curve of the chip at the junction of the chip shell and the radiator; determining a fourth real-time temperature rise curve of the chip based on the first real-time temperature rise curve, the second real-time temperature rise curve and the third real-time temperature rise curve;
And determining a junction temperature curve of the chip based on the fourth real-time temperature rise curve and the cooling working medium temperature.
2. The method of claim 1, wherein determining the first thermal impedance model parameters of the corresponding heat spreader mesa of the chip based on the vehicle speed information comprises:
and determining a first thermal impedance model parameter of the radiator mesa corresponding to the chip based on the vehicle speed information and a first corresponding relation between the pre-established vehicle speed information and the second thermal impedance model parameter.
3. The method according to claim 2, wherein the method further comprises:
measuring wind speed distribution information of the surface of a radiator of the running air-cooled converter under different vehicle speed information;
determining a second corresponding relation between the wind speed distribution information and different vehicle speed information;
acquiring temperature rise curves of the chips at the table top of the radiator under different vehicle speed information, wherein the temperature rise curves are obtained through experiments under the condition that the power loss is preset loss and the wind speed distribution information is met;
fitting calculation is carried out by adopting the Foster model based on the temperature rise curve, so that second thermal impedance model parameters of the radiator table corresponding to the chip under different vehicle speed information are obtained;
And establishing a first corresponding relation between different vehicle speed information and the second thermal impedance model parameter.
4. The method of claim 1, wherein the determining a second real-time temperature rise profile at the encrustation of the chip comprises:
acquiring reference thermal impedance model parameters of the chip crusting place;
and inputting the reference thermal impedance model parameters and the real-time power loss at the chip crusting position into the Foster model to determine a second real-time temperature rise curve at the chip crusting position.
5. The method of claim 1, wherein determining a third real-time temperature rise profile of a junction of a shell of a chip and the heat sink comprises:
acquiring parameters of heat conducting materials at the joint of the shell of the chip and the radiator;
determining a reference thermal impedance model parameter at the junction of the shell of the chip and the heat sink based on the thermally conductive material parameter;
and inputting the reference thermal impedance model parameters and the real-time power loss based on the connection position of the shell of the chip and the radiator into the Foster model, and determining a third real-time temperature rise curve of the connection position of the shell of the chip and the radiator.
6. The method of claim 1, wherein the Foster model is;
Wherein DeltaT is a temperature rise curve, P is power loss, and the thermal impedance model parameter is R 1 …R n And τ 1 …τ n N is the order, R n Is thermal resistance τ n Is a time constant.
7. The method according to claim 1, wherein the method further comprises:
recommending a chip model based on a junction temperature curve of a chip under the condition that the speed information of the train, the temperature of a cooling working medium and the electrical parameters of the chip of the running air-cooled converter are simulation data;
and under the condition that the speed information of the train, the temperature of the cooling working medium and the electrical parameters of the chip of the running air-cooled converter are measured data, transmitting a junction temperature curve of the chip to a monitoring system.
8. A device for determining a junction temperature profile of a chip, comprising:
the first acquisition module is used for acquiring speed information of a train, cooling working medium temperature of a running air-cooled converter of the train and electrical parameters of a chip of the running air-cooled converter;
the first determining module is used for determining first thermal impedance model parameters of the radiator table corresponding to the chip based on the vehicle speed information; and determining a real-time power loss of the chip based on the electrical parameter;
The second determining module is used for inputting the first thermal impedance model parameters and the real-time power loss into a preset Foster model and determining a first real-time temperature rise curve of a radiator table corresponding to the chip;
the third determining module is used for determining a second real-time temperature rise curve of the chip at the junction of the shell and the radiator;
a fourth determining module, configured to determine a fourth real-time temperature rise curve of the chip based on the first real-time temperature rise curve, the second real-time temperature rise curve, and the third real-time temperature rise curve;
and a fifth determining module, configured to determine a junction temperature curve of the chip based on the fourth real-time temperature rise curve and the cooling medium temperature.
9. An electronic device comprising a memory and a processor, the memory having stored thereon a computer program which, when executed by the processor, performs a method of determining a chip junction temperature profile as claimed in any one of claims 1 to 7.
10. A storage medium storing a computer program executable by one or more processors for implementing a method of determining a junction temperature profile of a chip as claimed in any one of claims 1 to 7.
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