CN116075092A - Rear cover of electronic equipment, manufacturing method of rear cover and electronic equipment - Google Patents

Rear cover of electronic equipment, manufacturing method of rear cover and electronic equipment Download PDF

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Publication number
CN116075092A
CN116075092A CN202310042428.1A CN202310042428A CN116075092A CN 116075092 A CN116075092 A CN 116075092A CN 202310042428 A CN202310042428 A CN 202310042428A CN 116075092 A CN116075092 A CN 116075092A
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China
Prior art keywords
layer
appearance
graphene oxide
rear cover
electronic device
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CN202310042428.1A
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Chinese (zh)
Inventor
陈义
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Honor Device Co Ltd
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Honor Device Co Ltd
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Priority to CN202310042428.1A priority Critical patent/CN116075092A/en
Publication of CN116075092A publication Critical patent/CN116075092A/en
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/047—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material made of fibres or filaments
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/03—Covers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/106—Carbon fibres, e.g. graphite fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/546—Flexural strength; Flexion stiffness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment

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  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)

Abstract

The application provides a rear cover of electronic equipment, a manufacturing method of the rear cover and the electronic equipment, and relates to the technical field of electronic equipment. The ceramic rear cover is used for solving the problems of low bending strength and high quality of the ceramic rear cover; and the carbon fiber rear cover has poor heat dissipation effect, rough surface texture and poor hand feeling, so that the problem of influencing user experience is caused. The rear cover of the electronic device comprises an appearance layer, a reinforcing layer and a heat conduction bonding layer. The appearance layer has an inner surface. The reinforcing layer and the appearance layer are stacked and arranged on one side close to the inner surface. The heat conduction bonding layer is arranged between the appearance layer and the reinforcing layer, and is used for enabling the appearance layer to be fixedly bonded with the reinforcing layer and transferring heat between the appearance layer and the reinforcing layer.

Description

Rear cover of electronic equipment, manufacturing method of rear cover and electronic equipment
Technical Field
The application relates to the technical field of electronic equipment, in particular to a rear cover of electronic equipment, a manufacturing method of the rear cover and the electronic equipment.
Background
The back cover of the electronic device is often made of ceramic material or carbon fiber material. The ceramic material has the advantages of high hardness, good thermal shock resistance, fast heat dissipation, strong wear resistance, smooth appearance, good hand feeling and the like. The carbon fiber material has the advantages of light weight, high bending strength and the like.
However, ceramic materials have lower flexural strength and greater overall mass. The carbon fiber material has poor heat dissipation effect, rough surface texture and poor hand feeling. Therefore, the rear cover made of two materials has certain disadvantages, which affect the user experience.
Disclosure of Invention
The embodiment of the application provides a rear cover of electronic equipment, a manufacturing method thereof and the electronic equipment, which are used for solving the problems of low bending strength and high quality of the ceramic rear cover; and the carbon fiber rear cover has poor heat dissipation effect, rough surface texture and poor hand feeling, so that the problem of influencing user experience is caused.
In order to achieve the above purpose, the embodiments of the present application adopt the following technical solutions:
in a first aspect, a back cover for an electronic device is provided that includes an appearance layer, a reinforcing layer, and a thermally conductive bonding layer. The appearance layer has an inner surface. The reinforcing layer and the appearance layer are stacked and arranged on one side close to the inner surface. The heat conduction bonding layer is arranged between the appearance layer and the reinforcing layer, and is used for enabling the appearance layer to be fixedly bonded with the reinforcing layer and transferring heat between the appearance layer and the reinforcing layer.
The application first aspect provides an electronic equipment's back lid, this back lid have outward appearance layer and enhancement layer, and the outward appearance layer can promote whole pleasing to the eye, is favorable to promoting user's use feel to promote user's use experience. The enhancement layer sets up on the internal surface of outward appearance layer, can strengthen the anti bending strength on outward appearance layer to promote the bulk strength of back lid. In addition, the appearance layer and the reinforcing layer are adhered and fixed through the thermal bonding layer. And, heat conduction bond line can be at the outward appearance layer and transfer heat between the enhancement layer, plays the heat conduction promptly, ensures the inside heat that produces of electronic equipment, can more efficient pass through enhancement layer and heat conduction bond line and transfer to the outward appearance layer to promote the radiating effect.
In some embodiments of the present application, the reinforcement layer is provided in a plurality of layers, and the plurality of layers of the reinforcement layer are sequentially stacked. The multilayer enhancement layer is favorable to further promoting intensity to avoid the back lid to lead to damaging because of receiving external force impact.
In some embodiments of the present application, a thermally conductive bonding layer is disposed between two adjacent reinforcing layers. Under this structure, can promote the heat conduction effect of every layer enhancement layer to ensure that the heat can more efficient transfer to outward appearance layer, thereby promote electronic equipment's radiating effect.
In some embodiments of the present application, the appearance layer is made of a ceramic material. The ceramic material has the advantages of high hardness, good thermal shock resistance, fast heat dissipation, strong wear resistance, smooth appearance, good hand feeling and the like, and is beneficial to improving the user experience.
In some embodiments of the present application, the reinforcing layer comprises carbon fiber cloth. The carbon fiber material has the advantages of light weight, high bending strength and the like, and is beneficial to improving the bending strength of the appearance layer made of the ceramic material, thereby being beneficial to improving the integral bending strength of the rear cover.
In some embodiments of the present application, the material of the thermally conductive bonding layer includes graphene oxide, an epoxy, and a curing agent. In this way, the graphene oxide and epoxy resin can be combined with each other with good heat conduction performance and good bonding performance, and the heat conduction combination layer with good heat conduction performance and bonding performance is formed by curing through the curing agent, so that the overall heat conduction performance can be improved while the appearance layer and the reinforcing layer are bonded and fixed.
In some embodiments of the present application, the thickness of the appearance layer is H1,0.08 mm.ltoreq.H2.ltoreq.0.3 mm.
In some embodiments of the present application, the total thickness of the reinforcing layer and the thermally conductive bonding layer is H2,0.01 mm.ltoreq.H2.ltoreq.0.3 mm.
In a second aspect, an electronic device is provided, where the electronic device includes a display module, a frame, and a rear cover, and the display module is fixedly connected with the frame. The back cover is the back cover according to any one of the above technical schemes, the back cover is arranged on one side of the frame far away from the display module, and the back cover is fixedly connected with the frame.
The electronic device according to the second aspect of the present application, because of comprising the rear cover according to any one of the above claims, can solve the same technical problems and achieve the same technical effects.
In a third aspect, a method of making a back cover for an electronic device is provided that includes preparing a substrate to form an appearance layer, the appearance layer having an inner surface and an outer surface. And coating a heat conduction bonding layer on the inner surface of the appearance layer. And a reinforcing layer is laminated on one side of the heat conduction bonding layer far away from the appearance layer. And carrying out vacuum infiltration hot-pressing treatment on the appearance layer and the heat conduction bonding layer opinion reinforcing layer so as to tightly bond the appearance layer, the heat conduction bonding layer and the reinforcing layer to form the composite material. The outer surface of the appearance layer is thinned so that the thickness of the appearance layer accords with the first design thickness. And thinning the surface of the reinforcing layer far away from the appearance layer so that the total thickness of the reinforcing layer and the heat conduction bonding layer accords with the second design thickness.
According to the manufacturing method of the rear cover of the electronic device, the composite material is formed by carrying out vacuum infiltration hot-pressing treatment on the appearance layer, the heat conduction bonding layer and the reinforcing layer. The rear cover of the electronic equipment is made of the composite material, so that the aesthetic property of the rear cover can be improved, and the bending strength of the rear cover can be improved. And the heat conduction bonding layer can also promote whole heat conductivility to promote the radiating effect of back lid. Finally, through the attenuate processing, make outward appearance layer accord with first design thickness to make the tie coat accord with second design thickness, thereby make outward appearance pleasing to the eye, radiating effect is good, anti back lid that bending strength is high, and then be favorable to promoting user's use experience.
In some embodiments of the present application, a method of vacuum infiltration autoclave treatment of an appearance layer, a thermally conductive bonding layer, and a reinforcement layer includes placing the appearance layer into a mold and spacing the appearance layer with an outer surface of the appearance layer opposite a bottom surface of the mold. A thermally conductive bonding layer is coated on the inner surface of the appearance layer. And stacking a reinforcing layer on one side of the heat conduction bonding layer away from the appearance layer to form a laminated structure. A pressing force is applied to the laminated structure, and compaction is performed. The compacted laminate structure is subjected to a vacuum infiltration process to form a composite material. In this way, the appearance layer, the heat conduction bonding layer and the reinforcing layer can be tightly combined to form a composite material, namely an integrated structure, so that the rear cover with attractive appearance, good heat dissipation effect and high bending strength is manufactured.
In some embodiments of the present application, the vacuum infiltration treatment comprises infiltration treatment and curing treatment, wherein the vacuum degree of the infiltration treatment is-0.07 MPa to-0.09 MPa, the infiltration temperature is 160 ℃ to 200 ℃, and the infiltration time is 60min to 90min. The vacuum degree of the curing treatment is-0.07 MPa to-0.09 MPa, the curing temperature is 50-90 ℃, and the curing time is 15-30 min.
In some embodiments of the present application, the material of the heat-conducting bonding layer is a graphene oxide-epoxy resin/curing agent mixed solution, and the manufacturing method of the graphene oxide-epoxy resin/curing agent mixed solution includes: step 1, preparing graphene oxide powder and absolute ethyl alcohol, and mixing the graphene oxide powder with the absolute ethyl alcohol, wherein the mass ratio of the graphene oxide powder to the absolute ethyl alcohol is 1:4-1:5, so as to form a graphene oxide solution. And 2, carrying out preliminary dispersion on the graphene oxide solution by stirring. And 3, performing ultrasonic dispersion treatment on the graphene oxide solution subjected to preliminary dispersion to form a prefabricated product of the heat-conducting graphene oxide dispersion liquid. And 4, vacuumizing the prefabricated product of the heat-conducting graphene oxide dispersion liquid, and drying to form the heat-conducting graphene oxide dispersion liquid. And 5, adding epoxy resin into the graphene oxide dispersion liquid, wherein the mass ratio of the graphene oxide dispersion liquid to the epoxy resin is 1:4-1:5. And 6, primarily dispersing the mixed solution of the graphene oxide dispersion liquid and the epoxy resin by stirring to form a mixed solution. And 7, standing and layering the mixed solution subjected to preliminary dispersion to form an upper layer solution and a lower layer solution. And 8, vacuumizing the lower layer solution, and drying. Step 9, adding a curing agent into the dried lower layer solution, wherein the mass ratio of the curing agent to the epoxy resin is 1:4-1:5, and forming a mixed solution; and finally dispersing the mixed solution by stirring to form graphene oxide-epoxy resin/curing agent mixed solution. The graphene oxide-epoxy resin/curing agent mixed solution prepared by the method can enable the appearance layer and the reinforcing layer to be adhered and fixed, and can transfer heat between the appearance layer and the reinforcing layer so as to improve the heat dissipation effect of the composite material.
In some embodiments of the present application, in step 2, the graphene oxide solution is subjected to electromagnetic stirring by a first electromagnetic stirrer, the power of the first electromagnetic stirrer is 300 rpm-500 rpm, the stirring time is 15 min-30 min, and the ambient temperature is 25 ℃ to 30 ℃.
In some embodiments of the application, in step 3, an ultrasonic dispersing device is used for ultrasonic dispersing treatment, the dispersing frequency of the ultrasonic dispersing device is 40 kHz-50 kHz, the power of the ultrasonic dispersing device is 200-500W, the ultrasonic dispersing time is 30-60 min, and the ultrasonic dispersing temperature is 25-30 ℃.
In some embodiments of the present application, in step 4, the preform is vacuumized by using a first vacuum drying oven, and is dried, where the temperature of the first vacuum drying oven is 25 ℃ to 30 ℃, and the drying time is 6h to 8h.
In some embodiments of the present application, in step 6, the mixed solution is subjected to electromagnetic stirring by a second electromagnetic stirrer, the power of the second electromagnetic stirrer is 200 rpm-400 rpm, the stirring time is 20 min-40 min, and the ambient temperature is 25 ℃ to 30 ℃.
In some embodiments of the present application, in step 8, the lower solution is vacuumized and dried by using a second vacuum drying oven, where the temperature of the second vacuum drying oven is 25 ℃ to 30 ℃, and the drying time is 2h to 4h.
In some embodiments of the present application, in step 9, the mixed solution is subjected to electromagnetic stirring by a third electromagnetic stirrer, the power of the third electromagnetic stirrer is 400 rpm-600 rpm, the stirring time is 5 min-15 min, and the ambient temperature is 25 ℃ to 30 ℃.
Drawings
Fig. 1 is a block diagram of an electronic device according to an embodiment of the present application;
fig. 2 is an exploded view of an electronic device according to an embodiment of the present application;
fig. 3 is a cross-sectional structural diagram of a rear cover of an electronic device according to an embodiment of the present application;
FIG. 4 is a cross-sectional view of another rear cover according to an embodiment of the present application
Fig. 5 is a flowchart of a method for manufacturing a rear cover of an electronic device according to an embodiment of the present application;
FIG. 6 is a cross-sectional block diagram of an appearance layer provided in an embodiment of the present application;
FIG. 7 is a cross-sectional view of a thermal conductive bonding layer coated on an inner surface of an appearance layer according to an embodiment of the present application;
fig. 8 is a flowchart of a preparation method of a graphene oxide-epoxy resin/curing agent mixed solution according to an embodiment of the present application;
FIG. 9 is a flow chart of a method for compacting an outer layer, a thermally conductive bonding layer, and a reinforcing layer according to an embodiment of the present disclosure;
fig. 10 is a cross-sectional structural view of a composite material provided in an embodiment of the present application.
Reference numerals: 10-an electronic device; 100-a display module; a 110 light-transmitting cover plate; 120-display screen; 200-a housing; 210-a rear cover; 211-an appearance layer; 211 a-an inner surface; 211 b-outer surface; 212-a thermally conductive bonding layer; 213-a reinforcement layer; 220-frame; 230-a middle plate; 300-an electronic device; 310-motherboard; 320-a camera module; 400-composite material.
Detailed Description
The following description of the technical solutions in the embodiments of the present application will be made with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, but not all embodiments.
Hereinafter, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", etc. may explicitly or implicitly include one or more such feature.
Furthermore, in this application, directional terms "upper", "lower", etc. are defined with respect to the orientation in which the components are schematically disposed in the drawings, and it should be understood that these directional terms are relative concepts, which are used for description and clarity with respect thereto, and which may be varied accordingly with respect to the orientation in which the components are disposed in the drawings.
In the present application, unless explicitly specified and limited otherwise, the term "coupled" is to be construed broadly, and for example, "coupled" may be either fixedly coupled, detachably coupled, or integrally formed; can be directly connected or indirectly connected through an intermediate medium.
The embodiment of the application provides electronic equipment. In particular, the electronic device may be a portable electronic apparatus or other type of electronic apparatus. For example, the electronic device may be a cell phone, tablet (tablet personal computer), laptop (laptop computer), personal digital assistant (personal digital assistant, PDA), monitor, camera, personal computer, notebook, wearable device, or the like. For convenience of explanation, the following will take an electronic device as an example of a mobile phone.
Referring to fig. 1 and fig. 2, fig. 1 is a block diagram of an electronic device 10 according to an embodiment of the present application, and fig. 2 is an exploded view of the electronic device 10 according to an embodiment of the present application. As can be seen from the above description, in the present embodiment, the electronic device 10 is a mobile phone, and the electronic device 10 may have an approximately rectangular plate shape. The electronic device 10 may include a display module 100, an electronic component 300 disposed inside the electronic device 10, a housing 200, and the like.
It will be appreciated that fig. 1 and 2 only schematically illustrate some of the components included in the electronic device 10, the actual shape, actual size, actual location, and actual configuration of which are not limited by fig. 1 and 2.
The display module 100 is used for displaying images, videos, and the like. The display module 100 may include a light-transmitting cover plate 110 and a display screen 120 (also referred to as a display panel), where the light-transmitting cover plate 110 and the display screen 120 are stacked. The material of the transparent cover plate 110 includes, but is not limited to, glass. For example, the transparent cover plate 110 may be a common transparent cover plate 110 for protecting the display screen 120 to prevent the display screen 120 from being damaged due to collision of external force, and to play a role in dust prevention. The light-transmitting cover plate 110 with the touch function can also be adopted, so that the electronic device 10 has the touch function, and the use of the electronic device is more convenient for users. Therefore, the specific material of the transparent cover plate 110 is not particularly limited in this application.
In addition, the display 120 may be a flexible display or a rigid display. For example, the display 120 may be an organic light-emitting diode (OLED) display, an active-matrix organic light-emitting diode (AMOLED) display, a mini-led (mini organic light-emitting diode) display, a micro-led (micro organic light-emitting diode) display, a micro-organic led (micro organic light-emitting diode) display, a quantum dot led (quantum dot light emitting diode, QLED) display, a liquid crystal display (liquid crystaldisplay, LCD).
The electronic device 300 is a device for realizing various functions inside the electronic apparatus 10. Specifically, the electronic device 300 may include a motherboard 310, a camera module 320, and the like. The motherboard 310 is used to realize electrical connection between other electronic devices 300, such as the camera module 320, a control Chip (e.g., a System On Chip (SOC)), a graphics control Chip (graphics processing unit, GPU), a universal storage (universal flash storage, UFS), a headset, and a flash module. In addition, the camera module 320 is used for capturing video or images.
The housing 200 is used to protect the electronics 300 inside the electronic device 10. The housing 200 may include a rear cover 210 and a bezel 220, wherein the rear cover 210 is located at a side of the display screen 120 away from the transparent cover plate 110, and is stacked with and spaced apart from the transparent cover plate 110 and the display screen 120, and the bezel 220 is located between the transparent cover plate 110 and the rear cover 210. The frame 220 is fixed on the rear cover 210, and illustratively, the frame 220 may be fixedly connected to the rear cover 210 by means of bonding, threaded connection, welding, clamping, etc., and the frame 220 may also be integrally formed with the rear cover 210, i.e. the frame 220 and the rear cover 210 are integrally formed as a structural member. The transparent cover plate 110 may be adhered to the frame 220 by glue, so that the transparent cover plate 110, the rear cover 210 and the frame 220 enclose an internal accommodating space of the electronic device 10, and the electronic device 300, for example, the main board 310 and the camera module 320 are disposed in the internal accommodating space.
In some embodiments, the case 200 may further include a middle plate 230, wherein the middle plate 230 is disposed in the inner accommodating space, and the middle plate 230 is located at a side of the display screen 120 away from the transparent cover plate 110. The middle plate 230 is fixedly connected with the frame 220 to form a middle frame of the electronic device 10, and the middle plate 230 and the frame 220 may be fixedly connected by gluing, screwing, welding, clamping, or the like, or the middle plate 230 and the frame 220 may be integrally formed, i.e., they are integral. The middle plate 230 divides the inner receiving space into two independent spaces, one of which is located between the light-transmitting cover plate 110 and the middle plate 230, and the display screen 120 is located in the space. The other member is located between the middle plate 230 and the rear cover 210, and a part of the electronic device 300 is disposed in the space.
The rear cover 210 may be made of a ceramic material or a carbon fiber material, and the ceramic material has the advantages of high hardness, good thermal shock resistance, fast heat dissipation, strong wear resistance, smooth appearance, good hand feeling, etc. The carbon fiber material has the advantages of light weight, high bending strength and the like.
However, the ceramic material has low bending strength and high overall mass, resulting in easy breakage and damage of the rear cover 210 made of the ceramic material, and increasing the overall weight of the electronic device 10. In addition, the carbon fiber material has poor heat dissipation effect, rough surface texture and poor hand feeling, so that the rear cover 210 made of the carbon fiber material has poor heat dissipation effect, is unfavorable for heat dissipation of the electronic equipment 10, influences the hand feeling of the user holding the electronic equipment 10, and reduces the user experience.
In order to solve the above-mentioned technical problem, please refer to fig. 3, fig. 3 is a cross-sectional view of a rear cover 210 of an electronic device 10 according to an embodiment of the present application. The rear cover 210 includes an exterior layer 211, a reinforcing layer 213, and a thermally conductive bonding layer 212. The appearance layer 211 has an inner surface 211a and an outer surface 211b. The reinforcing layer 213 is laminated with the exterior layer 211, and the reinforcing layer 213 is disposed on a side close to the inner surface 211a of the exterior layer 211. The heat conductive bonding layer 212 is disposed between the exterior layer 211 and the reinforcing layer 213, the heat conductive bonding layer 212 serves to adhesively fix the exterior layer 211 to the reinforcing layer 213, and the heat conductive bonding layer 212 serves to adhesively fix the exterior layer 211 to the reinforcing layer 213 and to transfer heat between the exterior layer 211 and the reinforcing layer 213.
For example, the exterior layer 211 may be made of a ceramic material, the reinforcing layer 213 may be made of a carbon fiber cloth, and the heat conductive bonding layer 212 may be made of a mixture of graphene oxide, epoxy resin, and a curing agent.
In this way, the appearance layer 211 made of ceramic material has a smooth outer surface 211b and a good hand feeling, so that the overall appearance is more attractive, the use hand feeling of a user is improved, and the use experience of the user is improved. The reinforcing layer 213 formed of carbon fiber cloth can enhance the bending resistance of the exterior layer 211 made of ceramic material, thereby enhancing the overall strength of the rear cover 210, and is advantageous in reducing the weight of the rear cover 210, thereby reducing the overall weight of the electronic device 10.
In addition, the heat-conducting bonding layer 212 made of a mixed material of graphene oxide, epoxy resin and a curing agent has good heat-conducting characteristics of the graphene oxide material and good bonding performance of the epoxy resin material, and is cured by the curing agent, so that the heat-conducting bonding layer 212 with good heat-conducting performance and bonding performance is formed. Therefore, the appearance layer 211 and the reinforcing layer 213 can be adhered and fixed through the heat conduction bonding layer 212, and heat on the reinforcing layer 213 can be transferred to the appearance layer 211 through the heat conduction property of the heat conduction bonding layer 212, and the heat is dissipated by the appearance layer 211, so that the heat dissipation effect of the electronic device 10 is improved.
In some embodiments, referring to fig. 4, fig. 4 is a cross-sectional view of another rear cover 210 according to an embodiment of the present application. The rear cover 210 may be provided with a plurality of the reinforcing layers 213, and the plurality of reinforcing layers 213 may be sequentially stacked. By providing the plurality of reinforcing layers 213, the overall bending strength of the rear cover 210 is further improved, so that the risk of breakage and damage of the rear cover 210 due to external impact can be further reduced.
In addition, referring to fig. 4, in order to avoid the influence of the plurality of reinforcing layers 213 on the heat conducting performance, the heat conducting bonding layers 212 may be disposed between two adjacent reinforcing layers 213, so that on one hand, the bonding strength between the structures of the layers can be improved, and on the other hand, the heat conducting performance of the reinforcing layers 213 can be improved, so as to ensure that the heat generated by the electronic device 10 can be more efficiently transferred to the appearance layer 211 through the reinforcing layers 213 and the heat conducting bonding layers 212, thereby being beneficial to improving the heat dissipation effect of the electronic device 10.
In order to reduce the thickness of the electronic device 10, the rear cover 210 needs to meet a certain size requirement, so as to avoid the increase of the thickness of the electronic device 10 caused by the excessive thickness of the rear cover 210. Illustratively, the thickness of the appearance layer 211 is H1, and H1 is required to satisfy the first design thickness, for example, 0.08 mm.ltoreq.H2.ltoreq.0.3 mm. And, the total thickness of the reinforcing layer 213 and the heat conductive bonding layer 212 is H2, and H2 is required to satisfy the second design thickness, for example, 0.01 mm.ltoreq.H2.ltoreq.0.3 mm.
In this way, when the external layer 211, the reinforcing layer 213, and the heat conductive bonding layer 212 satisfy the thickness requirements, the entire thickness of the electronic device 10 can be ensured, and an increase in the weight of the rear cover 210 due to an excessive thickness of the external layer 211 can be avoided. Thus, on the one hand, the thickness dimension requirements of the electronic device 10 can be ensured; on the other hand, the weight requirements of the electronic device 10 can also be ensured.
The specific structure of the rear cover 210 provided in the embodiment of the present application is described above, and the method for manufacturing the rear cover 210 is described in detail below, referring to fig. 5, fig. 5 is a flowchart of the method for manufacturing the rear cover 210 of the electronic device 10 provided in the embodiment of the present application, where the method for manufacturing the rear cover 210 includes steps S101 to S106 shown in fig. 5.
S101, preparing a substrate as an appearance layer 211, wherein the appearance layer 211 is provided with an inner surface 211a and an outer surface 211b;
referring to fig. 6, fig. 6 is a cross-sectional structure diagram of an appearance layer 211 according to an embodiment of the disclosure. Specifically, the substrate may be made of a ceramic material, and the outer surface 211b of the appearance layer 211 is a surface that can be seen and touched by a user, and due to the smooth surface of the ceramic material, the appearance layer 211 made of the ceramic material can improve the overall aesthetic property of the electronic device 10, and the cover 210 has a better hand feeling after the user touches the cover, which is beneficial to improving the use experience of the user.
S102, coating a heat conduction bonding layer 212 on the inner surface 211a of the appearance layer 211;
referring to fig. 7, fig. 7 is a cross-sectional view of a structure in which a heat-conductive bonding layer 212 is coated on an inner surface 211a of an appearance layer 211 according to an embodiment of the present application. Specifically, the material of the thermally conductive bonding layer 212 may be a graphene oxide-epoxy/curing agent mixture formed by mixing graphene oxide, epoxy and curing agent. The graphene oxide-epoxy resin/curing agent mixed solution has good heat conduction characteristics of graphene oxide and good bonding performance of epoxy resin. The material is coated on the inner surface 211a of the appearance layer 211, so that the material can be used for bonding and fixing the appearance layer 211 and the reinforcing layer 213, and can transfer heat between the appearance layer 211 and the reinforcing layer 213 to improve the heat dissipation effect of the reinforcing layer 213.
Referring to fig. 8, fig. 8 is a flowchart of a preparation method of a graphene oxide-epoxy resin/curing agent mixture according to an embodiment of the present application, where the preparation method of the graphene oxide-epoxy resin/curing agent mixture includes steps 1 to 9 shown in fig. 8, and specifically includes the following steps:
step 1, preparing graphene oxide powder and absolute ethyl alcohol, and mixing the graphene oxide powder with the absolute ethyl alcohol, wherein the mass ratio of the graphene oxide to the absolute ethyl alcohol is 1:4-1:5, so as to form a graphene oxide solution;
and 2, transferring the graphene oxide solution into an electromagnetic stirrer, and performing primary dispersion through electromagnetic stirring, wherein the power of the electromagnetic stirrer is 300-500 rpm, the stirring time is 15-30 min, and the environment temperature is 25-30 ℃. Thus completing the preliminary dispersion of the graphene oxide solution;
and 3, transferring the graphene oxide solution subjected to preliminary dispersion into ultrasonic dispersion equipment, wherein the dispersion frequency of the ultrasonic dispersion equipment is 40 kHz-50 kHz, the power is 200W-500W, the ultrasonic dispersion time is 30 min-60 min, and the ultrasonic dispersion temperature is 25-30 ℃. Thereby realizing the final dispersion of the graphene oxide solution and forming a prefabricated product of graphene oxide dispersion liquid;
and 4, placing the prefabricated product of the graphene oxide dispersion liquid into a vacuum drying oven, vacuumizing and drying, wherein the temperature of the vacuum drying oven is 25-30 ℃, and the drying time is 6-8 hours. Removing gas generated by ethanol volatilization in the dispersion liquid to obtain graphene oxide dispersion liquid;
step 5, adding epoxy resin into the graphene oxide dispersion liquid, wherein the mass ratio of the graphene oxide dispersion liquid to the epoxy resin is 1:4-1:5, and forming a mixed solution;
and 6, placing the mixed solution of the graphene oxide dispersion liquid and the epoxy resin in an electromagnetic stirrer, and performing primary dispersion through electromagnetic stirring. At the moment, the power of the electromagnetic stirrer is 200-400 rpm, the stirring time is 20-40 min, and the environment temperature is 25-30 ℃, so that the primary dispersion of the graphene oxide dispersion liquid and the mixed solution of the epoxy resin is completed;
step 7, standing the mixed solution of the graphene oxide dispersion liquid and the epoxy resin subjected to preliminary dispersion for a certain time to enable the mixed solution to generate layering phenomenon to form an upper layer solution and a lower layer solution, pouring out the upper layer solution, and reserving the lower layer solution;
and 8, placing the lower layer solution in a vacuum drying oven, vacuumizing and drying, wherein the temperature of the vacuum drying oven is 25-30 ℃, and the drying time is 2-4 hours. So as to remove the gas generated by the volatilization of the residual ethanol in the lower layer solution, and reduce the conditions of bubbles, holes and the like in the rear cover 210 prepared in the subsequent step.
And 9, adding a curing agent into the dried lower layer solution, wherein the mass ratio of the curing agent to the epoxy resin is 1:4-1:5, and forming a mixed solution. And placing the mixed solution into an electromagnetic stirrer, and finally dispersing by stirring, wherein the power of the electromagnetic stirrer is 400-600 rpm, the stirring time is 5 min-15 min, and the environment temperature is 25-30 ℃.
The graphene oxide-epoxy resin/curing agent mixed solution is prepared so far, and has good heat conduction characteristics of graphene oxide and good bonding performance of epoxy resin. Therefore, the heat dissipation device can be used for adhering and fixing the appearance layer 211 and the reinforcing layer 213, and can transfer heat between the appearance layer 211 and the reinforcing layer 213 to improve the heat dissipation effect of the reinforcing layer 213.
S103, laminating a reinforcing layer 213 on one side of the heat conduction bonding layer 212 away from the appearance layer 211 to form a structure shown in FIG. 3;
specifically, the reinforcing layer 213 may be made of carbon fiber cloth, and the carbon fiber material has the advantages of light weight and high bending strength, so that the reinforcing layer 213 formed by the carbon fiber cloth can improve the bending strength of the whole rear cover 210, so as to reduce the risk of breakage and damage of the rear cover 210 caused by external impact. And, the carbon fiber material is lighter in weight, is favorable to reducing the whole weight of back cover 210 to be favorable to reducing the weight of electronic equipment 10, be favorable to electronic equipment 10 frivolity.
In some embodiments, the reinforcement layer 213 may be provided with a plurality of layers, and the plurality of reinforcement layers 213 are stacked one on another. In this way, the bending strength of the rear cover 210 can be further improved, thereby further reducing the risk of breakage and damage of the rear cover 210.
In addition, in order to enhance the heat dissipation effect of the reinforcing layers 213 which are sequentially stacked, the heat conductive bonding layer 212 may be disposed between two adjacent reinforcing layers 213. On the one hand, the heat conduction efficiency of the multi-layer reinforcing layer 213 is improved, so that the heat generated in the electronic device 10 is rapidly transferred to the appearance layer 211 through the reinforcing layer 213, and the heat dissipation effect of the electronic device 10 can be improved. On the other hand, the heat conducting bonding layer 212 is arranged between two adjacent reinforcing layers 213, which is favorable for improving the bonding strength between the structures of all layers, thereby being favorable for improving the reliability of the integral structure of the rear cover 210.
S104, carrying out vacuum infiltration hot-pressing treatment on the appearance layer 211, the heat conduction bonding layer 212 and the reinforcing layer 213 so as to tightly bond the appearance layer 211, the heat conduction bonding layer 212 and the reinforcing layer 213 to form a composite material 400;
in this way, the composite material 400 formed by vacuum infiltration and hot pressing treatment of the appearance layer 211, the heat conduction bonding layer 212 and the reinforcing layer 213 has the appearance of ceramic material, that is, the outer surface 211b is smooth, and the feel of the use is good; the strength of the carbon fiber cloth is higher, namely the integral bending strength is higher, and the weight is lighter; the heat conducting performance is better, namely, the heat generated by the electronic device 300 is transferred by the reinforcing layer 213 formed by the carbon fiber cloth, and is quickly transferred to the appearance layer 211 through the heat conducting combination layer 212, and then the heat is uniformly dissipated through the appearance layer 211, so that the overall heat dissipation effect of the rear cover 210 is improved. Therefore, the aesthetic property of the rear cover 210 is improved, which is beneficial to improving the use experience of users; the bending resistance of the rear cover 210 is enhanced, and the risk of breakage and damage of the rear cover 210 is reduced; the heat dissipation effect of the rear cover 210 is also improved, which is beneficial to improving the heat dissipation effect of the electronic device 10.
Based on this, the following describes the method for performing the vacuum infiltration and hot-pressing treatment on the appearance layer 211, the heat-conductive bonding layer 212 and the reinforcing layer 213 in detail, referring to fig. 9, fig. 9 is a flowchart of the method for performing the vacuum infiltration and hot-pressing treatment on the appearance layer 211, the heat-conductive bonding layer 212 and the reinforcing layer 213 according to the embodiment of the present application, and the method may include steps S41 to S45, specifically as follows:
s41, preparing a mold, placing the appearance layer 211 (i.e., the ceramic substrate) at the bottom of the mold, and making the outer surface 211b of the appearance layer 211 face the bottom surface of the mold.
S42, coating the heat conduction bonding layer 212 (namely graphene oxide-epoxy resin/curing agent mixed solution) on the inner surface 211a of the appearance layer 211;
s43, stacking a reinforcing layer 213 (namely carbon fiber cloth) on one side of the heat conduction bonding layer 212 away from the appearance layer 211 to form a laminated structure;
in some embodiments, when the reinforcing layer 213 is provided with a plurality of layers, a plurality of reinforcing layers 213 are sequentially provided, and each of the reinforcing layers 213 is stacked, the heat conductive bonding layer 212 is coated on a surface of the reinforcing layer 213 remote from the exterior layer 211, thereby forming a stacked structure having a plurality of reinforcing layers 213.
In addition, the surface of one reinforcing layer 213 of the plurality of reinforcing layers 213 farthest from the appearance layer 211, which is far away from the appearance layer 211, may be coated with the heat-conducting bonding layer 212, so that heat generated in the electronic device 10 is quickly transferred to the reinforcing layer 213, and the heat dissipation efficiency of the rear cover 210 can be further improved.
S44, applying extrusion force to the laminated structure and compacting;
specifically, the laminated structure is pre-compacted, and then the laminated structure is placed in a press vulcanizer preheated in advance, and a pressing force is applied by a hydraulic press, so that the exterior layer 211, the heat conductive bonding layer 212, and the reinforcing layer 213 are tightly bonded.
S45, performing vacuum infiltration treatment on the compacted laminated structure to form a composite material 400;
specifically, the vacuum infiltration treatment includes an infiltration treatment and a curing treatment.
Firstly, the vacuum degree of the infiltration treatment is-0.07 MPa to-0.09 MPa, the infiltration temperature is 160 ℃ to 200 ℃, and the infiltration time is 60min to 90min. The exterior layer 211, the heat conductive bonding layer 212, and the reinforcing layer 213 can be further closely bonded by the impregnation treatment, and the heat conductive bonding layer 212 can infiltrate into the voids on the exterior layer 211 and the reinforcing layer 213, thereby further improving the adhesive strength between the exterior layer 211 and the reinforcing layer 213.
Secondly, the vacuum degree of the curing treatment is-0.07 MPa to-0.09 MPa, the curing temperature is 50-90 ℃, and the curing time is 15-30 min. After the curing treatment, the heat-conducting bonding layer 212 can be completely cured, so that the reinforcing layer 213 (ceramic material), the heat-conducting bonding layer 212 (graphene oxide-epoxy resin/curing agent mixed solution) and the reinforcing layer 213 (carbon fiber cloth) form a composite material 400, please refer to fig. 10, fig. 10 is a cross-sectional structure diagram of the composite material 400 provided in the embodiment of the present application.
In addition, the outer surface 211b of the composite material 400 is smooth, and has good appearance and touch feeling; meanwhile, the composite material 400 has stronger bending strength, so that the risk of damage to the rear cover 210 can be reduced; in addition, the heat-conducting and heat-dissipating performance is good, and the heat-dissipating effect of the electronic equipment 10 is improved.
S105, thinning the outer surface 211b of the appearance layer 211 to enable the thickness of the appearance layer 211 to conform to the first design thickness;
specifically, the outer surface 211b of the exterior layer 211 of the composite material 400 is ground and polished, or the outer surface 211b of the exterior layer 211 of the composite material 400 is numerically controlled lathe processed so that the thickness of the exterior layer 211 conforms to the first design thickness. For example, with continued reference to fig. 10, when forming the composite material 400, the thickness of the appearance layer 211 is D1, at this time, 0.4mm is equal to or less than D1 is equal to or less than 0.85mm, and after the thinning process, the thickness of the appearance layer 211 is thinned to H1, where H1 meets the first design thickness, i.e., 0.08mm is equal to or less than H1 is equal to or less than 0.3mm, as shown in fig. 4.
In this way, the thickness of the rear cover 210 can be reduced, the thickness dimension of the electronic device 10 can be reduced, and the weight of the rear cover 210 can be reduced after the appearance layer 211 is thinned, so that the weight of the electronic device 10 can be reduced, and the thinning of the electronic device 10 is facilitated.
S106, thinning the surface of the reinforcing layer 213 away from the appearance layer 211 to enable the total thickness of the reinforcing layer 213 and the heat conduction bonding layer 212 to conform to the second design thickness;
specifically, the surface of the reinforcing layer 213 of the composite material 400 away from the exterior layer 211 is polished, or the surface of the reinforcing layer 213 of the composite material 400 away from the exterior layer 211 is numerically controlled lathe processed, so that the total thickness of the reinforcing layer 213 and the thermally conductive bonding layer 212 conforms to the second design thickness. For example, referring to FIG. 10, when the conforming material is formed, the total thickness of the reinforcing layer 213 and the heat conductive bonding layer 212 is D2, and 0.5 mm.ltoreq.D2.ltoreq.1 mm; after the thinning process, the total thickness of the reinforcing layer 213 and the heat conductive bonding layer 212 is thinned to H2, where H2 meets the second design thickness, i.e., 0.01mm < H2 < 0.3mm, so as to form the rear cover 210 structure shown in fig. 4.
In this way, the thickness of the rear cover 210 can be further reduced, and the bending strength of the rear cover 210 can meet the use requirement, so that the thickness dimension and the weight of the electronic device 10 are further reduced, and the electronic device 10 is more beneficial to being lighter and thinner.
Based on this, the rear cover 210 made of the composite material 400 (ceramic material, graphene oxide-epoxy resin/curing agent and carbon fiber cloth) is formed, and in order to further enhance the appearance of the rear cover 210, the edge of the rear cover 210 may be processed by grinding, polishing or numerically controlled lathe processing, so that the edge of the rear cover 210 forms a curved surface structure, thereby further enhancing the aesthetic property of the rear cover 210, and the processing manner thereof is a common technical means, and thus will not be described in detail.
In the description of the present specification, a particular feature, structure, material, or characteristic may be combined in any suitable manner in one or more embodiments or examples.
The foregoing is merely specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think about changes or substitutions within the technical scope of the present application, and the changes and substitutions are intended to be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (19)

1. A back cover for an electronic device, comprising:
an appearance layer having an inner surface;
a reinforcing layer which is laminated with the appearance layer and is arranged on one side close to the inner surface;
the heat conduction bonding layer is arranged between the appearance layer and the reinforcing layer, and is used for enabling the appearance layer to be fixedly bonded with the reinforcing layer and transferring heat between the appearance layer and the reinforcing layer.
2. The back cover of an electronic device according to claim 1, wherein the reinforcing layer is provided in a plurality of layers, and a plurality of the reinforcing layers are stacked in order.
3. The back cover of an electronic device of claim 2, wherein the thermally conductive bonding layer is disposed between two adjacent ones of the reinforcement layers.
4. A rear cover for an electronic device according to any one of claims 1 to 3, wherein the appearance layer is made of a ceramic material.
5. The back cover of any one of claims 1-3, wherein the reinforcing layer comprises carbon fiber cloth.
6. The back cover of any one of claims 1-3, wherein the material of the heat conductive bonding layer comprises graphene oxide, epoxy resin and a curing agent.
7. The back cover of an electronic device according to any one of claims 1 to 3, wherein the thickness of the appearance layer is H1, and H1 is 0.08 mm-0.3 mm.
8. The back cover of an electronic device according to any one of claims 1 to 3, wherein the total thickness of the reinforcing layer and the heat conductive bonding layer is H2, and H2 is 0.01mm or less and 0.3mm or less.
9. An electronic device, comprising:
a display module;
the display module is fixedly connected with the frame;
the back cover is the back cover of the electronic device according to any one of claims 1-8, and the back cover is arranged on one side of the frame away from the display module and is fixedly connected with the frame.
10. A method for manufacturing a rear cover of an electronic device, the method comprising:
preparing a substrate to form an appearance layer, the appearance layer having an inner surface and an outer surface;
coating a heat conduction bonding layer on the inner surface of the appearance layer;
a reinforcing layer is laminated on one side of the heat conduction bonding layer far away from the appearance layer;
carrying out vacuum infiltration hot-pressing treatment on the appearance layer, the heat conduction bonding layer and the reinforcing layer so as to tightly bond the appearance layer, the heat conduction bonding layer and the reinforcing layer to form a composite material;
thinning the outer surface of the appearance layer to enable the thickness of the appearance layer to conform to a first design thickness;
and thinning the surface of the reinforcing layer far away from the appearance layer to ensure that the total thickness of the reinforcing layer and the heat conduction bonding layer accords with the second design thickness.
11. The method of claim 10, wherein the vacuum impregnating and hot pressing the appearance layer, the thermally conductive bonding layer, and the reinforcing layer comprises:
placing the appearance layer into a mold, limiting the appearance layer, and enabling the outer surface of the appearance layer to be opposite to the bottom surface of the mold;
coating the heat conductive bonding layer on the inner surface of the appearance layer;
stacking the reinforcing layer on one side of the heat conduction bonding layer far away from the appearance layer to form a stacked structure;
applying a compressive force to the laminated structure to compact the laminated structure;
and carrying out vacuum infiltration treatment on the compacted laminated structure to form the composite material.
12. The production method according to claim 11, wherein the vacuum infiltration treatment comprises infiltration treatment and curing treatment, the degree of vacuum of the infiltration treatment is-0.07 MPa to-0.09 MPa, the infiltration temperature is 160 ℃ to 200 ℃, and the infiltration time is 60min to 90min;
the vacuum degree of the curing treatment is-0.07 MPa to-0.09 MPa, the curing temperature is 50-90 ℃, and the curing time is 15-30 min.
13. The manufacturing method of any one of claims 10 to 12, wherein the material of the heat-conducting bonding layer is a graphene oxide-epoxy resin/curing agent mixed solution, and the manufacturing method of the graphene oxide-epoxy resin/curing agent mixed solution comprises the following steps:
step 1, preparing graphene oxide powder and absolute ethyl alcohol, and mixing the graphene oxide powder with the absolute ethyl alcohol, wherein the mass ratio of the graphene oxide to the absolute ethyl alcohol is 1:4-1:5, so as to form a graphene oxide solution;
step 2, primarily dispersing the graphene oxide solution through stirring;
step 3, carrying out ultrasonic dispersion treatment on the graphene oxide solution subjected to preliminary dispersion to form a prefabricated product of graphene oxide dispersion;
step 4, vacuumizing a prefabricated product of the graphene oxide dispersion liquid, and drying to form the graphene oxide dispersion liquid;
step 5, adding epoxy resin into the graphene oxide dispersion liquid, wherein the mass ratio of the graphene oxide dispersion liquid to the epoxy resin is 1:4-1:5;
step 6, primarily dispersing the graphene oxide dispersion liquid and the mixed solution of the epoxy resin through stirring to form a mixed solution;
step 7, standing and layering the mixed solution subjected to preliminary dispersion to form an upper layer solution and a lower layer solution;
step 8, vacuumizing the lower layer solution, and drying;
step 9, adding a curing agent into the dried lower layer solution, wherein the mass ratio of the curing agent to the epoxy resin is 1:4-1:5, and forming a mixed solution; and finally dispersing the mixed solution by stirring to form graphene oxide-epoxy resin/curing agent mixed solution.
14. The method according to claim 13, wherein in the step 2, the graphene oxide solution is subjected to electromagnetic stirring by a first electromagnetic stirrer, the power of the first electromagnetic stirrer is 300rpm to 500rpm, the stirring time is 15min to 30min, and the ambient temperature is 25 ℃ to 30 ℃.
15. The method according to claim 13, wherein in the step 3, the ultrasonic dispersion treatment is performed by using an ultrasonic dispersion device, the dispersion frequency of the ultrasonic dispersion device is 40khz to 50khz, the power is 200w to 500w, the ultrasonic dispersion time is 30min to 60min, and the ultrasonic dispersion temperature is 25 ℃ to 30 ℃.
16. The method according to claim 13, wherein in the step 4, the preform is vacuumized and dried by using a first vacuum drying oven, the temperature of the first vacuum drying oven is 25 ℃ to 30 ℃, and the drying time is 6h to 8h.
17. The method according to claim 13, wherein in the step 6, the mixed solution is subjected to electromagnetic stirring by a second electromagnetic stirrer, the power of the second electromagnetic stirrer is 200rpm to 400rpm, the stirring time is 20min to 40min, and the ambient temperature is 25 ℃ to 30 ℃.
18. The method according to claim 13, wherein in the step 8, the lower layer solution is vacuumized and dried by a second vacuum drying oven, the temperature of the second vacuum drying oven is 25 ℃ to 30 ℃, and the drying time is 2h to 4h.
19. The method according to claim 13, wherein in the step 9, the mixed solution is subjected to electromagnetic stirring by a third electromagnetic stirrer, the power of the third electromagnetic stirrer is 400rpm to 600rpm, the stirring time is 5min to 15min, and the ambient temperature is 25 ℃ to 30 ℃.
CN202310042428.1A 2023-01-28 2023-01-28 Rear cover of electronic equipment, manufacturing method of rear cover and electronic equipment Pending CN116075092A (en)

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