CN116075076A - Manufacturing process of multi-layer LCP (liquid crystal display) circuit - Google Patents

Abstract

The application provides a manufacturing process of a multilayer LCP circuit. The manufacturing process of the multilayer LCP circuit comprises the following steps: coating LDS ink on the bearing film to form a first ink layer; carrying out laser etching on the first ink layer to form a first line groove; electroless plating is carried out on the first ink layer to form a first circuit layer; applying an LCP slurry to the first ink layer and the first circuit layer to form an LCP barrier layer; coating LDS ink on the LCP barrier layer to form a second ink layer; carrying out laser etching on the second ink layer to form a second circuit groove; performing electroless plating operation on the second ink layer to form a second circuit layer; applying an LCP slurry to the second ink layer and the second circuit layer to form an LCP barrier layer; repeating the previous four steps at least once to form a multi-layer circuit strip; die cutting the multilayer circuit strip to form a multilayer circuit semi-finished product with a via hole; and filling silver paste into the through holes to form the through pieces in the through holes. In this way, the quality of the multilayer LCP lines is improved.

Description

Manufacturing process of multi-layer LCP (liquid crystal display) circuit

Technical Field

The invention relates to the technical field of multilayer LCP lines, in particular to a manufacturing process of multilayer LCP lines.

Background

In recent years, with the deep and rapid development of the internet of things in a plurality of high-new technology application fields such as mobile data communication, industrial automation, aerospace and the like, the technical requirements for manufacturing the high-frequency electromagnetic wave performance of the radio-frequency circuit element and the substrate in the electronic communication equipment are also more and more severe. The high-frequency electromagnetic wave is taken as a radio frequency circuit device, and great technical challenges are presented to the design of a common high-frequency high-speed electromagnetic wave substrate and the design, manufacture and process design of a typical transmission control system of high-frequency high-speed electromagnetic wave signals.

For the creation of multi-layer LCP lines, more researchers at home and abroad have developed related researches, and at present, two manufacturing methods for the LCP multi-layer lines are adopted, namely, a low-melting-point LCP layer is used as an adhesive layer, the low-melting-point LCP layer is overlapped between two adjacent layers of lines, and then the overlapped multi-layer lines are subjected to vacuum hot pressing in a high-temperature pressing machine; alternatively, the multilayer wiring is directly hot-pressed with a high-temperature press in the case of the adhesive layer.

However, in the high temperature lamination process, the low melting point LCP layer flows to cause uneven thickness of the circuit lamination, affects impedance of the circuit, causes discontinuous impedance, and the low melting point LCP layer flows to cause drift of the circuit, so that reliability of the circuit is poor, and quality of the multi-layer LCP circuit is reduced.

Disclosure of Invention

The invention aims to overcome the defects in the prior art and provides a manufacturing process of a multilayer LCP circuit, which solves the problem of uneven circuit thickness caused by the flow of an LCP layer, and also solves the problem of circuit deflection caused by the flow of the LCP layer, thereby improving the quality of the multilayer LCP circuit.

The aim of the invention is realized by the following technical scheme:

the manufacturing process of the multilayer LCP circuit comprises the steps of manufacturing the multilayer LCP circuit through circuit manufacturing equipment, wherein the circuit manufacturing equipment comprises a bearing coil stock, an unreeling device and a reeling device, the unreeling device and the reeling device are respectively used for unreeling and reeling the bearing coil stock, and a manufacturing area is formed between the unreeling device and the reeling device;

the line manufacturing equipment further comprises a manufacturing device, a die cutting device and a pulp filling device, wherein the manufacturing device, the die cutting device and the pulp filling device are all positioned in the manufacturing area and are sequentially arranged along the transmission direction of the bearing film for bearing the coil stock; the number of the manufacturing devices is at least three, the at least three manufacturing devices are sequentially arranged along the transmission direction of the bearing film, and each manufacturing device comprises an ink scraping mechanism, a laser carving mechanism, a chemical plating mechanism and a fat scraping mechanism which are sequentially arranged along the transmission direction of the bearing film;

the manufacturing process of the multilayer LCP circuit at least comprises the following steps:

step S101: respectively winding and unwinding the bearing coil stock in the unwinding device and the winding device;

step S103: coating LDS ink on the bearing film through the ink scraping mechanism so as to form a first ink layer on the bearing film;

step S105: carrying out laser engraving operation on the first ink layer through the laser engraving mechanism so as to form a first circuit groove on the first ink layer;

step S107: performing electroless plating operation on the first ink layer through a first electroless plating mechanism arranged along the conveying direction of the bearing film so as to form a first circuit layer in the first circuit groove;

step S109: applying an LCP slurry to the first ink layer and the first circuit layer by a first degreasing mechanism disposed along the carrier film transport direction to form an LCP barrier layer on the first ink layer and the first circuit layer;

step S111: coating LDS ink on the LCP barrier layer through a next ink scraping mechanism arranged along the conveying direction of the bearing film so as to form a second ink layer on the LCP barrier layer;

step S113: carrying out laser etching operation on the second ink layer through a next laser etching mechanism arranged along the conveying direction of the bearing film so as to form a second circuit groove on the second ink layer;

step S115: performing chemical plating operation on the second ink layer through a next chemical plating mechanism arranged along the conveying direction of the bearing film so as to form a second circuit layer in the second circuit groove;

step S117: applying LCP slurry to the second ink layer and the second circuit layer by a next degreasing mechanism disposed along the carrier film transport direction to form an LCP barrier layer on the second ink layer and the second circuit layer;

step S119: repeating the steps S111 to S117 at least once to form a multi-layered wiring tape;

step S121: die-cutting the multilayer circuit strip by the die-cutting device to form a multilayer circuit semi-finished product with a through hole;

step S123: and filling silver paste into the through hole through the paste filling device to form a through piece in the through hole, wherein the through piece is electrically connected with the first circuit layer and each second circuit layer respectively, so that a multi-layer LCP circuit is formed.

In one embodiment, the chemical plating mechanism of each manufacturing device comprises a liquid medicine tank and a pressing roller, the pressing roller of the chemical plating mechanism of each manufacturing device is rotatably arranged in the corresponding liquid medicine tank, and the bearing film is wound around the pressing roller of the chemical plating mechanism of each manufacturing device, so that the bearing film enters the liquid medicine tank of each manufacturing device to be subjected to chemical plating.

In one embodiment, each of the medicine water tanks is filled with copper ion solution or gold ion solution.

In one embodiment, each of the medicine water tanks further contains a palladium catalyst.

In one embodiment, each of the ink scraping mechanisms includes an ink scraping component and an ink baking and curing component, each of the ink scraping components and the corresponding ink baking and curing component are sequentially arranged along the conveying direction of the carrier film, each of the ink scraping components is used for scraping and coating LDS ink on the carrier film or the corresponding LCP barrier layer, and each of the ink baking and curing components is used for curing the corresponding first ink layer or the corresponding second ink layer.

In one embodiment, the step S103 includes:

scraping LDS ink on the bearing film through the ink scraping assembly so as to form a first ink viscous layer on the bearing film;

and baking the first ink viscous layer through the corresponding ink baking and curing assembly so as to cure the first ink viscous layer to form a first ink layer.

In one embodiment, the step S113 includes:

blade coating an LDS ink on the LCP barrier layer by a further said doctor blade assembly to form a second ink viscous layer on the resin layer;

and baking the second ink viscous layer through the corresponding ink baking and curing assembly so as to cure the second ink viscous layer to form a second ink layer.

In one embodiment, the chemical plating mechanism comprises a silver paste knife coating assembly and a silver paste baking and curing assembly, and the silver paste knife coating assembly and the silver paste baking and curing assembly are sequentially arranged along the conveying direction of the bearing film;

the step S125 includes:

the silver paste is scraped into the via hole through the silver paste scraping and coating assembly;

and baking the silver paste in the via hole through the silver paste baking and curing assembly so as to cure the silver paste in the via hole to form the via piece.

In one embodiment, in the step S123, the number of the via holes is a plurality.

In one embodiment, the carrier film is a PPS film.

Compared with the prior art, the invention has at least the following advantages:

the LCP barrier layer, the first ink layer and the second ink layers are obtained in a doctor-blading mode, baking is needed for curing the LCP barrier layer, the first ink layer and the second ink layers, the baking temperature is lower than the hot-pressing temperature of a hot press, and the laser etching temperature is also lower than the hot-pressing temperature of the hot press, so that the fluidity of the LCP barrier layers in the subsequent steps is reduced, the thickness of the circuit is more uniform, the influence on the impedance of the circuit is suppressed, and the discontinuity of the impedance is further suppressed. In addition, as the LCP barrier layer, the first ink layer and the second ink layers are adhered to the corresponding parts in a doctor-blade slurry mode, the acting force of doctor-blade coating is smaller than the pressing force of a hot press, the drifting problem of the LCP barrier layer, the first ink layer and the second ink layers is restrained, namely the drifting of a circuit is restrained. Thus, the uniformity of the thickness of the circuit is improved, meanwhile, the drift of the circuit is restrained, and the quality of the multi-layer LCP circuit is improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a flow chart of steps of a process for fabricating a multi-layer LCP line according to one embodiment;

FIG. 2 is a schematic diagram of a circuit fabrication apparatus according to an embodiment;

fig. 3 is a schematic view of a further partial structure of the line making apparatus shown in fig. 2;

fig. 4 is a schematic view of a further partial structure of the line making apparatus shown in fig. 2;

fig. 5 is a schematic view of a further partial structure of the line making apparatus shown in fig. 2;

fig. 6 is a schematic view of a further partial structure of the line making apparatus shown in fig. 2;

fig. 7 is a schematic view of a further partial structure of the line making apparatus shown in fig. 2;

fig. 8 is a schematic view of a further partial structure of the line making apparatus shown in fig. 2;

fig. 9 is a schematic view of still another partial structure of the line making apparatus shown in fig. 2;

fig. 10 is a schematic diagram of a multilayer circuit semi-finished product produced by the circuit production apparatus shown in fig. 2;

fig. 11 is a schematic view of a further partial structure of the line making apparatus shown in fig. 2;

fig. 12 is a multilayer LCP line made by the line making apparatus shown in fig. 2.

Detailed Description

In order that the invention may be readily understood, a more complete description of the invention will be rendered by reference to the appended drawings. The drawings illustrate preferred embodiments of the invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

The application provides a circuit preparation equipment, circuit preparation equipment are used for making multilayer LCP circuit, and circuit preparation equipment is including bearing the coil stock, unreeling device and coiling mechanism, and unreeling device and coiling mechanism are used for carrying out blowing and receiving the material to bearing the coil stock respectively, form the preparation district between unreeling device and the coiling mechanism. Further, the line manufacturing equipment further comprises a manufacturing device, a die cutting device and a slurry filling device, wherein the manufacturing device, the die cutting device and the slurry filling device are all positioned in the manufacturing area and are sequentially arranged along the transmission direction of the bearing film for bearing the coil stock; the number of the manufacturing devices is at least three, the at least three manufacturing devices are sequentially arranged along the transmission direction of the bearing film, and each manufacturing device comprises an ink scraping mechanism, a laser etching mechanism, a chemical plating mechanism and a fat scraping mechanism which are sequentially arranged along the transmission direction of the bearing film.

The application also provides a manufacturing process of the multilayer LCP circuit, which at least comprises the following steps:

step S101: respectively winding and unwinding the bearing coil stock in an unwinding device and a winding device;

step S103: coating LDS ink on the bearing film through an ink scraping mechanism so as to form a first ink layer on the bearing film;

step S105: carrying out laser engraving operation on the first ink layer through a laser engraving mechanism so as to form a first circuit groove on the first ink layer;

step S107: performing chemical plating operation on the first ink layer through a first chemical plating mechanism arranged along the conveying direction of the bearing film so as to form a first circuit layer in the first circuit groove;

step S109: applying an LCP slurry to the first ink layer and the first circuit layer by a first degreasing device disposed along a carrier film transport direction to form an LCP barrier layer on the first ink layer and the first circuit layer;

step S111: coating LDS ink on the LCP barrier layer through a next ink scraping mechanism arranged along the conveying direction of the bearing film so as to form a second ink layer on the LCP barrier layer;

step S113: carrying out laser etching operation on the second ink layer through a next laser etching mechanism arranged along the conveying direction of the bearing film so as to form a second circuit groove on the second ink layer;

step S115: performing chemical plating operation on the second ink layer through a next chemical plating mechanism arranged along the conveying direction of the bearing film so as to form a second circuit layer in the second circuit groove;

step S117: coating LCP slurry on the second ink layer and the second circuit layer through a next degreasing mechanism arranged along the conveying direction of the bearing film so as to form an LCP barrier layer on the second ink layer and the second circuit layer;

step S119: repeating steps S111 to S117 at least once to form a multi-layered circuit strip;

step S121: die-cutting the multilayer circuit strip by a die-cutting device to form a multilayer circuit semi-finished product with a through hole;

step S123: and filling silver paste into the through holes through the paste filling device to form conducting parts in the through holes, wherein the conducting parts are respectively and electrically connected with the first circuit layer and each second circuit layer, and then a multi-layer LCP circuit is formed.

According to the circuit manufacturing equipment and the manufacturing process of the multi-layer LCP circuit, the LCP barrier layer, the first ink layer and the second ink layers are obtained in a doctor-blading mode, baking is needed for curing the LCP barrier layer, the first ink layer and the second ink layers, the baking temperature is lower than the hot-pressing temperature of a hot press, and the laser engraving temperature is also lower than the hot-pressing temperature of the hot press, so that the flowability of the LCP barrier layers in the subsequent steps is reduced, the thickness of the circuit is more uniform, the influence on circuit impedance is inhibited, and the discontinuity of impedance is further inhibited. In addition, as the LCP barrier layer, the first ink layer and the second ink layers are adhered to the corresponding parts in a doctor-blade slurry mode, the acting force of doctor-blade coating is smaller than the pressing force of a hot press, the drifting problem of the LCP barrier layer, the first ink layer and the second ink layers is restrained, namely the drifting of a circuit is restrained. Thus, the uniformity of the thickness of the circuit is improved, meanwhile, the drift of the circuit is restrained, and the quality of the multi-layer LCP circuit is improved.

For better understanding of the technical solutions and advantageous effects of the present application, the following details are further described with reference to specific embodiments:

as shown in fig. 2, the circuit manufacturing apparatus of an embodiment includes a carrying coil 100, an unreeling device 200, and a reeling device 300, where the unreeling device 200 and the reeling device 300 are respectively used for unreeling and reeling the carrying coil 100, that is, the carrying coil 100 is sleeved on an unreeling roller of the unreeling device 200, one end of a carrying film 110 of the carrying coil 100 is pulled on the reeling device 300, so that one end of the carrying film 110 is wound on a reeling roller of the reeling device 300, so that the unreeling roller is used for unreeling the carrying film 110, and the reeling roller is used for reeling waste carrying film 110, and arrow a is a moving direction of the carrying film 110.

As shown in fig. 2 to 11, further, a manufacturing area is formed between the unreeling device 200 and the reeling device 300, the line manufacturing apparatus further includes a manufacturing device 400, a die cutting device 500 and a paste filling device 600, the manufacturing device 400, the die cutting device 500 and the paste filling device 600 are all located in the manufacturing area, and the manufacturing device 400, the die cutting device 500 and the paste filling device 600 are sequentially arranged along the transmission direction of the carrier film 110 carrying the roll 100. The number of the manufacturing devices 400 is at least three, and the at least three manufacturing devices 400 are sequentially arranged along the transport direction of the carrier film 110. In the present embodiment, the direction indicated by the arrow a is the moving direction of the carrier film 110. Each manufacturing apparatus 400 is configured to sequentially form the ink layer 120, the circuit layer 130, and the LCP barrier layer 140 on the carrier film 110, where the ink layer 120, the circuit layer 130, and the LCP barrier layer 140 are sequentially stacked in a direction away from the carrier film 110 to form a composite layer. The at least three manufacturing devices 400 are sequentially arranged along the transmission direction of the carrier film 110, so that a plurality of composite layers are sequentially stacked on the carrier film 110, and then a multi-layer circuit tape is formed. It is understood that the transport direction of the carrier film 110 is the pulling direction of the carrier film 110.

As shown in fig. 2 to 5, each manufacturing apparatus 400 further includes an ink scraping mechanism 410, a laser etching mechanism 420, a chemical plating mechanism 430, and a fat scraping mechanism 440, which are sequentially disposed along the conveying direction of the carrier film 110. As shown in fig. 2, the ink scraping mechanism 410 of the first manufacturing apparatus 400 in the conveying direction of the carrier film 110 is used to scrape the LDS ink onto the carrier film 110 to form the first ink layer 120; as shown in fig. 3, the laser engraving mechanism 420 of the first manufacturing apparatus 400 in the conveying direction of the carrier film 110 is used for performing an engraving operation on the first ink layer 120, so as to form a first line groove 121 on the first ink layer 120; as shown in fig. 4 and 5, the electroless plating mechanism 430 of the first manufacturing apparatus 400 in the conveying direction of the carrier film 110 is used to perform an electroless plating operation on the first ink layer 120 to form the first circuit layer 130 in the first circuit groove 121. As shown in fig. 5, the degreasing mechanism 440 of the first manufacturing apparatus 400 in the conveying direction of the carrier film 110 is used for blade-coating the LCP slurry on the first ink layer 120 and the first circuit layer 130 to form the LCP barrier layer 140 on the first ink layer 120 and the first circuit layer 130;

as shown in fig. 6, further, the doctor mechanism 410 of the second manufacturing apparatus 400 in the conveying direction of the carrier film 110 is used to doctor the LDS ink onto the LCP barrier layer 140 to form the second ink layer 120; as shown in fig. 7, the laser etching mechanism 420 of the second manufacturing apparatus 400 in the conveying direction of the carrier film 110 is used for performing laser etching operation on the second ink layer 120, so as to form a second circuit groove 121 on the second ink layer 120; the electroless plating mechanism 430 of the second manufacturing apparatus 400 in the conveying direction of the carrier film 110 is used for performing an electroless plating operation on the second ink layer 120 to form the second circuit layer 130 in the second circuit groove 121; as shown in fig. 8, the degreasing mechanism 440 of the second manufacturing apparatus 400 in the conveying direction of the carrier film 110 is used for blade-coating the LCP slurry on the second ink layer 120 and the second circuit layer 130 to form the LCP barrier layer 140 on the second ink layer 120 and the second circuit layer 130; the remaining fabrication apparatuses 400 in the transport direction of the carrier film 110 sequentially repeat the above fabrication to form a multi-layered wiring tape on the carrier film 110.

According to the circuit manufacturing equipment, the LCP barrier layer 140, the first ink layer 120 and the second ink layers 120 are obtained through the doctor blade coating mode, baking is needed for curing the LCP barrier layer 140, the first ink layer 120 and the second ink layers 120, the baking temperature is lower than the hot pressing temperature of a hot press, and the laser engraving temperature is also lower than the hot pressing temperature of the hot press, so that the flowability of the LCP barrier layer 140 in the subsequent steps is reduced, the thickness of a circuit is more uniform, the influence on circuit impedance is suppressed, and the discontinuity of impedance is further suppressed. In addition, since the LCP barrier layer 140, the first ink layer 120, and the second ink layers 120 are all attached to the corresponding portions by means of doctor blade, the force of doctor blade coating is small relative to the pressing force of the hot press, and the problem of drifting of the LCP barrier layer 140, the first ink layer 120, and the second ink layers 120, that is, drifting of the lines, is suppressed. Thus, the uniformity of the thickness of the circuit is improved, meanwhile, the drift of the circuit is restrained, and the quality of the multi-layer LCP circuit is improved.

In one embodiment, the process for making the multi-layer LCP lines includes at least the steps of:

step S101: as shown in fig. 2, the load-bearing coil 100 is respectively stored in the unreeling device 200 and the reeling device 300.

As shown in fig. 2, in the present embodiment, the load-bearing coil 100 is first sleeved on the unreeling roller of the unreeling device 200, then one end of the load-bearing coil 100 is pulled to the reeling device 300, and one end of the load-bearing coil 100 is wound on the reeling roller of the reeling device 300. In this way, by one of the unreeling device 200 and the reeling device 300, the carrier film 110 moves in the manufacturing area formed between the unreeling device 200 and the reeling device 300, that is, the unreeled carrier film 110 is released by the unreeled device 200, and the waste carrier film 110 after die cutting is reeled by the reeling device 300, and the direction indicated by the arrow a is the moving direction of the carrier film 110.

Step S103: as shown in fig. 2, LDS ink is coated on the carrier film 110 by a first wiping mechanism 410 disposed along the conveying direction of the carrier film 110 to form a first ink layer 120 on the carrier film 110.

In this embodiment, as shown in fig. 2, the LDS material is a modified plastic containing an organometallic complex, and the organometallic complex is released into particles after laser irradiation. The first manufacturing device 400 disposed along the conveying direction of the carrier film 110 coats the LDS ink on the carrier film 110 by using the ink scraping mechanism 410, specifically, the corresponding ink scraping mechanism 410 coats the LDS ink on the carrier film 110, and as the unwinding device 200 and the winding device 300 rotate, that is, as the carrier film 110 moves, the corresponding ink scraping mechanism 410 uniformly scrapes the LDS ink on the carrier film 110, so that the first ink layer 120 is formed on the carrier film 110, and then the first ink layer 120 is cured by baking. The cured first ink layer 120 releases particles after laser irradiation, so that a groove structure can be formed on the first ink layer 120 after irradiation. In one embodiment, the temperature at which the first ink layer 120 is baked is 40 ℃ to 60 ℃. Further, the temperature at which the first ink layer 120 is baked is 50 ℃.

Step S105: as shown in fig. 3, a laser etching operation is performed on the first ink layer 120 by the laser etching mechanism 420 of the first manufacturing apparatus 400 disposed along the conveying direction of the carrier film 110, so as to form the first line groove 121 on the first ink layer 120.

As shown in fig. 3, in this embodiment, the unwinding device 200 and the winding device 300 stop rotating, so that the carrier film 110 stops moving, and the corresponding laser engraving mechanism 420 can perform laser engraving on the first ink layer 120, and the unwinding device 200 and the winding device 300 continue to rotate after the laser engraving is completed. Because the first ink layer 120 is formed by coating LDS ink, the first ink layer 120 is laser etched to form the first line groove 121, and the groove wall of the first line groove 121 is rough, which is favorable for metal ion adhesion, and further ensures the normal performance of electroless plating.

Step S107: as shown in fig. 4 and 5, the electroless plating operation is performed on the first ink layer 120 by the electroless plating mechanism 430 of the first manufacturing apparatus 400 disposed along the conveying direction of the carrier film 110 to form the first wiring layer 130 in the first wiring groove 121.

As shown in fig. 4 and 5, in the present embodiment, the plating mechanism 430 of the first manufacturing apparatus 400 disposed along the conveying direction of the carrier film 110 is used to plate gold, copper, or a conventional conductive material. Through the cooperation rotation of the unreeling device 200 and the reeling device 300, the carrier film 110 with the first line groove 121 moves into the corresponding chemical plating mechanism 430, then the unreeling device 200 and the reeling device 300 stop rotating, so that the first line groove 121 is fully plated in the corresponding chemical plating mechanism 430, and after the first line layer 130 is formed in the first line groove 121, the unreeling device 200 and the reeling device 300 continue to rotate so as to enable the carrier film 110 processed in the step to enter the next step.

Step S109: as shown in fig. 5, the LCP paste is applied to the first ink layer 120 and the first circuit layer 130 by a first degreasing mechanism 440 disposed along the conveying direction of the carrier film 110 to form the LCP barrier layer 140 on the first ink layer 120 and the first circuit layer 130.

As shown in fig. 5, in the present embodiment, the unreeling device 200 and the reeling device 300 rotate, the corresponding degreasing mechanism 440 applies the LCP slurry onto the first ink layer 120 and the first circuit layer 130, and along with the rotation of the unreeling device 200 and the reeling device 300, the corresponding degreasing mechanism 440 uniformly knits the LCP slurry onto the first ink layer 120 and the first circuit layer 130, thereby forming the LCP barrier layer 140 on the first ink layer 120 and the first circuit layer 130, and then baking the LCP barrier layer 140 to cure the LCP barrier layer 140. The LCP barrier layer 140 serves to block the first circuit layer 130 from contact with foreign matter, while the LCP barrier layer 140 of the present embodiment also serves as a carrier layer for the next formed ink layer 120. In one embodiment, the temperature to bake the LCP barrier layer 130 is 40 ℃ to 60 ℃. Further, the temperature to bake the LCP barrier layer 130 is 50 ℃.

Step S111: as shown in fig. 6, LDS ink is applied on the LCP barrier layer 140 by a next ink wiping mechanism 410 disposed along the transport direction of the carrier film 110 to form a second ink layer 120 on the LCP barrier layer 140.

As shown in fig. 6, in the present embodiment, the corresponding ink scraping mechanism 410 applies the LDS ink to the LCP barrier layer 140, and as the unreeling device 200 and the reeling device 300 rotate, the corresponding ink scraping mechanism 410 uniformly scrapes the LDS ink on the LCP barrier layer 140 to form the second ink layer 120 on the LCP barrier layer 140. In one embodiment, the temperature at which the second ink layer 120 is baked is 40 ℃ to 60 ℃. Further, the temperature at which the second ink layer 120 is baked is 50 ℃.

Step S113: as shown in fig. 7, the second ink layer 120 is subjected to a laser etching operation by a next laser etching mechanism 420 disposed along the conveying direction of the carrier film 110, so as to form a second line groove 121 on the second ink layer 120.

In the present embodiment, as shown in fig. 7, the unwinding device 200 and the winding device 300 stop rotating, so that the carrier film 110 stops moving. The corresponding laser engraving mechanism 420 performs laser engraving on the second ink layer 120 to form a second circuit groove 121 on the second ink layer 120. After the laser engraving is completed, the unreeling device 200 and the reeling device 300 continue to rotate. Because the first ink layer 120 is formed by coating LDS ink, the first ink layer 120 is laser etched to form the first line groove 121, and the groove wall of the first line groove 121 is rough, which is favorable for metal ion adhesion, and further ensures the normal performance of electroless plating.

Step S115: as shown in fig. 8, the second ink layer 120 is subjected to an electroless plating operation by a next electroless plating mechanism 430 disposed along the conveying direction of the carrier film 110 to form a second wiring layer 130 in the second wiring groove 121.

As shown in fig. 8, in the present embodiment, gold plating, copper, or a conventional conductive material is performed by the electroless plating mechanism 430 of the next manufacturing apparatus 400 disposed along the conveying direction of the carrier film 110. Through the cooperation rotation of the unreeling device 200 and the reeling device 300, the carrier film 110 with the second line groove 121 moves into the corresponding chemical plating mechanism 430, then the unreeling device 200 and the reeling device 300 stop rotating, so that the second line groove 121 is fully plated in the corresponding chemical plating mechanism 430, and after the second line layer 130 is formed in the second line groove 121, the unreeling device 200 and the reeling device 300 continue to rotate so as to enable the carrier film 110 processed in the step to enter the next step.

Step S117: as shown in fig. 8, the LCP paste is applied to the second ink layer 120 and the second circuit layer 130 by a next degreasing mechanism 440 disposed along the conveying direction of the carrier film 110 to form the LCP barrier layer 140 on the second ink layer 120 and the second circuit layer 130. In one embodiment, the temperature to bake the LCP barrier layer 130 is 40 ℃ to 60 ℃. Further, the temperature to bake the LCP barrier layer 130 is 50 ℃.

As shown in fig. 8, in the present embodiment, the unreeling device 200 and the reeling device 300 rotate, the corresponding degreasing mechanism 440 applies the LCP slurry onto the first ink layer 120 and the first circuit layer 130, and along with the rotation of the unreeling device 200 and the reeling device 300, the corresponding degreasing mechanism 440 uniformly knits the LCP slurry onto the second ink layer 120 and the second circuit layer 130, so as to form the LCP barrier layer 140 on the second ink layer 120 and the second circuit layer 130. The LCP barrier layer 140 is used to block the second circuit layer 130 from contacting with foreign objects, and the LCP barrier layer 140 of the present embodiment also serves as a carrier layer for the ink layer 120 formed next.

Step S119: steps S113 to S119 are repeated at least once to form a multi-layered circuit strip.

As shown in fig. 9, in this embodiment, each manufacturing apparatus 400 is configured to sequentially form the ink layer 120, the circuit layer 130, and the LCP barrier layer 140 on the carrier film 110, where the ink layer 120, the circuit layer 130, and the LCP barrier layer 140 are sequentially stacked in a direction away from the carrier film 110 to form a composite layer. The at least three manufacturing devices 400 are sequentially arranged along the transmission direction of the carrier film 110, so that a plurality of composite layers are sequentially stacked on the carrier film 110, and then a multi-layer circuit tape is formed.

Step S121: as shown in fig. 9, the multi-layered circuit tape is die-cut by a die-cutting device 500 to form a multi-layered circuit blank 700 having a via hole 701.

As shown in fig. 9 and 10, in the present embodiment, the unwinding device 200 and the winding device 300 stop moving. The die-cutting device 500 is provided with an outline die-cutting mechanism and a punching mechanism, the punching mechanism is positioned in the outline die-cutting mechanism, and the die-cutting operation is carried out on the multilayer circuit belt through the die-cutting device 500, so that the outline die-cutting mechanism is used for die-cutting a preset outline on the multilayer circuit belt, the punching mechanism is used for punching a through hole 701 on the multilayer circuit belt, and further the die-cutting device 500 is used for punching a multilayer circuit semi-finished product 700 with the through hole 701. After die cutting is completed, the unwind apparatus 200 and the wind-up apparatus 300 continue to rotate.

Step S123: as shown in fig. 11 and 12, the via 701 is filled with silver paste by the paste filling device 600 to form a via in the via 701, and the via is electrically connected to the first circuit layer 130 and each second circuit layer 130, respectively, thereby forming a multi-layer LCP circuit 800.

As shown in fig. 11 and 12, in the present embodiment, the carrier film 110 drives the multilayer circuit semi-finished product 700 into the paste filling device 600 along with the rotation of the unreeling device 200 and the reeling device 300. The paste filling device 600 coats silver paste on the upper surface of the first multilayer circuit semi-finished product 700, and along with the rotation of the unreeling device 200 and the reeling device 300, the paste filling device 600 scrapes the silver paste into the through holes 701, and then the silver paste in the through holes 701 is baked to solidify the silver paste and form a conducting piece, and the conducting piece is electrically connected with the first circuit layer and each second circuit layer respectively, so that a multilayer LCP circuit is formed.

It should be noted that, because the circuit structure is longer, the drawing of the present invention only intercepts a section of circuit structure.

According to the manufacturing process of the multi-layer LCP circuit, the LCP barrier layer 140, the first ink layer 120 and the second ink layers 120 are obtained through a doctor blade coating mode, baking is needed for curing the LCP barrier layer 140, the first ink layer 120 and the second ink layers 120, the baking temperature is lower than the hot pressing temperature of a hot press, and the laser carving temperature is also lower than the hot pressing temperature of the hot press, so that the flowability of the LCP barrier layers 140 in the subsequent steps is reduced, the thickness of the circuit is more uniform, the influence on the circuit impedance is inhibited, and the discontinuity of the impedance is further inhibited. In addition, since the LCP barrier layer 140, the first ink layer 120, and the second ink layers 120 are all attached to the corresponding portions by means of doctor blade, the force of doctor blade coating is small relative to the pressing force of the hot press, and the problem of drifting of the LCP barrier layer 140, the first ink layer 120, and the second ink layers 120, that is, drifting of the lines, is suppressed. Thus, the uniformity of the thickness of the circuit is improved, meanwhile, the drift of the circuit is restrained, and the quality of the multi-layer LCP circuit is improved.

As shown in fig. 3, in one embodiment, the plating mechanism 430 of each manufacturing apparatus 400 includes a liquid medicine tank 431 and a pressing roller 432, the pressing roller 432 of the plating mechanism 430 of each manufacturing apparatus 400 is rotatably disposed in the corresponding liquid medicine tank 431, and the carrier film 110 is wound around the pressing roller 432 of the plating mechanism 430 of each manufacturing apparatus 400, so that the carrier film 110 enters the liquid medicine tank 431 of each manufacturing apparatus 400 for electroless plating.

In one embodiment, each of the liquid medicine tanks 431 contains a copper ion solution or a gold ion solution, so that copper or copper is deposited in the first line tank 121 or the second line tank 121, thereby forming the first line layer 130 or the second line layer 130. In one embodiment, each of the baths 431 also contains a palladium catalyst.

In one embodiment, each of the ink scraping mechanisms 410 includes an ink scraping assembly and an ink baking curing assembly, each of the ink scraping assemblies and the corresponding ink baking curing assembly being disposed sequentially along the conveying direction of the carrier film 110, each of the ink scraping assemblies being configured to scrape LDS ink onto the carrier film 110 or onto the corresponding LCP barrier layer 140, each of the ink baking curing assemblies being configured to cure the corresponding first ink layer 120 or the corresponding second ink layer 120.

In one embodiment, step S103 includes: blade-coating LDS ink on the carrier film 110 by a scraping assembly to form a first ink viscous layer on the carrier film 110; the first ink viscous layer is baked by a corresponding ink bake curing assembly to cure the first ink viscous layer to form the first ink layer 120.

In one embodiment, step S113 includes: blade coating the LDS ink on the LCP barrier layer 140 by a further doctor blade assembly to form a second ink viscous layer on the resin layer; the second ink viscous layer is baked by a corresponding ink bake curing assembly to cure the second ink viscous layer to form a second ink layer 120.

In one embodiment, the plating mechanism 430 includes a silver paste blade coating component and a silver paste baking and curing component, which are sequentially disposed along the conveying direction of the carrier film 110. Further, step S125 includes: silver paste is scraped into the via 701 through the silver paste scraping assembly; and baking the silver paste in the via hole 701 by a silver paste baking and curing assembly so as to cure the silver paste in the via hole 701 to form a via piece, and further, the multi-layer circuits are mutually communicated.

In one embodiment, in step S123, the number of via holes 701 is plural.

In one embodiment, the carrier film 110 is a PPS film, so that the carrier film 110 has high carrying performance.

In one embodiment, the temperature of baking the silver paste is 40 ℃ to 60 ℃. Further, the temperature of baking the silver paste was 50 ℃.

Compared with the prior art, the invention has at least the following advantages:

the LCP barrier layer 140, the first ink layer 120, and the second ink layers 120 are obtained by doctor blade coating, and baking is needed to cure the LCP barrier layer 140, the first ink layer 120, and the second ink layers 120, wherein the baking temperature is lower than the hot pressing temperature of the hot press, and the laser etching temperature is also lower than the hot pressing temperature of the hot press, so that the fluidity of the LCP barrier layers 140 in the subsequent steps is reduced, the thickness of the circuit is more uniform, the influence on the impedance of the circuit is suppressed, and the discontinuity of the impedance is further suppressed. In addition, since the LCP barrier layer 140, the first ink layer 120, and the second ink layers 120 are all attached to the corresponding portions by means of doctor blade, the force of doctor blade coating is small relative to the pressing force of the hot press, and the problem of drifting of the LCP barrier layer 140, the first ink layer 120, and the second ink layers 120, that is, drifting of the lines, is suppressed. Thus, the uniformity of the thickness of the circuit is improved, meanwhile, the drift of the circuit is restrained, and the quality of the multi-layer LCP circuit is improved.

The above examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.

Claims (10)

1. The manufacturing process of the multilayer LCP circuit is characterized by comprising the steps of manufacturing the multilayer LCP circuit through circuit manufacturing equipment, wherein the circuit manufacturing equipment comprises a bearing coil stock, an unreeling device and a reeling device, the unreeling device and the reeling device are respectively used for unreeling and reeling the bearing coil stock, and a manufacturing area is formed between the unreeling device and the reeling device;

the line manufacturing equipment further comprises a manufacturing device, a die cutting device and a pulp filling device, wherein the manufacturing device, the die cutting device and the pulp filling device are all positioned in the manufacturing area and are sequentially arranged along the transmission direction of the bearing film for bearing the coil stock; the number of the manufacturing devices is at least three, the at least three manufacturing devices are sequentially arranged along the transmission direction of the bearing film, and each manufacturing device comprises an ink scraping mechanism, a laser carving mechanism, a chemical plating mechanism and a fat scraping mechanism which are sequentially arranged along the transmission direction of the bearing film;

the manufacturing process of the multilayer LCP circuit at least comprises the following steps:

step S101: respectively winding and unwinding the bearing coil stock in the unwinding device and the winding device;

step S103: coating LDS ink on the bearing film through the ink scraping mechanism so as to form a first ink layer on the bearing film;

step S105: carrying out laser engraving operation on the first ink layer through the laser engraving mechanism so as to form a first circuit groove on the first ink layer;

step S107: performing electroless plating operation on the first ink layer through a first electroless plating mechanism arranged along the conveying direction of the bearing film so as to form a first circuit layer in the first circuit groove;

step S109: applying an LCP slurry to the first ink layer and the first circuit layer by a first degreasing mechanism disposed along the carrier film transport direction to form an LCP barrier layer on the first ink layer and the first circuit layer;

step S111: coating LDS ink on the LCP barrier layer through a next ink scraping mechanism arranged along the conveying direction of the bearing film so as to form a second ink layer on the LCP barrier layer;

step S113: carrying out laser etching operation on the second ink layer through a next laser etching mechanism arranged along the conveying direction of the bearing film so as to form a second circuit groove on the second ink layer;

step S115: performing chemical plating operation on the second ink layer through a next chemical plating mechanism arranged along the conveying direction of the bearing film so as to form a second circuit layer in the second circuit groove;

step S117: applying LCP slurry to the second ink layer and the second circuit layer by a next degreasing mechanism disposed along the carrier film transport direction to form an LCP barrier layer on the second ink layer and the second circuit layer;

step S119: repeating the steps S111 to S117 at least once to form a multi-layered wiring tape;

step S121: die-cutting the multilayer circuit strip by the die-cutting device to form a multilayer circuit semi-finished product with a through hole;

step S123: and filling silver paste into the through hole through the paste filling device to form a through piece in the through hole, wherein the through piece is electrically connected with the first circuit layer and each second circuit layer respectively, so that a multi-layer LCP circuit is formed.

2. The process of claim 1, wherein the plating mechanism of each of the manufacturing devices comprises a liquid medicine tank and a press roller, the press roller of the plating mechanism of each of the manufacturing devices is rotatably disposed in the corresponding liquid medicine tank, and the carrier film is wound around the press roller of the plating mechanism of each of the manufacturing devices, so that the carrier film enters the liquid medicine tank of each of the manufacturing devices for chemical plating.

3. A process for making a multilayer LCP line according to claim 2, wherein each of said reservoirs contains a copper ion solution or a gold ion solution.

4. A process for making a multi-layer LCP line as defined in claim 3, wherein each of said drug solution reservoirs further contains a palladium catalyst.

5. A process for the production of a multilayer LCP line according to claim 1, wherein each of the doctor-bar mechanisms comprises a doctor-bar assembly and an ink bake-cure assembly, each of the doctor-bar assemblies and the corresponding ink bake-cure assembly being disposed in sequence along the direction of conveyance of the carrier film, each of the doctor-bar assemblies being configured to doctor-coat LDS ink onto the carrier film or onto the corresponding LCP barrier layer, each of the ink bake-cure assemblies being configured to cure the corresponding first ink layer or the corresponding second ink layer.

6. A process for producing a multilayer LCP line according to claim 5, wherein step S103 comprises:

scraping LDS ink on the bearing film through the ink scraping assembly so as to form a first ink viscous layer on the bearing film;

and baking the first ink viscous layer through the corresponding ink baking and curing assembly so as to cure the first ink viscous layer to form a first ink layer.

7. A process for producing a multilayer LCP line according to claim 5, wherein step S113 comprises:

blade coating an LDS ink on the LCP barrier layer by a further said doctor blade assembly to form a second ink viscous layer on the resin layer;

and baking the second ink viscous layer through the corresponding ink baking and curing assembly so as to cure the second ink viscous layer to form a second ink layer.

8. The process of claim 1, wherein the plating mechanism comprises a silver paste blade coating assembly and a silver paste baking and curing assembly, which are sequentially arranged along the conveying direction of the carrier film;

the step S125 includes:

the silver paste is scraped into the via hole through the silver paste scraping and coating assembly;

and baking the silver paste in the via hole through the silver paste baking and curing assembly so as to cure the silver paste in the via hole to form the via piece.

9. The process for producing a multi-layer LCP line according to claim 1, wherein in the step S123, the number of via holes is plural.

10. A process for making a multilayer LCP line according to claim 1, wherein the carrier film is PPS film.

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