CN116075060A - Manufacturing method of high-reliability POFV hole and PCB - Google Patents
Manufacturing method of high-reliability POFV hole and PCB Download PDFInfo
- Publication number
- CN116075060A CN116075060A CN202310173149.9A CN202310173149A CN116075060A CN 116075060 A CN116075060 A CN 116075060A CN 202310173149 A CN202310173149 A CN 202310173149A CN 116075060 A CN116075060 A CN 116075060A
- Authority
- CN
- China
- Prior art keywords
- hole
- pofv
- resin
- copper
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 70
- 229910052802 copper Inorganic materials 0.000 claims abstract description 70
- 239000010949 copper Substances 0.000 claims abstract description 70
- 229920005989 resin Polymers 0.000 claims abstract description 37
- 239000011347 resin Substances 0.000 claims abstract description 37
- 238000005530 etching Methods 0.000 claims abstract description 33
- 238000007747 plating Methods 0.000 claims abstract description 27
- 238000009713 electroplating Methods 0.000 claims abstract description 24
- 238000007788 roughening Methods 0.000 claims abstract description 16
- 238000001465 metallisation Methods 0.000 claims abstract description 11
- 238000000227 grinding Methods 0.000 claims abstract description 10
- 238000005553 drilling Methods 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 claims description 21
- 239000003822 epoxy resin Substances 0.000 claims description 9
- 229920000647 polyepoxide Polymers 0.000 claims description 9
- 239000003795 chemical substances by application Substances 0.000 claims description 7
- 238000005498 polishing Methods 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 4
- 238000010329 laser etching Methods 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 7
- XEMZLVDIUVCKGL-UHFFFAOYSA-N hydrogen peroxide;sulfuric acid Chemical class OO.OS(O)(=O)=O XEMZLVDIUVCKGL-UHFFFAOYSA-N 0.000 description 3
- 241001391944 Commicarpus scandens Species 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 239000003814 drug Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/025—Abrading, e.g. grinding or sand blasting
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a manufacturing method of a high-reliability POFV hole and a PCB, belonging to the field of printed circuit boards, and specifically comprising the following steps: s1, drilling holes in a PCB; s2, carrying out primary copper electroplating on the whole plate through metallization, so that a copper plating layer is formed on the surface of the PCB and the inner wall of the hole; s3, filling resin into the holes after copper plating; s4, grinding the resin outside the overflow hole; s5, etching the resin surface in the hole to enable the resin plane to be lower than the plate surface after the first copper plating; s6, micro-etching roughening is carried out on the hole wall copper exposed out in the etched hole; s7, carrying out metallization on the whole plate for the second time, and electroplating copper. According to the invention, the resin in the hole is etched, so that a groove is formed between the plane of the resin in the hole and the plate surface after the first electroplating, and then the cap copper subjected to the second electroplating is inlaid in the hole, so that the stress point of the cap copper during cold and hot impact is improved, the cold and hot impact resistance is greatly enhanced, the problem of weaker reliability of the POFV hole is solved, and the product can be suitable for extreme environments of industries such as automobiles, military industry and aerospace.
Description
Technical Field
The invention relates to the field of printed circuit boards, in particular to a manufacturing method of a high-reliability POFV hole and a PCB.
Background
A PCB, i.e. a printed circuit board, is a support for electronic components, almost every type of electronic equipment, as small as electronic watches, calculators, as large as computers, communication electronics, military weapon systems, and as long as there are electronic components such as integrated circuits, PCB boards are used for electrical interconnection between the individual components. The PCB consists of an insulating bottom plate, connecting wires and bonding pads for assembling and welding electronic elements, and has the dual functions of a conductive circuit and the insulating bottom plate. The device can replace complex wiring, realize electrical connection among elements in a circuit, simplify the assembly and welding work of electronic products, reduce the whole volume, reduce the product cost and improve the quality and reliability of electronic equipment.
With the development of technology, particularly after the emergence of semiconductor transistors, the demand for PCBs has increased dramatically. The rapid development and wide application of integrated circuits make the volume of electronic devices smaller and the wiring density and difficulty of PCB circuits larger and larger, and the PCB is developed from a single-sided board into a double-sided board and a multi-sided board, and the manufacturing process of the circuit board is also continuously updated to conform to the development trend. The use of the POFV process is becoming more and more widespread as well, the POFV (Plated On Filled Via) process is to drill holes in a circuit board and to deposit copper into the holes to obtain metallized holes to effect conduction between corresponding circuit layers, then to plug the holes with resin and remove excess resin from the holes, and finally to deposit copper into the surfaces of the plug holes. The POFV process can reduce the area of the board, solve the problems of wires and wiring, and improve the wiring density.
In the prior art, most of the resin in the holes is polished to be parallel to the plate surface after the first copper electroplating, and then the second copper electroplating is performed on the plane. The invention patent CN115474342A discloses a circuit board POFV plug hole manufacturing method and a circuit board, wherein the method comprises the following steps: 1. drilling holes at preset positions on the PCB and cleaning the holes; 2. copper deposition and full plate electroplating to metalize the drilled holes; 3. coating a layer of alkaline dry film on the upper and lower surfaces of the PCB, exposing and developing, and plugging holes with resin; 4. polishing until the resin is flush with the dry film; 5. removing resin in a dry film hole on the polished PCB by a laser drilling machine; 6. performing film stripping treatment on the PCB to obtain a PCB with hole plugging resin flush with the board surface; 7. and carrying out copper deposition electroplating treatment on the surface of the hole plugging resin. The method avoids the problem that the abrasive produced in the traditional grinding process blocks the non-POFV hole by firstly attaching a dry film and laser ablating resin. However, the resin is polished to be flush with the PCB, and then copper is plated for the second time, so that the POFV hole has the problem of weaker reliability due to the fact that the expansion coefficients of the resin material in the hole and the cured material of the PCB are inconsistent and the cap copper plated on the POFV hole is easy to break under repeated stretching when subjected to cold thermal shock or extreme environment (as shown in figure 1).
Disclosure of Invention
Aiming at the problem that the reliability of the POFV hole in the prior art is weak, the invention provides a manufacturing method of the POFV hole with high reliability and a PCB, and the manufacturing method is realized by the following technology.
A manufacturing method of a high-reliability POFV hole comprises the following steps:
s1, drilling holes in a PCB;
s2, carrying out primary copper electroplating on the whole plate through metallization, so that a copper plating layer is formed on the surface of the PCB and the inner wall of the hole;
s3, filling resin into the holes after copper plating;
s4, grinding the resin outside the overflow hole;
s5, etching the resin surface in the hole to enable the resin plane to be lower than the plate surface after the first copper plating;
s6, micro-etching roughening is carried out on the hole wall copper exposed out in the etched hole;
s7, carrying out metallization on the whole plate for the second time, and electroplating copper.
According to the invention, through etching the resin in the hole after filling and polishing the resin, the plane in the hole is lower than the plate surface after the first copper plating, then microetching and roughening are carried out on the hole wall copper exposed in the hole after etching, and then the second copper plating is carried out, finally, an embedded POFV structure is formed at the hole opening, the structure can enable the first and second copper plating in the hole to be in direct contact, the binding force of the first and second copper plating is enhanced, and the stress bearing capacity of the cap copper of the second copper plating of the hole opening is obviously enhanced. According to the method, the stress point of the cap copper during cold and hot impact is improved by embedding the cap copper into the hole, so that the cold and hot impact resistance is greatly enhanced, and the problem of weaker reliability of the POFV hole is solved.
Preferably, in step S5, the etching depth is 1-5 mil, and the specific etching depth can be adjusted according to the thickness of the PCB board.
Too shallow etching depth can cause insufficient binding force of the front and back electroplating copper, and the cap copper electroplated on the POFV hole is easy to break under repeated stretching; too deep an etch depth can result in pits that are difficult to fill with copper, and pits appear in the hole after POFV copper plating.
Preferably, in step S5, the etching mode is a fixed-depth laser etching or a plasma weather etching.
Preferably, in step S6, the micro-etching roughening manner is micro-etching with a liquid medicine, and the liquid medicine includes one of a roughening micro-etching agent and an ultra-roughening micro-etching agent.
Preferably, in step S1, the PCB board is formed by laminating a double-sided board or a multi-layer board.
Preferably, in step S1, the hole is a through hole, a fixed-depth drilled hole or a laser hole.
Preferably, in step S3, the resin is filled by a vacuum hole plugging machine, and the resin is epoxy resin.
Preferably, in step S4, the grinding mode is belt grinding or ceramic brush grinding.
The invention also provides a POFV hole, which is manufactured by the manufacturing method of the POFV hole with high reliability.
The invention also provides a PCB board, which comprises the POFV hole.
Compared with the prior art, the invention has the following advantages:
the method for manufacturing the high-reliability POFV hole comprises the steps of etching resin in the hole to enable the plane in the hole to be lower than the plate surface after first copper plating, then micro-etching roughening the hole wall copper exposed in the hole after etching, and finally embedding cap copper subjected to second electroplating into the hole to form an embedded POFV structure at the hole opening. The method of the invention strengthens the binding force of the first electroplating and the second electroplating, improves the stress point of the cap copper during cold and hot impact, greatly strengthens the cold and hot impact resistance, solves the problem of weaker reliability of POFV holes, and enables the product to be suitable for extreme environments of the industries of automobiles, military industry, aerospace and the like.
Drawings
FIG. 1 is a schematic diagram of a conventional POFV failure;
FIG. 2 is a process flow diagram of a method for fabricating a high reliability POFV hole of the present invention;
FIG. 3 is a schematic diagram of step S1 of the method for fabricating a high reliability POFV hole of the present invention;
FIG. 4 is a schematic diagram of step S2 of the method for fabricating a high reliability POFV hole of the present invention;
FIG. 5 is a schematic diagram of step S3 of the method for fabricating a high reliability POFV hole of the present invention;
FIG. 6 is a schematic diagram of step S5 of the method for fabricating a high reliability POFV hole of the present invention;
fig. 7 is a schematic diagram of step S7 of the method for fabricating a high reliability POFV hole according to the present invention.
Wherein: 1. a PCB board; 2. copper on the substrate; 3. a copper plating layer for the first plating; 4. an epoxy resin; 5. copper plating layer of the second electroplating.
Detailed Description
The following description of the present invention will be made clearly and fully, and it is apparent that the embodiments described are only some, but not all, of the embodiments of the present invention. All other embodiments, which can be made by one of ordinary skill in the art without undue burden on the person of ordinary skill in the art based on embodiments of the present invention, are within the scope of the present invention.
The epoxy, mid-coarsening microetching and super-coarsening microetching described in the examples below are all common commercial products.
Example 1
Referring to the process flow chart of fig. 1, the method for fabricating a high reliability POFV hole according to the present embodiment includes the following steps:
s1, drilling a through hole and a deep drilling hole on a PCB formed by pressing double-sided boards, as shown in FIG. 3;
s2, carrying out primary copper electroplating on the whole plate through metallization, so that a copper plating layer is formed on the surface of the PCB and the inner wall of the hole, as shown in FIG. 4;
s3, filling epoxy resin into the holes after copper plating by a vacuum hole plugging machine, as shown in FIG. 5;
s4, grinding the resin outside the overflow hole by using an abrasive belt;
s5, performing plasma weather etching on the surface of the epoxy resin in the hole, wherein the etching depth is 3mil, as shown in FIG. 6;
s6, adopting a roughening microetching agent in a sulfuric acid-hydrogen peroxide series to microetch and roughen the hole wall copper exposed in the etched hole;
s7, carrying out secondary copper electroplating on the whole board, and enabling the etched groove and the PCB plane to form a copper plating layer, as shown in FIG. 7.
Example 2
The manufacturing method of the high-reliability POFV hole of the embodiment comprises the following steps:
s1, drilling a through hole in a PCB formed by laminating a plurality of layers of boards;
s2, carrying out primary copper electroplating on the whole plate through metallization, so that a copper plating layer is formed on the surface of the PCB and the inner wall of the hole;
s3, filling epoxy resin into the copper plated holes through a vacuum hole plugging machine;
s4, grinding the resin outside the overflow hole by using a ceramic brush;
s5, carrying out fixed-depth laser etching on the surface of the epoxy resin in the hole, wherein the etching depth is 5mil;
s6, adopting a roughening microetching agent in a sulfuric acid-hydrogen peroxide series to microetch and roughen the hole wall copper exposed in the etched hole;
s7, carrying out secondary copper electroplating on the whole board by metallization, and forming a copper plating layer on the etched groove and the PCB plane.
Example 3
The manufacturing method of the high-reliability POFV hole of the embodiment comprises the following steps:
s1, drilling a through hole in a PCB formed by laminating a plurality of layers of boards;
s2, carrying out primary copper electroplating on the whole plate through metallization, so that a copper plating layer is formed on the surface of the PCB and the inner wall of the hole;
s3, filling epoxy resin into the copper plated holes through a vacuum hole plugging machine;
s4, grinding the resin outside the overflow hole by using a ceramic brush;
s5, carrying out fixed-depth laser etching on the surface of the epoxy resin in the hole, wherein the etching depth is 1mil;
s6, carrying out microetching roughening on the hole wall copper exposed in the etched hole by adopting sulfuric acid-hydrogen peroxide series super-roughening microetching agents;
s7, carrying out secondary copper electroplating on the whole board by metallization, and forming a copper plating layer on the etched groove and the PCB plane.
According to the manufacturing method of the high-reliability POFV hole, after resin filling and polishing, the resin in the hole is etched, so that the plane in the hole is lower than the plate surface after first copper plating, then micro-etching roughening is carried out on the hole wall copper exposed in the hole after etching, and then the cap copper subjected to second electroplating is inlaid in the hole, so that the stress point of the cap copper during cold and hot impact is improved, the cold and hot impact resistance is greatly enhanced, and the problem of weaker reliability of the POFV hole is solved.
The above detailed description describes in detail the practice of the invention, but the invention is not limited to the specific details of the above embodiments. Many simple modifications and variations of the technical solution of the present invention are possible within the scope of the claims and technical idea of the present invention, which simple modifications are all within the scope of the present invention.
Claims (10)
1. The manufacturing method of the high-reliability POFV hole is characterized by comprising the following steps:
s1, drilling holes in a PCB;
s2, carrying out primary copper electroplating on the whole plate through metallization, so that a copper plating layer is formed on the surface of the PCB and the inner wall of the hole;
s3, filling resin into the holes after copper plating;
s4, grinding the resin outside the overflow hole;
s5, etching the resin surface in the hole to enable the resin plane to be lower than the plate surface after the first copper plating;
s6, micro-etching roughening is carried out on the hole wall copper exposed out in the etched hole;
s7, carrying out metallization on the whole plate for the second time, and electroplating copper.
2. The method of manufacturing a highly reliable POFV hole according to claim 1, wherein the etching depth in step S5 is 1 to 5mil.
3. The method of claim 1, wherein in step S5, the etching is a constant depth laser etching or a plasma weather etching.
4. The method of fabricating a highly reliable POFV hole according to claim 1, wherein in step S6, the micro-etching roughening is performed by micro-etching with a liquid chemical, and the liquid chemical includes one of a micro-etching agent for roughening and a micro-etching agent for super-roughening.
5. The method for fabricating a high reliability POFV hole according to claim 1, wherein in step S1, the PCB is formed by laminating a double-sided board or a multi-layer board.
6. The method of fabricating a highly reliable POFV hole according to claim 1, wherein in step S1, the hole is a through hole, a drilled hole with a constant depth, or a laser hole.
7. The method of fabricating a highly reliable POFV hole according to claim 1, wherein in step S3, the resin is filled by a vacuum hole plugging machine, and the resin is an epoxy resin.
8. The method of claim 1, wherein in step S4, the polishing is abrasive belt polishing or ceramic brush polishing.
9. A POFV hole, wherein the POFV hole is manufactured by the high reliability POFV hole manufacturing method according to any one of claims 1 to 8.
10. A PCB board comprising the POFV hole of claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310173149.9A CN116075060A (en) | 2023-02-28 | 2023-02-28 | Manufacturing method of high-reliability POFV hole and PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310173149.9A CN116075060A (en) | 2023-02-28 | 2023-02-28 | Manufacturing method of high-reliability POFV hole and PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116075060A true CN116075060A (en) | 2023-05-05 |
Family
ID=86173170
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310173149.9A Pending CN116075060A (en) | 2023-02-28 | 2023-02-28 | Manufacturing method of high-reliability POFV hole and PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116075060A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050081376A1 (en) * | 2003-10-21 | 2005-04-21 | Sir Jiun H. | Robust interlocking via |
| JP2010067813A (en) * | 2008-09-11 | 2010-03-25 | Tripod Technology Corp | Method of capping circuit board |
| CN111148355A (en) * | 2019-12-31 | 2020-05-12 | 生益电子股份有限公司 | Method for improving bonding force between copper layer and resin in back drilling area and PCB |
| CN216565724U (en) * | 2021-12-24 | 2022-05-17 | 江西志浩电子科技有限公司 | PCB heat radiation structure embedded with high heat radiation metal block and PCB |
| CN115003035A (en) * | 2022-06-30 | 2022-09-02 | 萍乡市联锦成科技有限公司 | Method for filling through hole of printed circuit core board |
-
2023
- 2023-02-28 CN CN202310173149.9A patent/CN116075060A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050081376A1 (en) * | 2003-10-21 | 2005-04-21 | Sir Jiun H. | Robust interlocking via |
| JP2010067813A (en) * | 2008-09-11 | 2010-03-25 | Tripod Technology Corp | Method of capping circuit board |
| CN111148355A (en) * | 2019-12-31 | 2020-05-12 | 生益电子股份有限公司 | Method for improving bonding force between copper layer and resin in back drilling area and PCB |
| CN216565724U (en) * | 2021-12-24 | 2022-05-17 | 江西志浩电子科技有限公司 | PCB heat radiation structure embedded with high heat radiation metal block and PCB |
| CN115003035A (en) * | 2022-06-30 | 2022-09-02 | 萍乡市联锦成科技有限公司 | Method for filling through hole of printed circuit core board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100733253B1 (en) | High density printed circuit board and manufacturing method thereof | |
| CN102438413B (en) | Second-order ladder groove bottom graphical printed board and processing method thereof | |
| KR100890447B1 (en) | Manufacturing method of printed circuit board | |
| JP2005286112A (en) | Printed circuit board and its manufacturing method | |
| JP2006222216A (en) | Wiring board and its manufacturing method | |
| JP2016134624A (en) | Electronic element built-in printed circuit board and manufacturing method therefor | |
| KR20030091793A (en) | Multilayer circuit board, process of manufacturing same, board for multilayer circuitry, and electronic apparatus | |
| CN109788663B (en) | Manufacturing method of circuit board and circuit board manufactured by same | |
| JP6798076B2 (en) | Embedded substrate and manufacturing method of embedded substrate | |
| US7245001B2 (en) | Multi-layer integrated circuit package | |
| KR100752017B1 (en) | Manufacturing Method of Printed Circuit Board | |
| KR100783462B1 (en) | Electronic components embedded pcb and the method for manufacturing thereof | |
| CN116075060A (en) | Manufacturing method of high-reliability POFV hole and PCB | |
| KR20150001125A (en) | Complex integrated circuit device package manufacturing method | |
| KR20030011433A (en) | Manufacturing method for hidden laser via hole of multi-layered printed circuit board | |
| JP2017228727A (en) | Wiring board and manufacturing method of the same | |
| KR100752956B1 (en) | The printed circuit board for the electric connection of the hole and the manufacturing method | |
| KR100688697B1 (en) | Method of manufacturing package substrate | |
| KR100762758B1 (en) | Electro component embedded PCB and manufacturing method thereof | |
| KR20030071391A (en) | Method for creating bump and making printed circuit board using the said bump | |
| KR100477258B1 (en) | Method for creating bump and making printed circuit board using the said bump | |
| EP0572232A2 (en) | A multilayer printed circuit board and method for manufacturing same | |
| JPH11191482A (en) | Manufacture of printed wiring board | |
| KR101133120B1 (en) | Maunfacturing method for semiconductor package board | |
| KR100566912B1 (en) | A manufacture method of flexible printed circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |