CN116072581A - Chip die bonding device - Google Patents
Chip die bonding device Download PDFInfo
- Publication number
- CN116072581A CN116072581A CN202310343450.XA CN202310343450A CN116072581A CN 116072581 A CN116072581 A CN 116072581A CN 202310343450 A CN202310343450 A CN 202310343450A CN 116072581 A CN116072581 A CN 116072581A
- Authority
- CN
- China
- Prior art keywords
- rod
- plate
- supporting
- plates
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Reciprocating Conveyors (AREA)
- Die Bonding (AREA)
Abstract
A die attach apparatus comprising: two backup pads, feed mechanism, transport mechanism. Two bearing plates which move in opposite directions are arranged between the supporting plates, and the supporting plates are sequentially provided with a chip clamping module and a heating module along the length direction of the supporting plates; the feeding mechanism is arranged at one end of the supporting plate and comprises a pushing assembly and two feeding assemblies, the feeding assemblies comprise obliquely arranged carrying frames for placing the lead frames, and the carrying frames are provided with movable lifting plates for pushing the lead frames; the pushing assembly comprises a moving rod which moves back and forth between the two supporting plates, and a second push pin is arranged below the moving rod and used for pushing the lead frame to the bearing plate; the conveying mechanism comprises a connecting rod which moves back and forth along the length direction of the supporting plate and rotates around the axis of the connecting rod, a plurality of supporting rods are arranged on the connecting rod, and one end of each supporting rod is provided with a first push pin which faces downwards and is used for pushing the lead frame. The lead frame can be continuously and uninterruptedly conveyed and the chips are placed, so that smooth production is ensured, and the production efficiency is improved.
Description
Technical Field
The invention relates to the technical field of semiconductor devices, in particular to a chip die bonding device.
Background
In the production process of semiconductor devices, a plurality of chips are required to be fixed on a lead frame in a certain arrangement. In the prior art, a manner of arranging a sucker on a manipulator is generally adopted to absorb and transfer a chip onto a lead frame, then the connection between the chip and the lead frame is stable in a heating manner, and when the chip is placed on the lead frame, the lead frame is required to stop moving, so that the lead frame is generally conveyed by adopting a conveying belt with intermittent conveying in the prior art, but when the conveying is stopped, the position of the lead frame can deviate, and a gap exists between two adjacent lead frames, so that the chip cannot be placed at the corresponding position on the lead frame; in another die bonding apparatus, a lead frame is continuously moved, and a chip is placed on the lead frame by a mechanical arm swinging back and forth, however, after the placement of the chip is completed, the lead frame needs to be removed and a new lead frame needs to be placed, which results in a pause in the production process, and the production process cannot be continuously and continuously performed, so that the production beat is affected, and the production efficiency is reduced.
Disclosure of Invention
To the not enough of above-mentioned relevant prior art, this application provides a chip die bonding device, can place the chip on lead frame in succession incessantly to avoid lead frame to take place to shift at the transportation in-process, guarantee going on smoothly of production, improve production efficiency, have stronger practicality.
In order to achieve the above object, the present invention adopts the following technique:
a die attach apparatus comprising: backup pad, feed mechanism, transport mechanism.
The two supporting plates are symmetrically arranged, two symmetrically arranged bearing plates which move in opposite directions are arranged between the two supporting plates and are used for bearing the lead frames, and a chip clamping module and a heating module are sequentially arranged on the supporting plates along the length direction of the supporting plates; the feeding mechanism is arranged at one end of the supporting plate and comprises a pushing assembly and two feeding assemblies respectively arranged at two sides of the pushing assembly, the feeding assemblies comprise U-shaped and obliquely arranged carrying frames for placing lead frames, the plane of each lead frame is perpendicular to the surface of each carrying frame, and lifting plates which move along the length direction of each carrying frame are arranged on each carrying frame and are used for receiving the lead frames; the pushing assembly comprises a moving rod which moves back and forth between the two supporting plates, and a second push pin which moves along the vertical direction is arranged below the moving rod and is used for pushing the lead frame to the bearing plate; one side of one of them backup pad is located to transport mechanism, includes along backup pad length direction reciprocating motion and around self axis pivoted connecting rod, and the connecting rod axis is on a parallel with the length direction of backup pad, is equipped with a plurality of branches on the connecting rod, and branch one end is equipped with the first push pin of direction down for promote lead frame.
Further, be equipped with a plurality of interval even bracing pieces between two backup pads, the loading board inboard is equipped with the sand grip along its length direction, the sand grip top surface is equipped with the recess that a plurality of both ends run through along its length direction, the bracing piece cooperation is in the recess, and the top surface of bracing piece flushes with the top surface of sand grip, the backup pad bottom surface is equipped with the horizontal pole along its width direction, install two-way lead screw in the horizontal pole, the screw thread of two-way lead screw divide into two sections, and the screw thread of two sections screw threads is opposite, the loading board overlaps respectively and locates on two sections screw threads of two-way lead screw, two-way lead screw one end is connected first motor, first motor installs on the horizontal pole.
Further, the two sides of the carrying frame are provided with sliding grooves, the two sides of the lifting plate penetrate through the sliding grooves and are connected to the moving end of the first linear mechanism, the first linear mechanism is arranged along the length direction of the carrying frame, the upper ends of the two sides of the carrying frame exceed the upper end of the bottom surface by a preset distance, a partition plate is arranged between the two sides of the upper end of the carrying frame, the lower end of the partition plate is at a preset distance from the bottom surface of the carrying frame, a push plate is arranged on the inner side of the partition plate, the upper end of the push plate is connected to the moving end of the first telescopic rod, and the first telescopic rod is arranged on the carrying frame.
Further, the top surface of the carrying frame is provided with a convex block, two sides of the convex block are provided with sliding rods, the sliding rods are sleeved with limiting plates, two through grooves which are symmetrically arranged are formed in the side surfaces of the lifting plates along the length direction of the lifting plates, the limiting plates are matched in the through grooves, the sliding rods are sleeved with first springs, and two ends of each first spring are respectively connected with the limiting plates and the convex blocks and are always in a stretching state; the lug is also provided with a double-end telescopic rod, and the movable end of the double-end telescopic rod is provided with a jacking block for pushing the limiting plate.
Further, the bottom surface of the carrying frame and the top surface of the carrying plate are both provided with sliding plates which are rotationally connected with the carrying frame, the sliding plate positioned below is arranged in the sliding plate above in a sliding manner, and the inclination angle of the sliding plate and the carrying frame is smaller than 45 degrees.
Further, the movable rod both ends are connected in the movable end of second straight line mechanism, second straight line mechanism sets up along the width direction of backup pad, wear to be equipped with the guide bar on the movable rod, the guide bar lower extreme is equipped with the link, wear to be equipped with a plurality of montants on the link, the montant lower extreme is equipped with the connecting plate, the second push pin is installed on the connecting plate, still the cover is equipped with the second spring on the montant, the connecting plate and link are supported respectively at second spring both ends, the montant upper end still is equipped with the retaining ring for support to the top surface of link, and be in compression state all the time, the link is connected in the movable end of second telescopic link, the second telescopic link is installed on the movable rod.
Further, the inboard card strip that still is equipped with of loading board along its length direction, card strip is located the sand grip top, and the distance between card strip and the same end of backup pad is greater than the width of carrying the thing frame, still be equipped with the pin between the backup pad, the pin is located the region outside carrying the thing frame, and the side is equipped with protruding pole, protruding pole is connected with the bracing piece, and be equipped with the guide way along its length direction on the protruding pole, cooperate with the roof in the guide way, be used for pushing lead frame to the region of card strip, the roof is connected in the removal end of third linear mechanism, third linear mechanism arranges along backup pad length direction.
Further, be equipped with a plurality of supporting shoes in the backup pad, the connecting rod wears to locate in the supporting shoe, still overlaps on the connecting rod and is equipped with the gangbar, and gangbar one end is connected in the removal end of reciprocal sharp mechanism, and reciprocal sharp mechanism installs in the backup pad to arrange along its length direction, still be equipped with the annular on the connecting rod, gangbar and connecting rod complex inner wall are equipped with the spacing ring, and the spacing ring cooperates in the annular.
Further, the connecting rod is also connected with a pressing plate, one end top surface of the pressing plate is connected with two third springs, the upper ends of the third springs are connected to the support, the support is mounted on the support, the support is further provided with a transmission shaft which rotates in a penetrating mode, one end of the transmission shaft is sleeved with an eccentric wheel, the side surface of the eccentric wheel is in contact with the top surface of the pressing plate, one end of the pressing plate is pressed down when the connecting rod is applied, the other end of the transmission shaft is connected with a second motor, and the second motor is mounted on the support.
Further, the conveying mechanism further comprises an L-shaped rod, a first push pin is also arranged on the bottom surface of the horizontal end of the L-shaped rod, the upper end of the L-shaped rod is connected to the rotating shaft, the rotating shaft is arranged along the length direction of the supporting plate and is installed on the vertical plate, the vertical plate is installed on the supporting plate, one end of the rotating shaft is connected with a third motor, the third motor is installed on the vertical plate, an arc-shaped groove is further formed in the outer side of the right angle of the L-shaped rod, and the arc-shaped groove is matched with the connecting rod when the conveying mechanism is used.
Further, the upper end of the L-shaped rod is also provided with a push rod which is rotationally connected with the L-shaped rod, one end of the push rod is connected with the moving end of the fourth linear mechanism, and the fourth linear mechanism is arranged on the supporting plate.
The invention has the beneficial effects that:
the lead frame is continuously conveyed forwards through the reciprocating motion of the push pins, the second push pins can limit the front and rear directions of the lead frame, and the bearing plates can limit the two sides of the lead frame, so that the lead frame can be placed without shifting in the conveying process, and a chip can be accurately placed at the corresponding position of the lead frame; the follow-up lead frame conveying rhythm of the previous lead frame can be ensured to be more accurately kept up when the follow-up lead frame is conveyed, so that pause equipment is avoided for adjusting the rhythm, the production process is further accelerated, and the production efficiency is improved; the distance between the two bearing plates can be adjusted, lead frames with different sizes can be placed in the bearing frames, and the two ends of the lead frames can be limited, so that the lead frames with different sizes are adapted.
Drawings
The drawings described herein are for illustration of selected embodiments only and not all possible implementations, and are not intended to limit the scope of the invention.
Fig. 1 is a schematic perspective view of an overall structure according to an embodiment of the present application.
Fig. 2 is a schematic diagram illustrating installation of a carrier plate according to an embodiment of the present application.
Fig. 3 is an enlarged schematic view at a of fig. 2.
Fig. 4 is a schematic perspective view of a feeding assembly according to an embodiment of the present application.
Fig. 5 is a schematic perspective view of a pushing assembly according to an embodiment of the present application.
Fig. 6 is a schematic perspective view of a carrying frame according to an embodiment of the disclosure.
Fig. 7 is a schematic perspective view of a transmission according to an embodiment of the present application.
Fig. 8 is an enlarged schematic view at B of fig. 7.
Reference numerals illustrate: 100-supporting plate, 200-loading mechanism, 300-conveying mechanism, 101-bearing plate, 102-supporting rod, 103-raised strip, 104-groove, 105-cross rod, 106-bidirectional screw rod, 107-first motor, 108-clamping strip, 109-stop lever, 110-raised rod, 111-guide groove, 112-top plate, 113-supporting block, 201-carrying frame, 202-lifting plate, 203-moving rod, 204-second push pin, 205-sliding groove, 206-partition plate, 207-push plate, 208-first telescopic rod, 209-bump, 210-slide rod, 211-limit plate, 212-through groove, 213-first spring, 214-double-headed telescopic rod, 215-ejector block, 216-slide plate, 217-guide rod, 218-connecting frame, 219-vertical rod, 220-connecting plate, 221-second spring, 222-second telescopic rod, 223-retainer ring, 301-connecting rod, 302-support rod, 303-first pin, 304-rod, 305-pressing plate, 306-ring groove, 307-limit ring, 308-third spring, 309-third spring, 310-support, 311-312, 314-eccentric link, 313-317, and three-rotating shaft.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the following detailed description of the embodiments of the present invention will be given with reference to the accompanying drawings, but the described embodiments of the present invention are some, but not all embodiments of the present invention.
As shown in fig. 1 to 8, an embodiment of the present application provides a die bonding apparatus, including: backup pad 100, feed mechanism 200, transport mechanism 300.
The two supporting plates 100 are symmetrically arranged, two symmetrically arranged bearing plates 101 which move in opposite directions are arranged between the two supporting plates 100 and are used for bearing the lead frames, a chip clamping module and a heating module are sequentially arranged on the supporting plates 100 along the length direction of the supporting plates, the chip clamping module is used for clamping and transferring chips onto the lead frames, a mechanical arm can be used for transferring, the clamping of the chips can be absorbed by using a sucker, the heating module is used for heating solder paste connected with the chips and the lead frames, the solder paste is melted, and the solder paste is solidified again to fix the chips on the lead frames; the feeding mechanism 200 is arranged at one end of the supporting plate 100, the feeding mechanism 200 comprises a pushing component and two feeding components which are respectively arranged at two sides of the pushing component, the feeding component comprises a U-shaped and obliquely arranged carrying frame 201 for placing a lead frame, the plane of the lead frame is perpendicular to the surface of the carrying frame 201, and a lifting plate 202 which moves along the length direction of the lead frame is arranged on the carrying frame 201 and is used for receiving the lead frame and pushing the lead frame upwards, and the distance of pushing each time is the thickness of the lead frame; the pushing assembly comprises a moving rod 203 which moves back and forth between the two support plates 100, and a second push pin 204 which moves along the vertical direction is arranged below the moving rod 203 and is used for pushing the lead frame onto the bearing plate 101; the conveying mechanism 300 is arranged on one side of one supporting plate 100, and comprises a connecting rod 301 which reciprocates along the length direction of the supporting plate 100 and rotates around the axis of the connecting rod 301, the axis of the connecting rod 301 is parallel to the length direction of the supporting plate 100, a plurality of supporting rods 302 are arranged on the connecting rod 301, and one end of each supporting rod 302 is provided with a first push pin 303 which faces downwards and is used for pushing the lead frame forwards.
Specifically, as shown in fig. 1-3, a plurality of support rods 102 with uniform intervals are arranged between two support plates 100, raised strips 103 are arranged on the inner side of a bearing plate 101 along the length direction of the support rods, a plurality of grooves 104 with two ends penetrating through are arranged on the top surface of each raised strip 103 along the length direction of each raised strip 103, the support rods 102 are matched in the corresponding grooves 104, the top surfaces of the support rods 102 are flush with the top surfaces of the raised strips 103, when a lead frame is conveyed, the support rods 102 support the lead frame, two sides of the lead frame are contacted with two sides of the bearing plate 101, so that the two sides of the lead frame are limited, meanwhile, in order to adapt to lead frames with different widths, a cross rod 105 is arranged on the bottom surface of the support plate 100 along the width direction of the support plate, a bidirectional lead screw 106 is arranged in the cross rod 105, threads of the bidirectional lead screw 106 are divided into two sections, the two sections of threads of the bidirectional lead screw 106 are sleeved on the two sections of threads of the bidirectional lead screw 106 respectively, one end of the bidirectional lead screw 106 is connected with a first motor 107, the first motor 107 is arranged on the cross rod 105, and the bidirectional lead screw 106 rotates to enable the two bearing plates 101 to move in opposite directions.
Specifically, as shown in fig. 1 and 4, the two sides of the carrying frame 201 are provided with sliding grooves 205, the two sides of the lifting plate 202 pass through the sliding grooves 205 and are connected to the moving end of the first linear mechanism, the first linear mechanism is arranged along the length direction of the carrying frame 201, the lifting plate 202 is moved upwards under the driving of the first linear mechanism, the distance of each movement is the thickness of the lead frame, so that the lead frame can fall out from the upper end of the carrying frame 201, the upper ends of the two sides of the carrying frame 201 exceed the upper end of the bottom surface by a preset distance, a partition 206 is arranged between the two sides of the upper end of the carrying frame 201, the lead frame falls from the gap between the partition 206 and the upper end of the carrying frame 201, the lower end of the partition 206 has a preset distance from the bottom surface of the carrying frame 201, so that the lead frame with a larger size can also fall smoothly, a push plate 207 is further arranged on the inner side of the partition 206, the upper end of the push plate 207 is connected to the moving end of the first telescopic rod 208, and the first telescopic rod 208 is mounted on the carrying frame 201, when the lead frame is relatively light in weight or the friction force between the two lead frames stops falling down, the lead frame is pushed down.
Specifically, as shown in fig. 1, fig. 4 and fig. 6, in order to adapt to lead frames with different lengths, a bump 209 is arranged on the top surface of a carrying frame 201, sliding rods 210 are arranged on two sides of the bump 209, a limiting plate 211 is sleeved on the sliding rods 210, two through grooves 212 which are symmetrically arranged are arranged on the side surface of a lifting plate 202 along the length direction of the lifting plate, the limiting plate 211 is matched in the through grooves 212, a first spring 213 is sleeved on the sliding rods 210, two ends of the first spring 213 are respectively connected with the limiting plate 211 and the bump 209 and are always in a stretching state, so that the two limiting plates 211 always have a trend of moving in opposite directions, and two ends of the lead frame are limited; the bump 209 is further provided with a double-end telescopic rod 214, and the moving end of the double-end telescopic rod 214 is provided with a top block 215 for pushing the limiting plate 211, so that the lead frame is conveniently placed in the carrying frame 201.
Specifically, as shown in fig. 1 and 4, in order to avoid that the lead frame falls into the space between the carrier plate 101 and the support plate 100 when moving out of the carrier frame 201, sliding plates 216 rotatably connected with the bottom surface of the carrier frame 201 and the top surface of the carrier plate 101 are respectively provided on the bottom surface and the top surface of the carrier plate 101, the sliding plate 216 positioned below is slidably inserted into the sliding plate 216 positioned above, when moving out of the carrier frame 201, the lead frame directly falls onto the sliding plate 216 and is then pushed between the two carrier plates 101 by the pushing assembly, and the inclination angle between the sliding plate 216 and the carrier frame 201 is smaller than 45 °, so that the lead frame can be prevented from falling out of the carrier frame 201 and turning over when moving on the sliding plate 216.
Specifically, as shown in fig. 1, 4 and 5, two ends of the moving rod 203 are connected to moving ends of a second linear mechanism, the second linear mechanism is arranged along the width direction of the supporting plates 100, the moving rod 203 can move back and forth between the two supporting plates 100 under the driving of the second linear mechanism, a guide rod 217 is arranged on the moving rod 203 in a penetrating manner, a connecting frame 218 is arranged at the lower end of the guide rod 217, a plurality of vertical rods 219 are arranged on the connecting frame 218 in a penetrating manner, a connecting plate 220 is arranged at the lower end of the vertical rods 219, a second push pin 204 is arranged on the connecting plate 220, a second spring 221 is sleeved on the vertical rods 219, two ends of the second spring 221 respectively abut against the connecting plate 220 and the connecting frame 218 and are always in a compressed state, a retainer ring 223 is also arranged at the upper end of the vertical rods 219 and is used for abutting against the top surface of the connecting frame 218, avoiding the separation between the vertical rod 219 and the connecting frame 218, the connecting frame 218 is connected to the moving end of the second telescopic rod 222, the second telescopic rod 222 is installed on the moving rod 203, when the lead frame on the sliding plate 216 needs to be moved between the two bearing plates 101, the moving rod 203 is moved above the sliding plate 216, the second telescopic rod 222 is started to enable the connecting frame 218 to descend until the second push pin 204 passes through the gap of the lead frame and contacts with the sliding plate 216, the second spring 221 is further compressed, the second linear mechanism is started again, the moving rod 203 moves towards the middle position of the two bearing plates 100, the second push pin 204 pushes the lead frame between the two bearing plates 101, and two sides of the lead frame contact with the inner sides of the bearing plates 101.
Specifically, as shown in fig. 1-3, a clamping bar 108 is further disposed on the inner side of the carrier plate 101 along the length direction thereof, the clamping bar 108 is located above the raised bar 103, so as to avoid the vertical movement of the lead frame when the lead frame is transferred by the conveying mechanism 300, the distance between the clamping bar 108 and the same end of the support plate 100 is larger than the width of the carrier frame 201, the lead frame is prevented from being unable to be transferred between the two carrier plates 101, a stop lever 109 is disposed between the support plates 100, the stop lever 109 is located in a region outside the carrier frame 201, a protruding rod 110 is disposed on the side surface of the stop lever 109, the protruding rod 110 is connected with the support rod 102, a guide groove 111 is disposed on the protruding rod 110 along the length direction thereof, a top plate 112 is matched in the guide groove 111 for pushing the lead frame to the region of the clamping bar 108, the top plate 112 is connected to the moving end of the third linear mechanism, the third linear mechanism is disposed along the length direction of the support plate 100, and the top plate 112 pushes the lead frame to the region where the clamping bar 108 is located under the driving of the third linear mechanism.
Specifically, as shown in fig. 1, 7 and 8, a plurality of supporting blocks 113 are disposed on the supporting plate 100, the connecting rod 301 rotationally passes through the supporting blocks 113, a linkage rod 304 is further sleeved on the connecting rod 301, one end of the linkage rod 304 is connected to a moving end of the reciprocating linear mechanism, the reciprocating linear mechanism is mounted on the supporting plate 100 and is arranged along the length direction of the reciprocating linear mechanism, the connecting rod 301 is driven to reciprocate by the reciprocating linear mechanism, in order to ensure that the connecting rod 301 can rotate around the axis of the connecting rod 301 while reciprocating, a ring groove 306 is further disposed on the connecting rod 301, a limit ring 307 is disposed on an inner wall of the linkage rod 304 matched with the connecting rod 301, and the limit ring 307 is matched in the ring groove 306.
Specifically, as shown in fig. 1, 7 and 8, the connecting rod 301 is further connected with a pressing plate 305, one end top surface of the pressing plate 305 is connected with two third springs 308, the upper ends of the third springs 308 are connected to a bracket 309, and should be in a stretched state, the bracket 309 is installed on the supporting plate 100, a transmission shaft 310 that rotates reciprocally is further installed on the bracket 309, one end of the transmission shaft 310 is sleeved with an eccentric wheel 311, the side surface of the eccentric wheel 311 contacts with the top surface of the pressing plate 305, after the lead frame is conveyed forward for a certain distance, the first push pin 303 needs to be removed from the gap of the lead frame, the eccentric wheel 311 is rotated again, one end of the pressing plate 305 is pressed down, the third springs 308 are further compressed, one end of the supporting rod 302 is also lifted up, the first push pin 303 is removed from the gap of the lead frame, the other end of the transmission shaft 310 is connected with a second motor 312, and the second motor 312 is installed on the bracket 309.
Specifically, when the previous lead frame is pushed away, the next lead frame needs to move along with the previous lead frame to ensure the continuity of operation, as shown in fig. 1, 7 and 8, the conveying mechanism 300 further comprises an L-shaped rod 313, a first push pin 303 is also arranged at the bottom surface of the horizontal end of the L-shaped rod 313, the upper end of the L-shaped rod 313 is connected to a rotating shaft 314, the rotating shaft 314 is arranged along the length direction of the supporting plate 100 and is mounted on a vertical plate 315, the vertical plate 315 is mounted on the supporting plate 100, one end of the rotating shaft 314 is connected to a third motor 316, the third motor 316 is mounted on the vertical plate 315, an arc-shaped groove is further arranged at the outer side of the right angle position of the L-shaped rod 313, and is matched with the connecting rod 301 when in use, a sensor is further arranged on one of the supporting rods 302 closest to the L-shaped rod 313 to monitor the pushed position of the lead frame, the next lead frame is pushed to a preset distance from the previous lead frame by a first push pin 303 below the L-shaped rod 313, and after that the first push pin 303 is kept to move synchronously with the supporting rod 315 until the distance between the two lead frames can be pushed away from the next lead frame to the preset distance between the two lead frames.
Specifically, as shown in fig. 7, the upper end of the L-shaped rod 313 is further provided with a push rod 317 rotatably connected thereto, and one end of the push rod 317 is connected to the moving end of the fourth linear mechanism, which is mounted on the support plate 100, so as to drive the L-shaped rod 313 to move.
The detailed operation steps for fixing the chip to the lead frame by using the device are as follows:
firstly, the distance between the two bearing plates 101 is adjusted according to the width of the lead frame, the first motor 107 is started to drive the bidirectional screw rod 106 to rotate, then the two bearing plates 101 can move in opposite directions, the two sliding plates 216 move relatively, then the lead frame is neatly placed in the carrying frame 201, the lifting plate 202 supports the lead frame, at the moment, the moving end of the double-end telescopic rod 214 is retracted, the limiting plate 211 moves under the pulling of the first spring 213 and limits the two ends of the lead frame, when the first lead frame is conveyed, the first linear mechanism is started to drive the lifting plate 202 to move upwards, the distance of each movement is the thickness of the lead frame, and when each movement is carried out, the lead frame positioned at the top falls from the gap between the baffle 206 and the end part of the carrying frame 201, but due to the too light lead frame or the friction force between the two lead frames, it may be difficult to drop the lead frame directly between the two carrier plates 101 by actuating the first telescoping rod 208 to move the push plate 207 downward, the push plate 207 pushes the lead frame out of the area of the carrier frame 201 and onto the slide plate 216, at this time, actuating the second linear mechanism to move the moving rod 203 toward the carrier frame 201, actuating the second telescoping rod 222 to lower the connecting frame 218 until the second push pin 204 passes through the gap of the lead frame and contacts the slide plate 216 when the moving rod 203 moves over the slide plate 216, and further compressing the second spring 221 to actuate the second linear mechanism again to move the moving rod 203 toward the middle of the two support plates 100, the second push pin 204 pushes the lead frame onto the support rod 102, and both sides of the lead frame contact the inner sides of the carrier plates 101, then the connecting frame 218 is lifted up by the second telescopic rod 222, the lower end of the second push pin 204 is higher than the top surface of the lead frame, then the third linear mechanism is started to enable the top plate 112 to move towards the conveying mechanism 300, so that the lead frame is pushed towards the area between the convex strip 103 and the clamping strip 108, at the moment, one end of the lead frame is a certain distance away from the nearest supporting rod 302, then the third motor 316 is started, the rotating shaft 314 is rotated by a certain angle, the L-shaped rod 313 is deflected downwards by a certain angle, the arc-shaped groove of the L-shaped rod 313 is matched with the connecting rod 301, the first push pin 303 below the L-shaped rod 313 is in a vertical state, the lower end of the first push pin 303 is positioned in a gap of the lead frame, at the moment, the fourth linear mechanism is started, the L-shaped rod 313 is moved towards the supporting rod 302, the lead frame is pushed to be below the supporting rod 302, the L-shaped rod 313 is reset, then the second motor 312 is started, when the transmission shaft 310 is rotated, the eccentric wheel 311 is rotated, so that the pressing plate 305 is in a horizontal state, one end of the supporting rod 302 is also deflected downwards and is in a horizontal state, the first push pin 303 below the supporting rod 302 is positioned in the first gap of the lead frame, then a reciprocating linear mechanism is started, the linkage rod 304 is moved forwards, the linkage rod 304 drives the connecting rod 301 to move together, the supporting rod 302 and the pressing plate 305 also move forwards along with the connecting rod 301, at the moment, the third spring 308 is further stretched, the lead frame is also moved forwards for a certain distance, the distance is the distance between two adjacent gaps on the lead frame, the first push pin 303 is not moved out of the gaps of the lead frame when the lead frame is stopped after being pushed for a certain distance, at the moment, a chip is placed on the lead frame, then the connecting rod 301 is reset under the driving of the reciprocating linear mechanism, immediately after the lead frame moves forwards for a certain distance, the transmission shaft 310 is rotated reversely, one end of the pressing plate 305 moves downwards, one end of the supporting rod 302 is tilted, the first push pin 303 moves out of a gap of the lead frame, the lead frame is moved forwards repeatedly, in the moving process of the lead frame, the chip clamping module clamps the chip and is adhered with solder paste and then is placed on a corresponding position of the lead frame, the heating module heats the solder paste, so that the solder paste is melted, and the solder paste is solidified again to fix the chip and the lead frame together;
after pushing the first lead frame a certain distance, the first push pin 303 under the L-shaped rod 313 pushes the second lead frame close to the first lead frame, at this time, a certain interval is formed between the two lead frames, and when the first lead frame pauses moving, the second lead frame is pushed forward continuously until the interval between the gap at the tail end of the first lead frame and the gap at the head end of the second lead frame is equal to the interval between two adjacent gaps on the lead frames, then the L-shaped rod 313 and the supporting rod 302 are synchronously moved until the first push pin 303 under the supporting rod 302 can push the second lead frame away, and the subsequent lead frames are conveyed by adopting the same steps, so that the lead frames are conveyed continuously, and the die bonding operation is not required to be stopped temporarily to keep up with the conveying progress.
The above is only a preferred embodiment of the present invention and is not intended to limit the present invention, and it is obvious that those skilled in the art can make various modifications and variations to the present invention without departing from the spirit and scope of the present invention. Thus, it is intended that the present invention also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
Claims (10)
1. A die attach apparatus comprising:
the two support plates (100) are symmetrically arranged, two symmetrically arranged bearing plates (101) which move in opposite directions are arranged between the two support plates (100) and are used for bearing the lead frames, and the support plates (100) are sequentially provided with a chip clamping module and a heating module along the length direction of the support plates;
the feeding mechanism (200) is arranged at one end of the supporting plate (100), the feeding mechanism (200) comprises a pushing component and two feeding components which are respectively arranged at two sides of the pushing component, the feeding component comprises a carrying frame (201) which is U-shaped and obliquely arranged and is used for placing a lead frame, the plane of the lead frame is perpendicular to the surface of the carrying frame (201), and a lifting plate (202) which moves along the length direction of the carrying frame is arranged on the carrying frame (201) and is used for receiving the lead frame;
the pushing assembly comprises a moving rod (203) which moves back and forth between the two supporting plates (100), and a second pushing pin (204) which moves along the vertical direction is arranged below the moving rod (203) and is used for pushing the lead frame onto the bearing plate (101);
the conveying mechanism (300) is arranged on one side of one supporting plate (100), comprises a connecting rod (301) which moves back and forth in the length direction of the supporting plate (100) and rotates around the axis of the connecting rod, the axis of the connecting rod (301) is parallel to the length direction of the supporting plate (100), a plurality of supporting rods (302) are arranged on the connecting rod (301), and one end of each supporting rod (302) is provided with a first push pin (303) facing downwards and used for pushing a lead frame.
2. The die bonding device according to claim 1, wherein a plurality of support rods (102) with uniform intervals are arranged between two support plates (100), raised strips (103) are arranged on the inner side of a bearing plate (101) along the length direction of the bearing plate, a plurality of grooves (104) with two ends penetrating through are arranged on the top surface of each raised strip (103) along the length direction of the bearing plate, the support rods (102) are matched in the grooves (104), the top surfaces of the support rods (102) are flush with the top surfaces of the raised strips (103), a cross rod (105) is arranged on the bottom surface of the support plate (100) along the width direction of the support rods, a bidirectional screw (106) is arranged in the cross rod (105), threads of the bidirectional screw (106) are divided into two sections, the rotation directions of the two sections of threads are opposite, the bearing plate (101) is respectively sleeved on the two sections of threads of the bidirectional screw (106), one end of the bidirectional screw (106) is connected with a first motor (107), and the first motor (107) is arranged on the cross rod (105).
3. The die bonding device according to claim 1, wherein sliding grooves (205) are formed in two sides of the carrying frame (201), two sides of the lifting plate (202) penetrate through the sliding grooves (205) and are connected to moving ends of a first linear mechanism, the first linear mechanism is arranged along the length direction of the carrying frame (201), two upper ends of the two sides of the carrying frame (201) exceed the upper end of the bottom surface by a preset distance, a partition plate (206) is arranged between two sides of the upper end of the carrying frame (201), a preset distance is formed between the lower end of the partition plate (206) and the bottom surface of the carrying frame (201), a pushing plate (207) is arranged on the inner side of the partition plate (206), the upper end of the pushing plate (207) is connected to the moving ends of a first telescopic rod (208), and the first telescopic rod (208) is installed on the carrying frame (201).
4. The chip die bonding device according to claim 1, wherein the top surface of the carrying frame (201) is provided with a protruding block (209), two sides of the protruding block (209) are provided with sliding rods (210), the sliding rods (210) are sleeved with limiting plates (211), two symmetrically arranged through grooves (212) are formed in the side surfaces of the lifting plates (202) along the length direction of the side surfaces of the lifting plates, the limiting plates (211) are matched in the through grooves (212), the sliding rods (210) are sleeved with first springs (213), and two ends of each first spring (213) are respectively connected with the limiting plates (211) and the protruding blocks (209) and are always in a stretching state; the bump (209) is further provided with a double-end telescopic rod (214), and the moving end of the double-end telescopic rod (214) is provided with a top block (215) for pushing the limiting plate (211).
5. The die bonder according to claim 1, wherein the bottom surface of the carrier frame (201) and the top surface of the carrier plate (101) are rotatably connected with a slide plate (216), the slide plate (216) located below is slidably inserted into the slide plate (216) located above, and an inclination angle between the slide plate (216) and the carrier frame (201) is smaller than 45 °.
6. The die bonding device according to claim 1, wherein two ends of the moving rod (203) are connected to moving ends of a second linear mechanism, the second linear mechanism is arranged along the width direction of the supporting plate (100), a guide rod (217) is arranged on the moving rod (203) in a penetrating manner, a connecting frame (218) is arranged at the lower end of the guide rod (217), a plurality of vertical rods (219) are arranged on the connecting frame (218) in a penetrating manner, connecting plates (220) are arranged at the lower ends of the vertical rods (219), second push pins (204) are mounted on the connecting plates (220), second springs (221) are sleeved on the vertical rods (219), two ends of each second spring (221) are respectively abutted to the connecting plates (220) and the connecting frame (218) and are always in a compressed state, check rings (223) are arranged at the upper ends of the vertical rods (219) and are used for being abutted to the top surfaces of the connecting frame (218), the connecting frame (218) is connected to the moving ends of second telescopic rods (222), and the second telescopic rods (222) are mounted on the moving rods (203).
7. The die bonding device according to claim 2, wherein a clamping strip (108) is further arranged on the inner side of the bearing plate (101) along the length direction of the bearing plate, the clamping strip (108) is located above the raised strip (103), the distance between the clamping strip (108) and the same end of the supporting plate (100) is larger than the width of the carrying frame (201), a stop lever (109) is further arranged between the supporting plates (100), the stop lever (109) is located in an area outside the carrying frame (201), a protruding rod (110) is arranged on the side face of the stop lever, the protruding rod (110) is connected with the supporting rod (102), a guide groove (111) is formed in the protruding rod (110) along the length direction of the protruding rod, a top plate (112) is matched in the guide groove (111) and used for pushing the lead frame to the area of the clamping strip (108), the top plate (112) is connected to the moving end of a third linear mechanism, and the third linear mechanism is arranged along the length direction of the supporting plate (100).
8. The die bonding device according to claim 1, wherein the supporting plate (100) is provided with a plurality of supporting blocks (113), the connecting rod (301) is arranged in the supporting blocks (113) in a penetrating manner, the connecting rod (301) is further sleeved with a linkage rod (304), one end of the linkage rod (304) is connected to the moving end of the reciprocating linear mechanism, the reciprocating linear mechanism is mounted on the supporting plate (100) and is arranged along the length direction of the reciprocating linear mechanism, the connecting rod (301) is further provided with a ring groove (306), and the inner wall of the linkage rod (304) matched with the connecting rod (301) is provided with a limiting ring (307), and the limiting ring (307) is matched with the ring groove (306).
9. The die bonding device according to claim 1, wherein the connecting rod (301) is further connected with a pressing plate (305), one end top surface of the pressing plate (305) is connected with two third springs (308), the upper ends of the third springs (308) are connected to a bracket (309), the bracket (309) is installed on the supporting plate (100), a transmission shaft (310) capable of rotating in a reciprocating manner is further arranged on the bracket (309), one end of the transmission shaft (310) is sleeved with an eccentric wheel (311), and the side surface of the eccentric wheel (311) is contacted with the top surface of the pressing plate (305), when the die bonding device is used, one end of the pressing plate (305) is pressed down, the other end of the transmission shaft (310) is connected with a second motor (312), and the second motor (312) is installed on the bracket (309).
10. The die bonding apparatus according to claim 1, wherein the conveying mechanism (300) further comprises an L-shaped rod (313), the first push pin (303) is also arranged at the bottom surface of the horizontal end of the L-shaped rod (313), the upper end of the L-shaped rod (313) is connected to a rotating shaft (314), the rotating shaft (314) is arranged along the length direction of the supporting plate (100) and is mounted on a riser (315), the riser (315) is mounted on the supporting plate (100), one end of the rotating shaft (314) is connected with a third motor (316), the third motor (316) is mounted on the riser (315), an arc-shaped groove is further arranged at the outer side of the right angle of the L-shaped rod (313), and the arc-shaped groove is matched with the connecting rod (301) when in use;
the upper end of the L-shaped rod (313) is also rotatably connected with a push rod (317), one end of the push rod (317) is connected with the moving end of a fourth linear mechanism, and the fourth linear mechanism is installed on the supporting plate (100).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310343450.XA CN116072581B (en) | 2023-04-03 | 2023-04-03 | Chip die bonding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310343450.XA CN116072581B (en) | 2023-04-03 | 2023-04-03 | Chip die bonding device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116072581A true CN116072581A (en) | 2023-05-05 |
| CN116072581B CN116072581B (en) | 2023-05-30 |
Family
ID=86173471
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310343450.XA Active CN116072581B (en) | 2023-04-03 | 2023-04-03 | Chip die bonding device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116072581B (en) |
Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000124230A (en) * | 1998-10-15 | 2000-04-28 | New Japan Radio Co Ltd | Supply equipment of semiconductor frame |
| KR20090113511A (en) * | 2008-04-28 | 2009-11-02 | 세크론 주식회사 | Lead frame transfer apparatus for die bonder |
| CN110610884A (en) * | 2019-10-28 | 2019-12-24 | 四川旭茂微科技有限公司 | Coating film chip adhesion device |
| CN112466801A (en) * | 2021-01-29 | 2021-03-09 | 四川晶辉半导体有限公司 | Conveying device for chip diode lead frame |
| CN112722781A (en) * | 2020-12-17 | 2021-04-30 | 安徽省东科半导体有限公司 | Lead frame processing conveyor |
| CN214012921U (en) * | 2020-12-28 | 2021-08-20 | 广东气派科技有限公司 | Semi-automatic piece pusher that arranges |
| CN113644015A (en) * | 2021-10-15 | 2021-11-12 | 四川晶辉半导体有限公司 | Semiconductor frame glues core device |
| CN214753681U (en) * | 2021-06-23 | 2021-11-16 | 四川通妙科技有限公司 | Lead frame transfer device |
| CN113911689A (en) * | 2021-12-10 | 2022-01-11 | 四川富美达微电子有限公司 | Lead frame conveying and stacking device |
| CN215578475U (en) * | 2021-08-23 | 2022-01-18 | 四川旭茂微科技有限公司 | Lead frame conveying device |
| CN115020309A (en) * | 2022-08-09 | 2022-09-06 | 四川晁禾微电子有限公司 | Lead frame arranging device |
| CN115083978A (en) * | 2022-06-23 | 2022-09-20 | 四川熙隆半导体科技有限公司 | Lead frame is carried and is piled up frock |
| CN115083980A (en) * | 2022-07-21 | 2022-09-20 | 四川明泰微电子有限公司 | Lead frame conveying device for bonding of multi-base-island lead frame and chip |
| CN115592280A (en) * | 2022-12-13 | 2023-01-13 | 四川超声印制板有限公司（Cn） | Automatic cutting device and cutting method for printed circuit board |
| CN218677090U (en) * | 2022-11-03 | 2023-03-21 | 晁禾微电子科技(东莞)有限公司 | Lead frame stacking device |
-
2023
- 2023-04-03 CN CN202310343450.XA patent/CN116072581B/en active Active
Patent Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000124230A (en) * | 1998-10-15 | 2000-04-28 | New Japan Radio Co Ltd | Supply equipment of semiconductor frame |
| KR20090113511A (en) * | 2008-04-28 | 2009-11-02 | 세크론 주식회사 | Lead frame transfer apparatus for die bonder |
| CN110610884A (en) * | 2019-10-28 | 2019-12-24 | 四川旭茂微科技有限公司 | Coating film chip adhesion device |
| CN112722781A (en) * | 2020-12-17 | 2021-04-30 | 安徽省东科半导体有限公司 | Lead frame processing conveyor |
| CN214012921U (en) * | 2020-12-28 | 2021-08-20 | 广东气派科技有限公司 | Semi-automatic piece pusher that arranges |
| CN112466801A (en) * | 2021-01-29 | 2021-03-09 | 四川晶辉半导体有限公司 | Conveying device for chip diode lead frame |
| CN214753681U (en) * | 2021-06-23 | 2021-11-16 | 四川通妙科技有限公司 | Lead frame transfer device |
| CN215578475U (en) * | 2021-08-23 | 2022-01-18 | 四川旭茂微科技有限公司 | Lead frame conveying device |
| CN113644015A (en) * | 2021-10-15 | 2021-11-12 | 四川晶辉半导体有限公司 | Semiconductor frame glues core device |
| CN113911689A (en) * | 2021-12-10 | 2022-01-11 | 四川富美达微电子有限公司 | Lead frame conveying and stacking device |
| CN115083978A (en) * | 2022-06-23 | 2022-09-20 | 四川熙隆半导体科技有限公司 | Lead frame is carried and is piled up frock |
| CN115083980A (en) * | 2022-07-21 | 2022-09-20 | 四川明泰微电子有限公司 | Lead frame conveying device for bonding of multi-base-island lead frame and chip |
| CN115020309A (en) * | 2022-08-09 | 2022-09-06 | 四川晁禾微电子有限公司 | Lead frame arranging device |
| CN218677090U (en) * | 2022-11-03 | 2023-03-21 | 晁禾微电子科技(东莞)有限公司 | Lead frame stacking device |
| CN115592280A (en) * | 2022-12-13 | 2023-01-13 | 四川超声印制板有限公司（Cn） | Automatic cutting device and cutting method for printed circuit board |
Non-Patent Citations (1)
| Title |
|---|
| 陈国岚;陈志祥;何文海;高睿;: "引线框架结构设计探讨", 电子工业专用设备, no. 11 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN116072581B (en) | 2023-05-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5876556A (en) | Die-bonding device | |
| CN215591112U (en) | Workpiece film laminating machine | |
| CN115083980B (en) | Lead frame conveying device for bonding of multi-base-island lead frame and chip | |
| CN107081597B (en) | A kind of scissor-like jack wears riveting automatic production line and working method | |
| CN116544163B (en) | Lead frame conveying device | |
| CN114800896B (en) | Cutting device for chip processing | |
| KR102059653B1 (en) | System for automatically fixing screws in horizontal direction | |
| CN116072581B (en) | Chip die bonding device | |
| CN109534672A (en) | A kind of plate glass cutter device | |
| CN116214160A (en) | Full-automatic assembly system and assembly method | |
| CN111266753A (en) | Conveying device and welding equipment | |
| CN116043426A (en) | Automatic sewing equipment | |
| CN110002209A (en) | A kind of blanking device and blanking pre-press equipment | |
| US5435681A (en) | Pusher device for plate-form articles | |
| CN117832135B (en) | Semiconductor lead frame glues core equipment | |
| CN103183228A (en) | Feeding mechanism for photoelectric component testing machine table | |
| CN208135431U (en) | A kind of feeding mechanism | |
| KR100914986B1 (en) | Chip bonding system | |
| CN112109997A (en) | Machine vision-based intelligent PCB labeling mechanism robot and labeling method | |
| CN105149401B (en) | A kind of Full-automatic key embryo stamping machine | |
| JPS6327886Y2 (en) | ||
| CN218931192U (en) | Material strip feeding equipment capable of preventing material returning | |
| KR100513283B1 (en) | Tape feeder for a chip mounter | |
| JPH02121339A (en) | Intermittent transfer device for lead frame | |
| CN218520600U (en) | Prevent loading attachment of encapsulation base plate upwarping |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |