CN116069140A

CN116069140A - Energy-saving method for cooling GPU chip and the like by using closed-loop high-pressure cold air

Info

Publication number: CN116069140A
Application number: CN202211638077.2A
Authority: CN
Inventors: 王晓丹; 廖礼毅
Original assignee: Sichuan Honasoft Technology Co ltd
Current assignee: Sichuan Honasoft Technology Co ltd
Priority date: 2022-04-27
Filing date: 2022-12-20
Publication date: 2023-05-05
Also published as: CN114911330A; CN116225184A

Abstract

In the energy-saving method for cooling the GPU chip and the like by using the closed-cycle high-pressure cold air, in a circulating gas sealing loop, cooling gas for cooling the GPU chip and a radiator is changed into heat-absorbed gas, the heat-absorbed gas is divided into high-temperature gas and low-temperature gas by a heat pump and is discharged, and the high-temperature gas is cooled by a cooling device and then mixed with the low-temperature gas to form cooling gas for cooling, so that the cooling gas for cooling is repeatedly used for cooling. The advantages are that: the cooling gas can be recycled, the temperature of the cooling gas is reduced without increasing energy consumption, and the GPU can work in a better temperature environment: the inert gas sealing circulation solves the pollution and oxidation problems, improves the temperature difference water-saving and cooling energy consumption, ensures that the GPU works in a better state, protects GPU chips and the like from being influenced by fog and dew, saves energy, reduces noise and improves the operation efficiency.

Description

Energy-saving method for cooling GPU chip and the like by using closed-loop high-pressure cold air

Technical Field

The invention relates to the technical field of computer server heat dissipation, in particular to an energy-saving heat dissipation method which uses high-pressure cold air flow with closed circulation to efficiently cool a GPU, can recycle refrigeration energy and can reduce noise by using a fan or without using the fan.

Background

The existing heat dissipation method for the GPU (or CPU, motherboard, circuit board, etc.) of the computer server mainly comprises two modes of air cooling and liquid cooling.

Regarding the air cooling method, the fan exhaust is to continuously extract indoor cold gas in the environment outside the machine room cabinet outside the machine case to dissipate heat of the GPU with the temperature of more than 40 ℃, and the defects are low utilization efficiency of refrigeration energy of the indoor cold gas, high cost and large fan noise; the reason is that: firstly, if the temperature of the machine room environment is 10 ℃, a large amount of space in the machine room is meaningless in refrigeration and energy consumption, and the temperature difference between an operator of the machine room and the machine room is large, so that the machine room is easy to generate diseases, and secondly, if the temperature of the machine room environment is 35 ℃, the heat dissipation effect on the GPU is poor, and over-temperature shutdown is easy to occur, so that the GPU and other heating components are damaged; thirdly, if the temperature of the environment of a common machine room is 25 ℃ and the temperature of the GPU is used for radiating the GPU, the temperature difference between the cold air of 25 ℃ and the temperature of the GPU is small, and the fan is operated with a large function to generate rapid air flow, so that the noise of the machine room is large, and operators and vibration are influenced to damage a server.

However, when the existing air cooling device is used for refrigerating and radiating the chips, dust in the air can enter the device to corrode the chips, so that the service life of the chips is reduced, in addition, part of dust can be accumulated in the radiating ports due to long-term placement, and if the dust cannot be timely treated, the dust can enter the device, so that the chips are polluted, and the use of the chips is affected.

The liquid cooling method can solve the problems of large fan noise and air corrosion to the chip and the main board, but the following liquid cooling methods have different defects:

202020343248.9 (server heat radiation System and device combining a server chip gravity type heat pipe and a heat pipe backboard) of Sichuan Chengguan energy-saving and environmental protection technology Co., ltd relate to a server heat radiation system and device combining a server chip gravity type heat pipe and a heat pipe backboard, and realize the heat radiation of a server chip level by arranging a gravity type heat pipe chip radiator in a data center; the heat pipe backboard radiating unit is used for carrying out auxiliary heat radiation, so that the space utilization efficiency of the data center is effectively improved, more servers can be arranged, the economic benefit is improved, and the energy-saving purpose is achieved; the system has the characteristics of high heat exchange efficiency, low thermal resistance, low energy consumption, high heat exchange response speed, high reliability, low noise, long service life and the like; the heat dissipation device has the advantages that the chip-level cooling technology is combined with the outdoor cooling unit, the server chip is directly subjected to more reasonable and efficient heat dissipation, and the heat dissipation device is combined with the outdoor freezing unit through the heat pipe backboard cooling technology, so that other heat sources except the server chip are directly subjected to more reasonable and efficient heat dissipation. The technical characteristics of the patent are that an evaporator which is sealed and filled with liquid refrigerant is arranged on a chip or a server shell, and the liquid refrigerant is absorbed by heat and then becomes a gaseous refrigerant, and the liquid refrigerant is sucked out to enter a refrigeration device and then becomes the liquid refrigerant. The technical disadvantage is that the liquid refrigerant or the gaseous refrigerant is sealed in the box body, and the box body is used for directly contacting the chip or the server shell, so that the chip and the server are damaged by the liquid refrigerant or the gaseous refrigerant leaked from the holes of the box body or the pipeline, and the data center stops working, which is a bearable risk. Such equipment is complex and costly, as leakage of the cooling fluid occurs, which can cause damage to the GPU and the circuit board.

The invention discloses a novel heat dissipation method for an integrated high-density GPU, which is disclosed in China patent 201610058267.5 of Langchao electronic information industry Co., ltd.A specific implementation process is as follows: firstly, dividing a server system into an upper independent heat dissipation space and a lower independent heat dissipation space through a board card, placing a GPU display card in the upper space, placing an exchange chip in the lower space, and dissipating heat in the two independent spaces through a heat dissipation fan arranged at the rear part of a server case; and performing partition type heat dissipation on the upper GPU display cards, and connecting gaps between the front-row GPU display cards to gaps between the corresponding rear-row GPU display cards through the wind scoops. Compared with the prior art, the novel heat dissipation method of the integrated high-density GPU solves the problem of heat dissipation of the rear GPU display card through a layered architecture and an isolated heat dissipation design, and can ensure heat dissipation of the exchange chip at the same time, so that the optimal heat dissipation of the whole server system is ensured; the independent wind scooper can integrate the display card highly, has wide application range and can be applied to the heat radiation design of all electronic products. The patent solves the problem of uniform heat dissipation of a plurality of GPU display cards at different positions in a machine shell, but air-cooled gas used for heat dissipation is still machine room gas, the temperature allowable range of the general C-level machine room gas is 10-35 ℃, the lower the temperature is, a large amount of space is meaningless and a large amount of energy is consumed if the machine room environment is 10 ℃, the heat dissipation effect on the GPU is poor if the machine room environment is 35 ℃, and the over-temperature shutdown is easy to occur, and even the GPU chip and other heating components are damaged.

The invention discloses a novel server heat dissipation design method of a high-density integrated display card, which belongs to a server heat dissipation design method and aims to solve the technical problem of how to meet the heat dissipation of a high-power consumption GPU card and ensure the heat dissipation of a high-power consumption exchange chip. The technical proposal is as follows: the method comprises the following steps: 1 display card position: the system is provided with a high-power display card, wherein the front part is arranged in half, and the rear part is arranged in the other half; the front and back rows of display cards are on the same height, the display cards of the front row and the rear row are staggered; 2 heat dissipation channels: comprises two independent air channels of a channel A and a channel B; 3 1U space of server chassis system places the switching module: is free from the upper part 3U.

In a word, the cooling liquid soaking type cooling method has the advantages that the used cooling liquid is expensive, the equipment is complex, the repairing is inconvenient to take out from the soaking liquid, and the cost is higher. If leakage of the cooling liquid occurs, the cooling liquid will damage the GPU and the circuit board.

Disclosure of Invention

The invention aims to provide a sealing gas circulation cooling method for a GPU chip and the like, wherein the sealing gas is used for directly contacting the chip, and the cooling gas is sealed in a circulation system for repeated refrigeration and heat absorption, so that unused refrigeration energy is not lost and electricity is saved, and the sealing gas circulation cooling method for the GPU chip and the like has the advantages of high-efficiency utilization of refrigeration energy, low noise of a machine room, cleanliness of the GPU chip and the like, lower working temperature of the GPU chip and the like, and stronger actual operation capability of the GPU chip and the like.

The gaseous refrigerant in the context of the present invention, i.e. cold air, is air, preferably an inert gas such as nitrogen or carbon oxide.

The GPU chips and the like refer to the GPU chips, the CPU chips and the radiators on the chips, and are simply written by the GPU chips for simplicity and convenience in description.

GPU refers to the arithmetic units to be heated, such as GPU chips or CPU chips, and is replaced by GPU simple characters for simplicity of description.

GPU box 4 refers to a box or cabinet body provided with a GPU chip or a CPU chip and is provided with an air inlet and an air outlet.

The pneumatic pump means an air compressor and an air compressor, and has the same meaning.

High-pressure cold air refers to: the high-pressure cool air and the high-pressure cool air, the high-pressure cool air and the high-pressure cool air refer to the same concept, and only different words are used for convenience in different places. The high pressure of the high pressure cold air is from more than one atmosphere to slightly smaller than the air pressure of a common household pressure cooker, so that the air flow rate of the blown air to the GPU chip and the like is 5 m/s-40 m/s, and the high pressure cold air is influenced by the size, the length, the bending and the like of an air pipeline from the high pressure cold air storage box to the GPU chip and the like and the air pipe real object installation, and different air pressure values are adopted, so that the specific meaning of the high pressure is suggested to be the variable air pressure with the pressure ranging from 105KPa to 150 KPa. The cold air is the refrigeration gas with the recommended temperature of 10 ℃ to 17 ℃ which is lower than the ambient normal temperature and is output by the refrigeration equipment. The high pressure of the high pressure cooling air of the present invention means the cooling air having a positive pressure as compared with the suction negative pressure of the existing fan. The existing fan negative pressure air extraction heat dissipation technology has the advantages that the fan power of the GPU box and the fan power of the machine case cannot be too high due to noise and vibration problems, the fan power is limited, the GPU is directly blown by forward air pressure, sound-producing vibration setting such as an air pressure pump generating the forward air pressure can be placed outside a machine room, the air pressure pump power cannot be limited due to sound production and vibration, the forward air pressure can be larger than the negative air pressure generated by the fan, the air pressure is larger than the air pressure of the fan, and high air pressure with higher air flow speed can be provided for rapidly dissipating heat of the GPU. The high-pressure rapid air flow generated by the pneumatic pump is used for replacing the low-pressure slow air flow of the fan of the traditional GPU box and the chassis.

Closed cycle refers to: the closed GPU heat dissipation system and the closed gas cooling system form a heat dissipation and cooling combined communication system; i.e. the gas refrigeration energy is enclosed in an energy-saving system in which the system is recycled.

The invention suggests that the gas temperatures at the various circulation positions are: the heat-absorbed gas in the GPU box 4 is 25-35 ℃, the low-temperature gas separated by the heat pump 40 is 5-17 ℃, the high-temperature gas separated by the heat pump 40 is 60-65 ℃, the external environment temperature gas discharged by the cooling device 41 is called normal temperature gas, and the cooling gas inhaled and discharged by the pneumatic pump 1 for cooling the GPU is 10-17 ℃.

The invention is suitable for being used when the external environment temperature or normal temperature is above 5 ℃ to 10 ℃, when the external environment temperature or normal temperature is below 5 ℃ to 10 ℃, the heat pump 40 in the invention is not needed, the heat-absorbed gas exhausted from the GPU box 4 at 25 ℃ to 35 ℃ or 35 ℃ to 45 ℃ can be directly cooled to 10 ℃ to 17 ℃ by the cooling device 41, and the heat-absorbed gas can be repeatedly used as high-pressure cooling gas for cooling the GPU box 4 after being pressurized by the pneumatic pump 1.

The reason for selecting the temperature range of the cooling gas of 10 ℃ to 17 ℃ is as follows: the first reason is that the invention uses the high-pressure gap mode to supply the cool air to cool the air at 10 ℃ to 17 ℃ for saving energy and noise reduction, because the room is normal temperature or not high-pressure cool air, when the high-pressure cool air only blows the GPU chip and the like, the temperature difference is larger than the temperature difference of the air cooled by the current fan, the cooling can be faster, the cool air can be stopped blowing after the cooling is up to the rated value, the cool air at 10 ℃ to 17 ℃ reserved in the GPU box and the case is fully utilized to cool the heat newly generated by the GPU chip, and the refrigerating energy is fully utilized; the refrigerator and the air press can be placed outside the machine room, so the machine room is noiseless, and the invention can reduce the overall energy consumption for cooling the GPU chip and the like, reduce the cooling cost, ensure that the working temperature of the GPU chip and the like is better, the computing capacity is enhanced, and the noise is very low. Secondly, regarding the problem of anti-fog dew, the prior art prescribes that national standard GB2887-89 of fan cooling technology prescribes that the environmental temperature of a GPU chip is 22+/-2 ℃, 15-30 ℃ in level B and 10-35 ℃ in level C; when the environmental humidity A is 45-65%, the maximum dew point temperature of the environment of the suitable data center is 17 ℃. The minimum temperature is 10 ℃ according to the standard, so that the minimum temperature of the cooling gas used for heat dissipation in the invention is 10 ℃, and the high temperature is 17 ℃, namely the cooling gas is 10 ℃ to 17 ℃. The invention adopts the technical proposal of blowing cold air under high pressure, the flow rate of the cold air is far greater than the flow rate of normal temperature air generated by a fan in the prior art, so the invention can disperse fog and dew by blowing the cold air under high pressure, and can select the high limit value of 17 ℃ and cool GPU chips and the like by using low temperature air with the temperature of more than 10 ℃ and less than 17 ℃. Because the invention can disperse the fog dew at any time by blowing cold air under high pressure, the temperature of the fog dew which is easy to generate and can not be selected by the prior fan for cooling is 10 ℃ to 17 ℃ and the invention can be used. The reason that the low limit temperature of the cold air is 10 ℃ is that the low limit temperature is 10 ℃ in the prior art, if the normal working temperature of the actual specific GPU chip and the like is lower than 10 ℃, for example, when the temperature is better than 5 ℃, the low limit temperature of the high-pressure cold air can be 5 ℃ in the technology provided by the invention, and the problem that the cold air at 5 ℃ generates fog dew is solved.

The conception of the invention is as follows:

the cooling gas sealing circulation that first heat dissipation was used is from recycling, solves refrigeration energy recycle and reduces GPU operating temperature problem: the existing open air cooling method is to discharge the endothermic gas in the GPU box 4 to the outside environment, so as to save refrigeration energy, the highest temperature of the endothermic gas before discharging is increased as much as possible under the condition that the GPU and the main board component can basically keep normal operation, for example, the highest temperature of the endothermic gas in the existing open air cooling method is 35 ℃ to 45 ℃ and even reaches 60 ℃, and the maximum working temperature of the GPU and the main board component is 22+/-2 ℃ of the environmental temperature A of the GPU chip specified by national standard GB 2887-89. The invention can recycle the heat dissipation gas in a sealing way, and the refrigeration energy in the heat absorption gas in the circulation system can be recycled, so that the highest temperature of the heat absorption gas can be reduced to 25-35 ℃ or even lower to 20-25 ℃; although the heat-absorbed gas with the temperature of 25 ℃ to 35 ℃ carries more refrigeration energy to leave the GPU box 4 than the heat-absorbed gas with the temperature of 35 ℃ to 45 ℃, the heat-absorbed gas with the temperature of 25 ℃ to 35 ℃ is reduced to the refrigeration energy consumed by 5 ℃ to 17 ℃ in the heat pump 40, and the refrigeration energy consumed by the temperature of less than 35 ℃ to 45 ℃ is reduced to 5 ℃ to 17 ℃, namely, in the heat dissipation gas sealing cycle, the heat pump 40 has the functions of recycling the refrigeration energy and separating high-temperature and low-temperature gases, and the heat pump 40 recycles the refrigeration energy, so that the heat-absorbed gas can be selected to have a lower temperature than the heat-absorbed gas with the temperature of open air cooling, namely, the highest temperature of the heat-absorbed gas is changed to be between 35 ℃ and 35 ℃, which is more beneficial to the GPU and the main board components to basically keep normal work;

The second heat dissipation gas sealing cycle solves the problems of pollution prevention and oxidation reduction: the GPU box or the chassis is provided with two holes for gas to enter and exit, the pipeline and the refrigeration device which are communicated with the two holes are connected into a sealed circulating gas channel, and inert gas is preferably used in the sealed circulating gas channel, so that the problems of dust pollution and oxidation of the GPU and main board components by using exogenous air are solved;

the third heat pump divides the absorbed heat gas into two high and low temperature gases for discharging: the low-temperature gas discharged by the heat pump is reused for cooling the GPU and the main board component, the high-temperature gas discharged by the heat pump is mixed with the low-temperature gas after being cooled by a cooling device such as water shower, and then the mixture is reused for cooling the GPU and the main board component; the heat pump is used for separating the endothermic gas at 25-35 ℃ flowing out of the GPU box into low-temperature gas at 5-17 ℃ with larger temperature difference and high-temperature gas at 60-65 ℃; the efficiency of water showering cooling of the high-temperature gas at 60-65 ℃ is higher than that of water showering cooling of the high-temperature gas at 25-35 ℃, and the required low-temperature gas at 5-17 ℃ cannot be obtained by water showering cooling only.

Fourth, the principle of large temperature difference and high cooling efficiency is used for saving the power consumption of cooling water: the temperature difference of cooling the separated high-temperature gas at 60-65 ℃ by using normal-temperature water is larger than the temperature difference of the separated high-temperature gas at 25-35 ℃ by using normal-temperature water; because the total quantity of the heat-absorbed gas at 25 ℃ to 35 ℃ is far more than the total quantity of the high-temperature gas at 60 ℃ to 65 ℃, and the larger the temperature difference is, the faster the temperature difference is, for example, the energy consumption of spraying the heat-absorbed gas at the temperature of all 25 ℃ to 35 ℃ with normal-temperature water is far more than the water consumption and the electricity consumption of the separated small quantity of the high-temperature gas at 60 ℃ to 65 ℃, the time for separating the high-temperature gas by using the heat pump is short, the efficiency is high, and the low-temperature gas at 5 ℃ to 17 ℃ is obtained, so that the electricity consumption is saved.

Fifth, the reason why the cooling system of the invention does not need an air conditioner to cool the heat-absorbed gas is that: if water is selected for cooling, the temperature of the heat-absorbed gas at 25-35 ℃ is reduced by water at normal temperature, if the temperature is higher than 10-17 ℃, the gas for reducing the temperature at 10-17 ℃ can not be obtained; if the air conditioner is selected for cooling, the air conditioner blows the heat-absorbed gas at 25-35 ℃ by using cold air at 10-17 ℃, a large amount of cold air energy at 10-17 ℃ is dissipated without being utilized, and a large amount of refrigeration energy is wasted. Therefore, the heat pump is used for separating the gas with high temperature and low temperature from the heat-absorbed gas, the water with large heat capacity and large temperature difference for high-temperature gas is cooled and then mixed with the gas for cooling, and the heat pump is reused as a technical scheme for cooling the data center GPU and the main board component which are more energy-saving.

Other reasons for choosing the inventive concept:

firstly, high air pressure is flushed into the device for cooling, so that demisting dew noise reduction is realized: the air pressure pump 1 arranged outside the machine room generates air pressure, the power of the air pressure pump 1 is not limited, high air pressure which is larger than the air pressure of the fan and has higher air flow speed can be provided, fog and dew can be effectively removed by the high air pressure, the GPU chip and the like can be cooled by using the air temperature which is lower than that of the existing fan, the cooling efficiency is improved by using the air temperature which is lower, the GPU chip and the like are better protected, and the operation capability of the GPU chip is improved. The high-pressure gas is used to remove mist, and the gas for heat dissipation can be cooled by the gas with the temperature of 10-17 ℃ which is lower than that of a fan.

Secondly, the mist can be reduced by using lower-temperature gas to cool down: the temperature of a common machine room cooled by the existing fan is normal temperature or about 25 ℃, and the working mode of continuously exhausting the fan is relatively saving in refrigeration energy, but the temperature range is about 25 ℃, the temperature difference between the fan and heating elements such as a GPU chip is small, the heat dissipation efficiency is low, the energy utilization rate of refrigeration is low, the cooling cost is high, the noise of the fan is large, particularly when the working load of the GPU chip is large and the temperature is high, the heat dissipation of the fan is slow, the cooling effect is poor, the heating of the GPU chip is not limited, the operation capability is reduced, and the GPU chip is easy to stop or damage.

The invention can solve the problem with lower cold air heat dissipation: in order to solve the problem that the temperature difference between the gas temperature for heat dissipation and the GPU chip is small, the cooling air is blown out in a high-pressure clearance mode to directly blow the cooling air at the temperature of 10-17 ℃ to the GPU chip and the like for cooling, the temperature difference between the cooling air and heating elements such as the GPU chip and the like is increased, the heat dissipation efficiency is improved, the energy utilization rate of refrigeration is high, the cooling cost is reduced, and a noise fan at a low temperature is not needed.

The reason that the existing fan cannot be used for cooling at 10-17℃ is that: the existing fan is used for cooling, the air is continuously discharged, the negative pressure generated by the fan is very low, high-speed air flow cannot be generated around a GPU chip and the like which mainly generate heat, so that the heat dissipation effect is poor, if the room temperature is 10-17 ℃, the low temperature of a large amount of space of a machine room is too low, the refrigerating energy is discharged by continuously discharging the air at 10-17 ℃ to make a large amount of refrigerating energy not fully utilized, the temperature of the machine room is too low, the refrigerating energy of the air flow cannot be fully utilized by the GPU chip and the like, and the power consumption of refrigeration is greatly wasted, so that the existing fan cooling machine does not use the cooling temperature of 10-17 ℃.

The high pressure range selection reason of the cooling gas 105 KPa-150 KPa is as follows: the high pressure value and the temperature of the cooling gas are selected, the high pressure value and the temperature of the cooling gas are related to the length, the diameter and other factors of the gas storage box gas outlet pipe 8 and the equipartition box gas outlet pipe 19, the heating value of the GPU chip and the like, the gas pressure range is between 105KPa and 150KPa, the low pressure value is more than one atmosphere pressure [100KPa ], and the cooling of the heating of the GPU chip and the like can be compensated by small gas flow after the GPU chip and the like are reduced to the rated low temperature. The pressure limit of the air pressure is smaller than that of the household pressure cooker, so that the high pressure limit is 150KPa. According to the invention, in different time periods when the high-pressure cooling gas is blown to the GPU chip and the like, the temperature to which the GPU chip and the like are reduced is different, and a specific value in the air pressure range of 105 KPa-150 KPa can be selected in different time periods, namely, the air pressure in the time when the GPU chip and the like are at different temperatures is selected to be a specific value in the air pressure range of 105 KPa-150 KPa.

The invention is characterized in that: the heat pump is used for separating the heat-absorbed gas into high-temperature gas and low-temperature gas, the temperature difference between the gas to be cooled and the cooling medium of the cooling device is improved, namely, small parts of high-temperature gas 60-65 ℃ is separated from the heat-absorbed gas exhausted by a server at 25-35 ℃ or 35-45 ℃ in a pipeline, the external water is used for cooling, the temperature difference between the water temperature and the gas is increased, the cooling efficiency is improved, the high-temperature gas is cooled by using normal-temperature water with large heat capacity and large temperature difference, and then the high-temperature gas is mixed with the low-temperature gas separated by the heat pump to form cooling gas for cooling, and the cooling gas is repeatedly used for cooling the GPU, the main board component and the like, so that the refrigerating energy in the cooling gas is recovered, the refrigerating power consumption is saved, and the more preferable cooling technical scheme for realizing the energy-saving data center GPU and the main board component is realized.

In addition, the invention solves the fog and dew problem by using the forward high-pressure cold air, greatly reduces noise without using a fan, can fully utilize the cold air by using a clearance mode to save refrigeration energy, can cool the GPU chip by using the cold air with the low temperature of 10 ℃ to 17 ℃ which cannot be used in the prior art, and can work in a lower temperature environment than the fan cooling method, thereby better protecting the GPU chip and the like and improving the operation efficiency of the GPU chip; the invention aims of saving energy, reducing noise and improving operation efficiency can be achieved.

In addition, firstly, the high-pressure cooling gas which can generate air flow faster than that of a fan of a general GPU box or a fan of a case is used for cooling GPU chips and the like, and because the high-pressure gas is blown onto the GPU in the GPU box or a GPU radiating fin, not only can the high-pressure gas be quickly cooled, but also the possible fog and dew in the GPU box can be blown out of the GPU box, the GPU and other parts are protected, the fog and dew can be blown out of the GPU box, and the fog and dew problem is solved, so that the high-pressure gas can be selected to have a lower cooling temperature of 10 ℃ to 17 ℃ which cannot be used for cooling by the fan, and becomes the high-pressure gas cooling gas which can only be used by the invention. And because the high-pressure air cooling body blown in at 10-17 ℃ firstly cools the GPU and the cooling fins, a large amount of cooling energy in the GPU box can be reserved and utilized, the blowing of the air cooling body can be stopped, the air cooling body is blown out in a gap mode sometimes when cold air is formed, or the cooling method for the air cooling body is provided in a gap mode when the flow is large, so that the consumption of the air cooling body is reduced, and energy is saved. In short, the method for cooling the GPU chip and the like in a high-pressure cold air gap mode is characterized in that the cooling air flows at a high speed under high pressure to remove fog and dew; and the fan is not needed, and the refrigerating and air pressure equipment is arranged outside the machine room, so that the noise of the machine room is greatly reduced.

In a word, the invention aims to solve the problem of fog and dew in the GPU box 4 by using the heat pump 40 and the cooling device 41 to be matched, solve more refrigeration energy sources in the absorbed gas in the recovery sealing circulation, and also solve the problem of fog and dew in the GPU box 4 by using high-pressure cooling gas, so that the cooling gas with the temperature of 10 ℃ to 17 ℃ lower than that of the existing fan heat dissipation mode can be used for rapidly cooling the GPU, the main board and the like, and the GPU, the main board and the like can basically define the working environment of the GPU chip in the national standard GB2887-89 with the A level of 22+/-2 ℃, thereby realizing the purposes of saving energy, reducing noise and improving the operation efficiency.

The invention comprises the following steps:

the energy-saving method for cooling GPU chips and the like by using closed-loop high-pressure cold air comprises a pneumatic pump 1, a high-pressure cold air storage box 2, a GPU chip, a radiator 3, a chip temperature sensor 16 and an automatic controller 13; the chip temperature sensor 16, the GPU chip and the radiator 3 are arranged in the GPU box 4, the GPU box 4 is provided with an air inlet hole 5 and an air outlet hole 6, and the pneumatic pump 1 is provided with an air pump power switch 11, and is characterized in that:

further comprising a heat pump 40 and a cooling device 41; the pump 1, the high-pressure cold air storage tank 2, the GPU chip, the radiator 3, the heat pump 40, the cooling device 41 and the pump 1 are communicated into a gas circulation sealing loop channel in sequence through pipelines;

In the circulating gas sealing loop, the high-pressure cooling gas discharged by the high-pressure cold air box 2 dissipates heat to the GPU chip and the radiator 3, the high-pressure cooling gas is changed into heat-absorbed gas to be discharged from the GPU box 4, the heat-absorbed gas is divided into high-temperature gas and low-temperature gas to be discharged by the heat pump 40, the high-temperature gas is cooled by the cooling device 41 and then mixed with the low-temperature gas to form cooling gas for heat dissipation, the cooling gas is pressurized by the pneumatic pump 1 to be high-pressure cooling gas again, and the high-pressure cooling gas is repeatedly used by the high-pressure cold air box 2 for heat dissipation of the GPU chip and the radiator 3, so that the GPU chip and the radiator 3 are controlled within a set temperature change range; the specific process is as follows:

high-pressure cooling gas stored in the high-pressure cold air box 2 is blown into the GPU box 4 to cool the GPU chip and the radiator 3, so that the high-pressure cooling gas is changed into absorbed gas, after the absorbed gas is absorbed by the heat pump 40, the absorbed gas is separated into high-temperature gas and low-temperature gas by the heat pump 40 to be discharged, namely, the high-temperature gas is separated into high-temperature gas and low-temperature gas to be discharged, the high-temperature gas enters the cooling device 41 in a high-temperature gas pipeline, the cooling device 41 cools the high-temperature gas into normal-temperature gas, and after the high-temperature gas is cooled by the cooling device 41, the low-temperature gas and the normal-temperature gas both enter the two-gas merging pipes 47 to be mixed into cooling gas, and the cooling gas is pressurized by the air pump 1 to be stored in the high-pressure cooling gas box 2 for standby, and is used as standby high-pressure cooling gas for reducing the temperature of the GPU chip and the radiator 3; when the temperature of the GPU chip and the radiator 3 reaches or exceeds a specified high temperature, the signals of the chip temperature sensor 16 and the automatic controller 13 enable an air pipe air pressure valve 15 on an air storage box air outlet pipe 8 of the high-pressure cooling air box 2 to be opened, and the high-pressure cooling air is blown into the GPU box 4 again to radiate heat to the GPU chip and the radiator 3; when the temperature of the GPU chip and the radiator 3 is reduced to or exceeds the specified low temperature, the signals of the chip temperature sensor 16 and the automatic controller 13 enable the air pipe air pressure valve 15 on the air storage box air outlet pipe 8 of the high-pressure cooling air storage box 2 to be closed or slightly opened; meanwhile, the automatic controller 13 makes the heat pump 40 suck the heat-absorbed gas in the GPU box 4, the heat-absorbed gas is separated into two gases with high temperature and low temperature by the heat pump 40 and is discharged, the high temperature gas is cooled by the cooling device 41 and becomes normal temperature gas, the normal temperature gas and the low temperature gas are mixed into cooling gas for heat dissipation by the GPU chip and the radiator 3, the cooling gas is pressurized by the pressure pump 1 into high pressure cooling gas to be stored in the high pressure cold air storage box 2 for repeated use;

According to the temperature changes of the GPU chip and the radiator 3 at different times, the energy saving is realized by discharging high-pressure cooling gas in an intermittent mode: the temperature sensor 16 controls the output quantity and output time of the high-pressure cooling gas in the high-pressure cooling gas storage tank 2 to the GPU chip and the radiator 3 by controlling the opening, micro opening or closing of the air pipe electromagnetic valve 15 through the automatic controller 13, and generates high-pressure cooling gas discharged in a clearance mode to radiate heat to the GPU chip and the radiator 3;

the GPU chip and the radiator 3 continuously generate heat, the high-pressure cooling gas continuously and sequentially carries out heat dissipation and cooling on the GPU chip and the radiator 3 in a sealed circulation mode from the high-pressure cooling gas, the heat-absorbed gas, the high-temperature gas and the low-temperature gas, the high-temperature gas is changed into normal-temperature gas, the low-temperature gas and the normal-temperature gas are mixed into cooling gas, the cooling gas is changed into high-pressure cooling gas.

High pressure cooling gas preferred value range: the temperature of the high-pressure cooling gas discharged from the high-pressure cooling gas storage tank 2 is 10-17 ℃.

High pressure preferred value range for cooling gas: the air pressure of the high-pressure cooling gas discharged from the high-pressure cooling gas storage tank 2 is 105 KPa-150 KPa.

Two choices in two cases within the preferred value range of the high pressure of the cooling gas:

When the temperature of the GPU chip and the chip temperature sensor 16 near the radiator 3 reaches the rated high-temperature set value set by the automatic controller 13, the pressure of a large amount of high-pressure cooling gas discharged by the gas storage tank gas outlet pipe 8 of the high-pressure cooling gas storage tank 2 is 130 KPa-150 KPa, and the temperature is 10 ℃ to 17 ℃;

when the temperature of the GPU chip and the chip temperature sensor 16 near the radiator 3 reaches the rated low-temperature set value set by the automatic controller 13, the air pipe electromagnetic valve 15 is slightly opened, the air storage box air outlet pipe 8 of the high-pressure cooling air storage box 2 discharges a small amount of high-pressure cooling air, the pressure is 105 KPa-130 KPa, and the temperature is 10 ℃ to 17 ℃; or when the temperature of the chip temperature sensor 16 reaches the rated low-temperature set value set by the automatic controller 13, the air pipe electromagnetic valve 15 is closed, and high-pressure cooling gas is not discharged.

The heat pump separates the preferred ranges of low and high temperatures: the low temperature gas separated by the heat pump 40 is 5-17 ℃, and the high temperature gas separated by the heat pump 40 is 60-65 ℃.

The main components of the closed circulation type gas cooling system comprise a sealed circulation gas channel which is formed by connecting a pneumatic pump 1, a high-pressure cold gas storage tank 2, a GPU box 4, a heat pump 40, a cooling device 41 and the like through pipelines, wherein the sealed gas channel is clean and dust-free air, and is preferably inert gas such as nitrogen or carbon dioxide gas or other inert gases. The air pump 1 pressurizes the cooling gas at 10-17 ℃ and stores the gas in the high-pressure cold air storage tank 2 for standby, the air inlet pipe air pressure valve 15 is opened and closed intermittently according to the instruction of the automatic controller 13, so that the air storage tank air outlet pipe 8 can intermittently discharge the high-pressure cooling gas at 10-17 ℃ to the GPU box 4 or the server box, when the temperature of the air in the GPU box 4 or the server box is raised to 25-35 ℃ to become the heat-absorbed gas, the air inlet pipe air pressure valve 15 is opened again, so that the air storage tank air outlet pipe 8 discharges the high-pressure cooling gas at 10-17 ℃ to the GPU box 4, and the high-pressure cooling gas afterwards discharges the original 25-35 ℃ of the GPU box 4 to become the heat-absorbed gas to be extruded out of the GPU box 4, and the heat-absorbed gas enters the heat pump 40; the negative pressure of the heat pump 40 can also be sucked into the heat pump 40 to be the heat-absorbed gas at 25-35 ℃, in the heat pump 40, the heat pump 40 changes the heat-absorbed gas at 25-35 ℃ into two gases with low temperature and high temperature to be discharged, the separated high temperature gas at 60-65 ℃ is changed into water temperature gas which is the normal temperature through the water shower cooling device 41, the water temperature gas which is the normal temperature is mixed with the low temperature gas at 5-17 ℃ separated by the heat pump 40 to be cooling gas at 10-17 ℃, the cooling gas at 10-17 ℃ enters the air pressure pump 1 again to be pressurized to be the high pressure cooling gas at 10-17 ℃ for standby, and the cooling gas can be repeatedly used for cooling the GPU box 4 and the server box, so that the heating components such as the GPU, the CPU, the main board and the like of the data center can be operated at the constant temperature state below 25-35 ℃. The automatic controller 13 adjusts the power of the power controllers 49 according to the temperature of the merging pipe temperature sensor 48, so that the heat pump 40 selects working powers with different magnitudes, and the cooling gas is kept at 10-17 ℃.

With the improvement of the heat pump 40 technology, if the high temperature gas separated by the heat pump 40 can be higher than 60-65 ℃ in the future, the invention selects the higher temperature gas separated by the heat pump 40 with the improved technology.

The invention is based on the principle of energy conservation: the invention firstly requires a sealed circulating gas system, the gas is not lost, the purpose is that the gas is clean, the inert gas with higher price can be used, the refrigeration energy can be recovered, the condition is provided for the heat dissipation gas with lower temperature than the existing fan, the heating components such as GPU, CPU, main board and the like can be operated in a constant temperature state below 25-35 ℃, the working efficiency of the heating components such as GPU, CPU, main board and the like is improved, and the explanation is as follows.

Firstly, only a sealed circulating gas system can be used, if the high-temperature gas at 60-65 ℃ separated by the heat pump 40 is discharged, the inert gas at normal temperature is added again, but the cost of adding the inert gas again is far greater than the cost of cooling by the water spray cooling device 41, and the time flow value of removing the high-temperature gas is difficult to be equal to the time flow value of adding the inert gas again, so that the air pressure in the sealed system is difficult to control. Only a sealed recycle gas system can be used with inert gas.

Secondly, the heat pump 40 is used for adding water to cool the shower cooling device 41 without air conditioning for cooling: if water is selected as a medium for cooling, the heat dissolving quantity of the water is large, the water is recyclable, and the water can be reused and has low cost; the air conditioner is used for cooling by taking cold air as a medium, the heat dissolving quantity of the air is small, the cold air cannot be reused, and the energy consumption and the cost are higher. [1] If the heat pump 40 is not used, only normal-temperature water is used for cooling the heat-absorbed gas at 25-35 ℃, if the normal temperature is higher than 10-17 ℃, the cooling gas for cooling at 10-17 ℃ cannot be obtained, so the heat pump 40 is needed to be matched with the water spraying cooling device 41; [2] if the heat pump 40 is not used for adding water to the cooling device 41, only the air conditioner is selected to cool the heat-absorbed gas at 25-35 ℃ from the server, the air conditioner blows the heat-absorbed gas at 25-35 ℃ from the air conditioner at 10-17 ℃ or lower, a large amount of air conditioner cold energy is emitted without being fully utilized, and a large amount of air conditioner refrigerating energy is wasted. Therefore, the invention separates the heat absorbing gas at 25 ℃ to 35 ℃ into the gas with high and low temperatures by the heat pump, and the gas with high heat capacity and large temperature difference is cooled by the water with high temperature and then mixed with the gas with low temperature to form the cooling gas for cooling, and the gas in the pipe and the water outside the pipe can be reused, thus being a preferable technical scheme for cooling the data center GPU and the main board component with more energy conservation.

Thirdly, the temperature difference is improved, water is saved, the temperature is reduced, the energy is saved, and the GPU works in a better state: the temperature difference between the heat-absorbed gas and the warm water is small at 25-35 ℃ discharged from the GPU box, and the temperature difference between the high-temperature gas at 60-65 ℃ separated by the heat pump 40 and the warm water is large, so that the temperature difference of about 30 ℃ is increased. Since the heat pump 40 can generally separate only high temperature gas of 60-65 ℃, the high temperature gas parameter is 60-65 ℃. The larger the temperature difference between the water and the gas needing to be cooled in the pipeline is, the more total heat is carried by the heat absorbing gas in unit time when the temperature of the gas needing to be cooled in the pipeline is reduced, the effect of cooling the high-temperature gas at 60-65 ℃ by water spraying is improved, the water consumption is less, and the more total heat is carried by the heat absorbing gas in unit time. If the temperature of 25 ℃ to 35 ℃ is directly used as the endothermic gas, the effect of water spraying and cooling is low, the temperature difference is small, the water consumption is large, and the temperature can not be reduced to 10 ℃ to 17 ℃ directly. The temperature reduction of the data center GPU, the CPU and the main board is more favorable for the GPU, the CPU and the main board to work in a better state, and the temperature reduction of the normal-temperature gas is not as good as the temperature reduction of the data center GPU, the CPU and the main board by using the temperature reduction of 10 ℃ to 17 ℃.

Fourth, the circulating gas can recycle refrigeration energy, the temperature of the circulating cooling gas is reduced without increasing energy consumption, so that the GPU can work in a better temperature environment: the invention is used for sealing and recycling the gas for cooling GPU chips and the like, so that the refrigerating energy of the heat pump for normal-temperature gas can be recycled, the temperature of the heat-absorbing gas flowing out of the GPU box can be lower than 35-45 ℃ of the temperature of the existing fan for opening, cooling and air cooling, and the invention can select the gas with the temperature of 25-35 ℃ of the heat-absorbing gas flowing out of the GPU box; because the refrigeration energy can be recycled, the invention can conditionally and selectively control the temperature of the heat-absorbing gas flowing out of the GPU box to be the best suitable for the working temperature of the GPU and the CPU, namely the better temperature environment of 25-35 ℃. When the temperature of the low-temperature gas is 5-17 ℃ and the water sprayed normal-temperature gas are mixed to form 10-17 ℃ gas for cooling, the gas is blown into the GPU box 4, after the temperature of the GPU, the CPU and the main board is reduced, when the temperature of the GPU box 4 is 25-35 ℃, the gas at the temperature of the cooling is blown into the GPU box 4 again, the gas with the temperature of 25-35 ℃ is discharged out of the GPU box 4, and the gas with the temperature of 25-35 ℃ is fed into the heat pump 40. In a closed system in which cooling gas is circulated, the heat pump 40 for a long time converts the heat-absorbed gas at 25 ℃ to 35 ℃ into low-temperature gas at 5 ℃ to 17 ℃ with the same total energy as the total energy required for converting the heat-absorbed gas at 35 ℃ to 45 ℃ into the low-temperature gas at 5 ℃ to 17 ℃, which is the advantage of sealing the circulating gas, and uses lower-temperature gas to cool GPU chips and the like without increasing energy consumption.

In order to prevent the high-pressure cold air from reversely flowing back, a check valve 14 which can only flow from the pneumatic pump 1 to the high-pressure cold air storage tank 2 is arranged on the pneumatic pump air outlet pipe 7.

The check valve 14 prevents the reverse flow of the high-pressure cold gas stored in the high-pressure cold gas storage tank 2 into the pneumatic pump 1 after the pneumatic pump 1 stops operating.

The automatic controller 13 is connected to an intake pipe air pressure valve 15 by an electric wire. The air inlet pipe air pressure valve 15 is a control part for realizing the output of the high-pressure cold air physical object in a gap mode by the high-pressure cold air storage box 2, and the opening or micro-opening or closing of the air inlet pipe air pressure valve 15 is controlled by the automatic controller 13. The automatic controller 13 may be a fixed time setting or may use the chip temperature sensor 16 as a source of control information.

When the workload of the GPU chip and the like is changed from large to small, and the heat of the GPU chip and the like is generated from small, the temperature of the gas in the two gas merging pipes 47 is lower than 10-17 ℃, and the signals transmitted into the automatic controller 13 by the merging pipe temperature sensor 48 enable the various power controllers 49 to reduce the power, so that the purposes of reducing the use of refrigeration energy and saving electricity are achieved.

Because the air inlet of the heat pump 40 has the function of sucking air, the air in the GPU box 4 can be sucked into the heat pump 40, and the air sucking function of the heat pump 40 can suck not only the hot air in the GPU box 4, but also the air to be absorbed in the GPU box 4, which does not reach the set temperature of the hot air; in order to save the energy of the gas to be absorbed, the gas to be absorbed continuously absorbs the heat of the GPU and the like in the GPU box 4, a hot air pipe air pressure valve 50 is arranged on a heat pump air inlet pipe 42 of the heat pump 40, and the hot air pipe air pressure valve 50 is connected with the automatic controller 13 by an electric wire; only when the chip temperature sensor 16 and the combining tube temperature sensor 48 reach the set values of the gas temperature, the automatic controller 13 sends out an instruction of opening the hot gas pipe air pressure valve 50, the hot gas pipe air pressure valve 50 is opened, the heat pump 40 sucks the heated gas in the GPU box 4, and when the heat pump 40 sucks enough or timed heated gas, the hot gas pipe air pressure valve 50 is closed; the automatic controller 13 then starts the air inlet pipe air pressure valve 15 to open, and blows cooling air at 10-17 ℃ for cooling into the GPU box 4. Therefore, the temperature information of the chip temperature sensor 16 controls the air inlet pipe air pressure valve 15 and the hot air pipe air pressure valve 50 of the GPU box 4 through the automatic controller 13, and the temperature in the GPU box 4 is regulated to be kept within a set range, so that the refrigerating energy is saved, the electricity is saved, and the cost is saved.

For the normal refrigeration control loop of temperature, the meaning of outputting high-pressure cold gas by setting rated gas pressure or rated time by using the air inlet pipe air pressure valve 15 is that: the gas pressure sensor 9 is mainly used for setting rated gas pressure in the high-pressure cold gas storage tank 2, in particular setting the highest rated gas pressure, and the realization method is that the power switch 11 of the pneumatic pump 1 is controlled by the automatic controller 13 through the gas pressure information of the gas pressure sensor 9, so that the gas pressure in the high-pressure cold gas storage tank 2 is controlled to be not over-rated. The rated pressure or the rated time is set, cooling gas which can flow rapidly with pressure can be intermittently or fluctuated to the GPU chip and the radiator 3, and high-temperature gas which is stuck near the GPU chip and the radiator 3 can be rapidly removed, so that the purpose of rapid cooling of the GPU chip and the radiator 3 is achieved. The cooling effect of the high temperature gas which is flushed towards the GPU chip and the radiator 3 and the surroundings with the same amount of energy consumption, such as with a lower temperature cooling gas of 10 ℃ is certainly better than the dispersed wide cooling effect of the normal temperature of 25 ℃ which is continuously sucked by a fan. That is, the cooling method for blowing low-temperature gas has better cooling effect and saves more energy than the cooling method for sucking higher-temperature gas by the existing fan. The air inlet pipe air pressure valve 15 is opened intermittently, so that the GPU fan and the case fan can be not used continuously, and the noise of a machine room is greatly reduced; because the pneumatic pump 1 can be placed outside the room, there is only a slight, low frequency, intermittent air flow sound in the room, rather than a large, high frequency, even resonant, even metallic, continuous fan sound. Therefore, the method is used for intermittently blowing the high-pressure cooling air to the GPU chip and the radiator 3, so that the cooling effect to the GPU chip and the radiator 3 is better, the cooling energy is saved, and the noise in a machine room is low.

The automatic control mode for the high-pressure cooling gas is as follows: the air pump 1 presses the cold air into the high-pressure air storage box 2, the chip temperature sensor 16 controls the opening, micro opening and closing of the air inlet pipe air pressure valve 15 through the automatic controller 13 to control the transmission amount and time of the high-pressure air in the high-pressure air storage box 2 to the GPU chip and the radiator 3, and the high-pressure air discharged in a clearance mode controls the GPU chip and the radiator 3 in a set temperature and humidity variation range; the specific mode is as follows:

when the temperature of the chip temperature sensor 16 reaches a high-temperature set value, the chip temperature sensor 16 enables the automatic controller 13 to drive the air inlet pipe air pressure valve 15 to open, and the air storage box air outlet pipe 8 discharges a large amount of high-pressure cold air to the GPU chip and the radiator 3 in the GPU box 4 so as to quickly cool the GPU chip and the radiator 3.

When the chip temperature sensor 16 is reduced to a rated low-temperature set value, the chip temperature sensor 16 enables the automatic controller 13 to drive the air inlet pipe air pressure valve 15 to be slightly opened, the air storage tank air outlet pipe 8 discharges a small amount of cold air to the GPU chip and the radiator 3 in the GPU box 4, and the GPU chip and the radiator 3 are kept; or when the chip temperature sensor 16 is lowered to the low-temperature set value, the chip temperature sensor 16 enables the automatic controller 13 to drive the air inlet pipe air pressure valve 15 to be closed, and the GPU chip and the radiator 3 slowly heat up.

The pressure of the high-pressure cooling gas is preferably 105KPa to 150KPa, and the temperature is 10 ℃ to 17 ℃.

The air inlet pipe air pressure valve 15 arranged on the air outlet pipe 8 of the air storage box is a key technical setting for generating a gap mode for providing high-pressure air, the gap mode provides the high-pressure air to enable the temperature of the air to be lower than the indoor normal temperature or the temperature of 17-35 ℃ of a machine room cabinet in the existing fan continuous air suction mode, the cooling effect of the high-pressure air at 10-17 ℃ is preferably obviously better than that of the existing fan normal temperature of 17-35 ℃, and the gap mode provides the high-pressure air to fully utilize the energy of the air at 10-17 ℃ in a box or a case during the gap inflation, instead of the prior art that the continuous air exhaust wastes the energy of the air cooling, and the existing continuous air exhaust enables the energy of the machine room to be not fully utilized.

Temperature settings and advantages for interstitial low temperatures: the invention is characterized in that the high-pressure gap type cooling gas is blown in, the temperature of the high-pressure cooling gas can be 10 ℃ to 17 ℃, the temperature is far lower than the indoor normal temperature or 17 ℃ to 35 ℃ of the machine room cabinet in the existing fan continuous air suction mode, the fan continuous air suction can only use the higher indoor normal temperature or 17 ℃ to 35 ℃, and the machine room air conditioner is not lower than 17 ℃, if the temperature is 10 ℃ to 17 ℃, the low-temperature gas continuously discharged by the fan wastes too much energy, so that the cooling gas with better GPU efficiency is required to be used for cooling the low-temperature cooling gas with 10 ℃ to 17 ℃ without wasting energy, only the cooling gas with 10 ℃ to 17 ℃ can be blown in by using the gap of the invention, and when the power consumption components such as the GPU chip are heated to the rated high temperature such as 50 ℃ to 65 ℃, a large amount of the cooling gas with 10 ℃ to 17 ℃ is blown in, the power consumption components such as the GPU chip are cooled to 10 ℃ to 17 ℃, and then the power consumption components such as the GPU chip are stopped from blowing in the low-temperature cooling gas with 10 ℃ to 17 ℃ or a small amount of the low-temperature cooling gas with the low temperature, and waiting for the power consumption components such as the GPU chip to be heated to 50 ℃ to 65 ℃ and then blown in the power consumption components such as the power consumption chip is cooled down with 10 ℃ to 17 ℃ again. When a large amount of low-temperature cooling gas at 10-17 ℃ is blown in, the temperature difference between the cooling gas and the GPU chip is large, and the cooling speed is faster than that of indoor normal-temperature gas of a fan, so that the cooling gas is used for cooling the GPU chip and the like, the energy utilization efficiency is higher, the energy is saved, the GPU chip and the like have longer low-temperature working time, and the operation capacity of the GPU chip is higher. The cooling gas blowing-in type cooling can also blow off dust and water mist at any time, and the GPU chip and the like are not damaged by crystal water, so that the cooling gas can be cooled at a low temperature of 10-17 ℃ lower than that of a fan mode.

The key point of the invention is that the high-pressure cold air can be cooled by a gap mode: when the temperature of the high-pressure cold air blown in the gap mode is 10 ℃ to 17 ℃, the gas with lower temperature below 10 ℃ can be used for inputting the high-pressure cold air blown in the gap mode to cool the GPU chip and the radiator 3, the cooling is faster, the gap time between the lowest temperature and the highest temperature for starting to cool the GPU chip and the radiator 3 can be prolonged, but the time for producing water mist and dew is very fast when the temperature of the gas is lower than 10 ℃, and the water mist and dew can not be completely blown out by the high-pressure air flow with 130KPa to 150KPa, so that the water mist and dew is not suggested. After the GPU chip and the radiator 3 are cooled to 10-17 ℃ from 10-17 ℃ by high-pressure cold air, the high-pressure cold air is stopped or blown in a small amount, so that the GPU chip and the radiator 3 are heated to 35-45 ℃ or 50-60 ℃ for a certain period of time, the cold air energy of 10-17 ℃ in the GPU box 4 is fully utilized in the period of stopping or blowing in the high-pressure cold air in a small amount, the energy consumption of cooling is reduced, and the cooling cost is saved.

In the prior art, if the fan is used for continuously exhausting air, the air for heat dissipation is continuously pumped out by the fan from one to the other at normal temperature or constant 25 ℃, the temperature of the air for heat dissipation is high, the temperature reduction efficiency is low when the temperature difference between the air for heat dissipation and the GPU chip and the radiator 3 is small, and the energy sources for preparing the power consumption and the refrigerating air of the fan for heat dissipation are wasted; if the prior art changes the air for heat dissipation into low temperature of 15 ℃, the temperature difference between the air and the GPU chip and the radiator 3 is higher, but more energy sources for preparing the air for heat dissipation at 15 ℃ are consumed in a large amount of useless space of a machine room, and the air is continuously extracted by a fan, so that the air is more romantic energy sources; if the temperature of the gas used for heat dissipation in the prior art is changed into high temperature of 40 ℃, the temperature difference between the gas and the GPU chip and the radiator 3 is too small, the cooling effect is too bad, and the gas cannot be used, and the gas has no meaning. Therefore, the gap-mode high-pressure cold air cooling method is a method with high cooling efficiency and energy conservation.

The automatic controller 13 mainly controls two processes of heat dissipation and dehumidification of the GPU chip and the radiator 3, and refrigeration power consumption and pressurization of the heat-absorbed gas, four processes: a heat dissipation process, a dehumidification process, a power consumption refrigeration process and a gas pressurization process.

The first heat dissipation process, the control of the heat dissipation process of the GPU chip and the heat sink 3 by the automatic controller 13 is mainly controlled by the chip temperature sensor 16 as follows:

a power switch 11 is arranged on a power line 10 connected with the pneumatic pump 1;

a gas pressure sensor 9 is provided in the high-pressure cooling gas storage tank 2,

an air pipe electromagnetic valve 15 is arranged on an air storage box air outlet pipe 8 of the high-pressure cooling air storage box 2,

a chip temperature sensor 16 and a humidity sensor 17 are provided in GPU box 4,

a combining pipe temperature sensor 48 is provided in the two gas combining pipes 47 which are cooling gas pipes entering the pneumatic pump 1,

a variety of power controllers 49 are provided in the heat pump 40,

a hot air pipe air pressure valve 50 is arranged on a heat pump air inlet pipe 42 which is communicated with the GPU box 4 and the heat pump 40,

the automatic controller 13 is respectively connected with a gas pressure sensor 9, a power switch 11, an air pipe electromagnetic valve 15, a chip temperature sensor 16, a humidity sensor 17, a combining pipe temperature sensor 48, a plurality of power controllers 49 and a hot air pipe air pressure valve 50 by wires;

The method for adjusting the temperature in the GPU box 4 by the chip temperature sensor 16 is as follows:

the chip temperature sensor 16 controls the opening, micro opening or closing of the air pipe electromagnetic valve 15 and the hot air pipe air pressure valve 50 in a matched manner through the automatic controller 13 to control the transmission quantity and time of the high-pressure cooling gas in the high-pressure cooling gas storage tank 2 to the GPU chip and the radiator 3, so that the high-pressure cooling gas discharged in a clearance mode dissipates heat of the GPU chip and the radiator 3, and the GPU chip and the radiator 3 are controlled in a set temperature and humidity variation range; the specific mode is as follows:

when the temperature of the chip temperature sensor 16 reaches the rated high temperature set value set by the automatic controller 13, the chip temperature sensor 16 enables the automatic controller 13 to drive the air pipe electromagnetic valve 15 and the hot air pipe air pressure valve 50 to be opened, and the heat pump 40 sucks the heat-absorbed gas in the GPU box 4; the air outlet pipe 8 of the air storage box discharges a large amount of high-pressure cooling air to the GPU chip and the radiator 3 in the GPU box 4, and rapidly cools the GPU chip and the radiator 3;

when the temperature of the chip temperature sensor 16 reaches the rated low-temperature set value set by the automatic controller 13, the chip temperature sensor 16 enables the automatic controller 13 to drive the air pipe electromagnetic valve 15 and the hot air pipe air pressure valve 50 to be slightly opened, the air storage box air outlet pipe 8 discharges a small amount of high-pressure cooling gas to the GPU chip and the radiator 3 in the GPU box 4, and the GPU chip and the radiator 3 are kept at low temperature or the GPU chip and the radiator 3 are slowly heated; or when the temperature of the chip temperature sensor 16 reaches the rated low-temperature set value set by the automatic controller 13, the automatic controller 13 drives the hot air pipe air pressure valve 50 to slightly open, and the chip temperature sensor 16 enables the automatic controller 13 to drive the air pipe electromagnetic valve 15 to close.

The second dehumidification process, the humidity sensor 17 in the box is used for mainly controlling the control of the dehumidification process of the GPU chip and the radiator 3 through the automatic controller 13 as follows:

the humidity sensor 17 in the box adjusts the humidity in the GPU box 4 as follows:

the humidity sensor 17 in the box controls the opening, micro opening or closing of the air pipe electromagnetic valve 15 and the hot air pipe air pressure valve 50 in a matched manner through the automatic controller 13 to control the transmission amount and time of the high-pressure cooling gas in the high-pressure cooling gas storage box 2 to the GPU chip and the radiator 3, so that the high-pressure cooling gas discharged in a clearance mode removes mist and dew from the GPU chip and the radiator 3, and the humidity in the GPU box 4 is controlled in a set humidity change range; the specific mode is as follows:

when the humidity of the humidity sensor 17 in the box reaches the rated high humidity set value set by the automatic controller 13, the humidity sensor 17 in the box enables the automatic controller 13 to drive the air pipe electromagnetic valve 15 and the hot air pipe air pressure valve 50 to be opened, and the heat pump 40 sucks the absorbed gas in the GPU box 4; the air outlet pipe 8 of the air storage box discharges a large amount of high-pressure cooling air to the GPU chip and the radiator 3 in the GPU box 4, and rapidly dehumidifies the surfaces of the GPU chip and the radiator 3 and the environment in the GPU box 4;

When the humidity of the humidity sensor 17 in the box reaches the rated low-humidity set value set by the automatic controller 13, the humidity sensor 17 in the box enables the automatic controller 13 to drive the air pipe electromagnetic valve 15 and the hot air pipe air pressure valve 50 to be slightly opened, and the air storage box air outlet pipe 8 discharges a small amount of high-pressure cooling air to the GPU chip and the radiator 3 in the GPU box 4; or when the humidity of the humidity sensor 17 in the box reaches the rated low humidity set value set by the automatic controller 13, the automatic controller 13 drives the hot air pipe air pressure valve 50 to slightly open, and the humidity sensor 17 in the box enables the automatic controller 13 to drive the air pipe electromagnetic valve 15 to close.

The third power consumption refrigeration process uses the merging tube temperature sensor 48 to mainly control the working power of the heat pump 40 through the automatic controller 13 as follows:

when the temperature of the combining pipe temperature sensor 48 in the two gas combining pipes 47 is higher than the set temperature value, the combining pipe temperature sensor 48 enables the automatic controller 13 to drive the various power controllers 49 to be changed into a larger power gear, and the working electricity of the heat pump 40 is increased;

when the temperature of the combining pipe temperature sensor 48 in the two gas combining pipes 47 is lower than the set temperature value, the combining pipe temperature sensor 48 enables the automatic controller 13 to drive the various power controllers 49 to change into a smaller power gear, and the working electricity consumption of the heat pump 40 is reduced.

The fourth gas pressurizing process mainly controls whether the pneumatic pump 1 is started or not by the gas pressure sensor 9 through the automatic controller 13 as follows:

a gas pressure sensor 9 is arranged in the high-pressure cooling gas storage tank 2, and a power supply automatic switch 11 is arranged on a power supply wire 10 connected with the pneumatic pump 1; the gas pressure sensor 9 is connected with the automatic power switch 11 and the automatic controller 13 to form a control loop for outputting high-pressure cooling gas at normal rated gas pressure or rated time.

Three meanings of the four control processes are as follows:

the meaning is that the heat pump is used for separating out high-temperature gas and is cooled, so that the electricity consumption for cooling can be saved: the power of the heat pump 40 is increased or decreased along with the change of the outdoor air temperature and the water temperature for cold shower, so that the heat dissipation energy consumption of a GPU chip and the like is saved, and the electricity consumption and the cost of a data center are saved. The automatic controller 13 adjusts various power controllers 49 according to the temperature of the merging pipe temperature sensor 48, so that the heat pump 40 selects working powers with different magnitudes, and the cooling gas is kept at 10-17 ℃. When the workload of the GPU chip and the like is changed from large to small and the heating of the GPU chip and the like is changed from small, the gas temperature in the two gas merging pipes 47 is lower than 10-17 ℃, and the signals transmitted into the automatic controller 13 by the merging pipe temperature sensor 48 enable the various power controllers 49 to reduce the power, so that the purposes of recycling the refrigerating energy by circulating gas and saving the refrigerating energy are achieved.

Meaning two, the energy of saving cooling, noise in the computer lab are low: for the normal refrigeration control loop of temperature, the nominal gas pressure or the nominal time is set by the gas pipe pneumatic valve 15 to output the meaning of high-pressure cooling gas: the gas pressure sensor 9 is mainly used for setting rated gas pressure in the high-pressure cooling gas storage tank 2, in particular setting the highest rated gas pressure, and the realization method is that the power switch 11 of the pneumatic pump 1 is controlled by the automatic controller 13 through the gas pressure information of the gas pressure sensor 9, so that the gas pressure in the high-pressure cooling gas storage tank 2 is controlled to be not over-rated. The rated pressure or the rated time is set, cooling gas which can flow rapidly with pressure can be intermittently or fluctuated to the GPU chip and the radiator 3, and high-temperature gas which is stuck near the GPU chip and the radiator 3 can be rapidly removed, so that the purpose of rapid cooling of the GPU chip and the radiator 3 is achieved. The cooling effect of the high temperature gas which is flushed towards the GPU chip and the radiator 3 and the surroundings with the same amount of energy consumption, such as with a lower temperature cooling gas of 10 ℃ is certainly better than the dispersed wide cooling effect of the normal temperature of 25 ℃ which is continuously sucked by a fan. That is, the cooling method for blowing low-temperature gas has better cooling effect and saves more energy than the cooling method for sucking higher-temperature gas by the existing fan. The air pipe air pressure valve 15 is opened intermittently, so that the GPU fan and the case fan can be not used continuously, the noise of the machine room is greatly reduced; because the pneumatic pump 1 can be placed outside the room, there is only a slight, low frequency, intermittent air flow sound in the room, rather than a large, high frequency, even resonant, even metallic, continuous fan sound. Therefore, the method is used for adding high-pressure cooling gas to intermittently blow the GPU chip and the radiator 3, so that the cooling effect on the GPU chip and the radiator 3 is better, the cooling energy is saved, and the noise in a machine room is low.

Meaning three can drive fog dew and can use low-temperature gas to dispel heat: the fog-dispelling dew can cool the GPU chip and the like by using cooling gas which is lower than that of an open fan, so that the GPU chip and the like can have a better working temperature environment. Emergent dehumidification defogging control circuit: the working environment of the GPU chip and the like has a specified range for temperature and humidity, and the maximum dew point temperature is 17 ℃ under the condition that the national standard B2887-89 considers that the environmental humidity is 45-65% of the A level. Under the condition that the humidity is 45% -65%, the temperature rated value of the chip temperature sensor 16 is 10 ℃ -45 ℃, namely when the temperature of the chip temperature sensor 16 reaches 45 ℃, high-pressure cooling gas with the starting temperature of 10 ℃ -17 ℃ is blown into the GPU box 4 to cool, when the temperature is reduced to 10 ℃, the high-pressure cooling gas is stopped to blow, when the temperature of the chip temperature sensor 16 reaches 45 ℃ again, the high-pressure cooling gas is blown to cool, and circulation of cooling and stopping after the blowing is stopped is formed. In the cycle time of cooling and stopping, if the fog dew can be generated in the GPU box 4, the fog dew is also driven out of the GPU box 4 by the high-pressure cooling gas blown in next time, so that the fog dew cannot exist in the GPU box 4 for a long time. Therefore, under the condition that the ambient humidity is 45-65%, the invention does not have the problem that the fog and dew influence the GPU chip and the like. However, if the time delay and the amount of the mist generated in the GPU box 4 are increased under the special bad condition that the ambient humidity is more than 85%, the GPU chip and the like are possibly bad for a long time, and in order to solve the problems that the mist is prolonged and the amount is also increased, the in-box humidity sensor 17 is arranged in the GPU box 4, the in-box humidity sensor 17 uses the mist data of the time length and the amount of the mist generated, and the air pipe air pressure valve 15 is controlled to be closed by the automatic controller 13, so that the air pipe air pressure valve 15 can be opened in advance by the mist data before the temperature of the chip temperature sensor 16 does not reach 45 ℃, the mist in the GPU box 4 is forcibly driven out by the high-pressure cooling gas in advance, and the emergency dehumidification is realized, so that the GPU chip and the like are protected from the mist under the special bad condition that the ambient humidity is more than 85%.

The invention has the advantages that:

first, recoverable refrigeration energy: the cooling gas for circulation heat dissipation can be recycled, the temperature of the cooling gas is reduced without increasing energy consumption, and the GPU can work in a better temperature environment. The gas for cooling the GPU chip and the like is circularly used in a sealing way, and the energy of the refrigerating gas can be recycled, so that the temperature of the heat-absorbing gas flowing out of the GPU box is selected to be 25-35 ℃ lower than the temperature of 50-60 ℃ cooled by a fan in the prior art, and the temperature of the heat-absorbing gas flowing out of the GPU box is controlled to be the optimal working temperature of the GPU and the CPU, namely, the working temperature of the CPU is 25-35 ℃ better.

Second, the sealed circulation of heat dissipation gas solves pollution and oxidation problems: the GPU box or the chassis is provided with two holes for gas to enter and exit, a pipeline for communicating the two holes and the refrigerating device are connected into a sealed circulating gas channel, and inert gas is preferably used in the sealed circulating gas channel, so that the problems of dust pollution and oxidation of the GPU and the main board components by using exogenous air are solved.

Thirdly, the problem of high cost of newly adding inert gas is solved: the invention uses the inert gas as the normal temperature gas of the GPU and the CPU, and the invention uses the sealing circulating gas system, thereby solving the problem that the cost is reduced because the inert gas does not need to be added at any time, and solving the problem that the flow of the discharged high-temperature gas at any time is difficult to be equal to the flow value of the newly added inert gas at any time, and the air pressure in the sealing system is difficult to control.

Fourth, cooling gas for reducing the temperature of 10 ℃ to 17 ℃ can be obtained by using the hot water: the energy consumption for cooling the endothermic gas is reduced, and the heat pump water-adding shower cooling device is selected for cooling, so that the cooling water can be reused and the cost is low; and cold air is used as a medium for cooling, and cannot be reused, so that the cost is low. The cooling gas for cooling at 10-17 ℃ can be obtained, and the phenomenon that when the air conditioner cools the heat-absorbed gas, the cold air energy is emitted without being fully utilized, and a large amount of refrigeration energy of the air conditioner is wasted is avoided.

Fifthly, the temperature difference is improved, the water is saved, the energy consumption is reduced, and the GPU works in a better state: the temperature difference between the high-temperature gas at 60-65 ℃ separated by the heat pump and the warm water is large, and the temperature difference between the high-temperature gas at 25-35 ℃ or 35-45 ℃ and the normal-temperature water is small, so that the high-temperature gas separated by the heat pump is used for cooling by water shower, the heat pump is more energy-saving than the heat pump which directly uses the high-temperature gas at 25-35 ℃ or 35-45 ℃ and the warm water for cooling, and the heat pump separates the high-temperature gas at 60-65 ℃ from the unit time to cool the normal-temperature water, so that the water consumption is less and the energy is more energy-saving.

In addition to the other of these,

the invention solves the problem of fog and dew generated in the GPU box 4 by using the forward high-pressure cooling gas, and the high-pressure generated gas flow rate is 20 m/s-40 m/s greater than the fan air flow rate, so that the noise of a machine room can be greatly reduced without using a fan; the high-pressure cooling gas at the temperature of 10 ℃ to 17 ℃ can be used for providing cool air in a gap mode, so that the cool air can be fully utilized to save refrigeration energy; the problem of fog dew is solved, and the cooling of the GPU chip and the like is faster by using cold air with low temperature of 10-17 ℃, so that the GPU chip and the like are better protected compared with the fan air with lower temperature, the working temperature of the GPU chip and the like is ensured not to be overtemperature, and the operation efficiency of the GPU chip is improved; the energy and noise are saved, and the operation efficiency is improved.

The invention uses high-pressure cooling gas, can realize that the cooling gas is output in a clearance mode to radiate the GPU chip and the radiator 3, thereby saving radiating energy consumption, improving operation efficiency, saving calculation cost and reducing noise of a machine room.

The temperature and humidity control loop outputs cooling gas in a gap mode, and controls the air pipe air pressure valve 15 by the chip temperature sensor 16 and the in-box humidity sensor 17, so that whether the cooling gas is output to the GPU chip and the radiator 3 is a key component for realizing the output of the cooling gas in the gap mode, realizing the automatic gap mode of discharging the high-pressure cooling gas to dissipate heat of the GPU chip and the like, and protecting the GPU chip and the like from mist.

And the heat dissipation energy consumption control loop selects working energy consumption power according to the temperature of cooling water, and the merging pipe temperature sensor controls the various power controllers to determine the heat dissipation energy consumption power according to the temperature of the external environment.

Drawings

FIG. 1 is a schematic diagram of the connection and control relationships of the server of the present invention to the equipment used in the gas sealing cycle for heat dissipation from the GPU chip and the heat sink.

FIG. 2 is a schematic illustration of the high pressure cooling gas flow sequence of the components of the present invention.

In the figure, the air pump 1, the high-pressure cold air tank 2, the GPU chip and the radiator 3, the GPU box 4, the air inlet 5, the air outlet 6, the air pump outlet 7, the air storage tank outlet 8, the air pressure sensor 9, the power line 10, the air pump electric source switch 11, the automatic controller 13, the one-way valve 14, the air pipe air pressure valve 15, the chip temperature sensor 16, the humidity sensor 17, the heat pump 40, the cooling device 41, the heat pump inlet 42, the low-temperature outlet 43, the air pump inlet 44, the high-temperature outlet 45, the cooling device outlet 56, the two-air merging pipe 47, the merging pipe temperature sensor 48, the multiple power controllers 49 and the hot air pipe air pressure valve 50 are arranged.

Detailed Description

Embodiment 1, energy saving method for cooling GPU chip and the like by closed-loop high-pressure cool air

As shown in figures 1 and 2 of the drawings,

The energy-saving method for cooling GPU chips and the like by using closed-loop high-pressure cold air is characterized by comprising the following steps of: in the circulating gas sealing loop, the cooling gas for radiating the heat of the GPU chip and the radiator 3 is changed into the heat-absorbed gas, the heat-absorbed gas is discharged from the GPU box 4, the heat pump 40 is used for separating the heat-absorbed gas into two gases with high temperature and low temperature, the high temperature gas is cooled by the cooling device 41 and then mixed with the low temperature gas to be used for radiating repeatedly, and the specific process is as follows:

The high-pressure cooling gas with the temperature of 10 ℃ to 150KPa and the temperature of 10 ℃ to 17 ℃ is blown into the GPU box 4 to dissipate heat to form heat-absorbed gas with the temperature of 25 ℃ to 35 ℃ for the GPU chip and the radiator 3, after the heat-absorbed gas is absorbed by the heat pump 40, the heat pump 40 divides the heat-absorbed gas into two gases with high temperature and low temperature to be discharged, namely, the heat-absorbed gas is divided into the high-temperature gas with the temperature of 60 ℃ to 65 ℃ and the low-temperature gas with the temperature of 5 ℃ to 17 ℃ to be discharged, the high-temperature gas enters the cooling device 41 in the high-temperature gas pipeline, after the high-temperature gas in the high-temperature gas pipeline is cooled to normal-temperature gas, the two gases enter the two gas merging pipes 47 to be mixed to form cooling gas with the temperature of 10 ℃ to 17 ℃ to be pressurized to 105KPa to 150KPa by the air pump 1, the high-pressure cooling gas with the temperature of 10 ℃ to 17 ℃ is stored in the high-pressure cooling gas box 2 to be used as standby gas for reducing the temperature of the GPU chip and the radiator 3, when the temperature of the GPU chip and the radiator 3 reaches 25-35 ℃ or 35-45 ℃, an air pipe air pressure valve 15 on an air storage tank air outlet pipe 8 which is communicated with the GPU chip and the radiator 3 and a high-pressure cooling air storage tank 2 is pressed, 105 KPa-150 KPa, high-pressure cooling air with the temperature of 10-17 ℃ is blown into the GPU box 4 again to continuously generate heat for the GPU chip and the radiator 3 to cool the GPU chip and the radiator 3, and the high-pressure cooling air continuously and sequentially changes high-pressure cooling air, endothermic air, high-temperature air and low-temperature air into normal-temperature air, low-temperature air and normal-temperature air into cooling air, and the cooling air is changed into high-pressure cooling air, so that the GPU chip and the radiator 3 are continuously cooled in a circulating way.

The seal gas passage is clean, dust-free air, preferably an inert gas such as nitrogen or carbon dioxide gas, or other inert gas.

The embodiment aims at clean gas and inert gas, can recycle refrigeration energy, provides conditions for using heat dissipation gas with lower temperature than the existing fans, ensures that heating components such as GPU, CPU, main board and the like can run in a constant temperature state below 25-35 ℃, improves the working efficiency of the heating components such as GPU, CPU, main board and the like,

the embodiment firstly requires a sealed circulating gas system, aims at cleaning gas and using inert gas, can recycle refrigeration energy, provides conditions for using heat dissipation gas with lower temperature than the existing fans, ensures that heating components such as a GPU, a CPU, a mainboard and the like can operate in a constant temperature state below 25-35 ℃, and improves the working efficiency of the heating components such as the GPU, the CPU, the mainboard and the like.

Parameter setting: the low temperature rated value of the GPU chip and the radiator 3 can be 25 ℃ or 35 ℃, the high temperature rated value can be 45 ℃ or 65 ℃, and in order to realize the combination of the temperature rated values, the air pressure of the high-pressure cooling air matched with the embodiment is 105 KPa-150 KPa, the temperature is 10 ℃ to 17 ℃, and the diameter, the length and the bending degree of the air pipe are reserved by various matched parameter values, so that the GPU is arranged in a small space such as the GPU box 4 or a large space such as a case.

More specific GPU chip and heat sink temperature control is described as follows:

the chip temperature sensor 16 controls the opening, micro opening or closing of the air pipe electromagnetic valve 15 through the automatic controller 13 to control the transmission quantity and time of the high-pressure cooling gas in the high-pressure cooling gas storage tank 2 to the GPU chip and the radiator 3, so that the high-pressure cooling gas discharged in a clearance mode dissipates heat to the GPU chip and the radiator 3, and the GPU chip and the radiator 3 are controlled in a set temperature and humidity variation range; the specific mode is as follows:

when the temperature of the chip temperature sensor 16 reaches the rated high-temperature set value set by the automatic controller 13, the chip temperature sensor 16 enables the automatic controller 13 to drive the air pipe electromagnetic valve 15 to open, and the air storage tank air outlet pipe 8 discharges a large amount of high-pressure cooling air to the GPU chip and the radiator 3 in the GPU box 4 so as to quickly cool the GPU chip and the radiator 3;

when the temperature of the chip temperature sensor 16 reaches the rated low-temperature set value set by the automatic controller 13, the chip temperature sensor 16 enables the automatic controller 13 to drive the air pipe electromagnetic valve 15 to be opened slightly, the air storage tank air outlet pipe 8 discharges a small amount of high-pressure cooling gas to the GPU chip and the radiator 3 in the GPU box 4, and the GPU chip and the radiator 3 are kept at low temperature or the GPU chip and the radiator 3 are slowly heated;

Or when the temperature of the chip temperature sensor 16 reaches the rated low-temperature set value set by the automatic controller 13, the chip temperature sensor 16 enables the automatic controller 13 to drive the air pipe electromagnetic valve 15 to be closed.

The chip temperature sensor 16 is generally self-contained in the GPU chip, and is not required to be additionally mounted, and only the pins of the temperature sensor on the GPU chip or the temperature sensor wiring on the motherboard are required to be welded by using wires, and then the wires are welded with the pins of the automatic controller 13.

The air pipe electromagnetic valve 15 is provided with a valve which gradually changes from small to large, so that the air pipe electromagnetic valve can be incompletely closed after the temperature of the GPU chip and the radiator 3 reaches the rated value, a small gap is reserved for flowing out a small amount of cooling gas, and the air pipe electromagnetic valve is used for compensating the part of heat consumed by the temperature rise of the GPU chip and the radiator 3, so that the time for the GPU chip and the radiator 3 to reach the high-temperature rated value again is prolonged.

Example 2 energy saving method for Cooling GPU chips Using closed-cycle high-pressure Cold air

As shown in figures 1 and 2 of the drawings,

in the method of embodiment 1, when the temperature of the chip temperature sensor 16, that is, the temperature of the endothermic gas reaches 35 ℃ of the rated high temperature set value, after the temperature of the GPU chip and the chip temperature sensor 16 near the radiator 3 reach the rated high temperature set value set by the automatic controller 13, the pressure of the large amount of high pressure cooling gas discharged from the gas storage tank outlet pipe 8 of the high pressure cooling gas storage tank 2 is 130 KPa-150 KPa, and the temperature is 10 ℃ to 17 ℃; i.e. the temperature of the absorbed gas is high and the pressure of the high pressure cooling gas is high.

If the temperature of the chip temperature sensor 16, namely the temperature of the absorbed gas reaches 25 ℃ of the rated low-temperature set value, after the temperature of the GPU chip and the temperature of the chip temperature sensor 16 near the radiator 3 reach the rated low-temperature set value set by the automatic controller 13, the air pipe electromagnetic valve 15 is slightly opened, the pressure of a small amount of high-pressure cooling gas discharged by the air storage box air outlet pipe 8 of the high-pressure cooling gas storage box 2 is 105 KPa-130 KPa, and the temperature is 10 ℃ -17 ℃; i.e. the temperature of the absorbed gas is low and the pressure of the high pressure cooling gas is low. Or when the temperature of the chip temperature sensor 16 reaches the rated low-temperature set value set by the automatic controller 13, the air pipe electromagnetic valve 15 is closed, and high-pressure cooling gas is not discharged.

Example 3 energy saving method for Cooling GPU chip Using closed-cycle high-pressure Cold air

As shown in figures 1 and 2 of the drawings,

in the methods of embodiments 1 and 2, the method for controlling the GPU chip and the heat sink 3 by the automatic controller 13 is as follows:

a variety of power controllers 49 are provided in the heat pump 40,

first, the method for adjusting the temperature in the GPU box 4 by the chip temperature sensor 16 is as follows:

the chip temperature sensor 16 controls the opening, micro opening or closing of the air pipe electromagnetic valve 15 and the hot air pipe air pressure valve 50 in a matched manner through the automatic controller 13 to control the transmission amount and time of the high-pressure cooling gas in the high-pressure cooling gas storage tank 2 to the GPU chip and the radiator 3, so that the high-pressure cooling gas discharged in a clearance mode dissipates heat of the GPU chip and the radiator 3, and the GPU chip and the radiator 3 are controlled in a set temperature change range; the specific mode is as follows:

Secondly, the humidity sensor 17 in the box adjusts the humidity in the GPU box 4 as follows:

Example 4 energy saving method for Cooling GPU chip Using closed-cycle high-pressure Cold air

As shown in figures 1 and 2 of the drawings,

in the methods of

embodiments

1 and 2 and 3, the control method of the heat pump 40 and the air pressure pump 1 by the automatic controller 13 is as follows:

The method for controlling the heat pump 40 by the automatic controller 13 is as follows:

when the temperature of the combining pipe temperature sensor 48 in the two gas combining pipes 47 is higher than the set temperature value of 17 ℃, the combining pipe temperature sensor 48 enables the automatic controller 13 to drive the various power controllers 49 to change into a larger power gear, and the working electricity of the heat pump 40 is reduced;

when the temperature of the combining pipe temperature sensor 48 in the two gas combining pipes 47 is lower than the set temperature value of 10 ℃, the combining pipe temperature sensor 48 enables the automatic controller 13 to drive the various power controllers 49 to be changed into a smaller power level, and the working electricity of the heat pump 40 is reduced.

The automatic controller 13 regulates the pneumatic pump 1 as follows:

a gas pressure sensor 9 is arranged in the high-pressure cooling gas storage tank 2, and a power supply automatic switch 11 is arranged on a power supply wire 10 connected with the pneumatic pump 1; the gas pressure sensor 9 is connected with the automatic power supply switch 11 and the automatic controller 13 to form 105 KPa-150 KPa normal rated gas pressure, or the automatic power supply switch 11 is connected for 10 seconds and is closed for 5 seconds for circulating rated working time, so as to achieve a control loop for outputting high-pressure cooling gas.

Claims

1. The energy-saving method for cooling the GPU chip and the like by using the closed-cycle high-pressure cold air comprises a pneumatic pump (1), a high-pressure cold air storage box (2), the GPU chip, a radiator (3), a chip temperature sensor (16) and an automatic controller (13); chip temperature sensor (16) and GPU chip and radiator (3) all set up in GPU box (4), are equipped with inlet port (5) and venthole (6) on GPU box (4), are equipped with air pump switch (11), its characterized in that on pneumatic pump (1):

The device also comprises a heat pump (40) and a cooling device (41); the method comprises the steps that a pressure pump (1), a high-pressure cold air storage box (2), a GPU chip, a radiator (3), a heat pump (40), a cooling device (41) and the pressure pump (1) are communicated in sequence through pipelines to form a gas circulation sealing loop channel;

in the circulating gas sealing loop, high-pressure cooling gas discharged by a high-pressure cold air box (2) dissipates heat of a GPU chip and a radiator (3), the high-pressure cooling gas is changed into heat-absorbed gas which is discharged from a GPU box (4), the heat-absorbed gas is divided into two gases with high temperature and low temperature by a heat pump (40) to be discharged, the high-temperature gas is cooled by a cooling device (41) and then mixed with low-temperature gas to form cooling gas for heat dissipation, the cooling gas is pressurized by a pneumatic pump (1) to form high-pressure cooling gas, and the high-pressure cooling gas is repeatedly used by the high-pressure cold air box (2) for heat dissipation of the GPU chip and the radiator (3), so that the GPU chip and the radiator (3) are controlled within a set temperature change range; the specific process is as follows:

high-pressure cooling gas in a high-pressure cooling gas storage box (2) is blown into a GPU box (4) to dissipate heat of a GPU chip and a radiator (3), so that the high-pressure cooling gas is changed into heat-absorbed gas, after the heat-absorbed gas is absorbed by a heat pump (40), the heat pump (40) divides the heat-absorbed gas into two high-low temperature gases to be discharged, namely, the two high-temperature gases are divided into two high-temperature gases and low-temperature gases to be discharged, the high-temperature gases enter a cooling device (41) in a high-temperature gas pipeline, the cooling device (41) cools the high-temperature gases into normal-temperature gases, and after the two low-temperature gases and the normal-temperature gases enter a two-gas merging pipe (47) to be mixed into cooling gas, and the cooling gas is pressurized by a pneumatic pump (1) to be stored in the high-pressure cooling gas storage box (2) for standby, and is used as standby high-pressure cooling gas for reducing the temperature of the GPU chip and the radiator (3); when the temperatures of the GPU chip and the radiator (3) reach or exceed a specified high temperature, the signals of the chip temperature sensor (16) and the automatic controller (13) enable an air pipe air pressure valve (15) on an air storage box air outlet pipe (8) of the high-pressure cooling air box (2) to be opened, and the high-pressure cooling air is blown into the GPU box (4) again to radiate heat of the GPU chip and the radiator (3); when the temperature of the GPU chip and the radiator (3) is reduced to or exceeds a specified low temperature, the signals of the chip temperature sensor (16) and the automatic controller (13) enable an air pipe air pressure valve (15) on an air storage box air outlet pipe (8) of the high-pressure cooling air storage box (2) to be closed or slightly opened; meanwhile, the automatic controller (13) enables the heat pump (40) to suck the heat-absorbed gas in the GPU box (4), the heat-absorbed gas is separated into high-temperature gas and low-temperature gas to be discharged by the heat pump (40), the high-temperature gas is cooled by the cooling device (41) and becomes normal-temperature gas, the normal-temperature gas and the low-temperature gas are mixed into cooling gas for heat dissipation by the GPU chip and the radiator (3), the cooling gas is pressurized by the pressure pump (1) into high-pressure cooling gas to be stored in the high-pressure cooling gas storage box (2) for repeated use;

According to the temperature change of the GPU chip and the radiator (3) at different time, the energy saving is realized by discharging high-pressure cooling gas in an intermittent mode: the temperature sensor (16) controls the output quantity and the output time of the high-pressure cooling gas in the high-pressure cooling gas storage tank (2) to the GPU chip and the radiator (3) by controlling the opening, micro opening or closing of the air pipe electromagnetic valve (15) through the automatic controller (13), and generates high-pressure cooling gas discharged in a clearance mode to radiate heat to the GPU chip and the radiator (3);

the GPU chip and the radiator (3) continuously generate heat, the high-pressure cooling gas continuously and sequentially changes high-pressure cooling gas, absorbed gas, high-temperature gas and low-temperature gas from repetition in a sealed circulation, the high-temperature gas is changed into normal-temperature gas, the low-temperature gas and the normal-temperature gas are mixed into cooling gas, the cooling gas is changed into high-pressure cooling gas, and the GPU chip and the radiator (3) are continuously cooled in a circulating manner.

2. The energy-saving method for cooling the GPU chips and the like by using the closed-loop high-pressure cold air according to claim 1, wherein the energy-saving method is characterized in that: the temperature of the high-pressure cooling gas discharged from the high-pressure cooling gas storage tank (2) is 10-17 ℃.

3. The energy-saving method for cooling the GPU chip and the like by using the closed-loop high-pressure cold air according to claim 2, wherein the energy-saving method is characterized in that: the air pressure of the high-pressure cooling gas discharged from the high-pressure cooling gas storage tank (2) is 105 KPa-150 KPa.

4. The energy-saving method for cooling the GPU chip and the like by using the closed-loop high-pressure cold air according to claim 3, wherein the energy-saving method comprises the following steps:

when the temperature of a chip temperature sensor (16) near a GPU chip and a radiator (3) reaches a rated high-temperature set value set by an automatic controller (13), a gas storage tank gas outlet pipe (8) of a high-pressure cooling gas storage tank (2) discharges a large amount of high-pressure cooling gas with the pressure of 130 KPa-150 KPa and the temperature of 10 ℃ -17 ℃;

when the temperature of a GPU chip and a chip temperature sensor (16) near a radiator (3) reaches a rated low-temperature set value set by an automatic controller (13), a gas pipe electromagnetic valve (15) is slightly opened, a gas storage tank gas outlet pipe (8) of a high-pressure cooling gas tank (2) discharges a small amount of high-pressure cooling gas, the pressure is 105 KPa-130 KPa, and the temperature is 10-17 ℃; or when the temperature of the chip temperature sensor (16) reaches the rated low-temperature set value set by the automatic controller (13), the air pipe electromagnetic valve (15) is closed, and high-pressure cooling gas is not discharged.

5. The energy-saving method for cooling the GPU chip and the like by using the closed-loop high-pressure cold air according to claim 2, 3 or 4, wherein the energy-saving method comprises the following steps: the low-temperature gas separated by the heat pump (40) is 5-17 ℃, and the high-temperature gas separated by the heat pump (40) is 60-65 ℃.

6. The energy-saving method for cooling the GPU chip and the like by using the closed-loop high-pressure cold air according to claim 5, wherein the energy-saving method is characterized in that:

a power switch (11) is arranged on a power line (10) connected with the pneumatic pump (1);

a gas pressure sensor (9) is arranged in the high-pressure cooling gas storage tank (2),

an air pipe electromagnetic valve (15) is arranged on an air storage box air outlet pipe (8) of the high-pressure cooling air storage box (2),

a chip temperature sensor (16) and a humidity sensor (17) are arranged in the GPU box (4),

a combining pipe temperature sensor (48) is arranged in a cooling gas pipeline, namely two gas combining pipes (47), which enters the pneumatic pump (1),

a plurality of power controllers (49) are arranged on the heat pump (40),

an air outlet pipe air pressure valve (50) is arranged on a heat pump air inlet pipe (42) which is communicated with the GPU box (4) and the heat pump (40),

the automatic controller (13) is respectively connected with the gas pressure sensor (9), the power switch (11), the gas pipe electromagnetic valve (15), the chip temperature sensor (16), the humidity sensor (17), the merging pipe temperature sensor (48), the multiple power controllers (49) and the gas outlet pipe air pressure valve (50) through wires;

The temperature regulation method of the chip temperature sensor (16) in the GPU box (4) is as follows:

the chip temperature sensor (16) controls the opening, micro opening or closing of the air pipe electromagnetic valve (15) and the air outlet pipe air pressure valve (50) in a matched manner through the automatic controller (13) to control the transmission amount and time of high-pressure cooling gas in the high-pressure cooling gas storage tank (2) to the GPU chip and the radiator (3), so that the high-pressure cooling gas discharged in a clearance mode dissipates heat of the GPU chip and the radiator (3), and the GPU chip and the radiator (3) are controlled in a set temperature change range; the specific mode is as follows:

when the temperature of the chip temperature sensor (16) reaches a rated high-temperature set value set by the automatic controller (13), the chip temperature sensor (16) enables the automatic controller (13) to drive the air pipe electromagnetic valve (15) and the air outlet pipe air pressure valve (50) to be opened, and the heat pump (40) sucks the absorbed gas in the GPU box (4); the air outlet pipe (8) of the air storage box discharges a large amount of high-pressure cooling air to the GPU chip and the radiator (3) in the GPU box (4) to quickly cool the GPU chip and the radiator (3);

when the temperature of the chip temperature sensor (16) reaches a rated low-temperature set value set by the automatic controller (13), the chip temperature sensor (16) enables the automatic controller (13) to drive the air pipe electromagnetic valve (15) and the air outlet pipe air pressure valve (50) to be slightly opened, and the air outlet pipe (8) of the air storage box discharges a small amount of high-pressure cooling gas to the GPU chip and the radiator (3) in the GPU box (4) to keep the low temperature of the GPU chip and the radiator (3) or enable the GPU chip and the radiator (3) to slowly heat; or when the temperature of the chip temperature sensor (16) reaches the rated low-temperature set value set by the automatic controller (13), the automatic controller (13) drives the air outlet pipe air pressure valve (50) to slightly open, and the chip temperature sensor (16) enables the automatic controller (13) to drive the air pipe electromagnetic valve (15) to close.

7. The energy-saving method for cooling the GPU chip and the like by using the closed-loop high-pressure cold air according to claim 6, wherein the energy-saving method is characterized in that:

the humidity sensor (17) in the box adjusts the humidity in the GPU box (4) as follows:

the humidity sensor (17) in the box controls the opening, micro opening or closing of the air pipe electromagnetic valve (15) and the air outlet pipe air pressure valve (50) in a matched manner through the automatic controller (13) to control the transmission amount and time of high-pressure cooling gas in the high-pressure cooling gas storage box (2) to the GPU chip and the radiator (3), so that mist and dew are removed from the GPU chip and the radiator (3) by the high-pressure cooling gas discharged in a clearance mode, and the humidity in the GPU box (4) is controlled in a set humidity change range; the specific mode is as follows:

when the humidity of the humidity sensor (17) in the box reaches a rated high humidity set value set by the automatic controller (13), the humidity sensor (17) in the box enables the automatic controller (13) to drive the air pipe electromagnetic valve (15) and the air outlet pipe air pressure valve (50) to be opened, and the heat pump (40) sucks the absorbed gas in the GPU box (4); the air outlet pipe (8) of the air storage box discharges a large amount of high-pressure cooling air to the GPU chip and the radiator (3) in the GPU box (4) and rapidly dehumidifies the surfaces of the GPU chip and the radiator (3) and the environment in the GPU box (4);

When the humidity of the humidity sensor (17) in the box reaches a rated low-humidity set value set by the automatic controller (13), the humidity sensor (17) in the box enables the automatic controller (13) to drive the air pipe electromagnetic valve (15) and the air outlet pipe air pressure valve (50) to be slightly opened, and the air outlet pipe (8) of the air storage box discharges a small amount of high-pressure cooling gas to the GPU chip and the radiator (3) in the GPU box (4); or when the humidity of the humidity sensor (17) in the box reaches the rated low humidity set value set by the automatic controller (13), the automatic controller (13) drives the air outlet pipe air pressure valve (50) to slightly open, and the humidity sensor (17) in the box enables the automatic controller (13) to drive the air pipe electromagnetic valve (15) to close.

8. The energy-saving method for cooling the GPU chip and the like by using the closed-loop high-pressure cold air according to claim 7, wherein the energy-saving method is characterized in that: when the temperature of a merging pipe temperature sensor (48) in the two gas merging pipes (47) is higher than a set temperature value, the merging pipe temperature sensor (48) enables the automatic controller (13) to drive a plurality of power controllers (49) to change into a larger power gear, and the working electricity of the heat pump (40) is increased;

when the temperature of a merging pipe temperature sensor (48) in the two gas merging pipes (47) is lower than a set temperature value, the merging pipe temperature sensor (48) enables the automatic controller (13) to drive various power controllers (49) to change into a smaller power level, and the working electricity consumption of the heat pump (40) is reduced.

9. The energy-saving method for cooling the GPU chip and the like by using the closed-loop high-pressure cold air according to claim 5, wherein the energy-saving method is characterized in that: a gas pressure sensor (9) is arranged in the high-pressure cooling gas storage tank (2), and a power supply automatic switch (11) is arranged on a power supply wire (10) connected with the pneumatic pump (1); the gas pressure sensor (9) is connected with the automatic power switch (11) and the automatic controller (13) to form a control loop for outputting high-pressure cooling gas at normal rated gas pressure or rated time.