CN116060822A - Self-soldering soft solder and preparation method and application thereof - Google Patents

Self-soldering soft solder and preparation method and application thereof Download PDF

Info

Publication number
CN116060822A
CN116060822A CN202310195574.8A CN202310195574A CN116060822A CN 116060822 A CN116060822 A CN 116060822A CN 202310195574 A CN202310195574 A CN 202310195574A CN 116060822 A CN116060822 A CN 116060822A
Authority
CN
China
Prior art keywords
self
solder
brazing
fluxing
flux
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310195574.8A
Other languages
Chinese (zh)
Inventor
邓建峰
王博
王生希
郝庆乐
龙伟民
张雷
程战
费文潘
王劲涛
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ningbo Academy of Intelligent Machine Tool Co Ltd of China Academy of Machinery
Original Assignee
Ningbo Academy of Intelligent Machine Tool Co Ltd of China Academy of Machinery
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ningbo Academy of Intelligent Machine Tool Co Ltd of China Academy of Machinery filed Critical Ningbo Academy of Intelligent Machine Tool Co Ltd of China Academy of Machinery
Priority to CN202310195574.8A priority Critical patent/CN116060822A/en
Publication of CN116060822A publication Critical patent/CN116060822A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/40—Making wire or rods for soldering or welding

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The invention relates to the technical field of brazing, in particular to self-brazing soft solder, and a preparation method and application thereof. The self-fluxing soft solder mainly comprises the following components in percentage by mass: 6-25 parts of tin-based brazing filler metal and brazing flux; wherein, the tin-based solder is mainly prepared from the following components in percentage by mass: 7-9% of Sb, 4-6% of Cu, 0.2-2% of Ni and the balance of Sn; the brazing flux comprises zinc chloride and/or ammonium chloride. The melting point of the self-soldering soft solder is 230-250 ℃, so that the sensitization temperature interval of stainless steel is completely avoided, and the problem of intergranular corrosion after soldering is avoided; meanwhile, the soft solder can greatly improve the shear strength of the soldered joint; the solder can be directly used for soldering without adding soldering flux.

Description

Self-soldering soft solder and preparation method and application thereof
Technical Field
The invention relates to the technical field of brazing, in particular to self-brazing soft solder, and a preparation method and application thereof.
Background
Stainless steel has good formability, corrosion resistance, heat resistance and other properties, and is widely applied to the fields of aerospace, rail transit, nuclear energy devices, refrigeration and the like, such as honeycomb structures, heat exchangers, sleeve structures and the like. The material is also widely applied to industries such as food, medical treatment, kitchen ware and the like, and is an important pin material of the electronic product connector. These products tend to be complex in structure, more in welding sites, and brazing is a very efficient method of joining. Brazing can be classified into brazing and soldering according to the melting point of the brazing filler metal, and brazing performed with the liquidus of the brazing filler metal higher than 450 ℃ is brazing, and brazing performed with the liquidus of the brazing filler metal lower than 450 ℃ is soldering.
The common brazing filler metals for stainless steel brazing are Ni-based brazing filler metals, cu-based brazing filler metals and Ag-based brazing filler metals, the melting points of the brazing filler metals are above 600 ℃, the brazing temperature is within a sensitization zone (450-800 ℃) of austenitic stainless steel, for common austenitic stainless steel (such as 304 and 316), cr23C6 is formed in a crystal boundary due to stay in the sensitization zone, a Cr-deficient zone appears near the crystal boundary, and serious intergranular corrosion problems are caused. Therefore, the adoption of the soft soldering is an important measure for avoiding the sensitization of the stainless steel, and the stainless steel soft soldering has outstanding advantages in the occasions with low working temperature and small strength requirement, but good sealing property and attractive appearance.
Brazing requires the use of a brazing flux to remove an oxide film on the surface of stainless steel and improve the wettability of brazing filler metal on a stainless steel base metal. The common soldering solders for stainless steel comprise Sn92AgCuSb, pb58Sn40Sb2, sn99, sn96BiSbCuNi, pb97Ag and the like, and the soldering agents comprise orthophosphoric acid aqueous solution, zinc chloride acid aqueous solution, zinc ammonium chloride aqueous solution, diethylamine hydrochloride-orthophosphoric acid glycol solution and the like.
However, the shear strength of the joint after the brazing of the existing stainless steel soft solder is low (about 40 MPa), the brazing flux is used discretely, the brazing flux is difficult to quantitatively add, and in order to ensure the brazing quality, the brazing flux is usually added excessively, so that on one hand, the brazing flux is wasted, on the other hand, the residual brazing flux has certain corrosiveness, and the cleaning procedure is increased.
For example, patent document CN100592958C discloses a sn—cu solder for stainless steel soldering, which has a certain deoxidizing and oxide film removing effect at a soldering temperature by adding alloy elements lithium and titanium having deoxidizing effect, but the technology still needs to be used with a soldering flux to achieve a better soldering effect.
The self-fluxing solder is a solder itself having a component for removing an oxide film and preventing secondary oxidation, and can be directly soldered without requiring an additional flux. The self-soldering solder has two forms, namely, the constituent elements of the solder have the capability of removing oxide films, such as phosphor-containing copper phosphor and copper silver phosphor solder, lithium-containing copper-based solder and silver-based solder; and secondly, compounding the brazing filler metal and the brazing flux, such as flux core, coating and powder synthetic brazing filler metal. Soldering mainly adopts tin-based solder, and electronic packaging is used as the largest application scene, and composite soldering paste or rosin-core solder is often adopted, but is only suitable for soldering materials mainly comprising Cu and Ni.
In addition, the rosin core self-soldering tin-based soft solder in the prior art has the following problems: the brazing flux is unevenly distributed and is easy to leak out; the applicable base material types are few, and the oxide film on the stainless steel surface can not be removed.
In view of this, the present invention has been made.
Disclosure of Invention
The first aim of the invention is to provide a self-soldering solder, the melting point of which is 230-250 ℃, thereby completely avoiding the sensitization temperature interval of stainless steel and avoiding the problem of intergranular corrosion after soldering; meanwhile, the self-soldering soft solder can greatly improve the shear strength of the soldered joint; in addition, the self-soldering soft solder can be used for directly soldering without adding soldering flux.
The second aim of the invention is to provide a preparation method of self-fluxing solder, which has the advantages that the self-fluxing solder is not easy to absorb moisture, is simple and easy to operate, has short process flow, is suitable for mass production and the like.
A third object of the present invention is to provide the use of the self-fluxing solder in stainless steel brazing.
In order to achieve the above object of the present invention, the following technical solutions are specifically adopted:
the invention provides self-fluxing soft solder which mainly comprises the following components in percentage by mass 75-94: 6-25 parts of tin-based brazing filler metal and brazing flux;
wherein, the tin-based solder is mainly prepared from the following components in percentage by mass: 7-9% of Sb, 4-6% of Cu, 0.2-2% of Ni and the balance of Sn;
the brazing flux comprises zinc chloride and/or ammonium chloride.
Preferably, the mass ratio of the tin-based brazing filler metal to the brazing flux is 80-92: 8-20.
Preferably, the brazing flux comprises the following components in percentage by mass of 2-5: 1 and ammonium chloride.
Preferably, the melting point of the self-fluxing solder is 230-250 ℃.
The invention also provides a preparation method of the self-fluxing solder, which comprises the following steps:
smelting a mixed material containing Sb, cu, ni and Sn to obtain an ingot, and then preparing into powder to obtain solder powder;
the brazing filler metal powder and the brazing flux are evenly mixed and then subjected to plastic forming, so that self-brazing filler metal is obtained;
wherein the brazing flux comprises zinc chloride and/or ammonium chloride.
Preferably, the particle size of the brazing filler metal powder is 30 to 200 mesh, preferably 50 to 150 mesh.
Preferably, the granularity of the brazing flux is 100-300 meshes;
preferably, the particle size of the flux is smaller than the particle size of the solder powder.
Preferably, the method of plastic forming comprises at least one of extrusion, drawing and rolling;
preferably, the extrusion comprises cold extrusion and/or hot extrusion;
preferably, the temperature of the hot extrusion is 100 to 150 ℃.
Preferably, the method of plastic forming comprises the steps of: and after the brazing filler metal powder and the brazing flux are uniformly mixed, cold extrusion, hot extrusion and drawing are sequentially carried out.
The invention also provides the self-fluxing solder or the self-fluxing solder prepared by the preparation method of the self-fluxing solder, and the self-fluxing solder is applied to stainless steel soldering.
Compared with the prior art, the invention has the beneficial effects that:
(1) The melting point of the self-soldering soft solder provided by the invention is kept at 230-250 ℃, the sensitization temperature interval of stainless steel is completely avoided, and the problem of intergranular corrosion after soldering is avoided.
(2) The self-fluxing soft solder provided by the invention forms tiny and uniformly distributed (Cu, ni) by adding Ni element 6 Sn 5 The strengthening phase greatly improves the shear strength of the soldered joint after soldering, especially when the mass percentage of Ni is 0.5%, the shear strength of the soldered joint reaches 66.9MPa, which is improved by 60% compared with the case of no Ni addition.
(3) According to the self-fluxing soft solder provided by the invention, the zinc chloride and/or the ammonium chloride are added, so that the oxide film on the surface of the stainless steel can be effectively removed.
(4) The self-soldering soft solder provided by the invention can be directly used for soldering, and no soldering flux is required to be additionally added, so that the self-soldering soft solder is more convenient to use.
(5) According to the preparation method of the self-soldering flux, the soldering flux, namely zinc chloride and/or ammonium chloride, is dispersed and distributed and is firmly wrapped in the solder powder, so that moisture absorption can be effectively avoided.
(6) According to the preparation method of the self-fluxing soft solder, provided by the invention, the powder extrusion forming method is adopted, so that the soldering flux is uniformly distributed, is not easy to leak out, and is convenient to use.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present invention, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
FIG. 1 is a DSC graph of examples 1 to 5 provided by the present invention;
FIG. 2 is a graph showing the SEM-EDS test results of the self-fluxing solder prepared in example 2 according to the present invention;
fig. 3 is a graph showing SEM-EDS test results of the solder prepared in comparative example 1 provided by the present invention.
Detailed Description
The technical solution of the present invention will be clearly and completely described below with reference to the accompanying drawings and detailed description, but it will be understood by those skilled in the art that the examples described below are some, but not all, examples of the present invention, and are intended to be illustrative of the present invention only and should not be construed as limiting the scope of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention. The specific conditions are not noted in the examples and are carried out according to conventional conditions or conditions recommended by the manufacturer. The reagents or apparatus used were conventional products commercially available without the manufacturer's attention.
In a first aspect, the present invention provides a self-fluxing solder that can be used for ferrous alloys, particularly stainless steel, consisting essentially of a mass ratio of 75 to 94 (including, but not limited to, a point value of any one of 76, 77, 78, 79, 80, 82, 84, 85, 87, 89, 90, 91, 92, 93 or a range value between any two): 6 to 25 (including but not limited to 7, 8, 9, 10, 12, 14, 15, 17, 19, 20, 21, 22, 23, 24, or any range between any two).
For example, the mass ratio of tin-based solder to flux may be 75: 25. 78: 22. 80: 20. 82: 18. 84: 16. 85: 15. 86: 14. 88: 12. 90: 10. 92:8 or 94:6.
wherein, the tin-based solder is mainly prepared from the following components in percentage by mass: 7-9% of Sb, 4-6% of Cu, 0.2-2% of Ni and the balance of Sn.
Wherein the mass percent of Sb includes, but is not limited to, a dot value of any one of 7.2%, 7.4%, 7.5%, 7.7%, 7.9%, 8.0%, 8.2%, 8.5%, 8.7%, 8.9%, or a range value therebetween; the mass percent of Cu includes, but is not limited to, any one of 4.2%, 4.4%, 4.5%, 4.7%, 4.9%, 5.0%, 5.2%, 5.5%, 5.7%, 5.9% of a point value or a range value between any two; the mass percent of Ni includes, but is not limited to, any one of 0.3%, 0.4%, 0.5%, 0.7%, 0.9%, 1.0%, 1.2%, 1.4%, 1.5%, 1.7%, 1.9% of a point value or a range value between any two.
The brazing flux comprises zinc chloride and/or ammonium chloride.
The invention uses Sn-Sb-Cu as a matrix, and controls the quantity of alloy elements to keep the melting point of self-soldering solder at 230-250 ℃, thereby completely avoiding the sensitization temperature interval of stainless steel and avoiding the problem of intergranular corrosion after soldering.
Further, the Sn-Sb-Cu-Ni lead-free solder provided by the invention forms tiny and uniformly distributed (Cu, ni) by adding Ni element into the Sn-Sb-Cu matrix 6 Sn 5 The strengthening phase greatly improves the shear strength of the soldered joint after soldering, especially when the mass percentage of Ni is 0.5%, the shear strength of the soldered joint reaches 66.9MPa, which is improved by 60% compared with the case of no Ni addition. Solves the problem of low shearing strength of the joint after the conventional stainless steel soft solder is soldered.
Furthermore, the self-fluxing solder provided by the invention can effectively remove the oxide film on the surface of stainless steel by adding zinc chloride and/or ammonium chloride. Solves the problem that the oxide film on the surface of stainless steel can not be removed by the traditional rosin core self-soldering tin-based soft solder.
Still further, when the conventional brazing filler metal in the prior art is used for brazing stainless steel, the brazing filler metal needs to be added with brazing flux alone, the brazing flux is difficult to accurately quantify, brazing flux waste is caused, and a subsequent cleaning process is increased. The self-soldering soft solder provided by the invention can be directly used for soldering, and no soldering flux is required to be additionally added, so that the self-soldering soft solder is more convenient to use.
Preferably, the mass ratio of the tin-based solder to the flux is 80-92 (including but not limited to a point value of any one of 81, 82, 83, 84, 85, 86, 87, 88, 89, 90, 91 or a range value between any two): 8-20 (including but not limited to point values of any one of 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19 or range values therebetween).
In order to comprehensively consider the melting point of the self-brazing solder and the strength of the welded joint after welding, the composition of the brazing flux is optimized. Preferably, the brazing flux comprises the following components in percentage by mass of 2-5: 1, wherein the mass ratio includes, but is not limited to, 2: 1. 3: 1. 4: 1. 5:1 or a range value between any two.
Preferably, the melting point of the self-fluxing solder is 230-250 ℃, including, but not limited to, any one of the point values of 231 ℃, 233 ℃, 235 ℃, 237 ℃, 238 ℃, 239 ℃, 240 ℃, 241 ℃, 242 ℃, 245 ℃, 248 ℃ or a range between any two.
The self-fluxing solder with specific composition and specific proportion provided by the invention has the melting point kept at 230-250 ℃, so that the sensitization temperature range of stainless steel is completely avoided, and the problem of intergranular corrosion after brazing is solved.
In a second aspect, the present invention provides a method for preparing the self-fluxing solder as described above, comprising the steps of:
smelting a mixed material containing Sb, cu, ni and Sn to obtain an ingot, and then preparing the ingot into powder to obtain solder powder;
the brazing filler metal powder and the brazing flux are evenly mixed and then subjected to plastic forming, so that self-brazing filler metal is obtained;
wherein the brazing flux comprises zinc chloride and/or ammonium chloride.
The invention obtains self-soldering solder which can be directly used for non-soldering without adding soldering flux by evenly mixing solder powder with soldering flux and then carrying out plastic forming, and has simple and convenient use.
In addition, the brazing flux-zinc chloride and/or ammonium chloride are dispersed and distributed and firmly wrapped in the Sn-Sb-Cu-Ni brazing filler metal powder, so that the oxide film on the surface of the stainless steel is effectively removed, and moisture absorption can be effectively avoided.
In some embodiments of the invention, the method of making a powder includes at least one of a mechanochysical method, a ball milling method, and an atomization method.
In some embodiments of the invention, after said powdering, a step of sieving is also included.
In some embodiments of the invention, the flux is dried and/or ground. Preferably, the drying temperature is 120-150 ℃. Preferably, the milling comprises ball milling.
In order to comprehensively consider the formability and the moisture absorption performance of the self-fluxing solder, the particle size of the solder powder and the brazing flux is optimized. Preferably, the particle size of the solder powder is 30-200 mesh, including but not limited to a point value of any one of 40 mesh, 50 mesh, 60 mesh, 80 mesh, 100 mesh, 120 mesh, 150 mesh, 180 mesh or a range value between any two; preferably 50 to 150 mesh.
Preferably, the granularity of the brazing flux is 100-300 meshes; including but not limited to a dot value of any one of 120 mesh, 150 mesh, 180 mesh, 200 mesh, 230 mesh, 250 mesh, 280 mesh, or a range value between any two.
Preferably, the particle size of the flux is smaller than the particle size of the solder powder. Thus being beneficial to the dispersion and distribution of the brazing flux and being firmly wrapped in the brazing filler metal powder, thereby avoiding moisture absorption.
Preferably, the method of plastic forming includes at least one of extrusion, drawing and rolling.
Preferably, the extrusion comprises cold extrusion and/or hot extrusion.
Preferably, the temperature of the hot extrusion is 100-150 ℃, including but not limited to any one of 110 ℃, 120 ℃, 130 ℃, 140 ℃ or a range of values between any two.
Preferably, the method of plastic forming comprises the steps of: and after the brazing filler metal powder and the brazing flux are uniformly mixed, cold extrusion, hot extrusion and drawing are sequentially carried out.
The Sn-Sb-Cu-Ni self-fluxing solder is prepared by adopting a powder extrusion forming method, so that the soldering flux is uniformly distributed, is not easy to leak out, and is convenient to use. Besides, the brazing flux is dispersed and distributed and firmly wrapped in the brazing filler metal, so that moisture absorption is effectively avoided.
In some embodiments of the invention, the plastic forming specifically comprises the steps of: cold extruding the mixture of brazing filler metal powder and brazing flux to obtain powder blank with diameter of 60-90 mm and height of 30-50 mm; then hot extruding the powder blank into thick filaments with the diameter of 1.8-3.6 mm; and drawing the thick wire into a fine wire-shaped self-fluxing solder (finished product) with the diameter of 1.6-3.2 mm by utilizing the waste heat of the hot extrusion.
In a third aspect, the present invention provides the use of a self-fluxing solder as described above or as prepared by a method of preparing a self-fluxing solder as described above in stainless steel brazing.
The rosin core solder in the prior art is suitable for soldering materials mainly comprising Cu and Ni, and can not remove oxide films on the surface of stainless steel. The Sn-Sb-Cu-Ni self-soldering flux with specific composition provided by the invention can effectively remove the oxide film on the surface of stainless steel. The strength of the welded joint obtained after brazing is high.
Embodiments of the present invention will be described in detail below with reference to examples, but it will be understood by those skilled in the art that the following examples are only for illustrating the present invention and should not be construed as limiting the scope of the present invention. The specific conditions are not noted in the examples and are carried out according to conventional conditions or conditions recommended by the manufacturer. The reagents or apparatus used were conventional products commercially available without the manufacturer's attention.
Example 1
The embodiment provides a self-fluxing solder, which comprises the following components in percentage by mass: 12 and a soldering flux. Wherein, the tin-based solder is mainly prepared from the following components in percentage by mass: 7% of Sb, 4% of Cu, 0.2% of Ni and the balance of Sn. The brazing flux comprises the following components in percentage by mass: 1 and ammonium chloride.
The embodiment also provides a preparation method of the self-fluxing solder, which comprises the following steps:
(1) Weighing Sb, cu, ni and Sn according to the proportion, smelting into Sn-Sb-Cu-Ni cast ingots, preparing Sn-Sb-Cu-Ni powder by adopting an atomization method, and sieving to obtain the brazing filler metal powder with the granularity of 30-50 meshes.
(2) Weighing zinc chloride and ammonium chloride, drying, and ball milling to obtain brazing flux powder with 100-120 mesh granularity. And then mixing the brazing flux powder with the brazing filler metal powder prepared in the step (1) according to the proportion, and uniformly stirring.
(3) And (3) filling the mixed powder after being uniformly stirred in the step (2) into a die for cold extrusion to obtain a composite powder blank with the diameter phi of 60mm and the height of 30 mm. The composite powder blank was hot extruded at 120℃to obtain a wire having a diameter of 1.8 mm. And then carrying out hot drawing on the wire by utilizing the waste heat of hot extrusion to obtain a self-fluxing soft solder finished product with the diameter of 1.6 mm.
Example 2
The self-fluxing solder provided by the embodiment comprises the following components in percentage by mass: 14 and a soldering flux. Wherein, the tin-based solder is mainly prepared from the following components in percentage by mass: 8% of Sb, 4% of Cu, 0.5% of Ni and the balance of Sn. The brazing flux comprises the following components in percentage by mass of 2.5:1 and ammonium chloride.
The preparation method of the self-fluxing solder provided in this example is basically the same as that in example 1, except that: in the step (1), the solder powder with the granularity of 50-100 meshes is obtained after sieving; in the step (2), ball milling is carried out to obtain brazing flux powder with the granularity of 100-150 meshes; in the step (3), the diameter of the composite powder blank is
Figure BDA0004109100740000101
The height was 35mm and the temperature of the hot extrusion was 150 ℃.
Example 3
The self-fluxing solder provided by the embodiment comprises the following components in percentage by mass: 15 and a soldering flux. Wherein, the tin-based solder is mainly prepared from the following components in percentage by mass: 8% of Sb, 5% of Cu, 1% of Ni and the balance of Sn. The brazing flux comprises the following components in percentage by mass: 1 and ammonium chloride.
The preparation method of the self-fluxing solder provided in this example is basically the same as that in example 1, except that: in the step (1), the solder powder with the granularity of 100 to 150 meshes is obtained after sieving; in the step (2), the brazing flux powder with the granularity of 120-150 meshes is obtained after ball milling; in the step (3), the diameter of the composite powder blank is
Figure BDA0004109100740000102
The height is 35mm, the hot extrusion temperature is 130 ℃, the diameter of a wire obtained after hot extrusion is 2.3mm, and the diameter of a self-fluxing solder finished product obtained after drawing is 2.0mm.
Example 4
The self-fluxing solder provided by the embodiment comprises the following components in percentage by mass: 16 and a soldering flux. Wherein, the tin-based solder is mainly prepared from the following components in percentage by mass: sb8.5%, cu 4.5%, ni 2%, and the balance Sn. The brazing flux comprises the following components in percentage by mass: 1 and ammonium chloride.
The preparation method of the self-fluxing solder provided in this example is basically the same as that in example 1, except that: in the step (1), the solder powder with the granularity of 150-200 meshes is obtained after sieving; in the step (2), the brazing flux powder with the granularity of 200-300 meshes is obtained after ball milling; in the step (3), the diameter of the composite powder blank is
Figure BDA0004109100740000103
The height is 40mm, the hot extrusion temperature is 130 ℃, the diameter of the wire obtained after hot extrusion is 2.7mm, and the diameter of the self-fluxing solder finished product obtained after drawing is 2.4mm.
Example 5
The self-fluxing solder provided by the embodiment comprises the following components in percentage by mass: 18 and a soldering flux. Wherein, the tin-based solder is mainly prepared from the following components in percentage by mass: 9% of Sb, 6% of Cu, 1.5% of Ni and the balance of Sn. The brazing flux comprises the following components in percentage by mass: 1 and ammonium chloride.
The preparation method of the self-fluxing solder provided in this example is basically the same as that in example 4, except that: in the step (3), the diameter of the composite powder blank is
Figure BDA0004109100740000112
The diameter of the wire obtained after 50mm hot extrusion is 3.6mm, and the diameter of the self-fluxing solder finished product obtained after drawing is 3.2mm.
Comparative example 1
The chemical composition of the brazing filler metal provided in this comparative example was substantially the same as in example 2, except that 0.5% by mass of Ni was replaced with 0.5% by Sn (i.e., no Ni was added).
The solder provided in this comparative example was prepared in the same manner as in example 2.
Experimental example 1
Melting points of the self-soldering solders prepared in the above examples and the solders prepared in the comparative examples were measured, respectively, and stainless steel was soldered using the self-soldering solders prepared in the above examples and the solders prepared in the comparative examples, and then the strength of soldered joints obtained after each set of soldering was measured, and the results are shown in table 1 below.
TABLE 1 melting points of the solder groups and strength of the solder joints
Figure BDA0004109100740000111
Figure BDA0004109100740000121
The DSC curves of examples 1 to 5 are shown in fig. 1. The numbers 1 to 5 in fig. 1 correspond to DSC curves of examples 1 to 5, respectively.
As can be seen from FIG. 1 and Table 1, the self-fluxing solder prepared by the invention has a melting point of 239-241 ℃, completely avoids the sensitization temperature interval of stainless steel, and avoids the problem of intergranular corrosion after brazing.
Meanwhile, the self-fluxing solder prepared by the invention has high shear strength of soldered joints after soldering, especially the shear strength of the soldered joints in the example 2 reaches 66.9MPa, which is improved by 60% compared with the solder in the comparative example 1 without Ni.
Experimental example 2
SEM-EDS analysis was performed on the self-fluxing solder prepared in example 2 and the solder prepared in comparative example 1, respectively, and the results are shown in FIGS. 2 and 3, respectively.
As can be seen from FIG. 2, the self-fluxing solder prepared in example 2 is formed as fine, uniformly distributed (Cu, ni) 6 Sn 5 And (3) strengthening phase. While comparative example 1 did not form (Cu, ni) 6 Sn 5 And (3) strengthening phase.
While the invention has been illustrated and described with reference to specific embodiments, it is to be understood that the above embodiments are merely illustrative of the technical aspects of the invention and not restrictive thereof; those of ordinary skill in the art will appreciate that: modifications may be made to the technical solutions described in the foregoing embodiments, or equivalents may be substituted for some or all of the technical features thereof, without departing from the spirit and scope of the present invention; such modifications and substitutions do not depart from the spirit of the corresponding technical solutions; it is therefore intended to cover in the appended claims all such alternatives and modifications as fall within the scope of the invention.

Claims (10)

1. The self-fluxing soft solder is characterized by mainly comprising the following components in percentage by mass of 75-94: 6-25 parts of tin-based brazing filler metal and brazing flux;
wherein, the tin-based solder is mainly prepared from the following components in percentage by mass: 7-9% of Sb, 4-6% of Cu, 0.2-2% of Ni and the balance of Sn;
the brazing flux comprises zinc chloride and/or ammonium chloride.
2. The self-fluxing solder of claim 1, wherein the mass ratio of the tin-based solder to the flux is 80-92: 8-20.
3. Self-fluxing solder according to claim 1, wherein the flux comprises a mass ratio of 2 to 5:1 and ammonium chloride.
4. A self-fluxing solder according to claim 1, wherein the self-fluxing solder has a melting point of 230-250 ℃.
5. A method of producing a self-fluxing solder according to any of claims 1 to 4, comprising the steps of:
smelting a mixed material containing Sb, cu, ni and Sn to obtain an ingot, and then preparing into powder to obtain solder powder;
the brazing filler metal powder and the brazing flux are evenly mixed and then subjected to plastic forming, so that self-brazing filler metal is obtained;
wherein the brazing flux comprises zinc chloride and/or ammonium chloride.
6. The method of producing a self-fluxing solder according to claim 5, wherein the particle size of the solder powder is 30 to 200 mesh, preferably 50 to 150 mesh.
7. The method for producing a self-fluxing solder according to claim 5, wherein the particle size of the flux is 100 to 300 mesh;
preferably, the particle size of the flux is smaller than the particle size of the solder powder.
8. The method of producing a self-fluxing solder of claim 5, wherein the method of plastic forming comprises at least one of extrusion, drawing, and rolling;
preferably, the extrusion comprises cold extrusion and/or hot extrusion;
preferably, the temperature of the hot extrusion is 100 to 150 ℃.
9. The method of producing a self-fluxing solder of claim 5, wherein the method of plastic forming comprises the steps of: and after the brazing filler metal powder and the brazing flux are uniformly mixed, cold extrusion, hot extrusion and drawing are sequentially carried out.
10. Use of the self-fluxing solder according to any one of claims 1 to 4 or the self-fluxing solder produced by the method of producing the self-fluxing solder according to any one of claims 5 to 9 in stainless steel soldering.
CN202310195574.8A 2023-02-22 2023-02-22 Self-soldering soft solder and preparation method and application thereof Pending CN116060822A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310195574.8A CN116060822A (en) 2023-02-22 2023-02-22 Self-soldering soft solder and preparation method and application thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310195574.8A CN116060822A (en) 2023-02-22 2023-02-22 Self-soldering soft solder and preparation method and application thereof

Publications (1)

Publication Number Publication Date
CN116060822A true CN116060822A (en) 2023-05-05

Family

ID=86175015

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310195574.8A Pending CN116060822A (en) 2023-02-22 2023-02-22 Self-soldering soft solder and preparation method and application thereof

Country Status (1)

Country Link
CN (1) CN116060822A (en)

Similar Documents

Publication Publication Date Title
TWI508812B (en) Solder alloy, solder paste and electronic circuit substrate
CN102922163B (en) Lead-free aluminum solder wire and preparation method thereof
EP3326745B1 (en) Solder alloy, solder paste, and electronic circuit board
CN105195915A (en) Low-temperature lead-free solder alloy
CN101348875A (en) Tin, bismuth and copper type low temperature lead-free solder alloy
EP1769881B1 (en) Process for producing high-melting metal particle-dispersed foam solder
JP2009502512A (en) A kind of low melting point lead-free solder alloy
CN103769760B (en) A kind of low melting point compound self-fluxing almit and preparation method thereof
JP5962461B2 (en) Au-Ge-Sn solder alloy
CN101130220A (en) Solder without cadmium and silver
CN101269444A (en) Stannum-silver-copper three-part alloy leadless solder paste
CN101716705B (en) Multi-alloy cadmium-free phosphor-free copper-based solder
CN107030412B (en) environment-friendly corrosion-free self-brazing ring for aluminum alloy brazing and preparation method thereof
CN112621015B (en) Flux-cored aluminum brazing filler metal and preparation method thereof
TW201127541A (en) Manufacturing method for lead-free solder material mixed with metal micro-particles
CN104002058B (en) A kind of Sn Zn Ag Ni alloy lead-free solders and preparation method thereof
CN102642097A (en) Low-silver lead-free solder alloy
JPH03173729A (en) Copper alloy for use as brazing metal filler
CN116060822A (en) Self-soldering soft solder and preparation method and application thereof
CN101392337B (en) Low melting point lead-free solder alloy
CN101264557A (en) Tin-copper base lead-free solder and preparation thereof
JP2003245793A (en) Soldering composition, soldering method, and electronic component
JP2019136774A (en) Solder alloy composition, solder, and production method thereof
CN101214586B (en) Tin-zinc base lead-free solder and preparation thereof
CN108296668A (en) A kind of leadless welding alloy and preparation method thereof

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination