CN116051552B - Mould supervision method and system - Google Patents
Mould supervision method and system Download PDFInfo
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- CN116051552B CN116051552B CN202310320322.3A CN202310320322A CN116051552B CN 116051552 B CN116051552 B CN 116051552B CN 202310320322 A CN202310320322 A CN 202310320322A CN 116051552 B CN116051552 B CN 116051552B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/001—Industrial image inspection using an image reference approach
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- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/10—Segmentation; Edge detection
- G06T7/13—Edge detection
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- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/60—Analysis of geometric attributes
- G06T7/62—Analysis of geometric attributes of area, perimeter, diameter or volume
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/10—Image acquisition modality
- G06T2207/10004—Still image; Photographic image
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30164—Workpiece; Machine component
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- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
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Abstract
The invention discloses a method and a system for supervising a die, which relate to the technical field of die supervision and solve the technical problems that an abnormal area inside an abnormal die is not analyzed, whether the die can be trimmed or not is judged, an abnormal point processing unit processes an abnormal image, a central point corresponding to the abnormal image is determined, a farthest edge point is searched according to the central point, the edge point is taken as a circle center, a corresponding radiation circle is established, the state of the corresponding abnormal die is judged according to the area parameter of the radiation circle, a corresponding state signal is generated through a signal generating unit and is transmitted to an external display terminal, and in this way, the whole area parameter corresponding to the abnormal area can be quickly obtained, whether the normal use of the die is influenced or not is analyzed, the quick decision is made, and the accuracy of numerical value judgment is improved.
Description
Technical Field
The invention belongs to the technical field of mold supervision, and particularly relates to a mold supervision method and a mold supervision system.
Background
Moulds, which are used in industrial production for injection moulding, blow moulding, extrusion, die casting or forging, smelting, stamping etc. to obtain the desired products, are, in short, tools for making shaped articles, which tools consist of various parts and different moulds consist of different parts.
The application with the patent publication number of CN114897034B discloses a stamping die supervision method, a device, equipment and a storage medium, which belong to the technical field of die monitoring, and the stamping die supervision method comprises the following steps of; monitoring vibration generated in the working process of the stamping die, and determining the damage condition of the stamping die according to a monitoring result; if the stamping die is damaged, carrying out three-dimensional scanning on the stamping die, and establishing an actual three-dimensional model of the stamping die; comparing and differencing the actual three-dimensional model of the stamping die with the standard three-dimensional model of the stamping die to obtain a damaged area three-dimensional model corresponding to the damaged area of the stamping die; based on the damage area three-dimensional model, repair the damage area of stamping die, the application has solved the technical problem that current means of judging whether stamping die is damaged can't discover the mould damage in advance.
In a specific supervision process of the mold, the mold is abnormal because of possible abnormality in the mold, but during supervision, the corresponding mold abnormality is generally judged according to corresponding mold stripping and manual detection, but the following defects still exist and need to be improved:
1. the abnormal area inside the abnormal die is not analyzed, and whether the die can be trimmed or not is judged;
2. the internal normal die is not monitored, and whether the internal working original is abnormal or not is analyzed.
Disclosure of Invention
The present invention aims to solve at least one of the technical problems existing in the prior art; therefore, the invention provides a mould supervision method and a mould supervision system, which are used for solving the technical problem that an abnormal area in an abnormal mould is not analyzed and whether the mould can be trimmed or not is judged.
To achieve the above object, an embodiment according to a first aspect of the present invention provides a mold supervision system, including a mold body image acquisition end, a supervision center, and a display terminal;
the monitoring center comprises an image marking unit, an analysis and comparison unit, a storage unit, a real-time monitoring unit, an abnormal point processing unit, a pressure ratio analysis unit, a trend analysis unit and a signal generation unit;
the die body image acquisition end is used for acquiring an internal die image of the abnormal die and transmitting the acquired internal die image into the supervision center;
the image marking unit is used for receiving the acquired internal mold images and marking the received internal mold images, wherein different internal mold images are marked by adopting the numbers of the corresponding molds, and the marked internal mold images are transmitted into the analysis and comparison unit;
the analysis and comparison unit is used for receiving the marked internal mold image, selecting a reference image of a corresponding mold from the storage unit according to the marked corresponding mold number, comparing the internal mold image with the reference image, executing subsequent different working units according to different comparison analysis results, and comparing the internal mold image with the reference image, wherein the specific mode is as follows:
determining the received internal mold image, and selecting a reference image of a corresponding mold from the storage unit;
according to the reference image, adjusting the internal mold image to enable the internal mold image to be at the same comparison angle with the reference image, and performing coincidence analysis on the internal mold image and the reference image to obtain corresponding coincidence parameters;
analyzing whether the coincidence degree parameter is more than 98%, if the coincidence degree parameter meets the condition, executing a real-time monitoring unit, if the coincidence degree parameter does not meet the condition, executing an abnormal point processing unit, extracting an abnormal region existing in the internal model image comparison process, and transmitting the extracted abnormal region into the abnormal point processing unit;
the abnormal point processing unit is used for receiving the extracted abnormal region, acquiring an abnormal image of the abnormal region, processing the abnormal image, determining a center point of the corresponding abnormal image, searching the edge point with the farthest distance according to the center point, taking the edge point as the center of a circle, establishing a corresponding radiation circle, judging the state of the corresponding abnormal mold according to the area parameter of the radiation circle, generating a corresponding state signal through the signal generating unit, transmitting the state signal into an external display terminal, and processing the abnormal image, wherein the specific mode of processing the abnormal image is as follows:
acquiring an abnormal image, determining a central point of the abnormal image, sequentially determining edge points of the abnormal image, acquiring distance parameters between the central point and a plurality of edge points, and marking the distance parameters as JLi, wherein i represents different edge points, extracting the maximum value from a plurality of groups of distance parameters JLi, and calibrating the corresponding edge points as circle centers;
the marked circle center is used as an endpoint, the abnormal image is rotated at high speed to obtain a group of radiation circles, the area parameters of the radiation circles are directly obtained, and the area parameters are marked as MJ;
extracting a preset parameter Y1 from the storage unit, wherein Y1 is a preset value, the specific value of the preset parameter is determined by an operator according to experience, when MJ is less than or equal to Y1, the corresponding abnormal image is in a trimmable state, and when MJ is more than Y1, the corresponding abnormal image is in a non-trimmable state;
the signal generating unit generates a trimmable signal according to the trimmable state, transmits the trimmable signal to the display terminal for display, generates an untrimmable signal according to the untrimmable state, and transmits the untrimmable signal to the display terminal for display, so that an external operator can check the untrimmed signal to know the state of the corresponding abnormal die.
Preferably, the real-time monitoring unit monitors the thimble pressure and the roller pressure of the abnormal die in real time in the die stripping process, and transmits the thimble pressure parameter and the roller pressure parameter which are monitored in real time to the pressure ratio analysis unit.
Preferably, the pressure ratio analysis unit performs ratio analysis on the thimble pressure parameter and the roller pressure parameter generated in the single group mold stripping process according to different time units, and the ratio analysis is performed by the thimble pressure parameter/the roller pressure parameter=yb t Obtaining the pressure ratio parameter YB t Wherein t represents different time units, the time interval between each group of time units is 1s, and the pressure ratio parameters YB of a plurality of groups of different time units obtained by processing t Transmitted to a trend analysis unit.
Preferably, the trend analysis unit compares the pressure ratio parameters YB for different time units t Receiving, building a line graph according to different and corresponding time units of the pressure ratio parameters, acquiring a plurality of groups of trend values from the line graph, confirming trend intervals according to the plurality of groups of trend values, comparing the trend intervals with preset intervals in a storage unit, generating different signals through a signal generating unit according to comparison results, and transmitting the signals to an external display terminal; the specific mode for obtaining the trend values is as follows:
establishing a transverse coordinate axis by different time units, establishing a vertical coordinate axis by pressure ratio parameters, and establishing a coordinate system and pressure ratio parameters YB of different time units t Confirming the position of the corresponding pressure ratio parameter from the coordinate system, and establishing a corresponding line graph;
according to the established line graph, the trend parameters between two adjacent points are acquired in the following manner:
obtaining trend parameters QS between a plurality of groups of connected two points, extracting maximum values and minimum values from the plurality of groups of trend parameters QS, and establishingTrend interval, expressed as: [ QS ] min ，QS max ]；
Extracting preset intervals (X1, X2) from the memory unit, and dividing trend interval [ QS ] min ，QS max ]Comparing with preset interval (X1, X2), when trend interval is epsilon preset interval, the signal generating unit generates normal signal, and transmits the normal signal to display terminal, when trend interval is epsilon preset interval
And when the interval is preset, the signal generating unit generates a working abnormal signal and transmits the working abnormal signal to the display terminal for display.
Further, the method for supervising the mold supervision system comprises the following steps:
firstly, acquiring an internal mold image of an abnormal mold in advance, selecting a reference image of the corresponding mold according to the corresponding mold number, comparing the internal mold image with the reference image, and executing different working units according to the comparison result;
step two, acquiring an abnormal image of the abnormal region, determining a center point of the corresponding abnormal image, searching a farthest edge point according to the center point, establishing a corresponding radiation circle by taking the edge point as a circle center, judging the state of the corresponding abnormal mold according to the area parameter of the radiation circle, and generating a corresponding state signal through a signal generating unit;
step three, the thimble pressure and the roller pressure of the abnormal die in the die stripping process are monitored in real time, the ratio analysis is carried out on thimble pressure parameters and roller pressure parameters generated in the single-group die stripping process according to different time units, and the ratio analysis is carried out by the thimble pressure parameters/the roller pressure parameters=YB t Obtaining a pressure ratio parameter;
step four, the pressure ratio parameter YB of different time units t Receiving, building a line graph according to different and corresponding time units of the pressure ratio parameters, acquiring a plurality of groups of trend values from the line graph, confirming trend intervals according to the plurality of groups of trend values, comparing with preset intervals in the storage unit, and obtaining a rootAnd generating a normal signal or a working abnormal signal according to the comparison result.
Compared with the prior art, the invention has the beneficial effects that: comparing the internal model image with a reference image, and executing different working units according to the comparison result;
the abnormal point processing unit is used for processing the abnormal image, determining a center point of the corresponding abnormal image, searching the edge point with the farthest distance according to the center point, establishing a corresponding radiation circle by taking the edge point as the center of a circle, judging the state of the corresponding abnormal mold according to the area parameter of the radiation circle, generating a corresponding state signal through the signal generating unit, and transmitting the corresponding state signal into an external display terminal;
the method comprises the steps of monitoring thimble pressure and roller pressure in real time, confirming pressure ratio parameters according to ratio parameters, judging whether corresponding working components are abnormal according to trend values among the pressure ratio parameters, transmitting abnormal signals into an external terminal, and adopting the supervision mode to rapidly confirm abnormal dies and timely give corresponding signals so as to enable external operators to timely make countermeasures and simultaneously improve the judging accuracy of the abnormal dies and the judging efficiency of the abnormal dies.
Drawings
FIG. 1 is a schematic diagram of a principal frame of the present invention;
FIG. 2 is a schematic view of the processing of an outlier image according to the present invention.
Detailed Description
The technical solutions of the present invention will be clearly and completely described in connection with the embodiments, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1, the present application provides a mold supervision system, which includes a mold body image acquisition end, a supervision center and a display terminal, wherein the mold body image acquisition end is electrically connected with an input end of the supervision center, and the supervision center is electrically connected with an input end of the display terminal;
the monitoring center comprises an image marking unit, an analysis and comparison unit, a storage unit, a real-time monitoring unit, an abnormal point processing unit, a pressure ratio analysis unit, a trend analysis unit and a signal generation unit;
the image marking unit is electrically connected with the input end of the analysis comparison unit, the analysis comparison unit is in bidirectional connection with the storage unit, the analysis comparison unit is respectively electrically connected with the input ends of the real-time monitoring unit and the abnormal point processing unit, the real-time monitoring unit is electrically connected with the input end of the pressure ratio analysis unit, the pressure ratio analysis unit is electrically connected with the input end of the trend analysis unit, the trend analysis unit is electrically connected with the input end of the signal generating unit, the abnormal point processing unit is in bidirectional connection with the storage unit, the abnormal point processing unit is electrically connected with the input end of the signal generating unit, and the storage unit is electrically connected with the input end of the trend analysis unit;
the die body image acquisition end is used for acquiring an internal die image of the abnormal die and transmitting the acquired internal die image into the supervision center, wherein the abnormal die is confirmed by an external operator, the die produced by the corresponding die is confirmed, the generated die is a non-standard die, and the corresponding die is marked as the abnormal die;
the internal image marking unit of the supervision center receives the acquired internal image and marks the received internal image, wherein different internal images are marked by adopting the numbers of the corresponding molds, and the marked internal image is transmitted into the analysis and comparison unit;
the analysis and comparison unit is used for receiving the marked internal mold image, selecting a reference image of a corresponding mold from the storage unit according to the marked corresponding mold number, comparing the internal mold image with the reference image, and executing subsequent different working units according to different comparison analysis results, wherein the specific mode of comparison is as follows:
determining the received internal mold image, and selecting a reference image of a corresponding mold from the storage unit;
according to the reference image, adjusting the internal mold image to enable the internal mold image to be at the same comparison angle with the reference image, and performing coincidence analysis on the internal mold image and the reference image to obtain corresponding coincidence parameters;
analyzing whether the coincidence degree parameter is more than 98%, if the coincidence degree parameter meets the condition, executing the real-time monitoring unit, if the coincidence degree parameter does not meet the condition, executing the abnormal point processing unit, extracting an abnormal region existing in the internal model image comparison process, and transmitting the extracted abnormal region into the abnormal point processing unit.
In combination with actual application scene analysis, after the obtained internal model image is cleaned, the coincidence ratio parameter between the corresponding internal model image and the reference image is generally a percentage;
if not a percentage, there may be some deviation, but the deviation will not generally exceed 2%, so 98% is directly chosen here.
The abnormal point processing unit is used for receiving the extracted abnormal region, acquiring an abnormal image of the abnormal region, processing the abnormal image, determining a center point of the corresponding abnormal image, searching the edge point with the farthest distance according to the center point, establishing a corresponding radiation circle by taking the edge point as a circle center, judging the state of the corresponding abnormal mold according to the area parameter of the radiation circle, generating a corresponding state signal through the signal generating unit, and transmitting the state signal to an external display terminal, wherein the specific mode for processing the abnormal image is as follows:
referring to fig. 2, an abnormal image is obtained, a center point of the abnormal image is determined (which may be determined by determining a center point by combining a scale with a reference line in PS), edge points of the abnormal image are sequentially determined, distance parameters between the center point and a plurality of edge points are obtained, and are marked as JLi, wherein i represents different edge points, a maximum value is extracted from a plurality of groups of distance parameters JLi, and the corresponding edge points are marked as circle centers;
the marked circle center is used as an endpoint, the abnormal image is rotated at high speed to obtain a group of radiation circles, the area parameters of the radiation circles are directly obtained, and the area parameters are marked as MJ;
extracting a preset parameter Y1 from the storage unit, wherein Y1 is a preset value, the specific value of the preset parameter is determined by an operator according to experience, when MJ is less than or equal to Y1, the corresponding abnormal image is in a trimmable state, and when MJ is more than Y1, the corresponding abnormal image is in a non-trimmable state;
in combination with the analysis of the practical application scene, Y1 generally takes the value of 0.5 pi cm 2 When the obtained radiation circle area exceeds the numerical value, the coverage area of the corresponding abnormal image is overlarge, and when the area is overlarge, the corresponding abnormal area cannot be adjusted.
The signal generating unit generates a trimmable signal according to the trimmable state, transmits the trimmable signal to the display terminal for display, generates an untrimmable signal according to the untrimmable state, and transmits the untrimmable signal to the display terminal for display, so that an external operator can check the untrimmed signal to know the state of the corresponding abnormal die.
The real-time monitoring unit is used for monitoring the thimble pressure and the roller pressure of the abnormal die in the die stripping process in real time and transmitting the thimble pressure parameter and the roller pressure parameter which are monitored in real time into the pressure ratio analysis unit;
the pressure ratio analysis unit is used for carrying out ratio analysis on thimble pressure parameters and roller pressure parameters generated in the single group demolding process according to different time units, and the thimble pressure parameters/the roller pressure parameters=YB are adopted t Obtaining the pressure ratio parameter YB t Wherein t represents different time units, the time interval between each group of time units is 1s, and t=1, 2, … …, n, the pressure ratio parameters YB of a plurality of groups of different time units to be processed are obtained t Transmitting the data to a trend analysis unit;
the trend analysis unit is used for analyzing different time slicesBit pressure ratio parameter YB t Receiving, building a line graph according to different and corresponding time units of the pressure ratio parameters, acquiring a plurality of groups of trend values from the line graph, confirming trend intervals according to the plurality of groups of trend values, comparing the trend intervals with preset intervals in a storage unit, generating different signals according to comparison results through a signal generating unit, and transmitting the signals to an external display terminal, wherein the specific mode for acquiring the plurality of groups of trend values is as follows:
establishing a transverse coordinate axis by different time units, establishing a vertical coordinate axis by pressure ratio parameters, and establishing a coordinate system and pressure ratio parameters YB of different time units t Confirming the position of the corresponding pressure ratio parameter from the coordinate system, and establishing a corresponding line graph;
according to the established line graph, the trend parameters between two adjacent points are acquired in the following manner:
obtaining trend parameters QS between a plurality of groups of connected two points, extracting maximum values and minimum values from the plurality of groups of trend parameters QS, and establishing a trend interval, wherein the trend interval is expressed as follows: [ QS ] min ，QS max ]；
Extracting preset intervals (X1, X2) from the memory unit, and dividing trend interval [ QS ] min ，QS max ]Comparing with preset interval (X1, X2), when trend interval is epsilon preset interval, the signal generating unit generates normal signal, and transmits the normal signal to display terminal, when trend interval is epsilon preset interval
When the interval is preset, the signal generating unit generates a working abnormal signal and transmits the working abnormal signal to the display terminal for display, so that an external person can check the working abnormal signal.
In combination with the analysis of the actual application scene, generally before the mold is completely removed, the pressure of the roller is generally zero, and the corresponding thimble pressure parameter value is the largest, if a certain component is abnormal, the corresponding trend parameter is abnormal, so that the abnormality between the corresponding components is displayed, the intervention of operators is needed, and the abnormal components are maintained.
The mould supervision method comprises the following steps:
firstly, acquiring an internal mold image of an abnormal mold in advance, transmitting the acquired internal mold image into a supervision center, selecting a reference image of a corresponding mold from a storage unit according to a marked corresponding mold number, comparing the internal mold image with the reference image, and executing different working units according to a comparison result;
step two, obtaining an abnormal image of the abnormal region, processing the abnormal image, determining a center point corresponding to the abnormal image, searching a farthest edge point according to the center point, establishing a corresponding radiation circle by taking the edge point as a circle center, judging the state of a corresponding abnormal mold according to the area parameter of the radiation circle, generating a corresponding state signal through a signal generating unit, and transmitting the state signal to an external display terminal;
step three, the thimble pressure and the roller pressure of the abnormal die in the die stripping process are monitored in real time, the ratio analysis is carried out on thimble pressure parameters and roller pressure parameters generated in the single-group die stripping process according to different time units, and the ratio analysis is carried out by the thimble pressure parameters/the roller pressure parameters=YB t Obtaining a pressure ratio parameter;
step four, the pressure ratio parameter YB of different time units t And receiving, building a line graph according to different and corresponding time units of the pressure ratio parameters, acquiring a plurality of groups of trend values from the line graph, confirming trend intervals according to the plurality of groups of trend values, comparing the trend intervals with preset intervals in the storage unit, and generating a normal signal or an abnormal working signal according to the comparison result.
The partial data in the formula are all obtained by removing dimension and taking the numerical value for calculation, and the formula is a formula closest to the real situation obtained by simulating a large amount of collected data through software; the preset parameters and the preset threshold values in the formula are set by those skilled in the art according to actual conditions or are obtained through mass data simulation.
The above embodiments are only for illustrating the technical method of the present invention and not for limiting the same, and it should be understood by those skilled in the art that the technical method of the present invention may be modified or substituted without departing from the spirit and scope of the technical method of the present invention.
Claims (6)
1. The mold supervision system is characterized by comprising a mold body image acquisition end, a supervision center and a display terminal;
the monitoring center comprises an image marking unit, an analysis and comparison unit, a storage unit, a real-time monitoring unit, an abnormal point processing unit, a pressure ratio analysis unit, a trend analysis unit and a signal generation unit;
the die body image acquisition end is used for acquiring an internal die image of the abnormal die and transmitting the acquired internal die image into the supervision center;
the image marking unit is used for receiving the acquired internal mold images and marking the received internal mold images, wherein different internal mold images are marked by adopting the numbers of the corresponding molds, and the marked internal mold images are transmitted into the analysis and comparison unit;
the analysis comparison unit is used for receiving the marked internal mold image, selecting a reference image of a corresponding mold from the storage unit according to the marked corresponding mold number, comparing the internal mold image with the reference image, and executing different subsequent working units according to different comparison analysis results;
the abnormal point processing unit is used for receiving the extracted abnormal region, acquiring an abnormal image of the abnormal region, processing the abnormal image, determining a center point of the corresponding abnormal image, searching the edge point with the farthest distance according to the center point, establishing a corresponding radiation circle by taking the edge point as the center of a circle, judging the state of the corresponding abnormal mold according to the area parameter of the radiation circle, generating a corresponding state signal through the signal generating unit, and transmitting the state signal to the external display terminal;
the analysis and comparison unit compares the internal model image with the reference image in the following specific modes:
determining the received internal mold image, and selecting a reference image of a corresponding mold from the storage unit;
according to the reference image, adjusting the internal mold image to enable the internal mold image to be at the same comparison angle with the reference image, and performing coincidence analysis on the internal mold image and the reference image to obtain corresponding coincidence parameters;
analyzing whether the coincidence degree parameter is more than 98%, if the coincidence degree parameter meets the condition, executing a real-time monitoring unit, if the coincidence degree parameter does not meet the condition, executing an abnormal point processing unit, extracting an abnormal region existing in the internal model image comparison process, and transmitting the extracted abnormal region into the abnormal point processing unit;
the abnormal point processing unit processes the abnormal image in the following specific modes:
acquiring an abnormal image, determining a central point of the abnormal image, sequentially determining edge points of the abnormal image, acquiring distance parameters between the central point and a plurality of edge points, and marking the distance parameters as JLi, wherein i represents different edge points, extracting the maximum value from a plurality of groups of distance parameters JLi, and calibrating the corresponding edge points as circle centers;
the marked circle center is used as an endpoint, the abnormal image is rotated at high speed to obtain a group of radiation circles, the area parameters of the radiation circles are directly obtained, and the area parameters are marked as MJ;
extracting a preset parameter Y1 from the storage unit, wherein Y1 is a preset value, the specific value of the preset parameter is determined by an operator according to experience, when MJ is less than or equal to Y1, the corresponding abnormal image is in a trimmable state, and when MJ is more than Y1, the corresponding abnormal image is in a non-trimmable state;
the signal generating unit generates a trimmable signal according to the trimmable state, transmits the trimmable signal to the display terminal for display, generates an untrimmable signal according to the untrimmable state, and transmits the untrimmable signal to the display terminal for display, so that an external operator can check the untrimmed signal to know the state of the corresponding abnormal die.
2. The mold supervision system according to claim 1, wherein the real-time monitoring unit monitors the ejector pin pressure and the roller pressure of the abnormal mold in the mold stripping process in real time, and transmits the ejector pin pressure parameter and the roller pressure parameter which are monitored in real time to the pressure ratio analysis unit.
3. The mold supervision system according to claim 2, wherein the pressure ratio analysis unit performs ratio analysis on the ejector pin pressure parameter and the roller pressure parameter generated in the single set of mold stripping process according to different time units, by the ejector pin pressure parameter/roller pressure parameter=yb t Obtaining the pressure ratio parameter YB t Wherein t represents different time units, the time interval between each group of time units is 1s, and the pressure ratio parameters YB of a plurality of groups of different time units obtained by processing t Transmitted to a trend analysis unit.
4. A mould supervision system according to claim 3, wherein the trend analysis unit is adapted to compare parameters YB for different time units t And receiving, building a line graph according to different and corresponding time units of the pressure ratio parameters, acquiring a plurality of groups of trend values from the line graph, confirming trend intervals according to the plurality of groups of trend values, comparing the trend intervals with preset intervals in the storage unit, generating different signals through the signal generating unit according to the comparison result, and transmitting the signals to the external display terminal.
5. The mold supervision system according to claim 4, wherein the trend analysis unit obtains the plurality of sets of trend values in the following specific manner:
establishing a transverse coordinate axis by different time units, establishing a vertical coordinate axis by pressure ratio parameters, and establishing a coordinate system and pressure ratio parameters YB of different time units t Confirming the position of the corresponding pressure ratio parameter from the coordinate system, and establishing a corresponding line graph;
according to the created line graph, for two adjacent pointsThe trend parameters are acquired in the following way:
obtaining trend parameters QS between a plurality of groups of connected two points, extracting maximum values and minimum values from the plurality of groups of trend parameters QS, and establishing a trend interval, wherein the trend interval is expressed as follows: [ QS ] min ，QS max ]；
Extracting preset intervals (X1, X2) from the memory unit, and dividing trend interval [ QS ] min ，QS max ]Comparing with preset interval (X1, X2), when trend interval is epsilon preset interval, the signal generating unit generates normal signal, and transmits the normal signal to display terminal, when trend interval is epsilon preset interval
And when the interval is preset, the signal generating unit generates a working abnormal signal and transmits the working abnormal signal to the display terminal for display.
6. A method of supervising a mold supervision system according to any one of claims 1 to 5, comprising the steps of:
firstly, acquiring an internal mold image of an abnormal mold in advance, selecting a reference image of the corresponding mold according to the corresponding mold number, comparing the internal mold image with the reference image, and executing different working units according to the comparison result;
step two, acquiring an abnormal image of the abnormal region, determining a center point of the corresponding abnormal image, searching a farthest edge point according to the center point, establishing a corresponding radiation circle by taking the edge point as a circle center, judging the state of the corresponding abnormal mold according to the area parameter of the radiation circle, and generating a corresponding state signal through a signal generating unit;
thirdly, monitoring the thimble pressure and the roller pressure of the abnormal die in the die stripping process in real time, and carrying out ratio analysis on thimble pressure parameters and roller pressure parameters generated in the single-group die stripping process according to different time units, wherein the thimble pressure parameters/the roller pressure parameters = pressure ratio parameters;
and step four, receiving the pressure ratio parameters of different time units, building a line graph according to the different pressure ratio parameters and the corresponding time units, acquiring a plurality of groups of trend values from the line graph, confirming trend intervals according to the plurality of groups of trend values, comparing the trend intervals with preset intervals in the storage unit, and generating normal signals or abnormal working signals according to comparison results.
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