CN116038164A

CN116038164A - Marking carrier mechanism applicable to integrated circuit substrate plastic package body

Info

Publication number: CN116038164A
Application number: CN202310254287.XA
Authority: CN
Inventors: 赵文强; 梁库; 孙少隆; 郭满鹏
Original assignee: Huatian Technology Baoji Co ltd
Current assignee: Huatian Technology Baoji Co ltd
Priority date: 2023-03-16
Filing date: 2023-03-16
Publication date: 2023-05-02

Abstract

The invention provides a marking carrier mechanism suitable for an integrated circuit substrate plastic package body, which comprises a base, wherein a material carrying component is arranged on the base, a material pressing component A and a material pressing component B are arranged on the bases on two sides of the material carrying component, the material pressing component A and the material pressing component B are used for fixing products on the material carrying component, a jacking component used for driving the material pressing component A and the material pressing component B to work is arranged on one side of the base, and the marking carrier mechanism is used for fixing a substrate material sheet and simultaneously pressing and fixing the edge of the substrate material sheet.

Description

Marking carrier mechanism applicable to integrated circuit substrate plastic package body

Technical Field

The invention relates to the technical field of integrated circuit packaging, in particular to a marking carrier mechanism applicable to an integrated circuit substrate plastic package body.

Background

At present, the existing domestic integrated circuit laser marking machine adopts a transmission track to carry out positioning printing on base plate sheet products. The marking machine adopts a positioning marking mode of a transmission rail, and has the defects that for a substrate material sheet product with high hardness and warp deformation or a small plastic package body, the rail marking machine easily generates product position deviation, so that the printing precision is unstable, and the quality of the marked product is reduced.

Disclosure of Invention

The invention aims to provide a marking carrier mechanism applicable to an integrated circuit substrate plastic package body, which overcomes the defects in the prior art.

In order to solve the technical problems, the technical scheme of the invention is as follows: the utility model provides a mark carrier mechanism is beaten to suitable integrated circuit substrate plastic envelope body, includes the base, be provided with on the base and carry the material subassembly, be provided with on the base of carrying the both sides of material subassembly and press material subassembly A and press material subassembly B, press material subassembly A and press material subassembly B to be used for fixed carrying the product on the material subassembly, base one side is provided with the jacking subassembly that is used for driving press material subassembly A and press material subassembly B work.

As an improvement of a marking carrier mechanism applicable to an integrated circuit substrate plastic package body, the material pressing assembly A comprises a turnover shaft rotationally connected with a base, material pressing blocks arranged on the turnover shaft at intervals, a turnover seat arranged on the shaft end of the turnover shaft and a cam bearing follower arranged on the turnover seat.

As an improvement of the marking carrier mechanism applicable to the integrated circuit substrate plastic package body, the pressing block and the base are both provided with mounting holes, a spring is arranged in the mounting hole of the base, and one end of the spring is embedded into the mounting hole of the pressing block.

As an improvement of the marking carrier mechanism applicable to the integrated circuit substrate plastic package body, an oilless bushing is arranged on a turnover shaft between a base and a turnover seat.

As an improvement of the marking carrier mechanism applicable to the integrated circuit substrate plastic package body, a limiting piece is arranged on a turnover shaft between the material pressing block and the base.

As an improvement of a marking carrier mechanism applicable to an integrated circuit substrate plastic package body, the structure of the material pressing component A is consistent with that of the material pressing component B.

As an improvement of a marking carrier mechanism applicable to an integrated circuit substrate plastic package body, the jacking assembly comprises a fixed seat, a jacking cylinder and a top plate, wherein a shell of the jacking cylinder is fixed on the fixed seat, and the top plate is fixedly connected with a cylinder rod of the jacking cylinder and is positioned below a cam bearing follower.

As an improvement of a marking carrier mechanism applicable to an integrated circuit substrate plastic package body, the material carrying assembly comprises a material carrying plate provided with a plurality of adsorption holes and a plurality of suckers, and the suckers are arranged in the adsorption holes of the material carrying plate.

As an improvement of the marking carrier mechanism applicable to the integrated circuit substrate plastic package body, the carrier plate is provided with a limiting plate.

Compared with the prior art, the invention has the beneficial effects that: this mark carrier mechanism is fixed the base plate material piece edge and is pushed down the fixed while, has solved that hardness is big and have warp deformation or the base plate material piece product of little plastic envelope body can't be fixed effectively, leads to the track type mark machine to appear the product position skew easily, leads to the printing precision unstable, causes to beat mark product output decline problem.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments described in the present invention, and other drawings may be obtained according to the drawings without inventive effort to those skilled in the art.

FIG. 1 is a schematic diagram of the structure of the present invention;

FIG. 2 is a schematic diagram of a press assembly according to the present invention;

FIG. 3 is a schematic view of a loading assembly according to the present invention;

fig. 4 is a schematic structural diagram of a jacking assembly according to the present invention.

1, a base; 2. a loading assembly; 21. a carrying plate; 22. adsorption holes; 23. a suction cup; 3. a pressing component A; 31. a turnover shaft; 32. pressing a material block; 33. turning over the seat; 34. cam bearing follower; 4. a pressing component B; 5. a jacking assembly; 51. a fixing seat; 52. jacking the air cylinder; 53. a top plate; 6. a mounting hole; 7. a spring; 8. an oilless bushing; 9. a limiting piece; 10. and a limiting plate.

Detailed Description

The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

As shown in fig. 1 to 4, a marking carrier mechanism suitable for an integrated circuit substrate plastic package body comprises a base 1, a material loading component 2 is arranged on the base 1, a material pressing component A3 and a material pressing component B4 are arranged on the base 1 at two sides of the material loading component 2, the material pressing component A3 and the material pressing component B4 are used for fixing products on the material loading component 2, and a jacking component 5 used for driving the material pressing component A3 and the material pressing component B4 to work is arranged at one side of the base 1.

In the initial state, the material pressing assembly A3 and the material pressing assembly B4 are in a closed state, then the jacking assembly 5 works, the material pressing assembly A3 and the material pressing assembly B4 are in an open state under the driving of the jacking assembly 5, the base plate material sheet is placed on the material carrying assembly 2 through the feeding mechanism, the jacking assembly 5 is reset, and the material pressing assembly A3 and the material pressing assembly B4 are gradually closed to fix the edge of the base plate material sheet to be warped. The problem of hardness is big and have warp deformation or little plastic envelope body's base plate tablet product can't be fixed effectively, leads to the track type marking machine to appear the product position skew easily, leads to the printing precision unstable, leads to marking product output decline is solved.

The material pressing assembly A3 comprises a turnover shaft 31 which is rotationally connected with the base 1, material pressing blocks 32 which are arranged on the turnover shaft 31 at intervals, a turnover seat 33 which is arranged on the shaft end of the turnover shaft 31, and a cam bearing follower 34 which is arranged on the turnover seat 33.

The jacking component 5 jacks up the cam bearing follower 34, the cam bearing follower 34 drives the turning seat 33 and the turning shaft 31, the turning shaft 31 rotates around the base 1, the turning shaft 31 drives the pressing block 32 on the turning shaft 31 to turn over, the pressing block 32 is separated from the surface of the carrying component 2, after the substrate material sheet is placed on the carrying component 2, the jacking component 5 is reset, the cam bearing follower drives the turning seat 33 and the turning shaft 31 to reset, and the pressing block 32 contacts with the edge of the substrate material sheet and fixes the substrate material sheet.

The pressing block 32 and the base 1 are both provided with mounting holes 6, a spring 7 is arranged in the mounting hole 6 of the base 1, and one end of the spring 7 is embedded into the mounting hole 6 of the pressing block 32.

After the jacking component 5 resets, in order to enable the pressing block 32 to reset faster and fix the substrate material sheet more tightly, a spring 7 is arranged between the pressing block 32 and the base 1, the spring 7 is a pressure spring, the spring 7 is in an extending state in an initial state, the spring 7 is in a retracting trend to drive the pressing block 31 to be attached to the substrate material sheet, when the jacking component 5 resets, the spring 7 drives the pressing block 32, the pressing block 32 drives the turnover shaft 31 to rotate around the base 1, and the pressing block 32 is in contact with the substrate material sheet more quickly and fixes the substrate material sheet more tightly under the action of the spring 7.

An oilless bushing 8 is arranged on the tilting shaft 31 between the base 1 and the tilting seat 33.

Because the turnover shaft 31 is rotationally connected with the base 1, the turnover shaft 31 is easy to axially float with the base 1, so that in order to avoid axial float, the turnover shaft 31 between the base 1 and the turnover seat 33 is provided with the oil-free bushing 8, and meanwhile, the oil-free bushing 8 can also avoid hard friction between the turnover seat 33 and the base 1, so that the service life of the mechanism is prolonged.

A limiting piece 9 is arranged on the turnover shaft 31 between the pressing block 32 and the base 1.

Because the turnover shaft 31 is rotationally connected with the base 1, the turnover shaft 31 is easy to axially float with the base 1, so that in order to avoid the axial float, the turnover shaft 31 between the base 1 and the pressing block 32 is provided with the limiting piece 9, the limiting piece 9 can also avoid hard friction between the turnover seat 33 and the base 1, and the service life of the mechanism is prolonged

The structure of the material pressing component A3 is identical with that of the material pressing component B4. Since the pressing components A3 and B4 are disposed on the base 1 in the left-right direction, it is necessary to keep the structures of the pressing components A3 and B4 identical.

As shown in fig. 4, the jacking assembly 5 includes a fixing base 51, a jacking cylinder 52, and a top plate 53, wherein a housing of the jacking cylinder 52 is fixed on the fixing base 51, and the top plate 53 is fixedly connected with a cylinder rod of the jacking cylinder 52 and is located below the cam bearing follower 34.

As shown in fig. 3, the loading assembly 2 includes a loading plate 21 provided with a plurality of adsorption holes 22 and a plurality of suction cups 23, and the suction cups 23 are disposed in the adsorption holes 22 of the loading plate 21.

The material carrying assembly 2 is used for placing and fixing a substrate material sheet main body, the material carrying plate 21 is used for placing the substrate material sheet main body, and after the substrate material sheet is placed, the sucker 23 is used for sucking the substrate material sheet under the action of negative pressure equipment, so that the substrate material sheet is fixed on the material carrying plate 21.

The object carrying plate 21 is provided with a limiting plate 10. The limiting plate 10 can ensure that the base plate sheet can be accurately placed on the carrying plate 21 by limiting the two sides of the base plate sheet.

It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.

Claims

1. The utility model provides a mark carrier mechanism is beaten to suitable integrated circuit substrate plastic envelope body, includes the base, its characterized in that, be provided with on the base and carry the material subassembly, be provided with on the base of carrying the both sides of material subassembly and press material subassembly A and press material subassembly B, press material subassembly A and press material subassembly B to be used for fixed carrying the product on the material subassembly, base one side is provided with the jacking subassembly that is used for driving press material subassembly A and press material subassembly B work.

2. The marking carrier mechanism for plastic package of integrated circuit substrate according to claim 1, wherein the pressing assembly a comprises a turnover shaft rotatably connected with the base, pressing blocks arranged on the turnover shaft at intervals, a turnover seat arranged on the shaft end of the turnover shaft, and a cam bearing follower arranged on the turnover seat.

3. The marking carrier mechanism for the integrated circuit substrate plastic package body according to claim 2, wherein the material pressing block and the base are provided with mounting holes, a spring is arranged in the mounting hole of the base, and one end of the spring is embedded into the mounting hole of the material pressing block.

4. The marking carrier mechanism for plastic packages of integrated circuit substrates according to claim 1, wherein an oilless bushing is disposed on the turnover shaft between the base and the turnover seat.

5. The marking carrier mechanism for plastic package of integrated circuit substrate according to claim 3, wherein a limiting piece is arranged on the turnover shaft between the pressing block and the base.

6. The marking carrier mechanism for plastic packages of integrated circuit substrates according to claim 1, wherein the pressing assembly a and the pressing assembly B are identical in structure.

7. The marking carrier mechanism for the plastic package body of the integrated circuit substrate according to claim 1, wherein the jacking assembly comprises a fixed seat, a jacking cylinder and a top plate, wherein a shell of the jacking cylinder is fixed on the fixed seat, and the top plate is fixedly connected with a cylinder rod of the jacking cylinder and is positioned below the cam bearing follower.

8. The marking carrier mechanism for plastic packaging bodies of integrated circuit substrates according to claim 1, wherein the carrier assembly comprises a carrier plate provided with a plurality of adsorption holes and a plurality of suckers, and the suckers are arranged in the adsorption holes of the carrier plate.

9. The marking carrier mechanism for plastic packages of integrated circuit substrates according to claim 8, wherein the carrier plate is provided with a limiting plate.