CN116033692B - IGBT-based driving controller, high-voltage electric compressor and assembly mode - Google Patents
IGBT-based driving controller, high-voltage electric compressor and assembly mode Download PDFInfo
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- CN116033692B CN116033692B CN202310320496.XA CN202310320496A CN116033692B CN 116033692 B CN116033692 B CN 116033692B CN 202310320496 A CN202310320496 A CN 202310320496A CN 116033692 B CN116033692 B CN 116033692B
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- 239000012212 insulator Substances 0.000 claims abstract description 110
- 239000000919 ceramic Substances 0.000 claims abstract description 67
- 239000000758 substrate Substances 0.000 claims abstract description 67
- 239000000178 monomer Substances 0.000 claims description 104
- 239000002184 metal Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 11
- 238000003780 insertion Methods 0.000 claims description 10
- 230000037431 insertion Effects 0.000 claims description 10
- 238000009434 installation Methods 0.000 claims description 10
- 230000000149 penetrating effect Effects 0.000 claims description 9
- 238000010586 diagram Methods 0.000 description 9
- 238000009413 insulation Methods 0.000 description 6
- 230000017525 heat dissipation Effects 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 238000004378 air conditioning Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Abstract
The invention discloses a drive controller based on IGBT, a high-voltage electric compressor and an assembly mode, wherein the drive controller comprises a bottom plate, a ceramic substrate, a screw hole insulating piece, a pin insulating piece, the same number of IGBTs and fixing screws; the ceramic substrate is arranged on the upper surface of the bottom plate; the IGBT is arranged on the upper surface of the ceramic substrate; concave holes are formed in the upper surface of the bottom plate; the screw hole insulating piece penetrates through the IGBT and the ceramic substrate and is abutted to the lowest surface of the concave hole; the fixed screw penetrates through the screw hole insulating piece; an insulating ring surrounding the screw hole insulating piece is arranged on the bottom surface of the IGBT; the IGBT is provided with a plurality of pins; the pin insulator is connected to the pins and provided with protrusions protruding from the plurality of pin gaps. The creepage distance between the shell and the driving controller and between pins is improved, and the voltage withstand capacity of the driving controller is improved; foreign matter is prevented from entering the pin spacing, and the pressure endurance capacity is improved.
Description
Technical Field
The invention relates to the technical field of new energy motors, in particular to a high-voltage motor compressor driving controller based on an IGBT, an assembling mode and a high-voltage motor compressor.
Background
At present, the high-voltage electric compressor is widely applied to the aspects of high-speed charging of new energy automobiles, cabin refrigeration, battery cooling and the like. The high-voltage motor-driven compressor mainly comprises a driving controller and a motor pump body, wherein the driving controller is a control center of the motor and has the main function of converting high-voltage direct current of a battery into alternating current so as to drive the motor to operate. The main actuator of the drive controller is typically a three-phase half-bridge circuit consisting of six IGBTs (Insulated Gate Bipolar Transistor, chinese name insulated gate bipolar transistors).
The current high-voltage motor-driven compressor is generally rated at 800V, and the highest voltage can reach 960V. Therefore, the high-voltage motor-driven compressor has definite insulation and voltage-resistant requirements, and the high-voltage network and the shell need to bear 2500Vac/5mA. The drive controller generally comprises 6 IGBT monomers, the IGBT monomers are generally mounted on the heat dissipation base plate through fixing screws, a ceramic substrate is generally arranged between the IGBT monomers and the heat dissipation base plate for electric insulation, and the mounting mode is widely applied to low-voltage compressors. For heat dissipation purposes, the IGBT generally has a metal back plate at the bottom, and an insulating ring is disposed between the metal back plate and the screw hole. The high pressure born by the shell is mainly resisted by the creepage distance between the metal backboard and the screw. If the ring width of the insulating ring is set to 1.8 mm, the diameter of the screw hole is set to 3.4 mm, and the diameter of the screw is set to 3 mm, the distance between the insulating ring and the screw is 0.2 mm, and the creepage distance is 1.8 mm+0.2 mm=2 mm. Under the high-voltage condition, only bear the high pressure through the creepage distance of 2 millimeters, can lead to high voltage withstand voltage ability lower, and then probably lead to appearing creepage striking sparks between the device, appear the problem of potential safety hazard and loss of property.
Meanwhile, the package of the IGBT is generally a general package of TO-247, and when the IGBT is used under high pressure, the distance between pins arranged on the IGBT is determined by the package type, and the minimum distance between the pins is 2.86 mm. This causes a problem that the withstand voltage between the pins is low, and when foreign matter is introduced between the pins, the pitch is further reduced, and the withstand voltage is further reduced.
Disclosure of Invention
The embodiment of the invention provides a high-voltage electric compressor driving controller based on an IGBT, an assembling mode thereof and a high-voltage electric compressor. The method aims at solving the problems that in the prior art, the creepage distance between the shell of the high-voltage electric compressor and the high voltage is insufficient, the interval between IGBT single pins is insufficient, the whole pressure-resistant capability is low, and then potential safety hazards and property loss are easily caused.
In a first aspect, an embodiment of the present invention provides an IGBT-based high voltage motor compressor driving controller, including a base plate, a ceramic substrate, a screw hole insulator, a pin insulator, a first number of IGBT monomers, and a first number of fixing screws; the ceramic substrate is arranged on the upper surface of the bottom plate; the IGBT monomer is arranged on the upper surface of the ceramic substrate; concave holes are formed in the upper surface of the bottom plate; the first end of the screw hole insulating piece penetrates through the IGBT monomer and the ceramic substrate and is abutted to the lowest surface of the concave hole; the fixing screw penetrates through the screw hole insulating piece and connects the screw hole insulating piece, the IGBT monomer and the ceramic substrate to the bottom plate; the IGBT monomer comprises an IGBT main body and a plurality of pins; a plurality of the pins are connected to the body; the pin insulator is connected to the pin; the pin insulator is provided with a protrusion protruding from gaps of a plurality of the pins.
In a second aspect, an embodiment of the present invention further provides a high-voltage electric compressor, including the driving controller according to the first aspect, and further including a driving pump body; the drive controller is electrically connected with the drive pump body.
In a third aspect, an embodiment of the present invention further provides a method for assembling a high-voltage motor compressor driving controller based on an IGBT, which is applied to the driving controller according to the first aspect, and the method includes:
placing the ceramic substrate on the upper surface of the bottom plate, and aligning the ceramic substrate to a first preset mounting position on the upper surface of the bottom plate to obtain the driving controller on which the ceramic substrate is placed;
placing each IGBT monomer on the upper surface of the ceramic substrate, and aligning each IGBT monomer to a second preset mounting position on the upper surface of the ceramic substrate to obtain the drive controller with the IGBT placed;
aligning the first end of the screw hole insulator to a third preset position on the upper surface of the IGBT monomer, and penetrating and installing the first end of the screw hole insulator into the IGBT monomer to obtain the drive controller with the screw hole insulator installed;
aligning the first end of the fixing screw with a fourth preset installation position on the upper surface of the screw hole insulating piece, penetrating and installing the first end of the fixing screw into the screw hole insulating piece, and connecting the first end of the fixing screw to the bottom plate to obtain the driving controller on which the fixing screw is installed;
and mounting the pin insulator to the pin of the IGBT monomer to obtain the assembled driving controller.
Based on the structure and the method, in the first aspect, the embodiment of the invention can improve the creepage distance between the shell and the high voltage in the high-voltage electric compressor, enhance the insulation characteristic and improve the integral pressure resistance; in the second aspect, the pitch between the pins of the IGBT unit can be increased, foreign matters are prevented from entering the pitch, and the voltage withstand capability of the pitch is improved. Furthermore, in the practical application of the high-voltage electric compressor, the embodiment of the invention reduces the potential safety hazard and property loss caused by insufficient pressure resistance.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a high-voltage motor compressor driving controller based on an IGBT according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a base plate in a high-voltage motor-driven compressor controller based on an IGBT according to an embodiment of the present invention;
FIG. 3 is a schematic block diagram of a ceramic substrate combined with a base plate in an IGBT-based high-voltage motor-compressor drive controller according to an embodiment of the invention;
fig. 4 is a schematic structural diagram of an IGBT cell in an IGBT-based high voltage motor compressor drive controller according to an embodiment of the invention;
FIG. 5 is a schematic block diagram of a screw hole insulator in an IGBT-based high-voltage motor compressor drive controller according to an embodiment of the invention;
FIG. 6 is a schematic block diagram of a section A-A of a screw hole insulator in an IGBT-based high-voltage motor-compressor drive controller according to an embodiment of the invention;
FIG. 7 is a schematic block diagram of a pin insulator in an IGBT-based high-voltage motor compressor drive controller provided by an embodiment of the invention;
fig. 8 is a schematic structural diagram of a pin insulator and an IGBT monomer combined in an IGBT-based high voltage motor compressor driving controller according to an embodiment of the present invention;
fig. 9 is a schematic flow chart of an assembling method of the high-voltage motor compressor driving controller based on the IGBT provided by the embodiment of the invention.
Wherein, the reference numerals specifically are:
10. a drive controller; 11. a bottom plate; 111. concave holes; 112, a first screw hole; 12. a ceramic substrate; 121. a second screw hole; 13. screw hole insulating pieces; 131. a first screw hole insulator; 132. a second screw hole insulator; 133. a first screw hole insulating body; 134. a second screw hole insulating body; 135. a third screw hole insulating body; 136. a first screw hole insulating connecting part; 137. a second screw hole insulating connecting part; 138. a fourth screw hole; 139. an insertion section; 1310. a receiving part; 14. a pin insulator; 141. a first pin insulator; 142. a second pin insulator; 143. a first pin insulating body; 144, a second pin insulator body; 145. a third pin insulating body; 146. a first pin insulation connection portion; 147. a second pin insulation connection portion; 148. a protruding portion; 15. IGBT monomers; 151. a first monomer; 152. a second monomer; 153. a third monomer; 154. a fourth monomer; 155. a fifth monomer; 156. a sixth monomer; 157. a metal backplate; 158. an insulating ring; 159. pins; 1510. a third screw hole; 16. and (5) fixing a screw.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be understood that the terms "comprises" and "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in this specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be further understood that the term "and/or" as used in the present specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes such combinations.
Referring to fig. 1 to 3, fig. 1 is a schematic block diagram of a high-voltage motor-compressor driving controller 10 based on an IGBT according to an embodiment of the present invention. As shown in fig. 1, an embodiment of the present invention provides a driving controller 10, which includes a base plate 11, a ceramic substrate 12, a screw hole insulator 13, a pin insulator 14, a first number of IGBT cells 15, and a first number of fixing screws 16; the ceramic substrate 12 is arranged on the upper surface of the bottom plate 11; the IGBT monomer 15 is arranged on the upper surface of the ceramic substrate 12; the upper surface of the bottom plate 11 is provided with a concave hole 111; a first end of the screw hole insulator 13 penetrates the IGBT cell 15 and the ceramic substrate 12 and abuts against a lowermost surface of the concave hole 111; the fixing screw 16 penetrates the screw hole insulator 13 and connects the screw hole insulator 13, the IGBT cell 15, and the ceramic substrate 12 to the base plate 11; a metal back plate 157 is arranged on the bottom surface of the IGBT unit 15, and an insulating ring 158 surrounding the screw hole insulating piece 13 is arranged on the bottom surface of the metal back plate 157; the IGBT cell 15 is further provided with a plurality of pins 159; the pin insulator 14 is connected to the pin 159; the pin insulator 14 is provided with a protrusion 148, and the protrusion 148 protrudes from the gaps of the plurality of pins 159.
In this embodiment, the bottom plate 11 is mainly used for dissipating heat of the IGBT cell 15, and heat generated during operation of the IGBT cell 15 is discharged through the bottom plate 11; the ceramic substrate 12 is mainly used for electrically insulating the IGBT from the heat dissipation base plate 11; the screw hole insulating piece 13 is mainly used for increasing the creepage distance between the IGBT monomer 15 and the bottom plate 11; the pin insulator 14 is mainly used to increase the creepage distance between the pins 159. In a specific design and production, referring to fig. 2, a concave hole 111 with a certain depth may be formed in the bottom plate 11, a screw hole is formed in the lowest surface of the concave hole 111, and a screw hole is also formed in a corresponding position on the ceramic substrate 12. Because the IGBT cell 15 will reserve the screw hole for fixing when designing and packaging, when the screw holes respectively formed on the base plate 11, the ceramic substrate 12, and the IGBT cell 15 are aligned with each other, the first end of the screw hole insulator 13 can directly penetrate through the IGBT cell 15 and the ceramic substrate 12 through the screw holes, and then abut against the lowest surface of the concave hole 111 formed on the base plate 11. After the installation of the screw hole insulating member 13 is completed, the fixing screw 16 can be installed into the screw hole insulating member 13 through a screw hole reserved on the screw hole insulating member 13, and the first end of the fixing screw 16 can be inserted into a screw hole formed in the bottom plate 11 and connected with the bottom plate 11, so that the screw hole insulating member 13 is fixed above the IGBT unit 15 and the ceramic substrate 12. And the screw hole insulator 13 simultaneously fixes the IGBT and the ceramic substrate above the bottom plate 11.
Referring to fig. 4, a metal back plate 157 is disposed on the lower surface of the IGBT cell 15, and an insulating ring 158 is disposed on the lower surface of the metal back plate 157. The insulating ring 158 is mainly used for providing a creepage distance between the metal back plate 157 and the set screw 16. The creepage distance refers to the shortest distance between two conductive parts measured along the surface of the insulating part, the insulating ring 158 is located between the fixing screw 16 and the metal back plate 157, and the insulating ring 158 is made of insulating material, at this time, the insulating part is the insulating ring 158, and the two conductive parts are the metal back plate 157 and the fixing screw 16. After the IGBT cell 15 is powered on, the insulating ring 158 will be electrically polarized, and the sum of the ring width of the insulating ring 158 and the distance between the insulating ring 158 and the fixing screw 16 will provide a part of the creepage distance between the metal back 157 and the fixing screw 16. After the screw hole insulator 13 is installed, the insulating ring 158 is disposed around the screw hole insulator 13, meanwhile, the bottom plate 11 is provided with a concave hole 111, the screw hole insulator 13 further penetrates down into the lowest surface of the concave hole 111, and the fixing screw 16 and the insulating ring 158 are isolated, so that after the ceramic substrate 12 and the screw hole insulator 13 are additionally installed, the insulating parts are the insulating ring 158, the ceramic substrate 12 and the screw hole insulator 13. As shown in fig. 2, after the screw hole insulator 13 is attached, the final value of the creepage distance is the sum of the ring width of the insulating ring 158, the thickness of the ceramic substrate 12, and the depth of the concave hole 111. It can be seen that, after the concave hole 111 and the screw hole insulator 13 are provided, the creepage distance between the IGBT cell 15 and the bottom plate 11 is significantly increased, and the electrical resistance is significantly increased.
In this embodiment, the pin insulator 14 is also added between the plurality of pins 159 on the IGBT cell 15. The protruding portion 148 provided on the pin insulator 14 may protrude at the interval between each of the pins 159, and since the creepage distance is measured along the surface of the insulating part, the protruding distance of the protruding portion 148 increases the original creepage distance between each of the pins 159, significantly improving the electrical resistance of each of the pins 159, and simultaneously preventing foreign matters from entering the interval of each of the pins 159, eliminating potential safety hazards.
In one embodiment, the diameter of the recess is set to be in the range of 4.3 to 5.1 mm; the concave depth range of the concave holes is set to be 0.4 to 0.6 mm; the thickness of the ceramic substrate is set to be 1.6 to 2.4 mm.
In this embodiment, the IGBT cell 15 may be a TO-247 package device, the diameter of the screw hole on the IGBT cell 15 is 3.4 mm, the ring width of the insulating ring 158 may be 1.8 mm, and the fixing screw 16 may be an M3 screw, where the diameter of the fixing screw 16 is 3 mm, and the corresponding screw hole on the bottom plate 11 should be set TO be 3 mm. If the concave hole 111 and the screw hole insulator 13 are not provided, the creepage distance is provided by the ring width of the insulating ring 158 and the distance between the insulating ring 158 and the fixing screw 16, i.e., 1.8 mm+0.2 mm=2 mm. In a preferred case, the diameter of the concave hole 111 may be set to 4.7 mm, the depth of the concave hole 111 may be set to 0.5 mm, and the thickness of the ceramic substrate 12 may be set to 2 mm; at this time, since the diameter of the screw hole on the bottom plate 11 is smaller than the diameter of the concave hole 111, the screw hole can be opened at the center of the lowest surface of the concave hole 111, and the screw hole insulator 13 is abutted to the lowest surface of the concave hole 111. At this time, the creepage distance between the IGBT cell 15 and the bottom plate 11 is 0.5 mm+2 mm+1.8 mm, and compared with the creepage distance before the screw hole insulator 13 is additionally installed, the creepage distance is increased by the thickness of the ceramic substrate 12 and the depth of the concave hole 111, so that the electric resistance is significantly improved.
In one embodiment, the protruding distance of the protruding portion between the pins is set to be 0.75 to 1.25 mm.
In the present embodiment, since the protruding portions 148 are provided protruding at the intervals of the pins 159, the protruding portions 148 should increase by twice the protruding distance as the creepage distance between the pins 159. The IGBT cell 15 may be a TO-247 package device, and the interval between each of the pins 159 is 2.46 mm, and the creepage distance at this time is 2.46 mm. In a preferred embodiment, the protruding distance of the protruding portion 148 may be set to 1 mm, and the creepage distance becomes 2.46 mm+1 mm×2=4.46 mm after the pin insulator 14 is attached. The creepage distance at this time is significantly increased, and the withstand performance between pins 159 is significantly improved.
In an embodiment, referring to fig. 2, a first screw hole 112 is formed at the bottom of the concave hole 111; the ceramic substrate 12 is provided with a second screw hole 121; a third screw hole 1510 is formed in each IGBT element 15; the screw hole insulating piece 13 is provided with a fourth screw hole 138; the first end of the screw hole insulator 13 penetrates the third screw hole 1510 and the second screw hole 121 and is abutted to the lowest end of the concave hole 111; the first end of each fixing screw 16 penetrates through the fourth screw hole 138 and the concave hole 111 into the first screw hole 112, and is connected to the first screw hole 112.
In this embodiment, the inner diameter of the first screw hole 112 is smaller than the inner diameter of the concave hole 111, and the first screw hole 112 may be formed at the center of the concave hole 111. The fourth screw hole 138 is a screw hole penetrating the first end and the second end of the screw hole insulator 13, and the inner diameter of the fourth screw hole 138 is the same as that of the first screw hole 112. When the screw hole insulator 13 is installed, the first end of the screw hole insulator 13 sequentially penetrates through the third screw hole 1510 and the second screw hole 121 until the first end abuts against the lowest surface of the concave hole 111, namely, the installation is completed, and at this time, the fourth screw hole 138 is directly opposite to the first screw hole 112.
The set screw 16 may be an M3 screw, and the set screw 16 includes a shank near the first end and a shank near the second end. When the fixing screw 16 is installed, the screw rod at the first end penetrates through the fourth screw hole 138, enters the first screw hole 112, and is connected with the fourth screw hole 138 and the first screw hole 112. After the fixing screw 16 is installed, the lower surface of the screw shank abuts against the upper surface of the screw hole insulator 13, thereby fixedly connecting the screw hole insulator 13 to the bottom plate 11. At this time, the screw hole insulator 13 is also abutted to the upper surface of the IGBT cell 15, thereby fixedly connecting the IGBT cell 15 and the ceramic substrate 12 to the bottom plate 11. Wherein, the second screw hole 121 and the third screw hole 1510 may have the same inner diameter.
In one embodiment, referring to fig. 1, the IGBT cell 15 includes a first cell 151, a second cell 152, a third cell 153, a fourth cell 154, a fifth cell 155, and a sixth cell 156; the pin insulator 14 includes a first pin insulator 141 and a second pin insulator 142; the screw hole insulator 13 includes a first screw hole insulator 131 and a second screw hole insulator 132; the first monomer 151, the second monomer 152, and the third monomer 153 are arranged in parallel; the first pin insulator 141 is connected to the first, second and third cells 151, 152 and 153; the first screw hole insulator 131 is connected to the first, second and third units 151, 152 and 153; the fourth monomer 154, the fifth monomer 155, and the sixth monomer 156 are arranged in parallel; the second pin insulator 142 is connected to the fourth cell 154, the fifth cell 155, and the sixth cell 156; the second screw hole insulator 132 is connected to the fourth unit 154, the fifth unit 155, and the sixth unit 156.
In the present embodiment, the provision of six IGBT cells 15 is determined by the construction requirements of the three-phase half-bridge circuit. The first, second and third cells 151, 152 and 153 are arranged in parallel, while the fourth, fifth and sixth cells 154, 155 and 156 are arranged in parallel, so that the first or second screw hole insulators 131 and 132 are simultaneously mounted to the three IGBT cells 15, and the first or second pin insulators 141 and 142 are simultaneously mounted to the three IGBT cells 15 to enhance the integrity and the mounting operability.
In one embodiment, referring to fig. 1 and 8, the pin insulator 14 includes a first pin insulator 143, a second pin insulator 144, a third pin insulator 145, a first pin insulator 146 and a second pin insulator 147; the first pin insulating body 143 is connected to the second pin insulating body 144 through the first pin insulating connection portion 146; the second pin insulating body 144 is connected to the third pin insulating body 145 through the second pin insulating connection portion 147; the first pin insulating body 143, the second pin insulating body 144, and the third pin insulating body 145 are each provided with the same number of protrusions 148; the first, second and third pin insulating bodies 143, 144, 145 in the first pin insulator 141 are connected to the first, second and third cells 151, 152, 153, respectively; the first, second and third pin insulating bodies 143, 144, 145 in the second pin insulator 142 are connected to the fourth, fifth and sixth cells 154, 155, 156, respectively; the protrusions 148 are provided protruding at the gaps between the pins 159 of each of the IGBT cells 15.
In the present embodiment, referring to fig. 7 and 8, the first pin insulating body 143, the second pin insulating body 144 and the third pin insulating body 145 are provided with the same number of protrusions 148. The IGBT cells 15 may be packaged with TO-247, and if the number of pins 159 is 3, the first pin insulating body 143, the second pin insulating body 144, and the third pin insulating body 145 may each be provided with 2 protruding portions 148 TO increase the creepage distance between each pin 159 on each IGBT cell 15. The provision of the first pin insulator connection 146 and the second pin insulator connection 147 ensures the integrity and mounting operability of the pin insulator 14.
In one embodiment, the screw hole insulating member 13 includes a screw hole insulating body and a screw hole insulating connecting portion; the screw hole insulating body comprises an insertion part 139 near the first end and a receiving part 1310 near the second end; the outer diameter of the receiving part 1310 is larger than that of the insertion part 139, and the bottom surface of the receiving part 1310 can be abutted against the upper surface of the IGBT unit 15; an end of the insertion portion 139 remote from the receiving portion 1310 may abut against a lowermost surface of the concave hole 111; the outer diameter of the insertion portion 139 is smaller than the inner diameter of the concave hole 111.
In this embodiment, referring to fig. 6, the outer diameter of the receiving portion 1310 may be set larger than the outer diameter of the insertion portion 139, and further, when the screw hole insulator 13 is installed, the lower surface of the receiving portion 1310 may abut against the upper surface of the IGBT cell 15, so as to fix the IGBT cell 15 and the ceramic substrate 12 at the same time. Wherein, the outer diameter of the insertion portion 139 may be set to be the same as the inner diameters of the second screw hole 121 and the third screw hole 1510, or may be set to be smaller than the inner diameters of the second screw hole 121 and the third screw hole 1510.
In one embodiment, the screw hole insulating body includes a first screw hole insulating body 133, a second screw hole insulating body 134, and a third screw hole insulating body 135; the screw hole insulating connecting part comprises a first screw hole insulating connecting part 136 and a second screw hole insulating connecting part 137; the first screw hole insulating body 133 is connected to the second screw hole insulating body 134 through the first screw hole insulating connection portion 136; the second screw hole insulating body 134 is connected to the third screw hole insulating body 135 through the second screw hole insulating connection portion 137; the first, second and third screw hole insulating bodies 133, 134 and 135 among the first screw hole insulating bodies 133 are connected to the first, second and third monomers 151, 152 and 153, respectively; the first, second and third screw hole insulating bodies 133, 134 and 135 of the second screw hole insulating body 134 are connected to the fourth, fifth and sixth monomers 154, 155 and 156, respectively.
In the present embodiment, referring to fig. 5, the first screw hole insulating connecting portion 136 and the second screw hole insulating connecting portion 137 ensure the integrity and the installation operability of the first screw hole insulating member 131 and the second screw hole insulating member 132. The first screw hole insulator 131 and the second screw hole insulator 132 can also function to further fix the IGBT cell 15 while providing an increase in the creepage distance.
An embodiment of the present invention provides a high-voltage electric compressor including the driving controller 10 as described above, and further including a driving pump body. The drive controller 10 is electrically connected with the drive pump body.
In this embodiment, the high-voltage electric compressor may be disposed in a new energy vehicle, and may be used for fast charging of the new energy vehicle or for an air conditioning function. The driving controller 10 is mainly used for generating a driving action on the driving pump body so as to implement a corresponding load program. The high-voltage electric compressor is provided with the driving controller 10, when the high-voltage electric compressor is electrified and operated, the high voltage born by the driving controller 10 can lead insulating parts therein to generate electric polarization, at the moment, the screw hole insulating piece 13 and the pin insulating piece 14 can ensure safe creepage distance, ensure the reliability and the safety of the operation of the driving controller 10, further ensure that the new energy vehicle provided with the high-voltage electric compressor can operate efficiently and reliably, prevent equipment damage and eliminate potential safety hazards.
Referring to fig. 9, an embodiment of the present invention provides a method for assembling a high-voltage motor-compressor driving controller based on an IGBT, which is applied to the driving controller 10, and the method includes:
s101, placing the ceramic substrate on the upper surface of the bottom plate, and aligning the ceramic substrate to a first preset installation position on the upper surface of the bottom plate to obtain the driving controller on which the ceramic substrate is placed.
In this embodiment, the first preset mounting position is specifically that each second screw hole on the ceramic substrate aligns with each first screw hole on the bottom plate. At this time, a communication state is formed between the first screw hole and the second screw hole.
S102, placing each IGBT monomer on the upper surface of the ceramic substrate, and aligning each IGBT monomer to a second preset installation position on the upper surface of the ceramic substrate to obtain the drive controller with the IGBT placed.
In this embodiment, each IGBT cell may be a standard device packaged by TO-247, and at this time, each IGBT cell has been provided with a third screw hole. The second preset installation position is specifically that each third screw hole on each IGBT monomer is aligned with each second screw hole on the ceramic substrate respectively. At this time, the first screw hole, the second screw hole and the third screw hole form a communication state.
S103, aligning the first end of the screw hole insulator to a third preset installation position on the upper surface of the IGBT monomer, and penetrating and installing the first end of the screw hole insulator into the IGBT monomer to obtain the drive controller with the screw hole insulator installed.
In this embodiment, the third preset position is specifically that each third screw hole on the surface of the IGBT is aligned with each screw hole insulator, respectively. Specifically, the first end of the screw hole insulator far away from the bearing is aligned with the third screw hole, then the first end of the screw hole insulator far away from the bearing penetrates through the third screw hole and the second screw hole in sequence until the first end of the screw hole insulator is abutted against the lowest surface of the concave hole, the lower surface of the bearing is abutted against the upper surface of the IGBT unit, at the moment, the screw hole insulator is installed, and the fourth screw hole and the first screw hole form a mutual communication state. The first screw hole insulating body, the second screw hole insulating body and the third screw hole insulating body of the first screw hole insulating piece can be respectively installed into the third screw holes of the first monomer, the second monomer and the third monomer; and then the first screw hole insulating body, the second screw hole insulating body and the third screw hole insulating body of the second screw hole insulating piece are respectively installed into the third screw holes of the fourth monomer, the fifth monomer and the sixth monomer. After the screw hole insulating piece is installed, the fixing screw and the insulating ring can be separated, and the creepage distance between the IGBT monomer and the bottom plate is increased.
And S104, aligning the first end of the fixing screw with a fourth preset mounting position on the upper surface of the screw hole insulating piece, penetrating and mounting the first end of the fixing screw into the screw hole insulating piece, and connecting the first end of the fixing screw to the bottom plate to obtain the driving controller on which the fixing screw is mounted.
In this embodiment, the fourth preset position is specifically that the screw rod of the fixing screw is aligned with the fourth screw hole. Specifically, the first end of the screw rod far away from the screw handle of the fixing screw is aligned with the fourth screw hole, the fixing screw is screwed into the fourth screw hole, and along with the increase of the screwing distance, the first end of the screw rod can be screwed into the first screw hole until the lower surface of the screw handle is abutted to the upper surface of the bearing part, and the fixing screw is installed at the moment. At this time, each IGBT cell has been fixedly connected to the upper surface of the ceramic substrate, and each IGBT cell has mounted the screw hole insulator.
And S105, mounting the pin insulator to the pin of the IGBT monomer to obtain the assembled driving controller.
In this embodiment, specifically, the first pin insulating body, the second pin insulating body, and the third pin insulating body of the first pin insulating member may be aligned with the pins in the first unit, the pins in the second unit, and the pins in the third unit, respectively, and the protruding portions in the first pin insulating body, the second pin insulating body, and the third pin insulating body may be inserted into the pin gaps one by one; and aligning the first pin insulating body, the second pin insulating body and the third pin insulating body of the second pin insulating piece with the pins in the fourth monomer, the pins in the fifth monomer and the pins in the sixth monomer respectively, and correspondingly inserting the protruding parts in the first pin insulating body, the second pin insulating body and the third pin insulating body into the pin gaps one by one. At this time, protruding parts are arranged between the pins, and the creepage distance between the pins is increased.
The embodiment of the invention provides a high-voltage electric compressor driving controller based on an IGBT, a high-voltage electric compressor and an assembling method of the high-voltage electric compressor driving controller based on the IGBT. The driving controller comprises a bottom plate, a ceramic substrate, a screw hole insulating piece, a pin insulating piece, a first number of IGBT monomers and a first number of fixing screws; the ceramic substrate is arranged on the upper surface of the bottom plate; the IGBT monomer is arranged on the upper surface of the ceramic substrate; concave holes are formed in the upper surface of the bottom plate; the first end of the screw hole insulating piece penetrates through the IGBT monomer and the ceramic substrate and is abutted to the lowest surface of the concave hole; the fixing screw penetrates through the screw hole insulating piece and connects the screw hole insulating piece, the IGBT monomer and the ceramic substrate to the bottom plate; the IGBT monomer comprises an IGBT main body and a plurality of pins; a plurality of the pins are connected to the body; the pin insulator is connected to the pin; the pin insulator is provided with a protrusion protruding from gaps of a plurality of the pins. The high-voltage electric compressor comprises the driving controller and a driving pump body; the drive controller is electrically connected with the drive pump body. The assembly method is applied to the drive controller according to the first aspect, and includes:
placing the ceramic substrate on the upper surface of the bottom plate, and aligning the ceramic substrate to a first preset mounting position on the upper surface of the bottom plate to obtain the driving controller on which the ceramic substrate is placed;
placing each IGBT monomer on the upper surface of the ceramic substrate, and aligning each IGBT monomer to a second preset mounting position on the upper surface of the ceramic substrate to obtain the drive controller with the IGBT placed;
aligning the first end of the screw hole insulator to a third preset position on the upper surface of the IGBT monomer, and penetrating and installing the first end of the screw hole insulator into the IGBT monomer to obtain the drive controller with the screw hole insulator installed;
aligning the first end of the fixing screw with a fourth preset installation position on the upper surface of the screw hole insulating piece, penetrating and installing the first end of the fixing screw into the screw hole insulating piece, and connecting the first end of the fixing screw to the bottom plate to obtain the driving controller on which the fixing screw is installed;
and mounting the pin insulator to the pin of the IGBT monomer to obtain the assembled driving controller.
Based on the structure and the method, in the first aspect, the embodiment of the invention can improve the creepage distance between the shell and the high voltage in the high-voltage electric compressor, enhance the insulation characteristic and improve the integral pressure resistance; in the second aspect, the pitch between the pins of the IGBT unit can be increased, foreign matters are prevented from entering the pitch, and the voltage withstand capability of the pitch is improved. Furthermore, in the practical application of the high-voltage electric compressor, the embodiment of the invention reduces the potential safety hazard and property loss caused by insufficient pressure resistance.
While the invention has been described with reference to certain preferred embodiments, it will be understood by those skilled in the art that various changes and substitutions of equivalents may be made and equivalents will be apparent to those skilled in the art without departing from the scope of the invention. Therefore, the protection scope of the invention is subject to the protection scope of the claims.
Claims (7)
1. The high-voltage motor compressor driving controller based on the IGBT is characterized by comprising a bottom plate, a ceramic substrate, screw hole insulating pieces, pin insulating pieces, a first number of IGBT monomers and a first number of fixing screws; the ceramic substrate is arranged on the upper surface of the bottom plate; the IGBT monomer is arranged on the upper surface of the ceramic substrate;
concave holes are formed in the upper surface of the bottom plate; the first end of the screw hole insulating piece penetrates through the IGBT monomer and the ceramic substrate and is abutted to the lowest surface of the concave hole; the fixing screw penetrates through the screw hole insulating piece and connects the screw hole insulating piece, the IGBT monomer and the ceramic substrate to the bottom plate;
a metal backboard is arranged on the bottom surface of the IGBT monomer, and an insulating ring surrounding the screw hole insulating piece is arranged on the bottom surface of the metal backboard; the IGBT monomer is also provided with a plurality of pins; the pin insulator is connected to the pin; the pin insulator is provided with a protruding part protruding from gaps of a plurality of pins;
the IGBT monomer comprises a first monomer, a second monomer, a third monomer, a fourth monomer, a fifth monomer and a sixth monomer; the pin insulator comprises a first pin insulator and a second pin insulator; the screw hole insulating piece comprises a first screw hole insulating piece and a second screw hole insulating piece;
the first monomer, the second monomer and the third monomer are arranged in parallel; the first pin insulator is connected to the first monomer, the second monomer and the third monomer; the first screw hole insulating piece is connected to the first monomer, the second monomer and the third monomer;
the fourth monomer, the fifth monomer and the sixth monomer are arranged in parallel; the second pin insulator is connected to the fourth monomer, the fifth monomer and the sixth monomer; the second screw hole insulating piece is connected to the fourth monomer, the fifth monomer and the sixth monomer;
the pin insulator comprises a first pin insulator body, a second pin insulator body, a third pin insulator body, a first pin insulator connection part and a second pin insulator connection part;
the first pin insulating body is connected to the second pin insulating body through the first pin insulating connection portion; the second pin insulating body is connected to the third pin insulating body through the second pin insulating connection portion; the first pin insulating body, the second pin insulating body and the third pin insulating body are all provided with the same number of protruding parts;
the first pin insulating body, the second pin insulating body, and the third pin insulating body in the first pin insulator are connected to the first cell, the second cell, and the third cell, respectively; the first, second and third pin insulating bodies in the second pin insulator are connected to the fourth, fifth and sixth cells, respectively; the protruding parts are arranged in a protruding mode at gaps among the pins of each IGBT single body;
the screw hole insulating piece comprises a screw hole insulating main body and a screw hole insulating connecting part; the screw hole insulating body comprises a first screw hole insulating body, a second screw hole insulating body and a third screw hole insulating body; the screw hole insulating connecting part comprises a first screw hole insulating connecting part and a second screw hole insulating connecting part;
the first screw hole insulating body is connected to the second screw hole insulating body through the first screw hole insulating connecting part; the second screw hole insulating body is connected to the third screw hole insulating body through the second screw hole insulating connecting part;
the first screw hole insulating body, the second screw hole insulating body and the third screw hole insulating body in the first screw hole insulating body are respectively connected to the first monomer, the second monomer and the third monomer and respectively abutted to the upper surface of the first monomer, the upper surface of the second monomer and the upper surface of the third monomer; the first screw hole insulating body, the second screw hole insulating body and the third screw hole insulating body in the second screw hole insulating body are connected to the fourth monomer, the fifth monomer and the sixth monomer, respectively.
2. The IGBT-based high voltage electric compressor drive controller of claim 1 wherein the diameter of the recess is set in the range of 4.3 to 5.1 mm; the concave depth range of the concave holes is set to be 0.4 to 0.6 mm; the thickness of the ceramic substrate is set to be 1.6 to 2.4 mm.
3. The IGBT-based high voltage motor drive controller according to claim 1, wherein the protruding distance of the protruding portion between the pins is set to be 0.75 to 1.25 mm.
4. The IGBT-based high voltage motor compressor drive controller of claim 1 wherein the recess bottom is provided with a first screw hole; the ceramic substrate is provided with a second screw hole; a third screw hole is formed in each IGBT monomer; the screw hole insulating piece is provided with a fourth screw hole;
the first end of the screw hole insulating piece penetrates through the third screw hole and the second screw hole and is abutted to the lowest end of the concave hole; the first end of each fixing screw penetrates through the fourth screw hole and the concave hole to enter the first screw hole and is connected to the first screw hole.
5. The IGBT-based high voltage electric compressor drive controller of claim 1 wherein the screw hole insulating body includes an insert portion near a first end and a socket portion near a second end;
the outer diameter of the bearing part is larger than that of the insertion part, and the bottom surface of the bearing part can be abutted to the upper surface of the IGBT monomer; one end of the insertion part far away from the bearing part can be abutted to the lowest surface of the concave hole; the external diameter of the insertion part is smaller than the internal diameter of the concave hole.
6. A high-pressure electric compressor, characterized by comprising the drive controller according to any one of claims 1 to 5, further comprising a drive pump body; the drive controller is electrically connected with the drive pump body.
7. A method for assembling a high-voltage motor compressor drive controller based on an IGBT, applied to the drive controller according to any one of claims 1 to 5, comprising:
placing the ceramic substrate on the upper surface of the bottom plate, and aligning the ceramic substrate to a first preset mounting position on the upper surface of the bottom plate to obtain the driving controller on which the ceramic substrate is placed;
placing each IGBT monomer on the upper surface of the ceramic substrate, and aligning each IGBT monomer to a second preset mounting position on the upper surface of the ceramic substrate to obtain the drive controller with the IGBT placed;
aligning the first end of the screw hole insulator to a third preset mounting position on the upper surface of the IGBT monomer, and penetrating and mounting the first end of the screw hole insulator into the IGBT monomer to obtain the driving controller with the screw hole insulator mounted;
aligning the first end of the fixing screw with a fourth preset installation position on the upper surface of the screw hole insulating piece, penetrating and installing the first end of the fixing screw into the screw hole insulating piece, and connecting the first end of the fixing screw to the bottom plate to obtain the driving controller on which the fixing screw is installed;
and mounting the pin insulator to the pin of the IGBT monomer to obtain the assembled driving controller.
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