CN116033671A - Method for preventing zinc impregnation of solder resist dry film and plate making equipment - Google Patents
Method for preventing zinc impregnation of solder resist dry film and plate making equipment Download PDFInfo
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- CN116033671A CN116033671A CN202211664908.3A CN202211664908A CN116033671A CN 116033671 A CN116033671 A CN 116033671A CN 202211664908 A CN202211664908 A CN 202211664908A CN 116033671 A CN116033671 A CN 116033671A
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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Abstract
The invention relates to the field of circuit board printing, and discloses a method for preventing a solder resist dry film from zinc impregnation and a board making device, wherein the temperature of the solder resist dry film in a hot pressing leveling procedure is controlled to be 90-100 ℃ and the vacuum pressure is controlled to be 7 kg/cm 2 To 9 kg/cm 2 And the substrate is controlled to be in a nitrogen environment in the post-baking process, so that the bonding strength of the dry film solder resist and the copper surface on the substrate is changed into compact bonding strength, the bonding strength is stronger, the problems of zinc impregnation and whitening of the dry film solder resist in the nickel-plating process are solved, the cost is controlled, and the yield of products is improved.
Description
Technical Field
The invention relates to the field of printed circuit boards, in particular to a method for preventing a solder resist dry film from zinc impregnation.
Background
Along with the characteristics of high density, high precision, miniaturization and thinning of global electronic products, particularly the process board manufacturing of a packaging substrate, the requirement on the surface flatness of solder resist ink of a printed circuit board is higher, the surface flatness of a solder resist layer cannot meet the mounting process of a downstream process in the traditional liquid solder resist process, and therefore a dry film solder resist process with better surface flatness of the solder resist is introduced. However, in the production and application process of the dry film process for the solder resist, the substrate is required to be Jin Hou to be 0.05-0.1 mu m, the soaking time is 9 minutes and 25 seconds in an environment with the temperature of a gold cylinder up to 88 ℃, after the plating of the nickel-plated metal is completed, the dry film ink for the solder resist is impacted by high temperature, the window of the solder resist is easily whitened, the bonding force between the solder resist and a copper surface is easily unqualified, in the baking process, the bonding force between the dry film for the solder resist and the copper surface is easily lowered in the curing process due to the change of the copper surface, and in the film pressing process, the problems of uneven coverage of the dry film for the solder resist and low bonding force between the dry film and the copper surface in the film pressing process are easily caused when the temperature and the pressure in the leveling process of the film are too low.
Therefore, in order to solve the above problems, optimization of parameters and structures of each process in the solder resist section is required to solve the problems of the above-mentioned zinc-impregnation of the solder resist dry film, the whitening of the solder resist window, and the low bonding force between the solder resist and the copper surface.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a technical scheme capable of solving the problems.
A method for preventing a solder resist dry film from zinc impregnation comprises the following steps:
s1, performing solder mask pretreatment, namely treating the plate material from the blanking process, removing oxides, greasy dirt and impurities on the plate surface, thoroughly cleaning the plate surface, and preparing for the subsequent film pressing work;
s2, performing vacuum film pressing on the substrate by a vacuum film pressing machine, wherein the vacuum film pressing treatment comprises a plate feeding process, a double-sided pre-pressing process, a vacuumizing film pressing process, a hot pressing leveling process and a plate discharging process; the temperature in the hot pressing leveling procedure is controlled to be 90-100 ℃; the vacuum pressure in the hot pressing leveling process was controlled to 7 kg/cm 2 To 9 kg/cm 2 ；
S3, performing solder resist exposure, namely performing ultraviolet irradiation exposure on the dry film ink required to be left on the substrate, so that the dry film ink on the selected area is subjected to crosslinking reaction and stably attached to the substrate;
s4, performing solder resist development, namely processing the dry film ink on the area, which is not exposed in the step S3, of the substrate, flushing and washing the unexposed dry film ink by using a developer, and leaving the dry film ink on the exposed part to play an insulating protection role;
s5, baking after the solder resist, namely baking the substrate in a back oven to thoroughly solidify the dry film ink of the solder resist, so as to finish a stable netlike framework and achieve electrical and physical and chemical properties; and controlling the nitrogen gas to be filled into the back oven in the back baking step, wherein the filling rate of the nitrogen gas is 250L/min to 350L/min.
Preferably, the temperature in the hot pressing leveling process in the step S2 is controlled to be 100 ℃.
Preferably, the vacuum pressure in the hot-pressing leveling process in the step S2 is controlled to 9 kg/cm 2 。
Preferably, the nitrogen gas is filled at a rate of 300L/min in the step S5.
The invention also provides a plate making device for preventing the zinc penetration of the dry film solder resist, which comprises a vacuum film pressing machine, wherein the vacuum film pressing machine is used for flatly coating the dry film solder resist on the substrate; the vacuum film pressing machine controls the hot pressing leveling temperature to be 90-100 ℃ when the hot pressing leveling procedure is carried out on the solder resist dry film, and controls the vacuum pressure to be 7 kg/cm when the hot pressing leveling is carried out 2 To 9 kg/cm 2 。
Preferably, the board manufacturing equipment further comprises a back oven, wherein the back oven is used for baking and curing the dry film solder resist after the developing process; and continuously introducing nitrogen into the back oven.
Preferably, the nitrogen gas in the post-oven is introduced at a rate of 300L/min.
Compared with the prior art, the invention has the beneficial effects that:
1. in the method for preventing the zinc impregnation of the solder resist dry film, the vacuum pressure and the temperature of the solder resist dry film in the hot pressing leveling process are improved, so that the solder resist dry film can be better contacted and combined with a copper surface, the leveling degree is better, the capability of the solder resist dry film for resisting the immersion of nickel-gold chemical liquid medicine is improved, the zinc impregnation and whitening problem probability of the window edge of the solder resist dry film after the immersion of nickel-gold of a substrate are reduced, and the product yield is improved.
2. In the method for preventing the zinc impregnation of the dry film of the solder resist, nitrogen is introduced in the post baking procedure, so that the post baking procedure is filled with the nitrogen, the copper surface is not oxidized to generate oxides in the post baking procedure, the binding force of the dry film of the solder resist and the copper surface in the curing procedure is further improved, the zinc impregnation and whitening of the window edge of the dry film of the solder resist of the substrate after the nickel-gold deposition are further reduced, and the product yield is improved.
Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the invention, and that other drawings can be obtained according to these drawings without inventive faculty for a person skilled in the art.
FIG. 1 is a schematic diagram of the steps of the present invention.
Fig. 2 is a schematic diagram of the film press of the present invention.
Detailed Description
The following description of the technical solutions in the embodiments of the present invention will be clear and complete, and it is obvious that the described embodiments are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.
Furthermore, in the description of the present invention, unless explicitly stated and limited otherwise, the terms "mounted," "connected," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; the two components can be directly connected or indirectly connected through an intermediate medium, or can be communicated inside the two components, or can be connected wirelessly or in a wired way. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
In addition, the technical features of the different embodiments of the invention described later can be combined with each other as long as they do not collide with each other.
Referring to fig. 1-2, in an embodiment of the invention, a method for preventing a dry film solder resist from zinc impregnation includes the following steps:
s1, performing solder mask pretreatment, namely treating the plate material from the blanking process, removing oxides, greasy dirt and impurities on the plate surface, thoroughly cleaning the plate surface, and preparing for the subsequent film pressing work;
s2, performing vacuum film pressing on the substrate by a vacuum film pressing machine, wherein the vacuum film pressing treatment comprises a plate feeding process, a double-sided pre-pressing process, a vacuumizing film pressing process, a hot pressing leveling process and a plate discharging process; the temperature in the hot pressing leveling procedure is controlled to be 90-100 ℃; the vacuum pressure in the hot pressing leveling process was controlled to 7 kg/cm 2 To 9 kg/cm 2 ；
S3, performing solder resist exposure, namely performing ultraviolet irradiation exposure on the dry film ink required to be left on the substrate, so that the dry film ink on the selected area is subjected to crosslinking reaction and stably attached to the substrate;
s4, performing solder resist development, namely processing the dry film ink on the area, which is not exposed in the step S3, of the substrate, flushing and washing the unexposed dry film ink by using a developer, and leaving the dry film ink on the exposed part to play an insulating protection role;
s5, baking after the solder resist, namely baking the substrate in a back oven to thoroughly solidify the dry film ink of the solder resist, so as to finish a stable netlike framework and achieve electrical and physical and chemical properties; and controlling the nitrogen gas to be filled into the back oven in the back baking step, wherein the filling rate of the nitrogen gas is 250L/min to 350L/min.
It should be noted that, according to the working principle of the vacuum film pressing machine of fig. 2, after the substrate from the previous step is processed and cleaned in the dry film solder resist process of the circuit board, the substrate enters the vacuum film pressing machine through the plate feeding process to perform double-sided pre-pressing film, then the substrate is vacuumized and heated and pressurized in the vacuum film pressing machine, the vacuumized film pressing process is performed to realize the primary film pressing process of the dry film solder resist, then the substrate enters the second step, namely the hot pressing leveling process along with the conveying device in the vacuum film pressing machine to realize planarization through heating and pressurizing, the flatness of the dry film solder resist film is improved, the combination of the dry film solder resist and the copper surface is tighter, in the hot pressing leveling process, the temperature needs to be controlled to be 90 ℃ to 100 ℃, and the vacuum pressure is controlled to be 7 kg/cm 2 To 9 kg/cm 2 Compared with the temperature of 80 ℃ of the hot pressing leveling procedure in the traditional method, the higher temperature and pressure can enable the welding-resistant dry film to be combined with the copper surface more easily in the film pressing leveling process, and the problems of zinc impregnation and whitening of the window edge of the follow-up welding-resistant dry film can be avoided when the bonding force between the welding-resistant dry film and the copper surface is increased. In the post-solder-resist baking in the step S5, air is introduced in the traditional method, but oxygen mixed in the air is easy to react with the copper surface in the baking process to generate oxides, so that a gap exists between the dry film of the solder resist and the copper surface in the curing process, the bonding force between the dry film of the solder resist and the copper surface in the baking curing process is low, the problems of oil dropping and zinc impregnation and whitening easily occur in the subsequent nickel-gold plating process, the novel method is to introduce inert gas nitrogen into a back oven to solve the problems, the yield of products is improved, but the cost of the nitrogen needs to be controlled, and the experimental result of the yield after introducing different nitrogen is as follows:
it should be specifically noted that, in one embodiment, the temperature in the hot-pressing leveling process in step S2 is controlled to 100 ℃, and the vacuum pressure in the hot-pressing leveling process in step S2 is controlled to 9 kg/cm 2 The method comprises the steps of carrying out a first treatment on the surface of the Meanwhile, the nitrogen filling rate in the step S5 is controlled to be 300L/min, so that the cost of the nitrogen can be controlled while ensuring a good yield. After the temperature and the pressure in the hot pressing leveling process are optimally controlled and the nitrogen inlet amount in the post baking process is optimally controlled, the method can be obtained according to experiments:
the invention also provides a plate making device for preventing the zinc impregnation of the solder resist dry film, which comprises a vacuum film pressing machine, wherein the vacuum film pressing machine is used for flatly coating the solder resist dry film on the substrate; the vacuum film pressing machine controls the temperature of hot pressing leveling to be 90-100 ℃ when the hot pressing leveling procedure is carried out on the solder resist dry film, and controls the vacuum pressure during hot pressing leveling to be 7 kg/cm 2 To 9 kg/cm 2 . Meanwhile, the board making equipment also comprises a back oven which is used for baking and curing the dry film after the development process; and continuously introducing nitrogen into the back oven, wherein the introducing rate of the nitrogen in the back oven is 300L/min.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Claims (7)
1. A resistance welding method for preventing zinc penetration of a resistance welding dry film is characterized by comprising the following steps:
s1, performing solder mask pretreatment, namely treating the plate material from the blanking process, removing oxides, greasy dirt and impurities on the plate surface, thoroughly cleaning the plate surface, and preparing for the subsequent film pressing work;
s2, performing vacuum film pressing on the substrate by a vacuum film pressing machine, wherein the vacuum film pressing treatment comprises a plate feeding process, a double-sided pre-pressing process, a vacuumizing film pressing process, a hot pressing leveling process and a plate discharging process; the temperature in the hot pressing leveling procedure is controlled to be 90-100 ℃; the vacuum pressure in the hot pressing leveling process was controlled to 7 kg/cm 2 To 9 kg/cm 2 ；
S3, performing solder resist exposure, namely performing ultraviolet irradiation exposure on the dry film ink required to be left on the substrate, so that the dry film ink on the selected area is subjected to crosslinking reaction and stably attached to the substrate;
s4, performing solder resist development, namely processing the dry film ink on the area, which is not exposed in the step S3, of the substrate, flushing and washing the unexposed dry film ink by using a developer, and leaving the dry film ink on the exposed part to play an insulating protection role;
s5, baking after the solder resist, namely baking the substrate in a back oven to thoroughly solidify the dry film ink of the solder resist, so as to finish a stable netlike framework and achieve electrical and physical and chemical properties; and controlling the nitrogen gas to be filled into the back oven in the back baking step, wherein the filling rate of the nitrogen gas is 250L/min to 350L/min.
2. The method for preventing zinc impregnation of a dry film for solder resist according to claim 1, wherein the temperature in the hot pressing leveling process in the step S2 is controlled to be 100 ℃.
3. The method for preventing zinc impregnation of a dry film solder resist according to claim 1Wherein the vacuum pressure in the hot-pressing leveling step in the step S2 is controlled to 9 kg/cm 2 。
4. The method for preventing zinc impregnation of a dry film for solder resist according to claim 1, wherein the nitrogen gas is introduced at a rate of 300L/min in step S5.
5. The equipment for preventing the zinc penetration of the dry film of the solder resist is characterized by comprising a vacuum film pressing machine, wherein the vacuum film pressing machine is used for flatly coating the dry film of the solder resist on the substrate; the vacuum film pressing machine controls the hot pressing leveling temperature to be 90-100 ℃ when the hot pressing leveling procedure is carried out on the solder resist dry film, and controls the vacuum pressure to be 7 kg/cm when the hot pressing leveling is carried out 2 To 9 kg/cm 2 。
6. The apparatus for preventing zinc impregnation of a dry film for solder resist according to claim 5, further comprising a back oven for baking and curing the dry film for solder resist after the developing process; and continuously introducing nitrogen into the back oven.
7. The apparatus for preventing zinc impregnation of a dry film solder resist according to claim 6, wherein the nitrogen gas in the back oven is introduced at a rate of 300L/min.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211664908.3A CN116033671A (en) | 2022-12-23 | 2022-12-23 | Method for preventing zinc impregnation of solder resist dry film and plate making equipment |
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| CN202211664908.3A CN116033671A (en) | 2022-12-23 | 2022-12-23 | Method for preventing zinc impregnation of solder resist dry film and plate making equipment |
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| CN116033671A true CN116033671A (en) | 2023-04-28 |
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| CN202211664908.3A Pending CN116033671A (en) | 2022-12-23 | 2022-12-23 | Method for preventing zinc impregnation of solder resist dry film and plate making equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117395884A (en) * | 2023-10-18 | 2024-01-12 | 江苏博敏电子有限公司 | Manufacturing process for improving flatness of solder mask layer of carrier plate |
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- 2022-12-23 CN CN202211664908.3A patent/CN116033671A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117395884A (en) * | 2023-10-18 | 2024-01-12 | 江苏博敏电子有限公司 | Manufacturing process for improving flatness of solder mask layer of carrier plate |
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