CN116029245A - Junction temperature estimation method of switch module in DC-DC switch power supply and electronic device - Google Patents
Junction temperature estimation method of switch module in DC-DC switch power supply and electronic device Download PDFInfo
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Abstract
The invention discloses a junction temperature estimation method and an electronic device of a switch module in a DC-DC switch power supply, and relates to the technical field of electrical parameter measurement, wherein the junction temperature estimation method comprises the following steps: calculating the total loss of the switch module under the current working condition; acquiring a temperature value of an environment where the switch module is located; and inputting the total loss and the temperature value of the environment into a preset thermal simulation model to obtain the junction temperature of the switch module, wherein the preset thermal simulation model is a functional relation between the junction temperature of the switch module and the total loss, between the temperature value of the environment and between the junction of the switch module and the thermal resistance value of the environment where the switch module is located. Through the scheme, the problems of poor reliability and high failure rate of the DC-DC circuit in the power supply module caused by the fact that the switch module cannot monitor in place in the prior art are solved.
Description
Technical Field
The application relates to the technical field of electrical parameter measurement, in particular to a junction temperature estimation method of a switch module in a DC-DC switch power supply and an electronic device.
Background
In recent years, with the reduction of petroleum resources and serious pollution of the atmospheric environment, the development of electric automobiles has become an inevitable trend for the development of the automobile industry. However, the problem of anxiety about the endurance mileage of the pure electric vehicle is also generated.
At present, a pure electric automobile mainly has two energy source supplementing modes of whole automobile charging and battery replacement. For a common power supply module system for an electric passenger car, a PWM rectifier circuit and a bidirectional direct current-to-direct current circuit are indispensable parts in the system. The bidirectional direct current-to-direct current circuit generally adopts LLC, CLLC, CLLLC as a main topology of the circuit, and zero-voltage on and zero-current off of the power semiconductor device can be realized through resonance between the resonance inductor and the resonance capacitor, so that the device loss can be reduced to a great extent, and the running efficiency of the direct current-to-direct current circuit can be improved.
However, in actual use, due to the diversification of the working scenario, the power conversion power supply module may encounter abnormal working conditions of heat dissipation degradation (such as water temperature, abnormal flow rate, etc.) in the full life cycle. Therefore, by monitoring the junction temperature of the power semiconductor devices of the ACDC and DCDC circuits in the power supply module and the service life of the power semiconductor devices on line, the method is particularly important for improving the reliability of the power supply module and reducing the failure rate of the power supply products of the module.
Disclosure of Invention
The invention provides a junction temperature estimation method of a switch module in a DC-DC switch power supply and an electronic device, and solves the problems of poor reliability and high failure rate of a DC-DC circuit in a power supply module caused by the fact that the switch module cannot be monitored in place in the prior art.
In a first aspect, the present invention provides a method for estimating a junction temperature of a switching module in a DC-DC switching power supply, including:
calculating the total loss of the switch module under the current working condition;
acquiring a temperature value of an environment where the switch module is located;
and inputting the total loss and the temperature value of the environment into a preset thermal simulation model to obtain the junction temperature of the switch module, wherein the preset thermal simulation model is a functional relation between the junction temperature of the switch module and the total loss, between the temperature value of the environment and between the junction of the switch module and the thermal resistance value of the environment where the switch module is located.
Further, the calculating the total loss of the switch module under the current working condition includes:
calculating the switching loss, the switching loss and the switching on loss of the switch module under the current working condition; and adding the switching loss, the switching loss and the switching loss to obtain the total loss.
Further, the DC-DC switching power supply includes:
a transformer;
a bridge structure and a resonant circuit arranged on the primary side of the transformer, wherein the primary side bridge structure is formed by a plurality of switch modules, the primary side resonant circuit is formed by a capacitor and an inductor, and the primary side bridge structure is connected to the primary side winding of the transformer through the primary side resonant circuit;
a bridge structure and a resonant circuit disposed on a secondary side of the transformer, wherein the secondary side bridge structure is constituted by a plurality of the switch modules, and the secondary side resonant circuit is constituted by a capacitor and an inductor, the secondary side bridge structure being connected to the secondary side winding of the transformer through the secondary side resonant circuit;
the calculating the opening loss of the switch module under the current working condition comprises the following steps:
obtaining the output voltage and the output current of the switch module under the current working condition;
calculating a direct current output impedance according to the output voltage and the output current;
acquiring the switching frequency of a switching module under the current working condition;
calculating the impedance of the primary side resonant circuit, the transformer and the secondary side resonant circuit according to the switching frequency;
calculating the total impedance of the DC-DC switching power supply according to the impedance of the primary side resonant circuit, the transformer and the secondary side resonant circuit;
acquiring the input voltage of a switch module under the current working condition;
obtaining a resonance current effective value according to the input voltage and the total impedance;
and obtaining the opening loss of the switch module according to the effective value of the resonant current.
Further, the calculating the turn-off loss of the switch module under the current working condition includes:
calculating an impedance phase angle from the total impedance;
calculating the turn-off current of the switch module according to the impedance phase angle and the effective value of the resonant current;
and obtaining the turn-off loss of the switch module according to the turn-off current.
Further, the junction temperature estimation method of the switch module in the DC-DC switch power supply further comprises the following steps:
establishing an initial thermal simulation model, wherein in the initial thermal simulation model, junction temperature Tj of a switch module=total loss Ptot of the switch module under a preset working condition+a thermal resistance value of the switch module under the preset working condition;
calculating the total loss of the switch module under the rated working condition;
acquiring the temperature value of the switch module in the environment under the rated working condition;
setting the thermal resistance value of the initial switch module;
inputting the temperature value of the switch module in the environment under the rated working condition, the total loss of the switch module under the rated working condition and the thermal resistance value of the initial switch module into the initial thermal simulation model to obtain the junction temperature calculated value of the switch module under the rated working condition;
obtaining a junction temperature measured value of the switch module under a rated working condition;
comparing whether the difference between the junction temperature measured value and the junction temperature calculated value is smaller than a first preset temperature threshold value;
if the difference value between the junction temperature measured value and the junction temperature calculated value is smaller than a first preset temperature threshold value, the calibration of the initial thermal simulation model under the rated working condition is realized;
and if the difference value between the junction temperature measured value and the junction temperature calculated value is not smaller than a first preset temperature threshold value, changing the thermal resistance value of the initial switch module to obtain an updated junction temperature calculated value and comparing the updated junction temperature calculated value with the junction temperature measured value until the difference value between the updated junction temperature calculated value and the junction temperature measured value is smaller than the first preset temperature threshold value.
Further, the junction temperature estimation method of the switch module in the DC-DC switch power supply further comprises the following steps:
calculating the total loss of the switch module under the non-rated working condition;
acquiring the temperature value of the switch module in the environment under the non-rated working condition;
obtaining a junction temperature calculated value of the switch module under the non-rated working condition according to the total loss of the switch module under the non-rated working condition, the temperature value of the switch module under the non-rated working condition and the calibrated initial thermal simulation model under the rated working condition;
obtaining a junction temperature measured value of the switch module under the non-rated working condition;
comparing whether the difference value between the junction temperature measured value under the non-rated working condition and the junction temperature calculated value under the non-rated working condition is smaller than a second preset temperature threshold value;
if the difference value between the junction temperature measured value under the non-rated working condition and the junction temperature calculated value under the non-rated working condition is smaller than a second preset temperature threshold value, the calibration of the initial thermal simulation model under the non-rated working condition is realized;
if the difference value between the junction temperature measured value under the non-rated working condition and the junction temperature calculated value under the non-rated working condition is not smaller than a second preset temperature threshold value, continuously adjusting the thermal resistance value of the switch module to obtain an updated junction temperature calculated value under the non-rated working condition and comparing the updated junction temperature calculated value with the junction temperature measured value under the non-rated working condition until the difference value between the updated junction temperature calculated value under the non-rated working condition and the junction temperature measured value under the non-rated working condition is smaller than the second preset temperature threshold value.
Further, the junction temperature estimation method of the switch module in the DC-DC switch power supply further comprises the following steps:
acquiring total loss of the switch module under a preset working condition, a thermal resistance value of the switch module and a temperature value of an environment of the switch module under the preset working condition from the calibrated initial thermal simulation model;
obtaining an optimal functional relation between junction temperature of the switch module and total loss of the switch module under a preset working condition, a thermal resistance value of the switch module and a temperature value of an environment of the switch module under the preset working condition by using a least square method;
traversing the preset working conditions to obtain junction temperature calculated values of the switch modules under various working conditions;
and carrying out optimal estimation by adopting Kalman filtering aiming at the difference value between the junction temperature measured value and the calculated value of the switch module under the various working conditions until the difference value between the junction temperature measured value and the calculated value of the switch module is smaller than a third preset temperature threshold value so as to obtain the preset thermal simulation model.
Further, the junction temperature estimation method of the switch module in the DC-DC switch power supply further comprises the following steps:
and if the junction temperature of the switch module under the current working condition exceeds the preset junction temperature threshold value, reducing the power output of the switch module.
In a second aspect, the present invention provides a computer readable storage medium comprising a stored program, wherein the program when run performs a method of estimating a junction temperature of a switching module in the DC-DC switching power supply.
In a third aspect, the invention provides an electronic device comprising a memory and a processor, characterized in that the memory has stored therein a computer program, the processor being arranged to execute a method of estimating the junction temperature of a switching module in the DC-DC switching power supply by means of the computer program.
The working principle and the beneficial effects of the invention are as follows:
according to the DC-DC switching power supply circuit, the total loss of the switching module under the current working condition can be obtained through calculation simulation, the environment temperature value of the switching module is obtained through measurement, and then the total loss and the environment temperature value are input into a preset thermal simulation model with functional relations among the junction temperature of the switching module, the total loss, the environment temperature value and the thermal resistance value of the switching module, so that the junction temperature of the switching module is obtained. By monitoring the temperature of the switch module, the problems of poor reliability and high failure rate of the DC-DC circuit in the power supply module are avoided.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the application and together with the description, serve to explain the principles of the application.
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required to be used in the description of the embodiments or the prior art will be briefly described below, and it will be obvious to those skilled in the art that other drawings can be obtained from these drawings without inventive effort.
FIG. 1 is a topology layout of a DC-DC switching power supply circuit of the present invention;
FIG. 2 is a flow chart of a junction temperature estimation method of a switch module according to one embodiment of the invention;
FIG. 3 is a flow chart of calculating switching on and off losses of a switching module according to one embodiment of the present invention;
FIG. 4 is a flow chart of thermal simulation model calibration under nominal operating conditions in accordance with one embodiment of the present invention;
FIG. 5 is a flow chart of thermal simulation model calibration under non-nominal operating conditions in accordance with an embodiment of the present invention;
fig. 6 is a schematic diagram of an electronic device according to an embodiment of the invention.
Detailed Description
In order to make the present application solution better understood by those skilled in the art, the following description will be made in detail and with reference to the accompanying drawings in the embodiments of the present application, it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, shall fall within the scope of the present application.
It should be noted that the terms "first," "second," and the like in the description and claims of the present application and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that embodiments of the present application described herein may be implemented in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
The invention provides a junction temperature estimation method of a switch module in a DC-DC switch power supply, a storage medium and an electronic device. Wherein, in a specific embodiment, the DC-DC switching power supply comprises:
a transformer;
a bridge structure and a resonant circuit arranged on the primary side of the transformer, wherein the primary side bridge structure is formed by a plurality of switch modules, the primary side resonant circuit is formed by a capacitor and an inductor, and the primary side bridge structure is connected to the primary side winding of the transformer through the primary side resonant circuit;
a bridge structure and a resonant circuit disposed on a secondary side of the transformer, wherein the secondary side bridge structure is constituted by a plurality of the switch modules, and the secondary side resonant circuit is constituted by a capacitor and an inductor, the secondary side bridge structure being connected to the secondary side winding of the transformer through the secondary side resonant circuit;
in one embodiment, as shown in fig. 1, the DC-DC switching power supply is in a full-bridge structure, and the primary side bridge structure includes switching modules Q7, Q8, Q9 and Q10, where the switching modules Q7, Q8, Q9 and Q10 are connected in an H-bridge manner, the switching modules Q7 and Q8 are used as upper bridge arms, the switching modules Q9 and Q10 are used as lower bridge arms, the primary side resonant circuit includes an inductor Lr1 and a capacitor Cr1, one end of the inductor Lr1 is connected to a connection point of the switching modules Q7 and Q9, the other end is connected to a first primary side of the transformer, one end of the capacitor Cr1 is connected to a connection point of the switching modules Q8 and Q10, and the other end is connected to a second primary side of the transformer.
The secondary side bridge structure comprises switch modules Q11, Q12, Q13 and Q14, wherein the switch modules Q11, Q12, Q13 and Q14 are connected in an H bridge mode, the switch modules Q11 and Q12 are used as upper bridge arms, the switch modules Q13 and Q14 are used as lower bridge arms, the secondary side resonant circuit comprises an inductor Lr2 and a capacitor Cr2, one end of the inductor Lr2 is connected with a connecting point of the switch modules Q11 and Q13, the other end is connected with a first secondary side of the transformer, one end of the capacitor Cr2 is connected with a connecting point of the switch modules Q12 and Q14, and the other end is connected with a second secondary side of the transformer.
In one embodiment, each switch module comprises a MOS transistor and a diode, because the gate electrode of the MOS transistor is isolated from the other two electrodes by silicon dioxide, the resistance of the MOS transistor is extremely high, static electricity is easy to induce, breakdown and burn out are caused, and in order to prevent static electricity accumulation, a diode, also called a parasitic diode, is connected in parallel, and when the voltage exceeds a certain value, the parasitic diode breaks down reversely to release charges, so that the MOS transistor is protected. Reverse breakdown of the parasitic diode is reversible, recoverable, and does not itself damage.
As shown in fig. 2, the embodiment provides a junction temperature estimation method of a switch module in a DC-DC switching power supply, which includes the following steps:
step one: calculating the total loss of the switch module under the current working condition;
in this embodiment, the total loss of the switch module under the current working condition includes an on loss, an off loss and an on loss of the switch module under the current working condition; and adding the switching loss, the switching loss and the switching loss to obtain the total loss.
In one embodiment, as shown in fig. 3, calculating the turn-on loss of the switch module under the current working condition includes:
obtaining the output voltage and the output current of the switch module under the current working condition;
calculating a direct current output impedance according to the output voltage and the output current;
acquiring the switching frequency of a switching module under the current working condition;
calculating the impedance of the primary side resonant circuit, the transformer and the secondary side resonant circuit according to the switching frequency;
calculating the total impedance of the DC-DC switching power supply according to the impedance of the primary side resonant circuit, the transformer and the secondary side resonant circuit;
acquiring the input voltage of a switch module under the current working condition;
obtaining a resonance current effective value according to the input voltage and the total impedance;
and obtaining the opening loss of the switch module according to the effective value of the resonant current.
In one embodiment, calculating the turn-off loss of the switch module under the current working condition includes:
calculating an impedance phase angle from the total impedance;
calculating the turn-off current of the switch module according to the impedance phase angle and the effective value of the resonant current;
and obtaining the turn-off loss of the switch module according to the turn-off current.
Step two: acquiring a temperature value of an environment where the switch module is located;
step three: and inputting the total loss and the temperature value of the environment into a preset thermal simulation model to obtain the junction temperature of the switch module, wherein the preset thermal simulation model is a functional relation between the junction temperature of the switch module and the total loss, between the temperature value of the environment and between the junction of the switch module and the thermal resistance value of the environment where the switch module is located.
In one embodiment, the DC-DC switching power supply further comprises a heat sink, the thermal resistance value being a sum of a thermal resistance of the switch module junction to the package housing, a thermal resistance of the housing to the heat sink, and a thermal resistance of the heat sink to the environment. When the DC-DC switching power supply includes a coolant line, the reference ambient temperature is a coolant temperature, and when the DC-DC switching power supply does not include a coolant line, the reference ambient temperature is an ambient air temperature. The cooling liquid is used for taking away heat from the radiator to achieve the effect of cooling.
Step four: and if the junction temperature of the switch module under the current working condition exceeds the preset junction temperature threshold value, reducing the power output of the switch module.
Further, as shown in fig. 4, in this embodiment, the construction of the preset thermal simulation model includes:
step 1: establishing an initial thermal simulation model, wherein in the initial thermal simulation model, junction temperature Tj of a switch module=total loss Ptot of the switch module under a preset working condition+a thermal resistance value of the switch module under the preset working condition;
step 2: calculating the total loss of the switch module under the rated working condition;
step 3: acquiring the temperature value of the switch module in the environment under the rated working condition;
step 4: setting the thermal resistance value of the initial switch module;
step 5: inputting the temperature value of the switch module in the environment under the rated working condition, the total loss of the switch module under the rated working condition and the thermal resistance value of the initial switch module into the initial thermal simulation model to obtain the junction temperature calculated value of the switch module under the rated working condition;
step 6: obtaining a junction temperature measured value of the switch module under a rated working condition;
in one embodiment, the junction temperature measured value of the switch module under the rated working condition is obtained by adding a thermocouple at the geometric center position of a chip of the switch module and is obtained through actual measurement, and the junction temperature measured value is used for checking an initial thermal simulation model.
Step 7: comparing whether the difference between the junction temperature measured value and the junction temperature calculated value is smaller than a first preset temperature threshold value;
if the difference value between the junction temperature measured value and the junction temperature calculated value is smaller than a first preset temperature threshold value, the calibration of the initial thermal simulation model under the rated working condition is realized;
and if the difference value between the junction temperature measured value and the junction temperature calculated value is not smaller than a first preset temperature threshold value, changing the thermal resistance value of the initial switch module to obtain an updated junction temperature calculated value and comparing the updated junction temperature calculated value with the junction temperature measured value until the difference value between the updated junction temperature calculated value and the junction temperature measured value is smaller than the first preset temperature threshold value.
In one embodiment, the first preset temperature threshold may be set to 3 ℃, and the temperature difference between the junction temperature calculated value obtained by the initial thermal simulation model and the junction temperature measured value directly obtained by the thermocouple is used for judging whether the initial thermal simulation model is accurate, and if not, the thermal resistance value of the switch module is changed for recalibration.
Further, as shown in fig. 5, in consideration of various working conditions of the DC-DC circuit, the construction of the preset thermal simulation model further includes:
step 8: calculating the total loss of the switch module under the non-rated working condition;
step 9: acquiring the temperature value of the switch module in the environment under the non-rated working condition;
step 10: according to the total loss of the switch module under the non-rated working condition, the temperature value of the switch module under the non-rated working condition and the thermal resistance value of the switch module under the rated working condition, inputting the total loss, the temperature value and the thermal resistance value of the switch module into an initial thermal simulation model to obtain a junction temperature calculated value of the switch module under the non-rated working condition;
step 11: obtaining a junction temperature measured value of the switch module under the non-rated working condition;
step 12: comparing whether the difference value between the junction temperature measured value under the non-rated working condition and the junction temperature calculated value under the non-rated working condition is smaller than a second preset temperature threshold value;
if the difference value between the junction temperature measured value under the non-rated working condition and the junction temperature calculated value under the non-rated working condition is smaller than a second preset temperature threshold value, the calibration of the initial thermal simulation model under the non-rated working condition is realized;
if the difference value between the junction temperature measured value under the non-rated working condition and the junction temperature calculated value under the non-rated working condition is not smaller than a second preset temperature threshold value, continuously adjusting the thermal resistance value of the switch module to obtain an updated junction temperature calculated value under the non-rated working condition and comparing the updated junction temperature calculated value with the junction temperature measured value under the non-rated working condition until the difference value between the updated junction temperature calculated value under the non-rated working condition and the junction temperature measured value under the non-rated working condition is smaller than the second preset temperature threshold value.
In one embodiment, the non-rated operating conditions include the DC-DC circuit operating in an overload condition and a half-load condition. The same thermal simulation calibration steps of the two non-rated working conditions can be realized through the steps 8-12, and when the method is applied specifically, the steps 8-12 can be executed twice, wherein the first time is used for thermal simulation calibration under the overload working condition, and the second time is used for thermal simulation calibration under the on-board working condition.
In one embodiment, the second preset temperature threshold may be set equal to the first preset temperature threshold, for example 3 ℃. Judging whether the initial thermal simulation model is accurate or not by judging the temperature difference between the junction temperature calculated value obtained by the initial thermal simulation model and the junction temperature measured value directly obtained by the thermocouple, and carrying out recalibration by changing the thermal resistance value of the switch module under the condition of inaccuracy.
Further, in order to make the construction of the preset thermal simulation model more accurate, an intelligent algorithm is introduced, and the construction of the preset thermal simulation model further comprises:
step 13: acquiring total loss of the switch module under a preset working condition, a thermal resistance value of the switch module and a temperature value of an environment of the switch module under the preset working condition from the calibrated initial thermal simulation model;
step 14: obtaining an optimal functional relation between junction temperature of the switch module and total loss of the switch module under a preset working condition, a thermal resistance value of the switch module and a temperature value of an environment of the switch module under the preset working condition by using a least square method;
in this embodiment, the least squares method finds the best function match for the data by minimizing the sum of squares of the errors. The unknown data can be easily obtained by the least square method, and the sum of squares of errors between the obtained data and the actual data is minimized.
Step 15: traversing the preset working conditions to obtain junction temperature calculated values of the switch modules under various working conditions;
step 16: and carrying out optimal estimation by adopting Kalman filtering aiming at the difference value between the junction temperature measured value and the calculated value of the switch module under the various working conditions until the difference value between the junction temperature measured value and the calculated value of the switch module is smaller than a third preset temperature threshold value so as to obtain the preset thermal simulation model.
In this embodiment, the kalman filter is an algorithm for optimally estimating the system state by using a linear system state equation and by inputting and outputting observation data through the system. The optimal estimate can also be seen as a filtering process, since the observed data includes the effects of noise and interference in the system.
It should be noted that, although the above scheme is described with the switching module in the DC-DC switching power supply shown in fig. 1, the present invention is not limited thereto, and those skilled in the art can apply the method according to the present invention to other DC-DC switching power supplies.
It will be appreciated by those skilled in the art that the present invention may implement all or part of the above-described methods according to the above-described embodiments, or may be implemented by means of a computer program for instructing relevant hardware, where the computer program may be stored in a computer readable storage medium, and where the computer program may implement the steps of the above-described embodiments of the method when executed by a processor. Wherein the computer program comprises computer program code which may be in source code form, object code form, executable file or some intermediate form etc. The computer readable storage medium may include: any entity or device, medium, usb disk, removable hard disk, magnetic disk, optical disk, computer memory, read-only memory, random access memory, electrical carrier wave signals, telecommunications signals, software distribution media, and the like capable of carrying the computer program code. It should be noted that the computer readable storage medium may include content that is subject to appropriate increases and decreases as required by jurisdictions and by jurisdictions in which such computer readable storage medium does not include electrical carrier signals and telecommunications signals.
The invention also provides a computer readable storage medium comprising a stored program, wherein the program executes a junction temperature estimation method of a switch module in the DC-DC switch power supply when running.
In one embodiment of the computer readable storage medium according to the present invention, the computer readable storage medium may be configured to store a program for performing the method of estimating the junction temperature of the switching module in the DC-DC switching power supply of the above-described method embodiment, which may be loaded and executed by the processor to implement the above-described method. For convenience of explanation, only those portions of the embodiments of the present invention that are relevant to the embodiments of the present invention are shown, and specific technical details are not disclosed, please refer to the method portions of the embodiments of the present invention. The computer readable storage medium may be a storage device including various electronic devices, and optionally, the computer readable storage medium in the embodiments of the present invention is a non-transitory computer readable storage medium.
As shown in fig. 6, the present embodiment provides an electronic device including a memory in which a computer program is stored, and a processor configured to execute a junction temperature estimation method of a switching module in the DC-DC switching power supply by the computer program.
In one embodiment, the electronic device is configured as a DSP.
For convenience of explanation, only those portions of the embodiments of the present invention that are relevant to the embodiments of the present invention are shown, and specific technical details are not disclosed, please refer to the method portions of the embodiments of the present invention. The electronic apparatus may be a control device including various electronic device formations.
Further, it should be understood that, since the respective modules are merely set to illustrate the functional units of the apparatus of the present invention, the physical devices corresponding to the modules may be the processor itself, or a part of software in the processor, a part of hardware, or a part of a combination of software and hardware. Accordingly, the number of individual modules in the figures is merely illustrative.
Those skilled in the art will appreciate that the various modules in the apparatus may be adaptively split or combined. Such splitting or combining of specific modules does not cause the technical solution to deviate from the principle of the present invention, and therefore, the technical solution after splitting or combining falls within the protection scope of the present invention.
Thus far, the technical solution of the present invention has been described in connection with the preferred embodiments shown in the drawings, but it is easily understood by those skilled in the art that the scope of protection of the present invention is not limited to these specific embodiments. Equivalent modifications and substitutions for related technical features may be made by those skilled in the art without departing from the principles of the present invention, and such modifications and substitutions will fall within the scope of the present invention.
The foregoing is merely a preferred embodiment of the present application and it should be noted that modifications and adaptations to those skilled in the art may be made without departing from the principles of the present application and are intended to be comprehended within the scope of the present application.
Claims (10)
1. A method for estimating a junction temperature of a switching module in a DC-DC switching power supply, comprising:
calculating the total loss of the switch module under the current working condition;
acquiring a temperature value of an environment where the switch module is located;
and inputting the total loss and the temperature value of the environment into a preset thermal simulation model to obtain the junction temperature of the switch module, wherein the preset thermal simulation model is a functional relation between the junction temperature of the switch module and the total loss, between the temperature value of the environment and between the junction of the switch module and the thermal resistance value of the environment where the switch module is located.
2. The method of claim 1, wherein the calculating the total loss of the switch module under the current operating condition comprises:
calculating the switching loss, the switching loss and the switching on loss of the switch module under the current working condition; and adding the switching loss, the switching loss and the switching loss to obtain the total loss.
3. The method of claim 2, wherein the step of determining the position of the substrate comprises,
the DC-DC switching power supply includes:
a transformer;
a bridge structure and a resonant circuit arranged on the primary side of the transformer, wherein the primary side bridge structure is formed by a plurality of switch modules, the primary side resonant circuit is formed by a capacitor and an inductor, and the primary side bridge structure is connected to the primary side winding of the transformer through the primary side resonant circuit;
a bridge structure and a resonant circuit disposed on a secondary side of the transformer, wherein the secondary side bridge structure is constituted by a plurality of the switch modules, and the secondary side resonant circuit is constituted by a capacitor and an inductor, the secondary side bridge structure being connected to the secondary side winding of the transformer through the secondary side resonant circuit;
the calculating the opening loss of the switch module under the current working condition comprises the following steps:
obtaining the output voltage and the output current of the switch module under the current working condition;
calculating a direct current output impedance according to the output voltage and the output current;
acquiring the switching frequency of a switching module under the current working condition;
calculating the impedance of the primary side resonant circuit, the transformer and the secondary side resonant circuit according to the switching frequency;
calculating the total impedance of the DC-DC switching power supply according to the impedance of the primary side resonant circuit, the transformer and the secondary side resonant circuit;
acquiring the input voltage of a switch module under the current working condition;
obtaining a resonance current effective value according to the input voltage and the total impedance;
and obtaining the opening loss of the switch module according to the effective value of the resonant current.
4. A method according to claim 3, wherein said calculating the turn-off loss of the switching module under the current operating conditions comprises:
calculating an impedance phase angle from the total impedance;
calculating the turn-off current of the switch module according to the impedance phase angle and the effective value of the resonant current;
and obtaining the turn-off loss of the switch module according to the turn-off current.
5. The method according to claim 1, wherein the method further comprises:
establishing an initial thermal simulation model, wherein in the initial thermal simulation model, junction temperature Tj of a switch module=total loss Ptot of the switch module under a preset working condition+a thermal resistance value of the switch module under the preset working condition;
calculating the total loss of the switch module under the rated working condition;
acquiring the temperature value of the switch module in the environment under the rated working condition;
setting the thermal resistance value of the initial switch module;
inputting the temperature value of the switch module in the environment under the rated working condition, the total loss of the switch module under the rated working condition and the thermal resistance value of the initial switch module into the initial thermal simulation model to obtain the junction temperature calculated value of the switch module under the rated working condition;
obtaining a junction temperature measured value of the switch module under a rated working condition;
comparing whether the difference between the junction temperature measured value and the junction temperature calculated value is smaller than a first preset temperature threshold value;
if the difference value between the junction temperature measured value and the junction temperature calculated value is smaller than a first preset temperature threshold value, the calibration of the initial thermal simulation model under the rated working condition is realized;
and if the difference value between the junction temperature measured value and the junction temperature calculated value is not smaller than a first preset temperature threshold value, changing the thermal resistance value of the initial switch module to obtain an updated junction temperature calculated value and comparing the updated junction temperature calculated value with the junction temperature measured value until the difference value between the updated junction temperature calculated value and the junction temperature measured value is smaller than the first preset temperature threshold value.
6. The method of claim 5, wherein the method further comprises:
calculating the total loss of the switch module under the non-rated working condition;
acquiring the temperature value of the switch module in the environment under the non-rated working condition;
obtaining a junction temperature calculated value of the switch module under the non-rated working condition according to the total loss of the switch module under the non-rated working condition, the temperature value of the switch module under the non-rated working condition and the calibrated initial thermal simulation model under the rated working condition;
obtaining a junction temperature measured value of the switch module under the non-rated working condition;
comparing whether the difference value between the junction temperature measured value under the non-rated working condition and the junction temperature calculated value under the non-rated working condition is smaller than a second preset temperature threshold value;
if the difference value between the junction temperature measured value under the non-rated working condition and the junction temperature calculated value under the non-rated working condition is smaller than a second preset temperature threshold value, the calibration of the initial thermal simulation model under the non-rated working condition is realized;
if the difference value between the junction temperature measured value under the non-rated working condition and the junction temperature calculated value under the non-rated working condition is not smaller than a second preset temperature threshold value, continuously adjusting the thermal resistance value of the switch module to obtain an updated junction temperature calculated value under the non-rated working condition and comparing the updated junction temperature calculated value with the junction temperature measured value under the non-rated working condition until the difference value between the updated junction temperature calculated value under the non-rated working condition and the junction temperature measured value under the non-rated working condition is smaller than the second preset temperature threshold value.
7. The method according to claim 5 or 6, characterized in that the method further comprises:
acquiring total loss of the switch module under a preset working condition, a thermal resistance value of the switch module and a temperature value of an environment of the switch module under the preset working condition from the calibrated initial thermal simulation model;
obtaining an optimal functional relation between junction temperature of the switch module and total loss of the switch module under a preset working condition, a thermal resistance value of the switch module and a temperature value of an environment of the switch module under the preset working condition by using a least square method;
traversing the preset working conditions to obtain junction temperature calculated values of the switch modules under various working conditions;
and carrying out optimal estimation by adopting Kalman filtering aiming at the difference value between the junction temperature measured value and the calculated value of the switch module under the various working conditions until the difference value between the junction temperature measured value and the calculated value of the switch module is smaller than a third preset temperature threshold value so as to obtain the preset thermal simulation model.
8. The method according to claim 1, wherein the method further comprises:
and if the junction temperature of the switch module under the current working condition exceeds the preset junction temperature threshold value, reducing the power output of the switch module.
9. A computer-readable storage medium, characterized in that the computer-readable storage medium comprises a stored program, wherein the program when run performs the method of any one of claims 1 to 8.
10. An electronic device comprising a memory and a processor, wherein the memory has stored therein a computer program, the processor being arranged to perform the method of any of claims 1 to 8 by means of the computer program.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117155135A (en) * | 2023-10-27 | 2023-12-01 | 国网湖北省电力有限公司经济技术研究院 | Junction temperature control method, device and equipment for isolated DC/DC converter |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117155135A (en) * | 2023-10-27 | 2023-12-01 | 国网湖北省电力有限公司经济技术研究院 | Junction temperature control method, device and equipment for isolated DC/DC converter |
| CN117155135B (en) * | 2023-10-27 | 2024-01-30 | 国网湖北省电力有限公司经济技术研究院 | Junction temperature control method, device and equipment for isolated DC/DC converter |
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