CN116029087A - Source furnace thermal field distribution analysis method and device, electronic equipment and storage medium - Google Patents
Source furnace thermal field distribution analysis method and device, electronic equipment and storage medium Download PDFInfo
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- CN116029087A CN116029087A CN202211348133.9A CN202211348133A CN116029087A CN 116029087 A CN116029087 A CN 116029087A CN 202211348133 A CN202211348133 A CN 202211348133A CN 116029087 A CN116029087 A CN 116029087A
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Abstract
The invention relates to the field of thermal field analysis, in particular to a source furnace thermal field distribution analysis method, a source furnace thermal field distribution analysis device, electronic equipment and a storage medium. The source furnace thermal field distribution analysis method comprises the following steps: establishing a two-dimensional axisymmetric simplified model according to structural parameters of each part in the source furnace; importing the two-dimensional axisymmetric simplified model into COMSOL software, and setting material parameters according to manufacturing materials of each component; setting the heat transfer type of each component; setting temperature conditions; the thermal field distribution image of the source furnace is obtained through calculation and analysis, the actual measurement is replaced by a simulation experiment mode, accurate experiment results are ensured to be obtained, and meanwhile, the resource waste and the experiment cost in the experiment process are greatly reduced.
Description
Technical Field
The invention relates to the field of thermal field analysis, in particular to a source furnace thermal field distribution analysis method, a source furnace thermal field distribution analysis device, electronic equipment and a storage medium.
Background
In the molecular beam epitaxy process, the temperature distribution of a source furnace can directly influence the evaporation effect of an evaporation source and the quality of a film deposited on a substrate, when different evaporation sources are used, the temperature requirements in the source furnace are different, the distribution mode and the heating power of a heating wire are often required to be adjusted according to the use requirement, the temperature of each position in the source furnace is generally measured by a sensor in the prior mode, the temperature distribution in the source furnace is further obtained, the heating wire is adjusted according to the measured temperature distribution result, the proper distribution mode and the heating power of the heating wire can be determined after repeated monitoring and adjustment, the test efficiency of the mode is obviously low, and the real-time monitoring and the real-time adjustment are carried out based on the actual experiment, so that each experiment is accompanied by a large amount of resource waste and high experiment cost.
Accordingly, the prior art is subject to improvement and development.
Disclosure of Invention
The invention aims to provide a source furnace thermal field distribution analysis method, a source furnace thermal field distribution analysis device, electronic equipment and a storage medium, which replace actual measurement in a simulation experiment mode, ensure that accurate experiment results are obtained, and simultaneously greatly reduce resource waste and experiment cost in an experiment process.
In a first aspect, the present application provides a method for analyzing a thermal field distribution of a source furnace, including the steps of:
s1, establishing a two-dimensional axisymmetric simplified model according to structural parameters of each part in a source furnace;
s2, importing the two-dimensional axisymmetric simplified model into COMSOL software, and setting material parameters according to manufacturing materials of the components;
s3, setting the heat transfer type of each component;
s4, setting temperature conditions;
s5, calculating and analyzing to obtain a thermal field distribution image of the source furnace.
According to the method, key component parameters are extracted from a complex source furnace entity to construct a simplified simulation model, the real thermal field distribution is simulated by setting accurate related parameters, the model and the parameters are easier to adjust in software, and excessive resources and cost are not required in the adjustment and simulation process.
Further, the component includes: the device comprises a crucible, a heating wire, a heat shielding layer and a water cooling wall, wherein the water cooling wall is positioned at the outermost layer of the two-dimensional axisymmetric simplified model;
the specific steps in the step S1 comprise:
s11, setting structural parameters of the crucible as follows: the outer diameter is 19.5mm, the thickness is 0.6mm, the length of the straight cylinder section is 106mm, and the radius of the pot opening is 9mm;
s12, setting the structural parameters of the heating wire as follows: the thickness is 0.8mm, the length of the heating wire in the lower temperature zone is 76mm, and the length of the heating wire in the upper temperature zone is 32.5mm;
s13, setting structural parameters of the heat shielding layer as follows: the distance between the heating wire and the heating wire is 3mm; the heat shielding layer comprises three layers, wherein the thickness of each layer is 0.1mm, and the interval between any two adjacent layers is 0.1-mm-0.2 mm;
s14, setting the structural parameters of the water-cooled wall as follows: the distance from the symmetry axis of the two-dimensional axisymmetric simplified model is 35mm.
The method is beneficial to reducing the influence of redundant components and structural parameters on experimental results, effectively reducing the operation amount of software, reducing the time consumption of single experiment and shortening the period of acquiring the optimal scheme.
Further, the specific steps in step S2 include:
s21, setting the manufacturing materials of the crucible as pyrolytic boron nitride, wherein the material parameters of the crucible are as follows: surface emissivity of 0.9, thermal conductivity of 50W/(mK);
s22, setting manufacturing materials of the heating wire and the heat shielding layer to be tantalum metal, wherein material parameters of the heating wire and the heat shielding layer are set as follows: the surface emissivity is 0.95;
s23, setting the material parameters of the water-cooled wall as follows: the heat transfer coefficient was 1000W/(m.K).
The influence of redundant material parameters on experimental results is further reduced, the operation amount of software is further reduced, the time consumption of single experiment is further reduced, and the period for obtaining the optimal scheme is further shortened.
Further, the heat transfer types include solid heat transfer and surface radiation heat transfer;
the specific steps in the step S3 include:
s31, setting the heat transfer type between the crucible and the heating wire as solid heat transfer;
s32, setting the heat transfer types among the inner surface of the crucible, the outer surface of the crucible, the surface of the heating wire, the surface of the heat shielding layer and the surface of the water cooling wall as surface radiation heat transfer.
And various physical fields existing in the source furnace during operation are accurately set, so that the accuracy of experimental results is ensured.
Further, the specific steps in step S4 include:
s41, setting the temperature condition as follows: the initial temperature inside is 300K, the temperature of the heating wire in the upper temperature zone is 1100K, the temperature of the heating wire in the lower temperature zone is 1000K, and the external temperature is 300K constantly.
Further, the specific steps in step S5 include:
s51, dividing the two-dimensional axisymmetric simplified model into a plurality of grids;
s52, respectively calculating the temperature of each grid to obtain the thermal field distribution image.
Further, the step S5 further includes the steps of:
s6, setting the thermal convection coefficient of the upper surface and the lower surface of the source furnace to be 4W/(m.K).
In a second aspect, the present invention also provides a source furnace thermal field distribution analysis device, including:
the construction module is used for constructing a two-dimensional axisymmetric simplified model according to the structural parameters of each part in the source furnace;
the first setting module is used for importing the two-dimensional axisymmetric simplified model into COMSOL software and setting material parameters according to manufacturing materials of the components;
a second setting module for setting a heat transfer type of each of the components;
the third setting module is used for setting temperature conditions;
and the calculation module is used for calculating and analyzing to obtain the thermal field distribution image of the source furnace.
And a simplified two-dimensional model is constructed based on key parts of a source furnace object, and key parameter simulation thermal field analysis experiments are set, so that accurate experimental results are obtained quickly and efficiently, the resource waste in the experimental process is greatly reduced, and the experimental cost is effectively reduced.
In a third aspect, the invention provides an electronic device comprising a processor and a memory storing computer readable instructions which, when executed by the processor, perform steps as in the source furnace thermal field distribution analysis method described above.
In a fourth aspect, the present invention provides a storage medium having stored thereon a computer program which, when executed by a processor, performs steps as in the source furnace thermal field distribution analysis method described above.
From the above, the method constructs the corresponding two-dimensional axisymmetric simplified model based on the real structure of the source furnace, and simulates the thermal field distribution of the source furnace under various conditions by setting relevant parameters through COMSOL, so that experiments are not needed in reality, the resource waste is greatly reduced, and the experiment cost is reduced.
Drawings
Fig. 1 is a flowchart of a source furnace thermal field distribution analysis method according to an embodiment of the present application.
FIG. 2 is a schematic diagram of a two-dimensional axisymmetric simplified model in an embodiment of the present application.
Fig. 3 is a schematic diagram of a two-dimensional axisymmetric simplified model according to an embodiment of the present application after being split into multiple grids.
Fig. 4 is a thermal field distribution image of a source furnace before a thermal convection coefficient is set for the upper and lower surfaces of the source furnace in the embodiment of the present application.
Fig. 5 is a temperature change curve of the source furnace before the thermal convection coefficient is set for the upper and lower surfaces of the source furnace in the embodiment of the present application.
Fig. 6 is a thermal field distribution image of a source furnace after setting thermal convection coefficients for the upper and lower surfaces of the source furnace in the embodiment of the present application.
Fig. 7 is a temperature change curve of the source furnace after setting the thermal convection coefficients for the upper and lower surfaces of the source furnace in the embodiment of the present application.
Fig. 8 is a schematic structural diagram of a source furnace thermal field distribution analysis device according to an embodiment of the present application.
Fig. 9 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments. The components of the embodiments of the present application, which are generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present application, as provided in the accompanying drawings, is not intended to limit the scope of the application, as claimed, but is merely representative of selected embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present application without making any inventive effort, are intended to be within the scope of the present application.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures. Meanwhile, in the description of the present application, the terms "first", "second", and the like are used only to distinguish the description, and are not to be construed as indicating or implying relative importance.
In order to obtain experimental data consistent with the real situation, people often build a three-dimensional model according to a real object, however, when the real object structure is too complex, a great deal of time and labor are required to build the three-dimensional model, so that the implementation process is difficult and heavy, and the implementation cost is seriously increased; meanwhile, when a complex three-dimensional model is subjected to simulation experiments, more complex parameter setting and analysis operation are often involved, and the period for obtaining an optimal scheme is longer as the single experiment is longer.
In certain preferred embodiments, and with reference to fig. 1 and 2, a method of analyzing a thermal field profile of a source furnace, comprises the steps of:
s1, establishing a two-dimensional axisymmetric simplified model according to structural parameters of each part in a source furnace;
s2, importing the two-dimensional axisymmetric simplified model into COMSOL software, and setting material parameters according to manufacturing materials of all the components;
s3, setting heat transfer types of all the components;
s4, setting temperature conditions;
s5, calculating and analyzing to obtain a thermal field distribution image of the source furnace.
In the embodiment, a two-dimensional axisymmetric simplified model is built on the longitudinal section of the source furnace, and the two-dimensional model can accurately show the position relationship and the connection relationship between all the components in the source furnace only by using simple lines.
After the two-dimensional axisymmetric simplified model is input into COMSOL software, material parameters and heat transfer types are set for each component in the software (namely, real material parameters and real heat transfer types are defined for cross section lines corresponding to each component, so that the two-dimensional axisymmetric simplified model is consistent with a real object, and the accuracy of follow-up experimental data is guaranteed); finally, for the analysis experiment of the source furnace thermal field distribution, multiple physical fields generally exist, and in this embodiment, the simulation experiment is required to be performed under the same temperature condition by placing multiple physical fields, so that the problem that the error is large due to the fact that only a single physical field is considered is avoided, and the experimental data can be ensured to be more true.
The analysis experiment of the source furnace thermal field distribution includes taking into consideration the influence of the crucible shape, the heating wire position distribution and the like on the source furnace thermal field distribution, and a user can more easily adjust the crucible shape and the heating wire position distribution by using a two-dimensional axisymmetric simplified model.
In certain embodiments, referring to fig. 2, the components include: the device comprises a crucible, a heating wire, a heat shielding layer and a water cooling wall, wherein the water cooling wall is positioned at the outermost layer of the two-dimensional axisymmetric simplified model;
the specific steps in the step S1 comprise:
s11, setting structural parameters of the crucible as follows: the outer diameter is 19.5mm, the thickness is 0.6mm, the length of the straight cylinder section is 106mm, and the radius of the pot opening is 9mm;
s12, setting the structural parameters of the heating wire as follows: the thickness is 0.8mm, the length of the heating wire in the lower temperature zone is 76mm, and the length of the heating wire in the upper temperature zone is 32.5mm (the heating wire in the upper temperature zone is the heating wire arranged near the top of the source furnace, the heating wire in the lower temperature zone is the heating wire arranged near the bottom of the source furnace, and different temperature zones can be formed under different heating temperatures due to different setting positions of the heating wire);
s13, setting structural parameters of the heat shielding layer as follows: the distance between the heating wire and the heating wire is 3mm; the heat shielding layer comprises three layers, wherein the thickness of each layer is 0.1mm, and the interval between any two adjacent layers is 0.1-mm-0.2 mm;
s14, setting structural parameters of the water-cooled wall as follows: the distance from the symmetry axis of the two-dimensional axisymmetric simplified model was 35mm.
In practical application, the arrangement of the crucible, the heating wire, the heat shielding layer and the water cooling wall has larger influence on the thermal field distribution of the source furnace, the embodiment extracts key components in the source furnace to be built into a two-dimensional axisymmetric simplified model, and sets key structural parameters of each component, only the influence of key structural parameters of key components on the thermal field distribution of the source furnace is studied, other irrelevant or less influenced components and structural parameters are eliminated, and on the premise of ensuring that the real situation is adequately reflected, the influence of redundant components and structural parameters on experimental results is reduced, the operation amount of software is effectively reduced, the time consumption of single experiment is reduced, and the period of obtaining an optimal scheme is shortened.
In certain embodiments, the specific steps in step S2 include:
s21, setting manufacturing materials of a crucible as pyrolytic boron nitride, and setting material parameters of the crucible as follows: surface emissivity of 0.9, thermal conductivity of 50W/(mK);
s22, setting manufacturing materials of the heating wire and the heat shielding layer as tantalum metal, and setting material parameters of the heating wire and the heat shielding layer as: the surface emissivity is 0.95;
s23, setting the material parameters of the water-cooled wall as follows: the heat transfer coefficient was 1000W/(m.K).
In the embodiment, key material parameters are set for key components in the source furnace, only the influence of key material parameters of key components on the thermal field distribution of the source furnace is studied, other irrelevant or less influenced material parameters are removed, the influence of redundant material parameters on experimental results is further reduced on the premise that the real situation is sufficiently reflected, the software operand is further reduced, the time consumption of single experiment is further reduced, and the period for obtaining an optimal scheme is further shortened.
In certain embodiments, the types of heat transfer include solid heat transfer and surface radiant heat transfer;
the specific steps in the step S3 include:
s31, setting the heat transfer type between the crucible and the heating wire as solid heat transfer;
s32, setting the heat transfer types among the inner surface of the crucible, the outer surface of the crucible, the surface of the heating wire, the surface of the heat shielding layer and the surface of the water cooling wall as surface radiation heat transfer.
In the embodiment, the crucible and the heating wire are mainly heat transfer objects, and a physical field of solid heat transfer is necessarily present based on the property that the crucible and the heating wire are solid; the heat of the heating wire can be transferred in a radiation mode, and the surfaces of all the components can radiate heat outwards to a certain extent after being heated, so that a physical field of surface radiation heat transfer is also necessarily present, multiple physical fields existing in the working process of the source furnace are accurately set, and analysis is performed based on the multiple physical fields, so that the accuracy of experimental results is ensured.
In certain embodiments, the specific steps in step S4 include:
s41, setting the temperature condition as follows: the initial temperature inside is 300K, the temperature of the heating wire in the upper temperature zone is 1100K, the temperature of the heating wire in the lower temperature zone is 1000K, and the external temperature is 300K constantly (the inside refers to the inside of the source furnace, and the outside refers to the outside of the source furnace).
In this embodiment, through can directly set for inside and outside temperature condition in the software, compare in traditional prior art, need not to wait for source stove temperature rise, the experimental mode of simulation has avoided latency, can obtain experimental result more soon, reduces idle time between the experimental step for experimental process is compacter high-efficient.
In certain embodiments, referring to fig. 3, the specific steps in step S5 include:
s51, dividing the two-dimensional axisymmetric simplified model into a plurality of grids;
s52, respectively calculating the temperature of each grid to obtain a thermal field distribution image.
In this embodiment, the two-dimensional axisymmetric simplified model is divided into a plurality of grids and the temperature calculation is performed on each grid separately, so that the temperature of each position of the whole two-dimensional axisymmetric simplified model can be accurately calculated, and compared with the mode of calculating the whole two-dimensional axisymmetric simplified model, the method can effectively reduce the overall temperature error (if the temperature of each grid has an error, but the overall effect of the local error on the whole is smaller due to the fact that the whole is divided into a plurality of grids), and greatly improve the accuracy of experimental results.
It should be noted that, the temperature calculation of each grid is automatically performed by the COMSOL software, which is not described herein.
In certain embodiments, referring to fig. 4, 5, 6 and 7, step S5 is preceded by the further step of:
s6, setting the thermal convection coefficient of the upper surface and the lower surface of the source furnace to be 4W/(m.K).
In the embodiment, considering that certain heat loss generally exists at the upper surface and the lower surface of the source furnace, the experimental conditions are more in line with objective and real conditions by setting the heat convection coefficients for the upper surface and the lower surface of the source furnace, and the accuracy of experimental results is further improved.
It should be noted that, according to the experimental verification, the temperature change on the axis of the crucible (the axis of the crucible refers to the central axis parallel to the height direction of the crucible) is the most representative of the temperature distribution inside the crucible, so that the temperature change on the axis of the crucible (referring to fig. 5 and 7, the starting point of the axis of the crucible is the bottom surface of the crucible, the end point of the axis of the crucible is the top surface of the crucible, the abscissa in the drawing is the length of the axis of the crucible, the ordinate is the temperature, the temperature values corresponding to the positions in the axis direction of the crucible are reflected, and the temperature values corresponding to the positions in the crucible can also be understood to represent the temperature distribution inside the crucible), and after the thermal convection coefficient is further set, the temperature at the crucible port is found to be greatly reduced, so that the thermal convection coefficient at the upper surface and the lower surface of the source furnace is determined to have a great influence on the thermal field distribution of the source furnace, and the experimental result accuracy can be further improved by setting the thermal convection coefficient.
Referring to fig. 8, fig. 8 is a source furnace thermal field distribution analysis device according to some embodiments of the present application, the source furnace thermal field distribution analysis device is integrated in a back-end control apparatus of the source furnace thermal field distribution analysis device in a form of a computer program, and the source furnace thermal field distribution analysis device includes:
the construction module 100 is used for constructing a two-dimensional axisymmetric simplified model according to the structural parameters of each component in the source furnace;
the first setting module 200 is used for importing the two-dimensional axisymmetric simplified model into COMSOL software and setting material parameters according to the manufacturing materials of each component;
a second setting module 300 for setting a heat transfer type of each component;
a third setting module 400 for setting a temperature condition;
the calculation module 500 is used for calculating and analyzing to obtain a thermal field distribution image of the source furnace.
In certain embodiments, the component comprises: the device comprises a crucible, a heating wire, a heat shielding layer and a water cooling wall, wherein the water cooling wall is positioned at the outermost layer of the two-dimensional axisymmetric simplified model;
the first setting module 200 is executed when it is used to build a two-dimensional axisymmetric simplified model according to the structural parameters of each component in the source furnace:
s11, setting structural parameters of the crucible as follows: the outer diameter is 19.5mm, the thickness is 0.6mm, the length of the straight cylinder section is 106mm, and the radius of the pot opening is 9mm;
s12, setting the structural parameters of the heating wire as follows: the thickness is 0.8mm, the length of the heating wire in the lower temperature zone is 76mm, and the length of the heating wire in the upper temperature zone is 32.5mm;
s13, setting structural parameters of the heat shielding layer as follows: the distance between the heating wire and the heating wire is 3mm; the heat shielding layer comprises three layers, wherein the thickness of each layer is 0.1mm, and the interval between any two adjacent layers is 0.1-mm-0.2 mm;
s14, setting structural parameters of the water-cooled wall as follows: the distance from the symmetry axis of the two-dimensional axisymmetric simplified model was 35mm.
In some embodiments, the first setting module 200 is executed when it is used to import a two-dimensional axisymmetric simplified model into the COMSOL software, and set material parameters according to the manufacturing materials of the respective components:
s21, setting manufacturing materials of a crucible as pyrolytic boron nitride, and setting material parameters of the crucible as follows: surface emissivity of 0.9, thermal conductivity of 50W/(mK);
s22, setting manufacturing materials of the heating wire and the heat shielding layer as tantalum metal, and setting material parameters of the heating wire and the heat shielding layer as: the surface emissivity is 0.95;
s23, setting the material parameters of the water-cooled wall as follows: the heat transfer coefficient was 1000W/(m.K).
In certain embodiments, the types of heat transfer include solid heat transfer and surface radiant heat transfer;
the second setting module 300 performs when it is used to set the heat transfer type of each component:
s31, setting the heat transfer type between the crucible and the heating wire as solid heat transfer;
s32, setting the heat transfer types among the inner surface of the crucible, the outer surface of the crucible, the surface of the heating wire, the surface of the heat shielding layer and the surface of the water cooling wall as surface radiation heat transfer.
In certain embodiments, the third setting module 400 performs when it is used to set a temperature condition:
s41, setting the temperature condition as follows: the initial temperature inside is 300K, the temperature of the heating wire in the upper temperature zone is 1100K, the temperature of the heating wire in the lower temperature zone is 1000K, and the external temperature is 300K.
In some embodiments, the calculation module 500 performs the calculation and analysis when it is used to obtain the thermal field distribution image of the source furnace:
s51, dividing the two-dimensional axisymmetric simplified model into a plurality of grids;
s52, respectively calculating the temperature of each grid to obtain a thermal field distribution image.
In certain embodiments, the calculation module 500 performs the steps of:
s6, setting the thermal convection coefficient of the upper surface and the lower surface of the source furnace to be 4W/(m.K).
Referring to fig. 9, fig. 9 is a schematic structural diagram of an electronic device according to an embodiment of the present application, where the electronic device includes: processor 1301 and memory 1302, processor 1301 and memory 1302 being interconnected and in communication with each other by a communication bus 1303 and/or other form of connection mechanism (not shown), memory 1302 storing computer readable instructions executable by processor 1301, which when the electronic device is running, processor 1301 executes the computer readable instructions to perform the source furnace thermal field distribution analysis method in any of the alternative implementations of the embodiments of the first aspect described above to implement the following functions: establishing a two-dimensional axisymmetric simplified model according to structural parameters of each part in the source furnace; importing the two-dimensional axisymmetric simplified model into COMSOL software, and setting material parameters according to manufacturing materials of each component; setting the heat transfer type of each component; setting temperature conditions; and calculating and analyzing to obtain a thermal field distribution image of the source furnace.
An embodiment of the present application provides a storage medium having a computer program stored thereon, which when executed by a processor, performs a method for analyzing a thermal field distribution of a source furnace in any optional implementation manner of the foregoing first aspect, so as to implement the following functions: establishing a two-dimensional axisymmetric simplified model according to structural parameters of each part in the source furnace; importing the two-dimensional axisymmetric simplified model into COMSOL software, and setting material parameters according to manufacturing materials of each component; setting the heat transfer type of each component; setting temperature conditions; and calculating and analyzing to obtain a thermal field distribution image of the source furnace.
The storage medium may be implemented by any type of volatile or nonvolatile Memory device or combination thereof, such as static random access Memory (Static Random Access Memory, SRAM), electrically erasable Programmable Read-Only Memory (Electrically Erasable Programmable Read-Only Memory, EEPROM), erasable Programmable Read-Only Memory (Erasable Programmable Read Only Memory, EPROM), programmable Read-Only Memory (PROM), read-Only Memory (ROM), magnetic Memory, flash Memory, magnetic disk, or optical disk.
In the embodiments provided in the present application, it should be understood that the disclosed apparatus and method may be implemented in other manners. The above-described apparatus embodiments are merely illustrative, for example, the division of the units is merely a logical function division, and there may be other manners of division in actual implementation, and for example, multiple units or components may be combined or integrated into another system, or some features may be omitted, or not performed. Alternatively, the coupling or direct coupling or communication connection shown or discussed with each other may be through some communication interface, device or unit indirect coupling or communication connection, which may be in electrical, mechanical or other form.
Further, the units described as separate units may or may not be physically separate, and units displayed as units may or may not be physical units, may be located in one place, or may be distributed over a plurality of network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
Furthermore, functional modules in various embodiments of the present application may be integrated together to form a single portion, or each module may exist alone, or two or more modules may be integrated to form a single portion.
In this document, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions.
The foregoing is merely exemplary embodiments of the present application and is not intended to limit the scope of the present application, and various modifications and variations may be suggested to one skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.
Claims (10)
1. The method for analyzing the thermal field distribution of the source furnace is characterized by comprising the following steps:
s1, establishing a two-dimensional axisymmetric simplified model according to structural parameters of each part in a source furnace;
s2, importing the two-dimensional axisymmetric simplified model into COMSOL software, and setting material parameters according to manufacturing materials of the components;
s3, setting the heat transfer type of each component;
s4, setting temperature conditions;
s5, calculating and analyzing to obtain a thermal field distribution image of the source furnace.
2. The source furnace thermal field distribution analysis method according to claim 1, wherein the component comprises: the device comprises a crucible, a heating wire, a heat shielding layer and a water cooling wall, wherein the water cooling wall is positioned at the outermost layer of the two-dimensional axisymmetric simplified model;
the specific steps in the step S1 comprise:
s11, setting structural parameters of the crucible as follows: the outer diameter is 19.5mm, the thickness is 0.6mm, the length of the straight cylinder section is 106mm, and the radius of the pot opening is 9mm;
s12, setting the structural parameters of the heating wire as follows: the thickness is 0.8mm, the length of the heating wire in the lower temperature zone is 76mm, and the length of the heating wire in the upper temperature zone is 32.5mm;
s13, setting structural parameters of the heat shielding layer as follows: the distance between the heating wire and the heating wire is 3mm; the heat shielding layer comprises three layers, wherein the thickness of each layer is 0.1mm, and the interval between any two adjacent layers is 0.1-mm-0.2 mm;
s14, setting the structural parameters of the water-cooled wall as follows: the distance from the symmetry axis of the two-dimensional axisymmetric simplified model is 35mm.
3. The method according to claim 2, wherein the specific steps in step S2 include:
s21, setting the manufacturing materials of the crucible as pyrolytic boron nitride, wherein the material parameters of the crucible are as follows: surface emissivity of 0.9, thermal conductivity of 50W/(mK);
s22, setting manufacturing materials of the heating wire and the heat shielding layer to be tantalum metal, wherein material parameters of the heating wire and the heat shielding layer are set as follows: the surface emissivity is 0.95;
s23, setting the material parameters of the water-cooled wall as follows: the heat transfer coefficient was 1000W/(m.K).
4. The source furnace thermal field distribution analysis method according to claim 2, wherein the heat transfer type includes solid heat transfer and surface radiation heat transfer;
the specific steps in the step S3 include:
s31, setting the heat transfer type between the crucible and the heating wire as solid heat transfer;
s32, setting the heat transfer types among the inner surface of the crucible, the outer surface of the crucible, the surface of the heating wire, the surface of the heat shielding layer and the surface of the water cooling wall as surface radiation heat transfer.
5. The method according to claim 2, wherein the specific steps in step S4 include:
s41, setting the temperature condition as follows: the initial temperature inside is 300K, the temperature of the heating wire in the upper temperature zone is 1100K, the temperature of the heating wire in the lower temperature zone is 1000K, and the external temperature is 300K constantly.
6. The method according to claim 1, wherein the specific steps in step S5 include:
s51, dividing the two-dimensional axisymmetric simplified model into a plurality of grids;
s52, respectively calculating the temperature of each grid to obtain the thermal field distribution image.
7. The method for analyzing thermal field distribution of a source furnace according to claim 1, further comprising the step of, before step S5:
s6, setting the thermal convection coefficient of the upper surface and the lower surface of the source furnace to be 4W/(m.K).
8. A source furnace thermal field distribution analysis device, characterized in that the source furnace thermal field distribution analysis device comprises:
the construction module is used for constructing a two-dimensional axisymmetric simplified model according to the structural parameters of each part in the source furnace;
the first setting module is used for importing the two-dimensional axisymmetric simplified model into COMSOL software and setting material parameters according to manufacturing materials of the components;
a second setting module for setting a heat transfer type of each of the components;
the third setting module is used for setting temperature conditions;
and the calculation module is used for calculating and analyzing to obtain the thermal field distribution image of the source furnace.
9. An electronic device comprising a processor and a memory storing computer readable instructions that, when executed by the processor, perform the steps in the source furnace thermal field distribution analysis method of any one of claims 1-7.
10. A storage medium having stored thereon a computer program which, when executed by a processor, performs the steps of the source furnace thermal field distribution analysis method according to any one of claims 1-7.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211348133.9A CN116029087A (en) | 2022-10-31 | 2022-10-31 | Source furnace thermal field distribution analysis method and device, electronic equipment and storage medium |
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| CN202211348133.9A CN116029087A (en) | 2022-10-31 | 2022-10-31 | Source furnace thermal field distribution analysis method and device, electronic equipment and storage medium |
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| CN116306058A (en) * | 2023-05-26 | 2023-06-23 | 季华实验室 | Method and device for analyzing influence of thermal stress of crucible, electronic equipment and storage medium |
| CN116306058B (en) * | 2023-05-26 | 2023-08-15 | 季华实验室 | Method and device for analyzing influence of thermal stress of crucible, electronic equipment and storage medium |
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