CN116013910A - 半导体装置及其制造方法 - Google Patents

半导体装置及其制造方法 Download PDF

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CN116013910A
CN116013910A CN202210223013.XA CN202210223013A CN116013910A CN 116013910 A CN116013910 A CN 116013910A CN 202210223013 A CN202210223013 A CN 202210223013A CN 116013910 A CN116013910 A CN 116013910A
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substrate
sealing resin
semiconductor device
semiconductor chip
speckle pattern
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佐藤克哉
松尾圭一郎
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Toshiba Corp
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Abstract

本发明的课题在于提供使产生于密封树脂的裂纹可视化，并能够进行客观的评价的半导体装置及其制造方法。本发明的解决课题的手段在于，半导体装置具备：基板；半导体芯片，被设于所述基板上；密封树脂，将所述基板以及所述半导体芯片覆盖；以及斑点图案，被设于所述基板以及所述半导体芯片中的至少一个与所述密封树脂的界面。

Description

半导体装置及其制造方法
技术领域
本发明的实施方式涉及半导体装置及其制造方法。
背景技术
例如功率半导体模块为了确保绝缘性，用绝缘性树脂将模块内部密封。若在该密封树脂产生裂纹(crack)，则无法保证绝缘性而可能成为不良的重要因素。在试验时、检查时，通过目视观察对密封树脂的裂纹的有无进行判断，判断基准容易根据作业者而不同。
现有技术文献
专利文献
专利文献1：日本特开2007-242973号公报
发明内容
发明将要解决的课题
本发明的实施方式提供使产生于密封树脂的裂纹可视化、并能够进行客观的评价的半导体装置及其制造方法。
用于解决课题的手段
根据本发明的实施方式，半导体装置具备：基板；半导体芯片，被设于所述基板上；密封树脂，将所述基板以及所述半导体芯片覆盖；以及斑点图案，被设于所述基板以及所述半导体芯片中的至少一个与所述密封树脂的界面。
附图说明
图1是实施方式的半导体装置的示意剖面图。
图2(a)是检查证实了实施方式的效果的实验例中使用的试料的示意剖面图，(b)是表示斑点图案
的一个例子的图像。
图3(a)～(c)是将上述试料中的伤痕可视化后的图像。
附图标记说明
1半导体装置，10壳体，20基板，30半导体芯片，21、22、71导电部件，50密封树脂，60斑点图案
具体实施方式
以下，参照附图对实施方式进行说明。另外，在各附图中，对相同的构成标注相同的附图标记。
图1是实施方式的半导体装置1的示意剖面图。
半导体装置1具备壳体10、基板20、半导体芯片30、导电部件21、22、71和密封树脂50。
壳体10具有基部11和侧壁部12。基部11以及侧壁部12例如由绝缘性的树脂材料构成。基板20、半导体芯片30、导电部件21、22、71以及密封树脂50被配置于被基部11与侧壁部12包围而成的壳体10内的空间。
基板20被配置于基部11上。基板20的背面通过接合部件42与基部11的上表面接合。基板20例如是绝缘性的树脂基板或者陶瓷基板。在基板20的表面设有导电部件21，在基板20的背面设有导电部件22。基板20的表面的导电部件21作为与半导体芯片30电连接的布线发挥功能。基板20的背面的导电部件22作为相对于基部11的接合部发挥功能。
半导体芯片30被搭载于基板20上。例如多个半导体芯片30被搭载于基板20上。半导体芯片30的背面通过接合部件41与基板20接合。在半导体芯片30的表面设有电极焊盘，该电极焊盘通过引线W与基板20的表面的导电部件21电连接。
在壳体10内设有与基板20的表面的导电部件21电连接的导电部件71。导电部件71的一部分71a位于壳体10之外，并作为外部连接端子发挥功能。
密封树脂50被设于壳体10内，并将壳体10的内表面(基部11的表面以及侧壁部12的侧壁面)、基板20、半导体芯片30、引线W、导电部件21、22以及接合部件41、42覆盖。此外，密封树脂50将位于导电部件71的壳体10内的部分覆盖。密封树脂50例如具有相对于可见光的透光性。作为密封树脂50，例如能够使用有机硅树脂。
半导体装置1还具备斑点图案60。斑点图案60被设于壳体10的内表面与密封树脂50的界面、基板20与密封树脂50的界面、半导体芯片30与密封树脂50的界面以及导电部件21、22、71与密封树脂50的界面。另外，斑点图案60只要被设于壳体10的内表面、基板20、半导体芯片30、以及导电部件21、22、71中的至少一个与密封树脂50的界面即可。斑点图案60是不同颜色、相同颜色的浓淡混合而成的图案，并在颜色、亮度中包含不均。斑点图案60由电绝缘性的材料构成。
如后述那样，根据实施方式的半导体装置1，通过图像检查隔着密封树脂50对斑点图案60进行观察，从而容易对产生于密封树脂50的裂纹的有无进行辨别。
接下来，对实施方式的半导体装置1的制造方法进行说明。
在基部11上经由接合部件42来搭载基板20。在基板20上经由接合部件41搭载半导体芯片30。通过引线W将半导体芯片30的表面的电极焊盘与基板20的表面的导电部件21连接。在壳体10内配置与基板20的表面的导电部件21连接的例如铜的板状的导电部件71。
在壳体10的内表面、基板20、半导体芯片30、以及导电部件21、22、71中的至少一个形成斑点图案60。例如使压缩后的空气、氮与斑点图案60的材料一起在壳体10内分散并进行涂覆。或者，通过静电力，使斑点图案60的材料在壳体10内分散并进行涂覆。例如斑点图案60将壳体10的内表面、基板20、半导体芯片30以及导电部件21、22、71覆盖。
在壳体10内形成将壳体10的内表面以及壳体10内的部件(基板20、半导体芯片30、导电部件21、22、71、引线W、接合部件41、42以及斑点图案60)覆盖的密封树脂50。密封树脂50例如在凝胶状或者液状的状态下被供给到壳体10内，然后通过热等被固化。
在形成了斑点图案60之后，形成密封树脂50。因此，斑点图案60不位于密封树脂50的表面、内部，而位于壳体10的内表面与密封树脂50的界面、壳体10内的部件(基板2、半导体芯片30、导电部件21、22、71、引线W以及接合部件41、42)与密封树脂50的界面。
从壳体10的外侧例如通过相机隔着密封树脂50对斑点图案60进行拍摄，隔着密封树脂50取得多个斑点图案60的图像。例如在出厂时、试验前、检查时、试验后等时刻，分别隔着密封树脂50取得斑点图案60的图像。
然后，对所取得的斑点图案60在多个图像间的相关值进行计算。相关值例如是斑点图案60的亮度分布的相关值。如果在密封树脂50产生裂纹，则来自位于裂纹之下的斑点图案60的反射光被裂纹散射，与没有裂纹的情况相比，斑点图案60的图像信息(例如亮度)变化。对在密封树脂50产生裂纹之前取得的隔着密封树脂50的斑点图案60的图像与在密封树脂50产生裂纹之后取得的隔着密封树脂50的斑点图案60的图像进行比较，对这两个图像间的例如亮度分布的相关值进行计算，通过图像处理，在所取得的图像中重叠地显示。例如用与不存在亮度的变化的像素不同的颜色显示存在比较对象的图像间的亮度的变化的像素。由此，产生于密封树脂50的裂纹被可视化，能够进行不取决于作业者的客观的裂纹有无的评价。
接下来，对检查证实了本实施方式的效果的实验例进行说明。
如图2(a)所示，在玻璃培养皿80的背面81喷雾涂覆白色涂料，之后，喷雾涂覆了黑色涂料。由此，在玻璃培养皿80的背面81形成了图2(b)所示的斑点图案60。
在形成了斑点图案60之后，作为密封树脂50，将具有相对于可见光的透光性的凝胶状的有机硅树脂向培养皿80内供给。向培养皿80内供给的凝胶状有机硅树脂的质量为7.7g。之后，通过使用了加热板(hot plate)的加热，使密封树脂(有机硅树脂)50固化。加热温度为80℃，加热时间为1.5小时。
用划线针在固化后的密封树脂50的表面轻轻地划线，在密封树脂50的表面留下了三道线状的伤痕。通过利用相机的拍摄，取得了在留下伤痕之前的隔着密封树脂50的斑点图案60的图像(基准图像)、留下了第一道伤痕之后的隔着密封树脂50的斑点图案60的图像、留下了第二道伤痕之后的隔着密封树脂50的斑点图案60的图像、以及留下了第三道伤痕后的隔着密封树脂50的斑点图案60的图像。而且，对在留下伤痕之前的基准图像与在留下了伤痕之后的各图像的亮度分布的相关值进行计算，通过图像处理，在留下了伤痕之后的各图像中将相对于基准图像的亮度分布的变化可视化。
图3(a)是在留下了第一道伤痕之后的隔着密封树脂50的斑点图案60的图像中将相对于基准图像的亮度分布的变化可视化的图像。
图3(b)是在留下了第二道伤痕之后的隔着密封树脂50的斑点图案60的图像中将相对于基准图像的亮度分布的变化可视化的图像。
图3(c)是在留下了第三道伤痕之后的隔着密封树脂50的斑点图案60的图像中将相对于基准图像的亮度分布的变化可视化的图像。
通过图3(a)～(c)的图像，相对于不存在伤痕的区域的斑点图案的亮度从基准图像不能观察到变化，确认了在密封树脂留下了伤痕的区域的斑点图案的亮度相对于不存在伤痕时的亮度而发生变化。例如，在图像中用与不存在亮度的变化的部分不同的颜色来显示存在亮度的变化的部分，从而容易进行产生于密封树脂50的裂纹的有无的辨别。
隔着密封树脂被观察的斑点图案与亮度色度均匀的图案相比，基于产生于密封树脂的裂纹的有无的图像信息(例如亮度)的变化较大，更容易基于其变化量使裂纹可视化。例如作为斑点图案，能够使用与壳体10、基板20、半导体芯片30、以及导电部件21、22、71中的至少一个颜色不同的一种材料。
或者，作为斑点图案，能够使用由相互颜色不同的两种材料构成的图案。例如两种材料中的一方是黑色，另一方是白色。例如作为黑色的材料能够使用碳黑，作为白色的材料能够使用氧化钛。碳黑以及氧化钛的各个例如能够作为溶于了水等而成的溶液涂覆于壳体10内。如果在使黑色的材料与白色的材料混合之后涂覆于壳体10内，则容易成为黑色与白色混合而成的灰色的均匀的斑点图案。因而，例如在将黑色的材料涂覆于壳体10内之后，将白色的材料涂覆于壳体10内而形成斑点图案。或者，在将白色的材料涂覆于壳体10内之后，将黑色的材料涂覆于壳体10内而形成斑点图案。
构成斑点图案的单位区域(与邻接区域能够区分颜色、亮度的区域)的尺寸(或者直径)优选比相机的像素分辨率，、并且比产生于密封树脂的裂纹的宽度(与裂纹的延伸方向正交的方向的宽度)小。例如构成斑点图案的单位区域的尺寸(或者直径)优选为基于壳体10内的密封树脂50的密封区域的尺寸的1/2000以上且20/2000以下。例如如果将基于在壳体10内的密封树脂50的密封区域的尺寸设为100mm见方，则构成斑点图案的单位区域的尺寸(或者直径)优选为0.05mm以上且1.00mm以下。
作为隔着密封树脂对斑点图案进行观察的波长，不限于可见光。例如也可以使用X射线来取得隔着密封树脂的斑点图案的图像。
以上进行了说明的斑点图案60也能够应用于不存在壳体10的情况。
对本发明的几个实施方式进行了说明，但这些实施方式是作为例子提示的，并非意图限定发明的范围。这些新的实施方式能够以其他各种各样的方式实施，在不脱离发明的主旨的范围内能够进行各种各样的省略、替换、变更等。这些实施方式及其变形被包含在发明的范围、主旨中，并且被包含在权利要求书所记载的发明和其等价的范围中。

Claims (12)

1.一种半导体装置，其中，具备：
基板；
半导体芯片，被设于所述基板上；
密封树脂，将所述基板以及所述半导体芯片覆盖；以及
斑点图案，被设于所述基板以及所述半导体芯片中的至少一个与所述密封树脂的界面。
2.根据权利要求1所述的半导体装置，其中，
所述斑点图案由与所述基板以及所述半导体芯片中的至少一个颜色不同的一种材料构成。
3.根据权利要求1所述的半导体装置，其中，
所述斑点图案由相互颜色不同的两种材料构成。
4.根据权利要求3所述的半导体装置，其中，
所述两种材料中的一方为黑色，另一方为白色。
5.根据权利要求1所述的半导体装置，其中，
所述密封树脂具有相对于可见光的透光性。
6.根据权利要求1所述的半导体装置，其中，还具备：
壳体，配置有所述基板；以及
导电部件，被设于所述基板上，并与所述半导体芯片电连接，
所述密封树脂被设于所述壳体内，并将所述壳体的内表面、所述基板、所述半导体芯片以及所述导电部件覆盖，
所述斑点图案还被设于所述壳体的内表面与所述密封树脂的界面、以及所述导电部件与所述密封树脂的界面。
7.一种半导体装置的制造方法，其中，具备如下工序：
在壳体内配置基板和被设于所述基板上的半导体芯片的工序；
在所述壳体的内表面、所述基板、以及所述半导体芯片中的至少一个形成斑点图案的工序；
在所述壳体内形成将所述壳体的内表面、所述基板、所述半导体芯片、以及所述斑点图案覆盖的密封树脂的工序；
隔着所述密封树脂取得多个所述斑点图案的图像的工序；以及
对所述斑点图案在所述多个图像间的相关值进行计算的工序。
8.根据权利要求7所述的半导体装置的制造方法，其中，
所述相关值是所述斑点图案的亮度分布的相关值。
9.根据权利要求7所述的半导体装置的制造方法，其中，
所述斑点图案由与所述基板以及所述半导体芯片中的至少一个颜色不同的一种材料构成。
10.根据权利要求7所述的半导体装置的制造方法，其中，
所述斑点图案由相互颜色不同的两种材料构成。
11.根据权利要求10所述的半导体装置的制造方法，其中，
所述两种材料中的一方为黑色，另一方为白色。
12.根据权利要求7所述的半导体装置的制造方法，其中，
所述密封树脂具有相对于可见光的透光性。
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