CN116000724A

CN116000724A - Polishing device

Info

Publication number: CN116000724A
Application number: CN202310107156.9A
Authority: CN
Inventors: 王宇; 余建琳
Original assignee: Meishan Boya New Material Co ltd
Current assignee: Meishan Boya New Material Co ltd
Priority date: 2022-09-27
Filing date: 2022-09-27
Publication date: 2023-04-25
Also published as: CN115284097A; CN115945982A; CN115284097B; CN116100398A

Abstract

The embodiment of the specification provides a burnishing device, relates to grinding technical field, and burnishing device includes: the clamp is used for adsorbing the workpiece; the driving mechanism is used for driving the clamp to move; the polishing disk is used for polishing a workpiece; the polishing disc comprises a base, a first elastic layer and a second elastic layer, wherein the first elastic layer is arranged between the base and the second elastic layer, and the ratio of the elastic modulus of the first elastic layer along the direction vertical to the polishing surface to the elastic modulus of the second elastic layer along the direction vertical to the polishing surface is 11:17-1:2. The polishing device can improve the polishing efficiency of the ultra-thin glass and reduce the damage of the ultra-thin glass during polishing.

Description

Polishing device

Description of the division

The present application is a divisional application filed in China with the application number 202211179299.2 and the name of "a polishing device" and with the application date 2022, 09 and 27.

Technical Field

The specification relates to the field of grinding technology, in particular to an ultrathin glass polishing device.

Background

Along with rapid development of technology, some photoelectric products used by people in daily life are increasingly developed to be light and thin and light, and ultrathin glass becomes an important base material due to good heat stability, chemical stability, optical performance and other excellent characteristics. Ultrathin glass belongs to brittle materials, and is extremely easy to break in the precise machining processes of cutting, polishing and the like due to the very low thickness. Therefore, how to achieve precise polishing of the surface of the ultra-thin glass is a widely focused problem in the industry, and it is necessary to provide a polishing device with high efficiency and safety, to improve the polishing efficiency of the ultra-thin glass, and to reduce the damage of the ultra-thin glass.

Disclosure of Invention

One of the embodiments of the present specification provides a polishing apparatus including: the clamp is used for adsorbing the workpiece; the driving mechanism is used for driving the clamp to move; a polishing disk for polishing the workpiece; the polishing disc comprises a base, a first elastic layer and a second elastic layer, wherein the first elastic layer is arranged between the base and the second elastic layer, and the elastic modulus of the first elastic layer is smaller than that of the second elastic layer.

In some embodiments, the ratio of the elastic modulus of the first elastic layer along the direction perpendicular to the polishing surface to the elastic modulus of the second elastic layer along the direction perpendicular to the polishing surface is in the range of 11:17 to 1:2.

In some embodiments, the elastic modulus of the first elastic layer along the direction perpendicular to the polishing surface ranges from 35MPa to 55MPa.

In some embodiments, the elastic modulus of the second elastic layer along the direction perpendicular to the polishing surface ranges from 70MPa to 85MPa.

In some embodiments, when the thickness of the first elastic layer ranges from 15mm to 25mm, the elastic modulus of the first elastic layer ranges from 35MPa to 55MPa.

In some embodiments, the first elastic layer has a modulus of elasticity in a direction perpendicular to the polishing surface that is less than a modulus of elasticity in a direction parallel to the polishing surface.

In some embodiments, the second elastic layer comprises a fibrous structure that is stretchable in a direction parallel to the polishing surface.

In some embodiments, the clamp includes one or more first holes through which negative pressure is provided to the clamp that attracts the workpiece.

In some embodiments, the one or more first holes have a pore size in the range of 0.3mm to 1mm.

In some embodiments, the ratio of the aperture of the one or more first holes to the thickness of the workpiece ranges from 3:1 to 4:1.

In some embodiments, the one or more first holes are uniformly distributed on the adsorption surface of the fixture, and the distance between adjacent first holes ranges from 2mm to 3.5mm.

In some embodiments, at least one of the one or more first apertures comprises a flexible membrane covering the adsorption end of the at least one of the one or more first apertures.

In some embodiments, the clamp further comprises a gas interface, the one or more first holes being in communication with the gas interface.

In some embodiments, the clamp further comprises one or more second holes in communication with one end of the gas storage cavity and a gas storage cavity in communication with the gas interface; and an air quantity adjusting structure is arranged in the air storage cavity.

In some embodiments, the air volume adjusting structure includes a piston and an elastic member connected to the piston, where a preset distance is provided between the piston and one end of the air storage chamber, where the end is in communication with the air interface, when the elastic member is in an initial state.

In some embodiments, the predetermined distance is not less than half the length of the gas storage cavity.

In some embodiments, the one or more second holes are evenly distributed over the suction face of the clamp.

In some embodiments, the clamp includes one or more valves that control the opening and closing of the gas interface.

In some embodiments, the number of valves comprises two.

In some embodiments, the polishing apparatus further comprises a polishing liquid filter screen.

Possible benefits of embodiments of the present description include, but are not limited to: (1) The first elastic layer is additionally arranged between the base of the polishing disk and the second elastic layer, the elastic modulus of the first elastic layer is smaller than that of the second elastic layer, the first elastic layer is easier to deform than the second elastic layer, the second elastic layer is integrally deformed during polishing and cannot generate local deformation displacement, and the workpiece and the second elastic layer can be prevented from being scratched and rubbed independently. (2) The adsorption surface of the clamp is provided with a plurality of first holes, and the distance between every two adjacent first holes is reasonably set, so that the clamp can provide uniform and constant adsorption force when adsorbing a workpiece, and the workpiece is prevented from being damaged. (3) The adsorption surface of the clamp is also provided with a plurality of second holes, and the gas in the gas storage cavity is discharged through the gas quantity adjusting structure, so that positive pressure for releasing the workpiece can be provided, and automatic release of the workpiece can be realized.

Drawings

The present specification will be further elucidated by way of example embodiments, which will be described in detail by means of the accompanying drawings. The embodiments are not limiting, in which like numerals represent like structures, wherein:

FIG. 1 is a schematic view of an exemplary polishing apparatus according to some embodiments of the present disclosure;

FIG. 2 is a schematic view of a portion of the structure of the exemplary polishing apparatus shown in FIG. 1;

figure 3 is a schematic diagram of an exemplary fixture, polishing platen, drive configuration shown in accordance with some embodiments of the present disclosure;

FIG. 4 is a schematic illustration of an exemplary clamp shown in accordance with some embodiments of the present disclosure;

FIG. 5 isbase:Sub>A cross-sectional block diagram of the A-A face of the exemplary clamp shown in FIG. 4;

FIG. 6 is a partial schematic view of an exemplary clip shown according to some embodiments of the present disclosure;

fig. 7 is a schematic view of an exemplary clamp according to further embodiments of the present disclosure.

Reference numerals:

1000 is a polishing device, 100 is a clamp, 110 is an adsorption plate, 111 is a first hole, 112 is a second hole, 120 is a substrate, 121 is a bump, 130 is a gas interface, 131 is a gas channel, 140 is a valve, 141 is a mounting plate, 150 is a workpiece, 160 is a gas storage cavity, 170 is a gas flow regulating structure, 171 is a piston, 172 is an elastic piece;

200 is a polishing disk, 210 is a base, 220 is a first elastic layer, 230 is a second elastic layer;

300 is a driving mechanism, 310 is a polishing arm, 320 is a motor, and 330 is a cylinder;

400 is a frame, 410 is a workbench, and 420 is an operation panel.

Detailed Description

In order to more clearly illustrate the technical solutions of the embodiments of the present specification, the drawings that are required to be used in the description of the embodiments will be briefly described below. It is apparent that the drawings in the following description are only some examples or embodiments of the present specification, and it is possible for those of ordinary skill in the art to apply the present specification to other similar situations according to the drawings without inventive effort.

As used in this specification and the claims, the terms "a," "an," "the," and/or "the" are not specific to a singular, but may include a plurality, unless the context clearly dictates otherwise. In general, the terms "comprises" and "comprising" merely indicate that the steps and elements are explicitly identified, and they do not constitute an exclusive list, as other steps or elements may be included in a method or apparatus.

The embodiments described in this specification are merely illustrative of the principles of the embodiments of this specification. Other variations are possible within the scope of this description. Thus, by way of example, and not limitation, alternative configurations of embodiments of the present specification may be considered as consistent with the teachings of the present specification. Accordingly, the embodiments of the present specification are not limited to only the embodiments explicitly described and depicted in the present specification.

Ultra-thin glass (glass with a diameter to thickness ratio greater than 10) presents a number of challenges in the polishing process. On the one hand, ultra-thin glass, due to its very thin thickness, is often held by the upper plate (i.e. the glass to be processed is held in a disc-shaped station) during grinding and polishing. However, the loading process is generally complicated and time-consuming, resulting in low polishing efficiency, and extremely easy damage to ultra-thin glass during loading and unloading. On the other hand, when grinding and polishing, the ultrathin glass needs to be very attached to the polishing disk, and because the flatness of the ultrathin glass is insufficient, a felt with better elasticity is generally adopted as the polishing disk, so that the attaching degree of the polishing disk and the glass is improved. However, in the polishing process, when the clamp drives the ultra-thin glass to move, the glass may scratch the felt, so that the ultra-thin glass is separated from the clamp, and the glass is damaged or safety accidents are caused.

In order to realize safe centre gripping ultra-thin glass and carry out high-efficient polishing to it, this description embodiment provides an ultra-thin glass's burnishing device, and anchor clamps pass through vacuum adsorption ultra-thin glass, can stabilize the ultra-thin glass of centre gripping, reduce ultra-thin glass damage to can realize ultra-thin glass's quick material loading and unloading, improve polishing efficiency. Further, the polishing disk comprises a base, a first elastic layer and a second elastic layer which are sequentially laminated, and the elastic modulus of the first elastic layer is smaller than that of the second elastic layer. The first elastic layer with smaller elastic modulus is arranged between the base and the second elastic layer, the first elastic layer is easier to deform than the second elastic layer, deformation displacement is firstly generated on the first elastic layer than the second elastic layer in the polishing process of the clamp driving ultrathin glass to move, the second elastic layer is wholly deformed along with the first elastic layer, local deformation displacement cannot be generated on the second elastic layer, and independent scraping and rubbing of glass and the second elastic layer can be avoided.

The polishing apparatus according to the embodiment of the present specification will be described in detail with reference to fig. 1 to 7. It is noted that the following examples are only for the explanation of the present specification and are not to be construed as limiting the present specification.

FIG. 1 is a schematic view of an exemplary polishing apparatus according to some embodiments of the present disclosure; FIG. 2 is a schematic view of a portion of the structure of an exemplary polishing apparatus according to FIG. 1; figure 3 is a schematic diagram of an exemplary fixture, polishing platen, drive configuration shown in accordance with some embodiments of the present description. In some embodiments, as shown in fig. 1, the polishing apparatus 1000 may include a fixture 100, a polishing disk 200, and a driving mechanism 300, where the fixture 100 may be used to fix the workpiece 150, and the driving mechanism 300 may drive the fixture 100 to move, and during the process that the fixture 100 drives the workpiece 150 to move, the workpiece and the polishing disk 200 rub against each other, so that the polishing disk 200 polishes the workpiece 150. The workpiece may refer to a part to be processed, and may include ultra-thin glass, for example. In some embodiments, the thickness of the ultra-thin glass may be 0.3mm to 0.06mm.

In some embodiments, as shown in fig. 3, the polishing pad 200 may include a base 210, a first elastic layer 220, and a second elastic layer 230, the first elastic layer 220 being disposed between the base 210 and the second elastic layer 230, the first elastic layer 220 having a modulus of elasticity that is less than the modulus of elasticity of the second elastic layer 230. In the polishing process of the workpiece 150 driven by the fixture 100, the second elastic layer 230 with larger elastic modulus is attached to the workpiece 150 for polishing, the elastic modulus of the first elastic layer 220 is smaller, the first elastic layer 220 is easier to deform than the second elastic layer 230, when the workpiece 150 and the polishing disc 200 move relatively for polishing, the first elastic layer 220 deforms and displaces earlier than the second elastic layer 230, the whole second elastic layer 230 deforms along with the first elastic layer 220, and the second elastic layer 230 does not deform and displace locally, so that the workpiece 150 and the second elastic layer 230 are prevented from being scratched independently.

In some polishing devices, when the driving mechanism drives the workpiece to move, the torque is not constant, so that the pressure on the workpiece in the polishing process is possibly not constant, and the workpiece and the felt of the polishing disk are easily scratched. In some embodiments, as shown in fig. 2 and 3, the driving mechanism 300 may include a polishing arm 310, a motor 320, and a cylinder 330, where the distal end of the polishing arm 310 may be fixedly mounted to the fixture 100, the motor 320 and the cylinder 330 are used to drive the polishing arm 310 to move, and the motor 320 and the cylinder 330 combine to make the output torque constant, so as to drive the polishing arm 310 to drive the fixture 100 to move smoothly. In some embodiments, the polishing arm 310 may be provided with a hollow structure, one end of the hollow structure of the polishing arm 310 is connected to a vacuum apparatus, and the other end is connected to the jig 100, and suction and exhaust of the jig 100 is controlled by the vacuum apparatus, thereby sucking and releasing the workpiece 150.

In some embodiments, as shown in fig. 1 and 2, the polishing apparatus 1000 may include a frame 400, the frame 400 may include a table 410 and an operation panel 420, and the jig 100, the polishing pad 200, and the driving mechanism 300 may be disposed on the table 410. In some embodiments, at least two jigs 100, at least two polishing discs 200, and at least two driving mechanisms 300 may be disposed on the table 410, and one jig 100, one polishing disc 200, and one driving mechanism 300 may be combined to form a set of polishing units. In some embodiments, as shown in fig. 1 and 2, the polishing apparatus 1000 may include four jigs 100, four polishing discs 200, and four driving mechanisms 300, including four sets of polishing units, and may implement a batch polishing process. In some embodiments, the jig 100, polishing pad 200, and drive mechanism 300 may be equal in number and in one-to-one correspondence. In some embodiments, the number of the polishing discs 200 may be less than or equal to the number of the clamps 100, and the number of the clamps 100 and the driving mechanism 300 may be equal to one, and the next workpiece may be polished on the polishing disc 200 during the completion of the transfer unloading of the previous workpiece polishing. In some embodiments, the suction surface of the jig 100 may simultaneously suction more than two workpieces 150 to achieve batch processing.

In some embodiments, the first elastic layer 220 is fixed relative to the second elastic layer 230, and the second elastic layer 230 completely covers the first elastic layer 220. The elastic modulus of the first elastic layer 220 cannot be too small, if the elastic modulus of the first elastic layer 220 is too small, the stiffness of the first elastic layer 220 is too small (i.e., the first elastic layer is too soft), so that the deformation of the first elastic layer 220 may be too large during the polishing process, which may result in relative movement between the first elastic layer 220 and the second elastic layer 230, so that the second elastic layer 230 cannot follow the first elastic layer 220 to deform (i.e., the second elastic layer may deform independently), resulting in the second elastic layer 230 not deforming as a whole, and further resulting in the second elastic layer 230 alone rubbing against the workpiece 150. Therefore, the ratio of the elastic modulus of the first elastic layer 220 to the elastic modulus of the second elastic layer 230 needs to satisfy a certain range.

In some embodiments, the ratio of the elastic modulus of the first elastic layer 220 in the direction perpendicular to the polishing surface (i.e., the elastic modulus in the machine direction, or young's modulus) to the elastic modulus of the second elastic layer 230 in the direction perpendicular to the polishing surface may range from 11:15 to 11:25. In some embodiments, the ratio of the elastic modulus of the first elastic layer 220 in the direction perpendicular to the polishing surface to the elastic modulus of the second elastic layer 230 in the direction perpendicular to the polishing surface may range from 11:17 to 1:2. In some embodiments, the ratio of the elastic modulus of the first elastic layer 220 in the direction perpendicular to the polishing surface to the elastic modulus of the second elastic layer 230 in the direction perpendicular to the polishing surface may range from 11:18 to 11:21. In some embodiments, the ratio of the elastic modulus of the first elastic layer 220 in the direction perpendicular to the polishing surface to the elastic modulus of the second elastic layer 230 in the direction perpendicular to the polishing surface may range from 11:19 to 11:20.

In some embodiments, the elastic modulus of the first elastic layer 220 along the direction perpendicular to the polishing surface may have a value ranging from 30MPa to 50MPa. In some embodiments, the elastic modulus of the first elastic layer 220 along the direction perpendicular to the polishing surface may have a value ranging from 35MPa to 55MPa. In some embodiments, the elastic modulus of the first elastic layer 220 along the direction perpendicular to the polishing surface may have a value ranging from 40MPa to 50MPa. In some embodiments, the elastic modulus of the first elastic layer 220 along the direction perpendicular to the polishing surface may have a value ranging from 43MPa to 48MPa.

In some embodiments, the elastic modulus of the second elastic layer 230 in the direction perpendicular to the polishing surface may range from 65MPa to 90MPa. In some embodiments, the elastic modulus of the second elastic layer 230 in the direction perpendicular to the polishing surface may range from 70MPa to 85MPa. In some embodiments, the elastic modulus of the second elastic layer 230 in the direction perpendicular to the polishing surface may range from 65MPa to 80MPa. In some embodiments, the elastic modulus of the second elastic layer 230 along the direction perpendicular to the polishing surface may range from 70MPa to 75MPa.

The modulus of elasticity of the first elastic layer 220 is related to the thickness of the first elastic layer 220. In some embodiments, the greater the thickness of the first elastic layer 220, the smaller the elastic modulus of the first elastic layer 220 may be; the thinner the thickness of the first elastic layer 220, the greater the elastic modulus of the first elastic layer 220 needs to be. In some embodiments, the first elastic layer 220 has a thickness ranging from 15mm to 25mm, and the first elastic layer 220 has an elastic modulus ranging from 30MPa to 60MPa. In some embodiments, the first elastic layer 220 has a thickness ranging from 15mm to 25mm, and the first elastic layer 220 has an elastic modulus ranging from 35MPa to 55MPa. In some embodiments, the first elastic layer 220 has a thickness ranging from 15mm to 25mm, and the first elastic layer 220 has an elastic modulus ranging from 40MPa to 50MPa. In some embodiments, the first elastic layer 220 has a thickness ranging from 18mm to 22mm, and the first elastic layer 220 has an elastic modulus ranging from 35MPa to 55MPa. In some embodiments, the first elastic layer 220 has a thickness ranging from 18mm to 22mm, and the first elastic layer 220 has an elastic modulus ranging from 40MPa to 50MPa.

In some embodiments, the elastic modulus of the first elastic layer 220 in the direction perpendicular to the polishing surface is smaller than the elastic modulus in the direction parallel to the polishing surface, and the first elastic layer 220 is easily deformed in the direction perpendicular to the polishing surface when the workpiece rubs with the polishing disk 200. In some embodiments, the first elastic layer 220 may be made of an elastic material such as EVA foam. In some embodiments, the thickness of the first elastic layer 220 may range from 15mm to 25mm.

In some embodiments, the second elastic layer 230 includes a fibrous structure that is capable of stretching in a direction parallel to the polishing surface. In some embodiments, the second elastic layer 230 may be a felt layer, which may have better wear resistance. In some embodiments, the felt layer may be made of natural fibers (e.g., cow hair, wool, etc.) or artificial fibers (e.g., polyester, polypropylene, viscose, etc.). In some embodiments, the felt layer may have a thickness in the range of 1 to 1.5mm.

In some embodiments, the polishing device may fix the workpiece using a vacuum suction type jig, the suction surface of the jig being provided with an air hole, and the vacuum suction device providing negative pressure for sucking the workpiece through the air hole. In some embodiments, the air hole of the vacuum adsorption fixture is arranged in the central area of the adsorption surface, when in vacuum adsorption, the air hole position and the air pressure at the periphery of the air hole have large difference, so that the adsorption force is unbalanced, and for the ultrathin glass and other brittle and thin workpieces, the workpiece is cracked when in processing due to different adsorption forces. To this end, some embodiments of the present disclosure provide a clamp that is more suitable for clamping ultra-thin workpieces.

FIG. 4 is a schematic illustration of an exemplary clamp shown in accordance with some embodiments of the present disclosure; FIG. 5 isbase:Sub>A cross-sectional block diagram of the A-A plane of the exemplary clamp according to FIG. 4. In some embodiments, as shown in fig. 4 and 5, the jig 100 may include a substrate 120 and an adsorption plate 110, the substrate 120 may be used to assemble mechanical components, and the adsorption plate 110 is disposed on a surface layer of the substrate 120. When the jig 100 suctions and clamps the workpiece 150, the suction plate 110 may be attached to the workpiece 150, and the suction plate 110 may be provided with a plurality of first holes 111, and negative pressure for suctioning the workpiece 150 may be supplied to the jig 100 through the plurality of first holes 111. In some embodiments, the substrate 120 may be made of a material that is light in weight and is not easy to deform, and can meet the requirement of assembling mechanical components, for example, the substrate 120 may be made of an aluminum alloy. In some embodiments, the adsorption plate 110 may be made of a non-metal material, which has a small deformation, and is not easy to scratch the polished product, for example, the adsorption plate 110 may be made of teflon.

In some embodiments, the first holes 111 may be uniformly distributed on the adsorption surface of the adsorption plate 110 of the jig 100, and the interval between adjacent first holes 111 may have a value ranging from 2mm to 3.5mm. In some embodiments, the spacing between adjacent first apertures 111 may range in value from 1.5mm to 3.0mm. In some embodiments, the spacing between adjacent first apertures 111 may range in value from 2.0mm to 2.5mm. The first holes 111 are uniformly distributed on the adsorption surface, and the intervals between the adjacent first holes 111 are reasonably set, so that the fixture 100 can provide uniform and constant adsorption force when adsorbing the workpiece 150, thereby avoiding the workpiece 150 from being damaged.

In some embodiments, the first aperture 111 may have an aperture range of 0.2mm to 1.2mm. In some embodiments, the first aperture 111 may have an aperture ranging from 0.3mm to 1mm. In some embodiments, the first aperture 111 may have an aperture ranging from 0.4mm to 0.9mm. In some embodiments, the first aperture 111 may have an aperture ranging from 0.5mm to 0.8mm. In some embodiments, the first aperture 111 may have an aperture ranging from 0.6mm to 0.7mm.

The aperture of the first hole 111 is related to the thickness of the workpiece 150, and the thinner the thickness of the workpiece 150, the smaller the aperture of the first hole 111 can be set to reduce the negative pressure of the vacuum pumped in the single first hole 111, so as to avoid damage caused by excessive local adsorption force of the workpiece 150. In some embodiments, the ratio of the aperture of the first hole 111 to the thickness of the workpiece 150 may range from 3:1 to 4:1. In some embodiments, the ratio of the aperture of the first hole 111 to the thickness of the workpiece 150 may range from 3:1 to 7:2. In some embodiments, the ratio of the aperture of the first hole 111 to the thickness of the workpiece 150 may range from 3:1 to 10:3.

In some embodiments, at least one of the first apertures 111 is provided with a flexible membrane (not shown in the figures) that covers the suction end of the first aperture 111. In some embodiments, the flexible film may be a soft, breathable film. When the workpiece 150 is absorbed by the first hole 111, the flexible film can increase the contact surface between the workpiece 150 and the absorption end of the first hole 111, so that the absorption force is dispersed, and the support is provided for the workpiece 150 at the hole position of the first hole 111, so that the workpiece 150 is prevented from being deformed greatly at the hole position of the first hole 111, and the damage risk of the workpiece 150 is further reduced.

In some embodiments, the flexible membrane may conform to cover the suction end of the first aperture 111 when the vacuum is pulled, the workpiece 150 conforms to the flexible membrane, and suction pressure within the first aperture 111 is uniformly transferred to the workpiece 150 through the flexible membrane. The flexible film can also increase the support surface when sucking the workpiece 150, compared to the suction manner in which the first hole 111 directly sucks the workpiece 150, thereby further avoiding breakage of the workpiece 150. In some embodiments, when the workpiece 150 is released by inflation, the positive pressure air flow in the first hole 111 is uniformly blown to the workpiece 150 through the flexible film, so that the workpiece 150 is prevented from being damaged due to local overstressed by strong air flow rapidly applied to the workpiece 150.

In some embodiments, the flexible membrane may be a breathable membrane, for example, the flexible membrane may include an EPTFE (polytetrafluoroethylene) film, a PE (polyethylene) film, a TPU (thermoplastic polyurethane) film, and the like. In some embodiments, the flexible membrane may be provided with a plurality of small pore size ventilation holes, each evenly distributed. In some embodiments, the pore size of the vent of the flexible membrane is substantially smaller than the pore size of the first aperture 111. In some embodiments, the ratio of the aperture of the ventilation holes to the aperture of the first holes 111 may range from 1:10 to 1:50. In some embodiments, the ratio of the aperture of the ventilation holes to the aperture of the first holes 111 may range from 1:20 to 1:40. In some embodiments, the ratio of the aperture of the ventilation holes to the aperture of the first holes 111 may range from 1:25 to 1:35.

In some embodiments, the flexible membrane may be a plurality of small-sized thin membranes, one covering one first hole 111, and each flexible membrane may be shaped and sized to match the shape and size of each first hole 111. In some embodiments, the flexible membrane edge may be secured to the first aperture 111 edge such that the flexible membrane covers the suction end of the first aperture 111. For example, the flexible film edge may be adhesively secured to the first aperture 111 edge. In some embodiments, the flexible film may cover the plurality of first holes 111 in a sheet of area. In some embodiments, the flexible membrane may cover the entire adsorption surface. In some embodiments, the edge of the flexible film covering an area may be secured to the suction side, e.g., adhered to the suction side. In some embodiments, a flexible film covering an area may be secured to the edge of the first aperture 111 at the location of each first aperture 111.

In some embodiments, as shown in fig. 4 and 5, the fixture 100 may further include a gas port 130, and each first hole 111 communicates with the gas port 130. In application, the gas port 130 may be connected to a vacuum device, and when the vacuum device draws a vacuum through the gas port 130, a negative pressure may be formed in each first hole 111, and the plurality of first holes 111 may uniformly distribute the adsorption force. In some embodiments, as shown in fig. 5, at least one air passage 131 may be provided in the substrate 120, and the adsorption plate 110 may be provided with a plurality of first holes 111 therethrough, and the first holes 111 may communicate with the gas interface 130 through the air passage 131. In some embodiments, as shown in fig. 5, two air passages 131 may be provided in the substrate 120, and suction may be performed through one of the air passages 131 to suck the workpiece and inflation may be performed to release the workpiece, and suction pressure may be maintained through the other air passage 131 during polishing to fix the workpiece. In some embodiments, an air passage 131 may be disposed in the substrate 120, and the workpiece may be sucked by air suction through the air passage 131, and then inflated through the air passage 131 to release the workpiece after polishing.

In some embodiments, an airflow channel may be disposed between the substrate 120 and the adsorption plate 110, and when the vacuum is pumped, gas enters from the plurality of first holes 111, passes through the airflow channel, gathers in the air channel 131 on the substrate 120, and is finally pumped away by the vacuum device through the air interface 130, so that a negative pressure is formed in each first hole 111. Fig. 6 is a partial schematic view of an exemplary clip according to some embodiments of the present description. In some embodiments, as shown in fig. 5 and 6, the surface of the substrate 120 contacting the adsorption plate 110 may be provided with a plurality of bumps 121 such that a gap through which gas flows is formed between the substrate 120 and the adsorption plate 110. In some embodiments, the airflow channel may be provided in other manners, so long as the airflow channel can communicate the first hole 111 with the air channel 131.

Fig. 7 is a schematic view of an exemplary clamp according to further embodiments of the present disclosure. In some embodiments, as shown in fig. 7, the fixture 100 may further include a plurality of second holes 112 and a gas-storage chamber 160, the plurality of second holes 112 being in communication with one end of the gas-storage chamber 160, the other end of the gas-storage chamber 160 being in communication with the gas interface 130; an air volume adjustment structure 170 is provided in the air storage chamber 160, and the air volume adjustment structure 170 may be used to adjust the volume of the air storage chamber 160. In some embodiments, when a vacuum is drawn through gas port 130, gas within gas storage chamber 160 in communication with gas port 130 is also drawn away and gas volume adjustment structure 170 may collapse; when the evacuation is stopped, the gas flow regulating structure 170 may expand, automatically squeezing out the gas stored in the gas storage chamber 160, thereby creating a positive pressure in the second bore 112 that can release the workpiece.

In some embodiments, as shown in fig. 7, the gas amount adjusting structure 170 may include a piston 171 and an elastic member 172 connected to the piston, where the elastic member 172 has a predetermined distance between the piston 171 and one end of the gas storage chamber 160, which communicates with the gas port 130, when the elastic member 172 is in an initial state. The piston 171 has a movement stroke within the gas storage chamber 160 of a predetermined distance such that a predetermined volume of gas can be drawn into and discharged from the gas storage chamber 160 after movement of the piston 171, wherein the predetermined volume of gas is capable of generating a positive pressure sufficient to release the workpiece. In some embodiments, when the workpiece is sucked under vacuum, the elastic member 172 is stretched, and the piston 171 moves to an end of the gas storage chamber 160 communicating with the gas port 130, at which time a certain amount of gas is sucked into the gas storage chamber 160. Further, when it is necessary to release the work, the vacuum suction is stopped, the elastic member 172 is restored to the original state, the piston 171 is moved to the original position, the gas in the gas storage chamber 160 is extruded, and the positive pressure is formed in the second hole 112, thereby automatically releasing the work.

The preset distance may be set according to the cross-sectional area of the inner cavity of the gas storage chamber 160, so long as the piston 171 returns to the initial position, and the gas amount of the preset volume (preset volume=preset distance×cross-sectional area of the inner cavity) is extruded, so that the workpiece can be released. For example, if the cross-sectional area of the inner cavity of the gas storage chamber 160 is small, a large preset distance needs to be set to ensure that a preset volume of gas can be discharged when the piston 171 returns to the initial position. For another example, if the cross-sectional area of the inner cavity of the gas storage chamber 160 is large, a smaller preset distance may be set, i.e., a preset volume of gas may be exhausted. In some embodiments, the predetermined distance is not less than half the length of the air trap 160.

In some embodiments, the plurality of second holes 112 are uniformly distributed on the adsorption surface of the fixture 100, and the uniformly distributed plurality of second holes 112 can generate uniform positive release pressure, so that the workpiece can be prevented from being damaged due to local overstress. In some embodiments, the spacing of adjacent second holes 112 may be set according to the thickness of the workpiece. For example, if the thickness of the workpiece is thin, the spacing between adjacent second holes 112 may be set small in order to avoid excessive positive pressure within a single second hole 112. For another example, if the thickness of the work is large, the pitch of the adjacent second holes 112 may be set large. In some embodiments, the spacing of adjacent second apertures 112 may be set with reference to the spacing of adjacent first apertures 111. In some embodiments, the spacing of adjacent second apertures 112 may be greater than or equal to the spacing of adjacent first apertures 111.

In some embodiments, the outlet end of the second hole 112 may also be provided with a flexible film, when the exhaust gas releases the workpiece 150, the air flow in the air storage cavity 160 is uniformly blown and discharged to the workpiece 150 through the flexible film, so that the workpiece 150 is prevented from being damaged due to local overstressed by the air flow rapidly applied to the workpiece 150. In some embodiments, the related art of the flexible film at the second hole 112 may refer to the content of the flexible film at the first hole 111, and will not be described herein.

In some embodiments, the clamp 100 may include one or more valves that may control the opening and closing of the gas port 130. In some embodiments, as shown in fig. 3 and 4, the fixture 100 may include two valves 140, two air passages 131 may be disposed in the substrate 120, the two valves 140 are respectively communicated with the two air passages 131, and the two valves 140 may respectively control opening and closing of the two air passages 131. In some embodiments, as shown in FIG. 4, one of the valves 140 is in communication with the gas port 130, and can control the opening and closing of the gas port 130. In some embodiments, as shown in fig. 3, the valve 140 is mounted to a wall of the base plate 120 remote from the suction plate 110 by a mounting plate 141.

In some embodiments, the clamp 100 may be used separately from a polishing apparatus, the clamp 100 being used to clamp a workpiece, the polishing apparatus being used to polish the workpiece. In some embodiments, the fixture 100 is connected to a vacuum apparatus through one of the valves 140 (which may be referred to as a first valve), and the vacuum apparatus is configured to evacuate the first hole 111 through one of the air passages 131 (which may be referred to as a first air passage) to perform suction and material extraction on the workpiece. Further, after the material is taken, the fixture 100 moves to the polishing device and is connected with the polishing arm 310, the other valve 140 (which can be called a second valve) is communicated with the gas interface 130, the gas interface 130 is communicated with the hollow structure of the polishing arm 310, and the gas pressure control component on the polishing device controls the gas pressure of the gas interface 130 through the second valve, so that the workpiece is adsorbed and clamped. In some embodiments, during polishing, the pneumatic control assembly controls the negative pressure of the first hole 111 through the gas interface 130 to achieve constant pressure suction clamping of the workpiece. Further, during polishing, the first valve is closed such that the first air passage is disconnected from the evacuation device. In some embodiments, as shown in fig. 5, the jig 100 may simultaneously suction-clamp two or more workpieces 150, thereby improving polishing efficiency.

In some embodiments, after polishing is completed, the gas interface 130 may be separated from the hollow structure of the polishing arm 310, and the first valve may be opened to enable the first air channel to be communicated with the vacuumizing device, and after the polishing arm 310 transfers the workpiece to the storage place, negative pressure adsorption is stopped, and since the polishing liquid may remain between the workpiece and the adsorption surface of the fixture 100, the liquid suction force may cause the workpiece to be difficult to separate from the adsorption surface, and positive pressure may be applied to the first hole 111 to release the workpiece. In some embodiments, the fixture 100 is provided with the second hole 112 and the air storage cavity 160, after the workpiece is transferred to the storage place, the negative pressure adsorption is stopped, and the air volume adjusting structure 170 can automatically discharge the air stored in the air storage cavity 160, so that positive pressure is generated in the second hole 112, and the workpiece is automatically released.

In some embodiments, during polishing, the polishing device may add polishing liquid to the workpiece and the second elastic layer, and a filter screen may be disposed at the polishing liquid recovery port to filter impurities in the polishing liquid, so that the polishing liquid may be reused.

It should be noted that, the advantages that may be generated by different embodiments may be different, and in different embodiments, the advantages that may be generated may be any one or a combination of several of the above, or any other possible advantages that may be obtained.

While the basic concepts have been described above, it will be apparent to those skilled in the art that the foregoing detailed disclosure is by way of example only and is not intended to be limiting. Although not explicitly described herein, various modifications, improvements, and adaptations to the present disclosure may occur to one skilled in the art. Such modifications, improvements, and modifications are intended to be suggested within this specification, and therefore, such modifications, improvements, and modifications are intended to be included within the spirit and scope of the exemplary embodiments of the present invention.

Meanwhile, the specification uses specific words to describe the embodiments of the specification. Reference to "one embodiment," "an embodiment," and/or "some embodiments" means that a particular feature, structure, or characteristic is associated with at least one embodiment of the present description. Thus, it should be emphasized and should be appreciated that two or more references to "an embodiment" or "one embodiment" or "an alternative embodiment" in various positions in this specification are not necessarily referring to the same embodiment. Furthermore, certain features, structures, or characteristics of one or more embodiments of the present description may be combined as suitable.

It should be noted that in order to simplify the presentation disclosed in this specification and thereby aid in understanding one or more inventive embodiments, various features are sometimes grouped together in a single embodiment, figure, or description thereof. This method of disclosure, however, is not intended to imply that more features than are presented in the claims are required for the present description. Indeed, less than all of the features of a single embodiment disclosed above.

Claims

1. A polishing apparatus, comprising:

the clamp is used for adsorbing the workpiece;

the driving mechanism is used for driving the clamp to move;

a polishing disk for polishing the workpiece;

the polishing disc comprises a base, a first elastic layer and a second elastic layer, wherein the first elastic layer is arranged between the base and the second elastic layer, and the ratio range of the elastic modulus of the first elastic layer along the direction vertical to the polishing surface to the elastic modulus of the second elastic layer along the direction vertical to the polishing surface is 11:17-1:2.

2. The polishing apparatus according to claim 1, wherein the second elastic layer entirely covers the first elastic layer, and the second elastic layer generates an overall deformation displacement based on a deformation of the first elastic layer when the polishing platen polishes a workpiece.

3. The polishing apparatus according to claim 1, wherein the elastic modulus of the first elastic layer in a direction perpendicular to the polishing surface has a value in a range of 35MPa to 55MPa.

4. The polishing apparatus according to claim 1, wherein the elastic modulus of the second elastic layer in a direction perpendicular to the polishing surface has a value ranging from 70MPa to 85MPa.

5. The polishing apparatus of claim 1, wherein a thickness of the first elastic layer is inversely related to an elastic modulus of the first elastic layer.

6. The polishing apparatus according to claim 5, wherein the thickness of the first elastic layer ranges from 15mm to 25mm.

7. The polishing apparatus according to claim 6, wherein the first elastic layer has an elastic modulus value ranging from 35MPa to 55MPa.

8. The polishing apparatus according to claim 1, wherein the first elastic layer has an elastic modulus in a direction perpendicular to the polishing surface that is smaller than an elastic modulus in a direction parallel to the polishing surface.

9. The polishing apparatus of claim 1, wherein the second resilient layer comprises a fibrous structure that is stretchable in a direction parallel to the polishing surface.

10. The polishing apparatus according to claim 1, wherein the suction surface of the jig is provided with a plurality of first holes, and the jig is provided with negative pressure for sucking the workpiece to the jig through the plurality of first holes.