CN115995401A - Semiconductor processing equipment - Google Patents

Abstract

The utility model provides a semiconductor processing device, includes liquid supply device and adapting device, adapting device is before the process begins, control the liquid outlet of adapting groove bottom and close, and will adapting groove is removed to the nozzle below and the position of spouting on the wafer that waits to process, at this moment, liquid supply device control nozzle to spout the liquid medicine in adapting groove, the sensing unit detects the real-time flow of liquid medicine, the liquid medicine in adapting groove is discharged in real time through the flowing back unit, when the real-time flow that the sensing unit detected reaches the preset flow, adapting device control adapting groove bottom's liquid outlet is opened, the liquid medicine that the nozzle spouted passes the liquid outlet spouts to the surface of wafer that waits to process, the process begins. Thereby ensuring that the time/flow rate of the liquid medicine in the process is matched with the setting, ensuring that the liquid medicine in the process has enough liquid quantity or volume, avoiding the abnormal dropping of the liquid medicine when the nozzle leaves after the process is finished, and improving the process effect.

Description

Semiconductor processing equipment

Technical Field

The present application relates to the field of semiconductors, and more particularly, to a semiconductor processing apparatus.

Background

The wafer fabrication process typically includes numerous processes such as photolithography, ion implantation, etching, chemical mechanical polishing, vapor deposition, and the like. After performing the related process, such as chemical mechanical polishing, the wafer needs to be cleaned to remove impurities on the wafer surface. If the wafer is not sufficiently cleaned, impurities and/or particles remain on the surface of the wafer, the wafer may be damaged in the next process, resulting in wafer discard.

Therefore, how to remove impurities and/or particles on the surface of a wafer has been a research hot spot in the field of semiconductor technology, and it is common to use a wafer cleaning apparatus to clean the wafer after performing a related semiconductor process, so as to remove impurities and/or particles that may be formed on the surface of the wafer.

However, when the existing wafer cleaning equipment is used for cleaning, the problem of insufficient liquid medicine volume exists, and the process precision and the yield are affected.

Disclosure of Invention

In view of this, some embodiments of the present application provide a semiconductor processing apparatus comprising:

the liquid supply device comprises a liquid supply unit, a nozzle and a sensing unit, wherein the liquid supply unit is used for supplying liquid medicine, the nozzle is used for spraying and discharging the liquid medicine supplied by the liquid supply unit, the sensing unit is used for detecting the real-time flow rate of the liquid medicine supplied by the liquid supply unit, and the liquid supply device is also used for moving the nozzle to a spraying position above a wafer to be processed before the process begins;

the liquid discharge unit is used for discharging the liquid medicine in the receiving tank, the liquid outlet at the bottom of the receiving tank is controlled to be closed before the process starts, the receiving tank is moved to a spraying position above a wafer to be processed along with the nozzle, the liquid supply device controls the nozzle to spray the liquid medicine into the receiving tank, the sensing unit detects the real-time flow of the liquid medicine, the liquid medicine in the receiving tank is discharged in real time through the liquid discharge unit, when the real-time flow detected by the sensing unit reaches a preset flow, the liquid outlet at the bottom of the receiving tank is controlled to be opened, the liquid medicine sprayed by the nozzle passes through the liquid outlet to be sprayed to the surface of the wafer to be processed, and the process starts.

In some embodiments, the liquid supply device is further used for controlling the nozzle to stop ejecting liquid drops and moving the nozzle to an initial position when the process is finished, and the receiving device is further used for controlling the liquid outlet to be closed and synchronously moving the receiving groove to the initial position along with the nozzle when the process is finished.

In some embodiments, the number of the receiving grooves and the number of the liquid outlets are one.

In some embodiments, the receiving groove comprises an upper receiving groove and a lower receiving groove positioned below the upper receiving groove, the liquid draining unit is respectively connected with the upper receiving groove and the lower receiving groove, the liquid outlet comprises an inner liquid outlet and an outer liquid outlet, the inner liquid outlet is positioned at the bottom of the upper receiving groove, the outer liquid outlet is positioned at the bottom of the lower receiving groove, and the inner liquid outlet and the outer liquid outlet can be both opened or closed.

In some embodiments, the receiving device controls the inner liquid outlet at the bottom of the upper receiving groove and the outer liquid outlet at the bottom of the lower receiving groove to be closed before the process begins; when the real-time flow detected by the sensing unit reaches the preset flow, the receiving device firstly controls the opening of the outlet at the bottom of the lower receiving groove, and then controls the opening of the inner outlet at the bottom of the upper receiving groove.

In some embodiments, at the end of the process, the receiving device controls the inner outlet at the bottom of the upper receiving tank to be closed, and then controls the outer outlet at the bottom of the lower receiving tank to be closed.

In some embodiments, the receiving device further comprises a gas purging unit for purging the liquid outlet after the liquid outlet is closed.

In some embodiments, the gas emitted by the gas purging unit is an inert gas.

In some embodiments, when the liquid outlet includes an inner liquid outlet and an outer liquid outlet, the gas purging unit includes an upper gas outlet for purging the inner liquid outlet and a lower gas outlet for purging the outer liquid outlet.

In some embodiments, after the nozzle and the receiving groove reach the spraying position, the liquid supply device controls the nozzle to spray the liquid medicine into the receiving groove, the sensing unit detects the real-time flow of the liquid medicine, the liquid medicine in the receiving groove is discharged in real time through the liquid discharge unit, when the real-time flow detected by the sensing unit reaches the preset flow, the receiving device controls the liquid outlet at the bottom of the receiving groove to be opened, the liquid medicine sprayed by the nozzle passes through the liquid outlet to spray the liquid medicine onto the surface of the wafer to be processed, and the process is started.

In some embodiments, before the nozzle and the receiving groove reach the spraying position, the liquid supply device controls the nozzle to spray the liquid medicine into the receiving groove, the sensing unit detects the real-time flow of the liquid medicine, the liquid medicine in the receiving groove is discharged in real time through the liquid discharge unit, when the real-time flow detected by the sensing unit reaches the preset flow after the nozzle and the receiving groove reach the spraying position, the receiving device controls the liquid outlet at the bottom of the receiving groove to be opened, the liquid medicine sprayed by the nozzle passes through the liquid outlet to spray the liquid medicine onto the surface of the wafer to be processed, and the process is started.

In some embodiments, the liquid supply unit of the liquid supply device comprises a liquid supply end and a liquid supply pipeline, wherein the inlet end of the liquid supply pipeline is connected with the liquid supply end, the outlet end of the liquid supply pipeline is connected with the nozzle, a first switch valve and a first suck-back valve are arranged on the liquid supply pipeline, the first switch valve is used for controlling the on-off of liquid medicine in the liquid supply pipeline, and the first suck-back valve is used for controlling the suck-back amount in the liquid supply pipeline and the nozzle.

In some embodiments, the sensing unit is disposed on the liquid supply line, the sensing unit comprising a flow meter.

In some embodiments, the liquid draining unit of the receiving device comprises a liquid draining pipeline, one end of the liquid draining pipeline is connected with the receiving groove, the other end of the liquid draining pipeline is connected with the lower draining end of the factory, a second switch valve and a second back suction valve are arranged on the liquid draining pipeline, the second switch valve is used for controlling on-off of liquid medicine in the liquid draining pipeline, and the second back suction valve is used for controlling back suction amount in the liquid draining pipeline.

In some embodiments, the liquid supply device and the receiving device further comprise a driving unit, the driving unit is provided with a movable end, the nozzle of the liquid supply device and the receiving groove of the receiving device are both fixed on the movable end of the driving unit, the receiving groove is positioned below the nozzle, and the driving unit drives the nozzle and the receiving groove to move simultaneously.

In some embodiments, the liquid supply device further comprises a first driving unit, the receiving device further comprises a second driving unit, the first driving unit is provided with a first movable end, the nozzle of the liquid supply device is fixed at the first movable end, the first driving unit drives the nozzle to move, the second driving unit is provided with a second movable end, the receiving groove of the receiving device is fixed on the second movable end, and the second driving unit drives the receiving groove to move.

In some embodiments, the semiconductor processing apparatus further comprises a control unit for sending control signals to control the liquid supply device and the receiving device to perform corresponding operations.

In some embodiments, the control unit is at least configured to send a first control signal to the liquid supply device and send a second control signal to the receiving device before the process starts, the liquid supply device receives the first control signal and then moves the nozzle to a spraying position above the wafer to be processed, the receiving device receives the second control signal and then controls the liquid outlet at the bottom of the receiving tank to be closed, and moves the receiving tank along with the nozzle to the spraying position above the wafer to be processed, the receiving device sends a first feedback signal to the control unit after the receiving tank moves to the spraying position, the control unit sends a third control signal to the liquid supply device after receiving the first feedback signal, the liquid supply device controls the nozzle to spray liquid medicine into the receiving tank after receiving the third control signal, the sensing unit detects the real-time flow of the liquid medicine and sends the detected real-time flow to the control unit, the control unit compares the detected real-time flow with a preset flow, and when the detected real-time flow reaches the preset flow, the receiving unit receives the fourth control signal to the receiving device and opens the receiving device when the fourth control unit receives the preset flow.

In some embodiments, the semiconductor processing apparatus is a wafer cleaning apparatus.

In some embodiments, the medical fluid comprises at least deionized water.

The semiconductor processing device in some of the foregoing embodiments of the application includes a receiving device, the receiving device includes a receiving tank and a liquid draining unit connected with the receiving tank, a liquid outlet capable of being opened or closed is provided at a bottom of the receiving tank, the receiving tank is used for receiving liquid medicine sprayed by the nozzle, the liquid draining unit is used for draining the liquid medicine in the receiving tank, the receiving device is further used for controlling the liquid outlet at the bottom of the receiving tank to be closed before a process starts, and moving the receiving tank along with the nozzle to a spraying position above a wafer to be processed, the liquid supplying device controls the nozzle to spray the liquid medicine into the receiving tank, the sensing unit detects real-time flow of the liquid medicine, the liquid medicine in the receiving tank is discharged in real time through the liquid draining unit, when the real-time flow detected by the sensing unit reaches a preset flow, the liquid outlet at the bottom of the receiving tank is controlled to be opened, the liquid medicine sprayed by the nozzle passes through the liquid outlet to be sprayed to a surface of the wafer to be processed, and the process starts. When the process is started, the liquid medicine sprayed from the nozzle is received by the receiving device, after the liquid medicine flow rate reaches the set flow rate, the liquid outlet holes in the receiving device are opened successively, and the process is started, so that the time/flow rate of the liquid medicine in the process is matched with the set, and the liquid medicine amount or volume in the process is enough. In addition, the liquid supply device is also used for controlling the nozzle to stop spraying liquid drops and moving the nozzle to an initial position when the process is finished, and the receiving device is also used for controlling the liquid outlet to be closed and synchronously moving the receiving groove along with the nozzle to the initial position when the process is finished, so that the inner liquid outlet and the outer liquid outlet are closed and move back to the initial position along with the nozzle when the process is finished, and abnormal dropping of liquid medicine caused by various uncertain factors in the process of leaving the spraying position of the nozzle is avoided, thereby improving the process effect.

Drawings

FIG. 1 is a schematic diagram of a semiconductor processing apparatus in accordance with some embodiments of the present application;

FIG. 2 is a schematic illustration of the positions of a liquid supply and receiving device in some embodiments of the present application;

FIG. 3 is an enlarged schematic view of a receiving slot according to some embodiments of the present application;

FIG. 4 is a schematic view of a semiconductor processing apparatus according to further embodiments of the present application;

fig. 5 is a circuit diagram of a semiconductor processing apparatus in some embodiments of the present application.

Detailed Description

As to the background art, when the existing wafer cleaning equipment is adopted for cleaning, the problem of insufficient liquid medicine volume exists, and the process precision and the yield are affected.

It is found that due to the characteristics of the wafer cleaning equipment, a certain time is required for the flow rate at the initial stage of the cleaning process to reach the set flow rate, but the time is also counted in the total time of the cleaning process, so that the liquid medicine volume required by the cleaning process can not reach the standard, and the process precision and the yield are affected. The influence of the cleaning process is more obvious for the requirement of the cleaning process with shorter time, and the process precision and the yield can be influenced to a certain extent under the condition.

In addition, after the cleaning process is finished, the liquid supply valve is closed, and the liquid medicine stops flowing out, but under the condition of nozzle actuation or other vibration, abnormal conditions of nozzle liquid medicine dripping onto the wafer can occur, the process result is affected, and pollution is caused.

Therefore, the application provides a semiconductor processing device, which can ensure that the time/flow rate of the liquid medicine is matched with the setting in the process after the cleaning process is started, improve the process effect, and can also ensure that the liquid medicine can not drop onto a wafer to pollute the wafer after the cleaning process is finished, thereby reducing the adverse effect of the process.

In order to make the above objects, features and advantages of the present application more comprehensible, embodiments accompanied with figures are described in detail below. In describing embodiments of the present application in detail, the schematic drawings are not necessarily to scale and are merely illustrative and should not be taken as limiting the scope of the present application. In addition, the three-dimensional dimensions of length, width and depth should be included in actual fabrication.

In some embodiments, a wafer cleaning apparatus is provided, referring to fig. 1 and fig. 2 in combination, including:

a liquid supply device 101, wherein the liquid supply device 101 comprises a liquid supply unit 102, a nozzle 103 and a sensing unit (not shown in the figure), the liquid supply unit 102 is used for supplying liquid medicine, the nozzle 103 is used for spraying and discharging the liquid medicine supplied by the liquid supply unit 102, the sensing unit is used for detecting the real-time flow rate of the liquid medicine supplied by the liquid supply unit 102, and the liquid supply device 101 is further used for moving the nozzle 103 to a spraying position 22 above a wafer 109 to be processed before the process starts;

the receiving device 104, the receiving device 104 includes a receiving tank 106 and a liquid draining unit 105 connected with the receiving tank 106, the bottom of the receiving tank 106 has a liquid outlet 110 capable of being opened or closed, the receiving tank 106 is used for receiving the liquid medicine sprayed by the nozzle 103, the liquid draining unit 105 is used for draining the liquid medicine in the receiving tank 106, the receiving device 104 is further used for controlling the liquid outlet 110 at the bottom of the receiving tank 106 to be closed before the process starts, and moving the receiving tank 106 along with the nozzle 103 to a spraying position 22 above the wafer 109 to be processed, the liquid supplying device 101 controls the nozzle 103 to spray the liquid medicine into the receiving tank 106, the sensing unit detects the real-time flow of the liquid medicine, the liquid medicine in the receiving tank 106 is discharged in real time through the liquid draining unit 105, when the real-time flow detected by the sensing unit reaches a preset flow, the liquid outlet 110 at the bottom of the receiving tank 106 is controlled to be opened, the liquid medicine sprayed by the nozzle 103 passes through the liquid outlet 110 to be sprayed to the surface 109 to be processed, and the process starts.

The semiconductor processing apparatus is configured to perform a corresponding process on the wafer 109 to be processed, and in some embodiments, the semiconductor processing apparatus is a wafer cleaning apparatus, the process includes a cleaning process, and the chemical solution includes deionized water or other cleaning solution. In other embodiments, the semiconductor processing apparatus may be another apparatus, the process may be another process, for example, the semiconductor processing apparatus may be a developing apparatus, the process may be a developing process (a process of developing the photoresist after exposure), and the chemical solution includes a developing solution.

In some embodiments, the semiconductor processing apparatus includes a process chamber 100, the process chamber 100 being a chamber in which a corresponding process is performed, and the liquid supply device 101 and the receiving device 104 are located in the process chamber 100.

In some embodiments, referring to fig. 5, the liquid supply unit 102 includes a liquid supply end 123 and a liquid supply line 102a, wherein an inlet end of the liquid supply line 102a is connected to the liquid supply end 123, and an outlet end of the liquid supply line 102a is connected to the nozzle 103, and the liquid supply end is connected to a liquid supply tank or a factory liquid supply center. The liquid supply pipeline 102a is provided with a first switch valve 117 and a first back suction valve 118, the first switch valve 117 is used for controlling the on-off of the liquid medicine in the liquid supply pipeline 102a, when the first switch valve 117 is opened, the liquid medicine flows in the liquid supply pipeline 102a, and when the first switch valve 117 is closed, the liquid medicine stops flowing in the liquid supply pipeline 102 a. The first back suction valve 118 is used for controlling the back suction amount in the liquid supply pipeline 102a and the nozzle 103, and when the first back suction valve 118 is opened, the liquid medicine in the liquid supply pipeline 102a is separated from the port of the nozzle 103 by a certain distance by using the back suction force, so that the liquid medicine in the liquid supply pipeline 102a and the nozzle 103 can be effectively prevented from dripping after the process is finished.

The first switching valve 117 may be an electric signal controlled pneumatic valve. The first suck-back valve 118 may also be an electrically controlled pneumatic valve, and the suck-back amount of the first suck-back valve 118 may be adjusted.

In some specific embodiments, the first back suction valve 118 is disposed at the front end (the end far from the nozzle) of the first switch valve 117, the first back suction valve 118 is closed, then the first switch valve 117 is opened, the liquid supply unit 102 starts to supply liquid, and the sensing unit detects the real-time flow rate of the liquid medicine supplied in the liquid supply unit 102 in real time; when the liquid supply is stopped, the first suck-back valve 118 is opened (actuated) to suck back the liquid in the liquid supply line 102a to a position away from the nozzle 103, and then the first switch valve 117 is closed to keep the liquid in the liquid supply line 102a at a position.

The sensing unit 116 is disposed on the liquid supply pipeline 102a, and the sensing unit 116 can measure the real-time flow rate of the liquid medicine in the liquid supply pipeline 102 a. In some embodiments, the sensing unit 116 comprises a flow meter.

With continued reference to fig. 1 and 2, the fluid supply unit 102 may further include a first arm support for supporting and securing the fluid supply line 102a (see fig. 5) and the nozzle 103. The material of the first arm support comprises metal.

In some embodiments, the liquid supply device 101 is further configured to control the nozzle 103 to stop ejecting liquid droplets and move the nozzle 103 to the initial position 21 (refer to fig. 2) at the end of the process. The receiving device 104 is further configured to control the liquid outlet 110 to be closed and move the receiving groove 106 to the initial position 21 (refer to fig. 2) along with the nozzle 103 at the end of the process.

In some embodiments, after the nozzle 103 and the receiving tank 106 reach the ejection position 22, the liquid supply device 101 controls the nozzle 103 to eject the liquid medicine into the receiving tank 106, the sensing unit detects the real-time flow of the liquid medicine, the liquid medicine in the receiving tank 106 is discharged in real time through the liquid discharging unit 105, when the real-time flow detected by the sensing unit reaches the preset flow, the receiving device 104 controls the liquid outlet 110 at the bottom of the receiving tank 106 to be opened, the liquid medicine ejected by the nozzle 106 is ejected to the surface of the wafer 109 to be processed through the liquid outlet 110, and the process is started.

In some embodiments, the liquid supply device 101 controls the nozzle 101 to spray the liquid medicine into the receiving tank 106 before the nozzle 103 and the receiving tank 106 reach the spraying position 22, the sensing unit detects the real-time flow rate of the liquid medicine, the liquid medicine in the receiving tank 106 is discharged in real time through the liquid discharging unit 105, when the real-time flow rate detected by the sensing unit reaches the preset flow rate after the nozzle 103 and the receiving tank 106 reach the spraying position 22, the receiving device 104 controls the liquid outlet 110 at the bottom of the receiving tank 106 to be opened, the liquid medicine sprayed by the nozzle 106 is sprayed to the surface of the wafer 109 to be processed through the liquid outlet 110, and the process is started. In the process that the nozzle 103 and the receiving groove 106 reach the ejection position 22 from the initial position, the ejection of the chemical liquid and the detection of the flow rate are performed, and when the nozzle 103 and the receiving groove 106 reach the ejection position 22, the real-time flow rate of the chemical liquid reaches the preset flow rate in advance, and the nozzle 103 can directly eject the chemical liquid onto the surface of the wafer 109 to be processed, so that the time of the process can be saved.

In this embodiment, referring to fig. 1 and 3, the receiving groove 106 includes an upper receiving groove 106a and a lower receiving groove 106b located below the upper receiving groove 106a, the liquid draining unit 105 is connected to the upper receiving groove 106a and the lower receiving groove 106b, the liquid outlet 110 includes an inner liquid outlet 110a and an outer liquid outlet 110b, the inner liquid outlet 110a is located at the bottom of the upper receiving groove 106a, the outer liquid outlet 110b is located at the bottom of the lower receiving groove 106b, and the inner liquid outlet 110a and the outer liquid outlet 110b can both be opened or closed.

The upper receiving groove 106a and the lower receiving groove 106b each have a receiving space therein for receiving the received chemical liquid, and the receiving spaces of the upper receiving groove 106a and the lower receiving groove 106b are independent when the inner liquid outlet 110a and the outer liquid outlet 110b are closed. The walls of the upper and lower pockets 106a, 106b may be formed from a metal, alloy, hard plastic or ceramic.

The inner and outer liquid outlets 110a and 110b may be valves or gate-shaped structures that are electrically controlled to open and close.

When the receiving groove 106 has the above-mentioned specific structure, the receiving device 104 controls the inner liquid outlet 110a at the bottom of the upper receiving groove 106a and the outer liquid outlet 110b at the bottom of the lower receiving groove 106b to be closed before the process is started; when the real-time flow detected by the sensing unit 116 (refer to fig. 5) reaches the preset flow, the receiving device 106 controls the opening of the outlet 110b at the bottom of the lower receiving tank 106b, and then controls the opening of the inner outlet 110a at the bottom of the upper receiving tank 106 a. In this embodiment, when the process is started, the receiving device 104 is used to receive the liquid medicine sprayed from the nozzle, after the flow rate of the liquid medicine reaches the set flow rate, the liquid outlet holes outside the center of the receiving device 104 and inside the center are opened successively, and the process is started, so that the time/flow rate of the liquid medicine in the process is ensured to be matched with the set, and the liquid medicine amount or volume in the process is enough, thereby improving the process effect. In addition, the outer liquid outlet 110b is opened first, so that time can be saved, and meanwhile, the contamination of the inner wall of the outer liquid outlet 110b with liquid medicine can be reduced.

At the end of the process, the receiving device 104 controls the inner outlet 110a at the bottom of the upper receiving groove 106a to be closed, and then controls the outer outlet 110b at the bottom of the lower receiving groove 106b to be closed. Therefore, when the process is finished, the liquid medicine can be prevented from dropping onto the wafer to pollute the wafer, even if the liquid drops drop in the nozzle, the liquid drops can only drop into the receiving groove and can not drop onto the wafer, adverse effects of the process are reduced, and when the liquid outlet is closed, the outer wall of the double-layer receiving groove structure is polluted even if the inner liquid outlet 110a is closed, and the outer liquid outlet 110b is closed later, so that the effect of well protecting the wafer from pollution can be achieved.

It should be noted that in other embodiments, the number of the receiving grooves and the number of the liquid outlets may be one.

In some embodiments, the receiving device 106 further includes a gas purging unit for purging the liquid outlet 110 after the liquid outlet 110 is closed, so as to prevent liquid droplets from remaining in the receiving tank 106 and affecting subsequent processes.

The gas sprayed by the gas purging unit is inert gas. The inert gas includes nitrogen.

In some embodiments, referring to fig. 3, when the liquid outlet includes an inner liquid outlet 110a and an outer liquid outlet 110b, the gas purging unit includes an upper gas outlet 111a and a lower gas outlet 111b, the upper gas outlet 111a is used for purging the inner liquid outlet 110, and the lower gas outlet 111b is used for purging the outer liquid outlet 110 b.

The number of the upper air outlets 111a and the lower air outlets 111b may be one or more. In some embodiments, when the number of the upper air outlets 111a and the lower air outlets 111b is plural, the plural upper air outlets 111a are uniformly distributed on the sidewall of the upper receiving groove 106a, and the plural lower air outlets 111b are uniformly distributed on the sidewall of the lower receiving groove 106b, so as to improve the purging effect.

In some embodiments, referring to fig. 1 and 5 in combination, the liquid draining unit 105 of the receiving device 104 includes a liquid draining pipe 105a (referring to fig. 5), one end of the liquid draining pipe 105a is connected to the receiving tank 106, the other end of the liquid draining pipe 105a is connected to the lower factory draining end 121, a second switch valve and a second back suction valve 119 are disposed on the liquid draining pipe 105a, the second switch valve is used for controlling on-off of the liquid medicine in the liquid draining pipe 105a, and the second back suction valve 119 is used for controlling back suction amount in the liquid draining pipe 105 a. The second suck-back valve 119 is to ensure that the pipeline has a negative pressure, so that the liquid in the receiving tank 106 and the liquid discharge pipeline 105a can be introduced into the lower end of the factory in time. Because the flow rates of the liquid medicines corresponding to different process menus are different, the liquid amounts to be recovered in the same time are also different, and thus the back suction amount of the second back suction valve 119 can be adjusted to meet the requirement of better preventing the liquid medicine in the receiving groove 106 from remaining under different process conditions.

In an embodiment, the amount of suction back in the second suction back valve 119 is adjusted according to the real-time flow rate of the chemical liquid supplied in the liquid supply unit 102 detected by the sensing unit. Specifically, a certain or a certain range of liquid medicine flow can be set as a standard flow, the second suckback valve correspondingly has a standard suckback amount under the standard flow, in the actual process, when the sensing unit detects that the real-time flow under a certain menu is greater than the standard flow, the suckback amount of the second suckback valve is correspondingly increased to the second suckback amount, when the detected real-time flow is smaller than the standard flow, the suckback amount of the second suckback valve is correspondingly reduced to the first suckback amount, and when the real-time flow is equal to the standard flow or within the standard flow range, the suckback amount of the second suckback valve is enabled to reach the standard suckback amount.

In some specific embodiments, the second suction valve 119 is disposed at the front end (the end far away from the receiving groove) of the second switch valve, the second suction valve 119 is closed, and then the second switch valve is opened to start liquid discharge; when the liquid discharge is stopped, the second suck-back valve 119 is opened, and then the second switching valve is closed.

In some embodiments, when the receiving tank 106 includes an upper receiving tank 106a and a lower receiving tank 106b, the drain line 105a is connected to the upper receiving tank 106a and the lower receiving tank 106b through a line branch, respectively, and a second on-off valve (122 a and 122 b) is disposed on the two line branches, respectively.

The liquid supply unit 102 may further include a second arm bracket for supporting and fixing the liquid supply line 102a (refer to fig. 5) and the nozzle 103. The material of the second arm support comprises metal.

In some embodiments, with continued reference to fig. 1, the liquid supply apparatus 101 further includes a first driving unit 113, the receiving apparatus 104 further includes a second driving unit 114, the first driving unit 113 has a first movable end, the nozzle of the liquid supply apparatus 101 is fixed at the first movable end, the first driving unit 113 drives the nozzle 103 to move, the second driving unit 114 has a second movable end, the receiving slot 106 of the receiving apparatus 104 is fixed at the second movable end, and the second driving unit 114 drives the receiving slot 106 to move.

In a specific embodiment, the nozzle 103 is fixed to the first movable end of the first driving unit 113 by a first arm structure, and the first driving unit 113 drives the first arm structure to move, thereby moving the nozzle 103. The receiving groove 106 is fixed on the second movable end of the second driving unit 114 through a second arm structure, and the second driving unit 114 drives the second arm structure to move, so that the receiving groove 106 moves.

In some embodiments, the first driving unit 113 may move the nozzle 103 from the initial position 21 (refer to fig. 2) to the ejection position 22 (refer to fig. 2) at the beginning of the process, and move the nozzle 103 from the ejection position 22 back to the initial position 21 at the end of the process, and the specific movement process of the nozzle 103 may include up-and-down movement, left-and-right movement, and/or rotational movement. The second driving unit 114 may move the receiving groove 106 from the initial position 21 (refer to fig. 2) to the ejection position 22 (refer to fig. 2) at the beginning of the process, and move the receiving groove 106 from the ejection position 22 back to the initial position 21 at the end of the process, wherein the specific movement process of the receiving groove 106 includes up-down movement, left-right movement and/or rotation movement.

In other embodiments, referring to fig. 4, the liquid supply device 101 and the receiving device 104 further comprise a driving unit 115, the driving unit 115 has a movable end, the nozzle 103 of the liquid supply device 101 and the receiving groove 106 of the receiving device 104 are both fixed on the movable end of the driving unit 115, the receiving groove 106 is located below the nozzle 103, and the driving unit 115 drives the nozzle 103 and the receiving groove 106 to move simultaneously. That is, only one driving unit 115 is needed, the nozzle 103 and the receiving groove 106 are fixed on the movable end of the driving unit, the relative position between the nozzle 103 and the receiving groove 106 is fixed, the receiving groove 106 is just below the nozzle 103, and the driving unit 115 controls the nozzle 103 and the receiving groove 106 to move simultaneously, so that the cost is saved and the space is saved.

In some embodiments, referring to fig. 1, 4 and 5, the semiconductor processing apparatus further comprises a control unit 120, where the control unit 120 is configured to send control signals to control the liquid supply device 101 and the receiving device 104 to perform corresponding operations. The operation includes at least the movement of the nozzle 103 and the receiving groove 106, the opening and closing of the first switching valve, the second switching valve, and the liquid outlet. The control unit 120 is electrically connected to the corresponding first switching valve 117, second switching valve (122 a, 122 b), liquid outlet 110, first suckback valve 118, and second suckback valve 119 to control the respective components to perform the corresponding switching operation, and the control unit 120 is also electrically connected to the first driving unit 113 and the second driving unit 114 (refer to fig. 1) or electrically connected to the driving unit 115 (refer to fig. 4) to control the driving unit to perform the corresponding driving operation.

In some embodiments, the control unit 120 is at least configured to send a first control signal to the liquid supply device 101 and send a second control signal to the receiving device 104 before the process starts, after the liquid supply device 101 receives the first control signal, move the nozzle 103 to a spraying position above a wafer to be processed, the receiving device 104 receives the second control signal, then controls the liquid outlet 110 at the bottom of the receiving tank 106 to be closed, and moves the receiving tank 106 along with the nozzle 103 to the spraying position above the wafer to be processed, after the receiving tank 106 moves to the spraying position, the receiving device 104 sends a first feedback signal to the control unit 120, the control unit 120 receives the first feedback signal and then sends a third control signal to the liquid supply device 101, after receiving the third control signal, the liquid supply device 101 controls the nozzle 103 to spray the liquid medicine into the receiving tank 106, the sensing unit 116 detects the real-time flow of the liquid medicine, and sends the detected real-time flow to the control unit 120, and when the detecting unit detects the real-time flow of the liquid medicine reaches the fourth control unit 120 and the fourth control unit controls the flow to be opened when the receiving the fourth control unit 104 and the fourth control unit controls the flow to be opened when the receiving unit 104 receives the real-time flow control signal.

The control unit 120 is further configured to send a fifth control signal to the receiving device 104 and send a sixth control signal to the liquid supply device 101 at the same time when the process is finished, the liquid supply device 101 stops spraying liquid when receiving the sixth control signal, and moves the nozzle back to the initial position, and the receiving device 104 controls the liquid outlet 110 at the bottom of the receiving tank 106 to be closed and moves the receiving tank 106 back to the initial position when receiving the fifth control signal.

Although the present invention has been described with respect to the preferred embodiments, it is not intended to limit the scope of the invention, and any person skilled in the art may make any possible variations and modifications to the technical solution of the present invention using the methods and technical matters disclosed above without departing from the spirit and scope of the present invention, so any simple modifications, equivalent variations and modifications to the above embodiments according to the technical matters of the present invention fall within the scope of the technical matters of the present invention.

Claims (20)

1. A semiconductor processing apparatus, comprising:

the liquid supply device comprises a liquid supply unit, a nozzle and a sensing unit, wherein the liquid supply unit is used for supplying liquid medicine, the nozzle is used for spraying and discharging the liquid medicine supplied by the liquid supply unit, the sensing unit is used for detecting the real-time flow rate of the liquid medicine supplied by the liquid supply unit, and the liquid supply device is also used for moving the nozzle to a spraying position above a wafer to be processed before the process begins;

the liquid discharge unit is used for discharging the liquid medicine in the receiving tank, the liquid outlet at the bottom of the receiving tank is controlled to be closed before the process starts, the receiving tank is moved to a spraying position above a wafer to be processed along with the nozzle, the liquid supply device controls the nozzle to spray the liquid medicine into the receiving tank, the sensing unit detects the real-time flow of the liquid medicine, the liquid medicine in the receiving tank is discharged in real time through the liquid discharge unit, when the real-time flow detected by the sensing unit reaches a preset flow, the liquid outlet at the bottom of the receiving tank is controlled to be opened, the liquid medicine sprayed by the nozzle passes through the liquid outlet to be sprayed to the surface of the wafer to be processed, and the process starts.

2. The semiconductor processing apparatus of claim 1, wherein the liquid supply device is further configured to control a nozzle to stop ejecting liquid droplets and move the nozzle to an initial position at the end of the process, and the receiving device is further configured to control the liquid outlet to be closed and move the receiving groove to an initial position along with the nozzle at the end of the process.

3. The semiconductor processing apparatus of claim 1, wherein the number of receiving slots and outlets is one.

4. The semiconductor processing apparatus of claim 2, wherein the receiving tank comprises an upper receiving tank and a lower receiving tank below the upper receiving tank, the liquid discharge unit is connected to the upper receiving tank and the lower receiving tank, respectively, the liquid outlet comprises an inner liquid outlet and an outer liquid outlet, the inner liquid outlet is located at the bottom of the upper receiving tank, the outer liquid outlet is located at the bottom of the lower receiving tank, and the inner liquid outlet and the outer liquid outlet are both openable or closable.

5. The semiconductor processing apparatus of claim 4, wherein the susceptor controls the closing of both the inner outlet at the bottom of the upper susceptor and the outer outlet at the bottom of the lower susceptor before the start of a process; when the real-time flow detected by the sensing unit reaches the preset flow, the receiving device firstly controls the opening of the outlet at the bottom of the lower receiving groove, and then controls the opening of the inner outlet at the bottom of the upper receiving groove.

6. The semiconductor processing apparatus of claim 5, wherein at the end of a process, the susceptor controls the inner outlet at the bottom of the upper susceptor to close and then controls the outer outlet at the bottom of the lower susceptor to close.

7. The semiconductor processing apparatus of claim 3 or 6, wherein the receiving means further comprises a gas purging unit for purging the liquid outlet after the liquid outlet is closed.

8. The semiconductor processing apparatus according to claim 7, wherein the gas ejected from the gas purging unit is an inert gas.

9. The semiconductor processing apparatus of claim 7, wherein when the liquid outlet comprises an inner liquid outlet and an outer liquid outlet, the gas purging unit comprises an upper gas outlet for purging the inner liquid outlet and a lower gas outlet for purging the outer liquid outlet.

10. The semiconductor processing apparatus according to claim 1, wherein the liquid supply device controls the nozzle to discharge the liquid medicine into the receiving tank after the nozzle and the receiving tank reach the discharge position, the sensing unit detects the real-time flow rate of the liquid medicine, the liquid medicine in the receiving tank is discharged in real time through the liquid discharge unit, when the real-time flow rate detected by the sensing unit reaches a preset flow rate, the receiving device controls the liquid outlet at the bottom of the receiving tank to be opened, the liquid medicine discharged by the nozzle is discharged to the surface of the wafer to be processed through the liquid outlet, and the process is started.

11. The semiconductor processing apparatus according to claim 1, wherein the liquid supply device controls the nozzle to discharge the liquid medicine into the receiving tank before the nozzle and the receiving tank reach the discharge position, the sensing unit detects the real-time flow rate of the liquid medicine, the liquid medicine in the receiving tank is discharged in real time through the liquid discharge unit, when the real-time flow rate detected by the sensing unit reaches a preset flow rate after the nozzle and the receiving tank reach the discharge position, the receiving device controls the liquid outlet at the bottom of the receiving tank to be opened, the liquid medicine discharged by the nozzle is discharged to the surface of the wafer to be processed through the liquid outlet, and the process is started.

12. The semiconductor processing apparatus according to claim 1, wherein the liquid supply unit of the liquid supply device includes a liquid supply end and a liquid supply pipe, an inlet end of the liquid supply pipe is connected to the liquid supply end, an outlet end of the liquid supply pipe is connected to the nozzle, a first switching valve and a first suck-back valve are provided on the liquid supply pipe, the first switching valve is used for controlling on-off of the liquid medicine in the liquid supply pipe, and the first suck-back valve is used for controlling suck-back amounts in the liquid supply pipe and the nozzle.

13. The semiconductor processing apparatus of claim 12, wherein the sensing unit is disposed on a liquid supply line, the sensing unit comprising a flow meter.

14. The semiconductor processing apparatus according to claim 1, wherein the liquid discharge unit of the receiving device includes a liquid discharge pipe, one end of the liquid discharge pipe is connected to the receiving tank, the other end of the liquid discharge pipe is connected to a lower end of the factory, a second switching valve and a second suck-back valve are provided on the liquid discharge pipe, the second switching valve is used for controlling on-off of the liquid medicine in the liquid discharge pipe, and the second suck-back valve is used for controlling suck-back amount in the liquid discharge pipe.

15. The semiconductor processing apparatus of claim 1, wherein the liquid supply means and the receiving means further comprise a driving unit having a movable end, the nozzle of the liquid supply means and the receiving groove of the receiving means are both fixed on the movable end of the driving unit, the receiving groove is located below the nozzle, and the driving unit drives the nozzle and the receiving groove to move simultaneously.

16. The semiconductor processing apparatus of claim 1, wherein the liquid supply device further comprises a first drive unit having a first movable end to which the nozzle of the liquid supply device is fixed, the first drive unit driving the nozzle to move, the second drive unit having a second movable end to which the receiving groove of the receiving device is fixed, the second drive unit driving the receiving groove to move.

17. The semiconductor processing apparatus of any one of claims 1, 10-16, further comprising a control unit for issuing control signals to control the liquid supply means and receiving means to perform corresponding operations.

18. The semiconductor processing apparatus according to claim 17, wherein the control unit is configured to send at least a first control signal to the liquid supply device and a second control signal to the receiving device before a process starts, the liquid supply device receives the first control signal and then moves the nozzle to a discharge position above a wafer to be processed, the receiving device receives the second control signal and then controls a liquid outlet at a bottom of the receiving tank to be closed, and moves the receiving tank along with the nozzle to a discharge position above the wafer to be processed, the receiving device sends a first feedback signal to the control unit after the receiving tank moves to the discharge position, the control unit sends a third control signal to the liquid supply device after receiving the first feedback signal, the liquid supply device controls the nozzle to discharge a liquid chemical into the receiving tank after receiving the third control signal, the sensing unit detects a real-time flow rate of the liquid chemical and sends the detected real-time flow rate to the control unit, the control unit compares the detected flow rate with a preset real-time flow rate to the receiving tank, and when the fourth control signal is received by the receiving device and the fourth control unit receives the real-time flow rate control signal to the receiving the fourth control signal.

19. The semiconductor processing apparatus of claim 1, wherein the semiconductor processing apparatus is a wafer cleaning apparatus.

20. The semiconductor processing apparatus of claim 1 or 19, wherein the medical fluid comprises at least deionized water.

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