CN115992339A

CN115992339A - Mask assembly and manufacturing apparatus of display device including the same

Info

Publication number: CN115992339A
Application number: CN202211252094.2A
Authority: CN
Inventors: 李锺大; 张原荣
Original assignee: Samsung Display Co Ltd
Current assignee: Samsung Display Co Ltd
Priority date: 2021-10-18
Filing date: 2022-10-13
Publication date: 2023-04-21
Also published as: KR20230055469A; CN218812024U

Abstract

The invention discloses a mask assembly and a manufacturing apparatus of a display apparatus including the same. The invention comprises the following steps: a mask frame having an opening region and having a groove; a plurality of mask sheets arranged in the opening area and spaced apart from each other in a first direction; and a first support frame that is disposed at an upper portion of the first support frame, and that is disposed to pass through the opening area, and that supports the mask pieces adjacent to each other among the plurality of mask pieces, wherein an end of the mask piece and an end of the first support frame are disposed inside the groove when viewed on a plane.

Description

Mask assembly and manufacturing apparatus of display device including the same

Technical Field

Embodiments of the present invention relate to an apparatus, and more particularly, to a mask assembly and a manufacturing apparatus of a display apparatus including the mask assembly.

Background

Mobility-based electronic devices are being widely used. Recently, in addition to small electronic devices such as mobile phones, tablet PCs are also widely used as mobile electronic devices.

To support various functions, such mobile electronic devices include a display device to provide visual information such as images or movies to a user. Recently, as other components for driving the display device become miniaturized, the specific gravity of the display device occupied in the electronic apparatus is gradually increasing, and a structure capable of being bent from a flat state to have a predetermined angle is also being developed. Such a display device may use a mask assembly to form a thin film.

Disclosure of Invention

Technical problem to be solved

In general, when the mask assembly and the substrate are brought into close contact with each other and deposition is performed, there are cases where the substrate is damaged by the mask assembly or cracks occur in the inside of the substrate. In this case, not only a defect of the final product but also a problem of a shortened life when the final product is used may occur. Embodiments of the invention provide a mask assembly preventing damage of a substrate and a manufacturing apparatus of a display device including the mask assembly.

Solution method

An embodiment of the present invention discloses a mask assembly, including: a mask frame having an opening region and having a groove; a plurality of mask sheets arranged in the opening area and spaced apart from each other in a first direction; and a first support frame that is disposed at an upper portion of the first support frame, and that is disposed to pass through the opening area, and that supports the mask pieces adjacent to each other among the plurality of mask pieces, wherein an end of the mask piece and an end of the first support frame are disposed inside the groove when viewed on a plane.

In this embodiment, the groove may extend in the first direction.

In this embodiment, at least one of the side surfaces of the groove may be inclined.

In this embodiment, the inclined one of the side surfaces of the groove may be lower from the edge of the groove toward the central portion of the groove.

In the present embodiment, at least one of the end of the mask sheet and the end of the first support frame may protrude in a direction away from the mask frame.

In this embodiment, the mask assembly may further include: a second support frame passing through the opening area and disposed at the mask frame in a manner crossing the first support frame.

Another embodiment of the present invention discloses a manufacturing apparatus of a display apparatus, the apparatus including: a mask assembly disposed opposite to the substrate; and a deposition source disposed opposite to the substrate with reference to the mask assembly, and supplying a deposition substance to the substrate, wherein the mask assembly includes: a mask frame having an opening region and having a groove; a plurality of mask sheets arranged in the opening area and spaced apart from each other in a first direction; and a first support frame that is disposed at an upper portion of the first support frame, and that is disposed to pass through the opening area, and that supports the mask pieces adjacent to each other among the plurality of mask pieces, wherein an end of the mask piece and an end of the first support frame are disposed inside the groove when viewed on a plane.

In this embodiment, the groove may extend in the first direction.

In this embodiment, the mask frame may further include: a second support frame passing through the opening area and disposed at the mask frame in a manner crossing the first support frame.

In this embodiment, the apparatus may further include: and a cooling plate disposed opposite the mask assembly centering on the substrate.

In this embodiment, the apparatus may further include: and a magnetic part arranged opposite to the mask assembly with the substrate as a center.

Still another embodiment of the present invention discloses a method of manufacturing a display device, the method including: a step of disposing a substrate on the mask assembly; a step of bringing a cooling plate into contact with the substrate; and a step of supplying a deposition substance from a deposition source so that the deposition substance passing through the mask assembly is deposited to the substrate, wherein the mask assembly includes: a mask frame having an opening region and having a groove; a plurality of mask sheets arranged in the opening area and spaced apart from each other in a first direction; and a first support frame that is disposed at an upper portion of the first support frame, and that is disposed to pass through the opening area, and that supports the mask pieces adjacent to each other among the plurality of mask pieces, wherein an end of the mask piece and an end of the first support frame are disposed inside the groove when viewed on a plane.

In this embodiment, the groove may extend in the first direction.

In this embodiment, the method may further include: a magnetic force is provided to the mask assembly to bring the mask assembly into close proximity to the substrate.

Other aspects, features and advantages, in addition to the foregoing, will become apparent from the following drawings, claims and detailed description of the invention.

These general and specific aspects may be implemented using a system, method, computer program, or some combination of systems, methods, computer programs.

Advantageous effects

The mask assembly, the manufacturing apparatus of the display apparatus including the mask assembly, and the manufacturing method of the display apparatus according to the embodiments of the present invention can reduce the damage of the substrate when manufacturing the display apparatus. In addition, the mask assembly, the manufacturing apparatus of the display device including the mask assembly, and the manufacturing method of the display device according to the embodiments of the present invention can reduce the defect rate when manufacturing the display device.

Drawings

Fig. 1 is a perspective view illustrating a mask assembly according to an embodiment of the present invention.

Fig. 2 is a cross-sectional view taken along line II-II of the mask assembly shown in fig. 1.

Fig. 3 and 4 are cross-sectional views illustrating the end of the mask sheet and the end of the first support frame shown in fig. 2.

Fig. 5 is a cross-sectional view showing a manufacturing apparatus of a display apparatus according to an embodiment of the present invention.

Fig. 6 is a plan view illustrating a display device according to an embodiment of the present invention.

Fig. 7 is a cross-sectional view taken along line VII-VII of the display device shown in fig. 6.

Description of the reference numerals

100: manufacturing apparatus for display device

110: chamber chamber

121: magnetic force part

122: cooling plate

130: support part

140: visual part

150: mask assembly

151: mask frame

152: mask sheet

153: first support frame

154: second supporting frame

160: deposition source

170: pressure regulating part

20: display device

21: substrate board

Detailed Description

The invention is capable of various modifications and its various embodiments, and its several embodiments are described in detail below with reference to the accompanying drawings. The effects and features of the present invention and a method of achieving the effects and features will become apparent by referring to embodiments described in detail later together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various forms.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings, and in the description with reference to the drawings, the same or corresponding constituent elements are given the same reference numerals regardless of the reference numerals, and the repeated description thereof will be omitted.

In the following embodiments, the terms "first", "second", etc. are used for the purpose of distinguishing one component from another, and are not used in a limiting sense.

In the following embodiments, singular expressions include plural expressions unless the context clearly indicates otherwise.

In the following embodiments, terms such as "comprising" or "having" mean that there are features or constituent elements described in the specification, and the possibility of adding one or more other features or constituent elements is not excluded in advance.

In the following embodiments, when a portion of a film, a region, a constituent element, or the like is referred to as being "on" or "over" another portion, it includes not only the case of directly on the other portion but also the case of other film, region, constituent element, or the like interposed therebetween.

In the drawings, the size of the constituent elements may be exaggerated or reduced for convenience of explanation. For example, the sizes and thicknesses of the respective constituent elements shown in the drawings are arbitrarily shown for convenience of explanation, and thus the present invention is not limited to those shown in the drawings.

In the following embodiments, the x-axis, y-axis, and z-axis are not limited to three axes in an orthogonal coordinate system, and may be interpreted in a broad sense including the same. For example, the x-axis, y-axis, and z-axis may be orthogonal to each other, but may also refer to mutually different directions that are not orthogonal to each other.

Where an embodiment may be implemented differently, the particular process sequence may be performed in a different order than illustrated. For example, two processes described as being performed in succession may be executed substantially concurrently or the two processes may be executed in the reverse order of description.

Fig. 1 is a perspective view illustrating a mask assembly according to an embodiment of the present invention. Fig. 2 is a cross-sectional view taken along line II-II of the mask assembly shown in fig. 1.

Referring to fig. 1 and 2, the mask assembly 150 may include a mask frame 151, a mask sheet 152, a first support frame 153, and a second support frame 154.

The mask frame 151 may be formed in the form of a window frame. At this time, the mask frame 151 may include a plurality of frames, and the plurality of frames may be connected to each other. One opening region may be formed at a central portion of the mask frame 151 as described above, and as another embodiment, a plurality of holes may be formed at a central portion of the mask frame 151. At this time, in the case where a plurality of holes are formed in the central portion of the mask frame 151, the central portion of the mask frame 151 may be formed in a mesh form. However, for convenience of explanation, a case where one opening area is arranged at the central portion of the mask frame 151 will be mainly described in detail below.

The mask frame 151 as described above may include a groove 151a. At this time, the grooves 151a may be disposed on the long side of the mask frame 151. In addition, the groove 151a may be disposed to overlap with the end of the mask sheet 152 and the end of the first support frame 153 when viewed in a plane. That is, the ends of the mask sheet 152 and the ends of the first support frame 153 may be disposed in a spaced apart form from the bottom surface of the groove 151a.

The mask sheet 152 may be disposed on the mask frame 151. At this time, the mask sheet 152 may be attached to the mask frame 151 by welding.

The mask sheet 152 may be provided in plurality, and may be arranged adjacent to each other in the direction of one side of the mask frame 151. At this time, the plurality of mask sheets 152 may shield the central portion of the opening of the mask frame 151. For example, the mask sheets 152 may be arranged adjacent to each other in the long-side direction of the mask frame 151.

Each mask sheet 152 may be attached to the mask frame 151 in a stretched state. For example, each of the mask sheets 152 may be welded and fixed to the mask frame 151 in a state stretched in the longitudinal direction of the mask sheet 152.

Each mask sheet 152 may include at least one opening (not labeled). At this time, the plurality of opening portions may be arranged to be spaced apart from each other.

At least one of the openings formed in each of the mask pieces 152 may be formed in the entire mask piece 152. As another example, at least one of the openings formed in each of the mask sheets 152 may be formed in a group, and a plurality of the groups may be formed in each of the mask sheets 152. For convenience of explanation, a case where at least one of the openings is formed in the entire mask sheet 152 will be mainly described in detail.

The mask sheet 152 as described above may include first protrusions 152a disposed on a side surface of the mask sheet 152 and protruding toward an upper surface of the mask sheet 152. Such a first protrusion 152a may be disposed at an upper portion of the groove 151a.

The first support frame 153 may be disposed at an opening region of the mask frame 151. The first support frame 153 may be disposed parallel to one side of the mask frame 151. The first support frame 153 may be disposed between the mask sheets 152. At this time, the first support frame 153 may support the mask sheet 152, thereby preventing the mask sheet 152 from sagging due to a load or the like when the mask sheet 152 is thermally deformed.

The first support frame 153 may include a second protrusion 153a, the second protrusion 153a being disposed on a side surface of the first support frame 153 and a portion of the second protrusion 153a protruding toward an upper surface of the first support frame 153. At this time, the second protrusion 153a may be formed integrally with the first protrusion 152a, or may be formed separately from the first protrusion 152a. In addition, the second protrusion 153a may be disposed at an upper portion of the groove 151a similarly to the first protrusion 152a.

The second support frame 154 may be disposed at an opening region of the mask frame 151. At this time, the second support frame 154 may be disposed to cross the first support frame 153. For example, the first support frame 153 may be arranged in parallel with one of the edges (e.g., short side) of the mask frame 151, and the second support frame 154 may be arranged in parallel with the other of the edges (e.g., long side) of the mask frame 151.

At least one of the first support frame 153 and the second support frame 154 as described above may be provided as at least one. At this time, the first and second support frames 153 and 154 may divide the opening area of the mask frame 151 into a plurality of portions by being arranged to cross each other.

In the case described above, the first and second support frames 153 and 154 may be arranged to be stacked on each other. For example, the mask frame 151, the first support frame 153, the second support frame 154, and the mask sheet 152 may be sequentially stacked from the lower portion to the upper portion. As another embodiment, the mask frame 151, the second support frame 154, the first support frame 153, and the mask sheet 152 may be sequentially stacked from the lower portion to the upper portion. In this case, the first support frame 153 and the second support frame 154 may be arranged in a form partially inserted into the mask frame 151. For example, the mask frame 151 may include coupling grooves for the first and second support frames 153 and 154 to be inserted, and the first and second support frames 153 and 154 may be inserted into such coupling grooves so as not to interfere with each other. At this time, the first and second support frames 153 and 154 may meet at a place crossing each other. In particular, the first support frame 153 and the second support frame 154 may meet each other due to the load of the mask sheet 152, the load of themselves. Hereinafter, for convenience of explanation, a case where the mask frame 151, the first support frame 153, the second support frame 154, and the mask sheet 152 are sequentially stacked from the lower portion to the upper portion will be mainly described in detail.

In view of the manufacturing method of the mask assembly 150 as described above, the groove 151a may be formed on the mask frame 151, and then the first and second support frames 153 and 154 may be disposed to the mask frame 151.

In the case as described above, the first support frame 153 and the second support frame 154 may be arranged on the mask frame 151 in a state stretched in the length direction and fixed to the mask frame 151.

When the above-described process is completed, the mask sheet 152 may be disposed on the mask frame 151 in a state stretched in the length direction, and then the mask sheet 152 may be fixed to the mask frame 151.

After fixing the mask sheet 152, a portion of the mask sheet 152 and a portion of the first support frame 153 may be cut and removed. At this time, the mask sheet 152 and the first support frame 153 may be cut at the same time, and the cut portion may be disposed at an upper portion of the groove 151a. For example, the mask sheet 152 and the cut portion of the first support frame 153 may be disposed at a central portion of the groove 151a. In this case, the first support frame 153 may have the mask sheet 152 disposed thereon.

The cutting of the mask sheet 152 and the first support frame 153 may be performed using a laser. At this time, the cut portions of the mask sheet 152 and the cut portions of the first support frame 153 are melted, thereby forming the first protrusions 152a and the second protrusions 153a. Such first protrusions 152a and second protrusions 153a may protrude from the upper surface of the mask sheet 152.

The mask assembly 150 as described above may be used to deposit organic matter on a substrate. At this time, even in the case where the mask assembly 150 contacts the substrate, the mask assembly 150 does not damage the substrate.

Referring to fig. 3 and 4, the grooves 151a in which the ends of the mask sheet 152 and the ends of the first support frame 153 are arranged may have various shapes. At this time, the side surfaces of the groove 151a may be formed obliquely. For example, the inclination of the groove 151a may be lower toward the center of the groove 151a.

As shown in fig. 3, the inclination of the side surfaces of the groove 151a as described above may be disposed at only one of the side surfaces of the groove 151a. As another embodiment, as shown in fig. 4, the inclination of the side surfaces of the groove 151a may be disposed at both sides of the side surfaces of the groove 151a. In this case, the length direction of the inclined surface of the groove 151a may be a direction perpendicular to the length direction of the mask sheet 152 and the length direction of the first support frame 153.

In the case as described above, when the substrate is disposed on the mask sheet 152, in the case where the substrate applies a force to the mask sheet 152, the tip of the mask sheet 152 and the tip of the first support frame 153 may be deformed toward the inside of the groove 151a so that the first protrusion 152a and the second protrusion 153a do not damage the substrate.

On the other hand, although not shown in the drawings, the side surfaces of the groove 151a may be formed in various shapes. For example, the side surface of the groove 151a may be formed to have a rounded cross-sectional shape. As another embodiment, the side surface of the groove 151a may also be formed to have a plurality of steps like a step shape.

Referring to fig. 5, the manufacturing apparatus 100 of the display apparatus may include a chamber 110, a mask assembly 150, a support 130, a deposition source 160, a vision part 140, a pressure adjusting part 170, and contact

parts

121, 122.

The inside of the chamber 110 may be formed with a space and may be formed to be partially opened. A gate valve 110a may be provided at an opening portion of the chamber 110 to open and close the opening portion.

The mask assembly 150 may include a mask frame 151, a mask sheet 152, a first support frame 153, and a second support frame 154. At this time, the mask frame 151, the mask sheet 152, the first support frame 153, and the second support frame 154 are the same as or similar to those described above, and thus detailed description thereof will be omitted.

The mask frame 151 may be disposed at the support 130. At this time, the support 130 may be fixedly disposed inside the chamber 110. In addition, the support 130 may also change the position of the mask assembly 150 to adjust the relative positions of the substrate 21 and the mask assembly 150.

Deposition source 160 may be disposed opposite mask assembly 150. At this time, the deposition source 160 may be fixedly disposed in the chamber 110, and as another embodiment, the deposition source 160 may be movably disposed in the chamber 110. However, for convenience of explanation, a case where the deposition source 160 is fixedly disposed inside the chamber 110 will be mainly described in detail.

A deposition material may be contained inside the deposition source 160. At this time, a heater 160a that applies heat to the deposition material may be disposed inside the deposition source 160.

The vision part 140 may be disposed at the chamber 110 to photograph the positions of the substrate 21 and the mask assembly 150. At this time, the vision part 140 may transmit the photographed image to a control part (not shown). The control part may align the substrate 21 and the mask assembly 150 through the support part 130 according to the positions of the substrate 21 and the mask assembly 150. As another embodiment, the above-described control part may also adjust the position of the mask assembly 150 by photographing the position of the mask assembly 150 using the vision part 140 before the substrate 21 is inserted into the chamber 110, and arrange the substrate 21 to correspond to the position of the mask assembly 150. At this time, the substrate 21 may be disposed on the mask assembly 150 by a robot arm or the like outside the chamber 110. As yet another embodiment, the control part may also align the positions of the deposition source 160 and the mask assembly 150 according to the positions of the substrate 21 and the mask assembly 150 measured by the vision part 140.

The pressure regulating part 170 may be connected to the chamber 110 to discharge the gas inside the chamber 110 to the outside. At this time, the pressure adjusting part 170 may include a connection pipe 171 connected to the chamber 110 and a pressure adjusting pump 172 provided to the connection pipe 171. The pressure regulating pump 172 may maintain the pressure inside the chamber 110 at atmospheric pressure or a vacuum state according to operation.

The

contact portions

121, 122 may contact the substrate 21 and bring the substrate 21 and the mask assembly 150 into close contact with each other. The

contact portions

121 and 122 may contact the substrate 21 to adjust the temperature of the substrate 21. For example, the

contact parts

121, 122 may include a magnetic part 121 providing a magnetic force to the mask assembly 150 and a cooling plate 122 disposed between the magnetic part 121 and the substrate 21. At this time, the cooling plate 122 may be in contact with the substrate 21, and may reduce the temperature of the substrate 21 when the deposition material is deposited on the substrate 21.

In view of the operation method of the display device manufacturing apparatus 100 described above, the mask assembly 150 may be inserted into the chamber 110 from the outside. The mask assembly 150 may be mounted to the support 130. At this time, the mask assembly 150 may enter the interior of the chamber 110 from the exterior of the chamber 110 by a robot arm or the like additionally provided at the exterior of the chamber 110. As another example, the mask assembly 150 may also be supplied from another chamber that is connected to the chamber 110 and stores the mask assembly 150.

When the above process is completed, the substrate 21 may be disposed on the mask assembly 150 from the outside of the chamber 110 by a robot arm. At this time, the positions of the substrate 21 and the mask assembly 150 may be adjusted according to the image photographed by the vision part 140.

When the above-described process is completed, the

contact portions

121, 122 may be in contact with one surface of the substrate 21. In this case, the supporting portion 130 or the

contact portions

121, 122 may be arranged to be linearly movable. As an example, when the support 130 is lifted, the substrate 21 may be brought into contact with the

contact portions

121 and 122 by lifting the support 130. As another example, in the case where the

contact portions

121, 122 are lifted, the

contact portions

121, 122 may be brought into contact with the substrate 21 by lowering the

contact portions

121, 122.

As described above, when the

contact portions

121, 122 are lowered, the

contact portions

121, 122 may contact the substrate 21 and cling the substrate 21 to the mask assembly 150. At this time, the substrate 21 is closely attached to the mask assembly 150 by the method in which the

contact portions

121, 122 may apply a force to the substrate 21 toward the mask assembly 150 side, or may provide a magnetic force to the mask assembly 150 to pull the mask assembly 150 toward the

contact portions

121, 122 side so that the substrate 21 and the mask assembly 150 are closely attached to each other.

In the case as described above, at least one of the first protrusion 152a of the mask sheet 152 and the second protrusion 153a of the first support frame 153 may protrude further toward the substrate 21 side than the upper surface of the mask sheet 152 (i.e., the surface of the mask sheet 152 in contact with the substrate 21), and at least one of the first protrusion 152a and the second protrusion 153a may provide an excessive force to the substrate 21.

In the case as described above, since the first protrusion 152a and the second protrusion 153a are not in contact with the inner surface of the groove 151a, when the force as described above is generated, the tip of the mask sheet 152 on which the first protrusion 152a is disposed and the tip of the first support frame 153 on which the second protrusion 153a is disposed may be inserted into the inside of the groove 151a. That is, the end of the mask sheet 152 and the end of the first support frame 153 may not be disposed on the boundary of the groove 151a, but may be disposed inside the groove 151a when viewed on a plane, thereby becoming a cantilever shape. In this case, since the end of the mask sheet 152 and the end of the first support frame 153 become a freely swingable structure, a force is not continuously applied to the substrate 21 due to a force applied to the substrate 21, but the end of the mask sheet 152 and the end of the first support frame 153 may be deformed.

In the case as described above, the force applied to the substrate 21 by the end of the mask sheet 152 and the end of the first support frame 153 can be reduced, thereby preventing the substrate 21 from being damaged.

When the above process is completed, the deposition material may pass through the mask assembly 150 and be deposited to the substrate 21 while the heater 160a is operated such that the deposition material is vaporized or sublimated. At this time, the cooling plate 122 may operate to lower the temperature of the substrate 21, thereby preventing the deposition material from being detached after being deposited on the substrate 21. In addition, the pressure regulating pump 172 may operate to discharge the deposition material inside the chamber 110 to the outside.

Accordingly, the display device manufacturing apparatus 100 and the display device manufacturing method can prevent the substrate 21 from being damaged when depositing a deposition substance onto the substrate 21. The display device manufacturing apparatus 100 and the display device manufacturing method can not only improve the quality of a product but also minimize defects generated during the manufacturing process by preventing the substrate 21 from being damaged during the deposition process.

The display device manufacturing apparatus 100 and the display device manufacturing method can prevent the lifetime of the manufactured display device from being shortened due to the damage of the substrate 21.

Fig. 6 is a plan view illustrating a display device according to an embodiment of the present invention. Fig. 7 is a cross-sectional view taken along line VII-VII of the display device shown in fig. 6.

Referring to fig. 6 and 7, in the display device 20, a display area DA and a non-display area located at the periphery of the display area DA may be defined on the substrate 21. The light emitting part D may be disposed in the display area DA, and a power supply wiring (not shown) or the like may be disposed in the non-display area. In addition, a pad portion C may be disposed in the non-display region.

The display device 20 may include a substrate 21 and a light emitting portion D. In addition, the display device 20 may include a thin film encapsulation layer E formed on an upper portion of the light emitting portion D. At this time, the substrate 21 may be made of a plastic material, or a metal material such as SUS or Ti. In addition, polyimide (PI) may be used for the substrate 21. For convenience of explanation, the case where the substrate 21 is mainly formed of polyimide will be described in detail below.

The light emitting portion D may be formed on the substrate 21. At this time, the light emitting part D may include a thin film transistor TFT, and the passivation layer 27 may be formed to cover the thin film transistor TFT, and the organic light emitting element 28 may be formed on the passivation layer 27.

The substrate 21 may include a single layer or multiple layers. As an example, in the case where the substrate 21 is a single layer, the substrate 21 may include Polyimide (PI), polyether sulfone (PES), polyarylate (polyarylate), polyether imide (PEI), polyethylene naphthalate (PEN, polyethyelenene napthalate), polyethylene terephthalate (PET), polyphenylene sulfide (PPS, polyphenylene sulfide), polycarbonate (PC), cellulose Triacetate (TAC), cellulose acetate propionate (CAP, cellulose acetate propionate), and/or the like. As another example, the substrate 21 may be a multilayer structure including a base layer including a polymer resin and an inorganic layer. For example, the substrate 21 may include a base layer including a polymeric resin and a barrier layer formed of an inorganic insulating layer. Hereinafter, for convenience of explanation, a case where the substrate 21 is a multilayer structure including a base layer including a polymer resin and an inorganic layer will be mainly described in detail.

The buffer layer 22 formed of an organic compound and/or an inorganic compound may also be formed on the upper surface of the substrate 21, and may be formed of SiO _x (x≥1)、SiN _x (x.gtoreq.1).

After the active layers 23 arranged in a predetermined pattern are formed on the buffer layer 22, the active layers 23 are covered with the gate insulating layer 24. The active layer 23 has a source region 23a and a drain region 23c, and further includes a channel region 23b therebetween.

Such an active layer 23 may be formed to contain various substances. For example, the active layer 23 may contain an inorganic semiconductor substance such as amorphous silicon or crystalline silicon. As another example, the active layer 23 may contain an oxide semiconductor. As yet another example, the active layer 23 may contain an organic semiconductor substance. However, in the following, for convenience of explanation, a case where the active layer 23 is formed of amorphous silicon will be mainly described in detail.

Such an active layer 23 may be formed by forming an amorphous silicon film on the buffer layer 22, crystallizing the amorphous silicon film to form a polysilicon film, and patterning the polysilicon film. The source and

drain regions

23a and 23c of the active layer 23 described above may be doped with impurities according to the types of thin film transistors such as a driving thin film transistor (not shown) and a switching thin film transistor (not shown).

A gate electrode 25 corresponding to the active layer 23 and an interlayer insulating layer 26 covering the gate electrode 25 are formed on an upper surface of the gate insulating layer 24.

Next, after the contact hole H1 is formed in the interlayer insulating layer 26 and the gate insulating layer 24, a source electrode 27a and a drain electrode 27b are formed on the interlayer insulating layer 26 so as to be in contact with the source region 23a and the drain region 23c, respectively.

The passivation layer 27 is formed on the upper portion of the thin film transistor TFT thus formed, and the pixel electrode 28a of the organic light emitting element (OLED) 28 is formed on the upper portion of the passivation layer 27. The pixel electrode 28a is in contact with the drain electrode 27b or the source electrode 27a of the thin film transistor TFT through a via hole H2 formed in the passivation layer 27. The passivation layer 27 may be formed of an inorganic substance and/or an organic substance, and may be formed of a single layer or two or more layers, and the passivation layer 27 may be formed as a planarization film to planarize an upper surface regardless of bending of a lower film, and conversely, the passivation layer 27 may be formed to be bent according to bending of a film located at a lower portion. In addition, the passivation layer 27 is preferably formed of a transparent insulator so as to be able to achieve a resonance effect.

After forming the pixel electrode 28a on the passivation layer 27, the pixel defining film 29 is formed of an organic and/or inorganic substance to cover the pixel electrode 28a and the passivation layer 27, and the pixel defining film 29 is opened to expose the pixel electrode 28a.

Next, an intermediate layer 28b and a counter electrode 28c are formed at least on the pixel electrode 28a.

The pixel electrode 28a serves as an anode and the counter electrode 28c serves as a cathode, although the polarities of the pixel electrode 28a and the counter electrode 28c may be reversed.

The pixel electrode 28a and the counter electrode 28c are insulated from each other by the above-described intermediate layer 28b, and the organic light-emitting layer emits light by applying voltages of different polarities to the intermediate layer 28 b.

The intermediate layer 28b may include an organic light emitting layer. As an alternative another example, the intermediate layer 28b may include an organic light emitting layer, and may include at least one of a hole injection layer (hole injection layer), a hole transport layer (hole transport layer), an electron transport layer (electron transport layer), and an electron injection layer (electron injection layer) in addition thereto. The present embodiment is not limited thereto, and the intermediate layer 28b may include an organic light emitting layer, and may further include other various functional layers (not shown).

At this time, the intermediate layer 28b as described above may be formed by a manufacturing apparatus (not shown) of the display device described above. For example, the organic light-emitting layer in the intermediate layer 28b may be formed by the manufacturing apparatus of the display device described above.

On the other hand, one unit pixel is composed of a plurality of sub-pixels, and the plurality of sub-pixels may emit light of various colors. For example, the plurality of sub-pixels may include sub-pixels that emit red light, green light, and blue light, respectively, and may include sub-pixels (not labeled) that emit red light, green light, blue light, and white light.

On the other hand, the thin film encapsulation layer E as described above may include a plurality of inorganic layers, or may include an inorganic layer and an organic layer.

The above-mentioned organic layer of the film encapsulation layer E may be formed of a polymer, and may be a single layer or a laminate preferably formed of any one of polyethylene terephthalate, polyimide, polycarbonate, epoxy resin, polyethylene, and polyacrylate. More preferably, the above-mentioned organic layer may be formed of polyacrylate, and specifically may include a product obtained by polymerizing a monomer composition including a diacrylate-based monomer and a triacrylate-based monomer. The monomer composition may further comprise a monoacrylate monomer. In addition, the monomer composition may further include a known photoinitiator such as TPO, but is not limited thereto.

The above inorganic layer of the thin film encapsulation layer E may be a single layer or a stacked layer including a metal oxide or a metal nitride. Specifically, the inorganic layer may include SiN _x 、Al ₂ O ₃ 、SiO ₂ And TiO ₂ Any one of them.

The uppermost layer of the thin film encapsulation layer E exposed to the outside may be formed of an inorganic layer to prevent moisture permeation to the organic light emitting element.

The thin film encapsulation layer E may include at least one sandwich structure in which at least one organic layer is interposed between at least two inorganic layers. As another example, the thin film encapsulation layer E may include at least one sandwich structure in which at least one inorganic layer is interposed between at least two organic layers. As yet another example, the thin film encapsulation layer E may also include a sandwich structure in which at least one organic layer is interposed between at least two inorganic layers and a sandwich structure in which at least one inorganic layer is interposed between at least two organic layers.

The thin film encapsulation layer E may include a first inorganic layer, a first organic layer, and a second inorganic layer in this order from an upper portion of the organic light emitting element (OLED) 28.

As another example, the thin film encapsulation layer E may include a first inorganic layer, a first organic layer, a second inorganic layer, a second organic layer, and a third inorganic layer in this order from an upper portion of the organic light emitting element (OLED) 28.

As yet another example, the thin film encapsulation layer E may include a first inorganic layer, a first organic layer, a second inorganic layer, a second organic layer, a third inorganic layer, a third organic layer, and a fourth inorganic layer in this order from an upper portion of the organic light emitting element (OLED) 28.

An organic light emitting element (OLED) 28 may additionally include a metal halide layer comprising LiF between the first inorganic layer. The metal halide layer may prevent the organic light emitting element (OLED) 28 from being damaged when the first inorganic layer is formed in a sputtering manner.

The area of the first organic layer may be smaller than the area of the second inorganic layer, and the area of the second organic layer may also be smaller than the area of the third inorganic layer.

Accordingly, the display device 20 includes the intermediate layer 28b forming a precise pattern, and the intermediate layer 28b is deposited to be formed at a correct position, so that a precise image can be presented. In addition, even if the intermediate layer 28b is repeatedly deposited, the display device 20 can be formed in a certain pattern so as to exhibit uniform quality in continuous production.

As described above, the present invention has been described with reference to the embodiments shown in the drawings, but this is merely exemplary, and those skilled in the art will understand that various modifications and embodiments can be made thereto. Therefore, the true technical scope of the present invention should be determined by the technical ideas of the appended claims.

Claims

1. A mask assembly, comprising:

a mask frame having an opening region and having a groove;

a plurality of mask sheets arranged in the opening area and spaced apart from each other in a first direction; and

a first support frame that is disposed at an upper portion of the first support frame, that is disposed to pass through the opening area, and that supports the mask pieces adjacent to each other among the plurality of mask pieces,

wherein the end of the mask sheet and the end of the first support frame are disposed inside the groove when viewed on a plane.

2. The mask assembly of claim 1, wherein,

the slot extends in the first direction.

3. The mask assembly of claim 1, wherein,

at least one of the side surfaces of the groove is inclined.

4. The mask assembly according to claim 3, wherein,

the inclined one of the side surfaces of the groove is lower from the edge of the groove toward the central portion of the groove.

5. The mask assembly of claim 1, wherein,

at least one of the end of the mask sheet and the end of the first support frame protrudes in a direction away from the mask frame.

6. The mask assembly of claim 1, further comprising:

a second support frame passing through the opening area and disposed at the mask frame in a manner crossing the first support frame.

7. A manufacturing apparatus of a display device, comprising:

a mask assembly disposed opposite to the substrate; and

a deposition source disposed opposite to the substrate with reference to the mask assembly and supplying a deposition material to the substrate,

wherein the mask assembly comprises:

a mask frame having an opening region and having a groove;

8. The apparatus for manufacturing a display device according to claim 7, wherein,

the slot extends in the first direction.

9. The apparatus for manufacturing a display device according to claim 7, wherein,

at least one of the side surfaces of the groove is inclined.

10. The apparatus for manufacturing a display device according to claim 9, wherein,