CN115990955A - Device and equipment for wire cutting silicon rod, silicon wafer and manufacturing method thereof - Google Patents
Device and equipment for wire cutting silicon rod, silicon wafer and manufacturing method thereof Download PDFInfo
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- CN115990955A CN115990955A CN202211669380.9A CN202211669380A CN115990955A CN 115990955 A CN115990955 A CN 115990955A CN 202211669380 A CN202211669380 A CN 202211669380A CN 115990955 A CN115990955 A CN 115990955A
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The embodiment of the invention discloses a device, equipment, a silicon wafer and a manufacturing method thereof for wire cutting a silicon rod, wherein the device comprises the following components: a spool body; a guide module disposed on a circumferential surface of the bobbin body, the guide module including a plurality of guide grooves parallel to each other and spaced apart, for winding a cutting wire to form an array of a plurality of cutting line segments parallel to each other, the array for cutting a silicon rod into a plurality of silicon chips at one time by a movement along an extension direction of the cutting wire; the guide module comprises a tension adjusting section, wherein the tension adjusting section is arranged to drive the cutting line segments wound on the tension adjusting section to deviate along a direction away from and towards the spool body together during linear cutting operation so as to adjust the actual tension of the cutting line segments to target tension.
Description
Technical Field
The embodiment of the invention relates to the technical field of wafer processing, in particular to a device and equipment for wire cutting a silicon rod, a silicon wafer and a manufacturing method thereof.
Background
Silicon wafers are used as carriers in semiconductor circuit fabrication processes, and their quality has a decisive impact on integrated circuit formation. At present, the main procedures in the preliminary molding process of the silicon wafer comprise: cutting silicon rod, physical and chemical grinding, chemical etching, physical and chemical polishing, etc. Silicon rod cutting is one of core processes in a silicon wafer forming process, and mainly comprises multi-line mortar (SiC) cutting and inner circle cutting. Taking the forming of a 12-inch wafer as an example, the mainstream technology adopted at present is multi-wire cutting, because compared with the inner circle cutting, the multi-wire cutting has the advantages of high efficiency, good quality, high wafer yield and the like.
Multi-wire cutting is an advanced slicing technology at present, and the principle is that cutting wires are wound on a group of bobbins to form an array of cutting wire segments, abrasive materials are brought into a processing area of a material to be cut (such as a silicon rod) by high-speed reciprocating motion of the cutting wires to grind, and a workpiece to be cut is fed in a vertical direction by lifting of a workbench, so that the workpiece is cut into a plurality of thin slices (such as wafers) with required size and shape. The abrasive material used in the multi-wire cutting process is preferably mortar, so that not only can the grinding be assisted, but also the cooling effect can be achieved in the multi-wire cutting process.
As the cutting process continues, the position of the silicon rod to be cut changes, the force borne by the cutting line changes, and accordingly, the magnitude of the tension of the cutting line also changes. The amount of the tension of the cutting line has a direct influence on the surface quality of the cut silicon wafer, the service life of the cutting line and the like, so the tension of the cutting line should be adjusted in real time in the cutting process.
Disclosure of Invention
In view of the above, embodiments of the present invention desirably provide an apparatus, a device, a silicon wafer, and a method of manufacturing the same for wire-cutting a silicon rod; the tension of the cutting line can be adjusted in the cutting process, the flatness and the surface quality of the cut silicon wafer are improved, and the service life of the cutting line is prolonged.
The technical scheme of the embodiment of the invention is realized as follows:
in a first aspect, an embodiment of the present invention provides an apparatus for wire cutting a silicon rod, the apparatus 5 comprising:
a spool body;
a guide module disposed on the circumferential surface of the spool body, the guide module including a plurality of guide grooves parallel to each other and spaced apart for winding the cutting line to form a plurality of cutting line segments parallel to each other
An array formed by the silicon rod cutting device, wherein the array is used for cutting the silicon rod into a plurality of silicon chips at one time through movement along the extending direction of the cutting line;
the guide module comprises a tension adjusting section, wherein the tension adjusting section is arranged to drive the cutting line segments wound on the tension adjusting section to deviate along a direction away from and towards the spool body together during linear cutting operation so as to adjust the actual tension of the cutting line segments to target tension.
In a second aspect, embodiments of the present invention provide an apparatus for wire cutting a silicon rod, the apparatus comprising:
the apparatus for wire-cutting a silicon rod according to the first aspect;
the bearing unit is used for loading and fixing the silicon rod to be processed;
and the movement control unit is used for controlling the device for wire cutting the silicon rod and/or the bearing unit to move 0 so that the device for wire cutting the silicon rod and the bearing unit move towards each other to cut the silicon rod.
In a third aspect, embodiments of the present invention provide a method for manufacturing a silicon wafer, the method comprising:
manufacturing a silicon wafer using the apparatus for wire-cutting a silicon rod according to the third aspect, comprising the steps of:
loading and fixing the silicon rod through the bearing unit;
5 controlling the device for wire cutting the silicon rod and the bearing unit loaded and fixed with the silicon rod to move in opposite directions by the movement control unit so as to cut the silicon rod;
and cleaning and detecting the silicon wafer obtained after the silicon rod is cut.
In a fourth aspect, embodiments of the present invention provide a silicon wafer obtained by using the apparatus for wire-cutting a silicon rod according to the second aspect.
The embodiment of the invention provides a device for wire cutting of a silicon rod; the device comprises a spool body and a guide module arranged on the circumferential surface of the spool body, wherein the guide module comprises a tension adjusting section; in the linear cutting process, the tension adjusting section drives the cutting line section to offset and adjust the span of the cutting line section along the direction away from and towards the spool body, so that the tension of the cutting line section is adjusted, based on the tension adjusting section, the tension of the cutting line section can be adaptively adjusted according to the change of the cutting condition, and the tension of the cutting line section is kept in a proper range, so that the flatness and the surface quality of a silicon wafer cut by a wire are improved, and the condition of wire breakage caused by overlarge tension of the cutting line section is avoided.
Drawings
Fig. 1 is a schematic view of a conventional wire cutting apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic view of another conventional wire cutting apparatus provided in an embodiment of the present invention;
FIG. 3 is a schematic view of an apparatus for wire cutting silicon rods according to an embodiment of the present invention;
fig. 4 is a schematic structural view of an apparatus for wire-cutting a silicon rod according to an embodiment of the present invention;
FIG. 5 is a schematic view of an apparatus for wire cutting silicon rods according to another embodiment of the present invention;
FIG. 6 is a schematic view of an apparatus for wire cutting silicon rods according to yet another embodiment of the present invention;
FIG. 7 is a schematic view of an apparatus for wire cutting silicon rods according to an embodiment of the present invention;
fig. 8 is a flowchart of a method for manufacturing a silicon wafer according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
Referring to fig. 1, which shows a schematic view of a conventional wire cutting apparatus 1, it is to be understood that the structure shown in fig. 1 is merely for explanation of principle, and does not represent that one skilled in the art would not add or subtract components to the constituent structure shown in fig. 1 according to a specific implementation state, and the embodiment of the present invention is not limited thereto in particular. As shown in fig. 1, the wire cutting apparatus 1 may include a wire cutting unit 11 and a carrying unit 12; the wire cutting unit 11 may be placed below the vertical direction of the carrying unit 12 as shown in fig. 1 in some examples, or may be placed above the vertical direction of the carrying unit 12 as shown in fig. 2 in some examples. Specifically, the wire cutting unit 11 may include a plurality of bobbins 111 and a cutting wire 112, the cutting wire 112 being wound on the bobbins 111 to form an array of mutually parallel cutting line segments; in fig. 1, the number of the bobbins 111 is illustrated as 2, and the reciprocating direction of the bobbins 111 and the cutting line 112 toward and away from the carrying unit 12 as indicated by solid arrows in fig. 1 may be, for example, 10m/s to 15m/s. The carrying unit 12 is used for loading and fixing the silicon rod 2 to be processed, and in the example shown in fig. 1 and 2, the carrying unit 12 may include a base 121 and an intermediate member 122, and the intermediate member 122 may fix the silicon rod 2 to be processed to the base 121, for example, the silicon rod to be processed may be fixed to the base by being bonded to a lower surface (fig. 1) or an upper surface (fig. 2) of the base with resin through a circumferential surface thereof.
With the wire cutting apparatus 1 shown in fig. 1, 2, the cutting of the silicon rod 2 to be processed can be achieved by the movement of the cutting line 112 in the extending direction thereof after the mutual contact of the cutting line 112 and the silicon rod 2 to be processed by moving the wire cutting unit 11 or the carrying unit 12 to move the cutting line 112 and the silicon rod 2 to be processed in the opposite direction in the vertical direction. In the example shown in fig. 1, the wire cutting unit 11 may be moved in the direction indicated by the black arrow, or the carrying unit 12 may be moved in the direction indicated by the broken white arrow, to achieve a relative movement between the cutting wire 112 and the silicon rod 2 to be processed in the vertical direction. In the example shown in fig. 2, the carrying unit 12 may be moved in the direction indicated by the black arrow, or the wire cutting unit 11 may be moved in the direction indicated by the broken white arrow, to achieve a relative movement between the cutting wire 112 and the silicon rod 2 to be processed in the vertical direction. It should be noted that, in the embodiment of the present invention, the lifting device (not shown in the drawings) is added to implement the movement of the wire cutting unit 11 or the carrying unit 12, and it can be understood that, according to the actual needs and implementation scenarios, a person skilled in the art may implement the movement of the wire cutting unit 11 or the carrying unit 12 in other manners, which is not described in detail herein.
In the conventional scheme, a plurality of guide grooves for guiding the cutting line 112 are provided on the bobbins 111, the guide grooves being spaced apart from each other at uniform intervals, that is, the intervals between the adjacent guide grooves are uniform, the cutting line 112 is sequentially wound around each guide groove of each bobbin 111 such that the cutting line 112 is formed in an array composed of a plurality of cutting line segments in which the cutting line segments are parallel to each other in order to cut the silicon rod into a plurality of silicon chips at one time.
In the process of wire cutting, the control of the tension of the cutting wire section is closely related to whether the wire cutting processing can be smoothly performed or not and the processing quality, and is one of the core elements of the cutting process, if the control is improper, obvious lines can be formed on the surface of the cut silicon wafer, the silicon wafer is broken, and even the wire breakage can be caused. Specifically, if the tension of the cutting line segment is too high, silicon carbide particles attached to the cutting line are difficult to enter a cutting area, the cutting efficiency is reduced, obvious line marks are formed, the cutting line is broken under the more serious condition, and the wire cutting process is forced to be interrupted; if the tension of the cutting line segment is too small, the cutting line is possibly caused to be additionally vibrated at a low frequency, the bending degree of the cutting line is increased, the sand carrying capacity is reduced, the cutting capacity is reduced, the surface processing quality of the silicon wafer is affected, and the warping degree of the cut silicon wafer is larger. It is particularly noted that the required tension of the cutting wire segment is different for different stages of the wire cutting process due to the different cutting positions.
Based on the above, the embodiments of the present invention are expected to provide a device, an apparatus, a silicon wafer, and a method for manufacturing the same for wire-cutting a silicon rod, which can adjust the tension of a cutting wire during cutting, improve the flatness and surface quality of the cut silicon wafer, and prolong the service life of the cutting wire.
In this regard, referring to fig. 3, there is shown an apparatus 200 for wire cutting a silicon rod according to an embodiment of the present invention, the apparatus 200 comprising:
a spool body 201;
a guide module 202 provided on a circumferential surface 201a of the bobbin body 201, the guide module 202 including a plurality of guide grooves GG parallel to each other and spaced apart for winding the cutting line 112 to form an array AR of a plurality of cutting line segments SE parallel to each other for cutting the silicon rod 2 into a plurality of silicon chips at one time by a movement in an extending direction of the cutting line 112;
wherein the guiding module comprises a tension adjusting section 2021, the tension adjusting section 2021 is configured to drive the cutting wire segment SE wound on the tension adjusting section 2021 to be offset together in a direction away from and towards the spool body 201 during a wire cutting operation so as to adjust an actual tension of the cutting wire segment SE to a target tension.
As shown in fig. 3, the apparatus 200 provided by the embodiment of the present invention includes a bobbin body 201 and a guide module 202 provided on a circumferential surface 201a of the bobbin body 201, wherein a guide groove GG is formed on the guide module 202. In the embodiment shown in fig. 3, the guide module 202 is formed in a cylindrical shape to fit over the bobbin body 201, and a part of the circumference of the guide module 202 constitutes the tension adjusting section 2021, whereby the guide module 202 can be divided into two parts, one part being fixed to the circumferential surface 201a of the bobbin body 201 and the other part being capable of being offset in a direction toward the bobbin body 201 and away from the bobbin body 201. For example, when the tension adjustment section 2021 is offset in a direction away from the spool body 201, the cut line segment is also lifted by the tension adjustment section 2021 away from the spool body 201, the span of the cut line segment increases, and thus is tightened, the tension also increases; conversely, when the tension adjustment section 2021 is offset in a direction toward the spool body 201, the cut line segment also decreases with the tension adjustment section 2021 approaching the spool body 201, and thus is relaxed, and the tension also decreases. It should be noted that the target tension may be an ideal tension determined from a summary of practical production experience, which may be a range of values, and that the target tension may be different for different cutting conditions, e.g. different cutting positions for the same silicon rod, different sizes of silicon rods, different cutting fluid conditions, etc., the range of values of the target tension may also be different. The offset of the tension adjustment section 2021 may be adjusted in real time according to the target tension while using the apparatus 200 to achieve the adjustment of the actual tension.
The embodiment of the invention provides a device 200 for wire cutting silicon rods; the device 200 comprises a spool body 201 and a guiding module 202 arranged on the circumferential surface of the spool body 201, the guiding module 202 comprising a tension adjusting section 2021; in the wire cutting process, the tension adjusting section 2021 drives the cutting line segment SE to offset and adjust the span of the cutting line segment along the direction away from and towards the spool body, so that the tension of the cutting line segment is adjusted, based on the tension, the tension of the cutting line segment can be adaptively adjusted according to the change of the cutting condition, and the tension of the cutting line segment is kept in a proper range, so that the flatness and the surface quality of a silicon wafer cut by a wire are improved, and the condition of wire breakage caused by overlarge tension of the cutting line segment is avoided.
For a specific implementation of the tension adjustment section, preferably, referring to fig. 4, the tension adjustment section 2021 is arc-segment shaped, and one end of the tension adjustment section 2021 is connected to the spool body 201 by a hinge 203, so that the tension adjustment section 2021 can rotate about the hinge 203 in a direction away from and toward the spool body 201. In fig. 4, a part of the guiding module 202 constitutes the tension adjusting section 2021, while another part is formed integrally with the spool body 201, the tension adjusting section 2021 being connected with another part of the guiding module 202 via the hinge 203, thereby being connected with the spool body 201, of course, it is conceivable that the hinge 203 may be provided directly on the spool body 201, such that the tension adjusting section 2021 can be directly connected to the spool body 201 via the hinge 203.
In fig. 4, the tensioning section 2021 is formed by one half circumference of the guide module 202 and is disposed on the right side of the spool body. The tension adjusting section 2021 includes a connecting end 2021a and a free end 2021b, the connecting end 2021a is connected to the spool body 201 by the hinge 203, the entire tension adjusting section 2021 can be rotated away from the spool body 201 in a clockwise direction about the hinge 203, and can also be rotated toward the spool body 201 in a counterclockwise direction about the hinge 203, and accordingly the cutting wire segment wound on the tension adjusting section 2021 can be driven to be offset away from and toward the spool body 201 to tighten or loosen the cutting wire segment to change the tension of the cutting wire segment.
For the same wire cutting apparatus, one or two devices 200 may be provided, as shown in fig. 3, taking the case of two devices 200 as an example, two devices 200 are provided symmetrically with respect to the silicon rod in the horizontal direction, wherein two tension adjustment sections 2021 are also provided symmetrically, whereby the adjustment of the tension of the cutting wire segment can be achieved by synchronous offset.
In order to achieve the support capability of the tension adjusting section 2021 to the cutting line segment and to reduce the abrasion to the cutting line segment, it is preferable that the tension adjusting section 2021 includes a metal base 2022 and a resin portion 2023 provided on an upper surface of the metal base, wherein the guide groove GG is formed by the resin portion 2023, the tension adjusting section 2021 is provided with the capability of independently supporting the cutting line segment by the metal base 2022, and the resin portion 2023 prevents the metal base from being in direct contact with the cutting line segment, reducing the abrasion to the cutting line segment.
Since the resin portion 2023 is an easily abradable component, it is preferable that the resin portion be removably disposed on the metal base so that once the resin portion is worn it is no longer able to guide the cut line segment, it can be removed and replaced with a new resin portion, as a non-limiting example, the resin portion 2023 can be adhered to the metal base.
According to a preferred embodiment of the invention, as shown in fig. 5, the device further comprises: a detection module 204, wherein the detection module 204 is configured to detect the actual tension of the cutting line segment. As discussed above, in the wire cutting process, the actual tension of the cutting wire is changed, and not the whole process needs to adjust the tension of the cutting wire, by setting the detecting module 204, it can be determined whether the tension adjustment operation needs to be performed according to the detection result of the detecting module 204, and the adjustment amount is determined.
According to another preferred embodiment of the present invention, as shown in fig. 6, the apparatus further comprises: a control module 205 in communication with the detection module 204, the control module 205 being configured to control the deflection of the tensioning section 2021 based on the detection result of the detection module 204. For example, the control module 205 is an electric control module connected to the hinge 203, which controls the amount of deflection of the tension adjusting section 2021 by controlling the amount of rotation of the hinge 203, and the control module 205 may also control the hinge 203 to remain at an angle such that the tension adjusting section 2021 may remain in a corresponding deflected position and be able to support the cut line section at all times.
In order to achieve an automated accurate adjustment of the tension of the cut wire segment, according to a further preferred embodiment of the present invention, as shown in fig. 6, the apparatus 200 comprises a processing module 206 in communication with the detection module 204 and the control module 205, the processing module 206 being configured to obtain an offset of the tension adjustment section 2021 according to the detection result of the detection module 204 and the target tension and send the offset to the control module 205, the control module 205 controlling the offset of the tension adjustment section 2021 based on the offset.
Referring to fig. 7, an embodiment of the present invention also provides an apparatus CD for wire-cutting a silicon rod, the apparatus CD comprising:
the apparatus 200 for wire-cutting a silicon rod according to the above;
a carrying module 12 for loading and fixing silicon rods to be processed;
and the movement control module 13 is used for controlling the device 200 and/or the bearing module 12 to move so as to enable the device and the bearing module to move towards each other to cut the silicon rod.
Referring to fig. 8, an embodiment of the present invention further provides a method for manufacturing a silicon wafer, the method comprising:
manufacturing a silicon wafer using the apparatus CD for wire-cutting a silicon wafer according to the above, comprising the steps of:
s01, loading and fixing a silicon rod through a bearing unit;
s02, controlling a device for wire cutting the silicon rod and a bearing unit loaded and fixed with the silicon rod to move in opposite directions by a movement control unit so as to cut the silicon rod;
s03, cleaning and detecting the silicon wafer obtained after the silicon rod is cut.
The embodiment of the present invention also provides a silicon wafer (not shown in the drawings) obtained by using the apparatus CD for wire-cutting a silicon rod according to the above, the silicon wafer obtained by the apparatus CD having better quality, particularly, less cutting lines on the surface and less warpage compared with the silicon wafer obtained by a conventional apparatus or.
It should be noted that: the technical schemes described in the embodiments of the present invention may be arbitrarily combined without any collision.
The foregoing is merely illustrative of the present invention, and the present invention is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. An apparatus for wire cutting a silicon rod, the apparatus comprising:
a spool body;
a guide module disposed on a circumferential surface of the bobbin body, the guide module including a plurality of guide grooves parallel to each other and spaced apart, for winding a cutting wire to form an array of a plurality of cutting line segments parallel to each other, the array for cutting a silicon rod into a plurality of silicon chips at one time by a movement along an extension direction of the cutting wire;
the guide module comprises a tension adjusting section, wherein the tension adjusting section is arranged to drive the cutting line segments wound on the tension adjusting section to deviate along a direction away from and towards the spool body together during linear cutting operation so as to adjust the actual tension of the cutting line segments to target tension.
2. The device of claim 1, wherein the tension adjustment section is arc-shaped and one end of the tension adjustment section is connected to the spool body by a hinge such that the tension adjustment section is rotatable about the hinge in a direction away from and toward the spool body.
3. The apparatus of claim 2, wherein the tension adjusting section comprises a metal base and a resin portion provided on an upper surface of the metal base, wherein the guide groove is formed by the resin portion.
4. A device according to claim 3, wherein the resin portion is detachably provided on the metal base.
5. The apparatus according to any one of claims 1 to 4, further comprising: and the detection module is used for detecting the actual tension of the cutting line segment.
6. The apparatus of claim 5, wherein the apparatus further comprises: and the control module is communicated with the detection module and is used for controlling the deflection of the tension adjusting section according to the detection result of the detection module.
7. The apparatus of claim 6, comprising a processing module in communication with the detection module and the control module, the processing module configured to obtain an offset of the tension adjustment section based on a detection result of the detection module and the target tension and send the offset to the control module, the control module controlling the offset of the tension adjustment section based on the offset.
8. An apparatus for wire cutting a silicon rod, the apparatus comprising:
the apparatus for wire-cutting a silicon rod according to any one of claims 1 to 7;
the bearing module is used for loading and fixing the silicon rod to be processed;
and the movement control module is used for controlling the device for wire cutting the silicon rod and/or the bearing module to move so that the device for wire cutting the silicon rod and the bearing module move towards each other to cut the silicon rod.
9. A method for fabricating a silicon wafer, the method comprising:
manufacturing a silicon wafer using the apparatus for wire-cutting a silicon rod according to claim 8, comprising the steps of:
loading and fixing the silicon rod through the bearing unit;
controlling a device for wire cutting the silicon rod and a bearing unit loaded and fixed with the silicon rod to move in opposite directions by a movement control unit so as to cut the silicon rod;
and cleaning and detecting the silicon wafer obtained after the silicon rod is cut.
10. Silicon wafer, characterized in that it is obtained by using the apparatus for wire-cutting silicon rods according to claim 8.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211669380.9A CN115990955A (en) | 2022-12-24 | 2022-12-24 | Device and equipment for wire cutting silicon rod, silicon wafer and manufacturing method thereof |
| TW112105722A TW202325513A (en) | 2022-12-24 | 2023-02-17 | Apparatus, equipment, and silicon wafer for wire cutting silicon rods and method of manufacturing same wherein the apparatus includes a bobbin body and a guide module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211669380.9A CN115990955A (en) | 2022-12-24 | 2022-12-24 | Device and equipment for wire cutting silicon rod, silicon wafer and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115990955A true CN115990955A (en) | 2023-04-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211669380.9A Pending CN115990955A (en) | 2022-12-24 | 2022-12-24 | Device and equipment for wire cutting silicon rod, silicon wafer and manufacturing method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN115990955A (en) |
| TW (1) | TW202325513A (en) |
-
2022
- 2022-12-24 CN CN202211669380.9A patent/CN115990955A/en active Pending
-
2023
- 2023-02-17 TW TW112105722A patent/TW202325513A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW202325513A (en) | 2023-07-01 |
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