CN115989906A - Aerosol generating device, heating element and preparation method thereof - Google Patents
Aerosol generating device, heating element and preparation method thereof Download PDFInfo
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Abstract
The invention discloses an aerosol generating device, a heating element and a preparation method thereof, wherein the heating element comprises: a substrate having an inner surface and an outer surface, the inner surface of the substrate being the face facing the aerosol-generating substrate; the substrate is aluminum material or the outer surface of the substrate is aluminum material surface; an insulating layer attached to an outer surface of the substrate; and the heating resistor layer is attached to the surface of the insulating layer, which is back to the base material, and is a heating resistor film formed by sputtering coating, and the thickness of the heating resistor film is 0.2-8 microns. Because the substrate is prepared from the aluminum material at least on the outer surface, the substrate has higher heat conduction efficiency, and the heat generated by the heating resistor layer can be quickly and uniformly transferred to the aerosol generating substrate, so that the baking efficiency and uniformity can be improved; and be equipped with the insulating layer between aluminium system's substrate and heating resistor layer, can play insulating effect to aluminium system's substrate, avoid aluminium system's substrate to produce the influence to heating resistor layer.
Description
Technical Field
The invention relates to the technical field of aerosol generating devices, in particular to an aerosol generating device, a heating element and a preparation method thereof.
Background
The heating of non-combustible cigarettes is an important new type of tobacco product, which can heat tobacco materials through an external heat source without directly burning cigarettes, and generate smoke so as to enable smokers to achieve the physiologically satisfied smoking effect. Compared with the traditional cigarettes, the heating non-burning cigarettes have no burning process, do not generate harmful substances such as tar, carbon monoxide and the like, and greatly reduce the harm of smoking to consumers and surrounding people.
The aerosol generating substrate of the heating non-burning cigarette needs to be heated and sucked by the aerosol generating device, and a heating body is arranged in the heating non-burning cigarette and is used for heating the cigarette.
The prior heating element for heating the non-combustible cigarettes generally adopts a stainless steel metal substrate thick film heating element, and the substrate is generally 430 grade stainless steel or 444 grade stainless steel, so that the problems of slow heat conduction of the substrate and uneven baking of cigarettes exist.
Disclosure of Invention
The invention provides an aerosol generating device, a heating body and a preparation method thereof, which are mainly used for solving the problems of low baking efficiency and uneven baking of the heating body.
According to a first aspect, in one embodiment, there is provided a heating element of an aerosol-generating device, comprising:
a substrate having an inner surface and an outer surface, the inner surface of the substrate being the face facing the aerosol-generating substrate; the substrate is aluminum, or the outer surface of the substrate is aluminum;
an insulating layer attached to an outer surface of the substrate; and
the heating resistor layer is attached to the surface, facing away from the base material, of the insulating layer, and is a heating resistor film formed by sputtering, and the thickness of the heating resistor film is 0.2-8 microns; the base material and the insulating layer are both heat conducting structures.
In one embodiment, the substrate is an aluminum material.
In one embodiment, the substrate includes an inner layer and an outer layer, the outer layer being an aluminum layer.
In one embodiment, the insulating layer is an insulating film.
In one embodiment, the insulating film is an aluminum oxide film, a CeO2 oxide film, or an aluminum nitride film.
In one embodiment, the heating resistor layer is a chromium nitride film, a molybdenum film, a nichrome film, a titanium film, or a tungsten film.
In one embodiment, the heating resistor layer comprises a bottom layer and a surface layer, the bottom layer is in contact with the insulating layer, the bottom layer is prepared by adopting a high-energy pulse sputtering process, the surface layer is prepared by adopting a direct-current sputtering process, and the thickness of the bottom layer is 0.04-0.2 microns.
In one embodiment, the substrate is a tubular structure, the insulating layer covers all or part of the outer surface of the substrate, and the heating resistor layer is a strip-shaped structure extending on the insulating layer.
According to a second aspect, in one embodiment, there is provided an aerosol-generating device including the heating element of the aerosol-generating device described above.
According to a third aspect, in one embodiment, a method for manufacturing a heat generating body of an aerosol-generating device, includes the steps of:
preparing a substrate, namely preparing the substrate by adopting aluminum materials, or preparing the outer surface of the substrate by adopting the aluminum materials;
attaching an insulating layer on an outer surface of the substrate;
and a heating resistor layer is attached to the surface of the insulating layer, which is opposite to the base material, wherein the heating resistor layer is a heating resistor film formed by sputtering coating, and the thickness of the heating resistor film is 0.2-8 microns.
In one embodiment, an aluminum nitride film is formed on the outer surface of the substrate by adopting a direct current reactive sputtering method or an intermediate frequency reactive sputtering method, and the aluminum nitride film is the insulating layer.
In one embodiment, an aluminum oxide film is formed on the outer surface of the substrate by hard oxidation process coating, and the aluminum oxide film is the insulating layer.
In one embodiment, a CeO2 oxide film is deposited on the outer surface of the substrate by an electrolytic deposition process, where the CeO2 oxide film is the insulating layer.
In one embodiment, a chromium nitride film is formed on the surface of the insulating layer facing away from the substrate by adopting a direct-current reactive sputtering method or an intermediate-frequency reactive sputtering method, and the chromium nitride film is the heating resistor layer.
In one embodiment, a molybdenum film, a nichrome film, a titanium film or a tungsten film is formed on the surface of the insulating layer facing away from the substrate by adopting a direct current sputtering method or a high-energy pulse sputtering method, and the molybdenum film, the nichrome film, the titanium film or the tungsten film is the heating resistor layer.
In one embodiment, a high-energy pulse sputtering process is adopted to coat a film on the surface of the insulating layer, which is away from the base material, to form a bottom layer, then a high-energy pulse sputtering process is adopted to coat a film on the surface of the bottom layer, which is away from the insulating layer, to form a surface layer, the bottom layer and the surface layer are laminated to form the heating resistor layer, and the thickness of the bottom layer is 0.04-0.2 microns.
According to the aerosol generating device, the heating body and the preparation method thereof, at least the outer surface of the base material is made of aluminum, so that the base material has higher heat conduction efficiency, and heat generated by the heating resistor layer can be quickly and uniformly transferred to the aerosol generating substrate, so that the baking efficiency and uniformity can be improved; the insulating layer is arranged between the aluminum base material and the heating resistor layer, so that the insulating effect on the aluminum base material can be achieved, and the influence of the aluminum base material on the heating resistor layer is avoided; in addition, the heating resistor layer is a heating resistor film formed by coating a film by a sputtering method, so that the heating resistor layer with thinner thickness can be formed, the limitation that the substrate needs to be insulated with thick film printing paste at the same temperature in the traditional thick film process preparation process can be avoided, and the process for preparing the insulating layer and the heating resistor layer on the aluminum substrate is greatly expanded; finally, by selecting proper film material design combination, the heating uniformity and the heat transfer speed of the heating element are greatly improved, so that the high-performance aluminum-based heating element with the heating temperature higher than 350 ℃ is prepared, and the aluminum-based heating element can continuously and reliably work at 350-400 ℃.
Drawings
FIG. 1 is a view showing the structure of a heat-generating body in one embodiment;
FIG. 2 is a partial radial cross-sectional view of a heat-generating body in one embodiment;
FIG. 3 is a flow chart showing a method of manufacturing a heating element in one embodiment;
wherein the reference numerals are as follows:
1-heating body, 11-base material, 12-insulating layer and 13-heating resistor layer;
2-aerosol generating substrate.
Detailed Description
The invention discloses an aerosol generating device, a heating element and a preparation method thereof, which are mainly used for solving the problems of low baking efficiency and uneven baking of the heating element. And is also used for solving the problem of limited coating process.
The aluminum-based thick film heating tube has the advantages that the heat conduction capacity of the base material is high, but because of the limitation of the process (the aluminum base material needs to be insulated at the same temperature with thick film printing paste), the sintering temperature of each layer of thick film is required to be lower than the melting point of aluminum and is not suitable to exceed 450-500 ℃, the selection of film materials is limited, and the allowable heating temperature of the aluminum-based thick film system in the market at present is only about 250 ℃.
The heating body is an aluminum-based thin film heating tube, and the insulating layer and/or the heating conductive layer are/is prepared by adopting a sputtering method, so that the thickness of the insulating layer and the heating conductive layer can be reduced, the coating process is not limited by the melting point of a base material, and the high-performance aluminum-based heating body with the heating temperature higher than 350 ℃ can be prepared by selecting the optimal design and combination of film materials.
The invention will be described in further detail below with reference to the drawings by means of specific embodiments. Wherein like elements in different embodiments are numbered alike in association. In the following embodiments, numerous specific details are set forth in order to provide a better understanding of the present application. However, one skilled in the art will readily recognize that some of the features may be omitted, or replaced by other elements, materials, or methods in different situations. In some instances, some operations associated with the present application have not been shown or described in the specification to avoid obscuring the core portions of the present application, and may not be necessary for a person skilled in the art to describe in detail the relevant operations based on the description herein and the general knowledge of one skilled in the art.
Furthermore, the described features, operations, or characteristics of the description may be combined in any suitable manner in various embodiments. Also, various steps or acts in the method descriptions may be interchanged or modified in a manner apparent to those of ordinary skill in the art. Thus, the various orders in the description and drawings are for clarity of description of only certain embodiments, and are not meant to be required orders unless otherwise indicated.
The numbering of the components itself, e.g. "first", "second", etc., is used herein merely to distinguish between the described objects and does not have any sequential or technical meaning. The terms "coupled" and "connected," as used herein, are intended to encompass both direct and indirect coupling (coupling), unless otherwise indicated. The upper end herein refers to the end closer to the intake and the lower end refers to the end farther from the intake.
Embodiment one:
referring to fig. 1 and 2, in the present embodiment, the heating element 1 of the aerosol generating device may be a tubular structure or an arc structure, the heating element 1 is wrapped around the periphery of the aerosol generating substrate 2, the heating element 1 is used for heating the periphery of the aerosol generating substrate 2, and the heating element 1 mainly adopts a resistance heating mode to heat the aerosol generating substrate 2. Of course, the heating element 1 can also be wrapped on the outer side of the heat exchanger, and the heating element 1 can also transmit heat to the heat exchanger to heat the air passing through the heat exchanger.
The heat-generating body 1 includes a base material 11, an insulating layer 12, and a heat-generating resistive layer 13. The substrate 11 may be a tubular structure, the substrate 11 having an inner surface and an outer surface, both of which are circumferential surfaces of the substrate 11, the inner surface of the substrate 11 being in direct or indirect contact with the aerosol-generating substrate 2. The insulating layer 12 covers the outer surface of the base material 11, and the heat generating resistive layer 13 is attached to the surface of the insulating layer 12 facing away from the base material 11, that is, the heat generating resistive layer 13 is attached to the outer surface of the insulating layer 12. The base material 11, the insulating layer 12, and the heat generating resistor layer 13 are arranged in this order from the inside to the outside along the radial direction of the tubular heat generating body 1. The heating resistor layer 13 is used for converting electric energy into heat energy, the base material 11 and the insulating layer 12 are of a heat conduction structure, and the heat energy is sequentially transferred into the aerosol generating substrate 2 along the insulating layer 12 and the base material 11.
The insulating layer 12 may cover the outer surface of the substrate 11 completely, or the insulating layer 12 may cover a majority of the outer surface of the substrate 11, e.g., two ends of the outer surface of the substrate 11 are not covered with the insulating layer 12, and the outer surface of the substrate 11 except the two ends is covered with the insulating layer. The insulating layer 12 may separate the entire heat generating resistive layer 13 from the outer surface of the base material 11. All of the heating resistor layer 13 is located on the insulating layer 12, the heating resistor layer 13 only covers part of the insulating layer 12, the heating resistor layer 13 is of a strip-shaped structure, the heating resistor layer 13 is bent and extended in an S shape and arranged on the insulating layer 12 to increase the heating area of the heating resistor layer 13, meanwhile, the heating resistor layer 13 is provided with a positive electrode connecting end and a negative electrode connecting end, the positive electrode connecting end and the negative electrode connecting end are respectively connected with a power supply through wires to form a heating loop with the power supply, the heating resistor layer 13 can convert electric energy into heat energy and transmit the heat energy to the insulating layer 12 and the base material 11, and finally the heat energy is transmitted to the aerosol generating substrate 2 to realize circumferential heating of the aerosol generating substrate 2.
The substrate 11 may be an aluminum material, and the entire substrate 11 is made of an aluminum material, and the inner surface and the outer surface of the substrate 11 are both aluminum material surfaces. The aluminum material is adopted as the whole substrate 11, so that the substrate 11 has excellent heat conduction performance from outside to inside, the heat conduction efficiency can be improved, and the aluminum material has strong heat diffusion energy, so that the substrate 11 can heat the aerosol generating substrate 2 more uniformly.
In some embodiments, the substrate 11 may also be provided with a double-layer structure, where the substrate 11 includes an inner layer and an outer layer, the inner layer may be made of a heat conducting material such as a copper material, and the outer layer is made of an aluminum material, that is, the outer surface of the substrate 11 is still an aluminum surface, so that heat energy generated by the heating resistor layer 13 can be quickly transferred to the inner side of the substrate 11 through the aluminum surface. The heat-conducting material such as copper material is provided inside the base material 11, and the heat absorbed by the surface of the aluminum material can be transferred to the aerosol-generating substrate 2.
In this embodiment, the insulating layer is an insulating film, and the thickness of the insulating film is 0.03 to 3 μm, for example, the thickness of the insulating film is 0.1 or 1 μm. The insulating film has the dual characteristics of insulation and heat conduction, can transmit the heat that the heating resistor layer 13 produced to the substrate 11, carries out insulation to the heating resistor layer 13 simultaneously for the heating resistor layer 13 can form the heating circuit, and does not lead to the short circuit, especially the surface that the surface of substrate 11 adopts the aluminum product surface, and the aluminum product is electrically conductive material, and insulating layer 12 can separate heating resistor layer 13 and substrate 11.
The insulating film may be a film of various materials, and at the same time, the insulating film may be attached to the outer surface of the substrate 11 by different processes, so that the insulating and heat conductive properties of the insulating layer are achieved.
The insulating film may be an aluminum nitride film formed by plating a film on the outer surface of the base material 11 by a direct current reactive sputtering method or an intermediate frequency reactive sputtering method. The direct current reactive sputtering method comprises a common direct current reactive sputtering method and a direct current pulse reactive sputtering method.
In some embodiments, the insulating film may be an aluminum oxide film, which may be coated on the outer surface of the substrate 11 using a hard oxidation process. The oxide film has the advantage of low preparation cost, and can reduce the production cost of the heating element.
In some embodiments, the insulating film may be CeO 2 Oxide film, ceO 2 The oxide film can be prepared by electrolytic precipitationIs deposited on the outer surface of the substrate 11.
In this embodiment, the heating resistor layer 13 is a heating resistor film formed by sputtering, and the heating resistor layer 13 can be made thinner by sputtering, for example, the thickness of the heating resistor layer 13 can be 0.2-8 μm, and different materials can be selected by sputtering to make the heating resistor film, for example, the heating resistor film can be a chromium nitride film, a molybdenum film, a nichrome film, a titanium film or a tungsten film.
In some embodiments, the heating resistor layer 13 may also be manufactured in a two-layer structure by two different sputtering methods, so as to reduce the cost and realize different characteristics to meet different use requirements. If the heating resistor layer 13 comprises a bottom layer and a surface layer, the bottom layer is contacted with the insulating layer 12, the bottom layer is prepared by adopting a high-energy pulse sputtering process, the surface layer is prepared by adopting a direct-current sputtering process, and the thickness of the bottom layer is 0.04-0.2 microns. The bottom layer is attached to the insulating layer 12, the surface layer is attached to the bottom layer, the bottom layer and the surface layer are stacked up and down to form the heating resistor layer 13, and the thickness of the heating resistor layer 13 with a double-layer structure is also 0.2-8 micrometers.
According to the heating element 1 provided by the embodiment, the base material 11 is made of aluminum, so that the base material 11 has higher heat conduction efficiency, and heat generated by the heating resistor layer 13 can be quickly and uniformly transferred to the aerosol generating substrate 2, so that the baking efficiency and uniformity can be improved; an insulating layer 12 is arranged between the aluminum base material 11 and the heating resistor layer 13, so that the insulating effect on the aluminum base material 11 can be achieved, and the influence of the aluminum base material 11 on the heating resistor layer is avoided; in addition, the heating resistor layer 13 is a heating resistor film formed by coating a film by a sputtering method, so that the heating resistor layer 13 with thinner thickness can be formed, the limitation that the substrate 11 needs to be insulated with thick film printing paste at the same temperature in the traditional thick film process preparation process can be avoided, and the process for preparing the insulating layer 12 and the heating resistor layer 13 on the aluminum substrate 11 is greatly expanded; finally, by selecting proper film material design combination, the heating uniformity performance and the heat transfer speed of the heating element are greatly improved, so that the high-performance aluminum-based heating element with the heating temperature exceeding 350 ℃ is prepared.
Embodiment two:
the present embodiment provides an aerosol generating device, which is a heating non-combustion device, and includes a housing and a heating element 1 in any of the above embodiments, the heating element 1 is mounted in the housing, the housing has a jack, and the jack is aligned with a receiving cavity of the heating element 1, so that an aerosol generating substrate 2 can be inserted into the heating element 1 through the jack of the housing. The shell is internally provided with a power supply and an electric wire, the power supply is connected with the heating body 1 through the electric wire, the power supply supplies power to the heating body 1, the heating body 1 converts electric energy into heat energy, and the heat energy can heat the aerosol generating substrate 2.
In this embodiment, since the base material 11 of the heating element 1 is made of aluminum, the base material 11 has higher heat conduction efficiency, and can rapidly and uniformly transfer the heat generated by the heating resistor layer 13 to the aerosol generating substrate 2, so as to improve the baking efficiency and uniformity; an insulating layer 12 is arranged between the aluminum base material 11 and the heating resistor layer 13, so that the insulating effect on the aluminum base material 11 can be achieved, and the influence of the aluminum base material 11 on the heating resistor layer is avoided; in addition, the heating resistor layer 13 is a heating resistor film formed by coating a film by a sputtering method, so that the heating resistor layer 13 with thinner thickness can be formed, the limitation that the substrate 11 needs to be insulated with thick film printing paste at the same temperature in the traditional thick film process preparation process can be avoided, and the process for preparing the insulating layer 12 and the heating resistor layer 13 on the aluminum substrate 11 is greatly expanded; finally, by selecting proper film material design combination, the heating uniformity performance and the heat transfer speed of the heating element are greatly improved, so that the high-performance aluminum-based heating element with the heating temperature exceeding 350 ℃ is prepared.
Embodiment III:
the present embodiment provides a method for producing a heat-generating body of an aerosol-generating device, which is used for producing the heat-generating body 1 in embodiment one.
Referring to fig. 3, the preparation method of the embodiment includes the following steps:
s01: preparing a base material 11;
the aluminum material is adopted to prepare the substrate 11, the aluminum material is processed into the aluminum pipe by casting, turning or a mode of a structure of the aluminum pipe and the like, the aluminum pipe is the substrate 11, the whole substrate 11 is made of the aluminum material, namely the inner surface and the outer surface of the substrate 11 are both aluminum material surfaces, and the part between the inner surface and the outer surface is also made of the aluminum material. The entire substrate 11 is set to an aluminum material structure based on good thermal conductivity and thermal diffusivity of the aluminum material, so that the substrate 11 has good thermal conductivity and thermal diffusivity, and the substrate 11 can achieve more uniform baking of the aerosol-generating substrate 2 while improving baking efficiency.
In some embodiments, the outer surface of the substrate 11 may be made of aluminum, and the inner surface of the substrate 11 may be made of other heat conductive materials. For example, the base material 11 may be an aluminum-clad copper structure, the aluminum tube is sleeved on the outer side of the copper tube, the aluminum tube and the copper tube are tightly connected, and the aluminum tube and the bobbin may be fixed together in an interference fit manner. The inlayer of substrate 11 is the copper material layer, and the skin of substrate 11 is the aluminum product layer, and the internal surface of substrate 11 is the copper material surface promptly, and the surface of substrate 11 is the aluminum product surface, and substrate 11 still absorbs heat through the aluminum product surface, and the copper material also has good heat conduction characteristic, so substrate 11 adopts the structure of aluminium package copper also can improve the homogeneity and the efficiency of toasting to aerosol production matrix 2 toasting.
In some embodiments, the substrate 11 may be a copper-clad aluminum film, the substrate 11 may be an aluminum film attached to the outer surface of the copper pipe in the circumferential direction, and the aluminum film may be fixed to the outer surface of the copper pipe by hard oxidation, film plating, or the like. The substrate 11 is also structured to be coated with copper by using an aluminum film, so that the uniformity of baking the aerosol-generating substrate 2 and the baking efficiency can be improved.
In this embodiment, the substrate 11 is preferably made of an aluminum material so that the substrate 11 has better thermal conductivity and thermal diffusivity.
S02: an insulating layer 12 is attached to the outer surface of the base material 11;
an aluminum nitride film is formed on the outer surface of the base material 11 by a direct current reactive sputtering method or an intermediate frequency reactive sputtering method, and the aluminum nitride film is an insulating layer 12. The direct current reactive sputtering method comprises a common direct current reactive sputtering method and a direct current pulse reactive sputtering method. The thickness of the aluminum nitride film may be 0.03-3 microns.
The coating process parameters of the aluminum nitride film are shown in the following table:
the aluminum nitride film is formed by adopting a direct current reactive sputtering method or an intermediate frequency reactive sputtering method for film coating, and an insulating film can be formed by film coating, and the film is generally a film with the thickness of less than 5 microns and a thick film with the thickness of more than 5 microns.
S03: a heat generating resistor layer 13 is attached to a surface of the insulating layer 12 facing away from the base material 11.
A molybdenum film, a nichrome film, a titanium film or a tungsten film is formed on the surface of the insulating layer 12 facing away from the base material 11 by a direct current sputtering process, and the heating resistor film such as the molybdenum film, the nichrome film, the titanium film or the tungsten film is the heating resistor layer 13. Wherein the heating resistor layer 13 is a heating resistor film formed by sputtering, the thickness of the heating resistor film is 0.2-8 micrometers, for example, the thickness of the heating resistor film is 1 or 3 micrometers.
The coating process parameters of the heating resistor film are shown in the following table:
according to the preparation method of the heating body 1, the three-layer structure with the substrate 11, the insulating layer 12 and the heating resistor layer 13 attached in sequence can be prepared, and the substrate 11 is made of aluminum, so that the substrate 11 has higher heat conduction efficiency, heat generated by the heating resistor layer 13 can be quickly and uniformly transferred to the aerosol generating substrate 2, and further the baking efficiency and uniformity can be improved; an insulating layer 12 is arranged between the aluminum base material 11 and the heating resistor layer 13, so that the insulating effect on the aluminum base material 11 can be achieved, and the influence of the aluminum base material 11 on the heating resistor layer 13 is avoided; in addition, the heating resistor layer 13 is a heating resistor film formed by coating a film by a sputtering method, so that the heating resistor layer 13 with thinner thickness can be formed, the limitation that the substrate 11 needs to be insulated with thick film printing paste at the same temperature in the traditional thick film process preparation process can be avoided, and the process for preparing the insulating layer 12 and the heating resistor layer 13 on the aluminum substrate 11 is greatly expanded; finally, by selecting proper film material design combination, the heating uniformity performance and the heat transfer speed of the heating element are greatly improved, so that the high-performance aluminum-based heating element with the heating temperature exceeding 350 ℃ is prepared.
Embodiment four:
the present embodiment provides a method for manufacturing a heating element of an aerosol generating device, which is different from the third embodiment in that: the insulating layer 12 is different in material and manufacturing process, and the heating resistor layer 13 is different in sputtering method partial parameters.
In this embodiment, the substrate 11 is an aluminum tube, the outer surface of the aluminum tube is subjected to a hard oxidation process, and an oxide insulating layer, such as an alumina insulating layer, is formed on the outer surface of the aluminum tube, and the alumina insulating layer is an insulating layer 12, i.e. the insulating layer 12 is attached to the outer surface of the substrate 11. The oxide film has the advantage of low preparation cost, and can reduce the production cost of the heating element.
The thickness of the alumina insulating layer may be 8-80 microns, which is a thin insulating film, thick film being a relative concept, generally meaning that films with a thickness greater than 5 microns are thick films.
In the process of hard oxidation of the alumina insulating layer, the reasonable oxidation rate can be controlled by maintaining a lower circuit voltage value so as to reduce cracks, obtain the complete crack-free alumina insulating layer, avoid the influence of the cracks on the insulating effect and improve the attractiveness.
The basic flow of the hard oxidation process performed on the outer surface of the substrate 11 is as follows:
feeding, neutral degreasing, water washing, acid degreasing, water washing, alkali etching, water washing, chemical grinding, water washing and the like washing, neutralizing, washing, oxidizing, washing, drying and packaging.
The number of times of water washing can be set according to the process requirements.
The parameters of the oxidation plating film of the alumina insulation layer attached to the outer surface of the substrate 11 are shown in the following table:
in the embodiment, the material system of the heating resistor layer 13 is unchanged, and the process adopts a direct current sputtering method (including a common direct current sputtering method and a direct current pulse sputtering method) with the current less than or equal to 50A and the voltage less than or equal to 1000V.
The coating process parameters of the heating resistor layer 13 are as follows:
in this embodiment, the insulating layer 12 is prepared as an insulating thick film, the heating resistor layer 13 is still a heating resistor thin film, and the heating resistor layer 13 is also coated by adopting a direct current sputtering process, so that the limitation that the substrate 11 needs to be insulated at the same temperature with thick film printing paste in the traditional thick film process preparation process can be avoided, and the process for preparing the insulating layer 12 and the heating resistor layer 13 on the aluminum substrate 11 is greatly expanded; finally, by selecting proper film material design combination, the heating uniformity performance and the heat transfer speed of the heating element are greatly improved, so that the high-performance aluminum-based heating element with the heating temperature exceeding 350 ℃ is prepared.
Fifth embodiment:
the present embodiment provides a method for manufacturing a heating element of an aerosol generating device, which is different from the third embodiment in that: the coating process of the heating resistor layer 13 is different.
In this embodiment, the material system of the resistor layer of the heating resistor layer 13 is unchanged, and the coating process adopts high-energy pulse coating, so that a heating resistor film can be formed by coating on the insulating layer 12.
The coating process parameters of the heating resistor layer 13 are as follows:
in this embodiment, the heating resistor layer 13 is coated by high-energy pulse sputtering, and during the pulse, very high peak power (usually kilowatt or megawatt peak power, corresponding to peak current 400-1000A) generates extremely dense plasma, so that the ionization rate is higher, the deposited film layer is denser, the adhesion is better, and the heating resistor layer 13 can be firmly attached to the insulating layer 12.
Example six:
the present embodiment provides a method for manufacturing a heating element of an aerosol generating device, which is different from the third embodiment in that: the coating process of the heating resistor layer 13 is different.
In this embodiment, the coating process of the heating resistor layer 13 is divided into two steps:
a first step of: firstly, coating a film on the surface of the insulating layer 12, which is opposite to the base material 11, by adopting a high-energy pulse sputtering process to form a bottom layer;
and a second step of: and then coating a film on the surface of the bottom layer, which is opposite to the insulating layer, by a high-energy pulse sputtering process to form a surface layer, and laminating the bottom layer and the surface layer to form the heating resistor layer 13.
Wherein the thickness of the bottom layer is 0.04-0.2 micrometers, and the thickness of the heating resistor layer 13 with the double-layer structure is also 0.2-8 micrometers. The bottom layer prepared by the high-energy pulse sputtering method is relatively thin, and the surface layer prepared by the direct current sputtering method is relatively thick.
In this embodiment, the heating resistor layer 13 adopts two different sputtering methods to prepare a two-layer structure, so as to reduce the cost and realize different characteristics, so as to meet different use requirements.
Embodiment seven:
the present embodiment provides a method for manufacturing a heating element of an aerosol generating device, which is different from the fourth embodiment and the fifth embodiment in that: the material and preparation process of the insulating layer 12 are different.
This embodimentIn which CeO is precipitated on the outer surface of the base material 11 by electrolytic precipitation 2 Oxide film of CeO 2 The oxide film is an insulating layer 12.
The insulating layer 12 is CeO 2 Oxide film, ceO 2 The oxide film is deposited on the outer surface of the substrate 11 by an electrolytic deposition process. The preparation process and other processes of the heating resistor layer 13 are unchanged.
The electrolytic precipitation of CeO2 oxide film includes: the aluminum alloy is placed in NaCl solution containing CeCl3, and deposited for a long time under a lower potential (-1.6 eV to-0.8 eV) to form the CeO2 oxide film with high corrosion resistance and almost no cracks.
Electrochemical reaction process of Ce3+ ion depositing CeO2 oxide film under current action:
4Ce 3+ +O 2 +4OH - +2H 2 O→4Ce(OH) 2 2+
Ce(OH) 2 2+ +2OH - →C e O 2 +2H 2 O
in the present embodiment, ceO is used for the insulating layer 12 2 Oxide film, ceO 2 The oxide film has an insulating effect and a heat conducting effect, so that the insulating slurry film has good insulating property and heat conducting property as well, and can quickly transfer heat generated by the heating resistor layer 13 to the base material 11, and meanwhile, insulation protection is formed between the base material 11 and the heating resistor layer 13.
The foregoing description of the invention has been presented for purposes of illustration and description, and is not intended to be limiting. Several simple deductions, modifications or substitutions may also be made by a person skilled in the art to which the invention pertains, based on the idea of the invention.
Claims (16)
1. A heating element of an aerosol-generating device, comprising:
a substrate having an inner surface and an outer surface, the inner surface of the substrate being the face facing the aerosol-generating substrate; the substrate is aluminum, or the outer surface of the substrate is aluminum;
an insulating layer attached to an outer surface of the substrate; and
the heating resistor layer is attached to the surface, facing away from the base material, of the insulating layer, and is a heating resistor film formed by sputtering, and the thickness of the heating resistor film is 0.2-8 microns; the base material and the insulating layer are both heat conducting structures.
2. A heating element of an aerosol generating device as set forth in claim 1, wherein said base material is an aluminum material.
3. A heat-generating body for an aerosol generating device as set forth in claim 1, wherein the base material comprises an inner layer and an outer layer, and the outer layer is an aluminum layer.
4. A heating element of an aerosol-generating device as set forth in claim 1, wherein the insulating layer is an insulating film.
5. A heating element of an aerosol generating device according to claim 4, wherein said insulating film is an alumina film or CeO 2 An oxide film or an aluminum nitride film.
6. A heating element of an aerosol-generating device according to claim 1, wherein the heating resistor layer is a chromium nitride film, a molybdenum film, a nichrome film, a titanium film, or a tungsten film.
7. The heating element of aerosol generating device according to claim 1, wherein the heating resistor layer comprises a bottom layer and a surface layer, the bottom layer is in contact with the insulating layer, the bottom layer is prepared by a high-energy pulse sputtering process, the surface layer is prepared by a direct-current sputtering process, and the thickness of the bottom layer is 0.04-0.2 μm.
8. A heating element of an aerosol-generating device according to claim 1, wherein the base material has a tubular structure, the insulating layer covers all or part of an outer surface of the base material, and the heating resistor layer has a strip-like structure extending over the insulating layer.
9. An aerosol-generating device comprising the heat-generating body of the aerosol-generating device according to any one of claims 1 to 8.
10. A method for manufacturing a heating element of an aerosol generating device, comprising the steps of:
preparing a substrate, namely preparing the substrate by adopting aluminum materials, or preparing the outer surface of the substrate by adopting the aluminum materials;
attaching an insulating layer on an outer surface of the substrate;
and a heating resistor layer is attached to the surface of the insulating layer, which is opposite to the base material, wherein the heating resistor layer is a heating resistor film formed by sputtering coating, and the thickness of the heating resistor film is 0.2-8 microns.
11. The method of claim 10, wherein an aluminum nitride film is formed on the outer surface of the substrate by direct current reactive sputtering or intermediate frequency reactive sputtering, and the aluminum nitride film is the insulating layer.
12. The method of claim 10, wherein an aluminum oxide film is formed on the outer surface of the substrate by hard oxidation, the aluminum oxide film being the insulating layer.
13. The method of claim 10, wherein CeO is precipitated on the outer surface of the substrate by an electrolytic precipitation process 2 Oxide film of CeO 2 The oxide film is the insulating layer.
14. The method according to claim 10, wherein a chromium nitride film is formed on a surface of the insulating layer facing away from the base material by direct-current reactive sputtering or intermediate-frequency reactive sputtering, and the chromium nitride film is the heat-generating resistive layer.
15. The method according to claim 10, wherein a molybdenum film, a nichrome film, a titanium film, or a tungsten film is formed on a surface of the insulating layer facing away from the base material by a direct current sputtering method or a high energy pulse sputtering method, and the molybdenum film, nichrome film, titanium film, or tungsten film is the heat generating resistor layer.
16. The method of claim 10, wherein a high-energy pulse sputtering process is used to coat a film on a surface of the insulating layer facing away from the substrate to form a bottom layer, and then a high-energy pulse sputtering process is used to coat a film on a surface of the bottom layer facing away from the insulating layer to form a surface layer, the bottom layer and the surface layer are laminated to form the heating resistor layer, and the thickness of the bottom layer is 0.04-0.2 μm.
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| CN202310070338.3A CN115989906A (en) | 2023-01-12 | 2023-01-12 | Aerosol generating device, heating element and preparation method thereof |
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| CN202310070338.3A CN115989906A (en) | 2023-01-12 | 2023-01-12 | Aerosol generating device, heating element and preparation method thereof |
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| CN202310070338.3A Pending CN115989906A (en) | 2023-01-12 | 2023-01-12 | Aerosol generating device, heating element and preparation method thereof |
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