CN115989574A

CN115989574A - Chamber interface for linked processing tools

Info

Publication number: CN115989574A
Application number: CN202180052189.7A
Authority: CN
Inventors: 罗伯特·I·德科蒂尼斯; 马雷克•拉德科
Original assignee: Applied Materials Inc
Current assignee: Applied Materials Inc
Priority date: 2020-11-02
Filing date: 2021-10-21
Publication date: 2023-04-18
Also published as: KR20230093336A; TW202234551A; WO2022093624A1; US20220139740A1

Abstract

Embodiments described herein provide linking tools and linked processing systems having two or more processing tools connected by one or more linking tools. Each arrangement of linked processing systems includes processing tools coupled to a linked chamber at a transfer module at a back end of adjacent processing tools. The back-end coupling utilizes the backplane space away from the factory interface of the processing tool. The linked cavity has at least five facets. The system also includes two or more transfer penetrations. Each transfer feedthrough is coupled to one facet of the link chamber. The transfer shuttle is connectable to a transfer module of the processing tool. The system also includes a link robot disposed in the link chamber and operable to transfer one or more substrates between the transfer shuttle connectable to the transfer module of the processing tool.

Description

Chamber interface for linked processing tools

Background

Technical Field

Embodiments of the present disclosure relate to a link tool and a linked processing system having two or more processing tools connected by one or more link tools.

Background

The manufacture of semiconductor devices typically involves performing a series of processes with respect to a substrate or "wafer" (such as a silicon substrate, a glass plate, etc.). These steps may include polishing, deposition, etching, photolithography, thermal treatment, and the like. Typically, several different processing steps may be performed in a single processing system or "tool" that includes multiple processing chambers. However, there are often times when other processes are performed at other processing sites within a manufacturing facility, and thus it is necessary to transport substrates from one processing site to another processing site within the manufacturing facility. Depending on the type of semiconductor device being manufactured, there may be a relatively large number of processing steps to be performed at many different processing sites within a manufacturing facility.

Traditionally, substrates are transported from one processing site to another within substrate carriers, such as sealed pods (sealed pods), cassettes (cassettes), containers, and the like. Traditionally, automated substrate carrier transport devices, such as automatic guided vehicles (automated guided vehicles), overhead transport systems (overhead transport systems), substrate carrier handling robots (handling robots), and the like, are also utilized to move substrate carriers from one location to another within a manufacturing facility, or to transfer substrate carriers out of or to a substrate carrier transport device.

The transport of such substrates typically involves exposing the substrates to room air, or at least to non-vacuum conditions. Any of these may expose the substrate to undesirable environments (e.g., oxidizing species) and/or contaminants. Accordingly, there is a need in the art for ways to avoid exposing substrates to adverse environments when transferring substrates between processing systems.

Disclosure of Invention

In one embodiment, a system is provided. Such a system comprises a link chamber having at least five facets (facet). The system further comprises two or more transfer penetrations (via). Each transfer feedthrough is coupled to one facet of the link chamber. The transfer penetrations can be connected to a transfer module of the process tool. The system further includes a link robot disposed in the link chamber and operable to transfer one or more substrates between the transfer passes of the transfer modules connectable to the processing tools.

In another embodiment, a system is provided. Such a system includes a linking tool. The linking tool includes: a linked cavity having at least five facets; and a first transfer feedthrough and a second transfer feedthrough, the first transfer feedthrough coupled to the first facet of the link chamber and the second transfer feedthrough coupled to the second facet of the link chamber. The link tool further includes a link robot disposed in the link chamber. Such a system further comprises: a first processing tool coupled to the first transfer feedthrough; and a second processing tool coupled to the second transfer feedthrough. Each of the first and second processing tools includes a first transfer module. The first transfer module includes a load lock chamber coupled between a factory interface and a first transfer chamber of the first transfer module. The first transfer module further includes an accessory chamber and first, second, and third processing chambers coupled to the first transfer chamber. The first processing tool further includes a second transfer module. The second transfer module includes a pass-through chamber (pass-through chamber) connecting the first transfer module and the second transfer module. The second transfer module further includes fourth, fifth, sixth, and seventh processing chambers coupled to the second transfer chamber. The second transfer chamber is coupled to one of the first transfer via or the second transfer via.

In yet another embodiment, a system is provided. Such a system includes a first linking tool. The first linking means includes: a linked cavity having at least five facets; and a first transfer feedthrough coupled to the first facet of the link chamber, a second transfer feedthrough coupled to the second facet of the link chamber, and a third transfer feedthrough coupled to the third facet of the link chamber. The first link tool further includes a link robot disposed in the link chamber. Such a system further comprises: a first processing tool coupled to the first transfer feedthrough; a second processing tool coupled to the second transfer feedthrough; and a third processing tool coupled to the third transfer feedthrough. The first processing tool, the second processing tool, and the third processing tool each include a first transfer module. The first transfer module includes a load lock chamber coupled between a factory interface and a first transfer chamber of the first transfer module. The first transfer module further includes an accessory chamber and first, second, and third processing chambers coupled to the first transfer chamber. Each of the first processing tool, the second processing tool, and the third processing tool includes a second transfer module. The second transfer module includes a pass through chamber connecting the first transfer module and the second transfer module. The second transfer module further includes at least fourth, fifth, and sixth processing chambers coupled to a second transfer chamber coupled to one of the first transfer feedthrough, the second transfer feedthrough, or the third transfer feedthrough.

Drawings

So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings. It is to be noted, however, that the appended drawings illustrate only example embodiments and are therefore not to be considered limiting of the scope of the disclosure, for the invention may admit to other equally effective embodiments.

Fig. 1 is a schematic top view of a linking tool according to embodiments described herein.

Fig. 2A-2H are schematic top views of arrangements of linked processing systems according to embodiments described herein.

To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.

Detailed Description

Embodiments described herein relate to linking tools and linked processing systems having two or more processing tools connected by one or more linking tools. Each arrangement of such linked processing systems includes adjacent processing tools coupled to the linked chambers at transfer modules at the back ends of the processing tools. This back-end coupling utilizes floor space (floor space) off the factory interface of the process tool and allows substrates to be transferred in the generally higher vacuum level portion of the process tool. Transferring the substrate in a higher vacuum region, which is typically at the back end of the processing tool, and through the link tool of the linked processing system, will minimize the amount or probability of contaminants eventually on the substrate as it passes between the processing chambers in the two processing tools during the substrate processing flow. The linked cavity has at least five facets. The system further includes two or more transfer penetrations. Each transfer feedthrough is coupled to one facet of the link chamber. The transfer penetrations can be connected to a transfer module of the process tool. The system further includes a link robot disposed in the link chamber and operable to transfer one or more substrates between the transfer passthrough of the transfer module connectable to the processing tool.

Fig. 1 is a schematic top view of a link tool 100. The linking tool 100 feeds into the

arrangements

200A, 200B, 200C, 200D, 200E, 200F, 200G and 200H of the linked processing system 200 shown in fig. 2A-2H. The link tool 100 includes a link cavity 102 having at least five facets 103. The facets 103 can each be connected to one of the transfer penetrations 104 or auxiliary chambers (auxiliary chambers) 214a, 214B (shown in fig. 2B and 2H) and 214c (shown in fig. 2G). The link chamber 102 includes a link robot 106 disposed in the link chamber 102. In one embodiment, which may be combined with other embodiments described herein, the link robot 106 is operable to transfer one or more substrates 101 between the second transfer modules 204b (shown in fig. 2A-2H) of the processing tools 202 (shown in fig. 2A-2H). In another embodiment, which may be combined with other embodiments described herein, the link robot 106 is operable to transfer one or more substrates 101 from the transfer shuttle 104 that may be coupled to a second transfer module 204b (shown in fig. 2A-2H) of the processing tool 202 (shown in fig. 2A-2H). In embodiments of the

arrangements

200B and 200H, the link robot 106 is operable to transfer one or more substrates 101 to either of the auxiliary chambers 214a, 214B. In an embodiment of the arrangement 200G, the link robot 106 is operable to transfer one or more substrates 101 to the

auxiliary chamber

214a, 214b, or 214c. The link robot 106 includes an extension (extension) of about 36 inches to about 50 inches. In one embodiment, the extent is about 50 inches. This extension of the robot 106 provides the capability for transferring substrates 101 between the second transfer module 204b, the link chamber 102, and the

auxiliary chambers

214a, 214b, 214c. This extent enables the length 110 of the link chamber 102 to be about 105 inches to about 139 inches. In one embodiment, the length 110 is about 110 inches.

The link chamber 102 includes at least two transfer penetrations 104. Each transfer feedthrough 104 is coupled to the second transfer chamber 208b (shown in fig. 2A-2H) such that the corresponding processing tool 202 is coupled to the link chamber 102. Coupling adjacent processing tools 202 to the link chamber 102 at the second transfer module 204b provides for utilization of the floor space of the factory interface 215 exiting the processing tools 202. Further, the conveying penetrations 104 may each be angled (angled) at an angle θ with respect to the center of a temporary position (stopping position) 104a, 104b of the conveying penetrations 104. In embodiments of the transfer pass-throughs 104 having an offset angle, the respective angles θ of each transfer pass-through 104 are the same. In one example, the angle θ is about 90 degrees to about 180 degrees. In another example, the angle θ is about 30 degrees to about 50 degrees. The utilization of the floor space exiting the factory interface 215, and in some embodiments the same angle θ of each transfer pass-through 104, minimizes the floor space required by the linked processing system 200 and allows additional utilization of the empty space on the manufacturing facility. As shown in the arrangement 200B of the linked processing system 200, coupling adjacent processing tools 202 to the linked chamber 102 at the second transfer module 204B provides space for the auxiliary chambers 214a, 214B. As shown in the

arrangements

200E, 200F, and 200H of the linked processing system 200, coupling adjacent processing tools 202 to the linked chamber 102 at the second transfer module 204b allows coupling a third processing tool 202c to the linked chamber 102 such that the linked processing system 200 includes three processing tools 202.

At least one transfer shuttle 104 of the two or more transfer shuttles 104 includes a substrate alignment device 109 located at one or more of the

staging positions

104a, 104b (e.g., the left staging position 104a and/or the right staging position 104b in fig. 1). The substrate alignment device 109 is configured to orient features (i.e., wafer notches) on the substrate 101 in the correct orientation for processing in the process chambers of the first, second, or

third process tools

202a, 202b, 202c. In one embodiment, which may be combined with other embodiments described herein, the substrate alignment device 109 of the transfer pass-through 104 includes one or more of a notch finder, a substrate aligner (aligner), or a re-orienter (re-orienter). The substrate alignment apparatus 109 may determine and/or adjust the alignment and/or orientation of the substrate 101 as the substrate 101 passes between the first, second, and

third processing tools

202a, 202b, 202c.

Valves 107 are provided at the interface of the transfer pass-through 104 and the link chamber 102, at the interface of the

auxiliary chambers

214a, 214b, 214c and the link chamber 102, and at the interface of the second transfer module 204b and the transfer pass-through 104. In one embodiment, which may be combined with other embodiments described herein, the valves are slit valves and/or gate valves. Thus, the link chambers 102 can be individually isolated from the transfer shuttle 104, the link chambers 102 can be individually isolated from the

auxiliary chambers

214a, 214b, 214c, and the transfer shuttle 104 can be individually isolated from the second transfer module 204b of the processing tool 202. A vacuum pump 112, such as a cryopump, turbo pump, or the like, may be coupled to the transfer feedthrough 104 and the link chamber 120. The vacuum pump 112 is operable to maintain a vacuum level in one or more of the transfer feedthrough 104 or the link chamber 120. As one or more substrates 101 are transferred between the second transfer module 204b, the link chamber 102, and the

auxiliary chambers

214a, 214b, 214c of the processing tool 202, the vacuum level may increase or decrease in each of the transfer shuttle 104 and the link chamber 120.

The link tool 100 includes a system controller 114, the system controller 114 including a substrate handling (handling) system. The substrate handling system is a centralized server that implements predictive modeling, such as machine learning, artificial intelligence, and/or deep learning, to improve the throughput of the linked processing systems 200. The system controller 114 is configured to communicate with a tool controller 203 of the processing tool 202. The system controller 114 is operable to receive data from the tool controller 203, apply predictive modeling to the data, and provide instructions to the tool controller 203 corresponding to process commands directed to processing in a process chamber of the process tool 202 and transferring one or more substrates from the process chamber of the process tool 202.

Fig. 2A-2H are schematic top views of

arrangements

200A, 200B, 200C, 200D, 200E, 200F, 200G, and 200H of linked processing systems 200 according to embodiments described herein. The linked processing system 200 of arrangements 200A-200D and 200G includes a first processing tool 202a coupled to a second processing tool 202b through the linking tool 100 as described herein. The linked processing system 200 of arrangement 200E includes a first processing tool 202a, a second processing tool 202b, and a third processing tool 202c connected to each other by the linking tool 100. The linked processing system 200 of arrangement 200F includes first and

second clusters

201a, 201b of first, second, and

third processing tools

202a, 202b, 202c. The first cluster 201a includes a first processing tool 202a, a second processing tool 202b, and a third processing tool 202c coupled to the first link tool 100 a. The second cluster 201b includes a first processing tool 202a, a second processing tool 202b, and a third processing tool 202c coupled to the second link tool 100 b. The first cluster 201a and the second cluster 201b are connected to each other by a third linking means 100 c. The linked processing system 200 of arrangement 200H includes a first processing tool 202a and a second processing tool 202b connected to each other by a first linking tool 100 a. The second processing tool 202b and the third processing tool 202c are connected to each other by the second link tool 100 b.

In one or more embodiments of the linked processing tools 200 disclosed herein, the processing tools 202 (e.g., the first, second, and

third processing tools

202a, 202b, 202 c) can include an Endura 2 host or an Endura 3 host, available from applied materials, inc., santa Clara, calif. Each processing tool 202 includes a first transfer module 204a, a second transfer module 204b, and a pass-through module (pass-through) 206 that connects a first transfer chamber 208a of the first transfer module 204a to a second transfer chamber 208b of the second transfer module 204 b. The first transfer module 204a includes

process chambers

210a, 210b, 210c (first, second, and third), an accessory chamber 212, and a load lock chamber 213. The second transfer module 204b includes

process chambers

210d, 210e, 210f, 210g (fourth, fifth, sixth, and seventh). In an embodiment of the arrangement 200F, the second transfer module 204b of one processing tool 202 of the first cluster 201a and the second transfer module 204b of another processing tool 202 of the second cluster 201b include

process chambers

210d, 210e, 210F.

The first and

second transfer modules

204a, 204b each include a substrate handling robot (not shown) in the first and

second transfer chambers

208a, 208b. The substrate handling robot of the first transfer module 204a is operable to transfer substrates between the load lock chamber 213, the first transfer chamber 208a, the process chambers 210a-210c, the satellite chamber 212, and the pass-through module 206. The substrate handling robot of the second transfer module 204b is operable to transfer substrates between the pass-through module 206, the second transfer chamber 208b, the process chambers 210d-210g, and the transfer shuttle 104. Each processing tool 202 includes a load lock chamber 213 coupled to a factory interface 215. The factory interface 215 separately provides substrates 101 to respective processing tools 202 via one or more Factory Interface (FI) robots (not shown) and Front Opening Unified Pods (FOUPs) 217.

Valves 207 are disposed at the interfaces of the

process chambers

210a, 210b, 210c, the satellite chamber 212, and the load lock chamber 213 with the first transfer chamber 208a of the first transfer module 204 a. The valve 207 is also disposed at the interface of the

process chambers

210d, 210e, 210f, 210g and the second transfer chamber 208b of the second transfer module 204 b. In one embodiment, which can be combined with other embodiments described herein, the valves 207 are slit valves and/or gate valves. Thus, the process chambers 210a-210f can be isolated from the transfer feedthrough 104, respectively, and the transfer feedthrough 104 can be isolated from the first and

second transfer chambers

208a, 208b, respectively. A vacuum pump 219, such as a cryopump, turbo pump, or the like, may be coupled to the transfer feedthrough 104 and the first and

second transfer chambers

208a, 208b. The vacuum pump 219 is operable to maintain the vacuum level of the first and

second transfer chambers

208a, 208b. As one or more substrates 101 are transferred between the first transfer chamber 208a and the second transfer chamber 208b, the vacuum level in each of the first and

second transfer chambers

208a, 208b may increase or decrease. Also, the vacuum level may increase or decrease as one or more substrates 101 are transferred between the second transfer chamber 208b and the link tool 100.

In this configuration, when the substrate 101 is placed in a high vacuum environment (e.g., 10) ^-7 -10 ^-9 Torr), the transfer of the substrate 101 can be completed between the first processing tool 202a and the second processing tool 202b (and the third processing tool 202c in embodiments of the

arrangements

200E, 200F, 200H) because the vacuum level in the second transfer chamber 208b is maintained at a higher level than the vacuum level maintained in the first transfer chamber 208aBase pressure (base pressure). Generally, the slave load lock chamber 213 (e.g., 10) follows the substrate 101 ^-3 Torr) to a second transfer chamber 208b (e.g., 10) ^-7 -10 ^-8 Torr) and a process chamber 210d-210g (e.g., 10 ^-8 -10 ^-9 Torr) is moved through the first transfer module 204a to the second transfer module 204b within the processing tool 200, the base pressure or vacuum level is increased (i.e., lower pressure). It is believed that transferring substrates in the high vacuum regions of two processing tools, such as the first processing tool 202a and the second processing tool 202b, and through the link tool 100, will minimize the amount or chance of contaminants eventually on the substrate as it passes between the processing chambers in the two processing tools during a substrate processing run.

The process chambers 210A-210F and auxiliary chambers 214a, 214B, 214C may be any type of process chamber, such as a deposition chamber (e.g., a Physical Vapor Deposition (PVD) chamber, a Chemical Vapor Deposition (CVD) chamber, a Plasma Enhanced Chemical Vapor Deposition (PECVD) chamber, an Atomic Layer Deposition (ALD) chamber, a Plasma Enhanced Atomic Layer Deposition (PEALD), an etch chamber, a degas chamber, and/or any other type of process chamber the types of process chambers 210A-210F and auxiliary chambers 214a, 214B, 214C in the

arrangement

200A, 200B, 200C, 200D, 200E, 200F, 200G, and 200H of the linked processing system 200 are in the process tool 202.

In operation, the process chambers 210a-210f of the first process tool 202a, the second process tool 202b, and the third process tool 202c are interchangeable. For example, one method for depositing contact structures in a semiconductor device in each of the first, second, and

third processing tools

202a, 202b, and 202c may include a combination of PVD, CVD, and ALD chambers. In this method, a barrier layer, a wetting layer and a metal layer may be deposited. The barrier layer, the wetting layer, and the metal layer may each be deposited by one or more of a PVD, CVD, PECVD, ALD, or PEALD process. In one example, if the process chamber 210a of the first process tool 202a (configured as a CVD chamber to deposit a barrier layer) is inoperable, undergoing maintenance, or undergoing replacement, the substrate 101 may be transferred to one of the process chambers 210a-210f of the second process tool 202b and/or the third process tool 202c configured as a CVD chamber to deposit a barrier layer. The process chambers 210e of the first process tool 202a of the

arrangements

200G and 200H may be replaced by the transfer shuttle 104 of the link tool 100. Thus, the arrangement 200G may include a third link tool 100 having

auxiliary chambers

214a, 214b, or 214c, and the arrangement 200H may include a third link tool 100 and a fourth process tool having

auxiliary chambers

214a, 214 b.

The substrate handling system of the system controller 112, which is in communication with the tool controller 203 of the processing tool 202, receives data corresponding to the throughput of each of the processing chambers 210a-210 f. The system controller 112 is operable to apply predictive modeling to the data to provide instructions to the tool controller 203 corresponding to process commands directed to processes performed in the process chambers 210a-210f of the processing tool 202 and to transfer one or more substrates 101 from the process chambers 210a-210f of the processing tool 202. The system controller 112 may also provide outputs corresponding to optimized combinations of PVD chambers, CVD chambers, PECVD chambers, ALD chambers, PEALD chambers, etch chambers, degas chambers, or any other type of processing chamber for the processing chambers 210a-210f of the first processing tool 202a, the second processing tool 202b, and the third processing tool 202c and the

auxiliary chambers

214a, 214b of the link tool 100.

In view of the foregoing, linked tools and linked processing systems having two or more processing tools connected by one or more linked tools are described herein. Each arrangement of the linked processing systems includes adjacent processing tools coupled to the linked chambers at a transfer module at a back end of the processing tools. To minimize the amount or chance of contaminants eventually on the substrate as it passes between the processing chambers in the two processing tools during the substrate processing flow, the substrate is transported in a high vacuum region at the back end of these processing tools and by a link tool of a linked processing system. Furthermore, locating link tools at the back end takes advantage of the floor space away from the factory interface of these processing tools, which may be important in some semiconductor fab processing system layouts. Utilizing the floor space exiting these factory interfaces, and in some embodiments the same angle for each transfer pass-through of the linked tooling, minimizes the floor space required for the linked processing systems and allows additional utilization of empty space on the manufacturing facility.

While the foregoing is directed to examples of the present disclosure, other and further examples of the disclosure may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.

Claims

1. A system, comprising:

a linked cavity having at least five facets;

two or more transfer passthroughs, each coupled to one facet of the link chamber, the transfer passthrough being connectable to a transfer module of a processing tool; and

a link robot disposed in the link chamber and operable to transfer one or more substrates from the transfer shuttle connectable to the transfer module of the processing tool.

2. The system of claim 1, wherein a valve is disposed at an interface of the transfer pass-through and the link chamber, and the valve is disposable at the interface of the transfer module and the transfer pass-through.

3. The system of claim 2, wherein a vacuum pump is coupled to the transfer feedthrough and the link chamber.

4. The system of claim 3, wherein the vacuum pump is a cryopump or a turbo pump.

5. The system of claim 2, wherein the valve is a slit valve or a gate valve.

6. The system of claim 1, further comprising two auxiliary chambers.

7. The system of claim 6, wherein each auxiliary is one of a deposition chamber, an etch chamber, or a degas chamber.

8. The system of claim 1, further comprising a system controller in communication with a tool controller of the processing tool, the system operable to receive data from the tool controller of the processing tool, apply predictive modeling to the data, and provide instructions to the tool controller corresponding to process commands directed to processing in and transferring one or more substrates from a process chamber of the processing tool.

9. A system, comprising:

a linking tool having:

a chaining chamber having at least five facets;

a first transfer feedthrough coupled to the first facet of the link chamber; and a second transfer feedthrough coupled to a second facet of the link chamber; and

the link manipulator is arranged in the link chamber; and

a first processing tool coupled to the first transfer feedthrough; and a second processing tool coupled to the second transfer feedthrough, the first and second processing tools each having:

a first transfer module, the first transfer module comprising:

a load lock chamber coupled between a factory interface and a first transfer chamber of the first transfer module;

a satellite chamber and first, second, and third process chambers coupled to the first transfer chamber;

a second transfer module, the second transfer module comprising:

connecting the first transfer module and the second transfer module through a chamber; and

a fourth, fifth, sixth, and seventh process chambers coupled to a second transfer chamber coupled to one of the first or second transfer vias.

10. The system of claim 9, wherein the valve is disposed at an interface of:

the first transfer penetration and the link chamber, and the second transfer penetration and the link chamber;

the second transfer chamber and the first transfer feedthrough of the first processing tool, and the second transfer chamber and the second transfer feedthrough of the second processing tool;

the satellite chamber and the first, second, and third process chambers and the first transfer chamber; and

the fourth, fifth, sixth, and seventh processing chambers and the second transfer chamber.

11. The system of claim 10, wherein a vacuum pump is coupled to the first transfer feedthrough, the second transfer feedthrough, the link chamber, the first transfer module, and the second transfer module.

12. The system of claim 9, wherein the first and second transfer penetrations each include a staging location, the staging location of at least one of the first and second transfer penetrations having a substrate alignment device.

13. The system of claim 12, wherein the first transfer pass-through and the second transfer pass-through are each angled at the same angle with respect to a center of the staging position.

14. The system of claim 9, further comprising two auxiliary chambers each coupled to a third facet and a fourth facet of the linked chamber.

15. The system of claim 9, wherein the first, second, third, fourth, fifth, sixth, and seventh processing chambers correspond to one of a deposition chamber, an etch chamber, or a degas chamber.

16. The system of claim 9, wherein the link tool comprises a system controller in communication with the tool controllers of the first and second processing tools, the system controller operable to receive data from the tool controllers, apply predictive modeling to the data, and provide instructions to the tool controllers corresponding to process commands directed to processing in and transferring one or more substrates from the process chambers of the first and second processing tools.

17. A system, comprising:

a first linking tool having:

a linked cavity having at least five facets;

a first transfer feedthrough coupled to a first facet of the link chamber; a second transfer through coupled to a second facet of the link chamber; and a third transfer feedthrough coupled to a third facet of the link chamber; and

the link manipulator is arranged in the link chamber; and

a first processing tool coupled to the first transfer feedthrough; a second processing tool coupled to the second transfer feedthrough; and a third processing tool coupled to the third transfer feedthrough, the first, second, and third processing tools each having:

a first transfer module, the first transfer module comprising:

a second transfer module, the second transfer module comprising:

at least a fourth, fifth, and sixth process chamber coupled to a second transfer chamber coupled to one of the first, second, or third transfer vias.

18. The system of claim 17, wherein the first, second, and third transfer penetrations each include a staging location with a substrate alignment device.

19. The system of claim 18, wherein the first, second, and third transfer penetrations are each angled at the same angle with respect to a center of the staging position.

20. The system of claim 17, further comprising:

a second link tool, the first transfer feedthrough of the second link tool being coupled to the second transfer chamber of the third processing tool and the second transfer feedthrough of the second link tool being coupled to a fourth processing tool; and

a third link tool, the first transfer feedthrough of the third link tool being coupled to the second transfer chamber of the fourth processing tool, and the second transfer feedthrough of the third link tool being coupled to a fifth processing tool, and the third transfer feedthrough of the third link tool being coupled to a sixth processing tool.