CN115988848A

CN115988848A - Heat radiator

Info

Publication number: CN115988848A
Application number: CN202310094736.9A
Authority: CN
Inventors: 程嘉俊
Original assignee: Individual
Current assignee: Individual
Priority date: 2023-02-10
Filing date: 2023-02-10
Publication date: 2023-04-18

Abstract

The heat radiator comprises a base body, wherein at least one heat conductor which is made of heat conduction materials or structures is arranged on the base body, an elastic part is arranged between the heat conductor and the base body, the elastic part completely or partially separates the heat conductor from the base body and generates a gap, and the heat conductor can rotate or move relative to the base body.

Description

Heat radiator

The invention relates to the field of circuit board heat dissipation, in particular to a radiator.

Background

Along with the development of science and technology, for example, electronic elements such as various chip capacitance inductance MOS tubes on PCB circuit boards such as m2 solid-state or gigabit network cards or video cards have increasingly large power consumption and increasingly serious heat generation, the heat dissipation requirement of the device is not neglected, and because the elements are not close to the liquid cooling head which is not easy to be independently installed after being installed on the board, the liquid cooling radiator with the multi-heat-dissipation-surface liquid cooling head which can simultaneously dissipate heat for the electronic elements with different heights needs to be produced, but at present, the multi-heat-dissipation-surface liquid cooling head usually produces required high and low heat dissipation surfaces and grooves or columnar arrays by milling a whole heat conduction material through a processing center, and the production cost is high, the consumed time is long, and the efficiency is low. Meanwhile, due to the fact that the heights of the heat sources are different, the heat sources are difficult to be in good contact with each other completely during installation, and the chip is likely to be crushed due to overlarge local pressure caused by slight deviation.

Therefore, a heat sink is needed to solve the problems of high price, difficult use and easy fracturing of a heat source of the existing heat sink.

Disclosure of Invention

The invention discloses a radiator, which reduces the production cost by simplifying the design structure. The heat conductor can float freely relative to the base body, so that the heat source is prevented from being crushed due to overlarge pressure or improper angle, and the mounting and using difficulty is reduced.

The method specifically comprises the following steps:

the heat radiator comprises a base body, wherein at least one heat conductor composed of a heat conduction material or structure is arranged on the base body, the heat conduction material or structure comprises copper, silver, aluminum, graphite or a phase change heat pipe, an elastic piece is arranged between the heat conductor and the base body, the elastic piece comprises a sealing ring or a rubber pad or soft rubber or an air bag or a piston cavity or a spring, the elastic piece completely or partially separates the heat conductor from the base body to enable an adjusting gap to be generated between the heat conductor and the base body, a mounting structure is arranged on the base body and comprises a screw or a screw hole or a buckle or a pressing plate or a binding belt, the base body is mounted on a circuit board by the mounting structure to enable the heat conductor to be tightly attached to a first type of heat source on the circuit board, the elastic piece is pressed and deformed in the attaching process to enable the adjusting gap to be changed, at the time, the heat conductor completes relative rotation or displacement to the base body, and the first type of heat source is a component with the highest heat density, including a silicon wafer or a power device, on the circuit board.

In at least one embodiment of the present invention, the heat conductor or the base is provided with a limiting structure, the limiting structure includes a screw or a screw hole or a buckle or a pressing plate or a binding band, and the limiting structure loosely mounts the heat conductor on the base and fixes an adjustment range of the adjustment gap.

In at least one embodiment of the present invention, the indicating structure is included, the indicating structure is fixed on the substrate or on the heat conductor, the indicating structure includes a mounting component or a pressure-sensitive component, the mounting component includes a screw or a screw hole or a buckle or a pressing plate or a binding band, the mounting component changes when the adjustment gap changes, the mounting component changes simultaneously, the mounting component changes include a change of a mutual distance between the mounting components or a deformation of a body of the mounting component, the pressure-sensitive component includes a pressure-sensitive element or a pressure-sensitive paint or a pressure gauge, the pressure-sensitive component changes simultaneously when the adjustment gap changes, the pressure-sensitive component changes include a change of an electrical value or a change of a color or a change of a reading, and the electrical value includes a resistance value or a capacitance value or a current value or a voltage value or an inductance value.

In at least one embodiment of the present invention, the substrate is made of a heat conducting material or structure, the substrate is attached to a second type of heat source, the second type of heat source is a component on the circuit board, the heat density of the component is 0% to 70% of that of the first type of heat source, the second type of heat source includes a memory chip or a power supply chip, a heat conducting fluid or a heat conducting solid is disposed between the substrate and the heat source, the heat conducting fluid includes a heat conducting silicone grease or a heat conducting glue or a heat conducting mud, and the heat conducting solid includes a copper block or an aluminum block.

In at least one embodiment of the present invention, a first cooling liquid channel is disposed in the heat conductor, or the heat conductor and the base are hermetically attached to each other, and a first cooling liquid channel is formed between the heat conductor and the base, and the first cooling liquid channel is provided with a first inlet and a first outlet.

In at least one embodiment of the present invention, a groove is disposed on one side of the first cold liquid channel of the heat conductor, a first channel cover plate is disposed above the groove, the first channel cover plate is tightly attached to the groove in real time to form the first cold liquid channel, and a space is left on two sides of the groove for allowing cold liquid to enter and exit the first cold liquid channel, so as to form a first inlet and a first outlet of the first cold liquid channel.

In at least one specific embodiment of the present invention, a second cold liquid channel is disposed in the base body, or a cover plate is disposed on the base body, the base body and the cover plate are in sealing fit to form the second cold liquid channel, and the second cold liquid channel is provided with a second inlet and a second outlet.

In at least one embodiment of the present invention, the first cold liquid channel and the second cold liquid channel are communicated with each other to form a total inlet and a total outlet, and after cold liquid flows in through the total inlet, at least a part of the cold liquid firstly enters the first cold liquid channel, then enters the second cold liquid channel, and finally flows out from the total outlet, or firstly enters the second cold liquid channel, then enters the first cold liquid channel, and finally flows out from the total outlet, or firstly flows through a part of the second cold liquid channel, then enters the first cold liquid channel, then returns to the rest of the second cold liquid channels, and finally flows out from the total outlet, or simultaneously enters the first cold liquid channel and the second cold liquid channel, and finally flows out from the total outlet.

In at least one specific embodiment of the present invention, the first cold liquid channel is connected in parallel to a parallel connection point in the second cold liquid channel, an elastic isolation member is disposed between the first cold liquid channel and the second cold liquid channel, the elastic isolation member includes a sealing ring or a rubber pad or an air bag or a hose, and the elastic isolation member deforms synchronously when the adjustment gap changes, so that the elastic isolation member will partition off a liquid path at the parallel connection point of the second cold liquid channel partially or completely at all times, and part or all of the cold liquid flows into the first cold liquid channel from the second cold liquid channel on one side of the elastic isolation member through the first inlet, flows out of the first cold liquid channel from the first outlet on the other side of the elastic isolation member, and returns to the remaining second cold liquid channels.

Compared with the prior art, the invention has the following beneficial effects:

the complex machining process of the originally required machining center is replaced by a simpler and cheaper machining process in a form of splitting the complex shape of the existing integral liquid cooling head heat-conducting bottom plate into a combination of a plurality of simple shapes, so that the production efficiency is improved, and the production cost is reduced.

The adjusting gap and the elastic piece are additionally arranged between the heat conductor and the base body, so that the heat conductor and the base body can move relatively after being pressed, the heat source is prevented from being damaged due to stress concentration, and the mounting difficulty is reduced.

Through setting up instruction structure, make whether the condition that heat conductor and heat source contacted well surveyability, improve the installation convenience.

Through setting up cold liquid passageway, improve whole heat-sinking capability.

Drawings

Fig. 1 is a view showing a structure of a preferred heat sink.

FIG. 2 is a diagram comparing the state of the heat sink when the spring is compressed and uncompressed.

Fig. 3 is a diagram of a preferred heat sink structure.

Fig. 4 is a diagram of a preferred first cold liquid channel configuration.

Fig. 5 is a combined structure diagram of a first cold liquid channel and a second cold liquid channel.

FIG. 3 is preferred

In the figure, 1-circuit board, 11-first type heat source, 12-second type heat source, 2-substrate, 21-mounting piece, 22-copper block, 3-heat conductor, 31-limiting structure, 32-indicating structure, 33-first cold liquid channel, 34-first inlet, 35-first outlet, 36-groove, 37-first channel cover plate, 4-elastic piece, 41-gap, 5-cover body, 51-second inlet, 52-second outlet, 53-elastic isolation piece, and 54-second cold liquid channel.

Detailed Description

The technical solutions of the present invention will be described clearly and completely with reference to the following embodiments, and it should be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In at least one embodiment of the present invention, as shown in fig. 1, it is a preferred overall structure of the heat sink. In this embodiment, the limiting member 31 is a set of screws passing through the through holes of the base 2 and screwed into the threaded holes of the heat conductor 3, and a rubber ring is sandwiched between the base 2 and the heat conductor 3 as the elastic member 4. The base body 2, the heat conductor 3 and the elastic piece 4 form a whole radiator, and the other group of screws are used as mounting pieces 21 and pass through holes on the base body 2 and through holes or threaded holes on the circuit board 1 to mutually fix the whole radiator and the circuit board 1. A first type of heat source 11 (core) on the circuit board 1 is tightly attached to the heat conductor 3, and a second type of heat source 12 (memory chip or power supply chip) is tightly attached to the substrate.

Figure 2 is a diagram comparing the state of the heat sink when the spring is compressed and when it is uncompressed. In this embodiment, the gap 41 is at a maximum when the elastic member 4 is not under pressure, as shown in the upper half of the figure. When the heat conductor 3 is tightly attached to the first type of heat source 11, the elastic member 4 is compressed, and the gap 41 is reduced as shown in the following half-figure, at this time, the position-limiting structure 31 is not tightly attached to the base body 2 any more, so that it can also be used as the indication structure 32. When it is observed that in this example all indicating structures 32 no longer abut against the substrate 2, this indicates that the thermal conductor 3 is in complete intimate contact with the heat source of the first type. In this embodiment, the heat conductor 3 can rotate and displace relative to the base 2 at the same time, but in other embodiments, the heat conductor can only displace and cannot rotate.

In at least one embodiment of the present invention, as shown in fig. 3, the base body 2 is made of a heat conductive material, and the copper block 22 is in close contact with the second type heat source 12 on the circuit board 1, so that the first type heat source 11 and the second type heat source 12 on the circuit board 1 can obtain heat dissipation enhancement at the same time.

In at least one embodiment of the present invention, as shown in fig. 4, a groove 36 is disposed on a side of the heat conductor 3 facing away from the first laser source, a first channel cover 37 is disposed on the groove 36, two ends of the groove 36 are left empty to form the first inlet 34 and the first outlet 35, and the groove 36, the first channel cover 37, the first inlet 34, and the first outlet 35 together form the first cold liquid channel 33.

In some embodiments, the first channel cover 37 has an inlet in the middle, and the cold liquid enters the rear edge groove 36 from the inlet and flows out from the plurality of outlets.

In at least one embodiment of the present invention, as shown in fig. 5, a first cold liquid channel 33 formed by the heat conductor 3 and the first channel cover plate 37 is connected in parallel to a second cold liquid channel 54 formed by the base body 2 and the cover body 5, an elastic separation member 53 is disposed between the first channel cover plate 37 and the second cold liquid channel 54 to separate the second cold liquid channel 54 into two parts, one part is communicated with the first inlet 34 of the first cold liquid channel 33, and the other part is communicated with the first outlet 35, so that cold liquid enters the second cold liquid channel 54 from the second inlet 51, passes through the first cold liquid channel 33, returns to the remaining second cold liquid channel 54, and finally flows out from the second outlet 52 to form a complete liquid path. The elastic spacer 53 is deformed synchronously when the gap 41 is changed, and the flow direction of the liquid path is kept unchanged.

In at least one embodiment of the present invention, the first inlet 34 and the second inlet 51 are integrated, or the second inlet 35 and the second outlet 52 are integrated.

After the scheme is adopted, in the process that the heat conductor 3 is tightly attached to the first type heat source 11, the angle or the distance between the heat conductor 3 and the base body 2 can be changed in the adjustment range of the gap 4, and the damage caused by overlarge pressure between the first type heat source 11 and the heat conductor 3 or the damage caused by stress concentration due to improper angle can be prevented. Meanwhile, the indicating structure is arranged, so that whether the heat conductor 3 is in good contact with the first type of heat source or not becomes clear at a glance without blurring, the installation difficulty is reduced, and the safety is improved.

Although the present invention has been described in detail with reference to the foregoing embodiments, other modifications, equivalents, and improvements can be made by those skilled in the art without departing from the spirit and scope of the invention.

Claims

1. A heat sink, characterized by: the heat conductor comprises a base body, wherein at least one heat conductor composed of a heat conducting material or structure is arranged on the base body, the heat conducting material or structure comprises a copper or silver or aluminum or graphite or a phase change heat pipe, an elastic piece is arranged between the heat conductor and the base body, the elastic piece comprises a sealing ring or a rubber pad or soft rubber or an air bag or a piston cavity or a spring, the elastic piece completely or partially separates the heat conductor from the base body to enable an adjusting gap to be generated between the heat conductor and the base body, a mounting structure is arranged on the base body and comprises a screw or a screw hole or a buckle or a pressing plate or a binding belt, the base body is mounted on a circuit board by the mounting structure to enable the heat conductor to be tightly attached to a first type of heat source on the circuit board, the elastic piece is pressed and deformed in the attaching process to enable the adjusting gap to be changed, at the moment, the heat conductor completes relative rotation or displacement to the base body, and the first type of heat source is a component with the highest heat density including a silicon wafer or a power device on the circuit board.

2. A heat sink according to claim 1, wherein: the heat conductor or the base body is provided with a limiting structure, the limiting structure comprises a screw or a screw hole or a buckle or a pressing plate or a binding band, and the limiting structure is used for loosely mounting the heat conductor on the base body and fixing the adjusting range of the adjusting gap.

3. A heat sink according to claim 1, wherein: including indicating structure, it fixes to indicate the structure on the base member or fix on the heat conductor, it includes installed part or pressure-sensitive piece to indicate the structure, the installed part includes screw or buckle or clamp plate or bandage, the installed part is in the installed part change takes place simultaneously when adjusting the clearance change, the installed part change includes the change of installed part mutual distance or the deformation of installed part body, pressure-sensitive piece includes pressure-sensitive element or pressure-sensitive paint or manometer, pressure-sensitive piece is in it changes to adjust the clearance change take place simultaneously, pressure-sensitive piece changes including electrical property value change or color change or reading change, electrical property value includes resistance value or capacitance value or current value or voltage value or inductance value.

4. A heat sink according to claim 1, wherein: the heat conducting body is made of heat conducting materials or structures, the base body is attached to a second type of heat source, the second type of heat source is a component on the circuit board, the heat density of the component is 0% -70% of that of the first type of heat source, the second type of heat source comprises a storage chip or a power supply chip, heat conducting fluid or heat conducting solids are arranged between the base body and the heat source, the heat conducting fluid comprises heat conducting silicone grease or heat conducting glue or heat conducting mud, and the heat conducting solids comprise copper blocks or aluminum blocks.

5. A heat sink according to claim 1, wherein: the heat conductor is internally provided with a first cold liquid channel, or the heat conductor and the base body are mutually sealed and attached, the first cold liquid channel is formed between the heat conductor and the base body, and the first cold liquid channel is provided with a first inlet and a first outlet.

6. A heat sink according to claim 5, wherein: the heat conductor is provided with a groove on one side of a first cold liquid channel, a first channel cover plate is arranged above the groove, the first channel cover plate is tightly attached to the groove in real time to form the first cold liquid channel, and the first channel cover plate is empty on two sides of the groove to allow cold liquid to enter and exit the first cold liquid channel to form a first inlet and a first outlet of the first cold liquid channel.

7. A heat sink according to claim 5, wherein: the base body is internally provided with a second cold liquid channel, or the base body is provided with a cover plate, the base body is in sealing fit with the cover plate to form the second cold liquid channel, and the second cold liquid channel is provided with a second inlet and a second outlet.

8. A heat sink according to claim 7, wherein: the first cold liquid channel and the second cold liquid channel are communicated with each other to form a total inlet and a total outlet, after cold liquid flows in through the total inlet, at least part of cold liquid firstly enters the first cold liquid channel, then enters the second cold liquid channel and finally flows out of the total outlet, or firstly enters the second cold liquid channel, then enters the first cold liquid channel and finally flows out of the total outlet, or firstly flows through part of the second cold liquid channel, then enters the first cold liquid channel, then returns to the rest of the second cold liquid channel and finally flows out of the total outlet, or simultaneously enters the first cold liquid channel and the second cold liquid channel, and finally is collected and flows out of the total outlet.

9. A heat sink according to claim 7, wherein: the first cold liquid channel is connected in parallel with the second cold liquid channel at a parallel point, an elastic separation member is arranged between the first cold liquid channel and the second cold liquid channel and comprises a sealing ring, a rubber pad, an air bag or a hose, the elastic separation member deforms synchronously when the adjustment gap is changed, so that the elastic separation member can partially or completely separate the liquid path at the parallel point of the second cold liquid channel from beginning to end, and partial or all cold liquid flows into the first cold liquid channel from the second cold liquid channel on one side of the elastic separation member through the first inlet, flows into the first cold liquid channel from the first outlet on the other side of the elastic separation member, and then flows back to the rest second cold liquid channel after flowing out of the first cold liquid channel from the first outlet on the other side of the elastic separation member.