CN1159859A - 用于装入无触点芯片卡的载体装置 - Google Patents

用于装入无触点芯片卡的载体装置 Download PDF

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Publication number
CN1159859A
CN1159859A CN95195390A CN95195390A CN1159859A CN 1159859 A CN1159859 A CN 1159859A CN 95195390 A CN95195390 A CN 95195390A CN 95195390 A CN95195390 A CN 95195390A CN 1159859 A CN1159859 A CN 1159859A
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Prior art keywords
carrier arrangement
response unit
chip card
support membrane
semi
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CN95195390A
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J·蒙迪格尔
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Siemens AG
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Siemens AG
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=6529721&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=CN1159859(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Siemens AG filed Critical Siemens AG
Publication of CN1159859A publication Critical patent/CN1159859A/zh
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Credit Cards Or The Like (AREA)
  • Radar Systems Or Details Thereof (AREA)
  • Measuring Leads Or Probes (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

具有一层支承薄膜(1)的载体装置，至少在该支承薄膜上安置一个由一块半导体芯片(3)和一个与此半导体芯片相连的天线线圈(4)构成的应答单元(5)。在至少一个应答单元(5)上有利地安置另一层薄膜(6)，使应答单元(5)为了运输加以密封包装。

Description

用于装入无触点芯片卡的载体装置
在无触点的芯片卡中，最通常的是借助电磁波把驱动芯片卡中包含的半导体芯片所需的能量由一个终端传输到芯片卡。终端和芯片卡之间的数据交换也是通过这一途径实现的。为此，在终端和芯片卡上均设有发射和接收电磁波的天线线圈。在芯片卡中例如装有一个由半导体芯片和与半导体芯片相连的天线线圈构成的应答单元。与芯片卡不同，应答单元往往是在其它地方制作的，因此在运输过程中线圈有受损伤或变形的危险。
因此，本发明的任务在于，提供一种载体装置，在它上面，线圈和线圈与半导体芯片的连接部位特别是在运输中可得到保护。
按照权利要求1，解决该任务的技术方案在于，构成一个具有支承薄膜的载体装置，至少一个由一块半导体芯片和一个与半导体芯片相连的天线线圈构成的应答单元安置在上述支承薄膜上。
通过本发明的在一层支承薄膜上固定应答单元的位置固定装置，使线圈的尺寸甚至在支承薄膜发生变形的情况下也保持不变。据此，可有利地把很多的应答单元依次置于一个连续的支承薄膜上，并为了便于运送将其譬如卷绕到一个卷辊上。本发明的载体装置只需极少的装配费用。通过本发明的载体装置，把可能导致天线和天线与半导体芯片之间的连接部位受损伤的机械干扰也被缩小到最低限度。由于线圈的尺寸因此不再发生改变，所以可实现重要的系统参数，如线圈的品质因数的高再现性。据此，本发明的载体装置可位置和形状不变地被送往后步加工。
在本发明优选的实施方案中，应答单元被另一层薄膜所覆盖。据此，应答单元可简单地防止受到污染。另一层薄膜在半导体芯片部位开有一个洞，是特别有利的。据此，可缩小载体装置的厚度。两层薄膜中的至少一层薄膜具有一粘贴层是有利的，使应答单元准密封地被包装在两层薄膜之间。
本发明载体装置的一个特殊优点在于，该载体装置在从连续的支承薄膜上被冲出后，可整体地装入一个譬如通过层压技术或也可通过压铸方法制作的芯片卡内。据此，支承薄膜和另一层薄膜意味着不改变形状。其中，如果支承薄膜和另一层薄膜与卡其余部分的材质相同，则是特别有利的。
下面，借助一个附图以一个实施例的形式详细说明本发明。该图示出了从卷辊2上退绕的支承薄膜1。在支承薄膜1上有一个粘贴层，由一块半导体芯片3和一个线圈4构成的应答单元5被附到该粘贴层上。然后，该装置借助一层覆盖薄膜6密封包装，其中，为了尽量缩小整个载体装置的厚度，在覆盖薄膜中，在半导体芯片3的部位开一个洞7是有利的。然后，为了继续运输，由一个包装在两层薄膜之间的应答单元5构成的载体装置被有利地卷绕到一个卷辊8上。

Claims (4)

1.具有一层支承薄膜(1)的载体装置，在该支承薄膜上至少安置一个由一块半导体芯片(3)和一个与此半导体芯片相连的天线线圈(4)构成的应答单元(5)。
2.按照权利要求1所述的载体装置，其特征在于，另一层薄膜(6)安置在至少一个应答单元(5)上。
3.按照权利要求2所述的载体装置，其特征在于，另一层薄膜(6)在半导体芯片(3)的部位有一个洞(7)。
4.按照权利要求1至3之一所述载体装置，其特征在于，两个薄膜层(1，6)中的至少一层薄膜在其面对应答单元(5)的面上有一粘贴层。
CN95195390A 1994-09-30 1995-09-25 用于装入无触点芯片卡的载体装置 Pending CN1159859A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4435138 1994-09-30
DEP4435138.0 1994-09-30

Publications (1)

Publication Number Publication Date
CN1159859A true CN1159859A (zh) 1997-09-17

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ID=6529721

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Application Number Title Priority Date Filing Date
CN95195390A Pending CN1159859A (zh) 1994-09-30 1995-09-25 用于装入无触点芯片卡的载体装置

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Country Link
EP (1) EP0784829B1 (zh)
JP (1) JPH09511704A (zh)
KR (1) KR970706552A (zh)
CN (1) CN1159859A (zh)
AT (1) ATE168800T1 (zh)
DE (1) DE59502922D1 (zh)
ES (1) ES2120229T3 (zh)
RU (1) RU2121715C1 (zh)
WO (1) WO1996010803A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113147094A (zh) * 2021-03-18 2021-07-23 淮安赫德兹彩色印刷包装有限公司 带装饰贴的包装纸袋加工设备

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EP0824245B1 (de) * 1996-08-09 2004-05-19 Ferag AG Bewegliches Objekt mit elektronisch gespeicherten berührungslos auslesbaren und/oder überschreibbaren Daten
DE19719271A1 (de) * 1997-05-07 1998-11-12 Melzer Maschinenbau Gmbh Verfahren zum Herstellen von Kunststoffkarten
WO1998053424A1 (en) * 1997-05-20 1998-11-26 Ronald Barend Van Santbrink Method for the production of a smart card, smart card and device for the production thereof
FR2775533B1 (fr) * 1998-02-27 2003-02-14 Gemplus Sca Dispositif electronique a memoire electronique sans contact, et procede de fabrication d'un tel dispositif
DE19900086B4 (de) * 1999-01-04 2006-07-06 Sihl Gmbh Laminatbahnrolle
EP1018703B1 (de) * 1999-01-04 2001-03-07 Sihl GmbH Laminierte, mehrschichtige Transportgutetikettenbahn mit RFID-Transpondern
DE59900131D1 (de) * 1999-01-23 2001-07-26 Ident Gmbh X RFID-Transponder mit bedruckbarer Oberfläche
EP1031940A1 (de) * 1999-02-24 2000-08-30 Sihl GmbH Anordnung enthaltend eine Vielzahl elektronischer Schaltungen
UA59498C2 (uk) 1999-12-07 2003-09-15 Інфінеон Текнолоджіс Аг Етикетка для товарів, спосіб її виготовлення та спосіб безконтактної ідентифікації товарів
DE10004429C1 (de) * 2000-02-02 2001-05-31 Skidata Ag Verfahren zur Herstellung eines Gegenstandes mit einem Transponder
FR2823888B1 (fr) * 2001-04-24 2005-02-18 Gemplus Card Int Procede de fabrication d'une carte sans contact ou hybride et carte obtenue
FI113811B (fi) * 2003-03-31 2004-06-15 Filtronic Lk Oy Menetelmä antennikomponenttien valmistamiseksi
DE102004008840A1 (de) 2004-02-20 2005-09-01 Bundesdruckerei Gmbh Verfahren zur Herstellung eines buchartigen Wertdokuments sowie ein buchartiges Wertdokument

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WO1988008592A1 (en) * 1987-04-27 1988-11-03 Soundcraft, Inc. Method for the manufacture of and structure of a laminated proximity card
FR2641102B1 (zh) * 1988-12-27 1991-02-22 Ebauchesfabrik Eta Ag
JPH04152191A (ja) * 1990-10-17 1992-05-26 Mitsubishi Electric Corp Ｔａｂ基板及びそれを用いた非接触ｉｃカード

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113147094A (zh) * 2021-03-18 2021-07-23 淮安赫德兹彩色印刷包装有限公司 带装饰贴的包装纸袋加工设备

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EP0784829A1 (de) 1997-07-23
ATE168800T1 (de) 1998-08-15
DE59502922D1 (de) 1998-08-27
WO1996010803A1 (de) 1996-04-11
EP0784829B1 (de) 1998-07-22
RU2121715C1 (ru) 1998-11-10
ES2120229T3 (es) 1998-10-16
KR970706552A (ko) 1997-11-03
JPH09511704A (ja) 1997-11-25

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