CN115984198A

CN115984198A - Data processing method and device, electronic equipment and storage medium

Info

Publication number: CN115984198A
Application number: CN202211629991.0A
Authority: CN
Inventors: 熊俊剑
Original assignee: Hangzhou Fuxin Semiconductor Co Ltd
Current assignee: Hangzhou Fuxin Semiconductor Co Ltd
Priority date: 2022-12-16
Filing date: 2022-12-16
Publication date: 2023-04-18

Abstract

The application provides a data processing method, a data processing device, an electronic device and a storage medium, wherein the method comprises the following steps: obtaining first identification information, wherein the first identification information comprises a preliminary identification result of whether each unit of the wafer is a normal unit or an abnormal unit, position information of each unit and an image of each unit, which are obtained based on a wafer scanning image; constructing a target image for the wafer based on the position information of each unit and the image of each unit; dividing the target image to obtain at least one target sub-image, wherein each target sub-image corresponds to P units of the wafer, and P is a positive integer greater than 1; and correcting the primary recognition results of at least part of the units based on at least one target sub-image and a preset image to obtain the target recognition result of each unit in the target image. By the technical scheme, the identification correctness of whether each unit in the wafer is a qualified unit or an unqualified unit can be improved, and the error identification is reduced.

Description

Data processing method and device, electronic equipment and storage medium

Technical Field

The present application relates to the field of semiconductor technologies, and in particular, to a data processing method, a data processing apparatus, an electronic device, and a storage medium.

Background

In the semiconductor field, a wafer is divided into cells, and each of the divided cells is regarded as a unit constituting the wafer. In order to realize the electrical parameter and functionality Test of the wafer, a Test Key (Test Key) needs to be arranged on the scribe line of the wafer. When a wafer is cut (Die Saw), edge breakage defects may exist in the wafer due to characteristics of a cutting machine (such as stability reduction, abnormal operation, etc.). In the related art, a defect inspection Apparatus (AOI) scans a wafer to obtain a wafer scan image, and an identification result of whether each unit constituting the wafer is a qualified unit or a non-qualified unit is obtained by analyzing the wafer scan image. It can be appreciated that the more pass units on a wafer, the higher the yield of the wafer. Therefore, the improvement of the identification accuracy of whether each unit on the wafer is a qualified unit or an unqualified unit becomes a technical problem to be solved urgently.

Disclosure of Invention

The application provides a data processing method, a data processing device, an electronic device and a storage medium, which are used for at least solving the technical problems in the prior art.

According to a first aspect of the present application, there is provided a data processing method comprising:

obtaining first identification information, wherein the first identification information comprises a preliminary identification result, obtained based on a wafer scanning image, of whether each unit of a wafer is a normal unit or an abnormal unit, position information of each unit and an image of each unit;

constructing a target image for the wafer based on the position information of each unit and the image of each unit;

dividing the target image to obtain at least one target sub-image, wherein each target sub-image corresponds to P units of the wafer, and P is a positive integer greater than 1;

and correcting the primary recognition results of at least part of the units in each unit based on at least one target sub-image and a preset image to obtain the target recognition result of each unit in the target image.

In an embodiment, the dividing the target image to obtain at least one target sub-image includes:

dividing the target image according to the attribute of the exposure unit of the wafer to obtain at least one target sub-image, wherein each target sub-image corresponds to M N units of the wafer, M N = P, and M and N are positive integers larger than 1.

In an implementation manner, the modifying, based on the at least one target sub-image and the preset image, the preliminary recognition result of at least some of the cells in each cell to obtain the target recognition result of each cell in the target image includes:

determining a first type unit in each unit based on at least one target sub-image and a preset image, wherein the first type unit is a unit which needs to be subjected to primary recognition result correction in each unit;

correcting the primary recognition result of the first type unit according to a preset recognition result to obtain a target recognition result of the first type unit;

and obtaining the target recognition result of each unit in the target image based on the target recognition result of the first-class unit and the preliminary recognition result of the second-class unit except the first-class unit in each unit.

In an embodiment, the determining the first type of cells in the cells based on the at least one target sub-image and the preset image includes:

determining a first sub-image based on a comparison result between each target sub-image in at least one target sub-image and a preset image and a primary recognition result of each unit in each target sub-image, wherein the first sub-image is a sub-image of at least one target sub-image including a unit which needs to be corrected according to the primary recognition result;

dividing the first sub-image into a plurality of first areas;

and determining a first type unit from the units based on the comparison result of the first areas and the second areas in the preset image and the preliminary identification result of the units included in the first areas.

screening out a second sub-image from at least one target sub-image based on the primary recognition result of each unit, wherein the second sub-image is a sub-image comprising the unit with abnormal primary recognition result;

performing region division on the second sub-image to obtain a plurality of third regions;

and determining a first type unit from the units based on the results of comparison between the third areas and the second areas in the preset image and the preliminary identification results of the units included in the first areas.

In one embodiment, the method further comprises:

outputting a target image;

and/or outputting the target recognition result of each unit on the target image corresponding to the position of each unit.

In one embodiment, the preliminary identification result is obtained by analyzing a wafer scanning image obtained by scanning each unit on the wafer one by one in a unit scanning manner.

According to a second aspect of the present application, there is provided a data processing apparatus comprising:

an obtaining unit configured to obtain first identification information, where the first identification information includes a preliminary identification result, obtained based on a wafer scanning image, that each unit of a wafer is a normal unit or an abnormal unit, location information of each unit, and an image of each unit;

the construction unit is used for constructing a target image aiming at the wafer based on the position information of each unit and the image of each unit;

the dividing unit is used for dividing the target image to obtain at least one target sub-image, each target sub-image corresponds to P units of the wafer, and P is a positive integer larger than 1;

and the correcting unit is used for correcting the preliminary recognition results of at least part of the units in each unit based on at least one target sub-image and a preset image to obtain the target recognition results of the units in the target image.

According to a third aspect of the present application, there is provided an electronic device comprising:

at least one processor; and

a memory communicatively coupled to the at least one processor; wherein the content of the first and second substances,

the memory stores instructions executable by the at least one processor to cause the at least one processor to perform the method described herein.

According to a fourth aspect of the present application, there is provided a non-transitory computer readable storage medium having stored thereon computer instructions for causing the computer to perform the method described herein.

By the technical scheme, the identification correctness of whether each unit in the wafer is a qualified unit or an unqualified unit can be improved, and the error identification is reduced.

It should be understood that the statements in this section do not necessarily identify key or critical features of the embodiments of the present application, nor do they limit the scope of the present application. Other features of the present application will become apparent from the following description.

Drawings

The above and other objects, features and advantages of exemplary embodiments of the present application will become readily apparent from the following detailed description read in conjunction with the accompanying drawings. Several embodiments of the present application are illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings and in which:

in the drawings, like or corresponding reference characters designate like or corresponding parts.

FIG. 1 shows a first flow chart of implementation of a data processing method in an embodiment of the present application;

FIG. 2 is a schematic diagram showing a Shot of an exposure unit in the embodiment of the present application;

FIG. 3 shows a schematic diagram of a standard image in an embodiment of the present application;

FIG. 4 shows a second flowchart illustrating an implementation of the data processing method in the embodiment of the present application;

FIG. 5 shows a schematic diagram of an application in an embodiment of the present application;

fig. 6 shows a schematic diagram of dividing areas of the first sub-image and the second sub-image in the embodiment of the present application;

FIG. 7 is a schematic diagram showing a configuration of a data processing apparatus according to an embodiment of the present application;

fig. 8 shows a schematic structural diagram of the electronic device in the embodiment of the present application.

Detailed Description

In order to make the objects, features and advantages of the present application more obvious and understandable, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. All other embodiments obtained by a person skilled in the art based on the embodiments in the present application without making any creative effort belong to the protection scope of the present application.

In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be described in further detail with reference to the attached drawings, the described embodiments should not be considered as limiting the present application, and all other embodiments obtained by a person of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

In the following description, reference is made to "some embodiments" which describe a subset of all possible embodiments, but it is understood that "some embodiments" may be the same subset or different subsets of all possible embodiments, and may be combined with each other without conflict.

In the following description, references to the terms "first," "second," and the like, are intended only to distinguish similar objects and not to imply a particular order to the objects, it being understood that "first," "second," and the like may be interchanged under appropriate circumstances or a sequential order, such that the embodiments of the application described herein may be practiced in other than those illustrated or described herein.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing embodiments of the present application only and is not intended to be limiting of the application.

It should be understood that, in the various embodiments of the present application, the size of the serial number of each implementation process does not mean the execution sequence, and the execution sequence of each process should be determined by its function and inherent logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

In the related art, the wafer may be scanned by a defect inspection Apparatus (AOI) to obtain a result of whether each cell constituting the wafer is a qualified cell or a non-qualified cell. Generally, if a broken edge defect exists in one cell of a wafer, AOI considers the cell to be a failed cell. In addition, for cells close to or connected to test elements, this situation is actually a misidentification because the presence of a test element (AOI may consider the test element as an abnormal part in the wafer) may also be considered as a failed cell by the AOI equipment. Therefore, how to reduce the misidentification and improve the accuracy of each unit in the wafer being a qualified unit or a non-qualified unit becomes an urgent technical problem to be solved.

According to the technical scheme, the target image of the wafer is constructed based on the first identification information, and based on the at least one target sub-image and the preset image obtained by dividing the constructed target image, the error primary identification result generated for at least part of units in the wafer can be corrected, so that the identification correctness of whether each unit in the wafer is a qualified unit or an unqualified unit is improved, and the error identification is reduced.

The data processing method is applied to a data processing device. The data processing device can be used as a single device, and can also be integrated into a reasonable device for use. Such as integrated into a wafer defect scanner (simply referred to as a scanner). The scanner is a device capable of identifying defects in the wafer.

Fig. 1 shows a first implementation flow diagram of a data processing method in an embodiment of the present application. As shown in fig. 1, the method includes:

s101: obtaining first identification information, wherein the first identification information comprises a preliminary identification result of whether each unit of the wafer is a normal unit or an abnormal unit, position information of each unit and an image of each unit, which are obtained based on a wafer scanning image;

in this step, the first identification information is obtained by receiving or reading the first identification information. The first identification information is generally information obtained by analyzing a wafer scanning image obtained by scanning a wafer by an AOI device.

Typically, the wafer includes a rows by B columns of cells. Each cell corresponds to a Die (Die), i.e., the wafer includes a rows x B columns of dice. Wherein A and B are positive integers greater than or equal to 2. A cell is a normal cell, meaning that the Die to which the cell corresponds is a normal Die. A cell is an exception cell, meaning that the Die to which the cell corresponds is an exception Die. Wherein, the normal Die is Die generated in the chip manufacturing process and available for normal use. The abnormal Die is a Die that is generated during the chip manufacturing process and cannot be used normally.

The preliminary identification result may be a preliminary identification result that the AOI device scans the units on the wafer one By one in a By Die Scan (By Die Scan) manner to obtain a wafer Scan image, and each unit on the wafer is a normal unit or an abnormal unit through analysis of the wafer Scan image. The initial recognition result is obtained by analyzing a wafer scanning image obtained by scanning each unit on the wafer one by one in a unit scanning manner.

The AOI equipment records the initial identification result of each unit, records the position of each unit on the wafer, and shoots and records the image of each unit to form first identification information. When the need comes, it is only required to send the data to the data processing device.

In the method and the device, the preliminary identification result is obtained based on the analysis of the wafer scanning image obtained in the By Die Scan mode, and the identification whether the preliminary identification result of the fine granularity needs to be corrected or not can be realized By taking Die as a unit of the wafer. Fine-grained identification is achieved.

S102: constructing a target image for the wafer based on the position information of each unit and the image of each unit;

in practice, the step may be performed by stitching the images of the units according to the positions of the units in the wafer to form an image (target image) for the wafer.

It will be appreciated that the target image and AOI scanned wafer scan image constructed based on the location information of each cell and the image of each cell may be equally large images or images having a certain scale of size. In some embodiments, the images are of equal size, such that the location of each cell is the same or consistent in the constructed target image and the wafer scan image.

S103: dividing the target image to obtain at least one target sub-image, wherein each target sub-image corresponds to P units of the wafer, and P is a positive integer greater than 1;

in implementation, the target image is divided according to the attribute of the exposure unit of the wafer to obtain at least one target sub-image, each target sub-image corresponds to M × N units of the wafer, M × N = P, and M and N are positive integers greater than 1. Wherein the attribute characterizes a size or specification of the exposure unit.

The exposure unit refers to a shot used in an exposure link in a chip manufacturing process. The specification or size of the exposure unit needs to be specified before exposure. Typically, the exposure unit is a shot of M rows by N columns specification. That is, the size of shot is the size of M rows × N columns of Die. The exposure unit comprises M rows and N columns of exposure subunits, and each exposure subunit has the same size as Die.

As shown in fig. 2, there are 2 rows by 3 columns (M =2, n = 3) of exposure units. In one exposure unit of 3 rows by 2 columns, there are M × N =6 exposure subunits, including subunit 11, subunit 12, subunit 13, subunit 21, subunit 22, and subunit 23. Each exposure subunit is the same size as a single Die of the wafer.

Fig. 2 shows a specific example of the exposure unit. Any reasonable size or dimension is within the scope of the present application.

And dividing the target image according to the attribute of the exposure unit of the wafer, wherein the size or specification of each obtained target sub-image is the same as that of the exposure unit.

S104: and correcting the primary recognition results of at least part of the units based on at least one target sub-image and a preset image to obtain the target recognition result of each unit in the target image.

In this step, the preset image may be a preset standard image. In size, the standard image is the same as the size of the exposure unit. In the content, the test chip is provided on the scribe line of the exposure unit as in the exposure unit, as shown in fig. 3. It is understood that the standard image is an image with a test chip and without defects.

In implementation, whether units needing to be subjected to preliminary recognition result correction exist in each unit can be determined through comparison between each target sub-image and the preset image. And determining that a unit which needs to be subjected to primary recognition result correction exists under the condition that the comparison result is that the target sub-image is consistent with the preset image. And if the cells exist, correcting the preliminary identification result of the existing cells based on at least one target sub-image and a preset image.

In the technical scheme of the application, because the test element is arranged on the cutting channel of the wafer, the primary identification result of the Die close to the cutting channel identified by the AOI is usually unqualified Die, and therefore, the Die needing to be subjected to primary identification result correction exists in each Die under most conditions. AOI identifies Die near the scribe line as a faulty Die because AOI misqualifies the test element as a defect. However, the test element is present on the wafer as a component for electrical parameter and functionality testing of the wafer, and is not a defect. It can be seen that the (initial) recognition result of Die of the near-cutting street by AOI is incorrect and needs to be corrected.

In S101 to S104, the first identification information is obtained, and the target image for the wafer is constructed based on the position information of each cell and the image of each cell in the first identification information. Based on at least one target sub-image and the preset image obtained by dividing the constructed target image, the method can correct the wrong primary identification result generated by aiming at least part of units in the wafer, so that the identification correctness of whether each unit in the wafer is a qualified unit or an unqualified unit is improved, and the error identification is reduced.

In some embodiments, the foregoing scheme of modifying the preliminary recognition result of at least some of the cells based on at least one target sub-image and the preset image to obtain the target recognition result of each cell in the target image may be implemented by the scheme shown in fig. 4.

S401: and determining a first type unit in each unit based on at least one target sub-image and a preset image, wherein the first type unit is a unit which needs to be subjected to primary recognition result correction in each unit.

The first type unit of the wafer is a unit which has an erroneous preliminary identification result and needs to be corrected in the wafer.

In this step, the Die that is wrong in the preliminary identification result and needs to be corrected in each Die of the wafer is identified. Further, the identification of the Die needing to be corrected can be realized in one of the following two ways.

Mode a: determining a first sub-image based on a comparison result between each target sub-image in at least one target sub-image and a preset image and a primary recognition result of each unit in each target sub-image, wherein the first sub-image is a sub-image of at least one target sub-image including a unit which needs to be corrected according to the primary recognition result; dividing the first sub-image into a plurality of first areas; and determining a first type unit from the units based on the comparison result of the first areas and the second areas in the preset image and the preliminary identification result of the units included in the first areas.

In the method a, the first sub-image is a sub-image that is consistent with the preset image in comparison among the target sub-images and includes a unit with an abnormal preliminary identification result. The preset image is a standard image without defects, and is consistent with the standard image in comparison, which indicates that the sub-image is an image without defects. However, the recognition result (preliminary recognition result) given by the AOI indicates that the sub-image is an image including an abnormal cell (a cell whose preliminary recognition result is abnormal), which indicates that the AOI is erroneous with respect to the preliminary recognition result given by the cell. And the unit with the error in the primary identification result is the unit with the primary identification result needing to be corrected. The sub-image including the cell for which the preliminary recognition result is erroneous may be regarded as a sub-image including the cell for which the preliminary recognition result needs to be corrected.

And dividing the preset image in advance according to the Die size to obtain a plurality of second areas of the preset image. In implementation, the first sub-image is divided into a plurality of first areas by dividing the first sub-image into a plurality of first areas according to the size of Die. Since all are divided by the size of Die, the second area is the same in size as the first area. Since the size of the first sub-image is the same as the size of the exposure unit and the size of the preset image is the same as the size of the exposure unit, the first sub-image and the preset image have the same size. The first sub-image and the preset image are divided according to the Die size, and the obtained first area and the second area are corresponding. For example, the 1 st area into which the first sub-image is divided corresponds to the 1 st area into which the preset image is divided, the 2 nd area into which the first sub-image is divided corresponds to the 2 nd area into which the preset image is divided, and so on.

And comparing the gray value of the corresponding area between the first sub-image and the preset image. If the difference between the gray-level value of a certain area, such as area 1, into which the first sub-image is divided and the gray-level value of the corresponding area of the preset image, such as area 1 of the preset image, is greater than or equal to the first threshold, area 1 is considered to be a defective area. If the difference between the gray values is not greater than or equal to the first threshold, it is considered that the region 1 is not a defective region. By adopting the scheme, the gray values of all the corresponding areas of the first sub-image and the preset image are compared, and the area without the defect is determined. For a region which is determined to have no defect through gray value comparison, if a cell whose preliminary identification result is abnormal exists in the region given by the AOI, the preliminary identification result of the AOI on the cell which is abnormal in the region is considered to be wrong. The preliminary identification result of the unit needs to be corrected. Thus, the unit with the error of the preliminary identification result and needing to be corrected in the wafer can be found out.

Mode b: screening out a second sub-image from at least one target sub-image based on the primary recognition result of each unit, wherein the second sub-image is a sub-image comprising the unit with abnormal primary recognition result; dividing the second sub-image into a plurality of third areas; and determining a first type unit from the units based on the results of comparison between the third areas and the second areas in the preset image and the preliminary identification results of the units included in the first areas.

In implementation, in each target sub-image, the sub-image including the unit with the abnormal preliminary identification result is screened out as the second sub-image. And according to the Die size, dividing the second sub-image into a plurality of third areas. And dividing the preset image in advance according to the Die size to obtain a plurality of second areas of the preset image. Since all are divided by the size of Die, the second area and the third area are the same in size. Since the size of the second sub-image is the same as the size of the exposure unit and the size of the preset image is the same as the size of the exposure unit, the size of the second sub-image is the same as the size of the preset image. And dividing the second sub-image and the preset image according to the Die size, wherein the obtained third area corresponds to the second area. For example, the 1 st area into which the second sub-image is divided corresponds to the 1 st area into which the preset image is divided, the 2 nd area into which the second sub-image is divided corresponds to the 2 nd area into which the preset image is divided, and so on.

And comparing the gray value of the corresponding area between the second sub-image and the preset image. If the difference between the gray value of a certain area, such as area 2, into which the second sub-image is divided and the gray value of the corresponding area of the preset image, such as area 2 of the preset image, is greater than or equal to the second threshold, the area 2 is considered to be a defective area. If the difference between the gray values is not greater than or equal to the second threshold, it is considered that the region 2 is not a defective region. By adopting the scheme, the gray values of all corresponding areas of the second sub-image and the preset image are compared, and the area without the defects is determined. For the area which is determined to have no defect through gray value comparison, if the AOI gives that the cells with abnormal preliminary identification results exist in the area, the AOI is considered to be wrong in the preliminary identification results of the cells with abnormal preliminary identification results in the area. The preliminary identification result of the unit needs to be corrected. Thus, the unit with the error of the preliminary identification result and needing to be corrected in the wafer can be found out.

Whether the method a or the method b is adopted to determine the unit needing to be corrected in the primary recognition result, the determination of the unit needing to be corrected in the primary recognition result is carried out based on the comparison result between the divided areas of the first sub-image and the second sub-image and the divided areas of the preset image and the primary recognition result of the unit included in each first area, and the determination accuracy of the first type unit in the wafer can be ensured. Therefore, the accuracy of identifying whether each unit in the wafer is a qualified unit or an unqualified unit is improved, and the error identification rate is reduced.

The first threshold and the second threshold are flexibly set values according to practical experience, and may be the same or different. For the specific description of the first and second modes, reference is made to the following related descriptions, which are not repeated.

S402: correcting the primary recognition result of the first type unit according to a preset recognition result to obtain a target recognition result of the first type unit;

in this step, the preset recognition result is the recognition result of the qualified unit as the characterization unit. And adjusting the wrong primary identification result of the first-class unit to be a preset identification result, and taking the preset identification result as the target identification result of the first-class unit.

S403: and obtaining the target recognition result of each unit in the target image based on the target recognition result of the first-class unit and the preliminary recognition result of the second-class unit except the first-class unit in each unit.

In this step, from the viewpoint of the initial recognition result of AOI on each unit of the wafer, each unit of the wafer includes two types. One of the classes is a unit (second class unit) whose preliminary recognition result is correct. The other type is a unit (first type unit) which is wrong in the primary recognition result and needs to be corrected. And collecting the preset identification result of the first type unit and the preliminary identification result of the second type unit to obtain the target identification result of each unit in the target image. That is, the target recognition result of each cell in the target image includes the corrected result of the first kind of cell and the preliminary recognition result of the second kind of cell.

In S401-S403, determining units needing preliminary identification result correction in each unit based on at least one target sub-image and a preset image; correcting the primary recognition result of the first type unit according to a preset recognition result to obtain a target recognition result of the first type unit; and obtaining the target recognition result of each unit in the target image based on the target recognition result of the first-class unit and the preliminary recognition result of a second-class unit except the first-class unit in each unit. And correcting the initial identification result of the unit to be corrected to obtain an accurate identification result of the unit. Therefore, the accuracy of identifying whether each unit in the wafer is a qualified unit or a unqualified unit can be improved, and the error identification is reduced.

In some embodiments, the method further comprises: outputting a target image; and/or outputting the target recognition result of each unit on the target image corresponding to the position of each unit. The target image and the target recognition result are output, visualization of the target recognition result can be achieved, and related personnel can conveniently check the target recognition result. The usability is improved.

The technical solution of the present application will be described in detail with reference to fig. 5.

The following description will be given taking a data processing apparatus in the present application as a simple (i.e., shot) filter system as an example.

In fig. 5, the scribe lines 1 and 2 of the wafer are provided with test devices as an example. And the AOI scans the wafer provided with the test element in a By Die scan mode to obtain a wafer scanning image. And analyzing the wafer scanning image to obtain a preliminary identification result of each Die in the wafer. Wherein, in the preliminary identification result of each Die of the wafer. The letter A indicates that the AOI recognizes the Die as a normal Die or a Good Die. The letter B indicates that AOI identifies Die as an abnormal Die or BAD Die (BAD Die). From the preliminary identification result shown in fig. 5, it is possible that the AOI identifies that a Die is an abnormal Die because there is an abnormality, such as an edge defect, on the Die, so the preliminary identification result for the Die is an abnormal Die. It is also possible that the Die itself does not have a defective edge defect, but since the Die is a Die close to a test element, the test element is mistaken for a defect, and thus the AOI erroneously recognizes the Die itself having no defective edge defect as an abnormal Die.

The real filter system in the technical scheme of the application can correct the primary recognition result of the abnormal Die which is wrongly recognized by the AOI. Specifically, the AOI generates the Klarf file based on the preliminary identification result of each Die in the wafer and the position of each Die in the wafer. Wherein, the Klarf file records the initial identification result of AOI on whether each Die is a normal Die or an abnormal Die and the position of each Die. The AOI shoots and records images of all Dies in the wafer, for example, abnormal Dies. AOI sends the Klarf file and the recorded images of the individual Die to the real filter system. And the reticule filter system splices the images of all the Dies according to the positions of all the Dies in the wafer to form a target image for the wafer. It can be understood that if the target image of the wafer is subjected to image stitching in an equal proportion according to the positions of the respective Die, the formed target image is the same image as the wafer scanning image. Among them, the contents recorded by the Klarf file and the images of the respective Die can be used as the first identification information of the present application.

In this example, the exposure unit is 2 rows × 3 columns. The reticule filter system divides the target image according to the size of the exposure unit to obtain a plurality of target sub-images of the target image. Shown in box 1, box 2 and box 3 in fig. 5, are three of the divided target sub-images. Each sub-image comprises 2 rows x 3 columns of Die, similar to the exposure unit comprising 2 rows x 3 columns of Die. It will be appreciated that because the lithographic pattern is a repeat of a pattern of multiple exposure units in the chip manufacturing process, the pattern of the target image that is built up is also a repeat of a pattern of multiple exposure units. Each target sub-image is a repetition of the pattern of exposure units.

In the present application, the predetermined image is a standard image having the same size as the exposure unit, 2 rows by 3 columns, and no defects. The 2 rows by 3 columns of exposure units without defects can be photographed in advance and used as standard images.

The coarse identification scheme or the fine identification scheme in the application is adopted to identify the Die needing to be subjected to the preliminary identification result correction, and the preliminary identification result of the Die needing to be corrected is subjected to the identification result correction.

Referring to the aforementioned solution a, each target sub-image is compared with the standard image respectively for consistency. If a certain target sub-image, such as the target sub-image 1, is consistent with the standard image in comparison, and the primary recognition result of AOI indicates that the target sub-image 1 includes Die with abnormal primary recognition result, it indicates that the abnormality of Die with abnormal primary recognition result in the target sub-image 1 is caused by the test element. The result of the AOI's preliminary identification of the Die is erroneous. If a certain target sub-image, such as the target sub-image 1, is not consistent with the standard image in comparison, and the primary recognition result of AOI indicates that the target sub-image 1 includes Die with abnormal primary recognition result, it indicates that the Die with abnormal primary recognition result in the target sub-image 1 is abnormal, and the Die is caused by edge breakage defect. The result of the AOI's preliminary identification of the Die is correct.

In the scheme a, if a target sub-image is not consistent with a standard image in comparison, and the primary recognition result of AOI indicates that the target sub-image includes Die of which the primary recognition result is abnormal, it indicates that the abnormality of Die is caused by edge breakage defect. Such target sub-images are excluded without correcting the preliminary recognition result of the abnormal Die included therein.

And (4) regarding the target sub-image which is consistent with the standard image in comparison and has the abnormal Die as a first sub-image (the sub-image which comprises the unit needing to be corrected in the primary recognition result).

The image of frame 3 shown in fig. 5 is assumed to be the first sub-image. The image of frame 3 is divided into regions according to the size of Die. Since the image size shown in box 3 is the same as the size of the exposure unit (M =2, n = 3). The image of the frame 3 is divided into regions according to the size of Die, and 2 × 3=6 (M × N) first regions are obtained. The standard image is divided into regions in advance according to the size of Die, and 2 × 3=6 (M × N) second regions are obtained. The size of the first area and the second area are both the same as the size of a single Die.

As shown in fig. 6, it is assumed that the image of the frame 3 is divided into 6

sub-regions

101, 102, 103, 201, 202, and 203. The standard image is divided into regions, resulting in

sub-regions

11, 12, 13, 21, 22, 23, respectively, as shown in fig. 3. The first region 101 corresponds to the second region 11. The first region 102 is a region 8230corresponding to the second region 12, and the first region 203 is a region corresponding to the second region 23.

The gray values of the corresponding areas of the two images (the first sub-image and the preset image) are compared. If the grayscale values of the region 101 and the grayscale values of the region 11 of the preset image are smaller than the first threshold, and the grayscale values of the region 103 and the grayscale values of the region 13 of the preset image are smaller than the first threshold, the

regions

101 and 103 are considered as regions without defects. However, the area 101 and the area 103 given by AOI both have Die with abnormal preliminary identification results, and the reticule filter system considers that AOI is wrong for the preliminary identification results of Die with abnormal area 101 and area 103. The reticule filter system regards the Die with the abnormal preliminary identification result included in the area 101 and the area 103 as the first type unit in the wafer.

Referring to the foregoing solution b, in each target sub-image, a sub-image including a cell whose preliminary recognition result is abnormal is screened out as a second sub-image. Such as screening the image of frame 3 in fig. 5 as the second sub-image. For the area division of the second sub-image and the area division of the standard image, refer to the foregoing description related to fig. 6 and fig. 3, which is not repeated.

And comparing the gray values of the corresponding areas of the two images (the second sub-image and the preset image). If the gray scale value of the region 101 and the gray scale value of the region 11 of the preset image are smaller than the second threshold, and the gray scale value of the region 103 and the gray scale value of the region 13 of the preset image are smaller than the second threshold, the

regions

In the scheme b, if the gray-scale value of a certain region of the second sub-image is greater than or equal to the second threshold, the region is considered to be a defective region. And AOI shows that the areas are all Dies with the abnormal preliminary identification result, which indicates that the abnormality of the Dies is caused by edge breakage defects. Such Die can be excluded without modification.

In practical applications, the area division of the first sub-image, the second sub-image and the exposure unit may be a division according to pixcel of the image. And identifying the first type of unit in the wafer based on the comparison of the gray values of the corresponding pixcel in the two images (the first sub-image and the preset image or the second sub-image and the preset image).

The two kinds of Die identification schemes for the preliminary identification result in the wafer needing to be corrected are easy to implement in engineering, high in feasibility and capable of ensuring the identification accuracy of the first type unit in the wafer.

And adjusting the Die recognition result with the wrong initial recognition result from the wrong recognition result to the Die recognition result with the qualified Die so as to achieve the purpose of correcting the wrong initial recognition result. As shown in fig. 5, row 3, column 4 and column 6 in the target image are corrected from the letter B, which is indicated as abnormal or non-defective, to the letter a, which is indicated as normal or non-defective. Therefore, the correction of the preliminary identification results of all the first-type units in the wafer can be realized.

It should be noted that what is corrected in the present application is the preliminary identification result of AOI identifying Die as abnormal Die due to the test element being mistaken for a defect. And (4) the preliminary identification result of the Die with the edge breakage defect does not need to be corrected and is excluded.

In the target image, the corrected recognition result of the first-type unit and the preliminary recognition result of the second-type unit except the first-type unit in the wafer can be correspondingly labeled at the respective positions of the units. And the reticule filter system outputs the target image marked with the identification result as a Map image and imports the Map image into the AOI.

And the AOI takes the target identification result of each unit in the Map as a correction result of the initial identification result of the AOI, so that the AOI can provide a more accurate identification result for defect detection of the wafer.

It is understood that the information in the Map indicates whether each Die in the wafer is a good Die or a bad Die. The Map display allows the relevant person to visually see which is a good Die and which is a bad Die. The selection of good Die and the removal of bad Die are facilitated for relevant personnel.

In this application, by using the particle filter system, the Bad Die identified by the fact that the Test Key on the cutting track is mistakenly captured as a defect can be modified into the Good Die by the AOI, so that the mistaken capture caused by the Test Key can be avoided.

The present application also provides a data processing apparatus, as shown in fig. 7, the apparatus including:

an obtaining unit 701 configured to obtain first identification information, where the first identification information includes a preliminary identification result that each unit of a wafer is a normal unit or an abnormal unit, position information of each unit, and an image of each unit, the preliminary identification result being obtained based on a wafer scanning image;

a construction unit 702 configured to construct a target image for a wafer based on the position information of each unit and the image of each unit;

the dividing unit 703 is configured to divide the target image to obtain at least one target sub-image, where each target sub-image corresponds to P units of the wafer, and P is a positive integer greater than 1;

and a correcting unit 704, configured to correct the preliminary recognition result of at least some of the cells based on the at least one target sub-image and the preset image, so as to obtain a target recognition result of each cell in the target image.

In some embodiments, the dividing unit 703 is configured to divide the target image according to an attribute of the exposure unit of the wafer to obtain at least one target sub-image, where each target sub-image corresponds to M × N units of the wafer, M × N = P, and M and N are positive integers greater than 1.

In some embodiments, the modifying unit 704 is configured to determine a first type of unit in each unit based on at least one target sub-image and a preset image, where the first type of unit is a unit in each unit that needs to be modified by a preliminary identification result;

In some embodiments, the correcting unit 704 is configured to determine a first sub-image based on a comparison result between each target sub-image in the at least one target sub-image and a preset image and a primary recognition result of each unit included in each target sub-image, where the first sub-image is a sub-image including a unit whose primary recognition result needs to be corrected in the at least one target sub-image;

dividing the first sub-image into a plurality of first areas;

and determining a first type unit from each unit based on the results of comparison between the plurality of first areas and the plurality of second areas in the preset image and the preliminary identification results of the units included in each first area.

In some embodiments, the modifying unit 704 is configured to filter out a second sub-image from the at least one target sub-image based on the preliminary identification result of each cell, where the second sub-image is a sub-image including a cell whose preliminary identification result is abnormal;

dividing the second sub-image into a plurality of third areas;

and determining a first type unit from each unit based on the results of the comparison between the plurality of third areas and the plurality of second areas in the preset image and the preliminary identification results of the units included in each first area.

In some embodiments, the apparatus further comprises an output unit for outputting the target image; and/or outputting the target recognition result of each unit on the target image corresponding to the position of each unit.

It should be noted that, in the data processing apparatus according to the embodiment of the present application, because the principle of solving the problem of the data processing apparatus is similar to that of the data processing method, the implementation process and the implementation principle of the data processing apparatus can be described by referring to the implementation process and the implementation principle of the method, and repeated details are not repeated.

According to an embodiment of the present application, an electronic device and a readable storage medium are also provided.

FIG. 8 shows a schematic block diagram of an example electronic device 800 that may be used to implement embodiments of the present application. Electronic devices are intended to represent various forms of digital computers, such as laptops, desktops, workstations, personal digital assistants, servers, blade servers, mainframes, and other appropriate computers. The electronic device may also represent various forms of mobile devices, such as personal digital processing, cellular phones, smart phones, wearable devices, and other similar computing devices. The components shown herein, their connections and relationships, and their functions, are meant to be examples only, and are not meant to limit implementations of the present application that are described and/or claimed herein.

As shown in fig. 8, the apparatus 800 includes a computing unit 801 that can perform various appropriate actions and processes according to a computer program stored in a Read Only Memory (ROM) 802 or a computer program loaded from a storage unit 808 into a Random Access Memory (RAM) 803. In the RAM 803, various programs and data necessary for the operation of the device 800 can also be stored. The calculation unit 801, the ROM 802, and the RAM 803 are connected to each other by a bus 804. An input/output (I/O) interface 805 is also connected to bus 804.

A number of components in the device 800 are connected to the I/O interface 805, including: an input unit 806, such as a keyboard, a mouse, or the like; an output unit 807 such as various types of displays, speakers, and the like; a storage unit 808, such as a magnetic disk, optical disk, or the like; and a communication unit 809 such as a network card, modem, wireless communication transceiver, etc. The communication unit 809 allows the device 800 to exchange information/data with other devices via a computer network such as the internet and/or various telecommunication networks.

Computing unit 801 may be a variety of general and/or special purpose processing components with processing and computing capabilities. Some examples of the computing unit 801 include, but are not limited to, a Central Processing Unit (CPU), a Graphics Processing Unit (GPU), various dedicated Artificial Intelligence (AI) computing chips, various computing units running machine learning model algorithms, a Digital Signal Processor (DSP), and any suitable processor, controller, microcontroller, and the like. The calculation unit 801 executes the respective methods and processes described above, such as the data processing method. For example, in some embodiments, the data processing method may be implemented as a computer software program tangibly embodied in a machine-readable medium, such as storage unit 808. In some embodiments, part or all of the computer program can be loaded and/or installed onto device 800 via ROM 802 and/or communications unit 809. When loaded into RAM 803 and executed by the computing unit 801, a computer program may perform one or more steps of the data processing method described above. Alternatively, in other embodiments, the computing unit 801 may be configured to perform the data processing method in any other suitable manner (e.g., by means of firmware).

Various implementations of the systems and techniques described here above may be implemented in digital electronic circuitry, integrated circuitry, field Programmable Gate Arrays (FPGAs), application Specific Integrated Circuits (ASICs), application specific labeling products (ASSPs), system on a chip (SOCs), load programmable logic devices (CPLDs), computer hardware, firmware, software, and/or combinations thereof. These various embodiments may include: implemented in one or more computer programs that are executable and/or interpretable on a programmable system including at least one programmable processor, which may be special or general purpose, receiving data and instructions from, and transmitting data and instructions to, a storage system, at least one input device, and at least one output device.

Program code for implementing the methods of the present application may be written in any combination of one or more programming languages. These program codes may be provided to a processor or controller of a general purpose computer, special purpose computer, or other programmable data processing apparatus, such that the program codes, when executed by the processor or controller, cause the functions/operations specified in the flowchart and/or block diagram to be performed. The program code may execute entirely on the machine, partly on the machine, as a stand-alone software package partly on the machine and partly on a remote machine or entirely on the remote machine or server.

In the context of this application, a machine-readable medium may be a tangible medium that can contain, or store a program for use by or in connection with an instruction execution system, apparatus, or device. The machine-readable medium may be a machine-readable signal medium or a machine-readable storage medium. A machine-readable medium may include, but is not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any suitable combination of the foregoing. More specific examples of a machine-readable storage medium would include an electrical connection based on one or more wires, a portable computer diskette, a hard disk, a Random Access Memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

To provide for interaction with a user, the systems and techniques described here can be implemented on a computer having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to a user; and a keyboard and a pointing device (e.g., a mouse or a trackball) by which a user can provide input to the computer. Other kinds of devices may also be used to provide for interaction with a user; for example, feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user may be received in any form, including acoustic, speech, or tactile input.

The systems and techniques described here can be implemented in a computing system that includes a back-end component (e.g., as a data server), or that includes a middleware component (e.g., an application server), or that includes a front-end component (e.g., a user computer having a graphical user interface or a web browser through which a user can interact with an implementation of the systems and techniques described here), or any combination of such back-end, middleware, or front-end components. The components of the system can be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: local Area Networks (LANs), wide Area Networks (WANs), and the Internet.

The computer system may include clients and servers. A client and server are generally remote from each other and typically interact through a communication network. The relationship of client and server arises by virtue of computer programs running on the respective computers and having a client-server relationship to each other. The server may be a cloud server, a server of a distributed system, or a server combining a blockchain.

It should be understood that various forms of the flows shown above may be used, with steps reordered, added, or deleted. For example, the steps described in the present disclosure may be executed in parallel, sequentially, or in different orders, and are not limited herein as long as the desired results of the technical solutions disclosed in the present disclosure can be achieved.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A method of data processing, comprising:

obtaining first identification information, wherein the first identification information comprises a preliminary identification result of whether each unit of the wafer is a normal unit or an abnormal unit, position information of each unit and an image of each unit, which are obtained based on a wafer scanning image;

2. The method of claim 1, wherein the dividing the target image into at least one target sub-image comprises:

dividing the target image according to the attributes of the exposure units of the wafer to obtain at least one target sub-image, wherein each target sub-image corresponds to M × N units of the wafer, M × N = P, and M and N are positive integers greater than 1.

3. The method according to claim 1 or 2, wherein the modifying the preliminary recognition result of at least some of the cells based on the at least one target sub-image and the preset image to obtain the target recognition result of each cell in the target image comprises:

4. The method according to claim 3, wherein determining the first type of cells in the cells based on the at least one target sub-image and the preset image comprises:

dividing the first sub-image into a plurality of first areas;

5. The method according to claim 3, wherein determining the first type of cells among the cells based on the at least one target sub-image and the preset image comprises:

dividing the second sub-image into a plurality of third areas;

6. The method of claim 1 or 2, further comprising:

outputting a target image;

7. A method according to claim 1 or 2, wherein the preliminary identification result is obtained by analyzing a wafer scanning image obtained by scanning each unit on the wafer one by one in a unit scanning manner.

8. A data processing apparatus, characterized by comprising:

the construction unit is used for constructing a target image for the wafer based on the position information of each unit and the image of each unit;

9. An electronic device, comprising:

at least one processor; and

a memory communicatively coupled to the at least one processor; wherein, the first and the second end of the pipe are connected with each other,

the memory stores instructions executable by the at least one processor to enable the at least one processor to perform the method of any one of claims 1-7.

10. A non-transitory computer readable storage medium having stored thereon computer instructions for causing the computer to perform the method of any one of claims 1-7.