CN115981036B

CN115981036B - Display panel and preparation method thereof

Info

Publication number: CN115981036B
Application number: CN202211728274.3A
Authority: CN
Inventors: 曹尚操; 袁海江
Original assignee: HKC Co Ltd; Changsha HKC Optoelectronics Co Ltd
Current assignee: HKC Co Ltd; Changsha HKC Optoelectronics Co Ltd
Priority date: 2022-12-29
Filing date: 2022-12-29
Publication date: 2024-02-09
Anticipated expiration: 2042-12-29
Also published as: CN115981036A

Abstract

The application provides a preparation method of a display panel and the display panel. The preparation method of the display panel comprises the following steps: providing a first transparent substrate; forming a first conductive layer and a second conductive layer which are insulated from each other on one side of the first transparent substrate, wherein the second conductive layer is away from the first transparent substrate compared with the first conductive layer; forming a color resist layer on one side of the second conductive layer; exposing the color resist layers in different product design areas to obtain a plurality of color resist layers, wherein the thicknesses of the different color resist layers in the opening areas are different, and the thicknesses of the color resist layers in the non-opening areas are the same; forming a via hole in the color resistance layer corresponding to the non-opening area to expose part of the second conductive layer; and forming a transparent conductive layer on one side of the color resistance layer, which is away from the first transparent substrate, wherein the transparent conductive layer is partially positioned in the via hole and is electrically connected with the second conductive layer. The preparation method of the display panel provided by the embodiment of the application can utilize the same photomask to realize the preparation of products with different color gamuts, and the quality of the products can be kept consistent.

Description

Display panel and preparation method thereof

Technical Field

The application relates to the technical field of display equipment, in particular to a preparation method of a display panel and the display panel.

Background

In the existing liquid crystal display, different products are simultaneously manufactured in the same photomask, so that the liquid crystal display can flexibly cope with the market, improve the competitiveness and meet the requirements of different customers.

However, the different specifications required by different product customers can cause compatibility problems in the same photomask production.

Disclosure of Invention

In a first aspect, the present application provides a method for preparing a display panel, where the method for preparing a display panel includes:

providing a first transparent substrate;

forming a first conductive layer and a second conductive layer which are insulated from each other on one side of the first transparent substrate, wherein the second conductive layer is away from the first transparent substrate compared with the first conductive layer;

forming a color-resisting layer positioned on one side of the second conductive layer;

exposing the color resistance layers in different product design areas to obtain a plurality of color resistance layers, wherein the thicknesses of the different color resistance layers in the opening areas are different, and the thicknesses of the color resistance layers in the non-opening areas are the same;

forming a via hole in the corresponding non-opening area of the color resistance layer to expose part of the second conductive layer; a kind of electronic device with high-pressure air-conditioning system

And forming a transparent conductive layer on one side of the color resistance layer, which is away from the first transparent substrate, wherein the transparent conductive layer is partially positioned in the through hole and is electrically connected with the second conductive layer.

The color resist layer comprises a first color resist layer and a second color resist layer, the color resist layer is positioned in different product design areas for exposure to obtain a plurality of color resist layers, wherein different color resist layers are positioned in different thicknesses of an opening area and are positioned in the same thickness of a non-opening area, and the color resist layer comprises:

exposing a first non-opening area of the first color germ layer and a second non-opening area of the second color germ layer by adopting a first illumination intensity, wherein the second color germ layer and the first color germ layer are the same-polarity photoresistors; a kind of electronic device with high-pressure air-conditioning system

Exposing the second opening area of the second color-resisting layer with a second illumination intensity, and exposing the first opening area of the first color-resisting layer with a third illumination intensity, wherein the second illumination intensity is different from the third illumination intensity.

When the first color resist layer and the second color resist layer are negative photoresists, exposing the color resist layers located in different product design areas to obtain a plurality of color resist layers, wherein the different color resist layers are different in thickness of an opening area and the same in thickness of a non-opening area, and further comprising:

controlling the third illumination intensity to be larger than the second illumination intensity;

forming a via hole in the color resistance layer corresponding to the non-opening area to expose a part of the second conductive layer, including:

and exposing the partial area of the first non-opening area by adopting fourth illumination intensity to form a first via hole, and exposing the partial area of the second non-opening area by adopting fourth illumination intensity to form a second via hole so as to expose part of the second conductive layer.

Wherein, the color resist layer is located in different product design areas is exposed to obtain a plurality of color resist layers, wherein, different the color resist layer is located the thickness difference in opening area, is located the thickness the same in non-opening area, still includes:

and controlling the first illumination intensity to be equal to the third illumination intensity, or controlling the first illumination intensity to be equal to the second illumination intensity.

controlling the first illumination intensity to be 100% illumination intensity;

forming a via hole in the color resistance layer corresponding to the non-opening area to expose a part of the second conductive layer, and further comprising:

and controlling the fourth illumination intensity to be 0% illumination intensity.

and controlling the first illumination intensity to be larger than or equal to an illumination intensity threshold, wherein the illumination intensity larger than the illumination intensity threshold is equal to the thickness generated by the area irradiated by the first color germ layer and the second color germ layer compared with the illumination intensity threshold.

Wherein, exposure is performed on the color resist layers in different product design areas to obtain a plurality of color resist layers, wherein the thicknesses of the different color resist layers in the opening areas are different, and after the thicknesses of the color resist layers in the non-opening areas are the same, the preparation method of the display panel further comprises:

setting a spacer layer on the color resistance layer; a kind of electronic device with high-pressure air-conditioning system

And exposing and developing the spacer layer by adopting fifth illumination intensity to form a plurality of main spacers with the same thickness, wherein the main spacers are positioned in the non-opening area.

After the spacer layer is disposed on the color resistance layer, the preparation method of the display panel further comprises the following steps:

and exposing and developing the spacer layer by adopting fifth illumination intensity to form a plurality of secondary spacers with the same thickness, wherein the secondary spacers have the same thickness as the primary spacers, and the secondary spacers are positioned in the non-opening area and/or the opening area.

Wherein, after exposing and developing the spacer layer with the fifth illumination intensity to form a plurality of main spacers with the same thickness, the main spacers are located in the non-opening area, the method for manufacturing the display panel further comprises:

a second transparent substrate is arranged on one side of the plurality of main spacers, wherein the second transparent substrate is abutted against the plurality of main spacers; a kind of electronic device with high-pressure air-conditioning system

Cutting is performed to obtain various products.

Wherein, form first conducting layer and the second conducting layer that is insulated each other in one side of first transparent substrate, wherein, the second conducting layer is compared first conducting layer deviates from first transparent substrate, include:

exposing the first germ layer on one side of the first transparent substrate to obtain a first conductive layer wrapped by a first insulating layer, wherein the orthographic projection of the main spacer on the first transparent substrate is at least partially positioned in the area where the first conductive layer is positioned; a kind of electronic device with high-pressure air-conditioning system

And setting a second germ layer on one side of the first insulating layer, which is away from the first transparent substrate, and exposing the second germ layer to obtain a second conductive layer wrapped by the second insulating layer, wherein the second conductive layer is insulated from the first conductive layer.

According to the preparation method of the display panel 1, various products are prepared on the same first transparent substrate, the color resistances of the opening areas of different products are different in thickness, so that different products have different color gamuts, meanwhile, the color resistances of the non-opening areas of different products are the same in thickness, the products of different types are favorable for forming through holes with the same aperture in the non-opening areas, the quality of the display panel is improved, and the compatibility problem of products with various color gamuts produced in the same photomask is solved. Therefore, the preparation method of the display panel provided by the embodiment of the application can realize the preparation of a plurality of products with different color gamuts by using the same photomask, and the quality of the plurality of products is kept consistent.

In a second aspect, the present application further provides a display panel, where the display panel is prepared by the method for preparing a display panel according to the first aspect.

The display panel provided in this embodiment corresponds to a product obtained by the preparation method of the display panel provided in the first aspect, that is, the display panels with multiple different color gamuts can be prepared by using the same photomask through the preparation method of the display panel, and the quality of the display panels with multiple different color gamuts can be kept consistent. Therefore, the manufacturing cost of the display panel is low, and the quality of the display panel with various different color gamuts can be kept consistent.

Drawings

In order to more clearly illustrate the technical solutions of the examples of the present application, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present application.

Fig. 2 is a top view of the display panel prepared in fig. 1.

Fig. 3 is a schematic diagram of a stacked structure of the display panel in fig. 2.

Fig. 4 is a schematic view of an open area and a non-open area of the display panel in fig. 2.

Fig. 5 is a schematic diagram illustrating three-color distribution of a color resist layer of the display panel in fig. 2.

FIG. 6 is a flow chart of the exposure of the color-resistant germ layers of FIG. 1.

FIG. 7 is a schematic diagram of the open area and the non-open area of FIG. 6 exposed to different products.

Fig. 8 is a flowchart of controlling the second illumination intensity and the third illumination intensity in fig. 6.

Fig. 9 is a flow chart of forming a via in fig. 1.

FIG. 10 is a flowchart of controlling the first illumination intensity according to an embodiment of FIG. 6.

FIG. 11 is a graph showing the relationship between color resist thickness and illumination intensity according to an embodiment of the present application.

Fig. 12 is a flowchart of another embodiment of fig. 6 for controlling the first illumination intensity.

Fig. 13 is a flowchart of the fourth illumination intensity control in fig. 1.

Fig. 14 is a flowchart of controlling the first illumination intensity according to still another embodiment in fig. 6.

Fig. 15 is a flow chart of the preparation of the master spacer of fig. 1.

Fig. 16 is a flow chart of the preparation of the secondary master spacer of fig. 1.

FIG. 17 is a flow chart of the various products obtained in FIG. 1.

Fig. 18 is a flow chart of preparing the first conductive layer and the second conductive layer in fig. 1.

Reference numerals: a display panel 1; a first transparent substrate 10; a first conductive layer 20; a second conductive layer 30; a color resist layer 40; an opening area 41; a first opening area 411; a second opening region 412; a non-open region 42; a first non-opening area 421; a second non-open region 422; a via 43; a first via 431; a second via 432; a first color resist layer 44; a second color resist layer 45; a red layer 46; a green layer 47; a blue layer 48; a main spacer 50; a secondary spacer 60; a second transparent substrate 70; a first insulating layer 80; a second insulating layer 90; a transparent conductive layer 100; product 2; a first product 21; a second product 22; a first illumination intensity L1; a second illumination intensity L2; a third illumination intensity L3; a fourth illumination intensity L4; an illumination intensity threshold Lm.

Detailed Description

The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without undue burden, are within the scope of the present application.

The terms first, second and the like in the description and in the claims of the present application and in the above-described figures, are used for distinguishing between different objects and not for describing a particular sequential order. Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those listed steps or elements but may include other steps or elements not listed or inherent to such process, method, article, or apparatus.

Reference herein to "an embodiment" or "an implementation" means that a particular feature, structure, or characteristic described in connection with the embodiment or implementation may be included in at least one embodiment of the present application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.

The present application provides a method of manufacturing a display panel 1. Referring to fig. 1, fig. 2, fig. 3, fig. 4, and fig. 5, fig. 1 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present application; FIG. 2 is a top view of the display panel prepared in FIG. 1; FIG. 3 is a schematic diagram of a stacked structure of the display panel of FIG. 2; FIG. 4 is a schematic view of the open area and the non-open area of the display panel of FIG. 2; fig. 5 is a schematic diagram illustrating three-color distribution of a color resist layer of the display panel in fig. 2. In this embodiment, the method for manufacturing the display panel 1 includes steps S10, S20, S30, S40, S50, and S60. In the present embodiment, the display panel 1 is prepared as a liquid crystal display panel 1, and the display panel 1 is applied to a liquid crystal display (Liquid Crystal Display, LCD). In this embodiment, the same mask (mask) is used to prepare a plurality of products 2, and different products 2 have different color gamuts, and the thicknesses of the non-opening areas 42 of the different products 2 are the same, so that the sizes of the vias 43 of the different products 2 are the same, and the quality of the panel is improved, so that the quality of the plurality of groups of products can be kept consistent. Specifically, please refer to the following steps.

S10, providing a first transparent substrate 10.

In the present embodiment, the first transparent substrate 10 is an Array Glass (Array Glass).

S20, forming a first conductive layer 20 and a second conductive layer 30 insulated from each other on one side of the first transparent substrate 10, wherein the second conductive layer 30 faces away from the first transparent substrate 10 compared with the first conductive layer 20.

In this embodiment, the first conductive layer 20 may be, but is not limited to, a metal conductor material, a semiconductor material, or the like. The second conductive layer 30 may be, but is not limited to, a metallic conductor material or a semiconductor material.

S30, forming color resistance layers on one side of the second conductive layer 30.

In the embodiment, a plurality of products 2 are prepared by using the same color-resistant germ layer, so that the preparation efficiency is higher and the preparation cost is low.

S40, exposing the color resist layers in different product design areas to obtain a plurality of color resist layers 40.

In this embodiment, the color resist layers of different product design areas are used to prepare products 2 with different color gamuts, and after exposing the color resist layers of different product design areas, a plurality of color resist layers 40 corresponding to a plurality of products 2 can be obtained. The thicknesses of the different color resists 40 in the opening regions 41 and the thicknesses of the different color resists in the non-opening regions 42 are the same, that is, the color resists of the different products 2 in the opening regions 41 are different to realize that the different products 2 have different color gamuts, and the color resists of the different products 2 in the non-opening regions 42 are the same, so that the different products 2 form the vias 43 with the same aperture in the non-opening regions 42.

In this embodiment (see fig. 5), the color resist layer 40 includes a Red (Red, R) layer 46, a Green (G) layer 47, and a Blue (B) layer 48. In the products 2 with different color gamuts, the thicknesses of the color resistance layers 40 in the opening areas 41 are different, the thicknesses of the color resistance layers 40 in the non-opening areas 42 are the same, and the color resistances of the same color in the products 2 with different color gamuts are compared. Specifically, in the product 2 with different color gamuts, the thicknesses of the R layers located in the open area 41 are different, the thicknesses of the G layers located in the open area 41 are different, the thicknesses of the B layers located in the open area 41 are different, the thicknesses of the R layers located in the non-open area 42 are the same, the thicknesses of the G layers located in the non-open area 42 are the same, and the thicknesses of the B layers located in the non-open area 42 are the same.

Alternatively, the color resist layer 40 in this embodiment is prepared by exposure, specifically, by a halftone mask reticle (Half Tone Mask mask, HTM mask).

In the present embodiment, the thickness or the height refers to a dimension in a direction in which the first transparent substrate 10 points toward the color resist layer 40.

S50, forming a via hole 43 corresponding to the non-opening region 42 on the color resist layer 40 to expose a portion of the second conductive layer 30.

In the present embodiment, since the color resists of different products 2 are the same in thickness in the non-opening region 42, the via holes 43 having the same aperture can be formed in the non-opening region 42 of the color resist layer 40 by the same illumination intensity. The via 43 is also referred to as a pixel via 43 or an RGB via 43.

And S60, forming a transparent conductive layer 100 on one side of the color resistance layer 40 away from the first transparent substrate 10, wherein the transparent conductive layer 100 is partially positioned in the via hole 43 and is electrically connected with the second conductive layer 30.

In this embodiment, the transparent conductive layer 100 is transparent indium tin oxide (IndiumTinOxide, ITO).

It should be noted that fig. 2, 3 and 4 are schematic for the display panel 1 including two products 2, and it should be understood that fig. 2, 3 and 4 should not be construed as limiting the types and numbers of the products 2 included in the display panel 1. For convenience of distinction, the two products 2 are respectively named as a first product 21 and a second product 22, and the first product 21 corresponds to the first opening area 411, the first non-opening area 421 and the first via 431, and the second product 22 corresponds to the second opening area 412, the second non-opening area 422 and the second via 432.

In summary, the method for manufacturing the display panel 1 provided in the embodiment of the present disclosure prepares multiple products 2 on the same first transparent substrate 10, and the color resistances of the opening regions 41 of different products 2 are different, so that different products 2 have different color gamuts, and meanwhile, the color resistances of the non-opening regions 42 of different products 2 are the same, so that it is beneficial for different products 2 to form via holes 43 with the same aperture in the non-opening regions 42, thereby improving the quality of the display panel 1, and further solving the compatibility problem of producing products 2 with multiple color gamuts in the same photomask. Therefore, the manufacturing method of the display panel 1 provided by the embodiment of the application can utilize the same photomask to realize the manufacturing of a plurality of products 2 with different color gamuts, and the quality of the plurality of products 2 can be kept consistent.

Referring to fig. 6 and 7, fig. 6 is a flowchart of exposing the color-resist layer in fig. 1; FIG. 7 is a schematic diagram of the open area and the non-open area of FIG. 6 exposed to different products. In this embodiment, the color-resistant layers include a first color-resistant layer and a second color-resistant layer, wherein the first color-resistant layer and the second color-resistant layer correspond to products 2 with different color gamuts, i.e. the first color-resistant layer corresponds to the first products 21, and the second color-resistant layer corresponds to the second products 22. The step S40 specifically includes steps S401 and S402.

S401, exposing the first non-opening area 421 of the first color resist layer and the second non-opening area 422 of the second color resist layer with a first illumination intensity L1.

In this embodiment, the second color resist layer and the first color resist layer are the same-polarity photoresist, so that the first non-opening area 421 of the first color resist layer and the second non-opening area 422 of the second color resist layer are exposed by using the first illumination intensity L1, so that the thickness of the first color resist layer 44 obtained after exposure of the first color resist layer in the first non-opening area 421 is equal to the thickness of the second color resist layer 45 obtained after exposure of the second color resist layer in the second non-opening area 422.

Optionally, the first color resist layer and the second color resist layer are both negative photoresist or both positive photoresist.

S402, exposing the second opening area 412 of the second color resist layer with the second illumination intensity L2, and exposing the first opening area 411 of the first color resist layer with the third illumination intensity L3.

In this embodiment, the second illumination intensity L2 is different from the third illumination intensity L3, so that the thickness of the second color resist layer 45 obtained after exposure of the second color resist layer in the second opening area 412 is different from the thickness of the first color resist layer 44 obtained after exposure of the first color resist layer in the first opening area 411, so that the color gamut of the product 2 obtained by correspondence of the first color resist layer is different from the color gamut of the product 2 obtained by correspondence of the second color resist layer.

Referring to fig. 7, 8 and 9, fig. 8 is a flowchart of fig. 6 for controlling the second illumination intensity and the third illumination intensity; fig. 9 is a flow chart of forming a via in fig. 1. In this embodiment, when the first color resist layer and the second color resist layer are negative resists, the step S40 further includes a step S411, and the step S50 further includes a step S501.

S411, controlling the third illumination intensity L3 to be larger than the second illumination intensity L2.

In this embodiment, since the first color resist layer and the second color resist layer are negative resists, the thickness of the first color resist layer 44 obtained by exposing the first color resist layer to light of the third light intensity L3 is greater than the thickness of the second color resist layer 45 obtained by exposing the second color resist layer to light of the second light intensity L2 in the opening 41.

S501, exposing a part of the first non-opening area 421 with the fourth light intensity L4 to form a first via 431, and exposing a part of the second non-opening area 422 with the fourth light intensity L4 to form a second via 432.

In the present embodiment, since the fourth light intensity L4 is smaller than the first light intensity L1, the first via 431 and the second via 432 having the same aperture can be formed by exposing the first non-opening area 421 and the second non-opening area 422 with the fourth light intensity L4, respectively, and a part of the second conductive layer 30 is exposed.

Referring to fig. 10, fig. 10 is a flowchart illustrating a control of the first illumination intensity according to an embodiment of fig. 6. In the present embodiment, the step S40 further includes a step S421.

S421, controlling the first illumination intensity L1 to be equal to the third illumination intensity L3, or controlling the first illumination intensity L1 to be equal to the second illumination intensity L2.

In the present embodiment, the first illumination intensity L1 is controlled to be equal to the second illumination intensity L2 or the third illumination intensity L3, and thus, the types of illumination intensities required for manufacturing the display panel 1 can be reduced, thereby reducing manufacturing costs and time. When the first illumination intensity L1 is equal to the second illumination intensity L2, the second color resist layer 45 has the same thickness in the second opening area 412 and the second non-opening area 422. When the first illumination intensity L1 is equal to the third illumination intensity L3, the thickness of the first color resist layer 44 in the first opening area 411 and the first non-opening area 421 is the same.

Referring to fig. 7, 11, 12 and 13, fig. 11 is a schematic diagram illustrating a relationship between color resist thickness and illumination intensity in an embodiment of the present application; FIG. 12 is a flowchart of another embodiment of FIG. 6 for controlling the first illumination intensity; fig. 13 is a flowchart of the fourth illumination intensity control in fig. 1. In the present embodiment, the step S40 further includes a step S431, and the step S50 further includes a step S511.

S431, controlling the first illumination intensity L1 to be 100% illumination intensity.

In this embodiment, fig. 11 shows that the color resist thickness remains unchanged after the illumination intensity exceeds a certain value, and it can be understood that the color resist thickness is in a saturated state. Therefore, after the first illumination intensity L1 is controlled to be 100% of the illumination intensity, the thickness of the first color resist layer in the first non-opening area 421 is the same as the thickness of the second color resist layer in the second non-opening area 422, and the thickness is stable, so that it is beneficial to keep the aperture size of the subsequently generated via hole stable, so that the variation of the via hole 43 is smaller, and the panel quality is improved. In addition, the 100% illumination intensity is easy to control, and the preparation process is simpler.

S511, controlling the fourth illumination intensity L4 to be 0% illumination intensity.

In the present embodiment, the first via 431 and the second via 432 are formed in the first non-opening area 421 and the second non-opening area 422 with the illumination intensity of 0%, respectively, so that the aperture sizes of the first via 431 and the second via 432 can be stabilized. In addition, the illumination intensity of 0% can be realized by completing shielding, and the preparation process is easy to control, so that the preparation is simpler.

Referring to fig. 11 and 14, fig. 14 is a flowchart illustrating a control of the first illumination intensity according to another embodiment of fig. 6. In the present embodiment, the step S40 further includes a step S441.

S441, the first illumination intensity L1 is controlled to be greater than or equal to an illumination intensity threshold Lm.

In the present embodiment, it can be seen from fig. 11 that the color resist thickness remains unchanged when the illumination intensity exceeds the illumination intensity threshold Lm. That is, the illumination intensity greater than the illumination intensity threshold Lm is the same as the illumination intensity threshold Lm, and the thickness generated in the area where the first color resist layer and the second color resist layer are irradiated is stable, so that the thickness of the first color resist layer 44 in the first non-opening area 421 is the same as the thickness of the second color resist layer 45 in the second non-opening area 422, which is favorable for keeping the aperture size of the subsequently generated via hole stable, thereby making the variation of the via hole 43 smaller and further improving the uniformity of the panel quality.

For example, the first product 21 is a 32-inch panel and the first color gamut is 75%, the second product 22 is a 24-inch panel and the second color gamut is 65%. In the related art, the exposure intensity Lx adopted by the first non-opening area 421 of the first product 21 is greater than the illumination intensity threshold Lm, and is in a saturated state, so that the color resistance thickness of the first product 21 in the first non-opening area 421 is stable, and therefore, the aperture of the first via 431 generated subsequently is stable. The exposure intensity Ly adopted by the second non-opening area 422 of the second product 22 is smaller than the illumination intensity threshold Lm, and is located in a position where the color resistance thickness changes greatly with the illumination intensity in fig. 11, that is, the exposure intensity Ly changes slightly, which also causes a relatively obvious change in the color resistance thickness at the second non-opening area 422, so that the aperture of the second via hole 432 that is subsequently generated is unstable, and the uniformity problem exists in the second via holes 432 at different positions, thereby causing a decrease in the quality uniformity of the panel. Compared with the related art, in the method for manufacturing the display panel 1 provided in the embodiment of the present application, the first illumination intensity L1 is controlled to simultaneously expose the first non-opening area 421 and the second non-opening area 422, and the first illumination intensity L1 is greater than the illumination threshold, so that the color resistance thickness at the first non-opening area 421 and the color resistance thickness at the second non-opening area 422 are in the same shape and are in the saturated state, and therefore, the aperture of the second via hole 432 at the second non-opening area 422 is stable, which can improve the problem of the uniformity of the panel quality.

Referring to fig. 3 and 15, fig. 15 is a flowchart of preparing the master spacer of fig. 1. In the present embodiment, steps S70 and S80 are further included after step S40.

S70, setting spacer germ layers on the color resistance layer 40.

And S80, performing exposure and development on the spacer layer by adopting a fifth irradiation intensity to form a plurality of main spacers 50 with the same thickness, wherein the main spacers 50 are positioned in the non-opening area 42.

In this embodiment, since the thicknesses of the plurality of color resists 40 in the non-opening area 42 prepared in the step S40 are the same, the heights of the plurality of main spacers 50 in the non-opening area 42 can be the same in all the plurality of main spacers 50 in the display panel 1, so that the flatness of the display panel 1 is maintained.

Referring to fig. 3 and 16, fig. 16 is a flowchart of preparing the secondary master spacer in fig. 1. In the present embodiment, step S90 is further included after step S70.

And S90, performing exposure and development on the spacer layer by adopting a fifth illumination intensity to form a plurality of secondary spacers 60 with the same thickness, wherein the secondary spacers 60 have the same thickness as the primary spacers 50, and the secondary spacers 60 are positioned in the non-opening area 42 and/or the opening area 41.

In the present embodiment, the secondary spacers 60 are generated by exposing the same primary spacers 50 to a fifth light intensity that is the same as the first light intensity generated by the primary spacers 50, so that the thicknesses of the secondary spacers 60 and the primary spacers 50 are the same, and the exposure cost can be reduced by providing the secondary spacers 60.

Wherein the secondary spacer 60 is located at a lower level within the display panel 1 than the primary spacer 50 is located within the display panel 1. Specifically, the first color resist layer and the second color resist layer are both negative photoresist. In an embodiment, the first illumination intensity L1 is greater than the second illumination intensity L2 and greater than the third illumination intensity L3, the color resistance thickness of the non-opening area 42 is greater than the color resistance thickness of the opening area 41, and the secondary spacer 60 is located in the opening area 41. In another embodiment, the first illumination intensity L1 includes a first sub-illumination intensity and a second sub-illumination intensity, where the first sub-illumination intensity is used to expose a portion of the non-opening area 42, the second sub-illumination intensity is used to expose another portion of the non-opening area 42, the first sub-illumination intensity is greater than the second illumination intensity L2 and greater than the third illumination intensity L3 and greater than the second sub-illumination intensity, the color-resistance thickness of the portion of the non-opening area 42 exposed by the first sub-illumination intensity is greater than the color-resistance thickness of the opening area 41 and greater than the color-resistance thickness of the other portion of the non-opening area 42 exposed by the second sub-illumination intensity, the primary spacer 50 is located in the portion of the non-opening area 42 exposed by the first sub-illumination intensity, and the secondary spacer 60 is located in the opening area 41 and/or the other portion of the non-opening area 42 exposed by the second sub-illumination intensity.

Optionally, step S90 and step S80 may be performed simultaneously to save exposure cost.

Referring to fig. 3 and 17, fig. 17 is a flowchart of the multiple products obtained in fig. 1. In the present embodiment, steps S100 and S110 are further included after step S80.

S100, a second transparent substrate 70 is disposed on one side of the plurality of main spacers 50, wherein the second transparent substrate 70 abuts against the plurality of main spacers 50.

S110, cutting to obtain various products 2.

In this embodiment, the second transparent substrate 70 is disposed on a side of the plurality of main spacers 50 facing away from the first transparent substrate 10, and since the plurality of main spacers 50 have the same thickness and the same height in the display panel 1, the second transparent substrate 70 can simultaneously abut against the plurality of main spacers 50, so that the display panel 1 is entirely flat, and the panel quality is better. The second transparent substrate 70 is color filter Glass (Color Filter Glass, CF Glass), which is also called CF substrate. After the second transparent substrate 70 is disposed, the display panel 1 corresponding to the plurality of products 2 may be obtained by cutting according to the product design area of the plurality of products 2.

Referring to fig. 18, fig. 18 is a flowchart of preparing the first conductive layer and the second conductive layer in fig. 1. In the present embodiment, the step S60 includes a step S601 and a step S602.

S601, exposing the first germ layer on one side of the first transparent substrate 10 to light to obtain a first conductive layer 20 surrounded by a first insulating layer 80.

In this embodiment, the front projection of the main spacer 50 on the first transparent substrate 10 is at least partially located in the area where the first conductive layer 20 is located, so that the size of the non-opening area 42 is smaller, thereby improving the opening ratio, and further improving the light emitting effect of the display panel 1.

S602, disposing a second layer of germ on a side of the first insulating layer 80 facing away from the first transparent substrate 10, and exposing the second layer of germ to light to obtain a second conductive layer 30 surrounded by a second insulating layer 90.

In the present embodiment, the second conductive layer 30 is insulated from the first conductive layer 20, specifically, the second conductive layer 30 is insulated from the first conductive layer 20 by the second insulating layer 90 and the first insulating layer 80. Optionally, the first insulating layer 80 is a Gate Insulating (GI) layer and the second insulating layer 90 is a PV1 layer.

Referring to fig. 2 again, in the present embodiment, the display panel 1 is manufactured by the manufacturing method of the display panel provided in any one of the foregoing embodiments.

In this embodiment, the display panel 1 is a liquid crystal display panel, and is widely used in various liquid crystal display devices, such as a mobile phone, a tablet computer, a notebook computer, a palm computer, a personal computer (Personal Computer, PC), a personal digital assistant (Personal Digital Assistant, PDA), and the like.

In this embodiment, the display panel 1 corresponds to the product 2 prepared by the preparation method of the display panel 1 provided in the foregoing embodiment, that is, the display panels 1 with multiple different color gamuts can be prepared by using the same photomask through the preparation method of the display panel 1, and the quality of the display panels 1 with multiple different color gamuts can be kept consistent. Therefore, the manufacturing cost of the display panel 1 provided by the application is low, and the quality of the display panel 1 with a plurality of different color gamuts can be kept consistent.

While embodiments of the present application have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the present application, and that variations, modifications, alternatives and alterations of the above embodiments may be made by those skilled in the art within the scope of the present application, which are also to be regarded as being within the scope of the protection of the present application.

Claims

1. The preparation method of the display panel is characterized by comprising the following steps of:

providing a first transparent substrate;

forming color-resisting layers positioned on one side of the second conductive layer, wherein the color-resisting layers comprise first color-resisting layers and second color-resisting layers;

exposing the color resistance layers in different product design areas to obtain a plurality of color resistance layers, wherein the thicknesses of the different color resistance layers in the opening areas are different, and the thicknesses of the color resistance layers in the non-opening areas are the same; wherein, the color resist layer is located in different product design areas is exposed to obtain a plurality of color resist layers, wherein, different color resist layers are located in different thicknesses of the opening areas, are located in the same thickness of the non-opening areas, and include:

controlling the first illumination intensity to be larger than or equal to an illumination intensity threshold, wherein the illumination intensity larger than the illumination intensity threshold is equal to the thickness generated by the area irradiated by the first color resistance layer and the second color resistance layer compared with the illumination intensity threshold;

Exposing a second opening area of the second color-resistant layer with a second illumination intensity, and exposing a first opening area of the first color-resistant layer with a third illumination intensity, wherein the second illumination intensity is different from the third illumination intensity;

2. The method of claim 1, wherein when the first color resist layer and the second color resist layer are negative resists, exposing the color resist layers located in different product design areas to obtain a plurality of color resist layers, wherein the thicknesses of the different color resist layers in the opening areas are different, and the thicknesses of the color resist layers in the non-opening areas are the same, further comprising:

3. The method for manufacturing a display panel according to claim 2, wherein the exposing the color resist layers located in different product design areas to obtain a plurality of color resist layers, wherein different color resist layers have different thicknesses in the opening areas and the same thickness in the non-opening areas, further comprises:

4. The method for manufacturing a display panel according to claim 2, wherein the exposing the color resist layers located in different product design areas to obtain a plurality of color resist layers, wherein different color resist layers have different thicknesses in the opening areas and the same thickness in the non-opening areas, further comprises:

controlling the first illumination intensity to be 100% illumination intensity;

5. The method of claim 1, wherein exposing the color resist layers located in different product design areas to light to obtain a plurality of color resist layers, wherein different color resist layers have different thicknesses in the opening areas, and wherein after the thicknesses in the non-opening areas are the same, the method further comprises:

6. The method of claim 5, further comprising, after disposing the spacer layer on the color resist layer:

7. The method of claim 5, wherein exposing and developing the spacer layer with a fifth light intensity to form a plurality of main spacers having the same thickness, wherein the main spacers are located after the non-opening region, the method further comprises:

Cutting is performed to obtain various products.

8. The method for manufacturing a display panel according to claim 5, wherein a first conductive layer and a second conductive layer are formed on one side of the first transparent substrate to be insulated from each other, wherein the second conductive layer is away from the first transparent substrate compared to the first conductive layer, and comprises:

9. A display panel, characterized in that the display panel is manufactured by the manufacturing method of the display panel according to any one of claims 1-8.