CN115971668A - Method and system for precisely marking transparent material by frequency-locked single-pulse infrared ultrafast laser - Google Patents
Method and system for precisely marking transparent material by frequency-locked single-pulse infrared ultrafast laser Download PDFInfo
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- CN115971668A CN115971668A CN202111200127.4A CN202111200127A CN115971668A CN 115971668 A CN115971668 A CN 115971668A CN 202111200127 A CN202111200127 A CN 202111200127A CN 115971668 A CN115971668 A CN 115971668A
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Abstract
The invention provides a method and a system for precisely marking a transparent material by frequency-locked single-pulse infrared ultrafast laser, wherein the method comprises the following steps: 1) The method comprises the steps that an ultrafast laser capable of emitting high-energy single pulses at a high repetition frequency and high in single pulse energy consistency is arranged, wherein the frequency is 10KHz-200KHz, and the single pulse energy is 50uJ-1000uJ; 2) Locking the transmitting frequency to a fixed value; 3) Setting the laser wavelength to 1064 +/-5 nm; 4) The ultrafast laser is input to a galvanometer through a shaping optical path and a beam transmission optical path, and is focused on the surface or the inside of the transparent material after passing through a field lens; 5) And marking is finished under the control of a software and hardware controller. The marking method of the invention realizes marking by the processing surface of the ultrafast laser vaporization material with high monopulse energy, almost no heat affected zone appears, no auxiliary powder and other materials are needed, the marking content is fine and clear, and the strength of the base material is not changed.
Description
Technical Field
The invention relates to the technical field of laser marking, in particular to a method and a system for precisely marking a transparent material by single-pulse infrared ultrafast laser with uniform frequency locking energy.
Background
The laser marking technology can be used for marking transparent materials (such as glass, sapphire and the like), and can be widely applied to various fields of consumer electronics, automobiles, aerospace, buildings, home life and the like, so that the market demand space is wide and the development potential needs to be excavated.
At present, the transparent material laser marking technology mainly adopts a CO2 laser, a green nanosecond laser, an ultraviolet nanosecond laser or a marking machine based on an ultrafast fiber laser, and marking is realized by damaging the surface of a transparent material. The principle of the marking method is that the heat is applied to melting, and the appearance of a heat affected zone can cause slag adhering, cracking and edge chipping on a processing surface, so that the marking content is not clear, the material strength is weakened, and even a substrate becomes loose.
When the marking machine is used for marking based on the ultrafast fiber laser, the single pulse width is generally in the picosecond or hundreds of femtoseconds level. In order to meet the high-energy processing threshold of hard and brittle transparent materials such as glass, the average power of the materials needs to be improved, the repetition frequency of a working range from hundreds of KHz to 1MHz or even more than 1GHz is needed, and the over-fast frequency is matched with the working frequency range from tens of KHz to hundreds of KHz of a conventional galvanometer on the market, so that the conditions of missing points, missing marks and even mark time sequence disorder can be caused by mismatch. And in order to compensate the state of low energy of the single pulse, a pulse train output mode is often adopted under the same repetition frequency. Since the starting time of each pulse in the string has a sequence, the sequence is represented in the time domain, so that the specific marking position point on the surface of the workpiece material is influenced by the time sequence during marking, and the corresponding drift occurs in the space. Meanwhile, the energy of each single pulse in the string generally fluctuates greatly, so that the marking effect consistency on the surface of the workpiece material is poor, and the quality and the effect are reduced. When the glass is used as a hard and brittle transparent material, the glass is easy to darken or generate a discolored color center and a dark mark under the irradiation of a laser pulse string during marking, and even the characteristic parameters of the glass material are locally changed, so that a substrate becomes loose. After a number of pulse trains, the irradiated area becomes darker and finally a dark edge is formed around, which weakens the material strength.
Disclosure of Invention
In view of this, in order to overcome the defects of the prior art, the invention provides a method for precisely marking a transparent material by single-pulse infrared ultrafast laser with uniform frequency locking energy.
The invention relates to a method for precisely marking a transparent material by single-pulse infrared ultrafast laser with uniform frequency locking energy, which comprises the following steps:
1) The setting can send the ultrafast laser that high energy monopulse and monopulse energy uniformity are high under high repetition frequency, high repetition frequency is 10KHz-200KHz, high energy monopulse energy is 50uJ-1000uJ, monopulse energy uniformity is: the energy difference between single pulses is less than or equal to +/-5 percent;
2) Locking a certain value of the emission frequency between 10KHz and 200KHz;
3) Setting the laser wavelength to 1064 +/-5 nm;
4) Ultrafast laser emitted by the laser device is amplified in beam size through a shaping light path, is input into a galvanometer through a beam transmission light path, and is focused on the surface or the inside of a transparent material workpiece on a workpiece bearing table after passing through an F-theta field lens;
5) Setting laser parameters and processing parameters under the control of a software and hardware controller; controlling the vibrating mirror and laser emission to complete the laser marking of the marking pattern on the surface or inside of the transparent material.
The frequency-locking uniform energy single pulse is characterized in that the laser working mode is the periodic output of the uniform energy single pulse under the locking frequency.
The laser is an all-solid-state picosecond laser.
The single pulse width is 1-10ps.
The laser window light spot is 1-3mm, and the divergence angle is 0.5-1.5 mrad.
The shaping light path is a beam expanding light path with the magnification of 1-8 times.
The light beam transmission light path is composed of transmission light paths with transmission distances of 10-1000 mm.
The working frequency of the galvanometer is 10k-400k, and the size of the lens of the galvanometer is 5-30mm.
The field lens is an F-theta field lens or a telecentric field lens, and the focal length is 30-300mm.
The minimum resolution feature size for forming the marked pattern microstructure is 1-30um.
The invention also provides a marking system for realizing the method for precisely marking the transparent material, the system comprises an ultrafast laser, a shaping light path, a light beam transmission light path, a focusing lens, a workpiece bearing table and a controller,
the ultrafast laser can emit high-energy single pulses under high repetition frequency, the single pulse energy consistency is high, the high repetition frequency is 10KHz-200KHz, the high-energy single pulse energy is 50uJ-1000uJ, and the single pulse energy consistency is less than or equal to +/-5%; locking a certain value of the transmitting frequency between 10KHz and 200KHz; setting the laser wavelength to 1064 +/-5 nm;
the focusing lens comprises a scanning galvanometer for controlling the deflection of the laser beam and a field lens for focusing the laser beam;
the workpiece bearing table is fixed on a six-axis motion system, and the six-axis motion system comprises a linear motor unit for controlling the workpiece bearing table to translate in the X, Y and Z directions and a rotary platform unit in the Rx, ry and Rz directions;
the laser is connected with a computer controller provided with laser marking system software through a data line, the computer controller inputs controlled laser power, scanning speed and repetition frequency signals to the laser, receives pulse synchronous signals of the laser, and controls a light path, a galvanometer, a field lens and a six-axis motion system to finish marking.
And an optical gate is arranged between the shaping optical path and the light beam transmission optical path, and the opening and closing of the optical gate are controlled by a controller.
The method can be used for the precise marking on the surface and the inside of a transparent material, in particular on the surface or the inside of glass, crystal or acrylic.
The invention has the beneficial effects that:
1. the ultrafast laser marking method based on locking high repetition frequency, single-pulse working, high single-pulse energy and high single-pulse energy consistency can be used for precise marking on the surface or inside of transparent materials such as glass, crystal, acrylic and the like, and can meet wide and various requirements.
2. The method realizes marking by the ultrafast laser vaporization material processing surface with high single pulse energy, but not by the action of melting by heat, so that the method hardly has the phenomena of a heat affected zone, and the processing surface hardly has slag adhering, cracks, edge breakage and the like. The invention does not need auxiliary powder and other materials, the marking content is fine and clear, and the material strength is almost unchanged.
3. The high-energy single pulse output by the marking method is unique in time domain, the specific position point of the workpiece material processing surface is very accurate in marking, the workpiece material processing surface cannot drift in space, and the marking quality is very good.
4. The marking method has the advantages of short processing time, almost no missing points or marks and accurate time sequence matching.
5. Under the irradiation of the ultrafast laser equipment with high single pulse energy consistency, the consistency of the optical processing process is good, the surfaces of transparent materials such as glass and the like are clear and bright, repeated irradiation is not carried out, the materials are hardly darkened, and the characteristic parameters of the materials are hardly changed.
Description of the drawings:
FIG. 1 is a schematic structural diagram of a system for precisely marking a transparent material by single-pulse infrared ultrafast laser with uniform frequency locking energy according to the present invention;
wherein: 1. an ultrafast laser; 2. an optical path; 2-1, shaping the light path; 2-2. Light beam transmission optical path; 3. a galvanometer; 4. a field lens; 5. marking a workpiece 6, a workpiece bearing table 7, a controller 8 and a reflector;
FIG. 2 is a photograph showing the effect of the method of the present invention on the precise marking of the "tiger head" pattern on the glass surface;
FIG. 3 is a photograph showing the effect of the "three-dimensional user-type pattern" precise marking of the pattern inside the glass by the single-pulse infrared ultrafast laser marking method with uniform energy and frequency locking according to the present invention;
FIG. 4 is a photograph showing the effect of the single-pulse infrared ultrafast laser marking method with uniform energy and frequency locking on the glass upper hole array;
FIG. 5 is a photograph showing the effect of the single-pulse infrared ultrafast laser marking method with uniform energy and frequency locking on the micro-pore array precision marking on the glass;
wherein: 5A, precisely marking the appearance of the micropore array on the glass, and 5B, magnifying the visual field by 100 times under a microscope;
FIG. 6 is a photograph showing the effect of the method of the present invention on the precise marking of the two-dimension code pattern inside the crystal;
wherein: 6A, a picture of the front of the crystal block; 6B, a picture of the side surface of the crystal block; 6C, a picture of the back of the crystal block; and 6D, a picture of the top surface of the crystal block.
Detailed Description
The invention provides a frequency-locking uniform energy single-pulse infrared ultrafast device by combining the attached drawings and the specific embodiment
The laser glass precision marking method and system are further explained and the present invention is not limited to the following examples.
The invention relates to a frequency-locking uniform-energy single-pulse infrared ultrafast laser precision marking method, which comprises the following steps of:
1) An ultrafast laser capable of emitting high-energy single pulses under high repetition frequency and high single pulse energy consistency is arranged, the high repetition frequency is 10KHz-200KHz, the high-energy single pulse energy is 50uJ-1000uJ, and the single pulse energy consistency is less than or equal to +/-5%;
2) Locking a certain value of the emission frequency between 10KHz and 200KHz;
3) Setting the laser wavelength to 1064 +/-5 nm;
4) Ultrafast laser emitted by the laser device is amplified in beam size through a shaping light path, is input into a galvanometer through a beam transmission light path, and is focused on the surface or the inside of a transparent material on a workpiece bearing table after passing through a field lens;
5) Setting laser parameters and processing parameters under the control of a software and hardware controller; controlling the vibrating mirror and laser emission to complete the laser marking of the marking pattern on the surface or inside of the transparent material.
The single pulse width is 1-10ps.
The laser window has light spot of 1-3mm and divergence angle of 0.5-1.5 mrad.
The shaping light path is a beam expanding light path with the magnification of 1-8 times.
The light beam transmission light path is composed of transmission light paths with transmission distances of 10-1000 mm.
The working frequency of the galvanometer is 10k-400k, and the size of the lens of the galvanometer is 5-30mm.
The field lens is an F-theta field lens or a telecentric field lens, and the focal length is 30-300mm.
The minimum resolution feature size for forming the micro-structures of the marked pattern is 1-30um.
Step 5) comprises the following steps:
1. setting laser emission parameters and a laser pulse synchronous signal in a level form, and sending the laser pulse synchronous signal and the starting time T1 to a software and hardware controller to serve as processing reference time;
2. debugging the laser beam: the light beam passes through a light beam transmission, an optical shutter and a shaping light path, wherein the optical shutter is controlled by TTL level; the software and hardware controller sends a signal for controlling the opening and closing of the optical shutter and a starting time T2 to the optical shutter;
3. debugging a galvanometer: the software and hardware controller sends a control signal in a 5V high-low level form of the galvanometer and the starting time T3 to the galvanometer,
4. and debugging the laser beam, focusing the laser beam near the workpiece bearing table through the field lens, and working within the effective range of the field lens.
5. And tightly fixing the workpiece bearing table on a six-axis motion system, and fixing the target workpiece on the workpiece bearing table. The position and the boundary of the workpiece bearing table are precisely adjusted, and the moving path is calibrated. And adjusting laser to focus near the workpiece, acting on the workpiece to be marked, and waiting for processing.
6. The software and hardware controller is controlled in a manual or automatic mode of input and output through a computer, a single chip microcomputer, an ARM or a mobile phone.
7. And decomposing the content to be marked by a software and hardware controller to obtain pixels, diameters, filling density, routing paths and graphs in a readable format, wherein the boundary range of the routing paths and the graphs is limited by the area boundary not larger than the laser marking machine.
8. According to the content and the sequence of the slicing graph, a laser synchronous signal is input to a software and hardware controller to serve as a time reference, the coordinate of a calibration workpiece bearing table serves as a space reference, and the software and hardware controller sequentially transmits a control signal, a time reference, delay time and a control signal time sequence to a galvanometer, an optical gate and a six-axis motion system to carry out overall time sequence calibration and preliminary proofing.
9. And verifying the degree of coincidence with the preset effect according to the preliminary proofing effect, fine-tuning the process and parameters of each part if the difference exists, locking the parameters until the effect is optimal, and starting marking.
The invention also provides a marking system for realizing the method for precisely marking the transparent material, which comprises an ultrafast laser 1, a shaping optical path 2-1, a light beam transmission optical path 2-2, focusing lenses 3 and 4, a workpiece bearing table 6 and a controller 7,
the ultrafast laser 1 can emit high-energy single pulses under high repetition frequency, the single pulse energy consistency is high, the high repetition frequency is 10KHz-200KHz, the high-energy single pulse energy is 50uJ-1000uJ, and the single pulse energy consistency is less than or equal to +/-5%; locking a certain value of the emission frequency between 10KHz and 200KHz; setting the laser wavelength to 1064 +/-5 nm;
wherein the beam transmission is accomplished by the mirror 8;
the focusing lens comprises a scanning galvanometer 3 for controlling the deflection of the laser beam and a field lens 4 for focusing the laser beam;
the workpiece bearing table 6 is fixed on a six-axis motion system, and the six-axis motion system comprises a linear motor unit for controlling the workpiece bearing table to translate in the X, Y and Z directions and a rotary platform unit in the Rx, ry and Rz directions;
the ultrafast laser 1 is connected with a computer controller 7 provided with laser marking system software through a data line, the computer inputs controlled laser power, scanning speed and repetition frequency signals into the laser 1, receives pulse synchronous signals of the laser, and controls the light path 2, the galvanometer 3, the field lens 4 and the transparent material workpiece 5 on the six-axis motion system to finish marking. As shown in fig. 1.
And an optical gate is arranged between the shaping optical path and the light beam transmission optical path, and the opening and closing of the optical gate are controlled by a controller.
Example 1: precision marking of 'tiger head' pattern on glass surface
The laser 1 is connected with a computer provided with laser marking system software through a data line, the computer inputs controlled laser power, scanning speed and repetition frequency signals into the laser, and the laser is an all-solid-state picosecond laser. The controller 7 receives a pulse synchronization signal of the laser, and controls the optical path 2, the galvanometer 3, the field lens 4 and the six-axis motion system to complete marking.
The locking transmitting frequency is 50KHz; the single pulse energy was 50uJ. The single pulse width is 10ps.
The laser 1 has a window spot of 2mm and a divergence angle of 1.0 mrad.
The shaping optical path 2-1 is a beam expanding optical path with 5 times of magnification.
The light beam transmission light path 2-2 is composed of transmission light paths with the transmission distance of 500 mm.
The working frequency of the galvanometer is 10k, and the size of the lens of the galvanometer is 18mm.
The field lens is an F-theta field lens, and the focal length is 50mm.
The minimum resolution feature size to form the marked pattern microstructure is 4um.
Marking with the laser:
(1) Importing an image to be marked into a computer;
(2) Reading an image to be marked through laser marking system software installed on a computer, and setting laser output power, galvanometer working frequency and laser repetition frequency;
(3) And (3) turning on the laser, scanning by the laser motion control system according to an image signal output by the computer, and marking the high-energy laser beam on the working surface by transmitting the transparent material 5.
The marking effect is shown in fig. 2.
Example 2: precision marking method for 'three-dimensional house figure' pattern in glass
Substantially the same as in example 1, except that,
the locking transmitting frequency is 10KHz; the single pulse energy was 1000uJ. The single pulse width is 1ps.
The laser 1 has a window spot of 3mm and a divergence angle of 1.5 mrad.
The shaping optical path 2-1 is a beam expanding optical path with the magnification of 8 times.
The light beam transmission light path 2-2 is composed of transmission light paths with the transmission distance of 1000 mm.
The working frequency of the galvanometer 3 is 50k, and the size of the lens of the galvanometer is 30mm.
The field lens 4 is an F-theta field lens with a focal length of 300mm.
The minimum resolution feature size to form the marked pattern microstructure is 2um.
The marking effect is shown in fig. 3.
Example 3: marking of hole arrays on glass
Substantially the same as in example 1, except that,
locking the transmitting frequency to 200KHz; the single pulse energy was 300uJ. The single pulse width is 10ps.
The laser 1 has a window spot of 1mm and a divergence angle of 0.5 mrad.
The shaping optical path 2-1 is a beam expanding optical path with the magnification of 1 time.
The light beam transmission light path 2-2 is composed of transmission light paths with the transmission distance of 100 mm.
The working frequency of the galvanometer 3 is 200k, and the size of the lens of the galvanometer is 5mm.
The field lens 4 is a telecentric field lens with a focal length of 30mm.
The minimum resolution feature size to form the marked pattern microstructure is 8um.
The marking effect is shown in fig. 4.
Example 4: precision marking of micro-pore arrays on glass
Substantially the same as in example 1, except that,
the locking transmitting frequency is 150KHz; the single pulse energy was 150uJ. The single pulse width is 10ps.
The laser 1 window spot was 1.5mm with a divergence angle of 1.0 mrad.
The shaping optical path 2-1 is a beam expanding optical path with the magnification of 8 times.
The light beam transmission light path 2-2 is composed of transmission light paths with the transmission distance of 500 mm.
The working frequency of the galvanometer 3 is 100k, and the size of the lens of the galvanometer is 20mm.
The field lens 4 is a telecentric field lens with a focal length of 30mm.
The minimum resolution feature size to form the marked pattern microstructure is 1um.
The marking effect is shown in fig. 5.
Example 5: precision marking of two-dimensional code pattern in crystal
Substantially the same as in example 1, except that,
the locking transmitting frequency is 100KHz; the single pulse energy was 100uJ. The single pulse width was 8ps.
The laser 1 window spot was 2mm with a divergence angle of 1.0 mrad.
The shaping optical path 2-1 is a beam expanding optical path with the magnification of 4 times.
The light beam transmission light path 2-2 is composed of a transmission light path with a transmission distance of 300mm.
The working frequency of the galvanometer 3 is 400k, and the size of the lens of the galvanometer is 20mm.
The field lens 4 is an F-theta field lens with a focal length of 200mm.
The minimum resolution feature size to form the marked pattern microstructure is 15um.
The marking effect is shown in fig. 6.
Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art can make modifications and equivalents to the embodiments of the present invention without departing from the spirit and scope of the present invention, which is set forth in the claims of the present application.
Claims (10)
1. A method for precisely marking a transparent material by single-pulse infrared ultrafast laser with uniform frequency locking energy is characterized by comprising the following steps:
1) The method comprises the steps of setting an ultrafast laser which can emit high-energy single pulses under high repetition frequency and has high single pulse energy consistency, wherein the high repetition frequency is 10KHz-200KHz, the high-energy single pulse energy is 50uJ-1000uJ, and the single pulse energy consistency is less than or equal to +/-5%;
2) Locking a certain value of the transmitting frequency between 10KHz and 200KHz;
3) Setting the laser wavelength to 1064 +/-5 nm;
4) Ultrafast laser emitted by the laser device is amplified in beam size through a shaping light path, is input into a galvanometer through a beam transmission light path, and is focused on the surface or the inside of a transparent material workpiece on a workpiece bearing table after passing through a field lens;
5) Setting laser parameters and processing parameters under the control of a software and hardware controller; controlling the vibrating mirror and laser emission to complete the laser marking of the patterns on the surface or inside the transparent material.
2. The method for ultrafast laser precision marking of transparent material as claimed in claim 1, wherein said laser is an all solid state picosecond laser.
3. The method for ultrafast laser precision marking of transparent material as claimed in claim 1, wherein the single pulse width is 1-10ps.
4. The method for ultrafast laser precision marking of transparent material as claimed in claim 1, wherein the laser window spot is 1-3mm and the divergence angle is 0.5-1.5 mrad.
5. The method for ultrafast laser precision marking of transparent material as claimed in claim 1, wherein the shaping optical path is a beam expanding optical path with a magnification of 1-8 times.
6. The method for ultrafast laser precision marking of transparent materials as claimed in claim 1, wherein the light beam transmission optical path is composed of transmission optical paths with transmission distance of 10-1000 mm.
7. The method for ultrafast laser precision marking of transparent material as claimed in claim 1, wherein the working frequency of the galvanometer is 10k-400k, and the lens size of the galvanometer is 5-30mm.
8. The method for ultrafast laser precision marking of transparent material as claimed in claim 1, wherein the field lens is an F-theta field lens or a telecentric field lens, and the focal length is 30-300mm.
9. The method for ultrafast laser precision marking of transparent material as claimed in claim 1, wherein the minimum resolution feature size of the micro-structures of the marking pattern is formed to be 1-30um.
10. Marking system for carrying out the method for precision marking of transparent materials according to claim 1, characterized in that it comprises an ultrafast laser, a shaping optical path and a beam transmission optical path, a focusing lens, a work piece carrier and a controller,
the ultrafast laser can emit high-energy single pulses under high repetition frequency, the single pulse energy consistency is high, the high repetition frequency is 10KHz-200KHz, the high-energy single pulse energy is 50uJ-1000uJ, and the single pulse energy consistency is less than or equal to +/-5%; locking a certain value of the transmitting frequency between 10KHz and 200KHz; setting the laser wavelength to 1064 +/-5 nm;
the focusing lens comprises a scanning galvanometer for controlling the deflection of the laser beam and a field lens for focusing the laser beam;
the workpiece bearing table is fixed on a six-axis motion system, and the six-axis motion system comprises a linear motor unit for controlling the workpiece bearing table to translate in the X, Y and Z directions and a rotary platform unit in the Rx, ry and Rz directions;
the laser is connected with a computer controller provided with laser marking system software through a data line, the computer controller inputs controlled laser power, scanning speed and repetition frequency signals into the laser, receives pulse synchronization signals of the laser, and controls a light path, a galvanometer, a field lens and a six-axis motion system to finish marking.
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