CN115968160A - Heat dissipation system of movable equipment and movable equipment - Google Patents
Heat dissipation system of movable equipment and movable equipment Download PDFInfo
- Publication number
- CN115968160A CN115968160A CN202111191512.7A CN202111191512A CN115968160A CN 115968160 A CN115968160 A CN 115968160A CN 202111191512 A CN202111191512 A CN 202111191512A CN 115968160 A CN115968160 A CN 115968160A
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- heat
- circuit module
- heat exchanger
- mobile device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60H—ARRANGEMENTS OF HEATING, COOLING, VENTILATING OR OTHER AIR-TREATING DEVICES SPECIALLY ADAPTED FOR PASSENGER OR GOODS SPACES OF VEHICLES
- B60H1/00—Heating, cooling or ventilating [HVAC] devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60K—ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES; ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS IN VEHICLES; AUXILIARY DRIVES FOR VEHICLES; INSTRUMENTATION OR DASHBOARDS FOR VEHICLES; ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GAS EXHAUST OR FUEL SUPPLY OF PROPULSION UNITS IN VEHICLES
- B60K11/00—Arrangement in connection with cooling of propulsion units
- B60K11/02—Arrangement in connection with cooling of propulsion units with liquid cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/61—Types of temperature control
- H01M10/613—Cooling or keeping cold
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/61—Types of temperature control
- H01M10/615—Heating or keeping warm
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Thermal Sciences (AREA)
- Transportation (AREA)
- Combustion & Propulsion (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The application provides a heat dissipation system of a movable device and the movable device, so that heat dissipation performance of a circuit module of the movable device is improved, and heat dissipation cost is reduced. The mobile device includes circuit module, first heat exchanger and first circulating pump, wherein: the circuit module comprises a shell and a circuit board assembly arranged in the shell, and the shell is provided with a liquid inlet and a liquid outlet; the first heat exchanger comprises a first port and a second port, and the first port is connected with the liquid inlet; the inlet of the first circulating pump is connected with the liquid outlet, and the outlet of the first circulating pump is connected with the second port; the first circulating pump, the first heat exchanger and the circuit module form a first circulating loop, cooling oil is arranged in the first circulating loop, and the circuit board assembly is immersed in the cooling oil.
Description
Technical Field
The application relates to the technical field of heat dissipation, in particular to a heat dissipation system of a movable device and the movable device.
Background
In recent years, environmental pollution and energy shortage accelerate the development and utilization of green renewable energy, and electric automobiles become research hotspots in the automobile industry due to the advantages of low pollution, low noise, high energy efficiency and the like. The electric vehicle is provided with a plurality of high-power circuit modules, such as an automatic driving module, an Electronic Control Unit (ECU), and the like, which generate a large amount of heat during operation, and the heat needs to be dissipated in time in order to ensure that the performance of the circuit modules is not affected.
At present, a heat dissipation mode to high-power circuit module adopts cold drawing and water-cooling radiator to dispel the heat, and accessible gel realizes heat conduction contact between the components and parts of cold drawing and circuit module, and water-cooling radiator sets up in one side that the cold drawing deviates from circuit module, and the heat that circuit module produced passes through gel and transmits for the cold drawing, and then transmits to water-cooling radiator by the cold drawing and gives off. By adopting the heat dissipation mode, the structure of the cold plate is complex, and different components of the circuit module need to be respectively dispensed, so that the processing cost is high. In addition, in practical application, the cold plate can only realize heat conduction contact with part of components on the circuit module, so that other components which are not in contact with the cold plate are difficult to dissipate heat.
Disclosure of Invention
The application provides a heat dissipation system of a movable device and the movable device, which are used for improving the heat dissipation performance of a circuit module of the movable device and reducing the heat dissipation cost.
In a first aspect, the present application provides a mobile device that may include a circuit module, a first heat exchanger, and a first circulation pump. Wherein, circuit module can include casing and circuit board assembly, and the casing is provided with inlet and liquid outlet, and circuit board assembly can set up in the casing. The first heat exchanger may comprise a first port and a second port, the first port being connectable to an inlet port of the circuit module. An inlet of the first circulating pump may be connected to a liquid outlet of the circuit module, and an outlet of the first circulating pump may be connected to a second port of the first heat exchanger. Therefore, the first circulating pump, the first heat exchanger and the circuit module can be connected to form a first circulating loop, cooling oil is arranged in the first circulating loop, and the circuit board assembly can be immersed in the cooling oil of the shell.
In the above scheme, when the first circulating pump drives the cooling oil to circularly flow in the first circulating loop, the cooling oil circulates to the first heat exchanger after absorbing heat generated by the circuit board assembly in the circuit module, and returns to the circuit module again to dissipate heat of the circuit board assembly after heat exchange and temperature reduction in the first heat exchanger, so that primary circulation is completed. Because the circuit board assembly can be immersed in the cooling oil, the cooling oil can be used for radiating all heating components on the circuit board assembly, and compared with a radiating mode of a water-cooling radiator, the radiating performance of the circuit module can be improved, and the radiating cost can be reduced.
The movable device may be a vehicle, a ship, an airplane, or the like, for example.
In some possible embodiments, the mobile device may further include a transmission system, and the transmission system has a first heat dissipation path therein, and the first heat dissipation path may be connected to the first circulation circuit, so that heat generated during operation of the transmission system may also be carried into the first heat exchanger by the circulating cooling oil to be dissipated, that is, the circuit module and the transmission system may share the same heat exchanger to dissipate heat, thereby facilitating simplification of the heat dissipation structure of the vehicle.
Because the operating temperature of the transmission system is relatively high, if the first heat dissipation path of the transmission system is disposed at the upstream of the circuit module, the high temperature of the transmission system may have a bad influence on the components of the circuit module. Therefore, when the circuit module is specifically arranged, the first heat dissipation passage can be connected between the liquid outlet of the circuit module and the inlet of the first circulating pump, so that the adverse effect on the circuit module can be reduced on the premise of realizing heat dissipation of the transmission system.
In some possible embodiments, the first heat exchanger may include a first flow passage and a second flow passage, the first flow passage and the second flow passage are isolated from each other and may perform heat exchange, and the first port and the second port may be two ports of the first flow passage. The movable equipment can also comprise a second circulating pump and a second heat exchanger, and the second circulating pump, the second heat exchanger and a second flow channel of the first heat exchanger can be sequentially connected to form a second circulating loop. By adopting the design, the high-temperature cooling oil in the first flow channel can exchange heat with the refrigerant in the second flow channel to realize cooling, the refrigerant in the second flow channel circulates to the second heat exchanger after absorbing the heat of the cooling oil in the first flow channel, and returns to the second flow channel again after exchanging heat and cooling in the second heat exchanger so as to continuously dissipate the heat of the cooling oil in the first flow channel.
For example, the refrigerant in the second circulation circuit may be cooling water, and the second heat exchanger may be an air-cooled heat exchanger.
In some possible embodiments, the mobile device may further include a power system, and the power system may have a second heat dissipation path, and the second heat dissipation path may be connected to the second circulation loop, so that heat generated during operation of the power system may also be carried into the second heat exchanger by a circulating refrigerant to be dissipated, that is, the second flow channel and the power system may share the same heat exchanger to dissipate heat, thereby facilitating simplification of a heat dissipation structure of the vehicle.
The working temperature of the power system is relatively high, and if the second heat dissipation passage of the power system is arranged at the upstream of the second flow passage, the refrigerant entering the second flow passage is too high, so that the heat dissipation effect of the second flow passage on the first flow passage is influenced, and further, the adverse effect on components of the circuit module is generated. Based on this, when specifically setting up, the second heat dissipation route can be connected between second runner and second circulating pump, can reduce the harmful effects to the circuit module under the prerequisite of the heat dissipation of realization to driving system like this.
In some other possible embodiments, the mobile device may further include a battery, the battery may have a third heat dissipation path, and the third heat dissipation path may be connected to the second circulation loop, so that heat generated by the battery during operation may also be carried into the second heat exchanger by a circulating refrigerant to be dissipated, and the second flow channel and the battery may share the second heat exchanger to dissipate heat, thereby facilitating simplification of a heat dissipation structure of the vehicle.
Similarly, when specifically arranged, the third heat dissipation passage can be connected between the second flow channel and the second circulation pump, so that adverse effects on the circuit module can be reduced on the premise of realizing heat dissipation of the battery.
In some possible embodiments, the first heat exchanger may also be an air-cooled heat exchanger, and at this time, the heat dissipation of the cooling oil can be realized by using the characteristics of the air-cooled heat exchanger without arranging a second circulation loop, so that the heat dissipation structure of the mobile device is simplified.
In some possible embodiments, the circuit board assembly may include a main board and a buckle plate, the buckle plate may be disposed on one side of the main board, the buckle plate and the main board are spaced apart from each other, and the buckle plate may cover a part of components on the main board. Because the circuit board assembly can be immersed in the cooling oil, all heating components on the main board and the pinch plate, including partial components covered by the pinch plate, can realize heat dissipation, thereby improving the heat dissipation effect on the circuit module.
In some possible embodiments, the circuit module may be a computing module of the removable device, or alternatively, the circuit module may be an electronic control unit of the removable device.
In a second aspect, the present application further provides a circuit module, which is mountable on a mobile device, and includes a housing and a circuit board assembly disposed in the housing, wherein the housing can be provided with a liquid inlet and a liquid outlet. The circuit module can be connected in the cooling system of the movable equipment, when the circuit module is specifically arranged, the liquid inlet can be connected with a first port of a first heat exchanger of the cooling system, the liquid outlet can be connected with an inlet of a first circulating pump of the cooling system, an outlet of the first circulating pump can be connected with a second port of the first heat exchanger, and therefore the first circulating pump, the first heat exchanger and the circuit module can be connected to form a first circulating loop, cooling oil is arranged in the first circulating loop, and the circuit board assembly can be immersed in the cooling oil of the shell.
In the scheme, the circuit board assembly can be immersed in the cooling oil, so that the cooling oil can dissipate heat of all heating components on the circuit board assembly, and compared with a heat dissipation mode of a water-cooling radiator, the heat dissipation performance of the circuit module can be improved, and the heat dissipation cost can be reduced.
In a third aspect, the present application further provides a mobile device that may include the heat dissipation system of any of the possible embodiments of the first aspect. The mobile device may be a vehicle, a ship, an airplane, or the like. The circuit board assembly of the circuit module of the mobile equipment can be immersed in the cooling oil to realize heat dissipation, and the heat dissipation effect is good, so that the use reliability of the mobile equipment is also improved.
Drawings
Fig. 1 is a schematic structural diagram of a mobile device according to an embodiment of the present application;
fig. 2 is a schematic partial structure diagram of a circuit module according to an embodiment of the present disclosure;
fig. 3 is a schematic structural diagram of a possible heat dissipation loop for a circuit module;
fig. 4 is a schematic structural diagram of a heat dissipation loop of a mobile device according to an embodiment of the present disclosure;
fig. 5 is a schematic structural diagram of another heat dissipation circuit of the mobile device according to the embodiment of the present disclosure;
fig. 6 is a schematic structural diagram of another heat dissipation loop of a mobile device according to an embodiment of the present disclosure;
fig. 7 is a schematic structural diagram of another heat dissipation loop of a mobile device according to an embodiment of the present application;
fig. 8 is a schematic structural diagram of another heat dissipation circuit of a mobile device according to an embodiment of the present disclosure.
Reference numerals are as follows:
1-a mobile device; 100-a power system; 200-a transmission system; 300-a wheel; 400-a battery; 500-a circuit module;
510-a circuit board assembly; 511-main board; 512-buckle plate; 5111. 5121-electronic components; 5112-interface; 610-a water pump;
62-a heat exchanger; 630-a water-cooled heat exchanger; 640-a cold plate; 710-a first heat exchanger; 720-a first circulation pump; 501-a liquid inlet;
502-a liquid outlet; 711 — first flow channel; 712-a second flow channel; 730-a second circulation pump; 740 — a second heat exchanger;
741. 713-a fan; 210 — a first heat dissipation path; 110 — a second heat dissipation path; 410-third heat dissipation path.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more clear, the present application will be further described in detail with reference to the accompanying drawings.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a mobile device according to an embodiment of the present disclosure. In the embodiment of the present application, the movable apparatus 1 may be a vehicle such as a vehicle, a ship, or an airplane, or other equipment with a carrying function, which is not limited in the present application. The mobile device 1 of the embodiment shown in fig. 1 is illustrated by way of example as a vehicle. It should be noted that the reference numerals of the following vehicle are the same as those of the movable apparatus. The vehicle 1 may include a power system 100, a transmission system 200 and wheels 300, wherein the power system 100 may be in transmission connection with the wheels 300 through the transmission system 200, so as to provide driving force to the wheels 300 through the conventional system 200 to drive the vehicle to run.
In some embodiments, the vehicle 1 may be a fuel-oil automobile, in this case, the power system 100 may specifically be an engine, the transmission system 200 may include a speed reducer, a transmission, and a transmission shaft, and the driving force output by the engine may be transmitted to the speed reducer, transmitted to the transmission after being subjected to speed reduction and torque multiplication by the speed reducer, and then output to the wheels 300 through the transmission shaft after being subjected to speed change by the transmission according to the gear setting of the vehicle 1, so as to drive the vehicle 1 to run. It should be noted that fig. 1 and the following related drawings only schematically show some components included in the movable apparatus 1, and the actual shape, the actual size, the actual position and the actual configuration of the components are not limited by fig. 1 and the following drawings.
In other embodiments, the vehicle 1 may also be an electric vehicle, in this case, the power system 100 may specifically be a motor, the transmission system 200 may include a speed reducer, a transmission shaft, and the like, and a driving force output by the motor may be transmitted to the speed reducer, and output to the wheels 300 after the speed reducer performs a speed reduction and torque increase function, so as to drive the vehicle 1 to run. When the vehicle 1 is an electric vehicle, the vehicle 1 may further include a battery 400, and the battery 400 may be used as a power source of the vehicle 1 to provide electric energy for the motor, so that the motor converts the electric energy into driving force to output.
In addition, the vehicle 1 is usually provided with a high-power circuit module such as an ECU, and the ECU can be used for monitoring various driving information of the vehicle 1 to determine the driving state of the vehicle 1 and the intention of a driver, and operate the vehicle 1 through a relevant actuator. In particular, for the intelligent driving vehicle 1, some calculation modules provided on the vehicle 1, such as the automatic driving module, also belong to the high-power circuit module. The automatic driving module can be used for planning the driving path of the vehicle, collecting and processing data acquired by various sensors, generating a real-time sensing result and making a specific behavior decision. For example, the vehicle 1 may be controlled to make a lane change, a passing, or a braking, etc., according to other vehicles, pedestrians, obstacles, etc., on the road, and traffic regulation information.
Referring to fig. 2, fig. 2 is a schematic partial structure diagram of a circuit module according to an embodiment of the present disclosure. The circuit module 500 may include a housing (not shown) and a circuit board assembly 510 received within the housing. The circuit board assembly 510 may include a main board 511, a plurality of electronic components 5111 disposed on the main board 511, and various interfaces 5112, where the interfaces 5112 may be used to connect with various sensors disposed on the vehicle to transmit the detection data of the sensors to the main board 511. In addition, in order to flexibly expand the computing power, the circuit board assembly 510 may further include a clip 512, wherein the clip 512 is disposed on one side of the main board 511, and the two clips are spaced apart from each other. The buckle plate 512 may also be provided with a plurality of electronic components 5121, and taking the circuit module 500 as an automatic driving module as an example, the electronic components 5121 provided on the buckle plate 512 may include a power supply, an Artificial Intelligence (AI) chip, a laser radar, a millimeter wave radar, an ultrasonic sensor, and the like. In specific implementation, the main board 511 and the buckle plate 512 can be electrically connected through a connector, so that data transmission between the electronic component 5121 on the buckle plate 512 and the electronic component 5111 on the main board 511 is realized. In order to fully utilize the space on the main board 511, the area of the main board 511 facing the clip plate 512 may be used for placing the electronic component 5111, that is, when the clip plate 512 is placed on the main board 511, a part of the electronic component 5111 on the main board 511 is covered.
It can be understood that the high-power circuit module 500 generates a large amount of heat during operation, and if the heat cannot be dissipated in time, the heat will be continuously accumulated in the circuit module 500, thereby generating adverse effects on various components on the circuit module 500, and the long-time poor heat dissipation can even cause the components to be damaged, thereby affecting the normal operation of the circuit module 500.
Fig. 3 is a schematic structural diagram of a possible heat dissipation loop for a circuit module. Referring to fig. 3, the heat dissipation circuit includes a water pump 610, a heat exchanger 620, and a water-cooled heat sink 630, which are connected in sequence, wherein the water-cooled heat sink 630 is disposed at the circuit module 500 and is in heat-conducting contact with the circuit module 500 through a cold plate 640. The water pump 610 drives cooling water to circulate in the heat dissipation loop, the cooling water enters the water-cooling radiator 630 and then exchanges heat with the circuit module 500, the cooling water after heat exchange and temperature rise is driven into the heat exchanger 620, cooling is achieved through heat exchange with outside fresh air, the cooling water after cooling enters the water-cooling radiator 630 again, and circulation is completed. The disadvantage of this heat dissipation method is that many boss structures need to be arranged at positions on the cold plate 640 corresponding to the components of the circuit module 500, and each boss structure is in heat-conducting contact with the corresponding component through gel, which results in an excessively complex structure of the cold plate 640, and the dispensing process is also tedious, which increases the manufacturing and installation costs of the cold plate 640. In addition, in practical application, the cold plate 640 cannot be in heat-conducting contact with all the components on the circuit module 500, for example, the components located between the main board and the pinch plate cannot contact the cold plate 640 due to the blocking of the pinch plate, so that the heat dissipation problem of the components which cannot contact the cold plate 640 still exists.
In view of this, the mobile device provided in the present application adopts an oil-cooling heat dissipation manner for the high-power circuit module 500, and the circuit module 500 is immersed in the cooling oil, so as to achieve effective heat dissipation of all components on the circuit module 500, which not only can improve the heat dissipation performance of the circuit module 500, but also can reduce the heat dissipation cost of the circuit module 500 because the cold plate 640 and the water-cooling heat sink 630 with higher cost do not need to be disposed.
Fig. 4 is a schematic structural diagram of a heat dissipation loop of a mobile device according to an embodiment of the present disclosure. Referring to fig. 4, the mobile equipment may further include a first heat exchanger 710 and a first circulation pump 720, and the first circulation pump 720, the first heat exchanger 710, and the circuit module 500 are sequentially connected through a pipe. When the circuit module 500 is specifically arranged, the housing of the circuit module has a liquid inlet 501 and a liquid outlet 502, and the liquid inlet 501 and the liquid outlet 502 can respectively communicate the inside and the outside of the housing. The first heat exchanger 710 may include a first port a and a second port B, the first port a may be connected to the inlet 501 of the housing, the second port B may be connected to the outlet of the first circulation pump 720, and the inlet of the first circulation pump 720 is connected to the outlet 502 of the housing. In this way, the first circulation pump 720, the first heat exchanger 710 and the circuit module 500 form a heat dissipation circulation loop, which can be referred to as a first circulation loop. Cooling oil is provided within the first circulation loop, and circuit board assemblies may be immersed within the cooling oil within the housing of the circuit module 500. The cooling oil is exemplified by an oil medium having no electrical conductivity but capable of conducting heat, such as vegetable oil or mineral oil.
In the present embodiment, the connection between the two components may be understood as a direct connection between the two components, or may be understood as an indirect connection between the two components via another component, as long as the cooling oil can flow between the two components, and the present invention is not limited to this. For example, for the above-mentioned inlet of the first circulation pump 720 being connected to the liquid outlet 502 of the housing, in practical applications, the inlet of the first circulation pump 720 and the liquid outlet 502 of the housing may be directly connected through a pipeline, or another component may be disposed between the inlet of the first circulation pump 720 and the liquid outlet 502 of the housing, and at this time, the component may be disposed on the pipeline between the inlet of the first circulation pump 720 and the liquid outlet 502 of the housing, that is, the inlet of the first circulation pump 720 is connected to the liquid outlet 502 of the housing through the component.
First circulation circuit during operation, first circulating pump 720 drive cooling oil circulation flow in the return circuit, the heat transfer with circuit board assembly behind the low-temperature cooling oil entering circuit module 500's the casing, the temperature risees behind the heat that circuit board assembly produced is absorbed to the cooling oil, and circuit board assembly then realizes the cooling through giving the cooling oil with the heat transfer. The cooling oil after rising the temperature is driven to first heat exchanger 710 by first circulating pump 720, gets back to circuit module 500 again after the heat transfer cooling in first heat exchanger 710 and carries out the heat transfer with circuit board subassembly, so reciprocating cycle can realize the lasting heat dissipation to circuit module 500. In this embodiment, since the circuit board assembly can be completely immersed in the cooling oil, the cooling oil can dissipate heat of all the heat generating components on the circuit board assembly, which not only can improve the heat dissipation performance of the circuit module 500, but also can reduce the heat dissipation cost of the circuit module 500 because no cold plate and a water-cooling heat sink with higher cost are required.
It should be understood that, in order to avoid the cooling oil in the housing from leaking out of the liquid inlet and the liquid outlet, other parts of the housing are sealed except for the liquid inlet and the liquid outlet, so that when the circuit board assembly is disposed in the housing, the circuit board assembly can only contact the cooling oil entering the housing, and both the liquid inlet 501 and the liquid outlet 502 of the housing can be connected with the pipeline through the sealing members. In addition, when the circuit module 500 is implemented, the housing may be made of a metal material with good thermal conductivity, such as aluminum, copper, and the like, so that part of the heat in the housing may be dissipated to the external environment through the housing, thereby improving the heat dissipation efficiency of the circuit module 500.
In addition, when the housing is designed in a sealing manner, the circuit board assembly in the housing is not affected by the external environment of the housing, and the mounting position of the circuit module 500 on the mobile device can be more flexible and convenient. Taking a movable device as an example of a vehicle, when the circuit module 500 is installed, the circuit module 500 may be located in a relatively clean and tidy cockpit or a front cabin with relatively poor air quality. Compared with the scheme that the circuit module 500 can only be arranged in the cockpit in the prior art, the circuit module 500 can be arranged at a proper position according to actual requirements in the embodiment, so that the space in the cockpit is saved, and the riding comfort of a user is improved.
With continued reference to fig. 4, in some embodiments, the first heat exchanger 710 may be a two-channel heat exchanger, that is, the first heat exchanger 710 may include a first channel 711 and a second channel 712, and the first channel 711 and the second channel 712 are isolated from each other and may exchange heat. Exemplarily, the first heat exchanger 710 may specifically be a plate heat exchanger. The first port a and the second port B may be two ports of the first flow path 711. At this time, the mobile equipment may further include a second circulation pump 730 and a second heat exchanger 740, and the second circulation pump 730, the second heat exchanger 740, and the second flow channel 712 of the first heat exchanger 710 may be sequentially connected to form a second circulation loop. By adopting the design, the first circulating pump 720 drives the high-temperature cooling oil flowing out of the circuit module 500 to enter the first flow channel 711, in the first heat exchanger 710, the high-temperature cooling oil in the first flow channel 711 can exchange heat with the refrigerant in the second flow channel 712 to realize cooling, the refrigerant in the second flow channel 712 is driven to the second heat exchanger 740 by the second circulating pump 730 after absorbing the heat of the high-temperature cooling oil in the first flow channel 711, and returns to the second flow channel 712 after being cooled in the second heat exchanger 740, so as to continuously dissipate the heat of the cooling oil in the first flow channel 711, and ensure the normal operation of the first circulating loop.
The refrigerant in the second circulation circuit may be cooling water. The second heat exchanger 740 may be an air-cooled heat exchanger, and after the high-temperature cooling water enters the second heat exchanger 740, the high-temperature cooling water exchanges heat with air flowing through the surface of the second heat exchanger 740 to achieve cooling. In addition, a fan 741 may be disposed at the second heat exchanger 740, so that the flow rate of air flowing across the surface of the second heat exchanger 740 may be increased, and the heat exchange efficiency of the second heat exchanger 740 may be improved.
Fig. 5 is a schematic structural diagram of another heat dissipation loop of a mobile device according to an embodiment of the present disclosure. Referring to fig. 5, the transmission system 200 of the mobile device may have a first heat dissipation path 210, and when the first heat dissipation path 210 is specifically designed, the first heat dissipation path 210 may be connected to the first circulation circuit through a pipeline, so that the cooling oil may absorb heat generated by the operation of the transmission system 200 when passing through the first heat dissipation path 210, and bring the heat into the first heat exchanger 710 to dissipate, thereby achieving heat dissipation of the transmission system 200. That is to say, in the embodiment of the present application, the heat dissipation paths of the circuit module 500 and the transmission system 200 may be located in the same heat dissipation loop, and the heat generated by the two can be dissipated through the same heat exchanger, which not only simplifies the overall heat dissipation structure of the mobile device, but also reduces the heat dissipation cost. For example, the first heat dissipation path 210 and the circuit module 500 may be disposed between the first port a of the first heat exchanger 710 and the inlet of the first circulation pump 720, that is, both heat-dissipated parts in the first circulation loop are located upstream of the first circulation pump 720, so as to improve the circulation efficiency of the cooling oil in the first circulation loop.
It should be noted that some gear structures are often arranged in the transmission system 200, and cooling oil is introduced into the transmission system 200, so that not only can the transmission system 200 be cooled, but also the lubrication effect on the gear structures can be realized, and the reliable operation of the transmission system can be ensured.
In addition, compared to the circuit module 500, the operating temperature of the transmission system 200 is higher, and because the transmission system 200 mainly includes mechanical components and has a higher temperature-resistant level, and the circuit module 500 includes electronic components and has a relatively lower temperature-resistant level, if the first heat dissipation path 210 of the transmission system 200 is disposed upstream of the circuit module 500, that is, between the liquid inlet 501 of the circuit module 500 and the first heat exchanger 710, the temperature of the low-temperature cooling oil passing through the first heat dissipation path 210 is greatly increased, and then the low-temperature cooling oil enters the circuit module 500, and adverse effects may be generated on the components of the circuit module 500. In view of this, in an embodiment of the present application, the first heat dissipation path 210 may be connected between the liquid outlet 502 of the circuit module 500 and the first circulation pump 720, that is, the first heat dissipation path 210 may be disposed at the downstream of the circuit module 500, so that even if the cooling oil generates a small temperature rise in the circuit module 500, the subsequent heat dissipation of the transmission system 200 is not greatly affected, and the reliability of the circuit module 500 may be improved on the premise of achieving effective heat dissipation of the transmission system 200.
Fig. 6 is a schematic structural diagram of another heat dissipation circuit of the mobile device according to the embodiment of the present application. Referring to fig. 6, the power system 100 of the mobile device may have a second heat dissipation path 110, and when the mobile device is specifically designed, the second heat dissipation path 110 may be connected to the second circulation loop through a pipeline, so that the refrigerant may absorb heat generated by the operation of the power system 100 when passing through the second heat dissipation path, and bring the heat into the second heat exchanger 740 to be dissipated, thereby implementing heat dissipation of the power system 100. That is to say, in the embodiment of the present application, the second flow channel 712 for implementing heat dissipation to the first circulation loop and the heat dissipation path of the power system 100 may be located in the same heat dissipation loop, and heat generated by the circuit module 500 and the transmission system 200 is transferred to the second flow channel 712 through the first flow channel 711, and is dissipated through the second heat exchanger 740 together with heat generated by the power system 100, so that not only the heat dissipation structure of the whole mobile device may be simplified, but also the heat dissipation cost may be reduced. For example, the second heat dissipation path 110 and the circuit module 500 may be disposed between the first port a of the first heat exchanger 710 and the inlet of the first circulation pump 720, that is, both heat-dissipated parts in the first circulation loop are located upstream of the first circulation pump 720, so as to improve the circulation efficiency of the cooling oil in the first circulation loop.
Since the operating temperature of the power system 100 is higher than the operating temperature of the circuit module 500, if the second heat dissipation path 110 of the power system 100 is disposed upstream of the second flow channel 712, that is, between the second flow channel 712 and the second heat exchanger 740, the temperature of the low-temperature refrigerant is greatly increased when the low-temperature refrigerant passes through the second heat dissipation path 110, and then the low-temperature refrigerant enters the second flow channel 712, so that the cooling effect on the cooling oil in the first flow channel 711 is limited, even the temperature is higher than the temperature of the cooling oil in the first flow channel 711, and thus the cooling oil flowing out of the first flow channel 711 enters the circuit module 500 again, which may have adverse effects on components of the circuit module 500. Therefore, in the specific design, the second heat dissipation path 110 may be connected between the second flow channel 712 and the second circulation pump 730, that is, the second heat dissipation path 110 may be disposed at the downstream of the second flow channel 712, so that even if the refrigerant generates a small temperature rise after heat exchange in the first heat exchanger 710, the heat dissipation of the subsequent power system 100 is not greatly affected, and thus the reliability of the circuit module 500 may be improved on the premise of effectively dissipating heat of the power system 100.
Fig. 7 is a schematic structural diagram of another heat dissipation circuit of a mobile device according to an embodiment of the present disclosure. Referring to fig. 7, when the mobile device is an electric vehicle, the battery 400 of the mobile device may have a third heat dissipation path 410, and when the mobile device is specifically designed, the third heat dissipation path 410 may be connected to the second circulation loop through a pipeline, so that the refrigerant may absorb heat generated by the battery 400 during operation when passing through the third heat dissipation path 410, and bring the heat into the second heat exchanger 740 to be dissipated, thereby implementing heat dissipation of the power system 100. That is to say, in the embodiment of the present application, the second flow channel 712 for implementing heat dissipation of the first circulation loop and the heat dissipation path of the battery 400 may be located in the same heat dissipation loop, and the heat generated by the circuit module 500 and the transmission system 200 is transferred to the second flow channel 712 through the first flow channel 711 and is dissipated through the second heat exchanger 740 together with the heat generated by the battery 400, so that not only the heat dissipation structure of the whole mobile device can be simplified, but also the heat dissipation cost can be reduced.
Similarly, if the third heat dissipation path 410 of the battery 400 is disposed at the upstream of the second flow channel 712, the temperature of the low-temperature cooling medium will be greatly increased when the low-temperature cooling medium passes through the third heat dissipation path 410, and then the low-temperature cooling medium enters the second flow channel 712, so that the cooling effect on the cooling oil in the first flow channel 711 is limited, and thus the cooling oil flowing out from the first flow channel 711 enters the circuit module 500 again, which may have an adverse effect on the components of the circuit module 500. Therefore, in the present embodiment, the third heat dissipation path 410 may be specifically connected between the second flow channel 712 and the second circulation pump 730, that is, downstream of the second flow channel 712, so that even if a small temperature rise occurs after the refrigerant exchanges heat in the first heat exchanger 710, the heat dissipation of the subsequent battery 400 is not greatly affected, and thus the reliability of the circuit module 500 may be improved on the premise of effectively dissipating heat of the battery 400.
Fig. 8 is a schematic structural diagram of another heat dissipation circuit of the mobile device according to the embodiment of the present application. Referring to fig. 8, in this embodiment, the first heat exchanger 710 may also be an air-cooled heat exchanger, at this time, after the high-temperature cooling oil flowing out from the circuit module 500 enters the first heat exchanger 710, the high-temperature cooling oil may directly exchange heat with air flowing through the surface of the first heat exchanger 710 to achieve cooling, and the cooled cooling oil enters the circuit module 500 again to dissipate heat of the circuit board assembly. By adopting the design, a second circulation loop does not need to be arranged, and the heat dissipation of the cooling oil can be realized by utilizing the self characteristic of the air-cooled heat exchanger, so that the whole heat dissipation structure of the movable equipment is simplified. In specific implementation, the first heat exchanger 710 may further include a fan 713, so as to increase a flow rate of air flowing across a surface of the first heat exchanger 710, and further increase a heat exchange efficiency of the first heat exchanger 710.
It can be understood that, when the first heat exchanger 710 is an air-cooled heat exchanger, the first heat dissipation path 210 of the transmission system 200 may also be connected to the first circulation loop, so that heat generated by the circuit module 500 and the transmission system 200 may be dissipated through the same heat exchanger, thereby simplifying the overall heat dissipation structure of the mobile device and reducing the heat dissipation cost. The position of the first heat dissipation path 210 in the first circulation loop can refer to the description of the foregoing embodiments, and will not be described in detail herein.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (13)
1. The utility model provides a cooling system of mobile device which characterized in that, includes circuit module, first heat exchanger and first circulating pump, wherein:
the circuit module comprises a shell and a circuit board assembly arranged in the shell, and the shell is provided with a liquid inlet and a liquid outlet;
the first heat exchanger comprises a first port and a second port, and the first port is connected with the liquid inlet;
the inlet of the first circulating pump is connected with the liquid outlet, and the outlet of the first circulating pump is connected with the second port;
the first circulating pump, the first heat exchanger and the circuit module form a first circulating loop, cooling oil is arranged in the first circulating loop, and the circuit board assembly is immersed in the cooling oil.
2. The heat dissipation system of a mobile device of claim 1, further comprising an actuator system having a first heat dissipation path, the first heat dissipation path connected in the first circulation loop.
3. The heat dissipation system of claim 2, wherein the first heat dissipation path is connected between the liquid outlet and an inlet of the first circulation pump.
4. The heat dissipation system of any one of claims 1-3, wherein the first heat exchanger comprises a first flow passage and a second flow passage, the first flow passage is isolated from the second flow passage and can exchange heat, and the first port and the second port are two ports of the first flow passage respectively;
the movable equipment further comprises a second circulating pump and a second heat exchanger, and the second circulating pump, the second heat exchanger and the second flow channel are sequentially connected to form a second circulating loop.
5. The heat dissipation system of a mobile device of claim 4, further comprising a power system having a second heat dissipation path, the second heat dissipation path connected in the second circulation loop.
6. The heat dissipation system of the mobile device of claim 5, wherein the second heat dissipation path is connected between the second flow channel and the second circulation pump.
7. The heat dissipation system of a mobile device according to claim 4, wherein the mobile device further comprises a battery having a third heat dissipation path, the third heat dissipation path being connected in the second circulation loop.
8. The heat dissipation system of the mobile device of claim 7, wherein the third heat dissipation path is connected between the second flow channel and the second circulation pump.
9. The heat dissipation system of the mobile device of any one of claims 1-3, wherein the first heat exchanger is an air-cooled heat exchanger.
10. The heat dissipation system of any one of claims 1 to 9, wherein the circuit board assembly comprises a main board and a pinch plate, the pinch plate is disposed on one surface of the main board, the pinch plate and the main board are spaced apart from each other, and the pinch plate can cover a part of components on the main board.
11. The heat dissipating system of the mobile device as claimed in any one of claims 1 to 10, wherein the housing is made of metal.
12. The heat dissipation system of the removable device according to any one of claims 1 to 11, wherein the circuit module is a computing module of the removable device; alternatively, the circuit module is an electronic control unit of the mobile device.
13. A mobile device comprising a heat dissipation system as claimed in any one of claims 1 to 12.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111191512.7A CN115968160A (en) | 2021-10-13 | 2021-10-13 | Heat dissipation system of movable equipment and movable equipment |
| PCT/CN2022/106790 WO2023060974A1 (en) | 2021-10-13 | 2022-07-20 | Heat dissipation system of mobile device and mobile device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111191512.7A CN115968160A (en) | 2021-10-13 | 2021-10-13 | Heat dissipation system of movable equipment and movable equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115968160A true CN115968160A (en) | 2023-04-14 |
Family
ID=85894928
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111191512.7A Pending CN115968160A (en) | 2021-10-13 | 2021-10-13 | Heat dissipation system of movable equipment and movable equipment |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN115968160A (en) |
| WO (1) | WO2023060974A1 (en) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009036317A (en) * | 2007-08-02 | 2009-02-19 | Aisin Aw Co Ltd | Control unit cooling device for automatic transmission |
| US9160214B2 (en) * | 2010-11-12 | 2015-10-13 | Kawasaki Jukogyo Kabushiki Kaisha | Cooling structure for electric vehicle |
| CN106314066B (en) * | 2015-06-17 | 2020-01-31 | 杭州三花研究院有限公司 | vehicle energy management system and control method thereof |
| CN106385787A (en) * | 2016-11-16 | 2017-02-08 | 河北广通电子科技有限公司 | Immersion type electronic product and electronic equipment heat radiation system |
| CN107394072B (en) * | 2017-06-23 | 2020-01-24 | 北京机械设备研究所 | Thermal management system of power battery and hybrid electric vehicle |
| CN108539327B (en) * | 2018-05-25 | 2020-10-09 | 上海汽车集团股份有限公司 | Power battery liquid heating system based on liquid cooling system and control method thereof |
| CN209184624U (en) * | 2019-01-31 | 2019-07-30 | 深圳市融创飞宇通讯有限公司 | A kind of sealed large-power optical fiber interchanger |
| CN211844078U (en) * | 2019-11-25 | 2020-11-03 | 中国第一汽车股份有限公司 | Hybrid electric vehicle thermal management system and hybrid electric vehicle |
-
2021
- 2021-10-13 CN CN202111191512.7A patent/CN115968160A/en active Pending
-
2022
- 2022-07-20 WO PCT/CN2022/106790 patent/WO2023060974A1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023060974A1 (en) | 2023-04-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH1122460A (en) | Cooling system of hybrid electric automobile | |
| CN111997730B (en) | Engineering vehicle complete machine thermal management system and articulated dump truck | |
| CN213472754U (en) | Thermal management system and vehicle | |
| JP2022549478A (en) | Vehicle temperature control system | |
| CN213291917U (en) | Motor electronic control waste heat utilization device and electric automobile | |
| US20230301028A1 (en) | Heat Dissipation Apparatus and Vehicle | |
| CN212671923U (en) | High-efficient thoughtlessly moves engine cooling system | |
| CN212671925U (en) | High-efficient thoughtlessly moves engine cooling system | |
| CN110273746B (en) | Parallel type cooling system for vehicle and operation method thereof | |
| CN115968160A (en) | Heat dissipation system of movable equipment and movable equipment | |
| CN111963293A (en) | High-efficient thoughtlessly moves engine cooling system | |
| CN217598337U (en) | Integrated oil-cooling electric drive system | |
| CN210068300U (en) | Parallel type cooling system for vehicle | |
| CN212612705U (en) | Electronic bull-dozer cooling system and electronic bull-dozer | |
| CN214647452U (en) | Electronic bull-dozer thermal management system and electronic bull-dozer | |
| CN105172577A (en) | Cooling system applied to hybrid truck | |
| CN113969820A (en) | Engine intelligent thermal management system with ambient temperature monitoring function | |
| CN219181944U (en) | Liquid cooling heat abstractor, liquid cooling heat dissipation system and vehicle | |
| CN219553741U (en) | Power battery temperature management device and vehicle | |
| CN220894829U (en) | Edge computing device shell with gas-liquid dual-channel heat dissipation function | |
| CN113097602B (en) | Thermal management system and heating method of battery pack | |
| CN113580906B (en) | Low-temperature cooling system of hybrid electric vehicle and hybrid electric vehicle | |
| CN212113955U (en) | Thermal management system for power battery of electric automobile | |
| CN111907292B (en) | Electric automobile heat management system and control method thereof | |
| CN112060865A (en) | Thermal management system of electric automobile |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |