CN1159654A

CN1159654A - Membrane and method for forming convex parts of plasma display and the plasma display made by said method

Info

Publication number: CN1159654A
Application number: CN96121343A
Authority: CN
Inventors: 池田顺治; 船越康友; 松永浩二; 关原敏伸
Original assignee: Matsushita Electric Industrial Co Ltd
Current assignee: Panasonic Holdings Corp
Priority date: 1995-11-29
Filing date: 1996-11-29
Publication date: 1997-09-17
Also published as: KR970030010A; JPH09213214A; KR100228723B1; SG69993A1; TW329502B

Abstract

The invention relates to a method of forming plasma display partition wall, the partition wall is formed on liner bottom of rear side of plasma display, the method is characterized in that: a mixture containing resin component at least containing glass powder, organic high polymer bond, photo-reaction initiator and photo-reaction accelerant forms a membrane-shaped substance and the obtained insulation photosensitive resin film is arranged on the liner bottom at rear side, the film is exposed, the mast develop of the required graphic is utilized so that the protrusions of the expected partition wall are formed, by the method, the components in the film are at solid state and are not liquefied.

Description

The film of formation convex parts of plasma display and method and the plasma scope made from this method

The present invention relates to a kind of film and the method for this projection of formation and plasma scope made from this method that on the substrate of colour plasma display, forms jut.

In recent years, in office automation and video and Audiotechnica field, growing to requiring of showing of colored large scale plane.Color plasma display panels (hereinafter referred to as colored POP) meets the technology of this requirement just.

Colored POP comprises a front glass substrate (front panel), rear glass substrate (rear side panel) and a spaced walls that is arranged between two substrates, thus form a large amount of junior units.Reverse side at these substrates corresponds respectively to junior unit formation electrode, and they become mutual square crossing to arrange.It doesn't matter is to exchange or the DC charging type for the spaced walls that is provided with.Have the space between two substrates of spaced walls by restriction, can guarantee suitable discharging gap, simultaneously, the cross (talk) between adjacent junior unit can be avoided again.Usually, the spaced walls of AC type color PDP manufactures band shape, and the spaced walls of DC type color PDP manufactures matrix type.Between spaced walls, the phosphor layer of three kinds of color R.G.B and with inert gas sealing wherein is set.In this color PDP, by apply voltage between the electrode corresponding to picture intelligence, the gas in the junior unit of expectation is subjected to discharge process, makes phosphor layer luminous, and chromatic image is revealed thus.

Such color PDP is made in the following manner.At first, make front side board and back side panel by make various types of juts on glass substrate, wherein various types of juts are as electrode, spaced walls or other parts.Two plates face one another and sealing around, then inert gas are injected wherein.Assemble control loop and base plate at last, finish the making of color PDP.

Under the situation of DC type, make back side panel, it is the bus that forms electrode and connection electrode by the screen printing process on substrate.Then form the resistance of connecting bus and electrode.On the resistance that forms, impose glass paste by screen printing process, thereby form insulating barrier.In these insulating barriers, form some holes, make negative electrode be exposed to the negative electrode shaped portion of insulating barrier.By screen printing process metal slurry is filled into and forms negative electrode in the hole.Along with the formation of negative electrode, around negative electrode, form the spaced walls of rectangular by repeatedly screen printing process or sandblast process.At last, by utilizing screen printing process and sandblast process, be spaced apart the space formation fluorescent material layer that wall surrounds.

In the situation of AC type, addressing electrode is formed on the glass substrate by screen printing process, and after electrode forms, on electrode, impose glass paste to form insulating barrier by screen printing process, and then, make the electrode that in a row forms promptly be capped by screen printing process formation strip spaced walls.At last, between spaced walls, form fluorescent material layer by screen printing process.

As mentioned above, in the manufacture process of color PDP, as resistance, the conductor circuit of juts such as electrode and bus, or be formed on the substrate by screen printing process as the insulation system of the jut of spaced walls.Yet when forming conductor circuit by screen printing process, the composition in the printing ink can change owing to the variation with the printing-ink time, makes electric property such as resistance value can change to some extent at different positions.In addition, when forming insulator structure by screen printing process, mechanical performance such as intensity and contraction factor etc. change to some extent at different parts.

One object of the present invention is to provide a kind of film that forms projection, a kind of method of film formation convex parts of plasma display and plasma scope made from this method of utilizing is provided, in this method, jut is even as much as possible, avoids time dependent composition to change.

When implementing above and other purpose according to a first aspect of the invention, a kind of film that forms projection on substrate is provided, this film is to make by forming a kind of resins in film form goods, this mixture comprises glass dust, organic polymer adhesive at least, photoreaction initator, photoreaction accelerator etc.

According to a second aspect of the invention, provide a kind of on substrate, form projection, as the film of first aspect definition, wherein, substrate is a kind of glass substrate that is used to plasma scope.

According to a third aspect of the invention we, provide a kind of on substrate, form projection, as the film of first aspect definition, wherein resin compound comprises that also electricity leads powder.In this case, can avoid the variation of conductor circuit aspect electric property.

According to a forth aspect of the invention, provide a kind of on substrate, form projection, as the film of second aspect definition, wherein resin compound comprises that also electricity leads powder.

According to a fifth aspect of the invention, provide a kind of on substrate, form projection, as the film of second aspect definition, wherein the spaced walls of plasma scope is formed by module, film is a kind of insulating photosensitive resin film that forms spaced walls, be a kind of at least by comprising plumbous system or the powder of zinc glass frit and the filler of boron oxide or silicon dioxide, and the composite material of a kind of resin Composition that comprises crosslinked organic polymer adhesive, photoreaction initator, photoreaction accelerator or the like, and mixture formed sheet on the film of separating.

According to a sixth aspect of the invention, provide a kind of as the film second aspect definition, that on substrate, form projection, wherein the electrode of plasma scope is formed by module, film is a kind of photosensitive resin conducting film that will form electrode, be a kind of that form by glass dust, a kind of conductive metal powder, a kind of resin Composition, photoreaction initator, photoreaction accelerator mixt of forming by silver powder that comprises crosslinked organic polymer adhesive at least, and will mix on the film of separation, form the material of sheet.

According to seventh aspect present invention, provide a kind of as film second aspect definition, that on substrate, form projection, wherein the insulating barrier of plasma scope is made of module, and film is a kind of insulating photosensitive resin film, be a kind of at least by the powder and boron oxide or the silica-filled thing that comprise plumbous system or zinc glass frit, comprise the resin composition of crosslinked organic polymer adhesive, things such as photoreaction initator, photoreaction accelerator mix on the film that is formed on separation material in the form of sheets.

According to an eighth aspect of the invention, provide a kind of as the film second aspect definition, that on substrate, form projection, wherein the phosphor layer of plasma scope is made of module, and film is a kind of photosensitive resin film that comprises fluorescent material, is in the form of sheets material on a kind of film that is formed on separation that is mixed with ultraviolet emission type fluorescent material powder, the resin composition that comprises crosslinked organic polymer adhesive, photoreaction initator, photoreaction accelerator at least with what form fluorescent material layer.

In first aspect to the eight aspect, fixedly membrane stage is not liquefied.Therefore, can obtain high accuracy, the uniform as far as possible desirable jut of structure.

According to a ninth aspect of the invention, provide a kind of method that forms jut on substrate, this method comprises:

A film is set to form jut on substrate, constitutes the membranaceous resin of film, its composition comprises glass dust, organic polymer adhesive, photoreaction initator and photoreaction accelerator at least; With

By being arranged on the film exposure on the substrate and on substrate, forming the jut of required shape with the process that a module formalizes.

According to the tenth aspect of the invention, the method that forms jut on substrate that provides a kind of as the 9th aspect to limit wherein, is a kind of glass substrate that stripped display such as is used to film being set to substrate on it.

According to an eleventh aspect of the present invention, provide a kind of method that forms jut on substrate of as the qualification of the 9th aspect, wherein, in the film on being set to substrate, the resin composition also comprises conducting powder.

According to a twelfth aspect of the invention, provide a kind of method that forms jut on substrate of as the qualification of the tenth aspect, wherein resin is formed and is also comprised conducting powder.

According to a thirteenth aspect of the invention, a kind of method that forms jut on substrate of as the qualification of the 9th aspect is provided, wherein, in the middle of the formation jut, the spaced walls of plasma scope forms by module, and the insulating photosensitive resin film that will form spaced walls is a kind of powder and boron oxide or silica-filled thing that is mixed with the glass dust of leaded system or zinc system at least, comprises the material of the resin composition of crosslinked organic high polymeric binder, photoreaction initator, photoreaction accelerator, and by stirring on the film that synthesizing flaky is formed on isolation.

According to a fourteenth aspect of the invention, the method a kind of as qualification of the 9th aspect, form jut on substrate also is provided, wherein in forming the jut process, the electrode of plasma scope forms by module, and the photosensitive conducting resin molding that will form electrode is a kind of powder, the resin that comprises crosslinked organic high polymer adhesive composition and photoreaction initator that is mixed with glass dust at least, contains the conductor metal powder of silver powder composition, the mixture of photoreaction accelerator, and is formed on the film at interval by being mixed into sheet.

According to a fifteenth aspect of the invention, a kind of method that forms jut on substrate of as the definition of the 9th aspect also is provided, wherein in the process that forms jut, the dielectric film of plasma scope forms by module, and the insulation photosensitive resin film that will form insulating barrier is a kind of powder that is mixed with the glass dust of leaded system or zinc system at least, the filler of boron oxide or silicon dioxide, the resin that comprises crosslinked organic high polymer adhesive, the photosensitized reaction initator, the material of photosensitized reaction accelerator or the like, and be formed at interval the film by being mixed into sheet.

According to a sixteenth aspect of the invention, the method a kind of as qualification of the 9th aspect, form jut on substrate also is provided, wherein in the process that forms jut, the fluorescent material layer of plasma forms by module, and the photosensitive resin film that contains fluorescent material that will form fluorescent material layer is a kind of ultraviolet emission type fluorescent material powder that is mixed with at least, the material that contains the resin, photoreaction initator, photoreaction accelerator or the like of crosslinked organic high polymer adhesive, and be formed on the film at interval by being mixed into sheet.

According to a seventeenth aspect of the invention, also provide a kind of and limited as the 13 aspect, form the method for jut on substrate, wherein in the process that forms jut, spaced walls is strip and is formed on the substrate.

According to an eighteenth aspect of the invention, also provide the method a kind of as qualification of the 13 aspect, form jut on substrate, wherein in the process that forms jut, spaced walls is formed on the substrate with the form of matrix.

In the 9th to the tenth eight aspect, the state of component is fixed in the film, does not wish to be liquefied.Thereby, as long as film is exposed under the light, just can obtain uniform as far as possible, the desirable jut of structure accurately by a mask corresponding to ideal structure.

According to a nineteenth aspect of the invention, the plasma scope that provides a kind of method of utilizing the 9th aspect to limit to make.

According to a twentieth aspect of the invention, the plasma scope that provides a kind of method of utilizing the 13 aspect to limit to make.

From in conjunction with the embodiments following, in the description with reference to the accompanying drawings, each characteristics of the present invention and purpose will seem more clear.

Fig. 1 is the partial sectional view of DC type PDP in the embodiment of the invention;

Fig. 2 A, 2B and 2C explain the sketch of making the electrode loop process among the embodiment;

Fig. 3 is the partial plan layout of resistance and electrode loop among the embodiment;

Fig. 4 A, 4B, 4C, 4D, 4E and 4F explain the sketch of making the electrode loop process among the embodiment;

Fig. 5 A, 5B, 5C and 5D are the sketches of making the insulating barrier process among the embodiment;

Fig. 6 A, 6B and 6C are the sketches of making the spaced walls process among the embodiment;

Fig. 7 A, 7B, 7C and 7D explain the sketch of making the fluorescent material layer process among the embodiment;

Fig. 8 is the partial sectional view of AC type PDP in the embodiment of the invention;

Fig. 9 is an AC type PDP profile diagram in the embodiment of the invention;

Figure 10 is the outline drawing of embodiment of the invention DC type PDP;

Figure 11 is the outline drawing of AC type PDP according to another embodiment of the present invention.

Before present invention is described, point out earlier a bit: in whole accompanying drawing, adopt identical label for identical part.

Below will be according to embodiments of the invention, to the film that forms convex parts of plasma display, form the method for this convex parts of plasma display that has utilized this film and utilize the plasma scope of this method manufacturing to make description.Fig. 1 is the partial sectional view that utilizes the DC type color PDP that the method for first embodiment of the invention makes.

As seen from the figure, color PDP 1 has a back side panel 2, one and back side panel 2 relative and separate the front side board 3 of a preset distance.Back side panel 2 has a rear side substrate 10 and has one to be formed on spaced walls on the rear side substrate 10 corresponding to pixel.Front side board 3 is by the space on spaced walls 11 its opposites of controlled maintenance.

Rear side substrate 10 is made of transparent glass.On rear side substrate 10, be arranged in matrix electrode 20, link an electrode and another electrode electrode bus 22, link electrode bus 22 and electrode 20 and be repeated setting to the resistance 21 of another electrode.Electrode 20, resistance 21, electrode bus 22 and analog are made of the conductor composition, therein glass with mix such as silver, ruthenium-oxide or analog.Electrode bus 22 is trapezoid elements, is branched to left side and right side, and this layout makes a direction (vertical direction of Fig. 1) along rear side substrate 10 along a pair of right side-left trapezoid element repeated arrangement of stretching, and keeps at a distance with the horizontal direction in Fig. 1 each other.Pair of electrodes bus 22 and another between form a secondary bus 23.Electrode 20 is arranged between the part 22a in length and breadth and electrode bus 22 corresponding to trapezoid element.Each resistance 21 all is placed between the 22a of part in length and breadth of electrode bus 22 of electrode 20, and the voltage that is added to electrode 20 at there is by resistance 21 decisions.

On rear side substrate 10, the insulating barrier 15 of formation covers in electrode 20, resistance 21 and electrode bus 22, removes outside the part that forms secondary bus 23.Insulating barrier 15 has perforation 16 to form by making such as the such dielectric of glass in its part in the face of electrode 20.Form the negative electrode 13 that links electrode 20 at these 16 places of boring a hole.Also form and boring a hole the 16 perforation 16a that same diameter arranged facing to the place of secondary bus 23, can improve the auxiliary cathode 24 of display response speed in these perforation 16a places formation.

Spaced walls 11 is formed on the insulating barrier 15, and is arranged in matrix form to surround negative electrode 13.Within each spaced walls 11, be provided with and have three kinds of color R (red), G (green), phosphor layer 17R, the 17G of B (orchid), display unit 14R, the 14G of 17B, 14B respectively.In this embodiment, two green display unit 14G are with the diagonal setting, and blue and

red display unit

14B, 14R be with the diagonal setting, thereby intersect with green display unit 14G.These

several display unit

14R, 14G, 14B constitute a pixel.

Front side board 3 has a front side substrate 12 of being made by transparent glass.On the surface of the front side substrate 12 that faces toward rear side substrate 10, burying one along the anode line 25 that faces toward negative electrode 13 places that is positioned at that extends perpendicular to the direction of electrode bus 22.This anode line 25 is filled in the process that is formed in the groove on the front side substrate 12 by silk screen printing by the pasty state conduction seal China ink that will contain aluminium or analog and forms.On front side substrate 12, also form the guiding spacing of guiding electric charge in

display unit

14R, 14G, the 14B.

Next, be described with reference to figs. 2 to the process embodiment that makes CD type PDP back side panel 2 among 7 couples of the present invention.

In an embodiment of the present invention, the galvanic circle of electrode bus 22, resistance 21 ex hoc genus anne thing at first is formed on the rear side substrate 10.Then, insulating barrier 15 and spaced walls 11 are respectively stacked on it.At last, form fluorescent material layer 17R again in

spaced walls

11,17G, 17B are so just formed back side panel 2.

In this manufacture process, at first preparation is a rear side substrate 10, the conduction photosensitive resin film that will constitute electrode 20, electrode bus 22, secondary bus 23, the insulating photosensitive resin film that will constitute insulating barrier 15, the electroconductive resin cream 38 and the insulating photosensitive resin film that will constitute spaced walls 11 that will form resistance 21.What also will prepare is a photosensitive resin film that contains fluorescent material that will form

fluorescent material layer

17R, 17G, 17B.

It is desirable to, will form the photosensitive conducting resin molding 30 of electrode bus 22 and auxiliary electrode 23 and be a kind of have uniform thickness 5-10 μ m's and things such as conductive metal powder, the filler of forming by the powder that for example comprises glass dust, by silver or analog, the resin that comprises organic high polymer adhesive of crosslinked or other type, photoreaction initator, photoreaction accelerator mix and constitute, and again mixture is formed on material on the film at interval with sheet.

The uniform films that preferably a kind of thickness of photosensitive insulating resin film 40 that will form insulating barrier 15 is 50-100 μ m, and by the powder that for example comprises plumbous system or zinc system or other congener glass dust with such as the filler of boron oxide or silicon dioxide and the resin that comprises the organic polymer adhesive composition of crosslinked or other type, things such as photoreaction initator, photoreaction accelerator are composite, be mixed into material on the film at interval with sheet again.

Will form preferably a kind of powder that comprises glass dust that is mixed with of electroconductive resin cream 38 of resistance 21, the conductive metal oxide powder and the filler of ruthenium-oxide or congener, with a kind of crosslinked or the organic polymer adhesive of other type and the material of photoreaction initator and photoreaction accelerator etc.

Will form the preferably a kind of 170-200 of having μ of insulating photosensitive resin film 45 m uniform thickness of spaced walls 11, for example be mixed with the powder that comprises plumbous system or zinc system or analog glass dust and such as the filler of boron oxide or silicon dioxide, comprise the material of resin, photoreaction initator and photoreaction accelerator etc. of the organic polymer adhesive composition of crosslinked or other type, and mix with sheet and be formed on the film at interval.

Will form preferably a kind of material that is mixed with ultraviolet emission type fluorescent material powder and a kind of resin composition that comprises crosslinked or other type organic polymer adhesive, photoreaction initator, photoreaction accelerator etc. of the photosensitive resin film 50R, the 50G that contain fluorescent material, the 50B of

fluorescent material layer

17R, 17G, 17B, and mixture will be formed on the film at interval with sheet.In this photosensitive resin film that comprises fluorescent material, have aperture in advance in position corresponding to negative electrode 13.

Utilize the assembly of these preparations, at first on rear side substrate 10, form electrode bus 22, secondary bus 23 and electrode 20.Shown in Fig. 2 A, beginning, the photosensitive resin film 30 that will conduct electricity earlier adheres on the rear side substrate 10.With bonding, utilize the upside of film at interval for this, form photosensitive resin conducting film 30, and utilize cylinder or analog that it is pasted on the rear side substrate 10.Then, shown in Fig. 2 B, with mask 31 location and be arranged on the rear side substrate 10, under the sort of state, photosensitive resin conducting film 30 exposes to the open air such as under the ultraviolet light.On the mask 31 herein, light transmission part 31a is set at the position and the structure place thereof that form corresponding to electrode bus 22, secondary bus 23 and electrode 20.Then, shown in Fig. 2 C, utilize desirable developer, carry out developing process as pure water, the aqueous solution of sodium carbonate (sodium acid carbonate) tetramethyl dihydro ammonia or the aqueous solution of NaOH.As a result, the part 30a of exposure is solidified, and formation will constitute the electroconductive resin of electrode bus 22, secondary bus 23 and electrode 20.With this product oven dry, and under 620-650 ℃ temperature, toasted about 0.5 hour, thereby organic component in the electroconductive resin of uncured resin film or curing and unnecessary composition are removed.As a result, on the rear side substrate 10 of 4.8-5.2 μ m uniform thickness, obtain the electrode bus 22 of stepped components, linear secondary bus 23 and the electrode 20 that is arranged to matrix form, as shown in Figure 3.In this mode, utilization has the galvanic circle and the analog of the conduction photosensitive resin film 30 formation electrode bus 22 of uniform thickness, might suppress owing to the evaporation of the black solvent of seal or the variation of the resistance value that causes consuming time that other reason causes, and suppress owing to print the variation of the resistance value that separation caused of compound particles composition in the China ink, this is suitable with the situation that forms the galvanic circle with screen printing process.Therefore, can obtain stable circuit.

Next, form resistance 21, to link electrode bus 22 and electrode 20.In order to form resistance 21, shown in Fig. 4 A, on rear side substrate 10, apply photoresists 35 equably.Then, shown in Fig. 4 B, location and layout mask 36 on rear side substrate 10.In this state, photoresists 35 expose to the open air such as under the ultraviolet light.Wherein on the mask 36.Be provided with the part 36a that is in the light at position and shape place corresponding to resistance 21.Follow shown in Fig. 4 C again, utilize desirable developer, carry out development treatment as the aqueous solution of pure water, sodium carbonate (sodium acid carbonate), the aqueous solution of tetramethyl dihydro ammonia or the aqueous solution of NaOH.As a result, form at exposed portion 35a place not and will constitute the rectangular recessed part 37 of resistance 21 figures, thereby partly expose to the open air between electrode bus 22 and electrode 20.

Along with the formation of recess 37, as shown in figure 40, conductor resin plaster 38 is filled into recess 37 and is dried.Be filled into and the drying course of conductor resin plaster 38 can carry out repeatedly, consider the contraction that causes because of drying course.When being filled into when finishing with drying course, the surface of conductor resin plaster 38 becomes slick and sly by burnishing device 400, and the thickness (apparent height) of the electroconductive resin cream 38 that is filled into is adjusted to a specific value (as 10-15 μ m), shown in Fig. 4 E.Then, product was toasted under 600-620 ℃ temperature about 0.5 hour, thereby remove organic component and the analog that comprises in the photoresists 35 of exposed portion not and the electroconductive resin cream 38, obtain the resistance 21 as shown in Fig. 4 F and Fig. 3.The resistance 21 that obtains is by this way adjusted aspect the height,, thereby reduced the variation of resistance value and the variation of discharge voltage, obtain a kind of each pixel being changed very little high-quality color PDP aspect the brightness so that its thickness is even.

Resistance 21 forms insulating barrier 15 after forming again, makes resistance 21, electrode 20, electrode bus 22 and secondary bus 23 be capped, and auxiliary electrode 23 parts that will form auxiliary electrode 23 parts of auxiliary cathode 24 and will form auxiliary cathode 13 are exposed to the open air.Then, form negative electrode 13 and auxiliary cathode 24 by screen printing process.In order to form insulating barrier 15,, insulation photosensitive resin film 40 is developed, and utilize cylinder or analog that it is bonded on the rear side substrate 10 at the upside of spacer film.Therefore, shown in Fig. 5 B, mask 41 location also are arranged on the rear side substrate 10.In this state, insulating resin film 40 exposes to the open air such as under the ultraviolet light, wherein, corresponding to the part of the negative electrode 13 that forms electrode 20 and the position and the shape of the part of the auxiliary cathode 24 that forms secondary bus 23, the part 41a that is in the light is set on mask 41.Then, utilize desirable developer, as pure water, the aqueous solution of the aqueous solution of sodium carbonate (sodium acid carbonate), tetramethyl dihydro ammonia or the aqueous solution of NaOH carry out developing process.As a result, form negative electrode 13 perforation 16 and and the perforation 16a that forms auxiliary cathode 24 in the unexposed portion 40a place's perforate shown in Fig. 5 C.Then product was toasted 0.5 hour under 550-600 ℃ temperature, obtain insulating barrier 15 thus.Along with the acquisition of insulating barrier 15, by screen printing process electroconductive resin cream is filled in the perforation 16, oven dry then obtains as shown in figure 50 negative electrode 13 and auxiliary cathode 24 thus.In this mode, have the insulation photosensitive resin film 40 of uniform thickness to form insulating barriers 15 by utilization, can obtain smooth, the uniform insulating barrier 15 of thickness, this with utilize screen printing process suitable.Therefore, the variation of distance reduces between negative electrode 13 and the anode, and the variation of discharging gap diminishes.

After negative electrode 13 forms, form spaced walls 11 to surround negative electrode 13.In order to form spaced walls 11 at interval, as shown in Figure 6A,, and utilize cylinder or analog that it is bonded on the insulating barrier 15 of rear side substrate 10 at spacer film upside development insulation photosensitive resin film 45.Therefore, shown in Fig. 6 B, mask 46 location also is arranged on the rear side substrate 10, and in this state, insulation photosensitive resin film 45 exposes to the open air such as under the ultraviolet light, and wherein, shape and position corresponding to spaced walls 11 on mask 46 are provided with light transmission part 46a.Then, utilize desirable developer, as pure water, the aqueous solution of the aqueous solution of sodium carbonate (sodium acid carbonate), tetramethyl dihydro ammonia or the aqueous solution of NaOH carry out developing process.As a result, the part 45a of exposure is cured, and formation will form the part of spaced walls 11.Then product was toasted under 520-550 ℃ temperature about 0.5 hour, remove the organic component or the analog of unexposed portion or cured portion insulation photosensitive resin film thus.As a result, shown in Fig. 6 C, for example, the rectangular jut that forms spaced walls 11 is formed the part of exposing, to surround negative electrode 13.

In this embodiment, spaced walls 11 utilizes insulation photosensitive resin film 45 to form, and resin molding 45 has a homogeneous thickness in preceding moulding.Afterwards, the height of control interval wall 11 makes thickness even, arcing distance is formed accurately and obtains suitable discharge at interval.So, can obtain changing very little high-quality color PDP aspect the brightness for each pixel.In addition,, can obtain the homogeneous mechanical characteristic, make to result from that heteropical height change of fold reduces in the drying course because the mixture in the film is fixed in admixture.

After spaced walls 11 forms, in spaced walls 11, form fluorescent material layer 17R, 17G, 17B.In order to form fluorescent material layer 17R, 17G, 17B, shown in Fig. 7 A, at the upside of film at interval, the photosensitive resin film 50R that utilizes cylinder or analog will comprise red fluorescence material is positioned on the spaced walls 11, makes through hole 52 facing to negative electrode 13.Then, shown in Fig. 7 B, the photosensitive resin film 50R that will comprise red fluorescence material heating and make it softening under about 50-120 ℃ temperature, softening back becomes U type shape between dividing wall 11.In this process, because being positioned, film 50R make through hole 52 facing to negative electrode 13, exposed to the open air through through hole 52 negative electrodes 13.Get off, shown in Fig. 7 C, be positioned at the mask 51 that is provided with light transmission part 51a corresponding to the red pixel position, and be arranged on the rear side substrate 10, in this state, the photosensitive resin film 50R that comprises fluorescent material exposes to the open air such as under the ultraviolet light.Then, utilize desirable developer, as the aqueous solution of pure water, sodium carbonate (sodium acid carbonate), the aqueous solution of tetramethyl dihydro ammonia or the aqueous solution of NaOH etc. carry out developing process.As a result, the photosensitive resin film that comprises fluorescent material only exists at the part 50a place of for example exposure, shown in Fig. 7 D.Then, product was toasted about 0.5 hour under 450 ℃-520 ℃ temperature, thus, evaporation is included in organic component or the analog among the photosensitive resin film 50R that contains fluorescent material, thereby obtains fluorescent material layer 17R.By repeating these steps with similar program, then can obtain green and blue look fluorescent material layer 17G, 17B one by one with photosensitive resin film 50G that contains the green fluorescence material and the photosensitive resin film 50B that comprises half look fluorescent material.

Fluorescent material layer

17R, 17G, the 17B of Huo Deing is a kind of U-shaped shape of Xuanzhong shape of tilting along spaced walls 11 by this way.This feasible light beam that gives off from

fluorescent material layer

17R, 17G, 17B is with high efficiency emission.Therefore, improved the color PDP that luminous efficiency obtains a kind of high brightness and strong contrast.In addition, be included in the photosensitive resin film 50R, the 50G that contain fluorescent material that removes, the fluorescent material among the 50B, before solidification process, be removed, make that this fluorescent material can be recycling.Therefore, compare, can not waste expensive fluorescent material with traditional method.In addition, according to the layout that formerly is arranged on the through hole 52 on film 50R, 50G, the 50B, even dropping on, film 50R, 50G, 50B be spaced apart within the wall 11 complete area surrounded, as be in the DC type, by the air in the zone is escaped by through hole 52, film 50R, 50G, 50B can stably drop in this zone.

Adopt this mode can finish the manufacturing of back side panel 2, by the separation process, back side panel 2 and back side panel 3 are combined, inner air is finished a display unit thus with inert gas such as helium and xenon or helium and neon replacement.At last, circuit and base plate are installed, are obtained a complete PDP.

The method of solidifying paste can be light or electron beam ray or radioactive heat or the analog that comprises ultraviolet ray.

Utilized DC type plasma display that embodiment is described.But the present invention also can be applicable on the AC type plasma display, as shown in Figure 8.In this AC type plasma, as shown in Figure 8, back side panel has a glass substrate 110, and a large amount of bar shapeds, parallel addressing electrode 120 are arranged on it.Spaced walls 111 flat shape between addressing electrode 120 is provided with.Space between the adjacent spaces wall 111 is ditch shape band, and addressing electrode 120 needn't expose to the open air.Therefore, AC type plasma display is spaced apart the DC type plasma display that wall 11 surrounds far different than the anode electrode 13 that exposes to the open air.In AC type plasma display, fluorescent material layer 117 has the C tee section of a ditch shape.Simultaneously, two parallel writing on the glass substrate 103 that electrode 125 is arranged on front side board.Therefore, as shown in Figure 9, in AC type plasma in the display floater, discharge at first occurs in two and writes between electrode 125 one of them and the addressing electrode 120, and afterwards, discharge continues to write between the electrode 125 two and carries out.So fluorescent material layer 117 sends the light beam shown in arrow 200.

In contrast to this, in DC type plasma display, as shown in figure 10, discharge occurs between the anode 13 of the cathode line 25 of front side board substrate 12 and back side panel lining 10.Thus, fluorescent material layer 17 sends the light beam shown in arrow 201.So anode 13 need be exposed to the open air.

Though AC type plasma display does not have insulating barrier, insulating barrier 115 can be arranged on addressing electrode 120 and the glass substrate 110, and spaced walls 111 can be arranged on the insulating barrier 115, as shown in figure 11.

It is a plane that each spaced

walls

11 and 111 cross sectional shape need not be confined to its side, consistent each other from a side of substrate to the thickness of its all parts of side of opening wide, as shown in Figure 1, but can be a kind of like this shape, its side is a curved surface, make outwards to broaden to the part that it opens wide a side that the thickness of substrate side part is greater than the thickness of open side part, so that be easy to form mortar shape or ditch shape from the part of its substrate one side.

In DC type and AC type plasma display, the layout of anode and negative electrode can be replaced mutually.Just, the electrode 13,120 that is arranged in anode-side in plate can be used as the electrode 13,120 of cathode side, and simultaneously, the electrode 25,125 that is arranged in cathode side in plate can be used as the electrode 25,125 of anode-side.

Spaced walls can be transparent or opaque.

Utilize film of the present invention, because the composition in the film is fixed on a certain state and can not liquefies, thus can obtain accurately uniformly, the desirable figure of structure, as jut.

Utilize the present invention to form the method for convex parts of plasma display, because the composition in the film is fixed on a certain state and can liquefy, so only, just can obtain uniform, the desirable jut of structure accurately by film being exposed to the open air under the light that sees through corresponding to the mask of ideal structure.

Utilize the display panel of making by the method that forms convex parts of plasma display,, can obtain jut as far as possible uniformly,, thereby keep stabilized quality as spaced walls or electrode by preventing composition decay in time.

Though the present invention has been carried out comprehensive description in conjunction with the preferred embodiments with reference to the accompanying drawings, it should be noted that variations and modifications are conspicuous to prior art.These variations and modification should be understood to and are included in the scope of the present invention that is limited by claims.

Claims

1. film that forms jut on substrate, it is to comprise that by making the membranaceous resin composition of glass dust, organic polymer adhesive, light efficiency reaction initiator and light efficiency reaction accelerator forms at least.

2. the film that forms jut on substrate according to claim 1 is characterized in that substrate is a kind of glass substrate that is used for plasma scope.

3. the film that forms jut on substrate according to claim 1 is characterized in that the resin composition also comprises conductive powder.

4. the film that forms jut on substrate according to claim 2 is characterized in that the resin composition also comprises conductive powder.

5. the film that on substrate, forms jut according to claim 2, it is characterized in that, the spaced walls (11 of plasma scope, 111) form by figure, the film that will form spaced walls is a kind of insulation photosensitive resin film, it is by being mixed with a kind of filler that comprises powder, boron oxide or the silicon dioxide of plumbous system or zinc glass frit at least, the resin composition that comprises crosslinked organic polymer adhesive, the mixture of light efficiency reaction initiator and light efficiency reaction accelerator, and mixture is formed on the film of separation with sheet.

6. the film that on substrate, forms jut according to claim 2, it is characterized in that, the electrode (22 of plasma display, 23) form by figure, the film that will form electrode is a kind of conductor photosensitive resin film (30), be that a kind of being mixed with has glass dust at least, comprises the powder of conductive metal powder of silver and the mixture that comprises the resin composition, light efficiency reaction initiator, light efficiency reaction accelerator etc. of crosslinked organic polymer adhesive, and with on the film of mixture with sheet shape or separation.

7. the film that on substrate, forms jut according to claim 2, it is characterized in that, the insulating barrier of plasma scope (15) forms by figure, the insulation photosensitive resin film (40) that will form insulating barrier is that a kind of resin composition, light efficiency reaction that is mixed with the filler of the powder that comprises plumbous system or zinc glass frit and boron oxide or silica at least and comprises crosslinked organic polymer adhesive causes and the mixture of light efficiency reaction accelerator etc., and mixture is formed on the film of separation with sheet.

8. according to the described film that on substrate, forms jut of claim 2, it is characterized in that, the phosphor layer of plasma scope (17R, 17G, 17B) forms by figure, will form the photosensitive resin film (50R, 50G, 50B) that contains fluorescent material layer is a kind of mixture that is mixed with ultraviolet emission type fluorescent material powder, the resin composition that comprises crosslinked organic polymer adhesive, light efficiency reaction initiator and light efficiency reaction accelerator etc. at least, and mixture is formed on the film of separation with sheet.

9. method in substrate upper process part, this method comprises:

The film that forms jut is set on the substrate, and this film is by will comprising glass dust at least, and organic polymer adhesive, light efficiency reaction initiator and light efficiency reaction accelerator resin composition are made membranaceous formation; With

Be arranged on the film exposure on the substrate and on substrate, form the jut of ideal structure with the process that figure develops by a handle.

10. the method that forms jut on substrate according to claim 9 is characterized in that in the substrate that film is put on it, substrate is a kind of glass substrate that is used for plasma scope.

11. the method that forms jut on substrate according to claim 9 is characterized in that in the substrate that film is put on it, the resin composition also comprises conductive powder.

12. the method that forms jut on substrate according to claim 10 is characterized in that the resin composition also comprises conductive powder.

13. the method that on substrate, forms jut according to claim 9, it is characterized in that, in the process that forms jut, the spaced walls (11 of plasma scope, 111) form by figure, with the film that forms spaced walls is a kind of insulation photosensitive resin film (45), be that a kind of being mixed with at least comprises plumbous system or the powder of zinc glass frit and the filler of silicon dioxide or boron oxide, the resin compound that comprises crosslinked organic polymer adhesive, the mixture of light efficiency reaction initiator and light efficiency reaction accelerator etc., and mixture is formed on the film of separation with sheet.

14. the method that on substrate, forms jut according to claim 9, it is characterized in that, in the process that forms jut, the electrode (23 of plasma scope, 22) form by figure, the film that will form electrode is a kind of conduction photosensitive resin film (30), be the mixture of a kind of powder that is mixed with glass dust at least, comprises the conductive metal powder that constitutes by silver, the resin compound that comprises crosslinked organic polymer adhesive, light efficiency reaction initiator and light efficiency reaction accelerator etc., and mixture is formed on the film of separation with sheet.

15. the method that on substrate, forms jut according to claim 9, it is characterized in that, in the process that forms jut, the insulating barrier of plasma scope (15) forms by figure, the film that will form electrode is a kind of insulation photosensitive resin film (40), it is that a kind of being mixed with at least comprises plumbous system or the powder of zinc glass frit and the filler of boron oxide or silica, the resin composition that comprises crosslinked organic polymer adhesive, the mixture of light efficiency reaction initiator and light efficiency reaction accelerator etc., and mixture is formed on the film of separation with sheet.

16. the method that on substrate, forms jut according to claim 9, it is characterized in that, in the process that forms jut, the fluorescent material layer of plasma scope (17R, 17G, 17B) forms by figure, the photosensitive resin film that comprises fluorescent material (50R, 50G, 50B) that will form fluorescent material layer is a kind of mixture that is mixed with ultraviolet emission type fluorescent material powder, the resin composition that comprises organic cross-linked polymer adhesive, photoreaction initator and photoreaction accelerator etc. at least, and mixture is formed on the film of separation with sheet.

17. the method that forms jut on substrate according to claim 13 is characterized in that in the process that forms jut, spaced walls is formed on the substrate with bar shape.

18. the method that forms jut on substrate according to claim 13 is characterized in that in the process that forms jut, spaced walls is formed on the substrate with matrix shape.

19. plasma scope of making by the described method of claim 9.

20. plasma scope of making by the described method of claim 13.