CN115957661A - Semiconductor silicon wafer polishing piece cleaning agent preparation equipment - Google Patents
Semiconductor silicon wafer polishing piece cleaning agent preparation equipment Download PDFInfo
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- CN115957661A CN115957661A CN202211615383.4A CN202211615383A CN115957661A CN 115957661 A CN115957661 A CN 115957661A CN 202211615383 A CN202211615383 A CN 202211615383A CN 115957661 A CN115957661 A CN 115957661A
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The invention relates to the field of cleaning agent preparation equipment, and particularly discloses semiconductor silicon wafer polishing piece cleaning agent preparation equipment which comprises a stirring barrel and an adjusting component, wherein an agent storage tank is arranged at the upper end of the stirring barrel, a sewer pipe is arranged on one side of the agent storage tank, which is far away from the central axis of the stirring barrel, a valve seat is arranged inside the sewer pipe, a valve casing is arranged at the upper end of the sewer pipe, the adjusting component is arranged inside the valve casing, and a micro motor is arranged at the upper end of a threaded rod, so that the semiconductor silicon wafer polishing piece cleaning agent preparation equipment has the beneficial effects that: the switch of downcomer is adjusted through the micro motor operation, makes the liquid that two storage agent jars were deposited, can inject the liquid of different proportions into respectively in to the agitator, and does not need artifical ratio, reduces the error of artifical configuration, has improved washing liquid quality, promotes the liquid through gas and rolls, and is more abundant when making the stirring rod stir the liquid, not only improves the speed of cleaner configuration, also improves the quality of cleaner.
Description
Technical Field
The invention relates to the field of cleaning agent preparation equipment, in particular to semiconductor silicon wafer polishing sheet cleaning agent preparation equipment.
Background
The wafer refers to a chip used for manufacturing a semiconductor integrated circuit, and is called a wafer because the shape of the wafer is circular; in recent years, silicon-based materials are also gradually applied to high-speed optical communication, and after the silicon-based materials are manufactured on a wafer, the wafer needs to be polished.
The patent document with the publication number of CN216296050U discloses a preparation equipment for environment-friendly water-based cleaning agent for electronic materials, which comprises a box body and a base, wherein a motor is fixedly arranged at the top of the box body, one end of a stirring shaft is fixedly connected to an output shaft of the motor, a plurality of stirring rods are fixedly arranged on the stirring shaft, the bottom end of the stirring shaft extends to the bottom of the box body and is fixedly provided with a first bevel gear, and two vertical plates are fixedly arranged at the bottom of the box body. According to the cleaning agent mixing device, the stirring rod is driven to rotate and simultaneously the box body is driven to shake up and down, so that the cleaning agent in the box body is driven to shake up and down, the cleaning agent is uniformly mixed, and the efficiency and the quality of the cleaning agent preparation are improved.
Among the above-mentioned equipment, cleaner ratio solution needs the manual work to add from the inlet pipe, and the manual work is added the solution of different components in the box, can not ensure the accuracy of solution ratio, makes the cleaner lead to the error when the configuration, not only reduces the cleaner quality, uses this kind of cleaner to lead to the product to damage easily moreover, to above-mentioned condition, carries out technical innovation on current cleaner configuration equipment basis.
Disclosure of Invention
The invention aims to provide a semiconductor silicon wafer polishing sheet cleaning agent preparation device to solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a semiconductor silicon wafer polishing piece cleaner configuration equipment, semiconductor silicon wafer polishing piece cleaner configuration equipment includes agitator and adjusting part the upper end of agitator is provided with the storage agent jar, and the one side that the agitator axis was kept away from to the storage agent jar is provided with the downcomer, the inside of downcomer is provided with the disk seat, and the upper end of downcomer is provided with the valve casing, adjusting part sets up the inside at the valve casing, and adjusting part includes threaded rod, micro motor, slider, valve rod and case, the upper end of threaded rod is provided with micro motor, and the outside of threaded rod is provided with the slider, the lower extreme of slider is provided with the valve rod, and the lower extreme of valve rod is provided with the case, the outside of valve rod is provided with sealing filler.
Preferably, an inner chamber is arranged at the upper side of the inner part of the stirring barrel, and a stirring assembly is arranged in the inner chamber.
Preferably, the stirring assembly comprises a large motor and a first gear, and the first gear is arranged at the left end of the large motor.
Preferably, the stirring assembly further comprises a second gear and a stirring column, the second gear is arranged at the lower end of the first gear, and the stirring column penetrates through the inner part of the second gear.
Preferably, the stirring assembly further comprises an air pipe and a stirring rod, the air pipe penetrates through the upper end of the stirring column, and the stirring rod is arranged on one side of one end of the stirring column.
Preferably, the stirring assembly further comprises a connector and an air outlet, the connector is arranged at the lower end of the stirring column, and the air outlet is formed in the outer side of the connector.
Preferably, one side of one end of the lower end of the stirring barrel is provided with a supporting leg, and the lower end of the stirring barrel is provided with an agent injection pipe.
Preferably, the lower extreme of annotating the agent pipe is provided with filtering component, and filtering component includes shell, screw and filter screen, the left end of shell is provided with the screw, and the inside of shell is provided with the filter screen, the lower extreme of shell is provided with the storage agent case.
Compared with the prior art, the invention has the beneficial effects that: the switch of downcomer is adjusted through the micro motor operation, makes the liquid that two storage agent jars were deposited, can inject the liquid of different proportions into respectively in to the agitator, and does not need artifical ratio, reduces the error of artifical configuration, has improved washing liquid quality, promotes the liquid through gas and rolls, and is more abundant when making the stirring rod stir the liquid, not only improves the speed of cleaner configuration, also improves the quality of cleaner.
1. When the liquid storage tank is used, the micro motor starts to operate to enable the threaded rod to rotate, the threaded rod rotates to drive the sliding block to move upwards, the sliding block moves to drive the valve rod and the valve core to move upwards so that the valve core is not clamped and sealed against the groove on the valve seat, liquid can flow into the stirring tank from the sewer pipe, the sealing filler arranged on the outer side of the valve rod enables the liquid not to leak easily, after a certain amount of liquid is injected, the micro motor operates to drive the threaded rod to rotate, the threaded rod rotates to drive the sliding block to move downwards, the valve rod drives the valve core to seal the valve seat again, the switch of the sewer pipe is adjusted through the operation of the micro motor, the liquid stored in the two liquid storage tanks can be respectively injected with the liquid in different proportions into the stirring tank, manual proportioning is not needed, errors of manual proportioning are reduced, and the quality of the cleaning liquid is improved.
2. When the liquid cleaning machine is used, the large motor operates to drive the first gear to rotate, the first gear rotates to drive the second gear to rotate, the second gear rotates to drive the stirring column and the stirring rod to rotate, then the stirring rod stirs liquid in the stirring barrel, then gas is injected into the stirring column through the gas pipe, the gas is discharged from the gas outlet hole in the connecting head and the gas hole in the stirring rod, and the discharged gas pushes the liquid to roll, so that the liquid is stirred more fully by the stirring rod, and the liquid is pushed to roll by the gas, so that the liquid is stirred more fully by the stirring rod, the preparation speed of the cleaning agent is improved, and the quality of the cleaning agent is also improved.
Drawings
FIG. 1 is a schematic sectional front view of an apparatus for dispensing a cleaning agent for a semiconductor silicon wafer polishing pad according to the present invention;
FIG. 2 is an enlarged schematic view of a cleaning agent dispensing apparatus for a semiconductor silicon wafer polishing pad of the present invention at the point A in FIG. 1;
FIG. 3 is an enlarged schematic view of the cleaning agent dispensing apparatus for semiconductor silicon wafer polishing pads of the present invention at the point B in FIG. 1;
FIG. 4 is a schematic perspective view of a second gear and a stirring column of the apparatus for dispensing a cleaning agent for a polished semiconductor wafer according to the present invention.
In the figure: 1. a stirring barrel; 2. a sewer pipe; 3. a valve seat; 4. a valve housing; 5. sealing and filling; 6. an adjustment assembly; 601. a threaded rod; 602. a micro motor; 603. a slider; 604. a valve stem; 605. a valve core; 7. a storage tank; 8. an inner chamber; 9. a stirring assembly; 901. a large motor; 902. a first gear; 903. a second gear; 904. stirring the column; 905. an air tube; 906. a stirring rod; 907. a connector; 908. an air outlet; 10. a support leg; 11. an agent injection pipe; 12. a filter assembly; 1201. a housing; 1202. a screw; 1203. a filter screen; 13. and a storage box.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clear and fully described, embodiments of the present invention are further described in detail below with reference to the accompanying drawings. It is to be understood that the specific embodiments described herein are merely illustrative of some embodiments of the invention and are not limiting of the invention, and that all other embodiments obtained by those of ordinary skill in the art without the exercise of inventive faculty are within the scope of the invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "inner", "outer", "top", "bottom", "side", "vertical", "horizontal", and the like indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," "fourth," "fifth," and "sixth" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in a specific case to those of ordinary skill in the art.
For the purposes of simplicity and explanation, the principles of the embodiments are described by referring mainly to examples. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the embodiments. It will be apparent, however, to one of ordinary skill in the art that the embodiments may be practiced without limitation to these specific details. In some instances, well-known methods and structures have not been described in detail so as not to unnecessarily obscure the embodiments. In addition, all embodiments may be used in combination with each other.
Referring to fig. 2 and fig. 3, the present invention provides a technical solution: a semiconductor silicon wafer polishing wafer cleaning agent preparation device comprises an agitator 1 and an adjusting component 6, wherein an agent storage tank 7 is arranged at the upper end of the agitator 1, a sewer pipe 2 is arranged on one side of the agent storage tank 7, which is far away from the central axis of the agitator 1, a valve seat 3 is arranged inside the sewer pipe 2, a valve casing 4 is arranged at the upper end of the sewer pipe 2, the adjusting component 6 is arranged inside the valve casing 4, the adjusting component 6 comprises a threaded rod 601, a micro motor 602, a sliding block 603, a valve rod 604 and a valve core 605, the micro motor 602 is arranged at the upper end of the threaded rod 601, the sliding block 603 is arranged outside the threaded rod 601, the valve rod 604 is arranged at the lower end of the sliding block 603, the valve core 605 is arranged at the lower end of the valve rod 604, a sealing filler 5 is arranged outside the valve rod 604, the micro motor 602 starts to operate, the threaded rod 601 rotates, and the threaded rod 601 rotates to drive the sliding block 603 to move upwards, the slide block 603 moves to drive the valve rod 604 and the valve core 605 to move upwards, so that the valve core 605 is not clamped and sealed against the groove on the valve seat 3 any more, liquid can flow into the stirring barrel 1 from the sewer pipe 2, the sealing filler 5 arranged on the outer side of the valve rod 604 prevents the liquid from leaking easily, after a certain amount of liquid is injected, the micro motor 602 operates to drive the threaded rod 601 to rotate, the threaded rod 601 rotates to drive the slide block 603 to move downwards, so that the valve rod 604 drives the valve core 605 to seal the valve seat 3 again, the micro motor 602 operates to adjust the opening and closing of the sewer pipe 2, so that the liquid stored in the two liquid storage tanks 7 can be respectively injected into the stirring barrel 1 with liquid in different proportions without manual proportioning, the errors of manual proportioning are reduced, the quality of cleaning liquid is improved, the support legs 10 are arranged on one side of the lower end of the stirring barrel 1, and the lower end of the stirring barrel 1 is provided with the liquid injection pipe 11, the lower extreme of annotating agent pipe 11 is provided with filtering component 12, and filtering component 12 includes shell 1201, screw 1202 and filter screen 1203, and the left end of shell 1201 is provided with screw 1202, and the inside of shell 1201 is provided with filter screen 1203, and the lower extreme of shell 1201 is provided with storage agent case 13, and operating personnel opens annotate the switch of agent pipe 11, then during the filter screen 1203 in the cleaning agent reachs shell 1201, in filter screen 1203 filtered the back in flowing into storage agent case 13 with impurity granule in the cleaning agent to improve the cleaning agent quality.
Referring to fig. 1 and 4, an inner chamber 8 is disposed on an upper side of an interior of the stirring barrel 1, a stirring assembly 9 is disposed in the inner chamber 8, the stirring assembly 9 includes a large motor 901 and a first gear 902, a first gear 902 is disposed at a left end of the large motor 901, the stirring assembly 9 further includes a second gear 903 and a stirring column 904, a second gear 903 is disposed at a lower end of the first gear 902, the stirring column 904 penetrates through the second gear 903, the stirring assembly 9 further includes an air pipe 905 and a stirring rod 906, the air pipe 905 and the stirring rod 906 penetrate through the second gear 903, the air pipe 905 and the stirring rod 906 penetrate through an upper end of the stirring column 904, the gear 903 rotates to drive the stirring rod 904 and the stirring rod 906 to rotate, the stirring rod 906 stirs liquid in the stirring barrel 1, the air pipe 905 injects air into the stirring column 902, the air pipe 901 drives the gear 903 and the gear 902 to rotate, the stirring rod 904 drives the stirring rod 904 and the air pipe 906 to discharge air, and the cleaning agent when the cleaning agent is stirred, the cleaning agent is more thoroughly pushed by the stirring rod 906, and the cleaning agent is more thoroughly stirred.
The working principle is as follows: when the liquid is actually used, firstly, an operator turns on a power supply, the micro motor 602 starts to operate to rotate the threaded rod 601, the threaded rod 601 rotates to drive the sliding block 603 to move upwards, the sliding block 603 moves to drive the valve rod 604 and the valve core 605 to move upwards, so that the valve core 605 is not clamped and sealed against the groove on the valve seat 3 any more, the liquid can flow into the stirring barrel 1 from the sewer pipe 2, the sealing filler 5 arranged on the outer side of the valve rod 604 prevents the liquid from leaking easily, when a certain amount of liquid is injected, the micro motor 602 operates to drive the threaded rod 601 to rotate, the threaded rod 601 rotates to drive the sliding block 603 to move downwards, so that the valve rod 604 drives the valve core 605 to seal the valve seat 3 again, after the liquid in the two liquid storage tanks 7 enters the stirring barrel 1, the large motor 901 operates to drive the first gear 902 to rotate, the first gear 902 rotates to drive the second gear 903 to rotate, the second gear 903 rotates to drive the stirring column 904 and the stirring rod 906 to rotate, then the stirring rod 906 stirs the liquid in the stirring barrel 1, then gas is injected into the stirring column 904 through the gas pipe 905, the gas is discharged from the gas outlet 908 in the connecting head 907 and the gas hole in the stirring rod 906, the discharged gas pushes the liquid to roll, so that the stirring rod 906 stirs the liquid more fully, after the cleaning agent is prepared, an operator opens the opening and closing of the agent injection pipe 11, then the cleaning agent reaches the filter screen 1203 in the shell 1201, the filter screen 1203 filters impurity particles in the cleaning agent and then flows into the agent storage box 13, finally, the screw 1202 is unscrewed, the filter screen 1203 is taken out, and the filter screen 1203 is cleaned, and then the cleaning machine is installed.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. A semiconductor silicon wafer polishing piece cleaning agent configuration equipment is characterized in that: semiconductor silicon wafer polishing piece cleaner configuration equipment includes agitator (1) and adjusting part (6), the upper end of agitator (1) is provided with storage agent jar (7), and one side that agitator (1) axis was kept away from in storage agent jar (7) is provided with downcomer (2), the inside of downcomer (2) is provided with disk seat (3), and the upper end of downcomer (2) is provided with valve casing (4), adjusting part (6) set up in the inside of valve casing (4), and adjusting part (6) include threaded rod (601), micro motor (602), slider (603), valve rod (604) and case (605), the upper end of threaded rod (601) is provided with micro motor (602), and the outside of threaded rod (601) is provided with slider (603), the lower extreme of slider (603) is provided with valve rod (604), and the lower extreme of valve rod (604) is provided with case (605), the outside of valve rod (604) is provided with sealing filler (5).
2. The apparatus of claim 1, wherein the cleaning agent dispensing apparatus comprises: an inner chamber (8) is arranged on the upper side in the stirring barrel (1), and a stirring assembly (9) is arranged in the inner chamber (8).
3. The apparatus of claim 2, wherein the cleaning agent dispenser comprises: the stirring assembly (9) comprises a large motor (901) and a first gear (902), and the first gear (902) is arranged at the left end of the large motor (901).
4. The apparatus of claim 3, wherein the cleaning agent dispenser comprises: stirring subassembly (9) still include gear two (903) and stirring post (904), the lower extreme of gear one (902) is provided with gear two (903), and the inside of gear two (903) is run through and has been stirred post (904).
5. The apparatus of claim 4, wherein the cleaning agent dispensing apparatus comprises: stirring subassembly (9) still include trachea (905) and stirring rod (906), the upper end of stirring post (904) has run through trachea (905), and one end one side of stirring post (904) all is provided with stirring rod (906).
6. The apparatus of claim 4, wherein the cleaning agent dispenser comprises: stirring subassembly (9) still include connector (907) and venthole (908), the lower extreme of stirring post (904) is provided with connector (907), and venthole (908) have been seted up to the outside of connector (907).
7. The apparatus of claim 1, wherein the cleaning agent dispensing apparatus comprises: one side of one end of the lower end of the stirring barrel (1) is provided with a supporting leg (10), and the lower end of the stirring barrel (1) is provided with an injection pipe (11).
8. The apparatus of claim 7, wherein the cleaning agent dispensing apparatus comprises: the lower extreme of annotating agent pipe (11) is provided with filtering component (12), and filtering component (12) include shell (1201), screw (1202) and filter screen (1203), the left end of shell (1201) is provided with screw (1202), and the inside of shell (1201) is provided with filter screen (1203), the lower extreme of shell (1201) is provided with storage case (13).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211615383.4A CN115957661A (en) | 2022-12-15 | 2022-12-15 | Semiconductor silicon wafer polishing piece cleaning agent preparation equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211615383.4A CN115957661A (en) | 2022-12-15 | 2022-12-15 | Semiconductor silicon wafer polishing piece cleaning agent preparation equipment |
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| Publication Number | Publication Date |
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| CN115957661A true CN115957661A (en) | 2023-04-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211615383.4A Pending CN115957661A (en) | 2022-12-15 | 2022-12-15 | Semiconductor silicon wafer polishing piece cleaning agent preparation equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117102137A (en) * | 2023-10-23 | 2023-11-24 | 苏州普洛泰科精密工业有限公司 | High-pressure nano bubble cleaning head assembly and cleaning method |
-
2022
- 2022-12-15 CN CN202211615383.4A patent/CN115957661A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117102137A (en) * | 2023-10-23 | 2023-11-24 | 苏州普洛泰科精密工业有限公司 | High-pressure nano bubble cleaning head assembly and cleaning method |
| CN117102137B (en) * | 2023-10-23 | 2024-02-06 | 苏州普洛泰科精密工业有限公司 | High-pressure nano bubble cleaning head assembly and cleaning method |
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