CN115955802A - Integrated multilayer full-sealed shell - Google Patents
Integrated multilayer full-sealed shell Download PDFInfo
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- CN115955802A CN115955802A CN202211677971.0A CN202211677971A CN115955802A CN 115955802 A CN115955802 A CN 115955802A CN 202211677971 A CN202211677971 A CN 202211677971A CN 115955802 A CN115955802 A CN 115955802A
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Abstract
The invention provides an integrated multilayer full-sealed shell, which belongs to the field of sealed shell devices and comprises pins, a shell body and a bottom base plate, wherein a circuit network is arranged on the bottom base plate, components are welded on the upper surface of the bottom base plate, the pins are arranged above the bottom base plate and electrically connected with the circuit network, the shell body covers the bottom base plate and is arranged in a sealing mode with the bottom base plate, through holes corresponding to the pins are formed in the top end of the shell body, the pins extend out of the shell body, and the pins and the shell body are arranged in a sealing mode. The vacant area on the cover plate substrate can be subjected to multilayer wiring, various components can be assembled on the upper surface and the lower surface, and the vacant area is electrically connected with the bottom substrate through the pins penetrating through the substrate, so that the areas of the front surface and the back surface of the cover plate are fully utilized, the component assembly density of the whole product is increased, and the integrated multilayer assembly of the whole shell is realized.
Description
Technical Field
The invention relates to the field of sealed shell devices, in particular to an integrated multilayer fully-sealed shell.
Background
The traditional full-sealed shell is generally made of 10# steel, kovar, HTCC ceramic and other materials, and a cover plate is made of Kovar, nickel and other metal sheets. The cover plate is only used for sealing and does not have any electrical connection performance. Because the cover plate is made of metal, if the pins of the fully-sealed shell are led out upwards, holes can be formed in the side wall of the shell only, and the insulator with the lead is sintered. The size of the housing becomes large (the lead wires on the side occupy a large space), and meanwhile, the pins must be sintered on the housing in advance, if a single-chip substrate is adopted for assembly, the size of the substrate is limited and cannot be as large as that of the housing, and the assembly complexity is increased and the assembly precision is difficult to control by adopting multi-chip substrate assembly. In addition, because the lead is fixed, the connection length between the pins and the substrate is increased, for products with high power and high current, in order to reduce the line resistance, an overhead bus is adopted for connection, the design of the connecting sheet is very complicated, and the connecting sheets of different products need to be specially designed and cannot be used with other products. For multilayer high-density assembly application, a substrate is welded on a cover plate in courtyard and is connected with a substrate at the bottom of a shell through a flexible plate, so that multilayer assembly is realized. However, this method is troublesome, and during the sealing process, the flexible board needs to be bent and has an uncontrollable shape, which may interfere with devices, bonding wires, etc. on the base board of the base board.
The prior art has the following problems: (1) When the metal cover plate is used for sealing, if the pins of the full-sealed shell are led out upwards, holes can be formed in the side wall of the shell, and the insulator with the lead is sintered, namely the size of the shell is increased; (2) When the pins are required to be sintered on the shell in advance, if a single substrate is adopted for assembly, the size of the substrate is limited and cannot be as large as that of the shell bottom plate, and when a plurality of substrates are adopted for assembly, the assembly is complex and the assembly precision is difficult to control; (3) Because the lead is fixed, the connection length between the pin and the substrate is increased, when the wire resistance is reduced, an overhead bus is needed for connection, the design of the connecting sheet is very complicated, and the connecting sheets of different products are not adaptive generally; (4) If the flexible board is connected with the substrate at the bottom of the shell, the flexible board needs to be bent in the sealing process, and the shape of the flexible board is uncontrollable, so that the flexible board may interfere with devices, bonding wires and the like on the substrate of the bottom plate.
Disclosure of Invention
The invention aims to provide an integrated multilayer fully-sealed shell, which solves the technical problems mentioned in the background technology.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows:
the utility model provides an integration multilayer all sealed shell, includes pin, shell body and bottom base plate, is provided with circuit network on the base plate of bottom, and the last surface welding of bottom base plate is equipped with components and parts, and the pin setting is in the top of bottom base plate to with circuit network electrical connection, the shell body lid closes on the bottom base plate, and with the sealed setting of bottom base plate, the top of shell body is provided with the through-hole corresponding with the pin, the pin stretches out the outside of shell body, pin and the sealed setting of shell body.
Furthermore, a sealing ring is arranged at the through hole of the pin and the outer shell and is a pad welding sealing ring for sealing, the sealing ring is arranged around the through hole, when the sealing ring is welded, a product is placed under a nitrogen atmosphere, and the pin and the sealing ring on the pad on the side edge of the through hole of the outer shell are welded together by melting solder and are filled in a gap to realize sealing.
Furthermore, a plurality of layers of shell circuit networks are arranged on the inner side and the outer side of the shell body, the shell circuit networks are electrically connected with the pins, the areas of the front side and the back side of the shell body are utilized, the device assembly density of the product is increased, and the integrated multilayer assembly of the shell body is realized.
Furthermore, the joint of the outer shell and the bottom substrate is hermetically welded together by adopting a welding process, and the welding process is gold tin welding, parallel seam welding or laser welding.
Furthermore, the number of the pins is a plurality, the pins comprise power pins and signal pins, the power pins are thicker than the signal pins, and the pins are pin pins.
Furthermore, the outer four corners of the outer shell are provided with fixing feet which are integrally arranged with the outer shell.
Further, the assembly process of the sealed shell is as follows: the method comprises the steps of welding and assembling components and pins on a bottom substrate and connecting the components and the pins together, manufacturing an outer shell into an integrated shell by adopting an HTC (high temperature conductive) process, manufacturing a sealing pad on the shell, a through hole and a through hole pad, carrying out wiring on a plurality of layers, placing a device pad, assembling the integrated shell, welding a sealing ring by adopting a welding flux or welding the sealing ring on the sealing pad, then assembling and connecting the device, sleeving the assembled bottom substrate into the integrated shell, welding the bottom substrate and the sealing pad or the sealing ring of the integrated shell into a whole by adopting a soldering tin welding, laser welding or parallel seam welding process, and ensuring the sealing property, and then welding the pins and the sealing ring by adopting the soldering tin welding or laser welding process under a nitrogen environment and ensuring the air tightness.
Furthermore, the shell body comprises a cover plate base plate, a sealing ring and a shell frame, the shell frame is arranged on four sides of the bottom base plate, the joints of the shell frame and the bottom base plate are arranged in a sealing mode, the cover plate base plate covers the top end of the shell frame, the sealing ring is arranged at the joint of the cover plate base plate and the shell frame and is arranged in a sealing mode, a plurality of layers of base plate circuit networks are arranged on the upper side and the lower side of the cover plate base plate, the base plate circuit networks are electrically connected with pins, the areas of the front side and the back side of the cover plate base plate are utilized, the device assembly density of a product is increased, and integrated multilayer assembly of the cover plate base plate is achieved.
Furthermore, the cover plate substrate is made of a thick film substrate, a plurality of layers of HTC substrates or a ceramic copper-clad substrate, and continuous welding pads for sealing are designed around the cover plate substrate and used for being directly welded with the shell frame for sealing or welded with a sealing ring on the shell frame for sealing through a parallel seam welding process.
Further, the assembly engineering of the sealed shell is as follows: the method comprises the steps of welding and assembling components and pins on a bottom substrate, assembling and connecting the bottom substrate and a shell frame together, manufacturing a cover plate substrate by adopting a thick film substrate and a plurality of layers of HTCC substrates or ceramic copper-clad substrate materials, designing a sealing plate and a through hole on the cover plate substrate, welding a sealing ring on the sealing plate by the sealing plate or the sealing ring on the sealing plate, designing a through hole welding plate on the side edge of the through hole, welding a sealing ring on the welding plate, assembling devices on the front side and the back side of the cover plate substrate and connecting the devices, sleeving the cover plate substrate into the shell frame assembled with the bottom substrate, completing the connection between the sealing plate or the sealing ring on the outer ring of the cover plate substrate and the shell frame, adopting soldering tin welding, laser welding or parallel seam welding processes to ensure the air tightness of the sealing ring and the shell frame, baking the welded product to remove water vapor, welding the pins and the sealing ring in a nitrogen environment, and adopting the soldering tin welding or laser welding processes to ensure the air tightness between the pins and the sealing ring.
Structurally, the shell adopts pin pins with different thicknesses as pins (thick pins for power pins and thin pins for signal pins), vertically welds the pins on a bottom substrate in a welding mode (soldering or ultrasonic welding), adopts a high-strength substrate (such as a thick film substrate, an HTC multilayer substrate or a ceramic copper-clad substrate) to manufacture a continuous pad for sealing (used for directly welding a seal with a shell frame or welding a seal ring on the substrate through processes of parallel seam welding and the like) on the periphery of a cover plate substrate and a cover plate substrate, and comprises a circuit layout and through holes (capable of enabling the pins to pass through and designing a pad welding seal ring around the through holes for sealing). When the sealing structure is assembled, the bottom substrate and the shell frame are welded together by adopting various welding processes (such as gold tin welding, parallel seam welding, laser welding and the like), components and pins to be assembled are assembled on the bottom plate, finally the cover plate substrate is sleeved into the pins to cover the shell frame and welded (the processes of gold tin welding, parallel seam welding, laser welding and the like can be adopted), then the product is placed in a nitrogen atmosphere, and the pins and the sealing rings on the through hole pads on the cover plate substrate are welded together by melting welding materials and filled in gaps to realize sealing, so that the requirement of the national military standard on the internal atmosphere of the sealed product is met. The vacant areas on the cover plate substrate can be subjected to multilayer wiring, various components can be assembled on the upper surface and the lower surface, and the upper surface and the lower surface are electrically connected with the bottom substrate through pins penetrating through the substrate, so that the areas of the front side and the back side of the cover plate are fully utilized, the component assembly density of the whole product is increased, and the integrated multilayer assembly of the whole shell is realized.
Due to the adoption of the technical scheme, the invention has the following beneficial effects:
the vacant area on the cover plate substrate can be subjected to multilayer wiring, various components can be assembled on the upper surface and the lower surface, and the upper surface and the lower surface are electrically connected with the bottom substrate through pins penetrating through the substrate, so that the areas of the front surface and the back surface of the cover plate are fully utilized, the component assembly density of the whole product is increased, and the integrated multilayer assembly of the whole shell is realized.
Drawings
FIG. 1 is a perspective view of an embodiment of the present invention;
FIG. 2 is a schematic view of a slit structure according to a first embodiment of the present invention;
FIG. 3 is a perspective view of an embodiment of the present invention;
fig. 4 is a schematic view of a notch structure according to a second embodiment of the present invention.
Reference numbers in the figures: 1-a pin; 2-a sealing ring; 3-an outer shell; 4-fixing feet; 5-a base substrate; 6-a cover substrate; 7-sealing ring; 8-housing frame.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail below with reference to the accompanying drawings by way of examples of preferred embodiments. It should be noted, however, that the numerous details set forth in the description are merely for the purpose of providing the reader with a thorough understanding of one or more aspects of the present invention, which may be practiced without these specific details.
Example 1:
as shown in fig. 1-2, an integrated multilayer fully-sealed housing comprises a pin 1, a housing body 3 and a bottom substrate 5, wherein a circuit network is arranged on the bottom substrate 5, a component is welded on the upper surface of the bottom substrate 5, the pin 1 is arranged above the bottom substrate 5 and electrically connected with the circuit network, the housing body 3 covers the bottom substrate 5 and is hermetically arranged with the bottom substrate 5, a through hole corresponding to the pin 1 is arranged at the top end of the housing body 3, the pin 1 extends out of the housing body 3, and the pin 1 is hermetically arranged with the housing body 3.
Utilize shell body 3 and bottom base plate 5 to constitute an inclosed space, sealed effect is realized to two casings, and these two casings also are as the circuit board structure simultaneously, can all be provided with the multilayer circuit network on shell body 3 and bottom base plate 5, then connect through pin 1, have realized the electrical connection that two casings were built, and the inner wall that realizes the inclosed space all is a circuit structure, great saving the space, can realize placing in electron device's the solid.
Pin 1 is provided with sealing ring 2 with the through-hole department of shell body 3, and sealing ring 2 welds the sealing ring for the pad for sealed, and sealing ring 2 sets up around the through-hole, and during the welding sealing ring, arrange the product in under the nitrogen atmosphere, the melting solder welds pin 1 and the sealing ring on the pad of shell body 3's through-hole side together and fills up the clearance and realizes sealing.
In the embodiment of the invention, the inner side and the outer side of the outer shell 3 are both provided with a plurality of layers of shell circuit networks, the shell circuit networks are electrically connected with the pins 1, the areas of the front surface and the back surface of the outer shell 3 are utilized, the device assembly density of a product is increased, and the integrated multilayer assembly of the outer shell 3 is realized. The outside of shell body 3 sets up sealed painting and carries out outer insulation and sealing protection to the circuit, through as a circuit substrate to shell body 3, realizes that the same volume can hold more complicated more multielement device and gets the circuit design. The joint of the outer shell 3 and the bottom substrate 5 is hermetically welded together by adopting a welding process, wherein the welding process is gold tin welding, parallel seam welding or laser welding. The sealing performance of the connecting part is better through gold-tin welding, parallel seam welding or laser welding.
In the embodiment of the invention, the number of the pins 1 is a plurality, the pins 1 comprise power pins and signal pins, the power pins are thicker than the signal pins, and the pins 1 are pin pins. The outside four corners department of shell body 3 is provided with fixed foot 4, and fixed foot 4 sets up with shell body 3 is integrative. The fixing pin 4 is mainly used for fixing the equipment, and the pin 1 is used for connecting input and output signals. The pin 1 is mainly used for signal input or output inside the device, is also connected with a power line and the like, and can be connected with an external circuit module to realize internal sealing.
The assembly process of the sealed shell comprises the following steps: the method comprises the steps of assembling components and pins 2 on a bottom base plate 5 in a welding mode and connecting the components and the pins together, manufacturing an outer shell 3 into an integrated shell by adopting an HTC (high temperature welding) process, manufacturing a sealing bonding pad, a through hole and a through hole bonding pad on the shell, carrying out wiring on a plurality of layers, placing a device bonding pad, assembling the integrated shell, firstly welding a sealing ring by adopting a welding flux or welding the sealing ring on the sealing bonding pad, then assembling and connecting the device, sleeving the assembled bottom base plate 5 into the integrated shell, firstly adopting the processes of soldering tin welding, laser welding or parallel seam welding to integrate the bottom base plate 5 with the sealing bonding pad or the sealing ring of the integrated shell and guarantee the sealing performance, and then adopting the processes of soldering tin welding or laser welding to weld the pins 1 and the sealing ring 2 in a nitrogen environment and guarantee the air tightness.
Example 2:
an integrated multilayer fully-sealed shell is shown in figures 3-4 and comprises a pin 1, a shell body 3 and a bottom base plate 5, wherein a circuit network is arranged on the bottom base plate 5, components are welded on the upper surface of the bottom base plate 5, the pin 1 is arranged above the bottom base plate 5 and electrically connected with the circuit network, the shell body 3 covers the bottom base plate 5 and is hermetically arranged with the bottom base plate 5, a through hole corresponding to the pin 1 is formed in the top end of the shell body 3, the pin 1 extends out of the shell body 3, and the pin 1 is hermetically arranged with the shell body 3. The shell body 3 comprises a cover plate substrate 6, a sealing ring 7 and a shell frame 8, the shell frame 8 is arranged on four sides of the bottom substrate 5, the joint is arranged in a sealing mode, the cover plate substrate 6 covers the top end of the shell frame 8, the sealing ring 7 is arranged on the joint of the cover plate substrate 6 and the shell frame 8 and arranged in a sealing mode, a plurality of layers of substrate circuit networks are arranged on the upper side and the lower side of the cover plate substrate 6, the substrate circuit networks are electrically connected with the pins 1, the areas of the front side and the back side of the cover plate substrate 6 are utilized, the device assembly density of a product is increased, and integrated multilayer assembly of the cover plate substrate 6 is achieved. The cover plate substrate 6 is made of a thick film substrate, a plurality of HTCC (high temperature co-fired ceramic) substrates or a ceramic copper-clad substrate, and continuous welding pads for sealing are designed around the cover plate substrate 6 and used for being directly welded with the shell frame 8 to seal or welded with a sealing ring on the shell frame through a parallel seam welding process to seal.
The difference between the structure and the embodiment 1 is that the outer shell 3 is arranged into two parts, so that the processes of welding electronic components and mounting are more convenient, the efficiency is higher, but the processes are more in the mounting seal, and the realized effect is also good.
The general circuit network setting of this structure just can not set up the circuit network on apron base plate 6, also can set up, just can only weld by the manual work when welding electronic components, but only when apron base plate 6 sets up the circuit network, all directly use when apron base plate 6 and bottom base plate 5 open the board and electronic components welds to produce the line and weld, and machining efficiency is higher.
The assembly engineering of the sealing shell is as follows: the method comprises the steps of welding and assembling components and pins 2 on a bottom substrate 5, assembling and connecting the bottom substrate 5 and a shell frame 8 together, manufacturing a cover plate substrate 6 by adopting a thick film substrate and a plurality of layers of HTCC substrates or ceramic copper-clad substrate materials, designing a sealing plate and a through hole on the cover plate substrate 6, wherein the sealing plate is a sealing pad or welding a sealing ring on the sealing pad, the side edge of the through hole is provided with a through hole pad, welding a sealing ring on the pad, assembling and connecting devices on the front side and the back side of the cover plate substrate 6, sleeving the cover plate substrate 6 into the shell frame 8 assembled with the bottom substrate 5, firstly completing the connection of the sealing pad or the sealing ring 7 on the outer ring of the cover plate substrate 6 and the shell frame 8, adopting soldering tin welding, laser welding or parallel seam welding processes to ensure the air tightness of the welding seam between the sealing ring 7 and the shell frame 8, baking a welded product to remove water vapor, welding the pins 1 and the sealing ring 2 under a nitrogen environment, and adopting soldering tin welding or laser welding processes to ensure the air tightness between the pins 1 and the sealing ring 2.
The structure utilizes the front and back surfaces of the cover plate substrate to assemble devices under the condition of not influencing the size of the box body, thereby realizing the maximization of space utilization.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that those skilled in the art can make various improvements and modifications without departing from the principle of the present invention, and these improvements and modifications should also be construed as the protection scope of the present invention.
Claims (10)
1. The utility model provides an integration multilayer totally enclosed shell which characterized in that: including pin (1), shell body (3) and bottom base plate (5), be provided with the circuit network on bottom base plate (5), the upper surface welding of bottom base plate (5) is equipped with components and parts, pin (1) set up the top at bottom base plate (5), and with circuit network electrical connection, shell body (3) lid closes on bottom base plate (5), and with bottom base plate (5) sealed setting, the top of shell body (3) is provided with the through-hole corresponding with pin (1), the outside of shell body (3) is stretched out in pin (1), pin (1) and shell body (3) sealed setting.
2. The integrated multilayer hermetically sealed housing of claim 1, wherein: through-hole department of pin (1) and shell body (3) is provided with sealing ring (2), and sealing ring (2) welds the sealing ring for the pad for it is sealed, around sealing ring (2) set up the through-hole, when welding the sealing ring, arrange the product in under the nitrogen atmosphere, the sealing ring that melts the solder on with the pad of the through-hole side of pin (1) and shell body (3) welds together and fills up the clearance and realizes sealing.
3. The integrated multilayer hermetically sealed housing of claim 1, wherein: the inner side and the outer side of the outer shell (3) are provided with a plurality of layers of shell circuit networks, the shell circuit networks are electrically connected with the pins (1), the areas of the front side and the back side of the outer shell (3) are utilized, the device assembly density of a product is increased, and the integrated multilayer assembly of the outer shell (3) is realized.
4. The integrated multilayer hermetically sealed housing of claim 1, wherein: the joint of the outer shell (3) and the bottom substrate (5) is hermetically welded together by adopting a welding process, and the welding process is gold-tin welding, parallel seam welding or laser welding.
5. The integrated multilayer hermetically sealed housing of claim 1, wherein: the number of the pins (1) is a plurality, the pins (1) comprise power pins and signal pins, the power pins are thicker than the signal pins, and the pins (1) are pin pins.
6. The integrated multilayer hermetically sealed housing of claim 1, wherein: the outer four corners of the outer shell (3) are provided with fixing feet (4), and the fixing feet (4) and the outer shell (3) are integrally arranged.
7. An integrated multi-layer hermetically sealed housing in accordance with any of claims 1 to 6, wherein: the assembly process of the sealed shell comprises the following steps: the method comprises the steps of assembling components and pins (2) on a bottom substrate (5) in a welding mode and connecting the components and the pins together, manufacturing an outer shell (3) into an integrated shell by adopting an HTCC process, manufacturing a sealing pad, a through hole and a through hole pad on the shell, carrying out wiring on a plurality of layers, placing a device pad, assembling the integrated shell, firstly welding a sealing ring by adopting a welding flux or welding the sealing ring on the sealing pad, then assembling and connecting the devices, sleeving the assembled bottom substrate (5) into the integrated shell, firstly adopting the processes of soldering tin welding, laser welding or parallel seam welding to integrate the bottom substrate (5) with the sealing pad or the sealing ring of the integrated shell and guarantee the sealing property, and then adopting the processes of soldering tin welding or laser welding to weld the pins (1) and the sealing ring (2) in a nitrogen environment and guarantee the air tightness.
8. The integrated multilayer hermetically sealed housing of claim 1, wherein: the shell body (3) comprises a cover plate substrate (6), a sealing ring (7) and a shell frame (8), the shell frame (8) is arranged on four sides of the bottom substrate (5), the joint is arranged in a sealing mode, the cover plate substrate (6) covers the top end of the shell frame (8), the sealing ring (7) is arranged on the joint of the cover plate substrate (6) and the shell frame (8) and is arranged in a sealing mode, a plurality of layers of substrate circuit networks are arranged on the upper side and the lower side of the cover plate substrate (6), the substrate circuit networks are electrically connected with the pins (1), the areas of the front side and the back side of the cover plate substrate (6) are utilized, the device assembly density of a product is increased, and integrated multilayer assembly of the cover plate substrate (6) is realized.
9. The integrated multilayer hermetically sealed housing of claim 8, wherein: the cover plate substrate (6) is made of a thick film substrate, a plurality of HTCC (high temperature capacitor) layers of substrates or a ceramic copper-clad substrate, and continuous welding pads for sealing are designed around the cover plate substrate (6) and used for directly welding and sealing with the shell frame (8) or welding a sealing ring on the shell frame to seal through a parallel seam welding process.
10. An integrated multi-layer hermetically sealed housing according to any of claims 8 to 9, wherein: the assembly engineering of the sealing shell is as follows: the method comprises the steps of assembling components and pins (2) on a bottom substrate (5) in a welding mode, assembling and connecting the bottom substrate (5) and a shell frame (8) together, manufacturing a cover plate substrate (6) by adopting a thick film substrate and a plurality of layers of HTCC substrates or ceramic copper-clad substrate materials, designing a sealing plate and a through hole on the cover plate substrate (6), welding a sealing ring on the sealing plate or the sealing ring on the sealing plate, designing a through hole pad on the side edge of the through hole, welding a sealing ring on the pad, assembling and connecting devices on the front side and the back side of the cover plate substrate (6), sleeving the cover plate substrate (6) into the shell frame (8) assembled with the bottom substrate (5), firstly completing the connection of the sealing plate or the sealing ring (7) on the outer ring of the cover plate substrate (6) and the shell frame (8), adopting a soldering tin welding, laser welding or parallel seam welding process to ensure the airtightness of a welding seam between the sealing ring (7) and the shell frame (8), baking a welded product after removing water vapor, and performing the welding of the pins (1) and the sealing ring (2) in a nitrogen environment, and adopting the soldering tin welding or laser welding process to ensure the airtightness of the pins (1) and the sealing ring (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211677971.0A CN115955802A (en) | 2022-12-26 | 2022-12-26 | Integrated multilayer full-sealed shell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211677971.0A CN115955802A (en) | 2022-12-26 | 2022-12-26 | Integrated multilayer full-sealed shell |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115955802A true CN115955802A (en) | 2023-04-11 |
Family
ID=87297722
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211677971.0A Pending CN115955802A (en) | 2022-12-26 | 2022-12-26 | Integrated multilayer full-sealed shell |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115955802A (en) |
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2022
- 2022-12-26 CN CN202211677971.0A patent/CN115955802A/en active Pending
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