CN115946026A - Polishing head, polishing apparatus, and polishing method - Google Patents
Polishing head, polishing apparatus, and polishing method Download PDFInfo
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- CN115946026A CN115946026A CN202211728960.0A CN202211728960A CN115946026A CN 115946026 A CN115946026 A CN 115946026A CN 202211728960 A CN202211728960 A CN 202211728960A CN 115946026 A CN115946026 A CN 115946026A
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
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Abstract
The application provides a burnishing head, burnishing device and polishing method for installation is polished the work piece, and the burnishing head is used for installing by polished the work piece, includes: rubbing head body and piezoceramics, piezoceramics install in the rubbing head body, piezoceramics is used for being connected so that the rubbing head vibrates with ultrasonic generator. The distance between the piezoelectric ceramic and the polished workpiece arranged on the polishing head is effectively reduced, so that the power loss of the vibration generated by the piezoelectric ceramic in the process of transmitting the vibration to the polished workpiece is reduced, the amplitude of the polished workpiece is relatively large when the polished workpiece is polished, and the aim of obtaining a better polishing effect is finally fulfilled; and moreover, the power loss of the vibration generated by the piezoelectric ceramic in the process of transmitting the vibration to the polished workpiece is reduced, and the polished workpiece can obtain higher vibration frequency during polishing, so that a better polishing effect is obtained.
Description
Technical Field
The application relates to the technical field of semiconductor processing and manufacturing, in particular to a polishing head, a polishing device and a polishing method.
Background
Because the roughness of a semiconductor workpiece polished by the traditional chemical mechanical polishing method is limited and cannot completely meet the requirements of subsequent production, the ultrasonic-assisted chemical mechanical polishing method is gradually applied, and compared with the traditional chemical mechanical polishing technology, the ultrasonic-assisted chemical mechanical polishing method has the advantages that due to the introduction of ultrasonic vibration, the temperature of a polishing liquid is increased, and abrasive particles are accelerated to impact the workpiece, so that the workpiece can obtain higher removal rate and lower roughness. The conventional ultrasonic-assisted chemical mechanical polishing device generally installs piezoelectric ceramics for generating a vibration effect on the upper surface of a polishing head, but the piezoelectric ceramics are far away from a workpiece to be polished, the power loss of the vibration is large in the process of transmitting the vibration to the workpiece to be polished, the amplitude of the workpiece to be polished is relatively small when the workpiece to be polished is polished, and the polishing effect is adversely affected.
Disclosure of Invention
In view of the above, embodiments of the present application provide a polishing head, a polishing apparatus, and a polishing method, so as to obviate or mitigate one or more of the disadvantages in the related art.
One aspect of the present application provides a polishing head comprising:
the polishing head comprises a polishing head body and piezoelectric ceramics, the piezoelectric ceramics are arranged in the polishing head body, and the piezoelectric ceramics are used for being connected with an ultrasonic generator to enable the polishing head to vibrate.
In some embodiments of the present application,
the polishing head body wraps the piezoelectric ceramic.
In some embodiments of the present application,
be formed with holding tank and work piece installation department on the burnishing head body, the orientation of the notch of holding tank deviates from the work piece installation department, piezoceramics detachable installs in the holding tank.
In some embodiments of the present application,
the polishing head comprises at least two piezoelectric ceramics, the polishing head body is disc-shaped, and the piezoelectric ceramics are uniformly distributed on the circumferential direction of the polishing head.
In some embodiments of the present application,
at least one piezoelectric ceramic is axial vibration piezoelectric ceramic, at least one piezoelectric ceramic is radial vibration piezoelectric ceramic, the axial vibration piezoelectric ceramic is used for generating vibration in the axial direction of the polishing head, and the radial vibration piezoelectric ceramic is used for generating vibration in the radial direction of the polishing head.
In some embodiments of the present application,
the polishing head comprises an even number of the piezoelectric ceramics, wherein half of the piezoelectric ceramics are the axial vibration piezoelectric ceramics, the other half of the piezoelectric ceramics are the radial vibration piezoelectric ceramics, the axial vibration piezoelectric ceramics and the radial vibration piezoelectric ceramics are arranged in a staggered mode in the circumferential direction of the polishing head, and the even number is larger than or equal to 4.
In some embodiments of the present application,
only one radial vibration piezoelectric ceramic is arranged between two adjacent axial vibration piezoelectric ceramics in the circumferential direction of the polishing head, and only one axial vibration piezoelectric ceramic is arranged between two adjacent radial vibration piezoelectric ceramics.
In some embodiments of the present application,
and a workpiece mounting part is formed on the polishing head body and is used for being connected with a vacuum pump to adsorb a polished workpiece.
Another aspect of the present application also provides a polishing apparatus, including:
rotate driving piece, main shaft, anodal carbon brush, negative pole carbon brush, anodal conducting ring, negative pole conducting ring, ultrasonic generator and as aforementioned embodiment the burnishing head, anodal conducting ring with the negative pole conducting ring is all fixed on the main shaft, anodal carbon brush with the negative pole carbon brush all is connected with ultrasonic generator, anodal carbon brush with anodal conducting ring contact, the negative pole carbon brush with the negative pole conducting ring contact, the burnishing head is fixed in the main shaft, rotate the driving piece with main shaft drive connects, piezoceramics with anodal conducting ring with the equal electricity of negative pole conducting ring is connected.
Another aspect of the present application also provides a polishing method comprising:
connecting a vacuum device with a vacuum pump externally, opening the vacuum pump, adsorbing a workpiece on a polishing head, closing the vacuum pump, and disconnecting the workpiece from the polishing head;
starting a machine table, dropping the polishing head to be in contact with a polishing pad on a polishing disc, selecting a machine table polishing program, setting relevant parameters, starting the machine table polishing program, and conveying polishing liquid to enable the polishing head and the polishing disc to start to rotate;
starting an ultrasonic generator to transmit an electric signal into piezoelectric ceramics so that the piezoelectric ceramics convert the electric signal into a mechanical vibration signal, and enabling a polishing head to transmit the mechanical vibration signal to the workpiece to realize ultrasonic-assisted chemical mechanical polishing;
and after the polishing is finished, the transmission of polishing liquid and the rotation of the polishing head and the polishing disk are automatically closed based on the polishing program of the machine table, the ultrasonic generator is manually closed, the vacuum device is opened, and the workpiece is taken down to finish the processing.
According to the polishing head, the polishing device and the polishing method, the piezoelectric ceramics are arranged in the polishing head body, compared with the prior art that the piezoelectric ceramics are arranged on the upper surface of the polishing head body, the distance between the piezoelectric ceramics and a polished workpiece arranged on the polishing head is effectively reduced, the power loss of vibration generated by the piezoelectric ceramics in the process of transmitting the vibration to the polished workpiece is further reduced, the amplitude of the polished workpiece is relatively large when the polished workpiece is polished, and the purpose of obtaining a better polishing effect is finally achieved; and moreover, the power loss of the vibration generated by the piezoelectric ceramic in the process of transmitting the vibration to the polished workpiece is reduced, and the polished workpiece can obtain higher vibration frequency during polishing, so that a better polishing effect is obtained.
Additional advantages, objects, and features of the application will be set forth in part in the description which follows and in part will become apparent to those having ordinary skill in the art upon examination of the following or may be learned from practice of the application. The objectives and other advantages of the application may be realized and attained by the structure particularly pointed out in the written description and drawings.
It will be appreciated by those skilled in the art that the objects and advantages that can be achieved with the present application are not limited to the specific details set forth above, and that these and other objects that can be achieved with the present application will be more clearly understood from the detailed description that follows.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application, are incorporated in and constitute a part of this application, and are not intended to limit the application. The components in the figures are not necessarily to scale, emphasis instead being placed upon illustrating the principles of the application. For purposes of illustrating and describing certain portions of the present application, the drawings may have been enlarged, i.e., may be larger, relative to other features of the exemplary devices actually made in accordance with the present application. In the drawings:
fig. 1 is a schematic structural diagram of a polishing head according to an embodiment of the present disclosure.
Fig. 2 is a schematic structural view of a polishing head apparatus according to another embodiment of the present application.
FIG. 3 is a schematic flow chart of a polishing method according to another embodiment of the present application.
Detailed Description
To make the objects, technical solutions and advantages of the present application more clearly understood, the present application is further described in detail below with reference to the following embodiments and the accompanying drawings. The exemplary embodiments and descriptions of the present application are provided to explain the present application and not to limit the present application.
Here, it should be further noted that, in order to avoid obscuring the present application with unnecessary details, only the structures and/or processing steps closely related to the scheme according to the present application are shown in the drawings, and other details not so relevant to the present application are omitted.
It should be emphasized that the term "comprises/comprising" when used herein, is taken to specify the presence of stated features, elements, steps or components, but does not preclude the presence or addition of one or more other features, elements, steps or components.
It is also noted herein that the term "coupled," if not specifically stated, may refer herein to not only a direct connection, but also an indirect connection in which an intermediate is present.
Hereinafter, embodiments of the present application will be described with reference to the accompanying drawings. In the drawings, the same reference numerals denote the same or similar parts, or the same or similar steps.
Fig. 1 is a schematic structural diagram of a polishing head according to an embodiment of the present application, as shown in fig. 1, which includes the following contents:
a polishing head is used for installing a workpiece to be polished and comprises a polishing head body 1 and piezoelectric ceramics 2, wherein the piezoelectric ceramics 2 are arranged in the polishing head body 1, and the piezoelectric ceramics 2 are used for being connected with an ultrasonic generator 8 to enable the polishing head to vibrate.
Specifically, the polishing head provided by the present application installs piezoelectric ceramic 2 inside its polishing head body 1, so that piezoelectric ceramic is connected with ultrasonic generator 8 in fig. 2, so that piezoelectric ceramic converts the electrical signal generated by ultrasonic generator 8 into a mechanical vibration signal to generate vibration.
According to the polishing head provided by the application, the piezoelectric ceramics are arranged in the polishing head body 1, compared with the prior art that the piezoelectric ceramics 2 are arranged on the upper surface of the polishing head body 1, the distance between the piezoelectric ceramics 2 and a polished workpiece 4 arranged on the polishing head is effectively reduced, the power loss of the vibration generated by the piezoelectric ceramics 2 in the process of being transmitted to the polished workpiece 4 is further reduced, the amplitude of the polished workpiece 4 is relatively large when the polished workpiece 4 is polished, and the purpose of obtaining a better polishing effect is finally achieved; moreover, the power loss of the vibration generated by the piezoelectric ceramic 2 in the process of being transmitted to the polished workpiece 4 is reduced, and the polished workpiece 4 can obtain higher vibration frequency during polishing, so that a better polishing effect is obtained.
In some embodiments of the present application,
the polishing head body 1 wraps the piezoelectric ceramic 2.
Specifically, the polishing head body 1 encases the piezoelectric ceramics 2 within itself so as to maximize the use of vibration, and the piezoelectric ceramics are not always exposed to the outside.
In some embodiments of the present application,
be formed with holding tank and work piece installation department on the burnishing head body 1, the orientation of the notch of holding tank deviates from the work piece installation department, piezoceramics detachable installs in the holding tank.
Specifically, polishing head body 1 is through installing piezoceramics 2 detachable in the holding tank, and the orientation of the notch of holding tank deviates from the work piece installation department on the polishing head body, the piezoceramics's of being convenient for dismouting.
In some embodiments of the present application,
the polishing head comprises at least two piezoelectric ceramics 2, the polishing head body 1 is disc-shaped, and the piezoelectric ceramics are uniformly distributed in the circumferential direction of the polishing head.
Specifically, the polishing head includes two piezoceramics 2 at least, and polishing head body 1 is discoid, and piezoceramics 2 evenly distributed in the circumference of polishing head makes polishing effect better through increasing 2 quantity of piezoceramics.
In some embodiments of the present application,
at least one piezoelectric ceramic 2 is an axial vibration piezoelectric ceramic, and at least one piezoelectric ceramic 2 is a radial vibration piezoelectric ceramic, the axial vibration piezoelectric ceramic is used for generating vibration in the axial direction of the polishing head, and the radial vibration piezoelectric ceramic is used for generating vibration in the radial direction of the polishing head.
Specifically, there is at least one piezoelectric ceramic 2 which is a radial vibration piezoelectric ceramic, and vibration in the radial direction of the polishing head is generated by the lateral effect vibrator according to the inverse piezoelectric effect. Meanwhile, at least one piezoelectric ceramic 2 is an axial vibration piezoelectric ceramic, the vibration in the axial direction of the polishing head is generated through a transverse effect vibrator according to the inverse piezoelectric effect, the polishing effect is improved through the vibration in various directions, and the polishing effect is improved through the vibration in various directions.
In some embodiments of the present application,
the polishing head comprises an even number of the piezoelectric ceramics 2, wherein half of the piezoelectric ceramics 2 are the axial vibration piezoelectric ceramics, the other half of the piezoelectric ceramics are the radial vibration piezoelectric ceramics, the axial vibration piezoelectric ceramics and the radial vibration piezoelectric ceramics are arranged in a staggered mode in the circumferential direction of the polishing head, and the even number is larger than or equal to 4.
Specifically, in order to make the different vibration directions uniformly distributed, the polishing head includes an even number of piezoelectric ceramics 2, wherein half of the piezoelectric ceramics 2 are axial vibration piezoelectric ceramics, and the other half of the piezoelectric ceramics are radial vibration piezoelectric ceramics, and each axial vibration piezoelectric ceramics and each radial vibration piezoelectric ceramics are staggered in the circumferential direction of the polishing head, so that the even number of the piezoelectric ceramics 2 is greater than or equal to 4, so as to make the different vibration directions uniformly distributed.
In some embodiments of the present application,
only one radial vibration piezoelectric ceramic is arranged between two adjacent axial vibration piezoelectric ceramics in the circumferential direction of the polishing head, and only one axial vibration piezoelectric ceramic is arranged between two adjacent radial vibration piezoelectric ceramics.
Specifically, only one radial vibration piezoelectric ceramic is disposed between two adjacent axial vibration piezoelectric ceramics in the circumferential direction of the polishing head, and only one axial vibration piezoelectric ceramic is disposed between two adjacent radial vibration piezoelectric ceramics, in which case six piezoelectric ceramics 2 may be disposed to be sequentially staggered. Meanwhile, two radial vibration piezoelectric ceramics can be arranged between two adjacent axial vibration piezoelectric ceramics in the circumferential direction of the polishing head, and two axial vibration piezoelectric ceramics are arranged between the two adjacent axial vibration piezoelectric ceramics, so that the vibration uniformity is better.
In some embodiments of the present application,
a workpiece mounting portion for connecting with a vacuum pump to adsorb a workpiece 4 to be polished is formed on the polishing head body 1.
Specifically, include the work piece installation department on the burnishing head body, work piece installation department and vacuum pump connection open the vacuum pump and can adsorb the polished workpiece on burnishing head body 1, be convenient for by 4 dismouting of polished workpiece.
Another aspect of the present application also provides a polishing apparatus, as shown in fig. 2, including:
rotation driving piece, main shaft 5, anodal carbon brush 7, negative pole carbon brush 10, servo motor 11, anodal conducting ring 6, negative pole conducting ring 9, ultrasonic generator 8 and as aforementioned embodiment burnishing head 1, anodal conducting ring 6 with negative pole conducting ring 9 is all fixed on the main shaft 5, anodal carbon brush 7 with negative pole carbon brush 10 all is connected with ultrasonic generator 8, anodal carbon brush 7 with anodal conducting ring 6 contacts, negative pole carbon brush 10 with negative pole conducting ring 9 contacts, burnishing head 1 is fixed in main shaft 5, rotation driving piece with main shaft 5 transmission is connected, piezoceramics 2 with anodal conducting ring 6 with negative pole conducting ring 9 is all connected electrically.
Specifically, the polishing head 1 is fixed on a spindle 5, the positive conducting ring 6 and the negative conducting ring 9 are both fixed on the spindle 5, the rotation driving member is in transmission connection with the spindle 5, the servo motor 11 is connected with the spindle 5, the piezoelectric ceramic 2 is electrically connected with the positive conducting ring 6 and the negative conducting ring 9, the positive carbon brush 7 is in contact with the positive conducting ring 6, the negative carbon brush 10 is in contact with the negative conducting ring 9, and the positive carbon brush 7 and the negative carbon brush 10 are both connected with the ultrasonic generator 8.
The third aspect of the present application also provides a polishing method, as shown in fig. 3, comprising:
step 110: connecting a vacuum device with a vacuum pump, starting the vacuum pump, adsorbing a workpiece on a polishing head, closing the vacuum pump, and disconnecting the workpiece from the polishing head;
step 120: starting a machine table, dropping the polishing head to be in contact with a polishing pad on a polishing disc, selecting a machine table polishing program, setting relevant parameters, starting the machine table polishing program, and conveying polishing liquid to enable the polishing head and the polishing disc to start to rotate;
step 130: starting an ultrasonic generator to transmit an electric signal into piezoelectric ceramics so that the piezoelectric ceramics convert the electric signal into a mechanical vibration signal, and enabling a polishing head to transmit the mechanical vibration signal to the workpiece to realize ultrasonic-assisted chemical mechanical polishing;
step 140: and after the polishing is finished, the transmission of polishing liquid and the rotation of the polishing head and the polishing disk are automatically closed based on the polishing program of the machine table, the ultrasonic generator is manually closed, the vacuum device is opened, and the workpiece is taken down to finish the processing.
Specifically, the vacuum device is externally connected with a vacuum pump, the vacuum pump is turned on, the workpiece is adsorbed on the polishing head, then the vacuum pump is turned off, and the workpiece is disconnected from the polishing head; starting a machine table, enabling a polishing head to fall down to be in contact with a polishing pad on a polishing disc, selecting a machine table polishing program, setting pressure, rotating speed, polishing solution flow and the like, starting the program, conveying the polishing solution, and enabling the polishing head and the polishing disc to start to rotate; simultaneously starting an ultrasonic generator, connecting an ultrasonic electrical signal to positive and negative binding posts of piezoelectric ceramics through a lead, a carbon brush and a conductive slip ring, converting the electrical signal into a mechanical vibration signal by the piezoelectric ceramics, and transmitting the ultrasonic vibration to a workpiece adsorbed on the piezoelectric ceramics through a polishing head to realize ultrasonic-assisted chemical mechanical polishing; and when the machining is finished, the transmission of the polishing solution and the rotation of the polishing head and the polishing disk are automatically closed based on the machine program, the ultrasonic generator is manually closed, the vacuum device is opened, and the workpiece is taken down to finish the machining.
Those of ordinary skill in the art will appreciate that the various illustrative components, systems, and methods described in connection with the embodiments disclosed herein may be implemented as hardware, software, or combinations of both. Whether this is done in hardware or software depends upon the particular application and design constraints imposed on the solution. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application. When implemented in hardware, it may be, for example, an electronic circuit, an Application Specific Integrated Circuit (ASIC), suitable firmware, plug-in, function card, or the like. When implemented in software, the elements of the present application are the programs or code segments used to perform the required tasks. The program or code segments may be stored in a machine-readable medium or transmitted by a data signal carried in a carrier wave over a transmission medium or a communication link.
It is to be understood that the present application is not limited to the particular arrangements and instrumentality described above and shown in the attached drawings. A detailed description of known methods is omitted herein for the sake of brevity. In the above embodiments, several specific steps are described and shown as examples. However, the device process of ultrasonically assisted chemical mechanical polishing of the present application is not limited to the specific steps described and illustrated, and those skilled in the art can make various changes, modifications and additions, or change the order between the steps, after appreciating the spirit of the present application.
Features that are described and/or illustrated with respect to one embodiment may be used in the same way or in a similar way in one or more other embodiments and/or in combination with or instead of the features of the other embodiments.
The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made to the embodiment of the present application by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims (10)
1. A polishing head is used for installing a workpiece to be polished, and is characterized by comprising a polishing head body and piezoelectric ceramics, wherein the piezoelectric ceramics are arranged in the polishing head body, and the piezoelectric ceramics are used for being connected with an ultrasonic generator to enable the polishing head to vibrate.
2. The polishing head as set forth in claim 1 wherein the polishing head body encases the piezoelectric ceramic.
3. The polishing head according to claim 1, wherein a holding groove and a workpiece mounting portion are formed on the polishing head body, a notch of the holding groove faces away from the workpiece mounting portion, and the piezoelectric ceramic is detachably mounted in the holding groove.
4. The polishing head according to claim 2, wherein the polishing head comprises at least two piezoelectric ceramics, the polishing head body has a disk shape, and each of the piezoelectric ceramics is uniformly distributed in a circumferential direction of the polishing head.
5. The polishing head as set forth in claim 4 wherein at least one of the piezoelectric ceramics is an axially vibrating piezoelectric ceramic and at least one of the piezoelectric ceramics is a radially vibrating piezoelectric ceramic, the axially vibrating piezoelectric ceramic being adapted to generate vibration in the axial direction of the polishing head, the radially vibrating piezoelectric ceramic being adapted to generate vibration in the radial direction of the polishing head.
6. The polishing head as set forth in claim 5 wherein the polishing head comprises an even number of the piezoelectric ceramics, half of the number of the piezoelectric ceramics being the axial vibration piezoelectric ceramics and the other half of the number of the piezoelectric ceramics being the radial vibration piezoelectric ceramics, each of the axial vibration piezoelectric ceramics being staggered with each of the radial vibration piezoelectric ceramics in a circumferential direction of the polishing head, the even number being greater than or equal to 4.
7. The polishing head according to claim 6, wherein only one of the radial vibration piezoelectric ceramics is disposed between two adjacent axial vibration piezoelectric ceramics in a circumferential direction of the polishing head, and only one of the axial vibration piezoelectric ceramics is disposed between two adjacent axial vibration piezoelectric ceramics.
8. The polishing head according to any one of claims 1 to 7, wherein a workpiece mounting portion for connection to a vacuum pump to suck the workpiece to be polished is formed on the polishing head body.
9. A polishing device, comprising a rotation driving member, a spindle, an anode carbon brush, a cathode carbon brush, an anode conductive ring, a cathode conductive ring, an ultrasonic generator and the polishing head as claimed in any one of claims 1 to 8, wherein the anode conductive ring and the cathode conductive ring are fixed on the spindle, the anode carbon brush and the cathode carbon brush are connected with the ultrasonic generator, the anode carbon brush is in contact with the anode conductive ring, the cathode carbon brush is in contact with the cathode conductive ring, the polishing head is fixed on the spindle, the rotation driving member is in transmission connection with the spindle, and the piezoelectric ceramic is in electrical connection with the anode conductive ring and the cathode conductive ring.
10. A method of polishing a substrate, characterized in that,
connecting a vacuum device with a vacuum pump externally, opening the vacuum pump, adsorbing a workpiece on a polishing head, closing the vacuum pump, and disconnecting the workpiece from the polishing head;
starting a machine table, enabling the polishing head to fall down to be in contact with a polishing pad on a polishing disc, selecting a machine table polishing program, setting relevant parameters, starting the machine table polishing program, and conveying polishing liquid to enable the polishing head and the polishing disc to start to rotate;
starting an ultrasonic generator to transmit an electric signal into piezoelectric ceramics so that the piezoelectric ceramics convert the electric signal into a mechanical vibration signal, and enabling a polishing head to transmit the mechanical vibration signal to the workpiece to realize ultrasonic-assisted chemical mechanical polishing;
and after the polishing is finished, automatically closing the transmission of the polishing solution and the rotation of the polishing head and the polishing disk based on the polishing program of the machine table, manually closing the ultrasonic generator, opening the vacuum device and taking down the workpiece to finish the processing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211728960.0A CN115946026A (en) | 2022-12-30 | 2022-12-30 | Polishing head, polishing apparatus, and polishing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211728960.0A CN115946026A (en) | 2022-12-30 | 2022-12-30 | Polishing head, polishing apparatus, and polishing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115946026A true CN115946026A (en) | 2023-04-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211728960.0A Pending CN115946026A (en) | 2022-12-30 | 2022-12-30 | Polishing head, polishing apparatus, and polishing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115946026A (en) |
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2022
- 2022-12-30 CN CN202211728960.0A patent/CN115946026A/en active Pending
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