CN115945793A

CN115945793A - PCD diamond compact surface grinding method and laser grinding device

Info

Publication number: CN115945793A
Application number: CN202111167417.3A
Authority: CN
Inventors: 吴喜泉
Original assignee: Suzhou Gaoyi Laser Technology Co ltd
Current assignee: Suzhou Gaoyi Laser Technology Co ltd
Priority date: 2021-10-07
Filing date: 2021-10-07
Publication date: 2023-04-11

Abstract

The application discloses a PCD diamond compact surface grinding method and a laser grinding device. The laser grinding device is characterized by comprising a frame body and a laser grinding module arranged in the frame body, wherein the laser grinding module comprises: the utility model discloses a diamond compact grinding machine, including drive division, the base is located to one side of drive division, the base side of keeping away from of drive division disposes the objective table, the diamond compact that treats grinding is placed to the objective table more than, dispose the support on the base, one side of support disposes Z to moving the subassembly Z connects the curb plate to moving the subassembly, dispose detection module on the curb plate, detection module is used for the information in the sampling diamond compact course of working. The grinding method can be used for the occasions of planes and non-planes, and the precise grinding of a specified shape can be realized by controlling the processing height or the processing linear speed.

Description

PCD diamond compact surface grinding method and laser grinding device

Technical Field

The application relates to the technical field of detection, in particular to a PCD diamond compact surface grinding method and a laser grinding device.

Background

Polycrystalline diamond (PCD) is widely used in high-speed cutting tools as a superhard material with high hardness, good wear resistance and stable chemical properties. Although polycrystalline diamond material has many excellent properties, it is difficult to form due to its high hardness and good wear resistance. Currently, grinding is performed according to specified parameters provided by a grinding client. In this way, the surface of the diamond compact can be substantially flat. However, in some cases, the surface of the tool to be ground has a certain curvature, for example, the central region slightly protrudes from the periphery, and then the tool is uniformly ground according to the conventional method, which does not meet the requirement and easily causes the defect of processing the workpiece.

Therefore, a method for grinding the surface of the PCD diamond is urgently needed.

Disclosure of Invention

In view of the above-described problems, it is an object of the present invention to provide a PCD diamond polishing method that can polish a surface having a curvature and can improve the polishing accuracy.

In order to achieve the purpose, the following technical scheme is adopted in the application:

a laser grinding apparatus, comprising:

a frame body, and a laser grinding module arranged in the frame body,

the laser grinding module comprises:

the drive part is provided with a Y-shaped moving assembly and an X-shaped moving assembly, one side of the drive part is fixed on the base, the side of the drive part, far away from the base, is provided with an objective table, the objective table is used for placing the diamond compact to be ground,

dispose the support on the base, one side of support disposes Z to removing the subassembly Z connects the curb plate to removing the subassembly, dispose detection module on the curb plate, detection module is used for sampling diamond compact piece.

Preferably, the stage comprises: the bottom plate, one side of bottom plate is fixed in on the X removes the subassembly, keeping away from of bottom plate one side that the X removed the subassembly disposes DD driver part, at least one joint portion is connected to DD driver part's output, joint portion is used for cliping the diamond compact piece.

Preferably, the clamping portion is provided with a concave portion, and the concave portion is used for placing the diamond compact.

The embodiment of the application provides a PCD diamond compact surface grinding method, which is characterized by comprising the laser grinding device, wherein the method comprises the following steps:

the control module controls the driving part based on the received preset threshold value,

adjusting the rotation speed of the DD drive part while the X-moving assembly and/or the Y-moving assembly move to adjust the rotation speed of the PCD diamond compact, irradiating the PCD diamond compact with light emitted by the laser emitting device to grind, or

And adjusting the Z moving assembly while the X moving assembly and/or the Y moving assembly move, and irradiating the PCD diamond compact with light emitted by the laser emitting device to grind.

Preferably, the PCD diamond compact surface grinding method further comprises:

based on the acousto-optic information of one or more detection modules in the process of continuously sampling and grinding the diamond compact, the sampled information is transmitted to the data processing module,

the data processing module is used for obtaining the processing condition of the PCD diamond compact to be ground through operation based on the received information and transmitting the information to the control module, and the control module is used for controlling the driving part or controlling the driving part and the Z moving assembly based on the received information and a preset threshold value. In the mode, the detection module is used for collecting sound (noise) in the laser processing process and flame at a processing position. The state of the surface of the current grinding position is judged according to the collected sound and/or light information, and then the control module controls the driving part or controls the driving part and the Z-shaped moving assembly, so that the processing efficiency is improved.

Preferably, the method for lapping the surface of the PCD diamond compact is characterized by further comprising:

based on the detection module, the associated acousto-optic information in the grinding process of the diamond composite sheet is sampled, the sampled information is transmitted to the data processing module,

the data processing module is operated based on the received information to obtain the grinding condition of the ground PCD diamond compact and transmits the surface information to the comparison and judgment module,

comparing the information received by the judging module with a preset threshold value,

if the grinding condition is satisfied, the part is normally ground,

if the grinding condition is not met, the grinding operation needs to be adjusted to continue grinding.

Preferably, the rotation speed of the PCD diamond compact when light emitted from the laser emitting device is irradiated at the central position of the PCD diamond compact is higher than that of the PCD diamond compact when the light is irradiated at the edge position of the PCD diamond compact based on the movement of the X moving assembly and/or the Y moving assembly.

Preferably, the light emitted from the laser emitting device is gradually reduced as the PCD diamond compact moves from a central position to an edge of the PCD diamond compact based on the movement of the X moving assembly and/or the Y moving assembly.

Preferably, the laser emitting device emits light, and the Z-moving assembly gradually moves upwards in the process that the edge position of the PCD diamond compact moves towards the center at the same time of the movement of the X-moving assembly and/or the Y-moving assembly until the grinding is finished.

Preferably, the surface grinding method of the PCD diamond compact is characterized in that,

and the detected grinding condition information and the preset threshold value information are displayed through the display module.

Has the beneficial effects that:

the grinding method of the diamond compact can be used in non-planar occasions, and accurate grinding is achieved by controlling machining distance or machining linear speed.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments are briefly introduced below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without inventive efforts, wherein:

fig. 1 is a schematic cross-sectional view of polycrystalline diamond according to an embodiment of the present disclosure;

FIG. 2 is a schematic structural diagram of a laser polishing apparatus according to an embodiment of the present application;

FIG. 3 is a schematic view of a laser polishing apparatus from a perspective view according to an embodiment of the present disclosure;

fig. 4 is a schematic view of polycrystalline diamond irradiated by light of a laser polishing apparatus according to an embodiment of the present disclosure.

Detailed Description

The above-described scheme is further illustrated below with reference to specific examples. It should be understood that these examples are for illustrative purposes and are not intended to limit the scope of the present application. The conditions employed in the examples may be further adjusted as determined by the particular manufacturer, and the conditions not specified are generally those used in routine experimentation.

The application discloses a grinding method of a PCD (Polycrystalline Diamond) Diamond compact. In particular to a method for grinding the surface of a diamond compact with radian by using a laser grinding device, which is simple to control. Specifically, the diamond compact (also referred to as diamond) is disposed on a stage during polishing, and is rotated at a constant speed by driving of a driving member.

The laser grinding apparatus-based grinding method proposed by the present application will be described below with reference to the accompanying drawings.

As shown in fig. 2 and 3, the laser polishing apparatus includes:

a laser polishing module 200 disposed in the frame,

the laser grinding module 200 includes:

a driving part 220, a stage 230 is disposed on the driving part 220,

the stage 230 is placed on the diamond compact 100 to be ground.

The driving part 220 includes:

a Y moving module 221 and an X moving module 222 stacked on the Y moving module 221, the Y moving module 221 is fixed on the base 202 through a connecting component 203,

a support 201 is disposed on the base 20, a Z-direction moving assembly 240 is disposed on one side of the support 201, one side of the Z-direction moving assembly 240 is connected to a side plate 210, a laser emitting device (not shown) is disposed on the side plate 210,

the laser emitting device operates to generate light 211, which light 211 is directed toward the diamond compact 100 to be ground.

The stage 230 includes: a base plate 231, one side of the base plate 231 being fixed to the X moving assembly 222,

the other side of the base plate 231 is provided with a DD driving part 232, the output end of the DD driving part 232 is connected with at least one clamping part 233, the clamping part 233 is provided with a concave part 234, and the concave part 234 is used for placing the diamond compact 100 to be ground. In the present embodiment, the X-moving unit 222 is stacked on the Y-moving unit 221, but in other embodiments, the stacking order may be reversed.

When the laser grinding device is operated, the grinding device is driven by the power supply,

the diamond compact to be ground is rotated based on the driving of DD driving part 232,

a control module (not shown) controls the driving part 220 to move based on a preset program,

the light 211 generated by the operation of the laser emitting device is directed to the surface of the diamond compact to be ground to grind the surface thereof.

The grinding method is described below in conjunction with figure 4,

in one embodiment, taking as an example that the light 211 (emitted by the laser emitting device operating) moves from the edge of the surface directed toward the diamond compact 100 to the center:

the driving based on the driving part drives the diamond compact 100 to move based on the movement of the X moving assembly and/or the Y moving assembly during operation, and at this time, the diamond compact does not move in the Z direction,

as the light moves from the edge of the surface (dashed light) to the center (solid light), the rotational speed of the diamond compact 100 gradually increases (V = ω r, where V is the linear velocity, ω is the angular velocity, and r is the distance from the center of rotation at the machining site). Thus, by adjusting the rotation speed of the diamond compact 100, the linear speed of a certain position is adjusted to adjust the time of the laser falling on the certain position (to realize adjustment of the grinding/etching time), and the surface of the diamond compact 100 after grinding has a certain radian (the middle is higher than the periphery), for example, the middle is higher than the edge 5 filaments.

As a variation of the above embodiment, the rotation speed of the diamond compact 100 gradually decreases as the light moves from the center of the surface (solid line light) to the edge (dotted line light).

As a variation of the above embodiment, in one embodiment, when the laser polishing apparatus is operated, the diamond compact 100 is moved based on the movement of the X-moving unit and/or the Y-moving unit, and then fine adjustment is performed in the Z direction, and fine adjustment is performed in the Z direction while light (light beam emitted by the laser emitting apparatus) moves from the edge of the surface (dotted line light) to the center (solid line light) (see fig. 4). The time of laser falling on a certain position is adjusted (the time of laser ablation on a certain position is adjusted, the mechanism of laser ablation is as follows, firstly, SP3 bond in diamond is broken to form SP2 bond, thereby changing into graphite phase, along with the improvement of laser energy density, the phase change mainly of graphitization is gradually changed into gas material removal, and the purpose of grinding is realized), and the surface of the ground diamond composite sheet 100 has a certain radian (for example, the middle is higher than 5 wires on the periphery).

In one embodiment, the laser grinding apparatus is further provided with a detection module (e.g., a laser range finder), which is used to sample surface information of the diamond compact 100 to be ground,

the sampled information is transmitted to a data processing module, the data processing module is operated based on the received information to obtain the surface information of the PCD diamond compact to be ground,

the control module controls the driving part to move based on the acquired surface information and a preset threshold value, and adjusts the rotating speed of the DD driving part 232 while the X moving assembly and/or the Y moving assembly move so as to adjust the rotating speed of the PCD diamond compact, wherein the rotating speed of the PCD diamond compact is higher than that of the PCD diamond compact when the light irradiates the central position of the PCD diamond compact.

The surface information of the diamond compact 100 after grinding is sampled based on the detection module, the sampled information is transmitted to the data processing module,

the data processing module is operated based on the received information to obtain the surface information of the ground PCD diamond compact and transmits the information to the comparison and judgment module,

the comparing and judging module receives the information and compares the information with a preset threshold value, namely the profile information of the surface of the diamond compact 100 after being detected is compared with the preset information,

if the grinding condition is satisfied, the grinding of the part is normal,

if the requirement is not met, the continuous grinding needs to be adjusted. When the grinding is continued, the targeted grinding can be performed on the part which does not reach the standard by means of the detected information so as to improve the grinding efficiency. Preferably, the detection module samples the surface information of the workpiece after each grinding until the grinding is finished. The comparison and judgment module can be integrated in the data processing module. Preferably, the control module includes a storage module for storing data and a predetermined program. The cross-section of the diamond compact after grinding is schematically shown in fig. 1, and the surface 110 of the diamond compact 100 has a curvature (the center a is higher than the edge b). While one PCD diamond compact is illustrated in this embodiment, in other embodiments, a plurality of PCD diamond compacts may be provided.

As a variation of the above-described embodiment,

the control module controls the driving part to move based on the acquired surface information and a preset threshold value, and adjusts the Z moving component while the X moving component and/or the Y moving component move, if the Z moving component gradually moves upwards in the process that light irradiates the edge position of the PCD diamond compact to move towards the center, until the grinding is finished,

the surface information of the grinded diamond compact is sampled based on the detection module, the sampled information is transmitted to the data processing module,

the comparing and judging module receives the information and compares the information with a preset threshold value, detects that the profile information of the surface of the diamond compact after grinding is compared with the preset information,

if the grinding fluid meets the requirements, the grinding is finished,

if not, continuing to grind until finishing grinding. When the grinding is continued, the targeted grinding can be performed on the part which does not reach the standard by means of the detected information so as to improve the grinding efficiency.

In one embodiment, the data processing module is operated based on the received information to obtain the grinding condition of the ground PCD diamond compact based on continuous sampling acousto-optic information in the process of grinding the diamond compact by one or more detection modules.

In one embodiment, the detected information and the preset information are displayed through a display module.

In one embodiment, the data processing module is integrated into the control module. The laser grinding device has the function of detecting the surface profile of a workpiece to be ground, so that the grinding efficiency is improved.

In a specific embodiment, based on the above steps, we achieved the following results in a pilot plant: finishing a coarse grinding process of a PCD compact with the diameter of 60mm, wherein the fastest grinding time of 0.1mm reaches 4.5 minutes, and the smoothness is superior to 2um Ra; and finishing a fine grinding process by using the PCD compact with the diameter of 60mm, wherein the grinding time is as fast as 7.5 minutes when the PCD compact is ground by 0.05mm, and the smoothness is better than 0.2um Ra. The rough grinding and finish grinding processes may be completed in a single set-up procedure. For example, 3 passes of the coarse grinding process can be provided to complete a 0.3mm coarse grind followed by a 0.05mm fine grind to achieve a total finish of 0.35 mm. It can be seen that the polishing efficiency proposed in the present application is high.

In the present application, the terms "upper", "lower", "inside", "middle", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings. These terms are used primarily to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.

The above embodiments are merely illustrative of the technical concepts and features of the present application, and the purpose of the embodiments is to enable those skilled in the art to understand the content of the present application and implement the present application, and not to limit the protection scope of the present application. All equivalent changes and modifications made within the spirit of the present application are intended to be covered by the scope of the present application.

Claims

1. A laser grinding apparatus, comprising:

a frame body and a laser grinding module arranged in the frame body,

the laser grinding module comprises: a driving part for driving the motor to rotate,

the drive unit includes: a Y-moving component and an X-moving component, wherein one side of the driving part is fixed on the base, the side of the driving part far away from the base is provided with an object stage, the object stage is used for placing a diamond compact to be ground,

dispose the support on the base, one side of support disposes Z to removing the subassembly Z connects the curb plate to removing the subassembly, dispose detection module on the curb plate, detection module is used for sampling the relevant information data of diamond compact in the course of working.

2. The laser milling apparatus as claimed in claim 1, comprising:

the stage includes: the bottom plate, one side of bottom plate is fixed in on the X removes the subassembly, keeping away from of bottom plate one side that the X removed the subassembly disposes DD driver part, at least one joint portion is connected to DD driver part's output, joint portion is used for cliping the diamond compact piece.

3. The laser grinding apparatus of claim 2, comprising:

the joint portion is provided with a concave portion, and the concave portion is used for placing a diamond compact.

4. A PCD diamond compact face lapping method comprising the laser lapping apparatus of any one of claims 1 to 3, the method comprising:

5. The method of lapping a PCD diamond compact surface of claim 4,

further comprising:

continuously sampling sound/light information in the process of grinding the surface of the diamond compact sheet based on one or more detection modules, transmitting the sampled sound/light information to a data processing module,

the data processing module is operated based on the received information to obtain the processed condition of the surface of the PCD diamond compact to be ground and transmits the information to the control module,

the control module controls the driving part or controls the driving part and the Z-moving component based on the received information and a preset threshold value.

6. The method of lapping a PCD diamond compact surface of claim 4, further comprising:

continuously sampling associated information in the grinding process of the diamond compact based on the detection module, transmitting the sampled information to the data processing module,

the data processing module is operated based on the received information to obtain the grinded condition of the grinded PCD diamond compact, and transmits the information to the comparison and judgment module in real time,

if the grinding condition is satisfied, the grinding is normal,

if the requirement is not met, the continuous grinding needs to be adjusted.

7. The method of lapping a PCD diamond compact surface of claim 4,

based on the movement of the X moving assembly and/or the Y moving assembly, the rotating speed of the PCD diamond compact when light emitted by the laser emitting device irradiates at the central position of the PCD diamond compact is higher than that of the PCD diamond compact when the light irradiates at the edge position of the PCD diamond compact.

8. The method of lapping a PCD diamond compact surface of claim 4,

based on the movement of the X-movement assembly and/or the Y-movement assembly, the moving speed of the PCD diamond compact is gradually reduced when light emitted by the laser emitting device irradiates the central position of the PCD diamond compact to move towards the edge.

9. The method of lapping a PCD diamond compact surface of claim 4,

and the Z moving assembly can gradually move upwards, downwards or in parallel during the process that the light emitted by the laser emitting device is irradiated on the edge position of the PCD diamond compact to move towards the center based on the movement of the X moving assembly and/or the Y moving assembly until the grinding is finished so as to obtain different surface shapes.

10. The method of lapping a PCD diamond compact surface of claim 4,

and the detected processing process information and the preset threshold value information are displayed through the display module.