CN115926224B - Prepreg for packaging carrier plate with high heat conductivity and manufacturing of copper-clad plate using prepreg - Google Patents
Prepreg for packaging carrier plate with high heat conductivity and manufacturing of copper-clad plate using prepreg Download PDFInfo
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- CN115926224B CN115926224B CN202211287466.5A CN202211287466A CN115926224B CN 115926224 B CN115926224 B CN 115926224B CN 202211287466 A CN202211287466 A CN 202211287466A CN 115926224 B CN115926224 B CN 115926224B
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 31
- 238000004519 manufacturing process Methods 0.000 title abstract description 10
- 239000004744 fabric Substances 0.000 claims abstract description 66
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical group [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims abstract description 63
- 239000000835 fiber Substances 0.000 claims abstract description 62
- 229920005989 resin Polymers 0.000 claims abstract description 58
- 239000011347 resin Substances 0.000 claims abstract description 58
- 229910010271 silicon carbide Inorganic materials 0.000 claims abstract description 53
- 230000004048 modification Effects 0.000 claims abstract description 15
- 238000012986 modification Methods 0.000 claims abstract description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000011889 copper foil Substances 0.000 claims abstract description 10
- 239000003292 glue Substances 0.000 claims description 23
- 239000002904 solvent Substances 0.000 claims description 20
- 239000000843 powder Substances 0.000 claims description 19
- 239000013032 Hydrocarbon resin Substances 0.000 claims description 13
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- 238000000034 method Methods 0.000 claims description 13
- 239000003795 chemical substances by application Substances 0.000 claims description 12
- 239000002131 composite material Substances 0.000 claims description 12
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- 229910052582 BN Inorganic materials 0.000 claims description 8
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- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 claims description 2
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- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 claims description 2
- 239000001263 FEMA 3042 Substances 0.000 claims description 2
- LRBQNJMCXXYXIU-PPKXGCFTSA-N Penta-digallate-beta-D-glucose Natural products OC1=C(O)C(O)=CC(C(=O)OC=2C(=C(O)C=C(C=2)C(=O)OC[C@@H]2[C@H]([C@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)O2)OC(=O)C=2C=C(OC(=O)C=3C=C(O)C(O)=C(O)C=3)C(O)=C(O)C=2)O)=C1 LRBQNJMCXXYXIU-PPKXGCFTSA-N 0.000 claims description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 2
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 claims description 2
- 238000000498 ball milling Methods 0.000 claims description 2
- 229910052796 boron Inorganic materials 0.000 claims description 2
- -1 boron aluminate Chemical class 0.000 claims description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 2
- KSEBMYQBYZTDHS-HWKANZROSA-N ferulic acid Chemical compound COC1=CC(\C=C\C(O)=O)=CC=C1O KSEBMYQBYZTDHS-HWKANZROSA-N 0.000 claims description 2
- 229940114124 ferulic acid Drugs 0.000 claims description 2
- KSEBMYQBYZTDHS-UHFFFAOYSA-N ferulic acid Natural products COC1=CC(C=CC(O)=O)=CC=C1O KSEBMYQBYZTDHS-UHFFFAOYSA-N 0.000 claims description 2
- 235000001785 ferulic acid Nutrition 0.000 claims description 2
- 235000004515 gallic acid Nutrition 0.000 claims description 2
- 229940074391 gallic acid Drugs 0.000 claims description 2
- 229960005219 gentisic acid Drugs 0.000 claims description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
- 229910000077 silane Inorganic materials 0.000 claims description 2
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 claims description 2
- 235000012239 silicon dioxide Nutrition 0.000 claims description 2
- 238000004381 surface treatment Methods 0.000 claims description 2
- 235000015523 tannic acid Nutrition 0.000 claims description 2
- LRBQNJMCXXYXIU-NRMVVENXSA-N tannic acid Chemical compound OC1=C(O)C(O)=CC(C(=O)OC=2C(=C(O)C=C(C=2)C(=O)OC[C@@H]2[C@H]([C@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)O2)OC(=O)C=2C=C(OC(=O)C=3C=C(O)C(O)=C(O)C=3)C(O)=C(O)C=2)O)=C1 LRBQNJMCXXYXIU-NRMVVENXSA-N 0.000 claims description 2
- 229940033123 tannic acid Drugs 0.000 claims description 2
- 229920002258 tannic acid Polymers 0.000 claims description 2
- QURCVMIEKCOAJU-UHFFFAOYSA-N trans-isoferulic acid Natural products COC1=CC=C(C=CC(O)=O)C=C1O QURCVMIEKCOAJU-UHFFFAOYSA-N 0.000 claims description 2
- 238000005253 cladding Methods 0.000 claims 1
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Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a prepreg for a packaging carrier plate with high heat conductivity and a manufacturing method of a copper-clad plate using the prepreg, and belongs to the technical field of electronic materials. The prepreg comprises a reinforced fiber cloth core and a resin layer coated outside the reinforced cloth core; the reinforced cloth core is silicon carbide fiber cloth, and the silicon carbide fiber cloth is modified silicon carbide fiber cloth subjected to surface reinforced modification treatment; according to the invention, the silicon carbide fiber cloth is modified, so that adverse effects caused by high dielectric constant of silicon carbide are reduced, the binding force of the silicon carbide fiber and matrix resin, the compatibility and cohesiveness between the heat conducting filler and the matrix resin and between the heat conducting filler and the silicon carbide fiber are increased, the peel strength of the prepreg and the copper foil can be improved, and the heat conductivity coefficient of the copper-clad plate can be further improved.
Description
Technical Field
The invention belongs to the technical field of electronic materials, and particularly relates to a prepreg for a packaging carrier plate with high heat conductivity and a manufacturing method of a copper-clad plate using the prepreg.
Background
With the continuous development of microelectronic technology, the types of electronic devices are diversified, the integration density is increased, and heat dissipation becomes one of important influencing factors in the design and manufacture of high-density devices, especially high-power devices such as LEDs, power modules, cameras and the like, and the requirement on heat dissipation is higher than that of common devices. Improving the thermal conductivity of the package carrier is one of the main ways to meet the high power applications.
The prepreg and the copper-clad plate are basic materials for manufacturing the packaging carrier plate, and glass fiber cloth is commonly used as a reinforced framework material to prepare the prepreg and the copper-clad plate at present, but the glass fiber cloth has low heat conductivity, usually 0.2-2.2W/m.K, and is difficult to meet the heat dissipation requirement. The document Wong C P, bollampallyr S, journal of Applied Polymer Science,2015,74 (14): 3396-3403 describes a method for improving the heat conducting property of a resin substrate by changing the molecular chain structure of the polymer itself to promote the order of the physical structure thereof, reducing phonon scattering and reducing the thermal resistance of the polymer itself, but this method is not easy to realize and has high cost and is not suitable for industrial production. Chen H, ginzburg V V, progress in Polymer Science,2016,59:41-85 and Gao J S, shiu S C, journal of Composite Materials,2013,47 (4): 449-458: the heat conducting performance of the composite material can be improved by adding common heat conducting fillers such as silicon carbide, boron nitride and the like and utilizing the interaction of the resin base material and the heat conducting fillers, but the method needs to be filled with a large amount of heat conducting filler powder, the dispersion uniformity of the heat conducting filler powder is poor, the physical characteristics such as resin dielectric property, hardness, thermal expansion and contraction rate and the like can be changed, and the processes such as drilling, pressing, hole metallization and the like in the manufacturing of the carrier plate are affected.
In recent years, various composite materials with isolation structures show excellent heat and electric conduction performance, such as silicon carbide fiber materials, and the materials have the advantages of strong high-temperature bearing capacity, high hardness, oxidation resistance, wear resistance, high heat conductivity, small thermal expansion coefficient, chemical corrosion resistance and the like, and the heat conductivity can reach 16.7W/m.K, and specific values are shown in table 1. The composite material has the advantages that the composite material has larger length-diameter ratio, can be effectively contacted with each other to form a heat conduction network, and the silicon carbide fiber and the heat conduction filler are compounded, so that the contact area of the silicon carbide fiber and matrix resin can be increased, and the directional distribution of heat conduction particles can be effectively promoted, so that the heat conduction performance of the composite material is improved.
Table 1 physical properties such as thermal conductivity of each material
Patent CN202210170426 discloses a high-heat-conductivity hydrocarbon resin-based prepreg and a high-frequency copper-clad plate prepared from the prepreg, wherein silicon carbide fiber cloth is adopted to simply replace glass fiber cloth, and the high-frequency copper-clad plate is obtained by dipping hydrocarbon resin glue solution, and has the advantages of low dielectric constant, low dielectric loss, high heat-conductivity, high peel strength and the like. However, silicon carbide has a dielectric constant of 9.66 to 10.03 (300K, table 1), and is a high dielectric material, and is not suitable for high-frequency and high-speed signal transmission. Secondly, the prepreg and the copper-clad plate thereof have higher chemical stability, so that the catalyst is difficult to adsorb during the metallization of the through blind holes and the blind holes of the interlayer interconnection, the copper deposition is not facilitated, the problems of poor bonding force between the silicon carbide fiber cloth and resin and the like exist, and the application of the silicon carbide prepreg and the copper-clad plate in packaging the carrier plate is limited.
Disclosure of Invention
The invention aims at: the prepreg for the packaging carrier plate with high heat conductivity is prepared by carrying out surface enhancement modification treatment on silicon carbide fiber cloth, so that adverse effects caused by high dielectric constant and high chemical stability of silicon carbide are reduced, meanwhile, the binding force of the silicon carbide fiber and matrix resin, the compatibility and cohesiveness between a heat conducting filler and the matrix resin and between the heat conducting filler and the silicon carbide fiber are increased, and the peeling resistance, tensile strength and heat conducting property of a copper foil of the silicon carbide fiber cloth are improved.
Another object of the invention is: the preparation method of the copper-clad plate of the prepreg for packaging the carrier plate with high heat conductivity is provided, and the prepared silicon carbide fiber copper-clad plate has high heat conductivity, low dielectric constant and dielectric loss and good through hole metallization characteristics, and is particularly suitable for manufacturing carrier plates for packaging high-power devices such as LEDs, PICs and the like. .
In order to achieve the above purpose, the invention adopts the following technical scheme:
A prepreg for packaging a carrier plate with high heat conductivity comprises a reinforced fiber cloth core and a resin layer coated outside the reinforced cloth core;
The reinforced cloth core is silicon carbide fiber cloth, and the silicon carbide fiber cloth is modified silicon carbide fiber cloth subjected to surface reinforced modification treatment;
the resin layer is obtained by solidifying and drying resin glue solution, and the resin glue solution comprises the following components in parts by weight: cyanate ester: 15-30 parts by weight of hydrocarbon resin: 30-60 parts by weight of heat conducting powder: 5-10 parts by weight of a curing agent: 5-15 parts by weight of a solvent: 30-50 parts by weight.
Further, the preparation method of the modified silicon carbide fiber cloth comprises the following steps:
s1, soaking silicon carbide fiber pulp in 0.1-3 mg/mL polyphenol water solution A for 20-30 min, adding a solution containing an aqueous adhesive, carrying out papermaking forming, and carrying out vacuum drying to obtain a silicon carbide fiber cloth core;
S2, immersing the reinforced cloth core in an immersion slurry C for 30-60 min, taking out, and vacuum drying to obtain the modified silicon carbide fiber cloth core, wherein the immersion slurry C is prepared from 20-30 parts by mass of silicate solution, 30-60K 2Ti6O13 whisker modified silicate solution, 10-30 parts by mass of composite glass powder or 10-50 parts by mass of acetone solution, and the pH value of the immersion slurry C is controlled within 7-9 by silicic acid.
Further, the polyphenol solution A is one or a mixture of more of tannic acid, gentisic acid, ferulic acid, gallic acid and protocatechuic acid.
Further, the curing agent is one or more of triallyl isocyanurate, dicumyl peroxide and trimethylolpropane triacrylate.
Further, the heat conducting powder is one or more of hexagonal boron nitride, aluminum oxide, spherical aluminum nitride and boron aluminate whisker, and the particle size of the heat conducting filler is 0.5-5 um.
Further, the prepreg for the packaging carrier plate with high heat conductivity is prepared by the following steps:
S1, adding 15-30 parts by weight of cyanate ester and 30-60 parts by weight of hydrocarbon resin into a solvent with the temperature of 70-110 ℃ for full dissolution, adding 5-10 parts by weight of heat conducting powder, 1-5 parts by weight of curing agent and the rest solvent after the solvent is heated to 100-130 ℃, keeping the temperature at 100-130 ℃, and stirring until the mixture is uniform to obtain resin glue solution;
S2, immersing the reinforced cloth core in the resin glue solution obtained in the step S1 for 10-30 min, solidifying for 1-10 h at the temperature of 120-200 ℃, and cooling to room temperature after solidification to obtain the high-heat-conductivity resin-based prepreg.
Further, the heat conducting powder is hexagonal boron nitride, and is added into the resin glue solution after ball milling, drying and silane surface treatment are sequentially carried out.
The invention also provides a copper-clad plate prepared from the prepreg for packaging the carrier plate with high heat conductivity, which is prepared by the following steps: symmetrically overlapping the high-heat-conductivity resin-based prepreg and the copper foil, then placing the prepreg and the copper foil into a hot press, and carrying out hot pressing after vacuumizing to obtain a copper-clad plate, wherein the hot pressing process meets the following conditions: the temperature is 150-350 ℃, the pressing time is 2-8 h, and the pressure is 1-50 MPa.
Due to the adoption of the technical scheme, the invention has the following advantages:
1. the prepreg for the high-heat-conductivity packaging carrier plate consists of the reinforced cloth core and the resin layer, wherein the reinforced cloth core is a silicon carbide fiber cloth core, and the silicon carbide fiber has excellent performances of high heat conductivity coefficient, high strength, high modulus, high temperature resistance, oxidation resistance, low thermal expansion coefficient and the like, and is beneficial to design and manufacture of high-power high-density devices.
2. The treatment fluid used in the process of modifying the reinforced cloth core disclosed by the invention comprises silicate solution, composite glass powder and acetone solution. Silicate is the most widely used material in inorganic adhesives, has a regular tetrahedral structure, and by introducing air pores, the porosity of a matrix is improved, the density of the material is reduced, and the number of polarized molecules in unit volume is reduced, so that the dielectric constant of the material is reduced. Meanwhile, the adhesive has better adhesiveness and can meet the adhesive requirements of silicon carbide and common ceramics, glass, packaging materials, metals and other materials. However, for a single silicate binder, the bonding strength tends to decrease over time, and the K 2Ti6O13 whisker modified silicate solution can improve the stability of the silicate binder to some extent. The glass powder also has good affinity and compatibility with resin, and is a good adhesive. Silicon carbide fiber has the advantage of high thermal conductivity, and also has the defect of high dielectric constant and poor bonding force with resin. The surface enhanced coating modification treatment is carried out by using silicate solution, so that adverse effects brought by high dielectric constant of silicon carbide are reduced, the binding force of silicon carbide fibers and matrix resin, the compatibility and cohesiveness between the heat conducting filler and the matrix resin and between the heat conducting filler and the silicon carbide fibers are increased, and the heat conductivity coefficient of the copper-clad plate is further improved.
3. The reinforced cloth core is preferably prepared by taking the polyphenol as a modified solution, the polyphenol is attached to the surface of the composite fiber after impregnation, and the polyphenol on the surface of the composite fiber can participate in the crosslinking and curing reaction of hydrocarbon resin and cyanate ester when preparing the prepreg, so that the binding force of the silicon carbide fiber and the resin can be further enhanced.
Drawings
FIG. 1 is a comparison of a sample of a silicon carbide fiber substrate subjected to reinforcement modification treatment and a sample of a silicon carbide fiber substrate not subjected to reinforcement modification treatment, wherein A is cracking after tin flotation of the sample of the silicon carbide fiber substrate not subjected to reinforcement modification treatment; b is silicon carbide fiber which is not cracked after being subjected to reinforcing modification treatment and sample tin flotation;
Fig. 2 is a real object diagram of a power management chip carrier plate prepared by the copper-clad plate prepared by the method of the invention, wherein a is a real object diagram of the power management chip carrier plate prepared by the copper-clad plate prepared by the method of the invention; and B is a real image of the packaging carrier plate prepared by the copper-clad plate obtained by the method.
Detailed Description
The invention is further illustrated by the following examples, without any limitation to the claims of the invention.
Example 1
The prepreg for the packaging carrier plate with high heat conductivity comprises a reinforced fiber cloth core and a resin layer coated outside the reinforced cloth core; the reinforced cloth core is silicon carbide fiber cloth, and the silicon carbide fiber cloth is modified silicon carbide fiber cloth with the surface subjected to surface reinforced modification treatment; the resin layer is obtained by drying resin glue solution, and the resin glue solution comprises the following components in parts by weight: cyanate ester: 25 parts by weight of hydrocarbon resin: 30 parts by weight of heat conducting powder: 5 parts by weight of a curing agent: 5 parts by weight of a solvent: 30 parts by weight.
The preparation method of the modified silicon carbide fiber cloth comprises the following steps:
S1, soaking silicon carbide fiber pulp in 0.1mg/mL polyphenol water solution for 20min, adding an aqueous adhesive, carrying out papermaking forming, and carrying out vacuum drying to obtain a silicon carbide fiber cloth core;
s2, immersing the reinforced cloth core in the impregnating slurry for 30min, and vacuum drying to obtain the modified silicon carbide fiber cloth core, wherein the impregnating solution comprises 40 parts by mass of K 2Ti6O13 whisker modified silicate solution and 20 parts by mass of composite glass powder. . The pH value of the impregnating solution is 8.
The high-heat-conductivity prepreg for the packaging carrier plate is prepared by the following steps:
S1, adding 15 parts by mass of cyanate ester and 30 parts by mass of hydrocarbon resin into a solvent with the temperature of 100 ℃ for full dissolution, heating the solvent to 110 ℃, adding 8 parts by mass of hexagonal boron nitride, 3 parts by weight of curing agent and the rest solvent, keeping the temperature at 110 ℃, and stirring until the mixture is uniform to obtain resin glue solution;
s2, immersing the reinforced cloth core in the resin glue solution obtained in the step S1 for 30min, solidifying for 3h at 185 ℃, and cooling to room temperature after solidification to obtain the high-heat-conductivity resin-based prepreg.
The invention also provides a copper-clad plate prepared from the prepreg for packaging the carrier plate with high heat conductivity, which is prepared by the following steps: symmetrically overlapping the high-heat-conductivity resin-based prepreg and the copper foil, then placing the prepreg and the copper foil into a hot press, and carrying out hot pressing after vacuumizing to obtain a copper-clad plate, wherein the hot pressing process meets the following conditions: the temperature is 210 ℃, the pressing time is 3.5h, and the pressure is 25MPa.
Comparative example 1
The prepreg for packaging the carrier plate comprises a reinforced fiber cloth core and a resin layer coated outside the reinforced cloth core; the reinforced cloth core is silicon carbide fiber cloth, the resin layer is obtained by drying resin glue liquid, and the resin glue liquid comprises the following components in parts by weight: cyanate ester: 25 parts by weight of hydrocarbon resin: 30 parts by weight of heat conducting powder: 5 parts by weight of a curing agent: 5 parts by weight of a solvent: 30 parts by weight.
The preparation method of the silicon carbide fiber cloth comprises the following steps:
S1, soaking silicon carbide fiber pulp in 0.1mg/mL polyphenol water solution for 20min, adding an aqueous adhesive, carrying out papermaking forming, and carrying out vacuum drying to obtain a silicon carbide fiber cloth core;
the high-heat-conductivity prepreg for the packaging carrier plate is prepared by the following steps:
S1, adding 15 parts by mass of cyanate ester and 30 parts by mass of hydrocarbon resin into a solvent with the temperature of 100 ℃ for full dissolution, heating the solvent to 110 ℃, adding 8 parts by mass of hexagonal boron nitride, 3 parts by weight of curing agent and the rest solvent, keeping the temperature at 110 ℃, and stirring until the mixture is uniform to obtain resin glue solution;
s2, immersing the reinforced cloth core in the resin glue solution obtained in the step S1 for 30min, solidifying for 3h at 185 ℃, and cooling to room temperature after solidification to obtain the high-heat-conductivity resin-based prepreg.
The invention also provides a copper-clad plate prepared from the prepreg for packaging the carrier plate with high heat conductivity, which is prepared by the following steps: symmetrically overlapping the high-heat-conductivity resin-based prepreg and the copper foil, then placing the prepreg and the copper foil into a hot press, and carrying out hot pressing after vacuumizing to obtain a copper-clad plate, wherein the hot pressing process meets the following conditions: the temperature is 210 ℃, the pressing time is 3.5h, and the pressure is 25MPa.
Comparative example 2
The prepreg for packaging the carrier plate comprises a reinforced fiber cloth core and a resin layer coated outside the reinforced cloth core; the reinforced cloth core is glass fiber cloth, the resin layer is obtained by drying resin glue liquid, and the resin glue liquid comprises the following components in parts by weight: cyanate ester: 25 parts by weight of hydrocarbon resin: 30 parts by weight of heat conducting powder: 5 parts by weight of a curing agent: 5 parts by weight of a solvent: 30 parts by weight.
The preparation method of the glass fiber cloth comprises the following steps:
s1, soaking glass fiber pulp in 0.1mg/mL polyphenol water solution for 20min, adding an aqueous adhesive, carrying out papermaking forming, and carrying out vacuum drying to obtain a glass fiber cloth core;
the high-heat-conductivity prepreg for the packaging carrier plate is prepared by the following steps:
S1, adding 15 parts by mass of cyanate ester and 30 parts by mass of hydrocarbon resin into a solvent with the temperature of 100 ℃ for full dissolution, heating the solvent to 110 ℃, adding 8 parts by mass of hexagonal boron nitride, 3 parts by weight of curing agent and the rest solvent, keeping the temperature at 110 ℃, and stirring until the mixture is uniform to obtain resin glue solution;
s2, immersing the reinforced cloth core in the resin glue solution obtained in the step S1 for 30min, solidifying for 3h at 185 ℃, and cooling to room temperature after solidification to obtain the high-heat-conductivity resin-based prepreg.
And (3) symmetrically superposing the resin-based prepregs prepared in the comparative examples 1 and 2 and the copper foil respectively, putting the prepregs into a hot press, vacuumizing and hot-pressing to obtain the copper-clad plate. The hot pressing process should satisfy the following conditions: the temperature is 210 ℃, the pressing time is 3.5h, and the pressure is 25Mpa.
The test methods of comparative example 1 and comparative example 2 were performed according to the IPC-TM 650-related requirements.
And the copper-clad plate performances of comparative example 1, comparative example 1 and comparative example 2. The comparison results are shown in Table 2.
Table 2 shows a comparison of the properties of three examples
Therefore, it is easy to find that the silicon carbide fiber copper-clad plate subjected to surface enhancement modification treatment provided by the embodiment has good comprehensive performance, high heat conduction capacity, low dielectric constant and dielectric loss, and good through hole metallization characteristics (highest backlight index after copper melting), and the heat conduction coefficient can reach 12.8W/m.K. In addition, the silicon carbide fiber copper-clad plate subjected to surface enhancement modification treatment provided by the embodiment is not easy to crack, and the interior of the copper-clad plate not subjected to surface enhancement modification treatment is easy to crack, as shown in fig. 1, so that the silicon carbide fiber surface enhancement modification treatment enhances the bonding capability of the silicon carbide fiber and the resin. Therefore, the improved copper-clad plate provided by the embodiment is particularly suitable for manufacturing carrier plates for packaging high-power devices such as LEDs, PICs and the like, as shown in fig. 2.
The foregoing embodiments are merely illustrative of the principles and functions of the present invention, and are not intended to limit the invention to the specific embodiments, so as to facilitate understanding of the principles of the invention, and the scope of the invention is not limited to the above-described arrangements and embodiments, and various other specific modifications and combinations may be made by those skilled in the art in light of the disclosure without departing from the spirit of the invention, but are still within the scope of the invention.
Claims (7)
1. The utility model provides a high heat conduction encapsulation prepreg for carrier plate, includes reinforcing cloth core and cladding at the outside resin layer of reinforcing cloth core, its characterized in that:
The reinforced cloth core is silicon carbide fiber cloth, and the silicon carbide fiber cloth is modified silicon carbide fiber cloth subjected to surface reinforced modification treatment; the modified silicon carbide fiber cloth is prepared according to the following steps:
S1, soaking silicon carbide fiber pulp in 0.1-3 mg/mL polyphenol water solution A for 20-30 min, adding a solution containing an aqueous adhesive, carrying out papermaking forming, and carrying out vacuum drying to obtain silicon carbide fiber cloth;
s2, immersing the silicon carbide fiber cloth in an immersion slurry C for 30-60 min, taking out, and vacuum drying to obtain a modified silicon carbide fiber cloth, wherein the immersion slurry C is prepared from 20-30 parts by mass of silicate solution, 30-60K 2Ti6O13 whisker modified silicate solution, 10-30 parts by mass of composite glass powder or 10-50 parts by mass of acetone solution, and the pH value of the immersion slurry C is controlled within a range of 7-9 by silicic acid;
The resin layer is obtained by solidifying and drying resin glue solution, and the resin glue solution comprises the following components in parts by weight: cyanate ester: 15-30 parts by weight of hydrocarbon resin: 30-60 parts by weight of heat conducting powder: 5-10 parts by weight of a curing agent: 1-5 parts by weight of a solvent: 30-50 parts by weight.
2. The prepreg for packaging carrier board with high heat conductivity according to claim 1, wherein the prepreg is characterized in that: the polyphenol water solution A is one or more of tannic acid, gentisic acid, ferulic acid, gallic acid and protocatechuic acid.
3. The prepreg for packaging carrier board with high heat conductivity according to claim 1, wherein the prepreg is characterized in that: the curing agent is one or more of triallyl isocyanurate, dicumyl peroxide and trimethylolpropane triacrylate.
4. The prepreg for packaging carrier board with high heat conductivity according to claim 1, wherein the prepreg is characterized in that: the heat conducting powder is one or more of hexagonal boron nitride, aluminum oxide, spherical aluminum nitride and boron aluminate whisker, and the particle size of the heat conducting powder is 0.5-5 mu m.
5. The prepreg for packaging carrier board with high heat conductivity according to claim 1, wherein the prepreg is characterized in that: the high-heat-conductivity prepreg for the packaging carrier plate is prepared through the following steps:
S1, adding 15-30 parts by weight of cyanate ester and 30-60 parts by weight of hydrocarbon resin into a solvent with the temperature of 70-110 ℃ for full dissolution, adding 5-10 parts by weight of heat conducting powder, 1-5 parts by weight of curing agent and the rest solvent after the solvent is heated to 100-130 ℃, keeping the temperature at 100-130 ℃, and stirring until the mixture is uniform to obtain resin glue solution;
S2, immersing the reinforced cloth core in the resin glue solution obtained in the step S1 for 10-30 min, solidifying for 1-10 h at the temperature of 120-200 ℃, and cooling to room temperature after solidification to obtain the high-heat-conductivity resin-based prepreg.
6. The prepreg for packaging carrier board with high thermal conductivity according to claim 5, wherein: the heat conducting powder is hexagonal boron nitride, and is added into the resin glue solution after ball milling, drying and silane surface treatment are sequentially carried out.
7. A copper-clad plate prepared by using the prepreg for packaging a carrier plate with high thermal conductivity according to claim 1, which is characterized by being prepared by the following steps: symmetrically overlapping the prepreg for the high-heat-conductivity packaging carrier plate and the copper foil, then placing the prepreg into a hot press, and carrying out hot pressing after vacuumizing to obtain a copper-clad plate, wherein the hot pressing process meets the following conditions: the temperature is 150-350 ℃, the pressing time is 2-8 h, and the pressure is 1-50 MPa.
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