CN115922068A - Feedback type laser pulse processing method and device for multilayer composite material - Google Patents
Feedback type laser pulse processing method and device for multilayer composite material Download PDFInfo
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Abstract
The invention discloses a feedback type laser pulse processing method and equipment for a multilayer composite material, wherein the processing method comprises the following steps: acquiring an initial image of the multilayer composite material, and determining an initial processing area according to the initial image; carrying out laser ablation on the initial processing area; determining the central wavelength of coaxial light according to the material components and the optical characteristics of the multilayer composite material, collecting an exposure feedback image of the upper surface of the multilayer composite material subjected to laser ablation, and determining a continuous processing area according to the exposure feedback image; if the ratio of the area of the continuous processing area to the area of the initial processing area is smaller than a set value, finishing the processing; and if the ratio of the area of the continuous processing area to the area of the initial processing area is larger than or equal to a set value, performing laser ablation on the continuous processing area. According to the processing method and the processing equipment, the range and the laser parameters of the processing area are continuously adjusted in the processing process through the exposure feedback image, so that the damage of the base layer material is effectively avoided.
Description
Technical Field
The invention relates to the field of laser pulse processing, in particular to a feedback type laser pulse processing method and device for a multilayer composite material.
Background
Since the invention of the self-laser Q-switching technology and the chirped pulse amplification technology, the short pulse and ultrashort pulse laser technology is rapidly developed and becomes a powerful tool in the field of industrial micromachining. When the laser pulse with the pulse width of nanosecond, picosecond or femtosecond magnitude is used for processing the material, the short pulse width enables the thermal diffusion effect to be restrained, and the processing effect with high precision and high quality is obtained.
The industrial short pulse or ultrashort pulse laser used for fine processing generally has lower pulse energy and higher pulse repetition frequency, and the material is removed by fast scanning layer by layer through the laser on the basis of the laser parameters, so that the problem of thermal damage brought by high pulse energy is restrained as much as possible, meanwhile, the processing precision is improved, and the control of the removal depth is more accurate.
In order to improve the consistency and processing controllability of materials, in general, technicians can achieve the purpose by using methods such as shorter pulse width, laser pulse energy improvement, repetition frequency stability and the like, but the use of the methods can greatly increase the design requirements and difficulty of the laser, thereby increasing the cost of processing equipment. In addition, when processing a composite material with poor consistency, especially when processing a multilayer composite material with large differences in physical properties, in order to ensure that the material in the processing area in the adhesion layer on top of the multilayer composite material is completely removed, even if the laser parameters are adjusted, damage to the matrix layer material in contact with the surface of the adhesion layer is inevitably caused during the removal process.
The concrete expression is as follows: in order to achieve higher processing efficiency, laser parameters with larger removal depth, such as larger pulse energy and/or lower scanning speed, are often used when processing the material in the processing region of the adhesion layer, and the laser parameters cause unpredictable damage to the material of the base layer. Even if the laser parameters with smaller removal depth are adopted to process the materials in the processing area in the adhesion layer, because the components and the thicknesses of the materials in different layers are different and the interface bonding force of the adjacent material layers is different, part of the materials in the processing area in the adhesion layer can be removed first under the non-laser action, and because the laser removal for fine processing is generally scanning layer by layer, in order to ensure that the materials in the processing area in the adhesion layer on the top of the multilayer composite material are completely removed, the processing times are inevitably increased, so that the damage of the base layer material in the area where the materials are removed first is caused. It should be noted that there are various non-laser effects that cause a part of the material in the processing region in the adhesion layer to be removed first, for example, peeling of the adhesion layer material after the interface between the adhesion layer and the base layer is damaged in the removal process, peeling of the adhesion layer material due to interface failure caused by mechanical impact force caused by laser irradiation, or peeling of the adhesion layer material due to interface failure caused by laser pulse thermal effect acting on the base layer formed by a polymer, and the like, and the peeling of the adhesion layer material caused by the non-laser effects generally originates from poor consistency of the multilayer composite material.
In the prior art, in order to avoid damage of a base layer material caused in a laser removal process from affecting the quality of a finished product of a multilayer composite material product as much as possible, off-line monitoring is generally performed on the processed multilayer composite material, and after the damage degree of the base layer material in the multilayer composite material is evaluated, a qualified sample is screened and enters the next processing step. Although the off-line monitoring step can ensure the finished product quality of the multilayer composite material product, the damage of the base layer material cannot be avoided, the product yield is greatly reduced, and the product cost is increased.
Disclosure of Invention
The invention aims to provide a feedback type laser pulse processing method of a multilayer composite material, which is characterized in that an exposure feedback image is obtained in the processing process, and the range and laser parameters of a processing area are continuously adjusted in the processing process through the exposure feedback image, so that the damage of a base layer material is effectively avoided, and the defects in the prior art are overcome.
Another objective of the present invention is to provide a feedback laser pulse processing apparatus for multilayer composite materials, which is used in conjunction with a laser pulse processing method to effectively improve the technical problem of poor processing controllability of the existing laser pulse processing method with low equipment cost, and is beneficial to ensure the processing quality of multilayer composite materials.
In order to achieve the purpose, the invention adopts the following technical scheme:
a feedback type laser pulse processing method of multilayer composite material is suitable for laser pulse processing equipment, wherein the laser pulse processing equipment comprises a laser removing device, an imaging device and a coaxial exposure device;
the laser pulse processing method comprises the following steps:
s1, acquiring an initial image of the upper surface of a multilayer composite material through an imaging device, and determining an initial processing area of the multilayer composite material according to the initial image;
s2, adjusting the processing parameters of the laser removing device, and carrying out laser ablation on the initial processing area through an ablation laser beam emitted by the laser removing device;
s3, determining the central wavelength of coaxial light emitted by a coaxial exposure device according to the material components and the optical characteristics of the multilayer composite material, performing instantaneous exposure by using the coaxial exposure device, acquiring an exposure feedback image of the upper surface of the multilayer composite material ablated by laser in the step S2 by using an imaging device, and determining a continuous processing area of the multilayer composite material according to the exposure feedback image;
s4, if the ratio of the area of the continuous processing area to the area of the initial processing area is smaller than a set value, processing the multilayer composite material;
if the ratio of the area of the continuous processing area to the area of the initial processing area is larger than or equal to a set value, adjusting the processing parameters of the laser removing device, carrying out laser ablation on the continuous processing area through an ablation laser beam emitted by the laser removing device, and repeating the step S3 to update the continuous processing area.
Preferably, in step S3, the absorption rate of the adhesion layer in the multilayer composite material to the coaxial light is not lower than 40%, the reflection rate of the matrix layer in the multilayer composite material to the coaxial light is not lower than 40%, or the matrix layer in the multilayer composite material has a light-exhibiting property to the coaxial light.
Preferably, in step S3, the exposure time of the coaxial exposure device is 0.1 to 100ms.
Preferably, in steps S2 and S4, the processing parameters to be adjusted include pulse energy, scanning speed and scanning interval of the ablation laser beam, the pulse width of the ablation laser beam emitted by the laser removing device is less than 20ns, and the maximum pulse repetition frequency is not less than 1kHz.
Preferably, the laser pulse processing equipment further comprises a paraxial lighting device;
s1, determining the central wavelength of paraxial light emitted by a paraxial lighting device according to the material components and the optical characteristics of the multilayer composite material, lighting by using the paraxial lighting device, acquiring an initial image of the upper surface of the multilayer composite material after lighting through an imaging device, and determining an initial processing area of the multilayer composite material according to the initial image.
Preferably, the adhesion layer in the multilayer composite has a reflectivity of no less than 40% of said off-axis light.
Preferably, in step S4, a set value of a ratio of an area of the continuous machining region to an area of the initial machining region is 10% or less.
The feedback type laser pulse processing equipment of the multilayer composite material is applied to the feedback type laser pulse processing method of the multilayer composite material, and comprises a laser removing device, an imaging device, a coaxial exposure device, a paraxial lighting device and a moving platform, wherein the laser removing device, the imaging device, the coaxial exposure device and the paraxial lighting device are relatively static, and the moving platform is used for moving the laser removing device, the imaging device, the coaxial exposure device and the paraxial lighting device or the moving platform is used for moving the multilayer composite material;
the laser removing device comprises a laser, a scanning galvanometer, a scanning lens and a deflection lens which are arranged in sequence;
the imaging device comprises an imaging camera, an imaging lens and an optical filter which are arranged in sequence;
the coaxial exposure device comprises a coaxial exposure light source, a selective multicolor reflector, a selective monochromatic reflector and an imaging objective lens which are sequentially arranged, the scanning galvanometer, the scanning lens, the deflection lens and the selective monochromatic reflector are positioned on the same light path, and the imaging camera, the imaging lens, the optical filter and the selective multicolor reflector are positioned on the same light path;
the paraxial illumination device comprises a paraxial light source, and the paraxial light source is close to the imaging objective lens.
Preferably, the laser removing device further comprises a beam expander, and the beam expander is arranged between the laser and the scanning galvanometer.
Preferably, the scanning lens comprises any one of an F-Theta field lens and an aspherical lens, and the deflection lens comprises any one of an infinite correction sleeve lens or a spherical lens;
the laser removing device also comprises a plurality of laser reflectors, and the plurality of laser reflectors are arranged between the deflection lens and the selective monochromatic reflector;
the laser removing device further comprises a plurality of laser lenses, and the laser lenses are arranged between the laser and the scanning galvanometer.
The technical scheme provided by the embodiment of the application can have the following beneficial effects:
1. instantaneous exposure is carried out by utilizing a coaxial exposure device, which is beneficial to obtaining a clear image at the bottom of a processing area; in addition, the instantaneous exposure is favorable for increasing the brightness of a light source during exposure, and compared with a common lighting mode, the instantaneous exposure is favorable for improving the illumination intensity and is more favorable for realizing a stable and accurate feedback process. Furthermore, the coaxial light source has smaller arrangement space and more severe heat dissipation conditions, and works in an instantaneous exposure mode, so that the power of the illumination light source can be reduced on the premise of ensuring the illumination brightness, and the heat dissipation requirement is reduced. Furthermore, through the feedback type laser pulse processing, offline monitoring and evaluation of the processed multilayer composite material are not needed, the equipment cost in the production process of the multilayer composite material is reduced, the process flow in the production process is reduced, the damage of the base layer material in the multilayer composite material can be effectively avoided, the product yield is greatly improved, and the product cost is reduced.
2. The upper surface of the multilayer composite material is preferably illuminated by the illumination light provided by the paraxial light source, and the paraxial illumination device has larger arrangement space and better heat dissipation condition, so that the higher-power illumination light source can be used, continuous illumination is realized, the brightness and uniformity of large-range illumination are ensured, the paraxial illumination light can cover a larger area of the upper surface of the multilayer composite material, a more uniform illumination effect is formed in the whole field of view, the problem of poor image edge illumination effect is avoided, the identification of an initial processing area is facilitated, and the scanning positioning in the laser ablation process is facilitated.
3. In order to match with a processing method, a scanning galvanometer, a scanning lens, a deflection lens and a selective monochromatic reflector in processing equipment are positioned on the same light path, so that an ablation laser beam emitted by a laser sequentially passes through the scanning galvanometer, the scanning lens, the deflection lens, the selective monochromatic reflector and an imaging objective lens to perform laser ablation on the upper surface of the multilayer composite material, and meanwhile, coaxial light emitted by a coaxial exposure light source sequentially passes through the selective polychromatic reflector, the selective monochromatic reflector and the imaging objective lens to perform ambiguous exposure on the upper surface of the multilayer composite material, and the exposure and the laser scanning are coaxial, so that accurate positioning in the scanning process can be realized for an exposure feedback image and an initial image; and the imaging camera, the imaging lens, the optical filter and the selective multicolor reflector are positioned on the same light path, so that the laser removing device and the imaging device share the imaging objective lens, the tail ends of the laser removing device and the imaging device are coaxial, additional mechanical movement is not needed in the imaging and laser scanning process, equipment system errors and efficiency loss caused by repeated mechanical movement are eliminated, and mechanical movement is not needed in the connection and switching between the steps S2 and S3, so that the effective implementation of the feedback type laser pulse processing method is ensured.
Drawings
FIG. 1 is a schematic flow chart of a feedback laser pulse processing method for a multilayer composite material according to the present invention.
FIG. 2 is a schematic structural diagram of a feedback laser pulse processing apparatus for multilayer composite materials according to the present invention.
FIG. 3 is a schematic diagram of the structure of an unprocessed multilayer composite in embodiment 1 of the method for laser pulse processing of a multilayer composite according to the present invention.
FIG. 4 is a first exposure feedback image of a method of feedback laser pulse processing of a multilayer composite according to embodiment 1 of the present invention.
Fig. 5 is a schematic structural diagram of a multilayer composite processed in embodiment 1 of the feedback laser pulse processing method of the multilayer composite according to the present invention.
Wherein: the device comprises a laser removing device 1, a laser 11, a scanning galvanometer 12, a scanning lens 13, a deflection lens 14 and a beam expander 15;
an imaging device 2, an imaging camera 21, an imaging lens 22, a filter 23;
a coaxial exposure device 3, a coaxial exposure light source 31, a selective multicolor reflector 32, a selective monochromatic reflector 33 and an imaging objective lens 34;
a paraxial lighting device 4;
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
The technical scheme provides a feedback type laser pulse processing method of a multilayer composite material, which is suitable for laser pulse processing equipment, wherein the laser pulse processing equipment comprises a laser removing device 1, an imaging device 2 and a coaxial exposure device 3;
the laser pulse processing method comprises the following steps:
s1, acquiring an initial image of the upper surface of a multilayer composite material 5 through an imaging device 2, and determining an initial processing area 501 of the multilayer composite material 5 according to the initial image;
s2, adjusting the processing parameters of the laser removing device 1, and carrying out laser ablation on the initial processing area 501 through an ablation laser beam emitted by the laser removing device 1;
s3, determining the central wavelength of coaxial light emitted by the coaxial exposure device 3 according to the material components and the optical characteristics of the multilayer composite material 5, carrying out instantaneous exposure by using the coaxial exposure device 3, acquiring an exposure feedback image of the upper surface of the multilayer composite material 5 ablated by laser in the step S2 through the imaging device 2, and determining a continuous processing area of the multilayer composite material 5 according to the exposure feedback image;
s4, if the ratio of the area of the continuous processing area to the area of the initial processing area 501 is smaller than a set value, processing the multilayer composite material 5 is finished;
if the ratio of the area of the continuous processing area to the area of the initial processing area 501 is greater than or equal to a set value, adjusting the processing parameters of the laser removing device 1, performing laser ablation on the continuous processing area through an ablation laser beam emitted by the laser removing device 1, and repeating the step S3 to update the continuous processing area.
In order to avoid damage to a base layer material in a multilayer composite material, the technical scheme provides a feedback type laser pulse processing method for fine processing of the multilayer composite material, the method obtains an exposure feedback image in the processing process, and continuously adjusts and updates the range and laser parameters of a processing area in the processing process through the exposure feedback image so as to prevent the damage to the base layer material of the area where the removal material is firstly removed, which is caused by the fact that part of materials in the processing area in an adhesion layer are firstly removed under the non-laser effect due to different components and thicknesses of materials in different layers and the difference of interface bonding force of adjacent material layers.
Specifically, the feedback laser pulse processing method of the present embodiment includes the following steps, and a schematic flow chart thereof is shown in fig. 1:
firstly, the upper surface of a multilayer composite material 5 to be processed is photographed through an imaging device 2 to obtain an initial image of the upper surface, and an initial processing area 501 of the multilayer composite material 5 is determined according to the initial image; the initial processing area 501 may be determined based on an identification point on the upper surface of the multilayer composite material 5 in the initial image, or may be determined based on a processing range set in advance by the controller, which is not limited herein.
After obtaining the initial processing area 501 of the multilayer composite material 5 to be processed, laser ablation needs to be performed on the area, but before laser ablation, processing parameters of the laser removing device 1 emitting the ablation laser beam need to be adjusted according to actual conditions such as the removal depth, the processing effect and the like, and the processing parameters include, but are not limited to, the pulse width, the maximum pulse repetition frequency, the pulse energy, the scanning speed and the scanning interval of the ablation laser beam emitted by the laser removing device 1, so as to meet the processing requirements.
After the primary laser ablation in step S2, in order to obtain the ablation condition of the upper surface of the multilayer composite material 5 at this time, so as to facilitate adjustment of the processing area and the processing parameters of the next laser ablation, so as to prevent damage to the base layer material of the multilayer composite material 5 due to removal of the processing parameters with too large depth and the processing areas with too wide width, in the present scheme, after step S2, instantaneous exposure is performed through the coaxial exposure device 3, an exposure feedback image of the upper surface of the multilayer composite material 5 ablated by the laser in step S2 is acquired through the imaging device 2, and a continuous processing area (i.e., the processing area of the next laser ablation) of the multilayer composite material 5 is determined according to the actual exposure feedback image condition, so as to facilitate improvement of the processing controllability of the multilayer composite material and realize feedback laser pulse processing. Meanwhile, the scheme is also specially provided with a finishing mark after the processing is finished, when the ratio of the area of the continuous processing area to the area of the initial processing area 501 is smaller than a set value, the processing of the multilayer composite material 5 is finished, when the ratio of the area of the continuous processing area to the area of the initial processing area 501 is larger than or equal to the set value, the processing parameters of the laser removing device 1 which sends the ablation laser beam are adjusted again according to the actual conditions such as the removal depth, the processing effect and the like, and then the laser ablation is carried out on the continuous processing area until the ratio of the area of the continuous processing area to the area of the initial processing area 501 is smaller than the set value, and then the processing process is finished.
The scheme utilizes the coaxial exposure device 3 to carry out instantaneous exposure so as to acquire an exposure feedback image of the upper surface of the multilayer composite material 5 ablated by laser in the step S2. Because the coaxial light source of the coaxial exposure device 3 is emitted to the upper surface of the multilayer composite material 5 from top to bottom, a clear image at the bottom of the processing area can be obtained; after the primary laser ablation, the upper surface of the multilayer composite material 5 has a height difference, and at this time, if a non-coaxial light source is used for illuminating the multilayer composite material, shadows may appear in the feedback image, so that the definition of the feedback image is greatly reduced, and the processing precision of the subsequent laser ablation is influenced; in addition, the instantaneous exposure is favorable for increasing the brightness of a light source during exposure, and compared with a common lighting mode, the instantaneous exposure is favorable for improving the illumination intensity and is more favorable for realizing a stable and accurate feedback process. Furthermore, the coaxial light source has smaller arrangement space and more severe heat dissipation conditions, and works in an instantaneous exposure mode, so that the power of the illumination light source can be reduced on the premise of ensuring the illumination brightness, and the heat dissipation requirement is reduced. Furthermore, by the feedback type laser pulse processing, offline monitoring and evaluation of the processed multilayer composite material are not needed, equipment cost in the production process of the multilayer composite material is reduced, the process flow in the production process is reduced, damage to a base layer material in the multilayer composite material can be effectively avoided, the product yield is greatly improved, and the product cost is reduced.
Since the multilayer composite material referred to in this embodiment is a composite body including at least two materials having different physical properties, materials that can achieve composite include, but are not limited to, metals, ceramics, semiconductors, and polymers. Typical multilayer composites include metal-polymer two-layer composites, metal-metal two-layer composites, metal-ceramic two-layer composites, metal-semiconductor two-layer composites, metal-polymer-metal three-layer composites, and the like. In addition, the polymer also comprises a high molecular polymer and a composite material consisting of the high molecular polymer. And because the absorptivity and reflectivity of materials with different physical properties to the light source are different, in order to improve the definition of an exposure feedback image and enhance the contrast of different materials in the image, the scheme further determines the central wavelength of coaxial light emitted by the coaxial exposure device 3 according to the material components and the optical characteristics of the multilayer composite material 5, so as to more accurately determine a subsequent continuous processing area.
It should be noted that laser ablation refers to laser fluence exceeding the ablation threshold of the material, so that the material is separated from the surface by phase explosion, vaporization, evaporation or columbic explosion, and the laser ablation process of the present embodiment can be realized by scanning the ablation laser beam line by line or column by column, which is not limited herein.
To be more specific, in step S3, the absorption rate of the adhesion layer 51 in the multilayer composite material 5 to the coaxial light is not lower than 40%, the reflectivity of the matrix layer 52 in the multilayer composite material 5 to the coaxial light is not lower than 40%, or the matrix layer 52 in the multilayer composite material 5 has a light-exhibiting property to the coaxial light.
In order to further improve the feedback precision of the processing method, the scheme further determines the central wavelength of the coaxial light according to the components and optical characteristics of the adhesion layer and the substrate layer material of the multilayer composite material to be processed, and preferably, the absorption rate of the adhesion layer 51 in the multilayer composite material 5 to the coaxial light is not lower than 40%, the reflectivity of the substrate layer 52 in the multilayer composite material 5 to the coaxial light is not lower than 40%, or the substrate layer in the multilayer composite material 5 has a light-showing characteristic to the coaxial light, so that under the same exposure condition, the brightness of the laser-removed area in the adhesion layer 51 is obviously higher than that of other areas, so as to more accurately determine the subsequent continuous processing area.
The light-appearing property means that the material emits light of another wavelength (i.e., emitted light) under the irradiation of light of a certain wavelength range (i.e., irradiation light), and the difference between the central wavelength of the irradiation light and the central wavelength of the emitted light is more than 10 nm. The adhesion layer 51 of the multilayer composite material 5 in the scheme refers to a material layer which is positioned at the top of the multilayer composite material 5 and is provided with a material to be subjected to laser ablation; and substrate layer 52 refers to the layer of material that is in contact with the material being laser ablated and where the material needs to remain.
In step S3, the exposure time of the coaxial exposure device 3 is 0.1 to 100ms.
In an embodiment of the present technical solution, the exposure time of the coaxial exposure device 3 in step S3 is preferably 0.1 to 100ms, which is beneficial to clear and stabilize the imaging of the exposure feedback image to meet the feedback requirement.
More specifically, in steps S2 and S4, the processing parameters to be adjusted include pulse energy, scanning speed and scanning interval of the ablation laser beam, the pulse width of the ablation laser beam emitted by the laser removal device 1 is less than 20ns, and the maximum pulse repetition frequency is not less than 1kHz.
In an embodiment of the present disclosure, on the premise of maintaining a relatively fixed pulse width and a maximum pulse repetition frequency, the pulse energy, the scanning speed, and the scanning pitch of the ablation laser beam according to the actual processing requirement are more favorable for improving the controllability of the processing process, so as to realize the fine processing of the multilayer composite material.
To explain further, the laser pulse processing equipment further comprises a paraxial illumination device 4;
step S1, determining the central wavelength of paraxial light emitted by a paraxial illumination device 4 according to the material composition and the optical characteristics of the multilayer composite material 5, illuminating by using the paraxial illumination device 4, acquiring an initial image of the upper surface of the multilayer composite material 5 after illumination through an imaging device 2, and determining an initial processing area 501 of the multilayer composite material 5 according to the initial image.
In a preferred embodiment of the present invention, in order to improve the sharpness of the initial image captured for the first time and to compare with the exposure feedback image more accurately, the processing method of the present invention further utilizes the paraxial illumination device 4 to illuminate, and the initial image with sufficient brightness is adopted on the basis of the illumination light provided by the paraxial illumination device 4.
Compared with the illuminating light provided by a coaxial light source, the illuminating light provided by the paraxial light source is preferably used for illuminating the upper surface of the multilayer composite material 5, and the paraxial illuminating device 4 has larger arrangement space and better heat dissipation condition, so that the illuminating light source with higher power can be used, continuous illumination is realized, and the brightness and uniformity of large-range illumination are ensured, so that the paraxial illuminating light can cover a larger area of the upper surface of the multilayer composite material, a more uniform illuminating effect is formed in the whole field of view, the problem of poor image edge illuminating effect is avoided, the identification of the initial processing area 501 is facilitated, and the scanning and positioning in the laser ablation process are facilitated.
Stated further, the adhesion layer 51 in the multilayer composite 5 has a reflectivity of not less than 40% for the paraxial light.
In order to further improve the definition of the initial image, the present solution further determines the central wavelength of the off-axis light according to the material composition and optical characteristics of the adhesion layer of the multilayer composite material 5, and preferably, the reflectance of the adhesion layer 51 in the multilayer composite material 5 to the off-axis light is not lower than 40%, so as to effectively prevent the too low reflectance from easily reducing the brightness of the initial image, which results in the disadvantages of the profile recognition of the initial processing area 501 and the scanning positioning during the laser ablation.
In step S4, the ratio of the area of the continuous machining region to the area of the initial machining region 501 is set to 10% or less.
As one of the preferred embodiments of the present invention, the maximum value of the ratio of the area of the continuous processing region to the area of the initial processing region 501 is set to 10% so as to ensure sufficient removal of the material of the initial processing region 501 of the adhesion layer 51.
A feedback type laser pulse processing device of a multilayer composite material is applied to the feedback type laser pulse processing method of the multilayer composite material, and comprises a laser removing device 1, an imaging device 2, a coaxial exposure device 3, a paraxial illumination device 4 and a moving platform, wherein the laser removing device 1, the imaging device 2, the coaxial exposure device 3 and the paraxial illumination device 4 are relatively static, and the moving platform is used for moving the laser removing device 1, the imaging device 2, the coaxial exposure device 3 and the paraxial illumination device 4 or the moving platform is used for moving a multilayer composite material 5;
the laser removing device 1 comprises a laser 11, a scanning galvanometer 12, a scanning lens 13 and a deflection lens 14 which are arranged in sequence;
the imaging device 2 comprises an imaging camera 21, an imaging lens 22 and an optical filter 23 which are arranged in sequence;
the coaxial exposure device 3 comprises a coaxial exposure light source 31, a selective multicolor reflecting mirror 32, a selective monochromatic reflecting mirror 33 and an imaging objective lens 34 which are sequentially arranged, the scanning galvanometer 12, the scanning lens 13, the deflection lens 14 and the selective monochromatic reflecting mirror 33 are positioned on the same light path, and the imaging camera 21, the imaging lens 22, the optical filter 23 and the selective multicolor reflecting mirror 32 are positioned on the same light path;
the paraxial illumination means 4 comprise a paraxial light source which is arranged close to the imaging objective 34.
The scheme also provides feedback type laser pulse processing equipment for the multilayer composite material, which is matched with a laser pulse processing method, can effectively improve the technical problem of poor processing controllability of the existing laser pulse processing method through lower equipment cost, and is favorable for ensuring the processing quality of the multilayer composite material.
Specifically, as shown in fig. 2, the processing equipment of the present solution includes a laser removing device 1 for emitting an ablation laser beam, an imaging device 2 for imaging an initial image and an exposure feedback image, a coaxial exposure device 3 for performing instantaneous exposure, a paraxial illumination device 4 for performing paraxial illumination, and a moving platform (not shown in the figure) for realizing scanning movement during laser ablation.
More specifically, the laser removal device 1 in the present embodiment includes a laser 11, a scanning galvanometer 12, a scanning lens 13, and a deflection lens 14. Wherein the laser 11 is used to emit an ablation laser beam to the scanning galvanometer 12. The scanning galvanometer 12 is used to direct the ablation laser beam to a scanning lens 13 which can effect a two-dimensional oscillation of the laser beam to direct the ablation laser beam to the desired optical component. The scanning lens 13 may convert the two-dimensional wobble of the laser beam into in-plane movement for directing the ablation laser beam to the deflection lens 14. Deflection lens 14 may effect deflection of the laser beam to direct the ablative laser beam to selective monochromatic mirror 33.
The imaging device 2 includes an imaging camera 21, an imaging lens 22, and an optical filter 23, which are arranged in this order. The imaging camera 21 is used for imaging the initial image and the exposure feedback image, and may be a CCD camera or a CMOS camera. The imaging lens 22 is used for realizing imaging in cooperation with the imaging camera 21 and the imaging objective lens 34, and can be an achromatic cemented lens or an achromatic lens group coated with a broadband film, and the transmittance at 300-650nm is preferably not lower than 80% so as to reduce the illumination loss of an imaging system and ensure the imaging quality. The optical filter 23 may comprise a single or multiple optical filters, and the optical filter is transparent to the illumination light emitted from the paraxial light source, preferably, the transmittance of the optical filter to the illumination light is not lower than 80%; but is not transparent to the ablation laser beam emitted by the laser 11, and preferably has a transmittance of not higher than 1% for the ablation laser beam, so as to avoid the ablation laser beam reflected by the surface of the multilayer composite material from damaging the imaging camera 21 on the premise of ensuring the imaging quality of the initial image.
As a preference of this embodiment, the filter 23 can further achieve high transmission or cut-off of the coaxial light emitted from the coaxial exposure light source 31 according to the response characteristics of the base layer 52 to the coaxial light emitted from the coaxial exposure light source 31 in the multi-layer composite material. When the reflectivity of the substrate layer 52 in the multilayer composite material 5 to the coaxial light is not lower than 40%, the optical filter 23 is designed to realize high transmittance to the coaxial light emitted by the coaxial exposure light source 31, and preferably, the transmittance of the optical filter 23 to the coaxial light emitted by the coaxial exposure light source 31 is not lower than 60%; when the base layer 52 in the multilayer composite 5 has a light-revealing property to on-axis light, the transmittance of the optical filter 23 to on-axis light emitted from the on-axis exposure light source 31 is preferably less than 1%.
In addition, the coaxial exposure device 3 of the present embodiment includes a coaxial exposure light source 31, a selective multicolor mirror 32, a selective monochromatic mirror 33, and an imaging objective lens 34, which are sequentially provided. In which the coaxial exposure light source 31 is used to achieve instantaneous exposure. The selective multicolor mirror 32 can transmit the coaxial light emitted by the coaxial exposure light source 31; generally, in order to cooperate with the imaging device 2 and the coaxial exposure device 3, the photosensitive wavelength of the imaging camera 21 is generally selected to be 350-650nm, so that the equipment difficulty of the processing equipment is reduced on the premise of meeting the implementation of the processing method, the scheme further preferably selects that the transmittance of the selective multicolor reflecting mirror 32 to the coaxial light is not lower than 60%, the selective multicolor reflecting mirror reflects light with other wavelengths in other 350-650nm wave bands, and the reflectivity is not lower than 80%. If the transmittance of the selective multicolor reflector 32 is too low, the lamp bead power of the coaxial exposure light source 31 may need to be increased in the acquisition process of the exposure feedback image, which is difficult to implement; if the reflectivity of the selective multi-color mirror 32 is too low, the brightness of the initial image is easily darker, which is not favorable for identification and scanning positioning. The selective monochromatic mirror 33 is used to reflect the ablative laser beam while transmitting the light emitted by the paraxial light source and the coaxial exposure light source 31, preferably with a reflectivity of the ablative laser beam of not less than 80% and a transmissivity of the coaxial light and the paraxial light of not less than 60%. The imaging objective lens 34 is a broadband film-coated microscope objective lens which can transmit coaxial light, paraxial light and ablation laser, and has a transmittance of not less than 60%.
Furthermore, the reflectivity and transmissivity characteristics of the selective multicolor reflector 32, the selective monochromatic reflector 33 and the imaging objective lens 34 are combined in the scheme, so that on one hand, the excellent coaxial exposure effect is realized, and simultaneously, the power requirement on a coaxial exposure light source is reduced, and the space arrangement and heat dissipation requirements of the coaxial exposure device 3 are met; on the other hand, the imaging device 2 can give consideration to the imaging quality during coaxial exposure and paraxial illumination; on the other hand, the scanning galvanometer 12, the scanning lens 13, the deflection lens 14 and the selective monochromatic reflector 33 are located on the same light path, so that an ablation laser beam emitted by the laser 11 sequentially passes through the scanning galvanometer 12, the scanning lens 13, the deflection lens 14, the selective monochromatic reflector 33 and the imaging objective lens 34 to perform laser ablation on the upper surface of the multilayer composite material, meanwhile, coaxial light emitted by the coaxial exposure light source 31 sequentially passes through the selective polychromatic reflector 32, the selective monochromatic reflector 33 and the imaging objective lens 34 to expose the upper surface of the multilayer composite material, and the exposure and the laser scanning are coaxial, so that accurate positioning in the scanning process of an exposure feedback image and an initial image can be ensured; in addition, the imaging camera 21, the imaging lens 22, the optical filter 23 and the selective multicolor reflector 32 are located on the same light path, so that the laser removing device 1 and the imaging device 2 share the imaging objective lens 34, and the tail ends of the laser removing device 1 and the imaging device 2 are coaxial, so that no additional mechanical movement is needed in the imaging and laser scanning processes, equipment system errors and efficiency loss caused by repeated mechanical movement are eliminated, and no mechanical movement is needed for connection and switching between the steps S2 and S3, so that the effective implementation of the feedback type laser pulse processing method is ensured.
Preferably, the feedback laser pulse processing apparatus of the present disclosure further includes a controller (not shown in the figure), and the controller is electrically connected to the laser removal device 1, the imaging device 2, the coaxial exposure device 3, the paraxial illumination device 4, and the mobile platform, respectively, so as to improve controllability of the processing apparatus.
Further, the laser removal device 1 further includes a beam expander 15, and the beam expander 15 is disposed between the laser 11 and the scanning galvanometer 12.
In a preferred embodiment of the present technical solution, the laser removing apparatus 1 further includes a beam expander 15, which is used for enlarging the size of a light spot of the emitted laser beam, so that the processing equipment can meet the processing requirement.
To explain further, the scan lens 13 includes any one of an F-Theta field lens and an aspherical lens, and the deflection lens 14 includes any one of an infinity corrected sleeve lens or a spherical lens;
the laser removing device 1 further comprises a plurality of laser mirrors, and the plurality of laser mirrors are arranged between the deflection lens 14 and the selective monochromatic mirror 33;
the laser removing device 1 further includes a plurality of laser lenses, and the plurality of laser lenses are disposed between the laser 11 and the scanning galvanometer 12.
In another preferred embodiment of the present invention, the laser removing apparatus 1 further comprises a plurality of laser mirrors (not shown) for reflecting the ablation laser beam, so as to meet the processing requirements of the processing equipment and reduce the occupied space of the processing equipment; in addition, the laser removing apparatus 1 further includes a plurality of laser lenses (not shown), and in some cases, the ablation laser beam may also pass through a plurality of laser lenses before entering the scanning galvanometer 12, so as to achieve functions of collimation, diffusion, beam contraction, beam mode change, and the like.
Examples
The schematic structural diagram of the processed copper-aluminum double-layer composite material is shown in fig. 3, wherein the material of the adhesion layer 51 is copper, and the material of the base layer 52 is aluminum.
S1, determining that the center wavelength of paraxial light emitted by a paraxial lighting device is 625nm according to the material components and the optical characteristics of the composite material, lighting by using the paraxial lighting device, acquiring an initial image of the upper surface of the composite material after lighting through an imaging device, and determining an initial processing area 501 of the composite material according to the initial image;
s2, adjusting processing parameters of the laser removal device, and performing laser ablation on the initial processing area 501 through an ablation laser beam emitted by the laser removal device 1, wherein the pulse width of the ablation laser beam is 3 nanoseconds, the maximum pulse repetition frequency is 200kHz, and the central wavelength is 1064nm;
s3, determining that the central wavelength of coaxial light emitted by a coaxial exposure device is 310nm according to the material components and the optical characteristics of the composite material, performing instantaneous exposure by using the coaxial exposure device, acquiring an exposure feedback image of the upper surface of the composite material ablated by laser in the step S2 through an imaging device, and determining a continuous processing area of the composite material according to the exposure feedback image, wherein the exposure feedback image acquired for the first time is shown in FIG. 4, and a white area in the image is the continuous processing area;
step S4, if the ratio of the area of the continuous processing region to the area of the initial processing region 501 is less than 10%, the processing of the composite material is completed, and the structural schematic diagram of the processed composite material is shown in fig. 5;
if the ratio of the area of the continuous processing area to the area of the initial processing area 501 is greater than or equal to 10%, adjusting the processing parameters of the laser removal device, performing laser ablation on the continuous processing area through an ablation laser beam emitted by the laser removal device, and repeating the step S3 to update the continuous processing area.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an", and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.
The relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise. Meanwhile, it should be understood that the sizes of the respective portions shown in the drawings are not drawn in an actual proportional relationship for the convenience of description. Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate. In all examples shown and discussed herein, any particular value should be construed as exemplary only and not as limiting. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
In the description of the present invention, it is to be understood that the orientation or positional relationship indicated by the orientation words such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal" and "top, bottom", etc. are usually based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and in the case of not making a reverse description, these orientation words do not indicate and imply that the device or element being referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore, should not be considered as limiting the scope of the present invention; the terms "inner and outer" refer to the inner and outer relative to the profile of the respective component itself.
For ease of description, spatially relative terms such as "above … …", "above … …", "above … … upper surface", "above", etc. may be used herein to describe the spatial positional relationship of one device or feature to other devices or features as shown in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" may include both orientations of "above … …" and "below … …". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
It should be noted that the terms "first", "second", and the like are used to define the components, and are only used for convenience of distinguishing the corresponding components, and the terms have no special meanings unless otherwise stated, and therefore, the scope of the present invention should not be construed as being limited.
It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are capable of operation in sequences other than those illustrated or described herein.
The technical principle of the present invention is described above in connection with specific embodiments. The description is made for the purpose of illustrating the principles of the invention and should not be construed in any way as limiting the scope of the invention. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without inventive effort, which would fall within the scope of the present invention.
Claims (10)
1. A feedback type laser pulse processing method of a multilayer composite material is characterized by being suitable for laser pulse processing equipment, wherein the laser pulse processing equipment comprises a laser removing device, an imaging device and a coaxial exposure device;
the laser pulse processing method comprises the following steps:
s1, acquiring an initial image of the upper surface of a multilayer composite material through an imaging device, and determining an initial processing area of the multilayer composite material according to the initial image;
s2, adjusting the processing parameters of the laser removing device, and carrying out laser ablation on the initial processing area through an ablation laser beam emitted by the laser removing device;
s3, determining the central wavelength of coaxial light emitted by a coaxial exposure device according to the material components and the optical characteristics of the multilayer composite material, performing instantaneous exposure by using the coaxial exposure device, acquiring an exposure feedback image of the upper surface of the multilayer composite material ablated by laser in the step S2 by using an imaging device, and determining a continuous processing area of the multilayer composite material according to the exposure feedback image;
s4, if the ratio of the area of the continuous processing area to the area of the initial processing area is smaller than a set value, processing the multilayer composite material;
if the ratio of the area of the continuous processing area to the area of the initial processing area is larger than or equal to a set value, adjusting the processing parameters of the laser removing device, carrying out laser ablation on the continuous processing area through an ablation laser beam emitted by the laser removing device, and repeating the step S3 to update the continuous processing area.
2. The method according to claim 1, wherein in step S3, the absorption rate of the adhesion layer in the multilayer composite material to the coaxial light is not less than 40%, the reflectivity of the matrix layer in the multilayer composite material to the coaxial light is not less than 40%, or the matrix layer in the multilayer composite material has a light-exhibiting property to the coaxial light.
3. The method of claim 1, wherein in step S3, the exposure time of the coaxial exposure device is 0.1-100 ms.
4. The method of claim 1, wherein the processing parameters to be adjusted in steps S2 and S4 include pulse energy, scanning speed and scanning pitch of the ablation laser beam, the laser ablation device emits the ablation laser beam with a pulse width of less than 20ns and a maximum pulse repetition frequency of not less than 1kHz.
5. The method of claim 1, wherein the laser pulse processing apparatus further comprises a paraxial illumination device;
s1, determining the central wavelength of paraxial light emitted by a paraxial lighting device according to the material components and the optical characteristics of the multilayer composite material, lighting by using the paraxial lighting device, acquiring an initial image of the upper surface of the multilayer composite material after lighting through an imaging device, and determining an initial processing area of the multilayer composite material according to the initial image.
6. The method of claim 5, wherein the reflectivity of the adhesion layer of the multilayer composite to the paraxial light is not less than 40%.
7. The method of claim 1, wherein in step S4, the ratio of the area of the continuous processing region to the area of the initial processing region is set to be 10% or less.
8. A feedback laser pulse processing device of a multilayer composite material, which is applied to the feedback laser pulse processing method of the multilayer composite material of any one of claims 5 to 7, and comprises a laser removal device, an imaging device, a coaxial exposure device, a paraxial illumination device and a moving platform, wherein the laser removal device, the imaging device, the coaxial exposure device and the paraxial illumination device are relatively static, and the moving platform is used for moving the laser removal device, the imaging device, the coaxial exposure device and the paraxial illumination device, or the moving platform is used for moving the multilayer composite material;
the laser removing device comprises a laser, a scanning galvanometer, a scanning lens and a deflection lens which are arranged in sequence;
the imaging device comprises an imaging camera, an imaging lens and an optical filter which are arranged in sequence;
the coaxial exposure device comprises a coaxial exposure light source, a selective multicolor reflector, a selective monochromatic reflector and an imaging objective lens which are sequentially arranged, the scanning galvanometer, the scanning lens, the deflection lens and the selective monochromatic reflector are positioned on the same light path, and the imaging camera, the imaging lens, the optical filter and the selective multicolor reflector are positioned on the same light path;
the paraxial illumination device comprises a paraxial light source, and the paraxial light source is close to the imaging objective lens.
9. The apparatus of claim 8, wherein the laser ablation device further comprises a beam expander disposed between the laser and the scanning galvanometer.
10. The apparatus of claim 8, wherein the scanning lens comprises any one of an F-Theta field lens and an aspherical lens, and the deflecting lens comprises any one of an infinity corrected sleeve lens and a spherical lens;
the laser removing device also comprises a plurality of laser reflectors, and the plurality of laser reflectors are arranged between the deflection lens and the selective monochromatic reflector;
the laser removing device further comprises a plurality of laser lenses, and the laser lenses are arranged between the laser and the scanning galvanometer.
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