CN115921232A - Glue solution spin coating device, control method and system - Google Patents

Abstract

The invention provides a glue liquid spin-coating device, a control method and a system, wherein the device comprises a projection unit, a liquid transfer unit and a loading unit; the projection unit is positioned on the top side of the wafer and used for projecting a target point to the surface of the wafer, and the target point is used for positioning the wafer so as to enable the target point to be positioned at the center of the wafer; the liquid transfer unit is positioned between the wafer and the projection unit and is used for sucking and containing glue liquid required by one-time spin coating; the liquid transferring unit is also used for transferring the glue solution to the target point on the surface of the wafer to be spin-coated; the loading unit is positioned at the bottom side of the wafer and used for loading the wafer so as to enable the wafer and the loading unit to be relatively fixed; the loading unit is also used for driving the wafer to rotate, and the rotating shaft passes through the center of the wafer so as to enable the glue solution to diffuse along the surface of the wafer to form a coating. The device, the control method and the system are all used for solving the problem that photoresist samples are not uniformly coated on the wafer.

Description

Glue solution spin coating device, control method and system

Technical Field

The invention relates to the field of semiconductor manufacturing, in particular to a glue liquid spin-coating device, a control method and a system.

Background

In the fabrication of integrated circuit chips, the photolithography step is an important step, and the Photoresist (PR) material used in the photolithography step is one of the key materials in photolithography technology and one of the core materials in semiconductor fabrication. The uniform application of the photoresist material to the wafer surface is usually achieved by a paste developer (track) which works on the principle that: a gallon bottle of photoresist is arranged on a gluing developing machine and is connected with a pipeline, a wafer to be coated is placed in a gluing container, and then the photoresist in the pipeline is sprayed out to the wafer through an electronic pump (pump).

At present, a great amount of experiments are required to verify various performances of the photoresist in the development stage of the photoresist, so that a great amount of wafers are required to be coated for exposure and development experiments. In the prior art, the photoresist is not only coated on the surface of the wafer, but also a large amount of photoresist is consumed in the processes of filling the pipeline and spraying the thinner. If frequent experiments are performed to load photoresist into gallon bottles and then install the bottles into a glue developer, a large amount of photoresist is consumed, and a large amount of time and labor are required to install debugging pipelines, while the photoresist material sample development stage performs batch experiments under a large number of different conditions, wherein each sample batch is about 200-400 ml. In this case, the glue can be dropped manually onto the wafer surface, but it is difficult to visually observe the wafer center when the glue is dropped manually onto the wafer surface, and the photoresist on the wafer surface is unevenly diffused when the glue is dropped off the wafer center during spin coating, and even a region not covered by the photoresist exists in the wafer center, resulting in a poor product. Therefore, a new apparatus, a control method and a system for spin coating a photoresist solution are needed to improve the above problems.

Disclosure of Invention

The invention aims to provide a glue solution spin-coating device, a control method and a system, which are used for solving the problem that photoresist small samples are coated on a wafer unevenly.

In a first aspect, the present invention provides a glue solution spin-coating apparatus for spin-coating a glue solution on a wafer surface to form a coating, including: a projection unit, a pipetting unit and a loading unit; the projection unit is positioned on the top side of the wafer and used for projecting a target point to the surface of the wafer, and the target point is used for positioning the wafer so as to enable the target point to be positioned at the center of the wafer; the liquid transfer unit is positioned between the wafer and the projection unit and is used for sucking and containing glue liquid required by N times of spin coating; the liquid transferring unit is also used for transferring the glue solution to the target point on the surface of the wafer to be spin-coated; the loading unit is positioned at the bottom side of the wafer and used for loading the wafer so as to enable the wafer and the loading unit to be relatively fixed; the loading unit is also used for driving the wafer to rotate, and the rotating shaft passes through the center of the wafer so as to enable the glue solution to diffuse along the surface of the wafer to form a coating.

The device of the invention has the beneficial effects that: the liquid transferring unit is arranged to absorb and contain glue liquid required by N times of spin coating, and N is any positive integer; the liquid-transfering unit is also used for transferring the glue solution to the intersection point of the surface of the wafer to be spin-coated. The method and the device reduce the waste of glue solution and the time for installing the gallon sample pipeline, are favorable for saving the cost of the glue solution and quickening the development progress of the photoresist small sample. According to the wafer positioning method and device, the projection unit is arranged to project an intersection point to the surface of the wafer, and the projection intersection point is used for positioning the wafer so that the center of the wafer is located at the intersection point. The method and the device can avoid the situation that the dripped glue deviates from the center of the wafer, are favorable for uniform diffusion of the photoresist on the surface of the wafer during spin coating, and reduce the defect of finished products.

Optionally, the projection unit is provided as a reflective baffle; the surface of the reflecting baffle is provided with scale marks with cross points; the intersection point is projected on the surface of the wafer to form the target point; when the reflecting baffle is irradiated by a light source, projecting an image containing the scale marks on the surface of the wafer; the intersection of the scale lines in the image is located at the center of the wafer.

Optionally, the pipetting unit is provided as a pipette; the dropper is used for sucking glue solution; the dropper is also used for dripping glue liquid to the target point on the surface of the wafer. The method has the advantages that glue solution is dripped to the target point on the surface of the wafer through the arranged dropper, so that the glue solution is coated at the center of the wafer; according to the embodiment, the dropper is arranged to absorb and contain the glue solution required by spin coating and directly coat the glue solution on the surface of the wafer, a glue solution pipeline and a gallon bottle are not required to be arranged, the operation is convenient, the glue solution required by far exceeding the process is not required to fill the pipeline, the glue solution cost is saved, and the development progress of photoresist samples is accelerated.

Optionally, the loading unit includes a first robot arm, a suction cup and a motor; the first mechanical arm is used for loading the wafer onto the sucker and unloading the wafer after coating is finished; the sucker is used for applying negative pressure to the wafer after the wafer is positioned so as to fix the wafer relative to the sucker; the motor is connected with the sucker and used for driving the sucker to bear the wafer attached with the glue solution to rotate so as to enable the glue solution to do centrifugal motion along the surface of the wafer.

Optionally, a diluting unit is arranged on one side of the loading unit and used for containing a diluent; the diluting unit is used for spraying a diluting agent to the surface of the wafer so that the diluting agent removes particles and glue solution on the surface of the wafer.

Optionally, the device further comprises a liquid collecting unit; the liquid collecting unit is arranged on the outer side of the loading unit and is used for collecting the glue solution, the diluent and the particles which are separated from the surface of the wafer.

In a second aspect, the present invention provides a method for controlling a spin coating apparatus for glue solution, the method comprising: s1, controlling a first mechanical arm to load a wafer to a loading unit so that the wafer and the loading unit are relatively fixed, and the center of the wafer is superposed with the rotating axis of the loading unit; s2, acquiring a projected image of a projection unit on the wafer, wherein a target point in the image is positioned at the center of the wafer; s3, controlling a second mechanical arm to transfer the glue solution in the liquid transfer unit to the target point; s4, controlling a loading unit to drive the wafer to rotate in an accelerated manner so as to enable the glue solution to diffuse along the surface of the wafer to form a coating; s5, controlling a loading unit to drive the wafer to rotate to be static at a reduced speed; and controlling the loading unit and the first mechanical arm to unload the wafer.

Optionally, before S3, the method further includes controlling a second mechanical arm to make the pipetting unit suck the glue solution required by N times of spin coating, where N is any positive integer.

In a third aspect, the present invention provides a glue spin coating system, comprising a chamber, a baffle door, an induction unit, a processing unit, and the apparatus of any one of the first aspect; the cavity is arranged on the outer side of the device and used for preventing particles outside the cavity from contacting the wafer; the baffle door is arranged at the opening of the cavity and is used for sealing the cavity when the baffle door is in a closed state; the baffle door is used for communicating the cavity with the atmosphere when in an open state; the sensing unit is connected with the baffle door; the loading unit and the sensing unit are electrically connected with the processing unit; the sensing unit is used for sending a state signal of the baffle door to the processing unit when being powered on; the processing unit is used for controlling the loading unit to drive the wafer to rotate according to the state signal.

Optionally, the processing unit is further configured to control the sensing unit to be powered on or powered off.

Drawings

Fig. 1 is a schematic structural diagram of a glue spin-coating apparatus provided in the present invention;

FIG. 2 is a schematic bottom view of a projection unit according to the present invention;

FIG. 3 is a schematic structural diagram of a glue solution spin-coating apparatus with a dilution unit according to the present invention;

FIG. 4 is a schematic structural diagram of a glue solution spin-coating device with a mechanical arm according to the present invention;

FIG. 5 is a schematic flow chart illustrating a method for controlling a glue-spin-coating apparatus according to the present invention;

FIG. 6 is a schematic view of a broken line of test point numbers obtained by dropping photoresist through a mechanical arm and related to the thickness of a photoresist coating film;

FIG. 7 is a broken line diagram of test point numbers obtained by manually dropping photoresist according to the present invention with respect to the thickness of the photoresist coating.

Reference numbers in the figures:

1. a loading unit; 2. a wafer; 21. a first robot arm; 3. a liquid collecting unit; 31. an inner wall; 32. an outer wall; 33. a cavity; 4. a projection unit; 5. a pipetting unit; 51. a second robot arm; 61. a first dilution unit; 62. a second dilution unit; 63. a third dilution unit; 7. a vacuum unit; 8. a cavity; 81. a flapper door; 82. a sensing unit; 9. and a processing unit.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings of the present invention, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention. Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs. As used herein, the word "comprising" and similar words are intended to mean that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items.

Fig. 1 is a schematic structural view of a glue spin-coating apparatus provided by the present invention.

To solve the problems in the prior art, as shown in fig. 1, the present invention provides a glue solution spin coating apparatus for spin-coating a glue solution on a surface of a wafer 2 to form a coating, including: a projection unit 4, a pipetting unit 5 and a loading unit 1. The projection unit 4 is located on the top side of the wafer 2, and is configured to project a target point to the surface of the wafer 2, where the target point is used to position the wafer 2, so that the center of the wafer 2 is located at the target point. The liquid-transfering unit 5 is located between the wafer 2 and the projection unit 4, and is used for sucking and containing glue liquid required by N times of spin coating, wherein N is any positive integer. The liquid-transfering unit 5 is also used for transferring the glue solution to the target point on the surface of the wafer 2 to be spin-coated. The loading unit 1 is located at the bottom side of the wafer 2 and is used for loading the wafer 2, so that the wafer 2 and the loading unit 1 are relatively fixed. The loading unit 1 is further configured to drive the wafer 2 to rotate, so that the glue solution is diffused along the surface of the wafer 2 to form a coating.

Specifically, the coating is provided as a photoresist layer. The pipetting unit 5 is used to aspirate and hold the glue required for 1 spin coating.

In other embodiments, the Coating is provided as a Bottom Anti-Reflection Coating (BARC).

In yet other embodiments, the coating is provided as a Spin On Carbon (SOC) layer.

In still other embodiments, the coating may be provided as any anti-reflective coating or any etch resistant coating.

It is worth to be noted that, the liquid-transfering unit 5 provided in the present application sucks and holds the glue solution required by N times of spin coating, where N is any positive integer. The pipetting unit 5 is also used for transferring the glue solution to the intersection of the surface of the wafer 2 to be spin coated. The application reduces the waste of glue solution and the time of loading gallon bottles, and is favorable for saving the cost of the glue solution and accelerating the development progress of the hand samples. According to the wafer 2 positioning method and device, the projection unit 4 projects an intersection point to the surface of the wafer 2, and the projection intersection point is used for positioning the wafer 2, so that the center of the wafer 2 is located at the intersection point. The method and the device can avoid the situation that the dripped glue deviates from the center of the wafer 2, are favorable for uniform diffusion of the photoresist on the surface of the wafer 2 during spin coating, and reduce the defect of finished products.

Fig. 2 is a schematic bottom view of a projection unit according to the present invention.

As shown in fig. 2, in some embodiments, the projection unit 4 is provided as a reflective baffle. The reflective baffle surface is provided with graduation lines with crossing points. And when the reflecting baffle is irradiated by a light source, the reflecting baffle is used for projecting an image containing the scale marks on the surface of the wafer 2. The intersection of the scale lines in the image is located at the center of the wafer 2 when it rotates, i.e., the wafer center. This embodiment is achieved by providing the reflective baffle surface with graduation marks having intersecting points. When the reflecting baffle is irradiated by a light source, an image containing the scale marks is projected on the surface of the wafer 2. The intersection of the scale lines in the image is located at the axis of rotation of the wafer 2.

Specifically, the graduation line may be provided in two. The two graduation lines are vertically arranged to form a cross point. When the reflecting baffle is irradiated by a light source, the reflecting baffle is used for projecting an image containing the scale mark on the surface of the wafer 2, and the cross point is positioned at the axis of the wafer 2 when rotating.

In other embodiments, the graduation marks are four. The four scale marks are intersected at the same point to form a cross point shaped like a Chinese character 'mi'. When the reflecting baffle is irradiated by a light source, the reflecting baffle is used for projecting an image containing the scale marks on the surface of the wafer 2, and the crossed point of the shape of the Chinese character 'mi' is positioned at the axis of the wafer 2 when rotating.

It should be noted that the graduation lines may be arranged as M, where M is any positive integer greater than 1. And the M scale marks intersect at the same intersection point. When the reflective baffle is irradiated by a light source, the reflective baffle is used for projecting an image containing the scale marks on the surface of the wafer 2, and the intersection point is positioned at the axis of the wafer 2 during rotation.

In still other embodiments, the surface of the reflecting baffle is provided with a target image with a central point, and a plurality of identification lines arranged in a concentric circular ring shape are arranged outside the central point; when the reflecting baffle is irradiated by a light source, the reflecting baffle is used for projecting a target image containing the central point on the surface of the wafer 2, and the central point is positioned at the axis of the wafer 2 during rotation.

In some embodiments, the pipetting unit 5 is provided as a pipette. The dropper is used for sucking glue solution. The dropper is also used for dripping glue liquid to the target point on the surface of the wafer 2. In this embodiment, a drip tube is disposed to drip the glue solution to the target point on the surface of the wafer 2, so that the glue solution is coated on the center of the wafer 2. In the embodiment, the dropper is arranged to suck and contain the glue solution required by one-time spin coating, the glue solution is directly coated on the surface of the wafer 2, a glue solution pipeline and a gallon bottle are not required to be arranged, the operation is convenient, the pipeline is not required to be filled with the glue solution required by a far-exceeding process, the glue solution cost is saved, and the development progress of photoresist samples is accelerated.

Specifically, the liquid transfer unit 5 is provided with a rubber-tipped dropper, and the rubber-tipped dropper is used for sucking the glue solution from the glue solution sample bottle. The glue solution sample bottle is a glass bottle. The volume of the glue solution sample bottle is 200 ml. The volume of the rubber head dropper is 20 milliliters. The rubber dropper sucks 15 ml of glue solution from the glue solution sample bottle each time.

In other specific embodiments, the glue bottle is a plastic bottle. The volume of the glue solution sample bottle is 400 ml. The volume of the rubber head dropper is 10 milliliters. The rubber head dropper sucks 10ml of glue solution from the glue solution sample bottle each time.

It should be noted that the glue solution sample bottle can be configured as a light-tight container made of any material that does not react with the glue solution. The volume of the glue solution sample bottle is A ml. The burette has a volume of B milliliters. The dropper sucks C milliliters of glue solution from the glue solution sample bottle each time. A is larger than B, B is larger than or equal to C, and C is larger than zero.

In some embodiments, the loading unit 1 comprises a first robot arm, a suction cup and a motor. The first mechanical arm is used for loading the wafer onto the sucker and unloading the wafer after coating is finished; the sucker is used for applying negative pressure to the wafer 2 after the wafer 2 is positioned, so that the wafer 2 is fixed relative to the sucker. The motor is connected with the sucker and used for driving the sucker to bear the wafer 2 attached with the glue solution to rotate, so that the glue solution does centrifugal motion along the surface of the wafer 2.

Specifically, after the wafer 2 is positioned, the center of the wafer 2 and the center of the sucker are located on the same vertical line. The motor is used for driving the sucker and the wafer 2 to rotate around the vertical line in an accelerating mode. The glue solution attached to the surface of the wafer 2 performs centrifugal motion with respect to the center of the wafer 2 along the surface of the wafer 2 when the wafer 2 rotates, so that the glue solution covers the top end surface of the wafer 2.

In some embodiments, a dilution unit is provided at one side of the loading unit 1 for containing a diluent. The diluting unit is used for spraying a diluent to the surface of the wafer 2 so that the diluent removes particles and glue on the surface of the wafer 2.

Fig. 3 is a schematic structural diagram of a glue solution spin-coating device provided with a dilution unit.

As shown in fig. 3, in particular, the dilution unit includes a first dilution unit 61, located in a central region of the top side of the wafer 2, for spraying a diluent on the surface of the wafer 2 after the wafer 2 is loaded by the loading unit 1 and before the glue solution is transferred to the surface of the wafer 2, so as to remove particles on the surface of the wafer 2. The embodiment realizes the cleaning of the surface of the wafer 2 before the spin coating of the glue solution, avoids the particles from mixing into the glue solution, and is beneficial to ensuring the yield of finished products.

In other specific embodiments, the dilution unit includes a second dilution unit 62, located at the top edge of the wafer 2, and configured to spray a diluent on the edge of the wafer 2 after the glue spin coating is completed, so as to remove the glue on the edge of the wafer 2. The embodiment realizes the removal of the glue solution on the edge of the wafer 2 so as to prevent the glue solution on the edge of the wafer 2 from contaminating the mechanical arm.

In some embodiments, the dilution unit includes a third dilution unit 63, located on the bottom side of the wafer 2, and configured to spray a diluent on the bottom side of the wafer 2 after the glue solution is spin-coated, so as to remove the glue solution on the bottom end surface of the wafer 2. In this embodiment, the glue solution on the bottom end surface of the wafer 2 is removed, so as to avoid affecting the subsequent processing of the wafer 2.

It is worth mentioning that the dilution unit can be arranged as a spray head or a liquid outlet valve; the dilution unit can be arranged on any side of the wafer 2, as long as the dilution unit can remove glue and particles on the surface of the wafer 2 when the dilution unit is in a working state.

In some embodiments, the device further comprises a drip unit 3. The liquid collecting unit 3 is arranged on the outer side of the loading unit 1, and the liquid collecting unit 3 is used for collecting the glue solution, the diluent and the particles which are separated from the surface of the wafer 2.

Specifically, the liquid trap unit 3 is composed of an inner wall 31 and an outer wall 32. The inner wall 31 is provided inside the outer wall 32. A cavity 33 is arranged between the inner wall 31 and the outer wall 32 and is used for collecting glue liquid, the diluent and the particles which are separated from the surface of the wafer 2. The top inner diameter of the outer wall 32 is larger than the outer diameter of the wafer 2, so that the wafer 2 is located inside the outer wall 32 when the wafer 2 is loaded in the loading unit 1. The inner diameter of the inner wall 31 is smaller than the outer diameter of the wafer 2, and the thickness of the inner wall 31 close to the cavity 33 is increased along the direction pointing to the center of the wafer 2, so that the glue solution, the thinner and the particles separated from the surface of the wafer 2 can flow to the bottom end of the cavity 33. The bottom end of the cavity 33 is communicated with a vacuum unit 7. The vacuum unit 7 is used to create a negative pressure to absorb the glue, diluent and particles in the cavity 33.

It should be noted that the liquid collecting unit 3 may be configured in any solid geometry as long as it can absorb the glue, the thinner and the particles that are separated from the surface of the wafer 2. The vacuum unit 7 may be provided as a vacuum machine or an air pump.

Fig. 4 is a schematic structural diagram of a glue solution spin-coating device provided with a mechanical arm according to the present invention. Fig. 5 is a schematic flow chart of a control method of a glue-liquid spin-coating apparatus according to the present invention.

As shown in fig. 3, 4 and 5, the present invention provides a control method for a glue solution spin-coating apparatus, for controlling the glue solution spin-coating apparatus according to any one of the above embodiments, including:

s1, controlling a first mechanical arm to load a wafer to a loading unit so that the wafer and the loading unit are relatively fixed, and the center of the wafer is superposed with the rotating axis of the loading unit;

s2, acquiring a projected image of a projection unit on the wafer, wherein a target point in the image is positioned at the center of the wafer;

s3, controlling a second mechanical arm to transfer the glue solution in the liquid transfer unit to the target point;

and S4, controlling the loading unit 1 to drive the wafer 2 to rotate in an accelerated manner, so that the glue solution is diffused along the surface of the wafer 2 to form a coating.

And S5, controlling the loading unit 1 to drive the wafer 2 to rotate to be static at a reduced speed. And controlling the loading unit 1 to unload the wafer 2.

It should be noted that, before S3, the method further includes controlling the second mechanical arm 51 to make the liquid-moving unit 5 suck the glue solution required by N times of spin coating, where N is any positive integer.

Specifically, the first robot arm 21 is used to place the wafer 2 on the top of the loading unit 1 or remove the wafer 2 from the top of the loading unit 1. The second mechanical arm 51 is also used for extruding the rubber head to discharge the gas in the rubber head, extending the dropper into the glue solution sample bottle, and releasing the rubber head to enable the rubber head dropper to suck the glue solution from the glue solution sample bottle. The second mechanical arm 51 is further configured to squeeze a rubber head of the rubber head dropper, so that the rubber liquid in the rubber head dropper falls toward the projection intersection. The specific operation flow of the control methods S4 and S5 of the present embodiment is shown in table 1.

In this embodiment, in the glue dropping stage, the vacuum unit 7 keeps the working state, and the rotation speed of the wafer 2 is accelerated from 0 to the first rotation speed; the first rotation speed is 1 or more revolutions per second and 50 or less revolutions per second. In this embodiment, the wafer 2 is slowly rotated to the first rotation speed, so that the wafer 2 can be prevented from being thrown out due to the loose adsorption, and the glue is dripped for a sufficient time in the glue dripping stage of at least 12 seconds, which is beneficial to improving the yield of finished products.

In the spin coating stage, the rotation speed of the wafer 2 is accelerated from the first rotation speed to a second rotation speed and then is decelerated to a third rotation speed, and the second rotation speed is more than 1000 revolutions per second and less than 4000 revolutions per second; the third rotation speed is greater than 50 revolutions per second and less than 200 revolutions per second; the vacuum unit 7 maintains an operation state. This embodiment spreads the photoresist across the wafer surface by acceleration and then conforms the photoresist thickness distribution across the wafer 2 in-plane by deceleration.

In the whirl coating stage, the rotation speed of the wafer 2 is increased from the third rotation speed to a fourth rotation speed, and the fourth rotation speed is more than 1000 revolutions per second and less than 4000 revolutions per second. In this embodiment, the wafer 2 is rotated at an increased speed to make the average thickness of the photoresist film in the whole surface meet the requirement. The photoresist throwing stage lasts at least 12 seconds, and the redundant photoresist on the surface of the wafer 2 can be thrown away as far as possible.

In the dilution stage, the second dilution unit 62, the third dilution unit 63, and the vacuum unit 7 are all brought into operation. In this embodiment, the diluents used in the second dilution unit 62 and the third dilution unit 63 are both OK73, and the photoresist on the edge of the wafer 2 and the photoresist on the back of the wafer 2 can be removed. The rotation speed of the wafer 2 is finally reduced to 0, so that the spin-coated wafer 2 is unloaded from the loading unit 1 by the first robot arm 21.

It should be noted that the second robot 51 may be used to hold a head dropper to drop the glue onto the surface of the wafer 2 during the glue dropping stage. Or a manual glue holding head dropper drips the glue on the surface of the wafer 2. After the photoresist coating and baking are completed, the photoresist coating on the surface of the wafer 2 can be measured for thickness and in-plane uniformity.

In some embodiments, 25 test points are numbered at equal intervals on the diameter of the photoresist coating, and the thickness of the photoresist coating at each test point is measured. The numbers are used as abscissa and the film thickness is used as ordinate to make a line graph.

Fig. 6 is a schematic broken line diagram of test point numbers obtained by dropping photoresist through a mechanical arm and related to the thickness of a photoresist coating film. FIG. 7 is a broken line diagram of test point numbers obtained by manually dropping photoresist according to the present invention with respect to the thickness of the photoresist coating.

As shown in FIGS. 6 and 7, it can be seen that the photoresist coating film thickness obtained by using the robot arm to drop the photoresist and using the manual dropping the photoresist is between the film thickness obtained by using the robot arm to drop the photoresist and the film thickness obtained by using the manual dropping the photoresist

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In the meantime. The film thickness of the photoresist coating layer obtained by adopting the mechanical arm glue dripping and the manual glue dripping is proved to be consistent, so that the manual glue dripping method is feasible.

Referring to fig. 3, the present invention provides a glue spin coating system, which includes a chamber 8, a shutter door 81, a sensing unit 82, a processing unit 9, and any one of the above-described embodiments. The cavity 8 is arranged outside the device and is used for preventing particles outside the cavity 8 from contacting the wafer 2. The flapper door 81 is disposed at an opening of the cavity 8, and the flapper door 81 is used to seal the cavity 8 when in a closed state. The flapper door 81 is in an open condition for communicating the chamber 8 with atmosphere. Sensing element 82 is coupled to flapper door 81. The loading unit 1 and the sensing unit 82 are both electrically connected with the processing unit 9. Sensing unit 82 is configured to send a status signal of flapper door 81 to processing unit 9 when powered on. The processing unit 9 is configured to control the loading unit 1 to drive the wafer 2 to rotate according to the status signal.

Specifically, when flapper door 81 is opened, sensing unit 82 sends a first status signal to processing unit 9, and processing unit 9 controls loading unit 1 to drive wafer 2 to stop rotating; when the flapper door 81 is closed, the sensing unit 82 sends a second status signal to the process unit 9, and the process unit 9 controls the loading unit 1 to drive the wafer 2 to start rotating.

In other embodiments, the processing unit 9 is further configured to control the sensing unit 82 to be powered on or powered off.

It is worth mentioning that the processing unit 9 may be configured as a processor. The sensing unit 82 may be provided as a sensor. The chamber 8 may be provided as a glass chamber 8.

In still other embodiments, the system of the present embodiment may be used by manually dropping the photoresist, after the wafer 2 enters the chamber 8, the sensing unit 82 is controlled to be powered down, the flapper door 81 is opened, and a 20ml dropper is used to suck a photoresist sample of more than 10ml from the photoresist sample bottle, and the photoresist sample is extended to the center of the reticle above the wafer 2 for dropping the photoresist. After the glue dripping is finished, the dropper is held by hands to exit the cavity 8, and the baffle door 81 is closed, and the process is controlled within 30 seconds. Then, the sensing unit 82 is controlled to be powered on, and the wafer 2 continues the above-mentioned glue solution spin coating process in the chamber 8.

Although the embodiments of the present invention have been described in detail hereinabove, it is apparent to those skilled in the art that various modifications and variations can be made to these embodiments. However, it is to be understood that such modifications and variations are within the scope and spirit of the present invention as set forth in the following claims. Moreover, the invention as described herein is capable of other embodiments and of being practiced or of being carried out in various ways.

Claims (10)

1. A glue solution spin coating device for spin coating a glue solution on a wafer surface to form a coating, comprising: a projection unit, a pipetting unit and a loading unit;

the projection unit is positioned on the top side of the wafer and used for projecting a target point to the surface of the wafer, and the target point is used for positioning the wafer so as to enable the target point to be positioned at the center of the wafer;

the liquid transfer unit is positioned between the wafer and the projection unit and is used for sucking and containing glue liquid required by N times of spin coating, and N is any positive integer; the liquid transferring unit is also used for transferring the glue solution to the target point on the surface of the wafer to be spin-coated;

the loading unit is positioned at the bottom side of the wafer and is used for loading the wafer so as to relatively fix the wafer and the loading unit; the loading unit is also used for driving the wafer to rotate, and the rotating shaft passes through the center of the wafer so as to enable the glue solution to diffuse along the surface of the wafer to form a coating.

2. The apparatus of claim 1, wherein the projection unit is provided as a reflective baffle; the surface of the reflecting baffle is provided with scale marks with cross points; the intersection is projected on the surface of the wafer to form the target point; when the reflecting baffle is irradiated by a light source, projecting an image containing the scale marks on the surface of the wafer; the intersection of the scale lines in the image is located at the center of the wafer.

3. The apparatus according to claim 1, wherein the pipetting unit is provided as a pipette; the dropper is used for sucking glue solution; the dropper is also used for dripping glue solution to the target point on the surface of the wafer.

4. The apparatus of claim 1, wherein the loading unit comprises a first robot arm, a suction cup, and a motor;

the first mechanical arm is used for loading the wafer onto the sucker and unloading the wafer after coating is finished;

the sucker is used for applying negative pressure to the wafer after the wafer is positioned so as to fix the wafer relative to the sucker;

the motor is connected with the sucker and used for driving the sucker to bear the wafer attached with the glue solution to rotate so as to enable the glue solution to do centrifugal motion along the surface of the wafer.

5. The apparatus of claim 1, wherein a diluting unit is provided at one side of the loading unit for containing a diluent; the diluting unit is used for spraying a diluting agent to the surface of the wafer so that the diluting agent removes particles and glue solution on the surface of the wafer.

6. The apparatus of claim 5, further comprising a liquid collection unit; the liquid collecting unit is arranged on the outer side of the loading unit and is used for collecting the glue solution, the diluent and the particles which are separated from the surface of the wafer.

7. A control method of a spin coating apparatus for a gum solution, for controlling the spin coating apparatus for a gum solution according to any one of claims 1 to 6, comprising:

s1, controlling a first mechanical arm to load a wafer to a loading unit so that the wafer and the loading unit are relatively fixed, and the center of the wafer is superposed with the rotating axis of the loading unit;

s2, acquiring a projection image of a projection unit on the wafer, wherein a target point in the image is positioned at the center of the wafer;

s3, controlling a second mechanical arm to transfer the glue solution in the liquid transfer unit to the target point;

s4, controlling a loading unit to drive the wafer to rotate in an accelerated manner so as to enable the glue solution to diffuse along the surface of the wafer to form a coating;

s5, controlling a loading unit to drive the wafer to rotate to be static at a reduced speed; and controlling the loading unit and the first mechanical arm to unload the wafer.

8. The method according to claim 7, wherein before S3, the method further comprises controlling a second mechanical arm to make a pipetting unit suck the glue solution required by N times of spin coating, wherein N is any positive integer.

9. A glue spin coating system comprising a chamber, a shutter door, a sensing unit, a processing unit and the apparatus of any one of claims 1 to 6;

the cavity is arranged on the outer side of the device and used for preventing particles outside the cavity from contacting the wafer;

the baffle door is arranged at the opening of the cavity and is used for sealing the cavity when the baffle door is in a closed state; the baffle door is used for communicating the cavity with the atmosphere when in an open state;

the sensing unit is connected with the baffle door; the loading unit and the sensing unit are electrically connected with the processing unit; the sensing unit is used for sending a state signal of the flapper door to the processing unit when being electrified;

the processing unit is used for controlling the loading unit to drive the wafer to rotate according to the state signal.

10. The system of claim 9, wherein the processing unit is further configured to control the sensing unit to power up or power down.

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