CN115914960A - Thin type large-amplitude MEMS loudspeaker - Google Patents
Thin type large-amplitude MEMS loudspeaker Download PDFInfo
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- CN115914960A CN115914960A CN202211635753.0A CN202211635753A CN115914960A CN 115914960 A CN115914960 A CN 115914960A CN 202211635753 A CN202211635753 A CN 202211635753A CN 115914960 A CN115914960 A CN 115914960A
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- material cutting
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- 239000000463 material Substances 0.000 claims abstract description 128
- 239000013078 crystal Substances 0.000 claims description 15
- 239000010453 quartz Substances 0.000 claims description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 9
- 229910002601 GaN Inorganic materials 0.000 claims description 3
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 2
- 230000035945 sensitivity Effects 0.000 abstract description 10
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000010257 thawing Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005520 electrodynamics Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
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Abstract
The invention relates to a thin type large-amplitude MEMS loudspeaker which comprises a shell, a vibrating diaphragm, a piezoelectric material cutting piece and an electrifying circuit, wherein the vibrating diaphragm is used for closing an opening of a containing space of the shell, the piezoelectric material cutting piece is arranged in the containing space, the outer contour of the shell combined with the vibrating diaphragm is approximately cuboid, the vibrating diaphragm is vertical to the height direction of the cuboid, the piezoelectric material cutting piece is in a long strip shape, the thickness direction of the piezoelectric material cutting piece is consistent with the height direction of the cuboid, one long strip surface of the piezoelectric material cutting piece faces the vibrating diaphragm, at least one end part of the piezoelectric material cutting piece is fixed on the shell, and the position of the maximum amplitude position of the piezoelectric material cutting piece is connected with the vibrating diaphragm through a thimble. On the one hand, the size of the piezoelectric material along the height direction of the cuboid is smaller, so that the shell can be designed to be thinner, and on the other hand, the resonant frequency of the piezoelectric material cutting piece is lower, so that the amplitude of the piezoelectric material is larger, and the sensitivity of the loudspeaker can be considered.
Description
Technical Field
The invention relates to the technical field of food thawing, in particular to a food thawing device and a food thawing method.
Background
In recent years, micro speakers have attracted more and more attention on wearable devices such as earphones, mobile phones and the internet of things. With the increasing demand of wearable devices, the development of micro speakers tends to be miniaturized, light-weighted, low-power consumption, and high sound pressure level. To meet the growing demand for wearable devices, and to achieve smaller, lower power consumption, lower cost and mass-produced devices, electrodynamic, capacitive and piezoelectric microspeakers based on MEMS fabrication technology provide an alternative solution. The piezoelectric MEMS micro-speaker realizes sound pressure output based on the piezoelectric effect of the piezoelectric film material, and has the advantages of simple manufacture, high signal-to-noise ratio, high response speed, no dust and the like compared with a capacitive MEMS micro-speaker. To date, piezoelectric speakers have been developed with various piezoelectric materials, such as ZnO, alN, PZT, PMN-PT, PZN-PT, etc. Generally, in order to improve the sensitivity of the MEMS speaker, the amplitude of the piezoelectric material needs to be larger, and thus the size of the piezoelectric material in the direction perpendicular to the diaphragm needs to be larger, which makes it difficult to achieve both the sensitivity and miniaturization of the MEMS speaker, and how to further reduce the volume (particularly the thickness) of the MEMS speaker and achieve both the sensitivity of the MEMS speaker is an urgent technical problem to be solved in the art.
Disclosure of Invention
To this end, the technical problem to be solved by the present invention is to overcome the problems in the prior art that it is difficult to further reduce the volume (especially the thickness) of the MEMS speaker and to take into account the sensitivity of the MEMS speaker.
In order to solve the above technical problem, the present invention provides a thin large-amplitude MEMS speaker, including:
the shell is enclosed into an accommodating space with one open side;
the vibrating diaphragm is connected to the shell and seals the opening of the accommodating space;
the piezoelectric material cutting piece is arranged in the accommodating space;
a power-on circuit that applies an alternating voltage to the cut piece of piezoelectric material to vibrate the cut piece of piezoelectric material;
the outer contour of the shell combined with the vibration diaphragm is approximately cuboid, and the vibration diaphragm is perpendicular to the height direction of the cuboid;
piezoelectric material cuts piece is rectangular form, the thickness direction of piezoelectric material cuts piece with the direction of height of cuboid is unanimous, piezoelectric material cuts piece has two rectangular surfaces that are located its different positions of thickness direction and set up mutually and lie in two tip that its different positions of length direction and set up mutually, one of them rectangular surface orientation the vibrating diaphragm, at least one the tip is fixed in on the casing, the circular telegram circuit to piezoelectric material cuts piece and applys alternating voltage so that piezoelectric material cuts piece along its vibration of thickness direction, the biggest position department of amplitude of piezoelectric material cuts piece is connected through the thimble the vibrating diaphragm.
In an embodiment of the invention, the cut piece of piezoelectric material is a cut piece of quartz crystal, gallium nitride or silicon carbide.
In one embodiment of the invention, the length-width ratio of the long strip surface of the piezoelectric material cutting piece is 2.
In one embodiment of the invention, the maximum amplitude of the cut piece of piezoelectric material is 1mm, and the thickness of the speaker is not more than 1.1mm.
In an embodiment of the present invention, the thimble is connected to a central position of the diaphragm.
In an embodiment of the invention, one of the end portions is fixed on the housing, the other end portion is suspended, and the suspended end of the piezoelectric material cutting piece is connected to the diaphragm through the ejector pin.
In an embodiment of the invention, the piezoelectric material cutting pieces are uniformly distributed around the central axis of the thimble, the suspended ends of the piezoelectric material cutting pieces are connected with the thimble in parallel, and the vibration phases of the piezoelectric material cutting pieces are the same.
In an embodiment of the invention, the two end portions are fixed on the shell, and the midpoint of the piezoelectric material cutting piece along the length direction is connected with the thimble.
In an embodiment of the present invention, the piezoelectric material cutting pieces are sequentially arranged in a direction away from the vibrating diaphragm, a first included angle is formed between two adjacent piezoelectric material cutting pieces, a second included angle is formed between the piezoelectric material cutting piece closest to the vibrating diaphragm and the piezoelectric material cutting piece farthest from the vibrating diaphragm, the first included angle and the second included angle are the same, the piezoelectric material cutting piece closest to the vibrating diaphragm is connected to the thimble, and vibration phases of the piezoelectric material cutting pieces are the same.
In an embodiment of the invention, the piezoelectric material cutting pieces are overlapped together, the piezoelectric material cutting piece closest to the vibrating diaphragm is connected with the thimble, and the vibration phases of the piezoelectric material cutting pieces are the same.
Compared with the prior art, the technical scheme of the invention has the following advantages: according to the thin large-amplitude loudspeaker, the piezoelectric material cutting piece is cut into the strip shape, the thickness direction of the piezoelectric material cutting piece is consistent with the height direction of the cuboid, on one hand, the size of the piezoelectric material along the height direction of the cuboid is small, so that the shell can be designed to be thinner, on the other hand, the strip surface of the piezoelectric material cutting piece faces the vibrating diaphragm, so that the resonance frequency of the piezoelectric material cutting piece is lower, the amplitude of the piezoelectric material is larger, and the sensitivity of the loudspeaker can be considered.
Drawings
In order that the present disclosure may be more readily and clearly understood, reference will now be made in detail to the present disclosure, examples of which are illustrated in the accompanying drawings.
FIG. 1 is an external view of a thin large amplitude MEMS speaker according to the present disclosure;
FIG. 2 is an internal schematic view of a thin large-amplitude MEMS speaker according to an embodiment of the present invention;
fig. 3 is a schematic connection diagram between the piezoelectric material cutting piece and the housing of the thin large-amplitude MEMS speaker according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of an interior of a thin large-amplitude MEMS speaker according to a second embodiment of the present invention;
fig. 5 is an internal schematic view of a thin large-amplitude MEMS speaker according to a third embodiment of the present invention;
fig. 6 is a schematic connection diagram between the piezoelectric material cutting piece and the housing of the thin large-amplitude MEMS speaker according to the third embodiment of the present invention;
fig. 7 is an internal schematic view of a thin large-amplitude MEMS speaker according to a fourth embodiment of the present invention.
The specification reference numbers indicate: 1. a housing; 11. a base plate; 12. a circumferential sidewall; 2. vibrating diaphragm; 3. cutting the piezoelectric material into pieces; 31. a strip surface; 32. an end portion; 4. and (4) a thimble.
Detailed Description
The present invention is further described below in conjunction with the following figures and specific examples so that those skilled in the art may better understand the present invention and practice it, but the examples are not intended to limit the present invention.
Example one
Referring to fig. 1 to 3, a thin large-amplitude MEMS speaker includes:
a housing 1, wherein the housing 1 encloses an accommodating space with one open side;
a diaphragm 2, the diaphragm 2 being connected to the housing 1 and closing the opening of the accommodating space;
the piezoelectric material cutting piece 3 is arranged in the accommodating space;
an energizing circuit (not shown) that applies an alternating voltage to the cut piece of piezoelectric material 3 to vibrate the cut piece of piezoelectric material 3;
the outer contour of the casing 1 and the diaphragm 2 combined together is approximately in a cuboid shape, and the diaphragm 2 is perpendicular to the height direction of the cuboid;
the cutting piece 3 of the piezoelectric material is in a long strip shape, the thickness direction of the cutting piece 3 of the piezoelectric material is consistent with the height direction of the cuboid, the cutting piece 3 of the piezoelectric material is provided with two long strip surfaces 31 which are located at different positions in the thickness direction and are arranged oppositely and two end portions 32 which are located at different positions in the length direction and are arranged oppositely, one of the long strip surfaces 31 faces the vibrating diaphragm 2, at least one of the end portions 32 is fixed on the shell, the energizing circuit applies alternating voltage to the cutting piece 3 of the piezoelectric material to enable the cutting piece 3 of the piezoelectric material to vibrate in the thickness direction, and the position where the amplitude of the cutting piece 3 of the piezoelectric material is maximum is connected with the vibrating diaphragm 2 through the ejector pin 4.
Preferably, the length direction of above-mentioned piezoelectric material cutting piece 3 is unanimous with the length direction of above-mentioned cuboid, after the open mouth of above-mentioned casing is connected to above-mentioned vibrating diaphragm, above-mentioned accommodation space has become an enclosure space, two of above-mentioned crystal cutting correspond the face and set up the electrode respectively, the electrode is connected with circular telegram circuit, after circular telegram circuit adds alternating voltage to piezoelectric material cutting piece, piezoelectric material cutting piece inside produces interior stress and interior stress that contracts in turn, make piezoelectric material cutting piece extend deformation and shrink, thereby drive the vibrating diaphragm and vibrate. Through cutting the piezoelectric material cutting piece into rectangular shape, the thickness direction of piezoelectric material cutting piece is unanimous with the direction of height of cuboid, and piezoelectric material is less along the size of cuboid direction of height on the one hand, consequently can be with the thinner of casing design, and on the other hand, and the rectangular surface orientation vibrating diaphragm of piezoelectric material cutting piece for piezoelectric material cutting piece, the resonant frequency of piezoelectric material cutting piece is lower, makes piezoelectric material's amplitude bigger, thereby can compromise the sensitivity of speaker.
In a preferred embodiment of the present invention, the cut piece 3 of piezoelectric material is a cut piece of quartz crystal.
A quartz crystal oscillator is a resonant device made by using the piezoelectric effect of a quartz crystal, and its basic constitution is roughly: a slice is cut from a quartz crystal according to a certain azimuth angle, silver layers are coated on two corresponding surfaces of the slice to be used as electrodes, a lead is welded on each electrode and connected to a pin, and a packaging shell is added to form a quartz crystal resonator, namely the quartz crystal resonator, or the crystal resonator, for short. When an alternating voltage is applied to the two electrodes of the quartz crystal (see the following figure), the wafer is mechanically vibrated. In general, the amplitude of mechanical vibration of a wafer and the amplitude of an alternating electric field are very small, but when the frequency of an applied alternating voltage is a specific value, the amplitude is significantly increased and is much larger than the amplitude at other frequencies, which is called piezoelectric resonance and is very similar to the resonance phenomenon of an LC circuit. The resonant frequency of the device is related to the cutting mode, the geometric shape, the size and the like of the wafer, and the calculation formula is shown in the following chart. Therefore, the wafer thickness can be cut according to different vibration frequency requirements.
By considering the characteristics of sound vibration of the crystal after being electrified, the thin MEMS loudspeaker with large amplitude can be manufactured. And the maximum amplitude of the crystal can reach 1mm, and for a loudspeaker, the larger the amplitude is, the higher the sensitivity of sound is, and the better the low-frequency performance is. On the other hand, the amplitude is large, and the output sensitivity is relatively higher when the loudspeaker is made into a small-volume loudspeaker. Therefore, compared with piezoelectric ceramics and electrostatic diaphragms, the crystal has more obvious advantages in manufacturing the MEMS loudspeaker.
In a preferred embodiment of the present invention, the ratio of the length to the width of the long surface of the dicing sheet 2 made of piezoelectric material is 2. Specifically, the length-width ratio of the long surface of the piezoelectric material cutting piece 2 is 2. The cutting proportion and the thickness are selected according to actual requirements.
In a preferred embodiment of the present invention, the maximum amplitude of the cut piece of piezoelectric material is 1mm, and the thickness of the speaker is not more than 1.1mm. The maximum amplitude of the piezoelectric material cutting piece in the embodiment can reach 1mm, the thickness of the loudspeaker can not exceed 1.1mm, and the size and the sensitivity of the loudspeaker are considered.
In a preferred embodiment of this embodiment, the thimble 4 is connected to a central position of the diaphragm 2. Above-mentioned thimble is connected and is put at the central point of vibrating diaphragm, can drive the better vibration of vibrating diaphragm.
In a preferred embodiment of the present invention, one of the end portions 32 is fixed to the housing 1, the other end portion 32 is suspended, and the suspended end of the piezoelectric material cutting piece 3 is connected to the diaphragm through the thimble 4. The piezoelectric material cutting piece is made into a cantilever beam structure. Above-mentioned piezoelectric material cuts piece towards the vibrating diaphragm and is close to the position of piezoelectric material cuts piece free end and sets up first electrode, and above-mentioned piezoelectric material cuts piece back of the body to the vibrating diaphragm and is close to the position of piezoelectric material cuts piece stiff end and sets up the second electrode, constitutes circular telegram return circuit behind first electrode of circular telegram circuit connection and the second electrode to apply alternating voltage to piezoelectric material cuts piece.
The housing 1 includes a bottom plate 11 and a circumferential sidewall 12, wherein one annular edge of the circumferential sidewall 12 is fixedly connected to the bottom plate 11, and the other annular edge of the circumferential sidewall 12 is fixedly connected to the diaphragm 2. The cross section of the circumferential side wall is a rounded rectangle, the bottom plate is a rounded rectangle, and the vibrating diaphragm is a rounded rectangle. The bottom plate is parallel to the diaphragm which is not subjected to external force. A protective cover with holes can be added above the diaphragm to prevent the diaphragm from being damaged.
Example two
Referring to fig. 4, the rest of the embodiments are the same as the first embodiment, except that a plurality of the piezoelectric material cutting pieces 3 are uniformly distributed around the central axis of the thimble 4, the hanging ends of the plurality of the piezoelectric material cutting pieces 3 are connected in parallel with the thimble 4, and the vibration phases of the plurality of the piezoelectric material cutting pieces 3 are the same.
Preferably, can
A plurality of the above-mentioned cut pieces of piezoelectric material are supplied with power at the same time, thus ensuring the phases of the vibrations to be identical. After the crystal is electrified with alternating current, one end of the fixed thimble deforms, so that the vibrating diaphragm is driven to vibrate up and down to produce sound.
EXAMPLE III
Referring to fig. 5 and 6, the rest is the same as the first embodiment except that two end portions 32 are fixed to the housing 1, and the center point of the cut piece 3 of piezoelectric material in the length direction is connected to the thimble 4. The piezoelectric material cutting piece is made into a beam structure. The position of one of them stiff end of above-mentioned piezoelectric material cutting piece towards the vibrating diaphragm and being close to piezoelectric material cutting piece sets up first electrode, and above-mentioned piezoelectric material cutting piece sets up the second electrode in the position that the vibrating diaphragm is carried on the back to and is close to another stiff end of piezoelectric material cutting piece, and the circular telegram circuit is constituteed behind first electrode and the second electrode to apply alternating voltage to piezoelectric material cutting piece.
Example four
Referring to fig. 7, the rest of the embodiments are the same as the embodiments, and the differences are that a plurality of the piezoelectric material cutting pieces 3 are sequentially arranged along a direction away from the vibrating diaphragm 2, a first included angle is formed between two adjacent piezoelectric material cutting pieces 3, a second included angle is formed between the piezoelectric material cutting piece 3 closest to the vibrating diaphragm 2 and the piezoelectric material cutting piece 3 farthest from the vibrating diaphragm 2, the first included angle is the same as the second included angle, the piezoelectric material cutting piece 3 closest to the vibrating diaphragm 2 is connected to the thimble, and vibration phases of the plurality of the piezoelectric material cutting pieces 3 are the same.
EXAMPLE five
The remaining parts are the same as those in the first or third embodiment, except that a plurality of the piezoelectric material cutting pieces are overlapped together, the piezoelectric material cutting piece closest to the vibrating diaphragm is connected to the thimble, and the vibration phases of the plurality of the piezoelectric material cutting pieces are the same.
EXAMPLE six
The remaining portions are the same as those in any one of the first to fifth embodiments, except that the piezoelectric material dicing sheet is a gallium nitride dicing sheet or a silicon carbide dicing sheet.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. This need not be, nor should it be exhaustive of all embodiments. And obvious variations or modifications of the invention may be made without departing from the spirit or scope of the invention.
Claims (10)
1. A thin large amplitude MEMS speaker comprising:
the shell is enclosed into an accommodating space with one open side;
the vibrating diaphragm is connected to the shell and seals the opening of the accommodating space;
the piezoelectric material cutting piece is arranged in the accommodating space;
a power-on circuit that applies an alternating voltage to the cut piece of piezoelectric material to vibrate the cut piece of piezoelectric material;
the method is characterized in that:
the outer contour of the shell combined with the vibration diaphragm is approximately cuboid, and the vibration diaphragm is vertical to the height direction of the cuboid;
piezoelectric material cuts piece is rectangular form, the thickness direction of piezoelectric material cuts piece with the direction of height of cuboid is unanimous, piezoelectric material cuts piece has two rectangular surfaces that are located its different positions of thickness direction and set up mutually and lie in two tip that its different positions of length direction and set up mutually, one of them rectangular surface orientation the vibrating diaphragm, at least one the tip is fixed in on the casing, the circular telegram circuit to piezoelectric material cuts piece and applys alternating voltage so that piezoelectric material cuts piece along its vibration of thickness direction, the biggest position department of amplitude of piezoelectric material cuts piece is connected through the thimble the vibrating diaphragm.
2. The thin large amplitude MEMS speaker as claimed in claim 1, wherein the cut piece of piezoelectric material is a cut piece of quartz crystal, gallium nitride or silicon carbide.
3. The thin large-amplitude MEMS speaker according to claim 1, wherein the length-width ratio of the surface of the long strip of the cut piezoelectric material is 2 to 25.
4. The thin large amplitude MEMS speaker as claimed in claim 1, wherein the maximum amplitude of the cut piece of piezoelectric material is 1mm, and the thickness of the speaker is not more than 1.1mm.
5. The thin large-amplitude MEMS speaker as claimed in claim 1, wherein the thimble is connected to a center of the diaphragm.
6. The thin large-amplitude MEMS speaker as claimed in claim 1, wherein one of the end portions is fixed to the housing, the other end portion is suspended, and the suspended end of the piezoelectric material cutting piece is connected to the diaphragm through the thimble.
7. The thin large-amplitude MEMS speaker according to claim 6, wherein the piezoelectric material cutting pieces are uniformly distributed around a central axis of the thimble, suspended ends of the piezoelectric material cutting pieces are connected to the thimble in parallel, and vibration phases of the piezoelectric material cutting pieces are the same.
8. The thin large-amplitude MEMS speaker as claimed in claim 1, wherein both of the ends are fixed to the housing, and the middle point of the cut piece of piezoelectric material along the length direction is connected to the thimble.
9. The thin large-amplitude MEMS loudspeaker according to claim 8, wherein the piezoelectric material cutting pieces are sequentially arranged along a direction away from the diaphragm, a first included angle is formed between every two adjacent piezoelectric material cutting pieces, a second included angle is formed between the piezoelectric material cutting piece closest to the diaphragm and the piezoelectric material cutting piece farthest from the diaphragm, the first included angle is the same as the second included angle, the piezoelectric material cutting piece closest to the diaphragm is connected with the ejector pin, and the vibration phases of the piezoelectric material cutting pieces are the same.
10. The thin large-amplitude MEMS speaker as claimed in claim 6 or 8, wherein a plurality of the cut pieces of piezoelectric material are overlapped, the cut piece of piezoelectric material closest to the diaphragm is connected to the thimble, and the vibration phases of the plurality of the cut pieces of piezoelectric material are the same.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211330056 | 2022-10-27 | ||
| CN2022113300564 | 2022-10-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115914960A true CN115914960A (en) | 2023-04-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211635753.0A Withdrawn CN115914960A (en) | 2022-10-27 | 2022-12-19 | Thin type large-amplitude MEMS loudspeaker |
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| Country | Link |
|---|---|
| CN (1) | CN115914960A (en) |
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2022
- 2022-12-19 CN CN202211635753.0A patent/CN115914960A/en not_active Withdrawn
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Application publication date: 20230404 |
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