CN115913370A - Multi-chip hybrid integrated satellite-borne array type microwave photon frequency converter - Google Patents
Multi-chip hybrid integrated satellite-borne array type microwave photon frequency converter Download PDFInfo
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Abstract
The invention discloses a multi-chip hybrid integrated satellite-borne array type microwave photon frequency converter, and belongs to the technical field of microwave photon signal processing. Including photonic chips and radio frequency chips. The photonic chip comprises a laser coupling component, an LO modulator chip, a PLC chip, an RF modulator chip, an optical fiber micro-connection structure and four high-speed photoelectric detectors, and the RF chip comprises a frequency multiplier, an RF low-noise amplifier chip, four intermediate frequency amplifiers and four filters. In order to solve the stress damage of the satellite high-low temperature environment and vibration on the direct connection of the multiple chips, a short optical fiber micro-connection structure is adopted to realize the bridge connection of the PLC chip and the modulator chip; in order to further improve the system integration level, the photoelectric hybrid integration multi-channel microwave photon frequency conversion with high integration level is realized in a multi-chip module packaging mode of a photon chip and a radio frequency chip. The invention improves the integration level and reliability of the optical path, reduces the volume and weight and meets the requirement of satellite-borne large-scale application.
Description
Technical Field
The invention belongs to the technical field of microwave photon signal processing, and particularly relates to a multi-chip hybrid integrated satellite-borne array type microwave photon frequency converter.
Background
The microwave photon frequency conversion means that the microwave photon technology is adopted to realize modulation frequency conversion of microwave signals in an optical domain, and comprises two basic frequency conversion modes of down-conversion and up-conversion. The traditional microwave frequency conversion technology has the defects of weak anti-electromagnetic interference capability, complex structure, poor universality, serious nonlinear distortion and the like due to the electronic bottleneck, and the processing and manufacturing of the microwave mixer become very difficult along with the improvement of frequency and bandwidth. The microwave photon frequency conversion technology can overcome the problems encountered by microwave frequency conversion, simplify the system structure, reduce the realization complexity, effectively expand the system working frequency, and has the advantages of transparent working frequency band, strong anti-electromagnetic interference capability and the like. Common multichannel microwave photon frequency conversion structures can be divided into serial connection and parallel connection.
The serial structure has the advantages of simple structure, and one optical path can simultaneously complete local oscillation and radio frequency modulation. The defects are that the radio frequency signal can carry out secondary modulation on the modulated local oscillation optical signal, the output harmonic wave is more, and the down-conversion efficiency of the output power is lower. The parallel structure has the advantages that the local oscillator and the radio frequency modulation are divided into two independent branches, the harmonic and clutter suppression performance is good, and the noise performance after coherent reception is improved compared with the series structure. The defects are that the realization structure is more complex, and the requirements on the performance of the laser such as the line width are higher.
Meanwhile, the existing microwave photon frequency conversion schemes are formed by splicing discrete devices, all the devices are interconnected through optical fibers, the integration level is poor when multiple channels are applied, the size and the weight are large, the reliability is not high, and the satellite-borne large-scale application requirements are difficult to adapt.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: the defects of the prior art are overcome, the multi-chip hybrid integrated satellite-borne array type microwave photon frequency converter is provided, the optical path integration degree and reliability are improved, the volume and weight are reduced, and the satellite-borne array type microwave photon frequency converter is suitable for the large-scale application requirements of satellite-borne.
The technical solution of the invention is as follows:
a multi-chip hybrid integrated satellite-borne array type microwave photon frequency converter comprises a photon chip and a radio frequency chip, wherein the photon chip comprises a first laser coupling component, a second laser coupling component, a first LO modulator chip, a second LO modulator chip, a first PLC chip, a second PLC chip, a first RF modulator chip, a second RF modulator chip, an optical fiber micro-connection structure and four high-speed photoelectric detectors, and the radio frequency chip comprises a first frequency multiplier, a second frequency multiplier, a first RF low-noise amplifier chip, a second RF low-noise amplifier chip, four intermediate frequency amplifiers and four filters;
a first laser coupling assembly: emitting a wavelength λ to a first LO modulator chip 1 The optical carrier of (a);
a second laser coupling assembly: emitting wavelength λ to a second LO modulator chip 2 The optical carrier of (a);
a first frequency multiplier: receiving a first local oscillation signal sent from the outside, generating a high-frequency local oscillation signal and sending the high-frequency local oscillation signal to a first LO modulator chip;
a second frequency multiplier: receiving a second local oscillation signal sent from the outside, generating a high-frequency local oscillation signal and sending the high-frequency local oscillation signal to a second LO modulator chip;
first LO modulator chip: modulating the first local oscillator signal to a wavelength of λ 1 Obtaining a first modulated optical signal on the optical carrier wave, and sending the first modulated optical signal to a first PLC chip through an optical fiber micro-connection structure;
a second LO modulator chip: modulating the second local oscillator signal to a wavelength of λ 2 Obtaining a second modulated optical signal on the optical carrier wave, and sending the second modulated optical signal to a second PLC chip through the optical fiber micro-connection structure;
a first PLC chip: coupling the first modulated optical signal and the second modulated optical signal, performing wavelength division multiplexing, dividing the multiplexed light into two paths in the first PLC chip, and feeding the two paths of the multiplexed light to the first RF modulator chip and the second RF modulator chip through the optical fiber micro-connection structure after the two paths of the multiplexed light are coupled through the end faces respectively;
the first RF low noise amplifier chip: performing power amplification on a first radio frequency signal input from the outside, and feeding the amplified signal to a first RF modulator chip;
a second RF low noise amplifier chip: performing power amplification on a second radio frequency signal input from the outside, and feeding the amplified signal to a second RF modulator chip;
first RF modulator chip: modulating an optical signal from the first PLC chip and then transmitting the optical signal to the second PLC chip through the optical fiber micro-connection structure;
a second RF modulator chip: modulating an optical signal from the first PLC chip and then transmitting the optical signal to the second PLC chip through the optical fiber micro-connection structure;
a second PLC chip: carrying out wavelength division demultiplexing and optical branching on the two received optical signals to obtain four high-power optical signals, wherein each high-power optical signal is fed to one high-speed photoelectric detector in a vertical coupling mode, and the four high-power optical signals correspond to four high-speed photoelectric detectors;
each high-speed photoelectric detector, an intermediate frequency amplifier, a filter and an intermediate frequency output port form an output channel; each high-speed photoelectric detector receives a path of high-power optical signal, the high-power optical signal is amplified by an intermediate frequency amplifier and then sent to a filter for filtering, and the filtered signal is output through a corresponding intermediate frequency output port.
Preferably, the optical fiber micro-connection structure comprises two end crystal heads and a middle short optical fiber, and the short optical fiber is a G.652 common single-mode optical fiber.
Preferably, the output ends of the first LO modulator chip and the second LO modulator chip firstly feed optical signals to the short optical fiber through the crystal head at one end of the optical fiber micro-connection structure, and then the crystal head at the other end is end-coupled with the input end of the first PLC chip.
Preferably, the first path of optical signal output end of the first PLC chip feeds an optical signal to the short optical fiber through the crystal head at one end of the third optical fiber micro-connection structure, and then the crystal head at the other end of the third optical fiber micro-connection structure is in end-face coupling with the first RF modulator chip; a second path of optical signal output end of the first PLC chip feeds an optical signal to the short optical fiber through a crystal head at one end of a fourth optical fiber micro-connection structure, and then the crystal head at the other end of the fourth optical fiber micro-connection structure is in end face coupling with a second RF modulator chip;
the output end of the first RF modulator chip feeds an optical signal to a short optical fiber through a crystal head at one end of a fifth optical fiber micro-connection structure, and then the crystal head at the other end of the fifth optical fiber micro-connection structure is in end-face coupling with one input end of a second PLC chip; and the output end of the second RF modulator chip feeds an optical signal to the short optical fiber through the crystal head at one end of the sixth optical fiber micro-connecting structure, and then the crystal head at the other end of the sixth optical fiber micro-connecting structure is in end-face coupling with the other input end of the second PLC chip.
Preferably, the shell of the satellite-borne array type microwave photon frequency converter is a tube shell.
Preferably, the tube shell comprises a front cavity and a back cavity, and all the photonic chips are uniformly distributed in the front cavity; a first RF low-noise amplifier chip and a second RF low-noise amplifier chip in the radio frequency chip are arranged in the front cavity, and a first frequency multiplier, a second frequency multiplier, four intermediate frequency amplifiers and four filters in the radio frequency chip are all arranged in the back cavity.
Preferably, the radio frequency port of the first LO modulator chip is connected to the back cavity through a vertical insulator and interconnected with the first frequency multiplier by a microstrip line, and the radio frequency port of the second LO modulator chip is connected to the back cavity through a vertical insulator and interconnected with the second frequency multiplier by a microstrip line;
the radio frequency port of the first RF modulator chip is interconnected with the first RF low-noise amplifier chip by utilizing a microstrip line, and then penetrates to the back cavity through the waveguide and the microstrip probe; and the radio frequency port of the second RF modulator chip is interconnected with the second RF low-noise amplifier chip by utilizing a microstrip line, and then penetrates to the back cavity through the waveguide and the microstrip probe.
Preferably, the second PLC chip performs wavelength division demultiplexing on the received two optical signals to obtain four optical signals, and the four optical signals pass through a 5.
Preferably, the output end face of the second PLC chip is arranged to be a 45 ° inclined plane, so that each path of output light generates a vertically downward refracted light output.
Preferably, 4 high-speed photodetectors are placed at 4 paths of high-power refracted light output positions to receive the space optical signals; 4 low-speed photodetectors are arranged at the 4-path 5% low-power refraction light output position to realize the monitoring output of the light power for the bias control of the modulator.
Compared with the prior art, the invention has the following beneficial effects:
1. the invention adopts the chip coupling design in the light path, replaces the traditional realization model based on discrete device splicing and long optical fiber, and greatly improves the light path integration level. The volume redundancy of the whole machine caused by the connection and bending of optical fibers in the module is effectively reduced;
2. according to the invention, the interconnection between the PLC chip and the modulator chip as well as between the PLC chip and the photoelectric detector is realized by adopting the short optical fiber micro-connection structure with higher flexibility compared with the chip, so that the problems of thermal expansion and cold contraction and stress damage of direct connection of photonic chips made of different materials caused by high and low temperature environments and vibration on a satellite are avoided, and the reliability is improved;
3. the radio frequency end of the electro-optical modulation and the photoelectric detection adopts an MCM mode and a microwave chip to realize the photoelectric hybrid packaging, realizes the advantage complementation of a broadband photon technology and a mature microwave technology, adapts to the satellite-borne large-scale application requirement, has higher practical value and stronger market competitiveness.
Drawings
FIG. 1 is a schematic view of the structure of the present invention;
FIG. 2 is a schematic diagram of a fiber optic micro-link structure provided by the present invention, wherein (a) is a side view, (b) is an overall view, and (c) is an end view of a crystal head;
fig. 3 is a structural diagram of a satellite-borne array type microwave photonic frequency converter (front surface) according to an embodiment of the present invention;
fig. 4 is a structural diagram of a satellite-borne array type microwave photonic frequency converter (back side) according to an embodiment of the present invention.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art. It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict. The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.
As shown in fig. 1, a multi-chip hybrid integrated satellite-borne array type microwave photonic frequency converter includes a photonic chip and a radio frequency chip, wherein the photonic chip includes a first laser coupling component (laser 1, corresponding to wavelength λ) 1 A lens set 1, a backlight detector 1), a second laser coupling component (laser 2, corresponding to wavelength lambda) 2 Lens group 2, detector 2 in a poor light), first LO modulator chip, second LO modulator chip, first PLC chip, second PLC chip, first RF modulator chip, second RF modulator chip, optic fibre micro-connection structure, four high-speed photoelectric detector, the radio frequency chip includes first frequency multiplier, second frequency multiplier, first RF low noise is put the chip, the chip is put to second RF low noise, four intermediate frequency amplifiers, four wave filters
The light path takes a PLC chip as switching to realize coupling interconnection of waveguides made of different materials except the laser. The right side of the first PLC chip is used for realizing the coupling of optical signals output by the first LO modulator chip and the second LO modulator chip respectively, and wavelength division multiplexing is carried out in the first PLC chip. And the multiplexed beam of light is divided into two paths in the first PLC chip and is respectively fed to the first RF modulator chip and the second RF modulator chip through end face coupling. Then, the optical signals output by the first RF modulator chip and the second RF modulator chip are input from the left side of the second PLC chip by end-face coupling. And wavelength division demultiplexing is respectively carried out on the two beams of light in the second PLC chip to obtain four paths of independent optical signals. The four detector chips are aligned with the right output end of the second PLC chip, and the second PLC chip outputs four paths of optical signals to feed the four detector chips in a vertical coupling mode.
FIG. 2 is a schematic diagram of an optical fiber micro-connection structure according to the present invention. The optical fiber micro-connection structure comprises two end crystal heads and a middle short optical fiber, the crystal heads are typically 3mm in length, the short optical fibers are typically 5-8mm in length, and the connection side surfaces and the overall view of the crystal heads and the short optical fibers are respectively shown as (a) and (b) in fig. 2. The type of the stub fiber is g.652 common single mode fiber, and the structure of the stub fiber at the input/output end face of the crystal head is shown in fig. 2 (c). And flexible connection mode design among large-size chips in the optical path. The output ends of the first LO modulator chip and the second LO modulator chip firstly feed optical signals to the short optical fiber from the chip waveguide through the crystal head at one end of the optical fiber micro-connection structure, and the size of the crystal head is far larger than that of a bare fiber, so that coupling and fixing are facilitated. And then the other end of the short optical fiber is coupled with the input end of the first PLC chip through the crystal head. Similarly, the input ends of the first RF modulator chip and the second RF modulator chip are coupled with the output end of the first PLC chip through the optical fiber micro-connection structure. And the output ends of the first RF modulator chip and the second RF modulator chip are in end-face coupling with the input end of the second PLC chip through an optical fiber micro-connection structure. The short-distance optical fiber with higher flexibility is utilized to realize bridging among different types of chips, the stress influence of direct interconnection of the multistage chips is reduced, and the influence of expansion with heat and contraction with cold on the coupling effect of the chips is reduced.
The shell of the satellite-borne array type microwave photon frequency converter is a tube shell. The shell comprises a front cavity and a back cavity, and all the photonic chips are uniformly distributed in the front cavity; in the RF chip, a first RF low-noise amplifier chip and a second RF low-noise amplifier chip are disposed in a front cavity, and the cavity and the interface structure are shown in fig. 3. In the rf chip, the first frequency multiplier, the second frequency multiplier, the four if amplifiers, and the four filters are all disposed in the back cavity, and the cavity and the interface structure are shown in fig. 4. In order to ensure the whole air tightness of the photonic chip and the microwave chip in the module. Radio frequency ports of the two low-frequency LO modulator chips penetrate through the vertical insulator to the back cavity, and the feed and frequency doubling chips are interconnected by utilizing the microstrip line. Radio frequency ports of the two high-frequency RF modulator chips penetrate through the back cavity body through the waveguide and the microstrip probe, and the microstrip line is utilized to realize the interconnection of the feeding chip and the low-noise amplifier chip. The photonic chips and the radio frequency chips are respectively distributed on two sides of the tube shell and are interconnected through the insulator and the microstrip probe, all the photonic chips are completely arranged in the front cavity and are interconnected through the insulator and the microstrip probe, the air tightness design difficulty of a radio frequency port is reduced, and the whole assembly meets the air tightness structural requirement.
In the invention, the laser is made of indium phosphide, the first LO modulator chip, the second LO modulator chip, the first RF modulator chip and the second RF modulator chip are made of lithium niobate materials, the first PLC chip and the second PLC chip are made of silicon dioxide materials, and the photoelectric detector is made of silicon germanium materials. Meanwhile, in order to realize efficient chip mode field matching, passive waveguides and mode spot conversion structures are etched on the first PLC chip and the second PLC chip with high mode field compatibility, and mixed integration among chips made of different materials is realized.
Example (b):
taking an optical path signal transmission path as an example, the optical path includes 2 laser coupling components with different wavelengths, and each component includes a laser, a collimating lens, an isolator, a focusing lens, and a backlight detector chip. The front light of the laser firstly reaches the collimating lens through free space, parallel light is output after beam shaping and enters the rear end isolator, the output of the isolator is fed to the focusing lens through space light, and the focusing lens bunches the parallel light and feeds the parallel light to the next-stage component. The backlight detector is arranged on the back of the laser, and power feedback and control are carried out through weak scattered light in the receiving and coupling process. The whole laser coupling assembly is placed on an aluminum nitride substrate. And the substrates of the two laser coupling assemblies are placed on one TEC chip to realize the temperature control of the lasers.
Two beams of laser coupling output optical signals are respectively fed into the respective corresponding LO modulator chips through short optical fibers, and the output light of the two LO modulator chips is respectively fed to the first PLC chip through an optical fiber micro-connection structure. The optical fiber micro-connection structure is shown in fig. 2. And the radio frequency ports of the two LO modulator chips are connected with the two vertical insulators. Two low-frequency local oscillation signals are input into the back cavity through the radio frequency connector and are connected with the frequency multiplier through the microstrip line to generate a high-frequency local oscillation. Two independent high-frequency local oscillators are fed to the vertical insulator through the microstrip line, penetrate through the front cavity and are input into a radio frequency port of the LO modulator chip.
Inside the first PLC chip, two LO modulated lights with different wavelengths are subjected to wavelength division multiplexing to synthesize a path. And then the first PLC chip carries out 50 branches on the multiplexed optical signal according to power, two paths of light are obtained and output again by the first PLC chip, and the two paths of light are respectively fed into the two RF modulator chips through the optical fiber micro-connection structure.
The radio frequency ports of the two RF modulator chips are respectively connected to a vertical waveguide through microstrip lines and are fed to the cavity on the back of the tube shell through the waveguide. The two paths of input high-frequency radio-frequency signals are input into the back cavity through the radio-frequency joint and are respectively fed into the front cavity through a vertical waveguide and a micro-strip probe. And the front cavity is connected to two RF low-noise amplifier chips through microstrip lines to realize power amplification. Then, the two paths of radio frequency signals are respectively input into the radio frequency ports of the two RF modulator chips through the microstrip lines.
After the two RF modulator chips modulate the input optical signal again, the output light is fed to the second PLC chip. And wavelength division demultiplexing is carried out on the two beams of modulated light in the second PLC chip, and four paths of optical signals are output. The four optical signals respectively pass through a 5. The 8 paths of optical signals are output by the second PLC chip 2 in parallel.
The output end face of the second PLC chip is arranged to be a 45-degree inclined plane, so that the 8 paths of output light generate vertically downward refracted light output. 4 high-speed photodetectors with 3dB bandwidth above 20GHz are placed at 4 paths of high-power refraction light output positions with 95% bandwidth to receive space light signals. 4 low-speed photodetectors with 3dB bandwidth below 2GHz are placed at 4 paths of 5% low-power refraction light output positions to monitor the light power and output the light power for modulator bias control.
The electric signals output by the four high-speed photoelectric detectors are respectively processed by independent amplifying and filtering chips and output by 4 parallel intermediate-frequency output ports. And completing the four-channel photoelectric hybrid integrated microwave photon frequency conversion.
The invention constructs a full-chip microwave photon frequency conversion structure comprising a laser based on an indium phosphide material, a modulator chip based on a lithium niobate material, a PLC chip based on a silicon dioxide material, a photoelectric detector based on a germanium-silicon material and the like; in order to realize efficient chip mode field matching, a passive waveguide and a mode spot conversion structure are etched on a PLC chip with higher mode field compatibility, and hybrid integration among chips made of different materials is realized. In order to solve the stress damage of the on-satellite high and low temperature environment and vibration to the direct connection of the multiple chips, a short optical fiber micro-connection structure is adopted to realize the bridge connection of the PLC chip and the modulator chip; in order to further improve the system integration level, the high-integration photoelectric hybrid integrated multi-channel microwave photon frequency conversion is realized in a multi-chip module (MCM) packaging mode of a photon chip and a radio frequency chip.
Although the present invention has been described with reference to the preferred embodiments, it is not intended to limit the present invention, and those skilled in the art can make variations and modifications of the present invention without departing from the spirit and scope of the present invention by using the methods and technical contents disclosed above.
Claims (10)
1. The utility model provides a multi-chip hybrid integrated spaceborne array type microwave photon frequency converter which characterized in that: the photonic chip comprises a first laser coupling component, a second laser coupling component, a first LO modulator chip, a second LO modulator chip, a first PLC chip, a second PLC chip, a first RF modulator chip, a second RF modulator chip, an optical fiber micro-connection structure and four high-speed photoelectric detectors, and the radio frequency chip comprises a first frequency multiplier, a second frequency multiplier, a first RF low-noise amplifier chip, a second RF low-noise amplifier chip, four intermediate frequency amplifiers and four filters;
a first laser coupling assembly: emitting a wavelength λ to a first LO modulator chip 1 The optical carrier of (a);
a second laser coupling assembly: emitting wavelength λ to a second LO modulator chip 2 The optical carrier of (a);
a first frequency multiplier: receiving a first local oscillation signal sent from the outside, generating a high-frequency local oscillation signal and sending the high-frequency local oscillation signal to a first LO modulator chip;
a second frequency multiplier: receiving a second local oscillation signal sent from the outside, generating a high-frequency local oscillation signal and sending the high-frequency local oscillation signal to a second LO modulator chip;
first LO modulator chip: modulating the first local oscillator signal to a wavelength of λ 1 Obtaining a first modulated optical signal on the optical carrier wave, and sending the first modulated optical signal to a first PLC chip through an optical fiber micro-connection structure;
a second LO modulator chip: modulating the second local oscillator signal to a wavelength of λ 2 Obtaining a second modulated optical signal on the optical carrier wave, and sending the second modulated optical signal to a second PLC chip through the optical fiber micro-connection structure;
a first PLC chip: coupling the first modulated optical signal and the second modulated optical signal, performing wavelength division multiplexing, dividing the multiplexed light into two paths in the first PLC chip, and feeding the two paths of light to the first RF modulator chip and the second RF modulator chip through the optical fiber micro-connection structure after the two paths of light are coupled respectively through end faces;
first RF low noise amplifier chip: performing power amplification on a first radio frequency signal input from the outside, and feeding the amplified signal to a first RF modulator chip;
a second RF low noise amplifier chip: performing power amplification on a second radio frequency signal input from the outside, and feeding the amplified signal to a second RF modulator chip;
first RF modulator chip: modulating an optical signal from the first PLC chip and then transmitting the optical signal to the second PLC chip through the optical fiber micro-connection structure;
a second RF modulator chip: modulating an optical signal from the first PLC chip and then sending the optical signal to a second PLC chip through an optical fiber micro-connection structure;
a second PLC chip: carrying out wavelength division demultiplexing and optical branching on the two received optical signals to obtain four high-power optical signals, wherein each high-power optical signal is fed to one high-speed photoelectric detector in a vertical coupling mode, and the four high-power optical signals correspond to four high-speed photoelectric detectors;
each high-speed photoelectric detector, an intermediate frequency amplifier, a filter and an intermediate frequency output port form an output channel; each high-speed photoelectric detector receives a path of high-power optical signal, the high-power optical signal is amplified by an intermediate frequency amplifier and then sent to a filter for filtering, and the filtered signal is output through a corresponding intermediate frequency output port.
2. The multi-chip hybrid integrated satellite-borne array type microwave photonic frequency converter according to claim 1, wherein: the optical fiber micro-connection structure comprises two end crystal heads and a middle short optical fiber, wherein the type of the short optical fiber is G.652 common single-mode optical fiber.
3. The multi-chip hybrid integrated satellite-borne array type microwave photonic frequency converter according to claim 2, wherein: the output ends of the first LO modulator chip and the second LO modulator chip firstly feed optical signals to the short optical fiber through the crystal head at one end of the optical fiber micro-connection structure, and then the crystal head at the other end is in end face coupling with the input end of the first PLC chip.
4. The multi-chip hybrid integrated satellite-borne array type microwave photonic frequency converter according to claim 2, wherein: a first path of optical signal output end of the first PLC chip feeds an optical signal to a short optical fiber through a crystal head at one end of a third optical fiber micro-connection structure, and then the crystal head at the other end of the third optical fiber micro-connection structure is in end-face coupling with the first RF modulator chip; a second path of optical signal output end of the first PLC chip feeds an optical signal to the short optical fiber through a crystal head at one end of a fourth optical fiber micro-connection structure, and then the crystal head at the other end of the fourth optical fiber micro-connection structure is in end-face coupling with the second RF modulator chip;
the output end of the first RF modulator chip feeds an optical signal to a short optical fiber through a crystal head at one end of a fifth optical fiber micro-connection structure, and then the crystal head at the other end of the fifth optical fiber micro-connection structure is in end-face coupling with one input end of a second PLC chip; and the output end of the second RF modulator chip feeds an optical signal to the short optical fiber through the crystal head at one end of the sixth optical fiber micro-connecting structure, and then the crystal head at the other end of the sixth optical fiber micro-connecting structure is in end-face coupling with the other input end of the second PLC chip.
5. The multi-chip hybrid integrated satellite-borne array type microwave photonic frequency converter according to claim 1, wherein: the shell of the satellite-borne array type microwave photon frequency converter is a tube shell.
6. The multi-chip hybrid integrated satellite-borne array type microwave photonic frequency converter according to claim 5, wherein: the shell comprises a front cavity and a back cavity, and all the photonic chips are uniformly distributed in the front cavity; a first RF low-noise amplifier chip and a second RF low-noise amplifier chip in the radio frequency chip are arranged in the front cavity, and a first frequency multiplier, a second frequency multiplier, four intermediate frequency amplifiers and four filters in the radio frequency chip are all arranged in the back cavity.
7. The multi-chip hybrid integrated satellite-borne array type microwave photonic frequency converter according to claim 6, wherein: the radio frequency port of the first LO modulator chip penetrates through a vertical insulator to the back cavity and is interconnected with the first frequency multiplier by using a microstrip line, and the radio frequency port of the second LO modulator chip penetrates through the vertical insulator to the back cavity and is interconnected with the second frequency multiplier by using the microstrip line;
the radio frequency port of the first RF modulator chip is interconnected with the first RF low-noise amplifier chip by utilizing a microstrip line, and then penetrates to the back cavity through the waveguide and the microstrip probe; and the radio frequency port of the second RF modulator chip is interconnected with the second RF low-noise amplifier chip by utilizing a microstrip line, and then penetrates to the back cavity through the waveguide and the microstrip probe.
8. The multi-chip hybrid integrated satellite-borne array type microwave photonic frequency converter according to claim 1, wherein: the second PLC chip performs wavelength division demultiplexing on the two received optical signals to obtain four optical signals, and the four optical signals respectively pass through a 5.
9. The multi-chip hybrid integrated satellite-borne array type microwave photonic frequency converter according to claim 8, wherein: and the output end surface of the second PLC chip is arranged to be a 45-degree inclined surface, so that each path of output light generates vertically downward refracted light output.
10. The multi-chip hybrid integrated satellite-borne array type microwave photonic frequency converter according to claim 9, wherein: 4 high-speed photoelectric detectors are placed at 4 paths of high-power refracted light output positions with high power to receive space optical signals; 4 low-speed photodetectors are arranged at the 4-path 5% low-power refraction light output position to realize the monitoring output of the light power for the bias control of the modulator.
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