CN115912946A - Power supply module - Google Patents

Power supply module Download PDF

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Publication number
CN115912946A
CN115912946A CN202211490270.6A CN202211490270A CN115912946A CN 115912946 A CN115912946 A CN 115912946A CN 202211490270 A CN202211490270 A CN 202211490270A CN 115912946 A CN115912946 A CN 115912946A
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China
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base island
independent base
pin
coupled
power
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请求不公布姓名
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Ensai Semiconductor Chengdu Co ltd
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Ensai Semiconductor Chengdu Co ltd
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Priority to CN202211490270.6A priority Critical patent/CN115912946A/en
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02BCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B70/00Technologies for an efficient end-user side electric power management and consumption
    • Y02B70/10Technologies improving the efficiency by using switched-mode power supplies [SMPS], i.e. efficient power electronics conversion e.g. power factor correction or reduction of losses in power supplies or efficient standby modes

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Abstract

The invention discloses a power module, which is coupled with an input alternating current power supply and is provided with a load, and the power module also comprises: the transformer at least comprises an auxiliary winding and a main winding, and the auxiliary winding and the main winding have the same end with the same name; the integrated package at least comprises a first power switch, a second power switch, a first class pin and a second class pin, wherein the dotted terminal of the auxiliary winding is coupled with the first power switch through the first class pin, and the dotted terminal of the main winding is coupled with the second power switch through the second class pin; the power module controls the first power switch to be switched on and off, so that the state of the second power switch is switched under a zero voltage state or an approximately zero voltage state. The power module can work at a lower switching loss and a higher frequency, and the problems that in the prior art, the switching loss of a power switch is reduced and the integration level of the power module is improved are solved.

Description

Power supply module
Technical Field
The present invention relates to the field of power supplies. More particularly, the present invention relates to a power supply module.
Background
These products like LED lighting typically require a built-in power module into the limited product space, but because the space inside the product where the power module can be placed is very small. Fig. 1A, 1B and 1C of the present application are power modules for step-down, step-up and step-up of a current mainstream LED driving power. There are at least two needs for improvementThe following places: 1) The constant current control of the load R can be realized only by matching a driving chip BP of the power module in the prior art with an external rectifier bridge and a fly-wheel diode, and the power module in the prior art has low working frequency, low inductance and large volume, so that the integration level of the power module in the prior art is low; 2) The driving chip BP of the power module in the prior art can only work in the quasi-resonant QR mode, that is, after the inductor Lp discharges to zero, the internal power switch of the driving chip BP is turned on when the resonance of the switching node SW of the driving chip BP is detected to reach the lowest value, but even if the quasi-resonant QR mode works, before the internal power switch of the driving chip BP is turned on, the absolute value voltage of the switching node SW is still very high, and a very large switching loss can be generated, wherein Ploss =0.5 × Coss × Vsw 2 Xf, where Coss = Cds + Cgd is the parasitic capacitance of the switch node SW, vsw is the voltage of the SW node before the internal power switch turns on, and f is the power switch operating frequency. The switching losses of the prior art power supply modules are large.
Therefore, how to provide a power module with high integration degree, small size, low loss and high efficiency has become a problem to be studied.
Disclosure of Invention
To address at least the above-identified deficiencies in the prior art, the present invention provides a power module, coupled to an input ac power source, having a load, the power module further comprising: the transformer at least comprises an auxiliary winding and a main winding, and the auxiliary winding and the main winding have the same dotted terminals; the integrated package at least comprises a first power switch, a second power switch, a first class pin and a second class pin, wherein the dotted terminal of the auxiliary winding is coupled with the first power switch through the first class pin, and the dotted terminal of the main winding is coupled with the second power switch through the second class pin; the power module controls the first power switch to be switched on and off, so that the state of the second power switch is switched under a zero voltage state or an approximately zero voltage state.
Preferably, the integrated package includes: the packaging support at least comprises a first independent base island and an AC-DC control chip arranged on the first independent base island; the first independent base island is electrically isolated from the first class pin and the second class pin, the AC-DC control chip integrates the first power switch and the second power switch, and the integrated packaging body enables the high-voltage end of the second power switch to be connected with the second class pin through a bonding pad and enables the high-voltage end of the first power switch to be connected with the first class pin.
Preferably, the integrated package includes: the packaging support at least comprises a first independent base island, a second independent base island, an AC-DC control chip and a second power switch, wherein the first independent base island and the second independent base island are electrically isolated from each other; the first independent base island is electrically isolated from the first class pins, the AC-DC control chip integrates the first power switch, the integrated packaging body enables the high-voltage end of the first power switch to be connected with the first class pins through a bonding pad, the second independent base island is connected with the high-voltage end of the second power switch through conductive adhesive, and the second class pins are second independent base island output pins.
Preferably, the integrated package includes: the packaging support at least comprises a first independent base island, a second independent base island, a third independent base island, a fourth independent base island and an AC-DC control chip, wherein the first independent base island, the second independent base island, the third independent base island, the fourth independent base island and the AC-DC control chip are electrically isolated from each other;
the first independent base island is electrically isolated from the first primary pin and the second primary pin, the AC-DC control chip integrates the first power switch and the second power switch, the integrated packaging body enables the high-voltage end of the second power switch to be connected with the second primary pin through a bonding pad, and the high-voltage end of the first power switch is connected with the first primary pin;
four rectifier diodes dispersedly arranged on the second independent base island, the third independent base island and the fourth independent base island, wherein the four rectifier diodes are connected with each other to form an AC-DC rectifier circuit, the anode of the rectifier circuit is coupled with a high-voltage power supply pin HV, the cathode of the rectifier circuit is coupled with a signal ground pin GND, a fourth class of pins are coupled with an AC power supply ACL end for a fourth independent base island output pin, a sixth class of pins are coupled with an AC power supply ACN end for the second independent base island output pin, a fifth class of pins are coupled with the high-voltage power supply pin HV for the third independent base island output pin, and a third class of pins are coupled with the signal ground GND pin for the first independent base island output pin.
Preferably, the integrated package includes:
the packaging support at least comprises a first independent base island, a second independent base island, a third independent base island, a fourth independent base island and a fifth independent base island which are electrically isolated from each other, an AC-DC control chip arranged on the first independent base island and a second power switch arranged on the fifth independent base island;
the first independent base island is electrically isolated from the first class pins, the AC-DC control chip integrates the first power switch, the integrated packaging body enables the high-voltage end of the first power switch to be connected with the first class pins through a bonding pad, the fifth independent base island is connected with the high-voltage end of the second power switch through conductive adhesive, and the second class pins are fifth independent base island output pins;
four rectifier diodes dispersedly arranged on the second independent base island, the third independent base island and the fourth independent base island, wherein the four rectifier diodes are connected with each other to form an AC-DC rectifier circuit, the anode of the rectifier circuit is coupled with a high-voltage power supply pin HV, the cathode of the rectifier circuit is coupled with a signal ground pin GND, a fourth class of pins are coupled with an AC power supply ACL end for a fourth independent base island output pin, a sixth class of pins are coupled with an AC power supply ACN end for the second independent base island output pin, a fifth class of pins are coupled with the high-voltage power supply pin HV for the third independent base island output pin, and a third class of pins are coupled with the signal ground GND pin for the first independent base island output pin.
Preferably, the positive electrode of the rectifying circuit of the power module is coupled with the high-voltage power supply pin HV, the negative electrode of the rectifying circuit is coupled with the signal ground pin GND, the load is coupled between the non-dotted end of the primary winding of the transformer and the high-voltage power supply pin HV, the freewheeling diode is coupled between the dotted end of the primary winding of the transformer and the high-voltage power supply pin HV, and the power module forms a Buck power architecture.
Preferably, the positive electrode of the rectifying circuit of the power module is coupled with the high-voltage power supply pin HV, the negative electrode of the rectifying circuit is coupled with the signal ground pin GND, the load and the freewheeling diode are coupled between the homonymous end of the primary winding of the transformer and the non-homonymous end of the primary winding of the transformer after being connected in series, and the power module forms a buck-boost Buckboost power supply framework.
Preferably, the positive electrode of the rectifying circuit of the power module is coupled to the high-voltage power supply pin HV, the negative electrode of the rectifying circuit is coupled to the signal ground pin GND, the freewheeling diode is coupled between the dotted terminal of the primary winding of the transformer and the signal ground GND after being connected in series with the load, and the power module forms a Boost power architecture.
Preferably, the positive electrode of the rectifying circuit of the power module is coupled to the high-voltage power supply pin HV, the negative electrode of the rectifying circuit is coupled to the signal ground pin GND, the freewheeling diode is coupled between the dotted terminal of the secondary winding of the transformer and the non-dotted terminal of the secondary winding of the transformer after being connected in series with the load, and the power module forms a Flyback power supply framework.
The embodiment of the invention has the following advantages:
1) The power module of this application work is in power switch zero-voltage switching state for power module can not only reduce power module temperature and heat dissipation cost with lower switching loss, higher frequency work, still can improve power module efficiency and reliability, reduces the power module volume, and then has solved the problem of switching loss among the prior art.
2) The power module of this application has reduced power module's volume through partly or all integrated rectifier circuit and freewheel diode D1 to integrated packaging body, has improved the integrated level.
Through the above description of the solution of the present invention and its various embodiments, those skilled in the art can understand that the integrated package of the power module of the present invention can form a power module with higher integration, smaller volume, lower manufacturing cost and easy control by integrating all or part of the rectifying diode chip, the AC-DC control chip, the freewheeling diode and the power switch.
Drawings
The essential features of the invention are set forth with particularity in the appended claims. A better understanding of the features and advantages of the present invention will be obtained by reference to the following detailed description that sets forth illustrative embodiments, in which the principles of the invention are utilized, and the accompanying drawings. In the drawings:
FIG. 1A is a typical example of a prior art buck power module;
FIG. 1B is a representative illustration of a prior art buck-boost power module;
FIG. 1C is a typical example of a prior art boost power supply module;
FIG. 2 shows a schematic structural diagram of a power supply module according to the present invention; and
fig. 3-6 are block diagrams illustrating power modules according to various embodiments of the invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In order to make the concept of the present invention deeply understandable to those skilled in the art, the technical problem of the present invention will be further explained first.
Fig. 1A to 1C show a conventional buck/boost power module, including: the circuit comprises an input alternating voltage source, a rectifier bridge, an input capacitor CIN, a driving chip BP, an inductor Lp, a freewheeling diode D1, a load R and a current detection resistor Rcs, and has the main problems that: the power module has low integration level and can only realize large switching loss caused by QR quasi-resonance work, and the power module has low efficiency.
In one embodiment, FIG. 2 shows a circuit schematic of a power supply module according to the present invention. A power module 20 coupled to an input ac power source and having a load 21, the power module 20 further comprising: the transformer 22 at least comprises an auxiliary winding La and a main-stage winding Lp, and the auxiliary winding La and the main-stage winding Lp have the same end with the same name; an integrated package 23, at least comprising a first power switch KA, a second power switch KP, a first class pin and a second class pin, wherein the dotted terminal of the auxiliary winding La is coupled to the first power switch KA through the first class pin, and the dotted terminal of the primary winding Lp is coupled to the second power switch KP through the second class pin; the power module 20 controls the first power switch KA to be turned on and off, so that the state of the second power switch KP is switched under a zero voltage state or an approximately zero voltage state.
The dotted terminals of the two windings of the transformer are defined as follows: when current flows in (or flows out) from one end of each of the two windings simultaneously, if magnetic fluxes generated by the two windings are in mutual assistance, the two ends are called the same-name ends of the transformer winding and marked by black dots or asterisks. The position of the homonymous end can be defined by self, the inflow end can be called as the homonymous end, and the outflow end can also be called as the homonymous end.
The principle of the power module 20 for switching the state of the second power switch KP in the zero-voltage or near-zero-voltage state (ZVS) is as follows: before the second power switch KP in the integrated package 23 is switched from the off state to the on state, the first power switch KA is controlled to be turned on to generate a first current pulse Ia flowing through the auxiliary winding La of the transformer, the first current pulse Ia is magnetically coupled to the primary winding Lp through the transformer, a second current pulse Ip in a direction opposite to that of the first current pulse Ia is formed in the primary winding Lp, and after the second current pulse Ip reduces the difference between voltages at two ends of the second power switch coupled in series with the primary winding Lp of the transformer to zero voltage or a voltage close to zero, the second power switch is switched from the off state to the on state, so that the second power switch works in a zero voltage or a voltage close to zero switching state.
The switching losses are defined as: ploss =0.5 × Coss × Vsw 2 Xf, where Coss = Cds + Cgd is the parasitic capacitance of the switch node SW, vsw is the voltage of the SW node before the internal power switch is turned on, f is the operating frequency of the power switch, and since the second power switch KP is in a zero voltage or near zero voltage switching state, the power module 2 is configured to operate at a high voltageThe switching loss of 0 will be reduced to zero or close to zero, which can significantly reduce the switching loss of the power module 20, improve efficiency, and can also work at a faster operating frequency, reducing the size of the transformer and the output capacitor.
In one embodiment, as shown in fig. 3, the integrated package includes: the packaging support at least comprises a first independent base island and an AC-DC control chip arranged on the first independent base island; the first independent base island is electrically isolated from the first class pins and the second class pins, the AC-DC control chip integrates the first power switch KA and the second power switch KP, the integrated packaging body enables the high-voltage end of the second power switch KP to be connected with the second class pins through the bonding pad, and the high-voltage end of the first power switch KA is connected with the first class pins. The power module controls the first power switch KA to be switched on and off, and the state of the second power switch KP is switched under a zero voltage or near zero voltage state.
In one embodiment, as shown in fig. 3, the freewheeling diode D1 is located outside the integrated package, the anode of the rectifying circuit is coupled to the high voltage supply HV, the cathode of the rectifying circuit is coupled to the signal ground GND, an input capacitor CIN is provided between the high voltage supply HV and the signal ground GND, and the non-dotted terminal of the secondary winding La of the transformer is coupled to the high voltage supply HV.
The current detection resistor Rcs is coupled to the AC-DC control chip through a ninth pin for detecting the current of the primary winding Lp of the transformer, which is not labeled in fig. 3 because it is a prior art.
In one embodiment, the load R is coupled between the non-dotted terminal of the primary winding Lp of the transformer and the high-voltage power supply HV, and the freewheeling diode D1 is coupled between the dotted terminal of the primary winding Lp of the transformer and the high-voltage power supply pin HV, so that the power module forms a Buck power architecture.
In one embodiment, the load R and the freewheeling diode D1 are connected in series and then coupled between the homonymous terminal of the primary winding Lp of the transformer and the non-homonymous terminal of the primary winding Lp of the transformer, and at this time, the power module forms a buck-boost buck boost power architecture.
In one embodiment, the freewheeling diode D1 is connected in series with the load R and then coupled between the dotted terminal of the primary winding Lp of the transformer and the signal ground GND, and the power module constitutes a Boost power architecture.
In an embodiment, the freewheeling diode D1 is connected in series with the load R and then coupled between the dotted terminal of the secondary winding Ls of the transformer and the non-dotted terminal of the secondary winding Ls of the transformer, and at this time, the power module forms a Flyback power architecture.
In an embodiment, as shown in fig. 3, the freewheeling diode D1 is located in the integrated package, as shown in fig. 3, the integrated package further includes a sixth independent base island and a freewheeling diode D1 located on the sixth independent base island, a cathode of the freewheeling diode D1 is coupled to the sixth independent base island through a conductive adhesive, and in a Buck power architecture, or a Buck-Boost Buck power architecture, or a Boost-Boost power architecture, an anode of the freewheeling diode D1 is coupled to the first type of pin; in a Flyback power supply framework, a freewheeling diode D1 is connected in series with a load R and then is coupled between a dotted terminal of a secondary winding Ls of a transformer and a non-dotted terminal of the secondary winding Ls of the transformer through a seventh pin and an eighth pin.
In one embodiment, as shown in fig. 4, the integrated package includes: the packaging support comprises a first independent base island, a second independent base island, an AC-DC control chip and a second power switch KP, wherein the first independent base island and the second independent base island are electrically isolated from each other; the first independent base island is electrically isolated from the first type pins, the AC-DC control chip integrates the first power switch KA, the integrated packaging body enables the high-voltage end of the first power switch KA to be connected with the first type pins through the bonding pad, the second independent base island is connected with the high-voltage end of the second power switch KP through the conductive adhesive, and the second type pins are output pins of the second independent base island. The power module controls the first power switch KA to be switched on and off, and the state of the second power switch KP is switched under a zero voltage or near zero voltage state.
In one embodiment, as shown in fig. 4, the freewheeling diode D1 is located outside the integrated package, the anode of the rectifier circuit is coupled to the high-voltage supply HV, the cathode of the rectifier circuit is coupled to the signal ground GND, there is an input capacitor CIN between the high-voltage supply HV and the signal ground GND, and the non-dotted terminal of the secondary winding La of the transformer is coupled to the high-voltage supply HV.
The current detection resistor Rcs is coupled to the AC-DC control chip through a ninth pin for detecting the current of the primary winding Lp of the transformer, which is not labeled in fig. 3 because it is a prior art.
In one embodiment, the load R is coupled between the non-dotted terminal of the primary winding Lp of the transformer and the high-voltage power supply HV, and the freewheeling diode D1 is coupled between the dotted terminal of the primary winding Lp of the transformer and the high-voltage power supply pin HV, so that the power module forms a Buck power architecture.
In one embodiment, the load R and the freewheeling diode D1 are connected in series and then coupled between a dotted terminal of the primary winding Lp of the transformer and a non-dotted terminal of the primary winding Lp of the transformer, where the power module forms a buck-boost power architecture.
In one embodiment, the freewheeling diode D1 is connected in series with the load R and then coupled between the dotted terminal of the primary winding Lp of the transformer and the signal ground GND, where the power module forms a Boost power architecture.
In an embodiment, the freewheeling diode D1 is connected in series with the load R and then coupled between the dotted terminal of the secondary winding Ls of the transformer and the non-dotted terminal of the secondary winding Ls of the transformer, and at this time, the power module forms a Flyback power architecture.
In an embodiment, as shown in fig. 4, the freewheeling diode D1 is located in the integrated package, the integrated package further includes a sixth independent base island and a freewheeling diode D1 located on the sixth independent base island, a cathode of the freewheeling diode D1 is coupled to the sixth independent base island through a conductive adhesive, and in the Buck power architecture, or the Buck-Boost Buck Boost power architecture, or the Boost-Boost power architecture, an anode of the freewheeling diode D1 is coupled to the first type pin; in a Flyback power supply framework, a freewheeling diode D1 is connected in series with a load R and then is coupled between a dotted terminal of a secondary winding Ls of a transformer and a non-dotted terminal of the secondary winding Ls of the transformer through a seventh pin and an eighth pin.
In one embodiment, as shown in fig. 5, the integrated package at least comprises: the packaging support comprises a first independent base island, a second independent base island, a third independent base island, a fourth independent base island and an AC-DC control chip, wherein the first independent base island, the second independent base island, the third independent base island and the fourth independent base island are electrically isolated from each other; the first independent base island is electrically isolated from the first class pin and the second class pin, the AC-DC control chip integrates a first power switch KA and a second power switch KP, the integrated packaging body enables the high-voltage end of the second power switch KA to be connected with the second class pin through a bonding pad, and the high-voltage end of the first power switch KA is connected with the first class pin;
four rectifier diodes which are dispersedly arranged on the second independent base island, the third independent base island and the fourth independent base island, wherein the four rectifier diodes are connected with each other to form an AC-DC rectifier circuit, the anode of the rectifier circuit is coupled with a high-voltage power supply pin HV, the cathode of the rectifier circuit is coupled with a signal ground pin GND, the fourth type of pin is a fourth independent base island output pin coupled with an AC power supply ACL end, the sixth type of pin is a second independent base island output pin coupled with an AC power supply ACN end, the fifth type of pin is a third independent base island output pin coupled with the high-voltage power supply pin HV, and the third type of pin is a first independent base island output pin coupled with the signal ground GND pin. The power module controls the first power switch KA to be switched on and off, and the state of the second power switch KP is switched under a zero voltage or near zero voltage state.
In one embodiment, the freewheeling diode D1 of the power supply module is located outside the integrated package, as shown in fig. 5.
The current detection resistor Rcs is coupled to the AC-DC control chip and the second power switch Kp through the ninth pin for detecting the current of the primary winding Lp of the transformer, which is not marked in fig. 5 because it is the prior art.
In one embodiment, the load R is coupled between the non-dotted terminal of the primary winding Lp of the transformer and the high-voltage power supply HV, and the freewheeling diode D1 is coupled between the dotted terminal of the primary winding Lp of the transformer and the high-voltage power supply pin HV, so that the power module forms a Buck power architecture.
In one embodiment, the load R and the freewheeling diode D1 are connected in series and then coupled between the homonymous terminal of the primary winding Lp of the transformer and the non-homonymous terminal of the primary winding Lp of the transformer, and at this time, the power module forms a buck-boost buck boost power architecture.
In one embodiment, the freewheeling diode D1 is connected in series with the load R and then coupled between the dotted terminal of the primary winding Lp of the transformer and the signal ground GND, and the power module constitutes a Boost power architecture.
In one embodiment, the freewheeling diode D1 is connected in series with the load R and then coupled between the dotted terminal of the secondary winding Ls of the transformer and the non-dotted terminal of the secondary winding Ls of the transformer, where the power module forms a Flyback power architecture.
In an embodiment, as shown in fig. 5, a freewheeling diode D1 of the power module is located in the integrated package, the integrated package further includes a sixth independent base island and a freewheeling diode D1 located on the sixth independent base island, a cathode of the freewheeling diode D1 is coupled to the sixth independent base island through a conductive adhesive, and an anode of the freewheeling diode D1 is coupled to the second type pin in the Buck power architecture, the Buck-Boost Buck power architecture, or the Boost-Boost power architecture; in a Flyback power supply framework, a freewheeling diode D1 is connected in series with a load R and then is coupled between a dotted terminal of a secondary winding Ls of a transformer and a non-dotted terminal of the secondary winding Ls of the transformer through a seventh pin and an eighth pin.
In one embodiment, as shown in fig. 6, the integrated package includes: the packaging support comprises a first independent base island, a second independent base island, a third independent base island, a fourth independent base island and a fifth independent base island which are electrically isolated from each other, an AC-DC control chip arranged on the first independent base island and a second power switch KP arranged on the fifth independent base island;
the first independent base island is electrically isolated from the first class pins, the AC-DC control chip integrates the first power switch KA, the integrated packaging body enables the high-voltage end of the first power switch KA to be connected with the first class pins through a bonding pad, the fifth independent base island is connected with the high-voltage end of the second power switch KP through conductive adhesive, and the second class pins are fifth independent base island output pins;
four rectifier diodes, the dispersion sets up in the independent base island of second, on third independent base island and the independent base island of fourth, four rectifier diodes interconnect constitutes AC-DC rectifier circuit, rectifier circuit's positive pole is coupled with high voltage power supply pin HV, rectifier circuit's negative pole is coupled with signal ground pin GND, the first class pin of fourth is that independent base island output pin of fourth couples alternating current power supply ACL end, the first class pin of sixth is that independent base island output pin of second is coupled alternating current power supply ACN end, the fifth class pin is that independent base island output pin of third is coupled high voltage power supply pin HV, the first class pin of third is that independent base island output pin of first couples signal ground GND pin. The power module controls the first power switch KA to be switched on and off, so that the state of the second power switch KP is switched under a zero voltage or near zero voltage state.
In one embodiment, the freewheeling diode D1 of the power supply module is located outside the integrated package as shown in fig. 6.
The current detection resistor Rcs is coupled to the AC-DC control chip and the second power switch Kp through the ninth pin for detecting the current of the primary winding Lp of the transformer, which is not labeled in fig. 6 because it is a prior art.
In one embodiment, the load R is coupled between the non-dotted terminal of the primary winding Lp of the transformer and the high-voltage power supply HV, and the freewheeling diode D1 is coupled between the dotted terminal of the primary winding Lp of the transformer and the high-voltage power supply pin HV, where the power module forms a Buck power architecture.
In one embodiment, the load R and the freewheeling diode D1 are connected in series and then coupled between a dotted terminal of the primary winding Lp of the transformer and a non-dotted terminal of the primary winding Lp of the transformer, where the power module forms a buck-boost power architecture.
In one embodiment, the freewheeling diode D1 is connected in series with the load R and then coupled between the dotted terminal of the primary winding Lp of the transformer and the signal ground GND, where the power module forms a Boost power architecture.
In an embodiment, the freewheeling diode D1 is connected in series with the load R and then coupled between the dotted terminal of the secondary winding Ls of the transformer and the non-dotted terminal of the secondary winding Ls of the transformer, and at this time, the power module forms a Flyback power architecture.
In an embodiment, as shown in fig. 6, a freewheeling diode D1 of the power module is located in the integrated package, the integrated package further includes a sixth independent base island and a freewheeling diode D1 located on the sixth independent base island, a cathode of the freewheeling diode D1 is coupled to the sixth independent base island through a conductive adhesive, and an anode of the freewheeling diode D1 is coupled to the second type pin in the Buck power architecture, the Buck-Boost Buck power architecture, or the Boost-Boost power architecture; in a Flyback power supply framework, a freewheeling diode D1 is connected in series with a load R and then is coupled between a dotted terminal of a secondary winding Ls of a transformer and a non-dotted terminal of the secondary winding Ls of the transformer through a seventh pin and an eighth pin.
From the above description, it can be seen that the above-described embodiments of the present application achieve the following technical effects:
1) The power module of this application switches on and ends through controlling first power switch KA, realizes that the state of second power switch KP switches under zero voltage or approximate zero voltage state for power module can be with lower switching loss, and higher frequency work not only can reduce power module temperature and heat dissipation cost, still can improve power module efficiency and reliability, reduces the power module volume, and then has solved the problem of switching loss among the prior art.
2) The power module of this application has further reduced power module's volume through partly or all integrated rectifier circuit and freewheel diode D1 to integrated packaging body, has improved the integrated level.
It should be noted that, in this specification, each embodiment is described in a progressive manner, and each embodiment focuses on differences from other embodiments, and portions that are the same as and similar to each other in each embodiment may be referred to.
It should be noted that the above coupling may be a direct electrical connection or an indirect electrical connection, where the direct electrical connection means that two devices are directly connected, and the indirect electrical connection means that other devices, such as a capacitor and a resistor, are also connected between a and B that are connected. Magnetic coupling is a coupling method relative to electrical coupling, in which two objects are electrically coupled or electrically connected, and the two objects need to be connected in a physical direct or physical indirect manner before an electrical path can be formed. There is no direct physical connection between the primary winding and the auxiliary winding of the transformer, or between the primary winding and the secondary winding of the transformer, and the coupling method for transmitting signals by magnetic field coupling is called magnetic coupling.
It should also be noted that, in this document, the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Moreover, relational terms such as "first" and "second" are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions or should not be construed as indicating or implying relative importance. "and/or" means that either or both of them can be selected. Also, the terms "include", "including" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or terminal device including a series of elements includes not only those elements but also other elements not explicitly listed or inherent to such process, method, article, or terminal device. Without further limitation, an element defined by the phrases "comprising one of 8230; \8230;" 8230; "does not exclude the presence of additional like elements in a process, method, article, or terminal device that comprises the element.
The technical solutions provided by the present invention are described in detail above, and the principle and the embodiments of the present invention are explained in the present document by applying specific examples, and the descriptions of the above examples are only used to help understanding of the present invention, and the content of the present specification should not be construed as limiting the present invention. While various modifications of the illustrative embodiments and applications herein will be apparent to those skilled in the art, it is not desired to be exhaustive or exhaustive that all such modifications and variations are within the scope of the invention.

Claims (9)

1. A power module coupled to an input ac power source and having a load, the power module further comprising:
the transformer at least comprises an auxiliary winding and a main winding, and the auxiliary winding and the main winding have the same end with the same name;
the integrated package at least comprises a first power switch, a second power switch, a first class pin and a second class pin, wherein the dotted terminal of the auxiliary winding is coupled with the first power switch through the first class pin, and the dotted terminal of the main winding is coupled with the second power switch through the second class pin;
the power module controls the first power switch to be switched on and off, so that the state of the second power switch is switched under a zero voltage state or an approximately zero voltage state.
2. The power module of claim 1, wherein the integrated package comprises:
the packaging support at least comprises a first independent base island and an AC-DC control chip arranged on the first independent base island; the first independent base island is electrically isolated from the first class pin and the second class pin, the AC-DC control chip integrates the first power switch and the second power switch, and the integrated packaging body enables the high-voltage end of the second power switch to be connected with the second class pin through a bonding pad and enables the high-voltage end of the first power switch to be connected with the first class pin.
3. The power module of claim 1, wherein the integrated package comprises:
the packaging support at least comprises a first independent base island, a second independent base island, an AC-DC control chip and a second power switch, wherein the first independent base island and the second independent base island are electrically isolated from each other; the first independent base island is electrically isolated from the first class pins, the AC-DC control chip integrates the first power switch, the integrated packaging body enables the high-voltage end of the first power switch to be connected with the first class pins through a bonding pad, the second independent base island is connected with the high-voltage end of the second power switch through conductive adhesive, and the second class pins are second independent base island output pins.
4. The power module of claim 1, wherein the integrated package comprises:
the packaging support at least comprises a first independent base island, a second independent base island, a third independent base island, a fourth independent base island and an AC-DC control chip, wherein the first independent base island, the second independent base island, the third independent base island and the fourth independent base island are electrically isolated from each other;
the first independent base island is electrically isolated from the first primary pin and the second primary pin, the AC-DC control chip integrates the first power switch and the second power switch, the integrated packaging body enables the high-voltage end of the second power switch to be connected with the second primary pin through a bonding pad, and the high-voltage end of the first power switch is connected with the first primary pin;
four rectifier diodes dispersedly arranged on the second independent base island, the third independent base island and the fourth independent base island, wherein the four rectifier diodes are connected with each other to form an AC-DC rectifier circuit, the anode of the rectifier circuit is coupled with a high-voltage power supply pin HV, the cathode of the rectifier circuit is coupled with a signal ground pin GND, a fourth class of pins are coupled with an AC power supply ACL end for a fourth independent base island output pin, a sixth class of pins are coupled with an AC power supply ACN end for the second independent base island output pin, a fifth class of pins are coupled with the high-voltage power supply pin HV for the third independent base island output pin, and a third class of pins are coupled with the signal ground GND pin for the first independent base island output pin.
5. The power module of claim 1, wherein the integrated package comprises:
the packaging support at least comprises a first independent base island, a second independent base island, a third independent base island, a fourth independent base island and a fifth independent base island which are electrically isolated from each other, an AC-DC control chip arranged on the first independent base island and a second power switch arranged on the fifth independent base island;
the first independent base island is electrically isolated from the first one-class pins, the AC-DC control chip integrates the first power switch, the integrated packaging body enables the high-voltage end of the first power switch to be connected with the first one-class pins through a bonding pad, the fifth independent base island is connected with the high-voltage end of the second power switch through conductive adhesive, and the second one-class pins are fifth independent base island output pins;
four rectifier diodes dispersedly arranged on the second independent base island, the third independent base island and the fourth independent base island, wherein the four rectifier diodes are connected with each other to form an AC-DC rectifier circuit, the anode of the rectifier circuit is coupled with a high-voltage power supply pin HV, the cathode of the rectifier circuit is coupled with a signal ground pin GND, a fourth class of pins are coupled with an AC power supply ACL end for a fourth independent base island output pin, a sixth class of pins are coupled with an AC power supply ACN end for the second independent base island output pin, a fifth class of pins are coupled with the high-voltage power supply pin HV for the third independent base island output pin, and a third class of pins are coupled with the signal ground GND pin for the first independent base island output pin.
6. The power module according to any one of claims 1 to 5, wherein the positive pole of the rectifying circuit of the power module is coupled to the high voltage supply pin HV, the negative pole of the rectifying circuit is coupled to the signal ground pin GND, the load is coupled between the non-dotted terminal of the primary winding of the transformer and the high voltage supply pin HV, and the freewheeling diode is coupled between the dotted terminal of the primary winding of the transformer and the high voltage supply pin HV, the power module forming a Buck power architecture.
7. The power supply module according to any one of claims 1 to 5, wherein an anode of a rectifying circuit of the power supply module is coupled to a high-voltage power supply pin HV, a cathode of the rectifying circuit is coupled to a signal Ground (GND) pin, a load is coupled between a same-name end of a primary winding of the transformer and a non-same-name end of the primary winding of the transformer after being connected with a freewheeling diode in series, and the power supply module forms a buck-boost Buckboost power supply architecture.
8. The power module according to any one of claims 1 to 5, wherein an anode of a rectifying circuit of the power module is coupled to a high voltage supply pin HV, a cathode of the rectifying circuit is coupled to a signal ground pin GND, a freewheeling diode is coupled between a same-name terminal of a primary winding of a transformer and the signal ground GND after being connected in series with a load, and the power module forms a Boost power architecture.
9. The power module according to any one of claims 1 to 5, wherein an anode of a rectifying circuit of the power module is coupled to the high voltage supply pin HV, a cathode of the rectifying circuit is coupled to the signal ground pin GND, and a freewheeling diode is coupled between a dotted terminal of a secondary winding of the transformer and a non-dotted terminal of the secondary winding of the transformer after being connected in series with a load, and the power module constitutes a Flyback power supply architecture.
CN202211490270.6A 2022-11-25 2022-11-25 Power supply module Pending CN115912946A (en)

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Application Number Priority Date Filing Date Title
CN202211490270.6A CN115912946A (en) 2022-11-25 2022-11-25 Power supply module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202211490270.6A CN115912946A (en) 2022-11-25 2022-11-25 Power supply module

Publications (1)

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CN115912946A true CN115912946A (en) 2023-04-04

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CN202211490270.6A Pending CN115912946A (en) 2022-11-25 2022-11-25 Power supply module

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116526636A (en) * 2023-06-30 2023-08-01 恩赛半导体(成都)有限公司 Quick charger, quick charging circuit and power supply device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116526636A (en) * 2023-06-30 2023-08-01 恩赛半导体(成都)有限公司 Quick charger, quick charging circuit and power supply device
CN116526636B (en) * 2023-06-30 2023-09-08 恩赛半导体(成都)有限公司 Quick charger, quick charging circuit and power supply device

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