CN115910509A - Surface-junction type piezoresistor disc, preparation process thereof and electromagnetic pollution absorption device - Google Patents
Surface-junction type piezoresistor disc, preparation process thereof and electromagnetic pollution absorption device Download PDFInfo
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- CN115910509A CN115910509A CN202211412917.3A CN202211412917A CN115910509A CN 115910509 A CN115910509 A CN 115910509A CN 202211412917 A CN202211412917 A CN 202211412917A CN 115910509 A CN115910509 A CN 115910509A
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- 238000010521 absorption reaction Methods 0.000 title claims abstract description 33
- 238000002360 preparation method Methods 0.000 title claims abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 31
- 238000004519 manufacturing process Methods 0.000 claims abstract description 9
- 239000002994 raw material Substances 0.000 claims description 23
- 238000002156 mixing Methods 0.000 claims description 15
- 238000005245 sintering Methods 0.000 claims description 15
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 11
- 239000003990 capacitor Substances 0.000 claims description 11
- 229910000416 bismuth oxide Inorganic materials 0.000 claims description 9
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 claims description 9
- 229910052709 silver Inorganic materials 0.000 claims description 9
- 239000004332 silver Substances 0.000 claims description 9
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 8
- 239000000843 powder Substances 0.000 claims description 8
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- 239000000463 material Substances 0.000 claims description 7
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 6
- 239000000654 additive Substances 0.000 claims description 6
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- 239000011248 coating agent Substances 0.000 claims description 4
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- 239000011787 zinc oxide Substances 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 3
- 229910021446 cobalt carbonate Inorganic materials 0.000 claims description 3
- ZOTKGJBKKKVBJZ-UHFFFAOYSA-L cobalt(2+);carbonate Chemical compound [Co+2].[O-]C([O-])=O ZOTKGJBKKKVBJZ-UHFFFAOYSA-L 0.000 claims description 3
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- 229940093474 manganese carbonate Drugs 0.000 claims description 3
- 235000006748 manganese carbonate Nutrition 0.000 claims description 3
- 229910000016 manganese(II) carbonate Inorganic materials 0.000 claims description 3
- XMWCXZJXESXBBY-UHFFFAOYSA-L manganese(ii) carbonate Chemical compound [Mn+2].[O-]C([O-])=O XMWCXZJXESXBBY-UHFFFAOYSA-L 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- 239000012466 permeate Substances 0.000 claims description 3
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 3
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 3
- 229910001887 tin oxide Inorganic materials 0.000 claims description 3
- 239000004408 titanium dioxide Substances 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 238000001238 wet grinding Methods 0.000 claims description 3
- 238000001764 infiltration Methods 0.000 claims description 2
- 230000008595 infiltration Effects 0.000 claims description 2
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- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
Abstract
The invention provides a surface junction type piezoresistor sheet, a preparation process thereof and an electromagnetic pollution absorption device, and relates to the field of piezoresistor production. A preparation process of a surface junction type varistor comprises the following steps of S1: preparing a chip varistor main body; s2: and printing and burning electrodes on the working surface of the piezoresistor main body. The surface junction type piezoresistor sheet prepared by the process comprises a sheet piezoresistor main body, wherein the piezoresistor main body is internally provided with a pressure-sensitive surface junction, and the working surface of the piezoresistor main body is provided with an electrode. The electromagnetic pollution absorption device applying the surface-junction type piezoresistor disc comprises an annular PCB substrate, wherein one surface of the PCB substrate is connected with the piezoresistor disc. The invention solves the problem that the annular piezoresistor is easy to break or even crack in larger drop due to the limitation of the shape; and the surface junction type piezoresistor sheets are compounded into the electromagnetic pollution absorption device, so that the electromagnetic pollution absorption device has a good electromagnetic pollution absorption effect and can effectively inhibit electric sparks.
Description
Technical Field
The invention relates to the field of piezoresistor production, in particular to a surface-junction type piezoresistor sheet, a preparation process thereof and an electromagnetic pollution absorption device.
Background
In the current market, piezoresistors which are mainly applied to a brushed direct current micro motor and are released by companies such as Xinlefu and the like are all annular; the annular piezoresistor takes strontium titanate or zinc oxide as a main material, comprises an annular ceramic substrate and at least three electrodes arranged on the substrate, and has the advantages of strong surge absorption capacity, high reliability, strong self-restoring capacity and the like.
However, various electrical equipment using the brush direct current micro motor are subjected to drop tests before delivery, and due to factors such as different purposes of the electrical equipment, different requirements of the testing and accepting parties and the like, the actual passing standard of part of the drop tests is high; in addition, in the processes of storage, transportation, use and the like of the electrical equipment, the electrical equipment is easy to fall off, fall down and the like; therefore, electrical components used in the brushed dc micro-motor should have a considerable degree of drop resistance and stability. However, the annular piezoresistor has the characteristic of large moment due to the limitation of shape, and can only be sleeved on the motor; therefore, when the electrical equipment drops greatly, the ceramic substrate of the annular piezoresistor is likely to break due to the failure of bearing external force, so that the ceramic substrate cannot play a role, and if the substrate is broken completely and ceramic fragments can enter other electrical parts and structures, the motor and even the electrical equipment can be directly scrapped.
Disclosure of Invention
The invention aims to provide a surface-junction-type piezoresistor sheet, a preparation process thereof and an electromagnetic pollution absorption device.
The invention is realized by adopting the following technical scheme:
a preparation process of a surface junction type varistor comprises the following steps:
s1: preparing a sheet-shaped piezoresistor main body;
s2: the electrodes are printed and fired on the working face of the varistor body.
For the scheme, the piezoresistor main body obtained by the step S1 and the step S2 is sheet-shaped instead of annular, the sheet-shaped moment is obviously smaller than that of the annular, and in practical use, the sheet-shaped piezoresistor does not need to be sleeved on the motor and can be directly and electrically connected to a commutator part of the motor, so that the sheet-shaped piezoresistor is more difficult to break under the same external force; in addition, for the sheet-shaped piezoresistor main body, only the electrode raw material is directly printed in the designated area on the working surface, so that compared with the annular piezoresistor, the sheet-shaped piezoresistor does not need complex works such as measurement, correction and the like in the early stage in the printing link, the production efficiency is higher, and a standard, uniform and efficient production line can be formed. In addition, the preparation process further comprises a step S3: testing various performances of the formed piezoresistor sheet after the electrode is burnt; s4: packaging the piezoresistor discs with qualified performance, or assembling the piezoresistor discs on a specified element and packaging the assembly; s5: and storing or packaging the packaged products (the piezoresistor sheets or the assemblies) for delivery.
Further, the S1 specifically includes the following sub-steps:
s1-1: mixing materials, namely mixing 85-95% of zinc oxide and 5-15% of additive according to weight percentage, wherein the additive comprises the following components in percentage by weight: 3 to 4 percent of cobalt carbonate, 2 to 3 percent of aluminum oxide, 1 to 1.5 percent of manganese carbonate, 1 to 1.5 percent of titanium dioxide, 0.5 to 1 percent of tin oxide and 0.5 to 1 percent of silicon oxide;
s1-2: wet grinding, namely grinding the mixed raw materials to form slurry;
s1-3: drying, evaporating water in the slurry to form powder;
s1-4: molding, namely pressing and molding the powder to form a blank;
s1-5: sintering, namely sintering the blank at a high temperature to prepare a piezoresistor main body;
s1-6: and cleaning to remove residues on the surface of the piezoresistor main body.
For the scheme, the step S1-2 is used for further uniformly mixing the raw materials preliminarily mixed in the step S1-1 to form slurry; since the sintering in step S1-5 is a process of heating and forming the powder, the slurry formed in step S1-2 needs to be dewatered and dried in step S1-3; in step S1-4, pressing the powder into a sheet shape; through the steps S1-6, impurities such as dust, particles and the like adsorbed on the surface of the main body of the piezoresistor in the previous steps are removed, so that the subsequent operation of printing electrodes is facilitated.
Further, the S2 specifically includes the following sub-steps:
s2-1: mixing materials, namely mixing silver paste and bismuth oxide to form an electrode raw material, wherein the content of the bismuth oxide accounts for 2-5% of the content of the whole electrode raw material;
s2-2: coating, namely coating and printing the electrode raw material on the working surface of the piezoresistor main body;
s2-3: and (4) sintering and infiltrating, and sintering the electrode.
For the scheme, in the step S2-1, the adopted silver paste is prepared by mixing silver powder, organic matters, metal oxidants, diluents and the like; the electrode material formed in step S2-1 is in the form of ink. The specific principles and operation processes of the printing electrode raw material and the sintering and infiltrating are all adopted in the prior art, and are not described in detail herein.
Further, in the step S2-3, through the firing infiltration, bismuth oxide in the electrode raw material permeates into the piezoresistor main body to form a surface knot, and silver paste in the electrode raw material is condensed on the working surface of the piezoresistor main body to form an electrode.
For the scheme, the bismuth oxide permeates into a surface knot formed in the piezoresistor main body, namely a piezoresistor knot, and the piezoresistor knot can form a piezoresistor characteristic between two ends of an electrode, namely the voltage and the current of the piezoresistor follow the nonlinear coefficient change. Because the brushed direct current micro motor can generate reverse electromotive force which is far ten times higher than rated working voltage in the reversing process, the reverse electromotive force can become electromagnetic pollution so as to generate great harm to electric parts, and electric sparks can be formed due to instantaneous high voltage of the reverse electromotive force so as to reduce the service life of the brush and the motor; therefore, the surface junction type voltage-sensitive resistor disc with the voltage-sensitive characteristic can absorb the reverse electromotive force, namely, the electromagnetic pollution generated in the commutation process of the brush direct current micro motor is absorbed, and the electric sparks are inhibited, so that the normal work of each electric appliance and electric equipment is ensured, and the service lives of the electric brush and the motor are prolonged.
Further, in the step S2-2, after the electrode material is coated and printed on the working surface of the varistor main body, the electrode material is further extended and coated and printed on two opposite side surfaces of the varistor main body.
For the above scheme, the two opposite side surfaces of the varistor main body specifically refer to any two opposite surfaces of four surfaces adjacent to the working surface, and this operation is to expand the connection points of the electrodes and other elements to be assembled, so that the connection between the two is more convenient.
The surface junction type piezoresistor sheet is prepared according to the preparation process, and comprises a sheet piezoresistor main body, wherein the piezoresistor main body is internally provided with a pressure-sensitive surface junction, and the working surface of the piezoresistor main body is provided with an electrode.
For the scheme, the piezoresistor main bodies are sheet-shaped, and each piezoresistor main body is provided with one planar strip-shaped electrode, so that the preparation process and the operation flow of the piezoresistor sheet are unified and concise; and, a single varistor can realize the varistor characteristics, so the varistor can be fitted to other elements as a unit to form an electromagnetic pollution absorbing apparatus suitable for a brushed dc micro motor.
Further, the electrodes extend from the working surface of the varistor body to two opposite sides of the varistor body.
With the above arrangement, when the electrodes extend from the working surface of the varistor body to two opposite side surfaces of the varistor body (i.e. to any two opposite surfaces of the four surfaces adjacent to the working surface), the electrodes naturally change from a planar strip shape to a two-end L shape.
The surface junction type piezoresistor sheet comprises an annular PCB substrate, and the piezoresistor sheet is connected to one surface of the PCB substrate.
According to the scheme, the annular PCB substrate is used as a carrier, and the required number of voltage-sensitive resistance sheets are connected on the annular PCB substrate, so that the electromagnetic pollution absorption device suitable for the brush direct-current micro motor can be formed. The device substrate of the electromagnetic pollution absorption device is a PCB (printed Circuit Board) instead of ceramic, and the ceramic is only used as a main body of the surface junction type piezoresistor disc and is connected to the PCB; therefore, when the electromagnetic pollution absorption device falls along with the whole electrical equipment, the ceramic part can not directly receive impact, and the electromagnetic pollution absorption device has good falling resistance in practical use. In addition, the electromagnetic pollution absorption device can realize the compounding of a plurality of surface junction type piezoresistor discs, thereby having good electromagnetic pollution absorption effect and effectively inhibiting the generation of electric sparks.
Furthermore, a plurality of connecting points are arranged on the PCB substrate, and a piezoresistor sheet is connected between every two connecting points.
According to the scheme, all the contacts and the piezoresistor electrodes form a closed loop in a mode that each contact on the PCB substrate is connected with one end of an electrode on the piezoresistor, and pins of the PCB substrate are connected with the motor commutator.
Furthermore, a capacitor is connected between every two contact points, the capacitor is connected with the piezoresistor disc in parallel, and the capacitor and the piezoresistor disc are respectively positioned on two surfaces of the PCB substrate.
With the above scheme, in the electromagnetic pollution absorbing device, the varistor sheet has an upper limit on the absorption of the back electromotive force; in particular, the capacitance of a varistor is typically several tens to several hundreds pf, and is generally applicable only to low frequency signals. Therefore, the capacitance is connected in parallel with the contact of the PCB substrate, so that the electromagnetic pollution absorption device is also suitable for high-frequency signals, thereby having stronger practicability.
The invention has the following beneficial effects:
a surface junction type voltage-sensitive resistance sheet is prepared by a uniform and simple preparation process; compared with the existing annular piezoresistor, the chip piezoresistor has smaller stress moment and is not limited to be sleeved on the motor in the installation mode, so that the chip piezoresistor has better falling resistance under the same falling external force, is not easy to break, and further ensures the realization of electromagnetic pollution absorption and electric spark generation inhibition effects.
An electromagnetic pollution absorption device can combine a plurality of surface junction type piezoresistor discs on an annular PCB substrate, has good drop resistance in practical use, has good electromagnetic pollution absorption effect, and can effectively inhibit the generation of electric sparks; and the device is suitable for low-frequency and high-frequency signals simultaneously through the parallel capacitors, namely, the device has stronger practicability.
Drawings
FIG. 1 is a schematic structural diagram of a surface-junction-type varistor according to an embodiment of the present invention;
FIG. 2 is a schematic top view of the electromagnetic pollution absorption apparatus according to embodiment 1 of the present invention;
in the figure: 1. a varistor body; 11. a working surface; 2. an electrode; 3. a PCB substrate; 4. and (6) connecting points.
Detailed Description
For the purpose of illustrating the present invention, reference is made to the following description taken in conjunction with the accompanying drawings:
as shown in fig. 1 to 2, embodiment 1 of the present invention:
a preparation process of a surface junction type varistor comprises the following steps:
s1: preparing a sheet-shaped piezoresistor main body 1;
s2: printing and firing the electrodes 2 on the working face 11 of the varistor body 1, it being noted that this step can also be carried out on the opposite face of the working face 11;
s3: after the electrode 2 is burnt, various performances of the formed piezoresistor sheet are tested, including but not limited to the strength of the piezoresistor main body 1, the peeling strength of the silver layer of the electrode 2 and the like;
s4: packaging the voltage-sensitive resistance sheets with qualified performance;
s5: and storing the packaged piezoresistor sheets for later use.
Wherein the content of the first and second substances,
the step S1 specifically comprises the following substeps:
s1-1: mixing materials, namely mixing 85-95% of zinc oxide and 5-15% of additive according to weight percentage, wherein the additive comprises the following components in percentage by weight: 3 to 4 percent of cobalt carbonate, 2 to 3 percent of aluminum oxide, 1 to 1.5 percent of manganese carbonate, 1 to 1.5 percent of titanium dioxide, 0.5 to 1 percent of tin oxide and 0.5 to 1 percent of silicon oxide, thereby realizing the preliminary mixing of the raw materials;
s1-2: wet grinding, namely grinding the mixed raw materials by using a wet ball mill to form slurry;
s1-3: drying, namely evaporating water in the slurry by a spray drying method to form powder;
s1-4: molding, namely pressing the powder into sheets by using a pressure molding machine to form a blank;
s1-5: sintering, namely placing the blank into a high-pressure chamber for high-temperature sintering to prepare a piezoresistor main body 1;
s1-6: and cleaning to remove impurity residues such as dust and particles on the surface of the piezoresistor main body 1.
The step S2 specifically includes the following substeps:
s2-1: mixing materials, namely mixing silver paste and bismuth oxide to form a raw material of the electrode 2, wherein the content of the bismuth oxide accounts for 2% -5% of the content of the whole raw material of the electrode, and the silver paste is prepared from silver powder, organic matters, metal oxidants, diluents and the like;
s2-2: printing, as shown in fig. 1, after printing the ink-like electrode material on the working surface 11 of the varistor main body 1, the electrode material 2 is extended and printed on two opposite side surfaces of the varistor main body 1;
s2-3: and (5) sintering and infiltrating, and sintering the electrode 2.
Through the steps S1 and S2, the obtained piezoresistor main body is sheet-shaped rather than annular, the sheet-shaped moment is obviously smaller than that of the annular piezoresistor main body, and in practical use, the sheet-shaped piezoresistor does not need to be sleeved on the motor and can be directly and electrically connected to a commutator part of the motor, so that the sheet-shaped piezoresistor is more difficult to break under the same external force; in addition, for the sheet-shaped piezoresistor main body, only electrode raw materials are directly printed in a designated area on the working surface, and the sheet-shaped piezoresistor is quicker in production efficiency compared with an annular piezoresistor without complex works such as measurement, correction and the like in the early stage in a printing link, and can form a standard, uniform and efficient production line. The surface junction type piezoresistor sheet is prepared according to the preparation process, and comprises a sheet piezoresistor main body 1, wherein a piezoresistor surface junction is arranged in the piezoresistor main body 1, and an electrode 2 is arranged on a working surface 11 of the piezoresistor main body 1 and two adjacent opposite surfaces of the working surface 11 respectively.
An electromagnetic pollution absorption device applies the surface junction type piezoresistor disc, as shown in figure 2, and comprises an annular PCB substrate 3, wherein three surface junction type piezoresistor discs are adhered and welded on one surface of the PCB substrate 3, and a certain spacing distance is reserved between the three surface junction type piezoresistor discs; the PCB substrate 3 is also provided with three contacts 4, the three contacts 4 and the three piezoresistor discs are arranged at intervals, two ends of each contact 4 are respectively connected with one end of the electrode 2 of the adjacent piezoresistor disc, wherein the contacts 4 are connected on the electrodes 2 on the side surfaces (namely two adjacent opposite surfaces of the working surface 11) of the piezoresistor main body 1 through lead wires; the pins of the PCB are connected to a commutator (not shown in the drawings, for prior art) of a brushed dc micro motor.
In summary, compared with the existing annular piezoresistor, the present embodiment successfully realizes breakthrough and improvement in three aspects, specifically:
firstly, compared with the shape of an annular piezoresistor sheet, the sheet-shaped moment is obviously small, and in practical use, the sheet-shaped piezoresistor does not need to be sleeved on the motor and can be directly and electrically connected to a commutator part of the motor, so that the sheet-shaped piezoresistor is more difficult to break under the same external force, and the electromagnetic pollution absorption and the realization of the electric spark generation inhibition effect are ensured;
secondly, compared with the complicated printing steps and operation standards in the existing annular piezoresistor, the method has the advantages that on the basis of ensuring the peeling strength standard of the silver layer, only the raw materials of the electrodes 2 need to be directly printed in the designated areas on the working surface 11 and two opposite surfaces respectively adjacent to the working surface 11; and the number of the electrodes 2 on the piezoresistor sheet is uniform, so that the process operation does not need to be adjusted for multiple times according to the number of the electrodes 2; in addition, when the electromagnetic pollution absorption device is prepared, no special position requirement exists between the piezoresistor disc and the PCB substrate 3, and only the piezoresistor disc is required to be completely positioned on the PCB substrate 3 and a certain spacing distance exists between the three piezoresistor discs; therefore, the efficiency of the printing link of the electrode 2 is effectively improved, and the whole piezoresistor sheet preparation production line and the electromagnetic pollution absorption device production line can efficiently run;
thirdly, the electromagnetic pollution absorption device realizes the compounding of 3 surface junction type piezoresistor discs, has good falling resistance in practical use, has good electromagnetic pollution absorption effect, and can effectively inhibit the generation of electric sparks.
Example 2 of the invention:
in this embodiment, on the basis of embodiment 1, three capacitors are further bonded to the reverse surface of the PCB substrate 3 to which the varistor is bonded, and the three capacitors are connected to the three contacts 4 in the same manner as the varistor and the contacts 4 described in embodiment 1, so that the varistor and the capacitors are connected in parallel and located on the two surfaces of the PCB substrate 3, respectively.
As described above, in the electromagnetic pollution absorbing apparatus according to embodiment 1, the varistor sheet has a limited current absorption; in particular, the capacitance of a varistor is typically several tens to several hundreds pf, and is generally applicable only to low frequency signals. Therefore, the capacitor is connected in parallel to the contact 4 of the PCB substrate 3, so that the electromagnetic pollution absorption device in this embodiment is also applicable to high frequency signals, thereby having a higher practicability.
Of course, the foregoing is only a preferred embodiment of the invention and should not be taken as limiting the scope of the embodiments of the invention. The present invention is not limited to the above examples, and equivalent changes and modifications made by those skilled in the art within the spirit and scope of the present invention should be construed as being included in the scope of the present invention.
Claims (10)
1. A preparation process of a surface junction type piezoresistor sheet is characterized by comprising the following steps:
s1: preparing a sheet-shaped piezoresistor main body (1);
s2: the electrodes (2) are printed and fired on the working surface (11) of the varistor body (1).
2. The preparation process of the surface-junction-type varistor according to claim 1, wherein S1 comprises the following substeps:
s1-1: mixing materials, namely mixing 85-95% of zinc oxide and 5-15% of additive according to weight percentage, wherein the additive comprises the following components in percentage by weight: 3 to 4 percent of cobalt carbonate, 2 to 3 percent of aluminum oxide, 1 to 1.5 percent of manganese carbonate, 1 to 1.5 percent of titanium dioxide, 0.5 to 1 percent of tin oxide and 0.5 to 1 percent of silicon oxide;
s1-2: wet grinding, namely grinding the mixed raw materials to form slurry;
s1-3: drying, evaporating water in the slurry to form powder;
s1-4: forming, namely pressing and forming the powder to form a blank;
s1-5: sintering, namely sintering the blank at a high temperature to prepare a piezoresistor main body (1);
s1-6: and cleaning to remove residues on the surface of the piezoresistor main body (1).
3. The process for preparing the surface-junction-type varistor according to claim 1, wherein said S2 comprises the following substeps:
s2-1: mixing materials, namely mixing silver paste and bismuth oxide to form an electrode raw material, wherein the content of the bismuth oxide accounts for 2% -5% of the content of the whole electrode raw material;
s2-2: coating, namely coating and printing electrode raw materials on a working surface (11) of the piezoresistor main body (1);
s2-3: and (5) sintering and infiltrating, and sintering the electrode (2).
4. The preparation process of the surface-junction-type piezoresistor sheet according to claim 3, wherein the preparation process comprises the following steps: in the S2-3, through sintering and infiltration, bismuth oxide in the electrode raw material permeates into the piezoresistor main body (1) to form a surface knot, and silver paste in the electrode raw material is condensed on the working surface (11) of the piezoresistor main body (1) to form the electrode (2).
5. The preparation process of the surface-junction-type piezoresistor sheet according to claim 3, wherein the preparation process comprises the following steps: and in the S2-2, after the electrode raw materials are coated and printed on the working surface (11) of the piezoresistor main body (1), the electrode raw materials are coated and printed on two opposite side surfaces of the piezoresistor main body (1) in an extending mode.
6. The surface-junction type varistor sheet prepared by the preparation process according to any one of claims 1 to 5, wherein: the varistor comprises a sheet-shaped varistor main body (1), wherein a piezosensitive surface knot is arranged in the varistor main body (1), and an electrode (2) is arranged on a working surface (11) of the varistor main body (1).
7. The surface-junction-type varistor according to claim 6, wherein: the electrodes (2) extend from the working surface (11) of the piezoresistor main body (1) to two opposite side surfaces of the piezoresistor main body (1).
8. An electromagnetic pollution absorption device using the surface-junction-type varistor according to claim 7, wherein: the circuit board comprises an annular PCB substrate (3), wherein one surface of the PCB substrate (3) is connected with a piezoresistor sheet.
9. The electromagnetic pollution absorption device according to claim 8, wherein: the PCB substrate (3) is provided with a plurality of contact points (4), and a voltage-sensitive resistance sheet is connected between every two contact points (4).
10. The electromagnetic pollution absorption device according to claim 9, wherein: and a capacitor is connected between every two contact points (4), the capacitor is connected with the voltage-sensitive resistance sheet in parallel, and the capacitor and the voltage-sensitive resistance sheet are respectively positioned on two surfaces of the PCB substrate (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211412917.3A CN115910509A (en) | 2022-11-11 | 2022-11-11 | Surface-junction type piezoresistor disc, preparation process thereof and electromagnetic pollution absorption device |
Applications Claiming Priority (1)
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| CN101239819A (en) * | 2007-09-14 | 2008-08-13 | 中国南玻集团股份有限公司 | Method for preparing sheet type multilayer zinc oxide pressure-sensitive electric resistance ceramic powder |
| CN102262919A (en) * | 2011-07-19 | 2011-11-30 | 彩虹集团公司 | Environment-friendly electrode silver paste for piezoresistor and preparation method for paste |
| CN204886578U (en) * | 2015-08-26 | 2015-12-16 | 深圳市航天电机系统有限公司 | Piezo -resistor encircles for motor |
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| CN211930448U (en) * | 2020-01-19 | 2020-11-13 | 上海博泽电机有限公司 | Direct current brush motor and commutator and brush arrangement thereof |
| US20210344257A1 (en) * | 2019-01-17 | 2021-11-04 | Johnson Electric International AG | Emi filter for dc motor |
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| CN101239819A (en) * | 2007-09-14 | 2008-08-13 | 中国南玻集团股份有限公司 | Method for preparing sheet type multilayer zinc oxide pressure-sensitive electric resistance ceramic powder |
| CN102262919A (en) * | 2011-07-19 | 2011-11-30 | 彩虹集团公司 | Environment-friendly electrode silver paste for piezoresistor and preparation method for paste |
| CN204886578U (en) * | 2015-08-26 | 2015-12-16 | 深圳市航天电机系统有限公司 | Piezo -resistor encircles for motor |
| CN107799199A (en) * | 2017-10-24 | 2018-03-13 | 彩虹集团新能源股份有限公司 | A kind of low cost low temperature sintering piezoresistor silver paste and preparation method thereof |
| US20210344257A1 (en) * | 2019-01-17 | 2021-11-04 | Johnson Electric International AG | Emi filter for dc motor |
| CN211930448U (en) * | 2020-01-19 | 2020-11-13 | 上海博泽电机有限公司 | Direct current brush motor and commutator and brush arrangement thereof |
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