CN115900977A - Chip overheating early warning method and device of relay protection equipment - Google Patents
Chip overheating early warning method and device of relay protection equipment Download PDFInfo
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Abstract
The invention discloses a chip overheating early warning method and device of relay protection equipment. The method comprises the following steps: acquiring the environmental temperature of the monitored chip by a temperature sensor at preset unit monitoring time intervals; calculating the junction temperature of the monitored chip according to the ambient temperature based on the chip junction temperature model; comparing the junction temperature with a plurality of preset junction temperature thresholds to determine whether the relay protection equipment carries out early warning prompt on the monitored chip, wherein the plurality of junction temperature thresholds comprise a first junction temperature threshold, a second junction temperature threshold, a third junction temperature threshold and a fourth junction temperature threshold, and a normal working temperature range is between the first junction temperature threshold and the second junction temperature threshold; a life accelerated decay temperature interval is between the second junction temperature threshold and the third junction temperature threshold; the temperature interval between the third junction temperature threshold and the fourth junction temperature threshold is an allowable short-time operation temperature interval: the fourth junction temperature threshold is a maximum allowable temperature.
Description
Technical Field
The invention relates to the technical field of chip overheating early warning, in particular to a chip overheating early warning method and device of relay protection equipment.
Background
The relay protection equipment is one of key equipment in the field of power grid dispatching communication, is a first defense line for guaranteeing safe and stable operation of a power grid, and can cause equipment performance reduction or instability due to overheating of components, so that correct action of the relay protection equipment can be influenced in severe cases, and accidents such as power grid power failure or casualties can be caused.
The equipment manufacturer mainly relies on design experience and later-stage high-low temperature test of the whole machine to ensure the thermal reliability of the equipment, and the thermal reliability is considered to meet the requirement after the test is passed. However, when the device is put into operation, the device is overheated, which causes equipment failure, and affects the reliable operation of the power grid. With the comprehensive application of domestic chips in protection equipment, the problem of equipment heating gradually appears.
At present, the national grid company installs temperature sensors on a CPU board and a power panel of a transportation relay protection device to sense the environmental temperature of the device, and lacks effective judgment means for the temperature and the service life state of high-heat-loss components such as a main control chip and an FPGA chip, and lacks an effective early warning prompt strategy for an overheated chip, so that an operator cannot know the abnormal state of the chip at the first time. The chip performance is abnormal due to long-time high-temperature operation of high-heat-loss components, so that the abnormal protection equipment, even the failure or misoperation can be caused, and the safe and reliable operation of a power grid is seriously influenced.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a chip overheating early warning method and device of relay protection equipment.
According to one aspect of the invention, a chip overheating early warning method for relay protection equipment is provided, which comprises the following steps:
acquiring the environmental temperature of the monitored chip by a temperature sensor at intervals of a preset unit monitoring time period;
calculating the junction temperature of the monitored chip according to the ambient temperature based on the chip junction temperature model;
comparing the junction temperature with a plurality of preset junction temperature thresholds to determine whether the relay protection device carries out early warning prompt on the monitored chip, wherein the plurality of junction temperature thresholds comprise a first junction temperature threshold, a second junction temperature threshold, a third junction temperature threshold and a fourth junction temperature threshold,
a normal working temperature interval is arranged between the first junction temperature threshold and the second junction temperature threshold;
a life accelerated decay temperature interval is between the second junction temperature threshold and the third junction temperature threshold;
the temperature interval between the third junction temperature threshold and the fourth junction temperature threshold is an allowable short-time operation temperature interval:
the fourth junction temperature threshold is a maximum allowable temperature.
Optionally, comparing the junction temperature with a plurality of junction temperature thresholds set in advance, and determining whether the relay protection device performs an early warning prompt on the monitored chip, includes:
and under the condition that the junction temperature is higher than the fourth junction temperature threshold value, the relay protection equipment sends an alarm signal to the monitored chip.
Optionally, comparing the junction temperature with a plurality of junction temperature thresholds set in advance, and determining whether the relay protection device performs an early warning prompt on the monitored chip, includes:
and under the condition that the junction temperature is in a third junction temperature threshold value and a fourth junction temperature threshold value interval, calculating the running time of the monitored chip, and under the condition that the running time exceeds the preset maximum value of the running time allowed in the temperature interval, sending an alarm signal to the monitored chip by the relay protection equipment.
Optionally, comparing the junction temperature with a plurality of junction temperature thresholds set in advance, and determining whether the relay protection device performs an early warning prompt on the monitored chip, includes:
under the condition that the junction temperature is in the second junction temperature threshold value and the third junction temperature threshold value interval, setting a monitoring time period of the monitored chip, and calculating the average junction temperature of the monitored chip in the monitoring time period;
calculating a first characteristic life of the monitored chip at a second junction temperature threshold value and a second characteristic life of the monitored chip at an average junction temperature according to an Arrhenius model;
determining the life decay acceleration ratio of the monitored chip in the monitoring time period according to the first characteristic life and the second characteristic life;
setting protection early warning time of a monitored chip in a life acceleration decay temperature interval, and carrying out junction temperature calculation and life decay acceleration ratio calculation on the monitored chip at intervals of preset unit monitoring time periods within the protection early warning time to determine the average life decay acceleration ratio of the monitored chip within the protection early warning time;
and determining whether the relay protection equipment carries out early warning prompt on the monitored chip or not according to the average life decay acceleration ratio.
Optionally, determining whether the relay protection device performs an early warning prompt on the monitored chip according to the average lifetime attenuation acceleration ratio includes:
under the condition that the average life attenuation acceleration ratio is larger than a preset threshold value, the relay protection equipment does not give an early warning prompt to the monitored chip;
and under the condition that the average life decay acceleration ratio is less than or equal to a preset threshold value, the relay protection equipment sends an alarm signal to the monitored chip.
According to another aspect of the present invention, there is provided a chip overheat early warning device for a relay protection device, including:
the acquisition module is used for acquiring the environmental temperature of the monitored chip by the temperature sensor at preset unit monitoring time intervals;
the calculation module is used for calculating the junction temperature of the monitored chip according to the ambient temperature based on the chip junction temperature model;
a determining module, configured to compare the junction temperature with a plurality of junction temperature thresholds that are preset, and determine whether the relay protection device performs an early warning prompt on the monitored chip, where the plurality of junction temperature thresholds include a first junction temperature threshold, a second junction temperature threshold, a third junction temperature threshold, and a fourth junction temperature threshold,
a normal working temperature interval is arranged between the first junction temperature threshold and the second junction temperature threshold;
a life accelerated decay temperature interval is between the second junction temperature threshold and the third junction temperature threshold;
between the third junction temperature threshold and the fourth junction temperature threshold is a short-time operation temperature-allowed interval:
the fourth junction temperature threshold is a maximum allowable temperature.
According to a further aspect of the invention, there is provided a computer readable storage medium having stored thereon a computer program for executing the method of any of the above aspects of the invention.
According to still another aspect of the present invention, there is provided an electronic apparatus including: a processor; a memory for storing the processor-executable instructions; the processor is configured to read the executable instructions from the memory and execute the instructions to implement the method according to any one of the above aspects of the present invention.
Therefore, according to the chip overheating early warning method for the relay protection device, the actual operation state of the chip can be reliably identified by setting different temperature thresholds and matching with corresponding warning strategies. When the chip is abnormally high in temperature, the abnormal lamp of the device is lightened and warning information is sent to the station end monitoring background to prompt operating personnel to check the abnormal protection state in the first time, so that the problem that the device is failed due to overheating of the chip and the safe and reliable operation of a power grid is influenced is avoided. The invention can change the current situation that the chip of the current relay protection equipment has no effective supervision means when being overheated, and effectively improves the reliability of the relay protection equipment.
Drawings
A more complete understanding of exemplary embodiments of the present invention may be had by reference to the following drawings in which:
fig. 1 is a schematic flowchart of a chip overheating warning method for relay protection equipment according to an exemplary embodiment of the present invention;
fig. 2 is another schematic flow chart of a chip overheating warning method for relay protection equipment according to an exemplary embodiment of the present invention;
fig. 3 is a schematic structural diagram of a chip overheating early warning device of a relay protection device according to an exemplary embodiment of the present invention;
fig. 4 is a structure of an electronic device according to an exemplary embodiment of the present invention.
Detailed Description
Hereinafter, example embodiments according to the present invention will be described in detail with reference to the accompanying drawings. It is to be understood that the described embodiments are merely a subset of embodiments of the invention and not all embodiments of the invention, with the understanding that the invention is not limited to the example embodiments described herein.
It should be noted that: the relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.
It will be understood by those of skill in the art that the terms "first," "second," and the like in the embodiments of the present invention are used merely to distinguish one element, step, device, module, or the like from another element, and do not denote any particular technical or logical order therebetween.
It should also be understood that in embodiments of the present invention, "a plurality" may refer to two or more and "at least one" may refer to one, two or more.
It should also be understood that any reference to any component, data, or structure in an embodiment of the invention may be generally understood as one or more, unless explicitly stated otherwise or indicated otherwise herein.
In addition, the term "and/or" in the present invention is only one kind of association relationship describing the associated object, and means that there may be three kinds of relationships, for example, a and/or B, which may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" in the present invention generally indicates that the preceding and succeeding related objects are in an "or" relationship.
It should also be understood that the description of the embodiments of the present invention emphasizes the differences between the embodiments, and the same or similar parts may be referred to each other, so that the descriptions thereof are omitted for brevity.
Meanwhile, it should be understood that the sizes of the respective portions shown in the drawings are not drawn in an actual proportional relationship for the convenience of description.
The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.
Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but are intended to be part of the specification where appropriate.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
Embodiments of the invention are operational with numerous other general purpose or special purpose computing system environments or configurations, and with numerous other electronic devices, such as terminal devices, computer systems, servers, etc. Examples of well known terminal devices, computing systems, environments, and/or configurations that may be suitable for use with electronic devices, such as terminal devices, computer systems, servers, and the like, include, but are not limited to: personal computer systems, server computer systems, thin clients, thick clients, hand-held or laptop devices, microprocessor-based systems, set-top boxes, programmable consumer electronics, network personal computers, small computer systems, mainframe computer systems, and distributed cloud computing environments that include any of the above, and the like.
Electronic devices such as terminal devices, computer systems, servers, etc. may be described in the general context of computer system-executable instructions, such as program modules, being executed by a computer system. Generally, program modules may include routines, programs, objects, components, logic, data structures, etc. that perform particular tasks or implement particular abstract data types. The computer system/server may be practiced in distributed cloud computing environments where tasks are performed by remote processing devices that are linked through a communications network. In a distributed cloud computing environment, program modules may be located in both local and remote computer system storage media including memory storage devices.
Exemplary method
Fig. 1 is a schematic flowchart of a chip overheating warning method for a relay protection device according to an exemplary embodiment of the present invention. The embodiment can be applied to an electronic device, and as shown in fig. 1, a chip overheating warning method 100 of a relay protection device includes the following steps:
102, calculating the junction temperature of the monitored chip according to the ambient temperature based on a chip junction temperature model;
a normal working temperature interval is arranged between the first junction temperature threshold and the second junction temperature threshold;
a life accelerated decay temperature interval is between the second junction temperature threshold and the third junction temperature threshold;
the temperature interval between the third junction temperature threshold and the fourth junction temperature threshold is an allowable short-time operation temperature interval:
the fourth junction temperature threshold is the maximum temperature allowed.
Optionally, comparing the junction temperature with a plurality of junction temperature thresholds set in advance, and determining whether the relay protection device performs an early warning prompt on the monitored chip, includes:
and under the condition that the junction temperature is higher than the fourth junction temperature threshold value, the relay protection equipment sends an alarm signal to the monitored chip.
Optionally, the step of comparing the junction temperature with a plurality of junction temperature thresholds set in advance to determine whether the relay protection device performs an early warning prompt on the monitored chip includes:
and under the condition that the junction temperature is in a third junction temperature threshold value and a fourth junction temperature threshold value interval, calculating the running time of the monitored chip, and under the condition that the running time exceeds the preset maximum value of the running time allowed in the temperature interval, sending an alarm signal to the monitored chip by the relay protection equipment.
Optionally, comparing the junction temperature with a plurality of junction temperature thresholds set in advance, and determining whether the relay protection device performs an early warning prompt on the monitored chip, includes:
under the condition that the junction temperature is in the second junction temperature threshold value and the third junction temperature threshold value interval, setting a monitoring time period of the monitored chip, and calculating the average junction temperature of the monitored chip in the monitoring time period;
calculating a first characteristic life of the monitored chip at a second junction temperature threshold value and a second characteristic life of the monitored chip at an average junction temperature according to an Arrhenius model;
determining the life decay acceleration ratio of the monitored chip in the monitoring time period according to the first characteristic life and the second characteristic life;
setting protection early warning time of a monitored chip in a life acceleration decay temperature interval, and carrying out junction temperature calculation and life decay acceleration ratio calculation on the monitored chip at intervals of preset unit monitoring time periods within the protection early warning time to determine the average life decay acceleration ratio of the monitored chip within the protection early warning time;
and determining whether the relay protection equipment carries out early warning prompt on the monitored chip or not according to the average life decay acceleration ratio.
Optionally, determining whether the relay protection device performs an early warning prompt on the monitored chip according to the average life decay acceleration ratio includes:
under the condition that the average life decay acceleration ratio is larger than a preset threshold value, the relay protection equipment does not perform early warning prompt on the monitored chip;
and under the condition that the average life decay acceleration ratio is less than or equal to a preset threshold value, the relay protection equipment sends an alarm signal to the monitored chip.
Specifically, according to the working requirements of the monitored chip, different junction temperature thresholds are set, and T is sequentially set from small to large 1m ，T 2m ，T 3m ，T 4m 。
Wherein, T 1m ～T 2m : the expected service life of the monitored chip is not affected in the normal working temperature range;
T 2m -T 3m : the life accelerated decay temperature interval of the monitored chip;
T 3m -T 4m : the monitored chip allows a short-time operation temperature interval;
T 4m : the chip allows the highest junction temperature, and the chip can be damaged irreversibly when the temperature exceeds the highest junction temperature;
the method mainly comprises the following steps:
step 1: calculating the maximum allowable temperature T of the monitored chip in normal operation according to an Arrhenius model 2m Characteristic life of the following:
and 2, step: acquiring the ambient temperature of the chip in real time by adopting a temperature sensor every unit time delta T, and calculating the junction temperature T of the monitored chip based on a chip junction temperature model j ；
And 3, step 3: and judging the temperature interval in which the junction temperature is positioned.
When junction temperature T j Greater than T 4m When the alarm is started, the abnormal lamp of the protection device is directly lightened, and an alarm signal is sent to a monitoring background;
when junction temperature T j Greater than T 3m And is less than T 4m When the accumulated running time exceeds the allowable time h, the accumulated running time h of the monitored chip is calculated max When the lamp is turned on, the abnormal lamp of the protection device is lightedAlarming signals to a monitoring background;
when junction temperature T j Less than T 3m Then, the average junction temperature T of the monitored chip within a certain temperature monitoring time interval Delta T (n.Delta T) is calculated jav And the characteristic lifetime of the chip at that temperature
Calculating the life attenuation acceleration ratio of the monitored chip:
and 4, step 4: setting the protection early warning time of the chip in the life accelerated decay period to be N times of delta T, repeating the step 2 to the step 3 in the chip protection early warning time, and calculating lambda i (i＝1,2,3....)。
And 5: calculating the average value of the life decay acceleration ratio in the protection early warning time N-. DELTA.T period:
if mu is more than 1 during the protection early warning time N.DELTA.T, the monitored chip works in the normal working allowable temperature range in most of time, and the expected service life of the chip is not influenced;
if mu is less than or equal to 1 during the protection early warning time N.DELTA.T, the monitored chip works outside the normal working allowable temperature range in most of time, the chip is in the life accelerated decay period, namely the life decay rate of the monitored chip is larger, and at the moment, the abnormal lamp of the protection device is lightened, and an alarm signal is sent to the monitoring background.
Therefore, 1, the invention provides an overheating early warning method for components of relay protection equipment, which provides corresponding overheating warning strategies based on different temperature thresholds and can reliably identify the actual running state of a chip; 2. the service life accelerated attenuation model and the inter-partition early warning strategy based on the Arrhenius equation are provided, so that false alarms generated by a relay protection system in thermal oscillation and EMC environments can be avoided, and the method is stable and reliable; 3. the invention belongs to the field of soft protection, and completes the overheating early warning of a monitored chip by means of the temperature monitoring function of the current relay protection equipment and the addition of the judgment strategy provided by the invention.
Therefore, according to the chip overheating early warning method for the relay protection device, the actual operation state of the chip can be reliably identified by setting different temperature thresholds and matching with corresponding warning strategies. When the chip is abnormally high in temperature, the abnormal lamp of the device is lightened and warning information is sent to the station end monitoring background to prompt operating personnel to check the abnormal protection state in the first time, so that the problem that the device is failed due to overheating of the chip and the safe and reliable operation of a power grid is influenced is avoided. The invention can change the current situation that the chip of the current relay protection equipment has no effective supervision means when being overheated, and effectively improves the reliability of the relay protection equipment.
Exemplary devices
Fig. 3 is a schematic structural diagram of a chip overheating early warning device of a relay protection device according to an exemplary embodiment of the present invention. As shown in fig. 3, the apparatus 300 includes:
the acquisition module 310 is used for acquiring the environmental temperature of the monitored chip by the temperature sensor at preset unit monitoring time intervals;
a calculating module 320, configured to calculate a junction temperature of the monitored chip according to the ambient temperature based on the chip junction temperature model;
a determining module 330, configured to compare the junction temperature with a plurality of junction temperature thresholds that are preset, and determine whether the relay protection device performs an early warning prompt on the monitored chip, where the plurality of junction temperature thresholds include a first junction temperature threshold, a second junction temperature threshold, a third junction temperature threshold, and a fourth junction temperature threshold,
a normal working temperature interval is arranged between the first junction temperature threshold and the second junction temperature threshold;
a life accelerated decay temperature interval is between the second junction temperature threshold and the third junction temperature threshold;
the temperature interval between the third junction temperature threshold and the fourth junction temperature threshold is an allowable short-time operation temperature interval:
the fourth junction temperature threshold is a maximum allowable temperature.
Optionally, the determining module 330 includes:
and the first alarm sub-module is used for sending an alarm signal to the monitored chip by the relay protection equipment under the condition that the junction temperature is higher than the fourth junction temperature threshold value.
Optionally, the determining module 330 includes:
and the second warning sending sub-module is used for calculating the running time of the monitored chip under the condition that the junction temperature is in a third junction temperature threshold value and a fourth junction temperature threshold value interval, and sending a warning signal to the monitored chip by the relay protection equipment under the condition that the running time exceeds a preset maximum running time allowed in the temperature interval.
Optionally, the determining module 330 includes:
the first calculation submodule is used for setting a monitoring time period of the monitored chip under the condition that the junction temperature is in a second junction temperature threshold value and a third junction temperature threshold value interval, and calculating the average junction temperature of the monitored chip in the monitoring time period;
the second calculation submodule is used for calculating the first characteristic life of the monitored chip at a second junction temperature threshold value and the second characteristic life of the monitored chip at the average junction temperature according to the Arrhenius model;
the first determining submodule is used for determining the life decay acceleration ratio of the monitored chip in the monitoring time period according to the first characteristic life and the second characteristic life;
the second determining submodule is used for setting the protection early warning time of the monitored chip in the life acceleration attenuation temperature interval, carrying out junction temperature calculation and life attenuation acceleration ratio calculation on the monitored chip at intervals of preset unit monitoring time periods within the protection early warning time, and determining the average life attenuation acceleration ratio of the monitored chip within the protection early warning time;
and the third determining submodule is used for determining whether the relay protection equipment carries out early warning prompt on the monitored chip or not according to the average life decay acceleration ratio.
Optionally, the third determining sub-module includes:
the first judgment unit is used for not carrying out early warning prompt on the monitored chip by the relay protection equipment under the condition that the average life attenuation acceleration ratio is larger than a preset threshold value;
and the second judgment unit is used for sending an alarm signal to the monitored chip by the relay protection equipment under the condition that the average life decay acceleration ratio is less than or equal to a preset threshold value.
Exemplary electronic device
Fig. 4 is a structure of an electronic device according to an exemplary embodiment of the present invention. As shown in fig. 4, the electronic device 40 includes one or more processors 41 and memory 42.
The processor 41 may be a Central Processing Unit (CPU) or other form of processing unit having data processing capabilities and/or instruction execution capabilities, and may control other components in the electronic device to perform desired functions.
The input device 43 may also include, for example, a keyboard, a mouse, and the like.
The output device 44 can output various information to the outside. The output devices 44 may include, for example, a display, speakers, a printer, and a communication network and its connected remote output devices, among others.
Of course, for simplicity, only some of the components of the electronic device that are relevant to the present invention are shown in fig. 4, omitting components such as buses, input/output interfaces, and the like. In addition, the electronic device may include any other suitable components, depending on the particular application.
Exemplary computer program product and computer-readable storage Medium
In addition to the above-described methods and apparatus, embodiments of the invention may also be computer program products comprising computer program instructions which, when executed by a processor, cause the processor to perform the steps in the methods according to various embodiments of the invention described in the "exemplary methods" section of this specification above.
The computer program product may write program code for carrying out operations for embodiments of the present invention in any combination of one or more programming languages, including an object oriented programming language such as Java, C + + or the like and conventional procedural programming languages, such as the "C" programming language or similar programming languages. The program code may execute entirely on the user's computing device, partly on the user's device, as a stand-alone software package, partly on the user's computing device and partly on a remote computing device, or entirely on the remote computing device or server.
Furthermore, embodiments of the present invention may also be a computer readable storage medium having stored thereon computer program instructions that, when executed by a processor, cause the processor to perform steps in a method of information mining of historical change records according to various embodiments of the present invention described in the "exemplary methods" section above in this specification.
The computer-readable storage medium may take any combination of one or more readable media. The readable medium may be a readable signal medium or a readable storage medium. A readable storage medium may include, for example, but not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, or device, or any combination of the foregoing. More specific examples (a non-exhaustive list) of the readable storage medium include: an electrical connection having one or more wires, a portable disk, a hard disk, a Random Access Memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.
The basic principles of the present invention have been described above with reference to specific embodiments, but it should be noted that the advantages, effects, etc. mentioned in the present invention are only examples and are not limiting, and the advantages, effects, etc. should not be considered as being necessary for the various embodiments of the present invention. Furthermore, the foregoing disclosure of specific details is for the purpose of illustration and description and is not intended to be limiting, since the invention is not limited to the specific details described above.
In the present specification, the embodiments are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same or similar parts in the embodiments are referred to each other. For the system embodiment, since it basically corresponds to the method embodiment, the description is relatively simple, and reference may be made to the partial description of the method embodiment for relevant points.
The block diagrams of devices, systems, apparatuses, and systems involved in the present invention are merely illustrative examples and are not intended to require or imply that the devices, systems, apparatuses, and systems must be connected, arranged, or configured in the manner shown in the block diagrams. These devices, systems, apparatuses, systems may be connected, arranged, configured in any manner, as will be appreciated by those skilled in the art. Words such as "including," "comprising," "having," and the like are open-ended words that mean "including, but not limited to," and are used interchangeably therewith. The words "or" and "as used herein mean, and are used interchangeably with, the word" and/or, "unless the context clearly dictates otherwise. The word "such as" is used herein to mean, and is used interchangeably with, the phrase "such as but not limited to".
The method and system of the present invention may be implemented in a number of ways. For example, the methods and systems of the present invention may be implemented in software, hardware, firmware, or any combination of software, hardware, and firmware. The above-described order for the steps of the method is for illustrative purposes only, and the steps of the method of the present invention are not limited to the order specifically described above unless specifically indicated otherwise. Furthermore, in some embodiments, the present invention may also be embodied as a program recorded in a recording medium, the program including machine-readable instructions for implementing a method according to the present invention. Thus, the present invention also covers a recording medium storing a program for executing the method according to the present invention.
It should also be noted that in the systems, apparatus and methods of the present invention, the various components or steps may be broken down and/or re-combined. These decompositions and/or recombinations are to be regarded as equivalents of the present invention. The previous description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these aspects will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other aspects without departing from the scope of the invention. Thus, the present invention is not intended to be limited to the aspects shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
The foregoing description has been presented for purposes of illustration and description. Furthermore, the description is not intended to limit embodiments of the invention to the form disclosed herein. While a number of example aspects and embodiments have been discussed above, those of skill in the art will recognize certain variations, modifications, alterations, additions and sub-combinations thereof.
Claims (10)
1. A chip overheating early warning method of relay protection equipment is characterized by comprising the following steps:
acquiring the environmental temperature of the monitored chip by a temperature sensor at intervals of a preset unit monitoring time period;
calculating the junction temperature of the monitored chip according to the ambient temperature based on a chip junction temperature model;
comparing the junction temperature with a plurality of preset junction temperature thresholds to determine whether the relay protection device carries out early warning prompt on the monitored chip, wherein the plurality of junction temperature thresholds comprise a first junction temperature threshold, a second junction temperature threshold, a third junction temperature threshold and a fourth junction temperature threshold,
a normal working temperature interval is arranged between the first junction temperature threshold and the second junction temperature threshold;
a life accelerated decay temperature interval is between the second junction temperature threshold and the third junction temperature threshold;
the temperature interval between the third junction temperature threshold and the fourth junction temperature threshold is allowed to run for a short time:
the fourth junction temperature threshold is a maximum allowable temperature.
2. The method of claim 1, wherein comparing the junction temperature with a plurality of junction temperature thresholds set in advance to determine whether a relay protection device gives an early warning prompt to the monitored chip comprises:
and under the condition that the junction temperature is higher than the fourth junction temperature threshold value, the relay protection equipment sends an alarm signal to the monitored chip.
3. The method of claim 1, wherein comparing the junction temperature with a plurality of junction temperature thresholds set in advance to determine whether a relay protection device performs an early warning prompt on the monitored chip comprises:
and under the condition that the junction temperature is in the third junction temperature threshold value and the fourth junction temperature threshold value, calculating the running time of the monitored chip, and under the condition that the running time exceeds the preset maximum running time allowed in the temperature interval, sending an alarm signal to the monitored chip by the relay protection equipment.
4. The method of claim 1, wherein comparing the junction temperature with a plurality of junction temperature thresholds set in advance to determine whether a relay protection device performs an early warning prompt on the monitored chip comprises:
under the condition that the junction temperature is in the second junction temperature threshold value and the third junction temperature threshold value interval, setting a monitoring time period of the monitored chip, and calculating the average junction temperature of the monitored chip in the monitoring time period;
calculating a first characteristic life of the monitored chip at the second junction temperature threshold value and a second characteristic life of the monitored chip at the average junction temperature according to an Arrhenius model;
determining a life decay acceleration ratio of the monitored chip in the monitoring time period according to the first characteristic life and the second characteristic life;
setting the protection early warning time of the monitored chip in the life time accelerated degradation temperature interval, and carrying out junction temperature calculation and life time degradation acceleration ratio calculation on the monitored chip at intervals of the preset unit monitoring time period within the protection early warning time to determine the average life time degradation acceleration ratio of the monitored chip within the protection early warning time;
and determining whether the relay protection equipment carries out early warning prompt on the monitored chip or not according to the average life decay acceleration ratio.
5. The method of claim 4, wherein determining whether the relay protection device warns the monitored chip based on the life-time degradation acceleration ratio comprises:
under the condition that the average life attenuation acceleration ratio is larger than a preset threshold value, the relay protection equipment does not perform early warning prompt on the monitored chip;
and under the condition that the average life attenuation acceleration ratio is less than or equal to the preset threshold value, the relay protection equipment sends an alarm signal to the monitored chip.
6. The utility model provides an overheated early warning device of chip of relay protection equipment which characterized in that includes:
the acquisition module is used for acquiring the environmental temperature of the monitored chip by the temperature sensor at preset unit monitoring time intervals;
the calculation module is used for calculating the junction temperature of the monitored chip according to the ambient temperature based on a chip junction temperature model;
a determining module, configured to compare the junction temperature with a plurality of junction temperature thresholds that are set in advance, and determine whether a relay protection device performs an early warning prompt on the monitored chip, where the plurality of junction temperature thresholds include a first junction temperature threshold, a second junction temperature threshold, a third junction temperature threshold, and a fourth junction temperature threshold,
a normal working temperature interval is arranged between the first junction temperature threshold and the second junction temperature threshold;
a life accelerated decay temperature interval is between the second junction temperature threshold and the third junction temperature threshold;
the temperature interval between the third junction temperature threshold and the fourth junction temperature threshold is allowed to run for a short time:
the fourth junction temperature threshold is a maximum allowable temperature.
7. The apparatus of claim 6, wherein the means for determining comprises:
and the first alarm sub-module is used for sending an alarm signal to the monitored chip by the relay protection device under the condition that the junction temperature is higher than the fourth junction temperature threshold value.
8. The apparatus of claim 6, wherein the means for determining comprises:
and the second warning sending submodule is used for calculating the running time of the monitored chip under the condition that the junction temperature is in the third junction temperature threshold value and the fourth junction temperature threshold value interval, and the relay protection equipment sends a warning signal to the monitored chip under the condition that the running time exceeds the preset maximum time allowed to run in the temperature interval.
9. A computer-readable storage medium, characterized in that the storage medium stores a computer program for performing the method of any of the preceding claims 1-5.
10. An electronic device, characterized in that the electronic device comprises:
a processor;
a memory for storing the processor-executable instructions;
the processor is used for reading the executable instructions from the memory and executing the instructions to realize the method of any one of the claims 1 to 5.
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| CN202211456795.8A CN115900977A (en) | 2022-11-21 | 2022-11-21 | Chip overheating early warning method and device of relay protection equipment |
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| CN202211456795.8A CN115900977A (en) | 2022-11-21 | 2022-11-21 | Chip overheating early warning method and device of relay protection equipment |
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