CN115890459A - Quartz wafer polishing device and polishing method - Google Patents
Quartz wafer polishing device and polishing method Download PDFInfo
- Publication number
- CN115890459A CN115890459A CN202211736932.3A CN202211736932A CN115890459A CN 115890459 A CN115890459 A CN 115890459A CN 202211736932 A CN202211736932 A CN 202211736932A CN 115890459 A CN115890459 A CN 115890459A
- Authority
- CN
- China
- Prior art keywords
- storage tank
- polishing
- gas
- liquid
- quartz wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Abstract
The invention belongs to the technical field of quartz wafer polishing, and particularly relates to a quartz wafer polishing device and a polishing method, wherein the quartz wafer polishing device comprises a double-sided polishing machine, a liquid storage tank, a water pump, a liquid supply pipe, a gas storage tank, a suction pump, a first gas pipe and a hollow upright rod; starting an air pump, injecting argon gas in the air storage tank into the liquid storage tank through a first air pipe and a hollow upright rod, exhausting air in the liquid storage tank, filling the prepared polishing solution into the liquid storage tank, and separating the air from the polishing solution by the argon gas to prevent fixed impurities such as dust in the air from entering the polishing solution; simultaneously, when argon gas got into the inside polishing solution of liquid reserve tank by hollow pole setting, argon gas scatters all around, and the argon gas of injection for the polishing solution is at the inside motion of liquid reserve tank, makes the solid abrasive in the polishing solution be difficult to static, thereby has reduced the solid abrasive that the solid abrasive in the polishing solution gathers into the large granule solid abrasive, has then reduced the probability that causes the fish tail on quartz chip surface.
Description
Technical Field
The invention belongs to the technical field of quartz wafer polishing, and particularly relates to a quartz wafer polishing device and a quartz wafer polishing method.
Background
With the rapid development of the electronic industry, the demand of quartz wafers serving as the core of the electronic industry is increasing day by day, and when the quartz wafers are produced and manufactured, a polishing device is required to polish and polish the surfaces of the quartz wafers, so that the flatness of the quartz wafers is improved, and the subsequent photoetching process is facilitated; polishing methods of quartz wafers are mainly classified into mechanical polishing methods, chemical polishing methods, and chemical mechanical polishing methods; the existing polishing mode is mainly a chemical mechanical polishing method.
The chemical mechanical polishing technology is a polishing method which is generally adopted in the modern semiconductor industry, utilizes the simultaneous action of chemical corrosion and mechanical grinding of a polishing solution on the surface of a silicon wafer, has the advantages of two polishing methods of chemical polishing and mechanical polishing and is a polishing method; the chemical mechanical polishing process is a process in which the mechanical action and the chemical action are balanced, in the quartz wafer polishing process, a quartz wafer is fixed on a lower working disc, and through relative rotation between the upper working disc and the lower working disc, polishing liquid is in contact with the surface of the quartz wafer to generate corrosion reaction, so that the surface of the quartz wafer is corroded and softened; and a large amount of solid grinding materials in the polishing solution help mechanical polishing to remove the corroded surface of the quartz wafer, so that the polishing of the quartz wafer is realized.
Because the diameter of the solid abrasive in the polishing solution is in the nanometer level, and any other fixed particle impurities in the polishing solution can scratch the surface of the quartz wafer, the preparation of the polishing solution is carried out in a sterile environment; however, the specific surface area of the nanoscale solid abrasive in the polishing solution is large, and the nanoscale solid abrasive has strong self-adsorption force, so that the solid abrasive in the polishing solution can be settled and aggregated with the passage of time to form large solid particles, and the surface of a quartz wafer is scratched in the polishing process.
Therefore, the invention provides a quartz wafer polishing device and a polishing method.
Disclosure of Invention
To remedy the deficiencies of the prior art, at least one of the technical problems set forth in the background is addressed.
The technical scheme adopted by the invention for solving the technical problems is as follows: the invention relates to a quartz wafer polishing device, which comprises a double-sided polishing machine and a liquid supply structure; the back of the double-sided polishing machine is provided with a liquid supply structure; the liquid supply structure comprises a liquid storage tank, a water pump, a liquid supply pipe, a gas storage tank, an air pump, a first gas pipe and a hollow upright rod; the back surface of the double-sided polishing machine is provided with a liquid storage tank, polishing liquid is filled in the liquid storage tank, a water pump is mounted on the top surface of the liquid storage tank, the water inlet end of the water pump is communicated with the bottom of the liquid storage tank, the water outlet end of the water pump is communicated with a liquid supply pipe, the top end of the liquid supply pipe is communicated with an upper working plate of the double-sided polishing machine, one side of the liquid storage tank is provided with a gas storage tank, the gas storage tank is filled with argon gas through a gas cylinder, one side of the gas storage tank is fixedly connected with an air suction pump, the air inlet end of the air suction pump is communicated with the inside of the gas storage tank, the air outlet end of the air suction pump is communicated with a first air pipe, the top surface of the liquid storage tank is fixedly connected with a hollow upright rod, the bottom end of the hollow upright rod extends into the liquid storage tank, a plurality of air grooves are uniformly formed in the outer ring of the hollow upright rod, the top end of the hollow upright rod is communicated with the end of the first air pipe, a one-way valve is arranged in the middle of the first air pipe, and the direction of the one-way valve points to the hollow upright rod; the specific surface area of the nano-scale solid abrasive in the polishing solution is large, the self-adsorption force is strong, so that the solid abrasive in the polishing solution can be settled and aggregated with the lapse of time to form larger solid particles, and further the surface of a quartz wafer is scratched in the polishing process; based on the problems, the embodiment of the invention makes up the defects of the prior art; connecting a gas cylinder filled with argon gas with a gas storage tank, filling argon gas into the gas storage tank, starting a suction pump, injecting the argon gas in the gas storage tank into the liquid storage tank through a first gas pipe and a hollow upright rod, exhausting air in the liquid storage tank, precipitating the argon gas at the bottom of the liquid storage tank because the density of the argon gas is greater than that of the air, and indicating that the argon gas in the liquid storage tank is full when the argon gas is discharged from a liquid injection port of the liquid storage tank; filling the prepared polishing solution into a liquid storage tank, wherein the polishing solution is arranged at the bottom of the liquid storage tank, and argon separates air from the polishing solution to prevent fixed impurities such as dust in the air from entering the polishing solution; simultaneously, when argon gas got into the inside polishing solution of liquid reserve tank by hollow pole setting, argon gas splashes all around, and when argon gas upwards floated in the polishing solution, the production was broken for the polishing solution produced the vibration, and simultaneously, the argon gas of injection makes the polishing solution at the inside motion of liquid reserve tank, makes the solid abrasive material in the polishing solution be difficult to static, thereby has reduced the solid abrasive material of the solid abrasive material aggregation into big granule in the polishing solution, has then reduced the probability that causes the fish tail on quartz wafer surface.
Preferably, a plurality of arc guide plates are uniformly and fixedly connected to the outer ring of the hollow upright rod, and the arc guide plates and the air grooves are alternately distributed; during operation, when argon gas got into the inside polishing solution of liquid reserve tank by hollow pole setting, received the direction that blocks of arc baffle for the polishing solution produces rotatory vortex in the inside of liquid reserve tank, simultaneously, because the square structure of liquid reserve tank, makes the inner wall of polishing solution striking liquid reserve tank and produce broken reposition of redundant personnel, reduces the probability of the solid abrasive material gathering in the polishing solution.
Preferably, a plurality of partition plates are fixedly connected between the adjacent arc-shaped guide plates, and the partition plates and the air grooves are alternately distributed; during operation, when argon enters the polishing liquid in the liquid storage tank from the hollow upright rod, the argon is guided by the arc guide plate and is simultaneously divided by the plurality of partition plates to form a plurality of strands of rotating water flows, and the rotating water flows are impacted to form mixed flow, so that the flow irregularity of the polishing liquid is improved, the movement irregularity of solid abrasives in the polishing liquid is improved, and the probability of gathering a large number of solid abrasives in the polishing liquid is reduced.
Preferably, a bucket is fixedly connected to the bottom surface inside the air storage tank, pure water is filled into the bucket, a second air pipe is fixedly connected to the top surface of the air storage tank, the second air pipe penetrates through the top surface of the air storage tank, the bottom end of the second air pipe extends into the bottom of the bucket, the top end of the second air pipe is communicated with the top of the air storage tank, a check valve is arranged in the middle of the second air pipe, and the direction of the check valve points to the air storage tank; during operation, the inside pressure increase of liquid reserve tank because the continuous injection of argon gas of liquid reserve tank for the inside argon gas of liquid reserve tank is arranged back to the inside of gas holder through No. two trachea, and the argon gas is filtered by the bottom of leading-in cask through the inside pure water of cask, and the gas holder is arranged back to clean argon gas and is carried out reuse, has improved the utilization ratio of argon gas, has practiced thrift the cost.
Preferably, a plurality of baffles are spirally and fixedly connected to the inner wall of the water barrel; during the during operation, during the pure water in the argon gas was introduced into the cask, when argon gas upwards passed the pure water for the pure water splashes, through the baffle of heliciform setting, blocks the pure water that splashes, has reduced the probability that the pure water splashes out the cask, has reduced the waste of pure water.
Preferably, a water outlet is formed in one side of the bottom of the gas storage tank, a valve body is fixedly connected inside the water outlet, a sealing block is slidably mounted inside the valve body, a sliding rod is fixedly connected to the top end of the sealing block, the sliding rod penetrates through the top of the valve body in a sliding manner, a connecting rod is hinged to the top end of the sliding rod, and a floating ball is fixedly connected to one end, away from the sliding rod, of the connecting rod; when the water storage tank works, after pure water splashes out of the water bucket, the pure water falls to the bottom of the water storage tank, after the liquid level of the waste water at the bottom of the water storage tank rises, the waste water pushes the floating ball to rise to drive the connecting rod to rotate, when the connecting rod rotates to be coaxial with the sliding rod, the sliding rod is pulled to slide upwards to drive the sealing block to slide upwards, the through hole of the valve body is opened, the waste water at the bottom of the water storage tank is discharged from the water discharge port, after the waste water is discharged, the liquid level of the waste water descends, the height of the floating ball descends, the sealing block descends, and the water discharge port is sealed and blocked; because the liquid level of waste water is higher than the outlet to block the inside argon gas of gas holder and leak, then improved the security of gas holder.
Preferably, a plurality of reinforcing ribs are uniformly and fixedly connected to the inner wall of the gas storage tank, the cross section of each reinforcing rib is in a pointed cone shape, and a plurality of vertical grooves are formed in the surface of each reinforcing rib; the integral strength of the air storage tank is improved through the arranged reinforcing ribs; meanwhile, moisture carried in the argon gas is in contact with the reinforcing ribs, and the moisture is gathered on the surfaces of the reinforcing ribs to form large water drops which slide along the vertical grooves, so that the dryness of the argon gas is improved, and the influence of the moisture in the argon gas on the polishing solution is reduced.
Preferably, a base is arranged on one side of the liquid storage tank, a pair of straight grooves are formed in four corners of the base, clamping blocks are slidably mounted at the tops of each pair of straight grooves, the clamping blocks are fixedly connected with the straight grooves through bolts, and inner rings of the clamping blocks are in sliding fit with outer rings of the gas storage tank; through the sliding fit between the straight groove and the clamping block, the gas storage tanks with different specifications and sizes can be conveniently and fixedly clamped, and the whole application range of the polishing device is further improved.
Preferably, the liquid supply pipe and the middle part of the first air pipe are both communicated with a connecting ring, a connecting pipe is communicated between the two connecting rings, an electric valve is arranged in the middle of the connecting pipe, and the direction of the electric valve points to the liquid supply pipe; after polishing of the quartz wafer is completed, polishing liquid can remain in the liquid supply pipe, and solid abrasive materials in the liquid supply pipe can be gathered and attached to the inner wall of the liquid supply pipe to influence the next polishing work; therefore, after the quartz wafer is polished, the electric valve is opened, so that the first gas pipe is communicated with the liquid supply pipe through the connecting pipe, high-speed argon is led into the inside of the liquid supply pipe, the residual polishing liquid in the liquid supply pipe is discharged, and the inside of the liquid supply pipe is kept in a dry state.
Preferably, a quartz wafer polishing method which uses the above quartz wafer polishing apparatus and comprises the steps of:
s1: injecting pure water into a bucket in the gas storage tank, connecting a gas cylinder filled with argon gas with the gas storage tank, filling argon gas into the gas storage tank, starting an air suction pump, injecting the argon gas in the gas storage tank into the liquid storage tank, and exhausting air in the liquid storage tank;
s2: the method comprises the following steps of (1) preparing polishing liquid in a sterile workshop, filling the prepared polishing liquid into a liquid storage tank, and preventing air from entering the liquid storage tank due to the fact that the density of argon is greater than that of air;
s3: when argon enters polishing liquid in the liquid storage tank from the hollow upright rod, the argon is divided by the partition plate and guided by the arc-shaped guide plate, so that the polishing liquid generates a rotating vortex in the liquid storage tank, and meanwhile, due to the square structure of the liquid storage tank, the polishing liquid impacts the inner wall of the liquid storage tank to generate crushing and shunting, so that the probability of gathering solid grinding materials in the polishing liquid is reduced;
s4: the pressure in the liquid storage tank is increased due to the continuous injection of the argon gas in the liquid storage tank, so that the argon gas in the liquid storage tank is discharged back to the inside of the gas storage tank through the second gas pipe, filtered by pure water in the bucket, and discharged back to the gas storage tank for recycling;
s5: the water pump injects the polishing solution into an upper working disc of the double-sided polishing machine through a liquid supply pipe; the mechanical arm puts the quartz wafer to be polished on a lower working disc of the double-sided polishing machine, fixes the quartz wafer, uniformly sprays polishing solution on the surface of the quartz wafer, contacts with the surface of the quartz wafer to generate corrosion reaction, so that the surface of the quartz wafer is corroded and softened, and solid grinding materials in the polishing solution help mechanical polishing to remove the corroded surface of the quartz wafer, so that the polishing of the quartz wafer is realized.
The invention has the following beneficial effects:
1. the invention relates to a quartz wafer polishing device and a polishing method, wherein a liquid storage tank, a water pump, a liquid supply pipe, a gas storage tank, a gas extraction pump, a first gas pipe and a hollow upright rod are arranged; connecting a gas cylinder filled with argon gas with a gas storage tank, filling argon gas into the gas storage tank, starting a suction pump, injecting the argon gas in the gas storage tank into the liquid storage tank through a first gas pipe and a hollow upright rod, exhausting air in the liquid storage tank, precipitating the argon gas at the bottom of the liquid storage tank because the density of the argon gas is greater than that of the air, and indicating that the argon gas in the liquid storage tank is full when the argon gas is discharged from a liquid injection port of the liquid storage tank; filling the prepared polishing solution into a liquid storage tank, wherein the polishing solution is arranged at the bottom of the liquid storage tank, and the argon separates air from the polishing solution to prevent fixed impurities such as dust in the air from entering the polishing solution; simultaneously, when argon gas got into the inside polishing solution of liquid reserve tank by hollow pole setting, argon gas splashes all around, and when argon gas upwards floated in the polishing solution, the production was broken for the polishing solution produced the vibration, and simultaneously, the argon gas of injection makes the polishing solution at the inside motion of liquid reserve tank, makes the solid abrasive material in the polishing solution be difficult to static, thereby has reduced the solid abrasive material of the solid abrasive material aggregation into big granule in the polishing solution, has then reduced the probability that causes the fish tail on quartz wafer surface.
2. The invention relates to a quartz wafer polishing device and a polishing method, wherein a water bucket and a second air pipe are arranged; inside because the continuous injection of argon gas, the pressure increase of the inside of liquid reserve tank for the inside argon gas of liquid reserve tank is arranged back to the inside of gas holder through No. two trachea, and the argon gas is filtered through the inside pure water of cask by the bottom of leading-in cask, and the gas holder is arranged back to clean argon gas and is carried out reuse, has improved the utilization ratio of argon gas, has practiced thrift the cost.
Drawings
The invention will be further described with reference to the accompanying drawings.
FIG. 1 is a first perspective view of a first embodiment of the present invention;
FIG. 2 is a second perspective view of a first embodiment of the present invention;
FIG. 3 is a cross-sectional view of a reservoir in accordance with one embodiment of the present invention;
FIG. 4 is a perspective view of an air reservoir in accordance with a first embodiment of the present invention;
FIG. 5 is an exploded view of a first embodiment of the present invention;
FIG. 6 is a perspective view of a hollow upright of an embodiment of the present invention;
FIG. 7 is a cross-sectional view of a gas reservoir according to a first embodiment of the present invention;
FIG. 8 is an enlarged view of a portion of FIG. 7 at A;
FIG. 9 is a perspective view of a water bucket according to a first embodiment of the present invention;
FIG. 10 is a perspective view of a liquid supply structure in a second embodiment of the invention;
FIG. 11 is a flow chart of the polishing method of the present invention;
in the figure: 1. a double-sided polishing machine; 2. a liquid storage tank; 3. a water pump; 4. a liquid supply tube; 5. a gas storage tank; 6. an air pump; 7. a first air pipe; 8. a hollow upright rod; 9. an air tank; 10. an arc-shaped guide plate; 11. a partition plate; 12. a water bucket; 13. a second air pipe; 14. a baffle plate; 15. a water discharge port; 16. a valve body; 17. a sealing block; 18. a slide bar; 19. a connecting rod; 20. a floating ball; 21. reinforcing ribs; 22. a base; 23. a straight groove; 24. a clamping block; 25. a connecting ring; 26. a connecting pipe; 27. an electrically operated valve.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
Example one
As shown in fig. 1 to 6, a polishing apparatus for a quartz wafer according to an embodiment of the present invention includes a double-side polishing machine 1 and a liquid supply structure; the back of the double-sided polishing machine 1 is provided with a liquid supply structure; the liquid supply structure comprises a liquid storage tank 2, a water pump 3, a liquid supply pipe 4, a gas storage tank 5, a suction pump 6, a first gas pipe 7 and a hollow upright rod 8; the back of the double-sided polishing machine 1 is provided with a liquid storage tank 2, polishing liquid is filled in the liquid storage tank 2, a water pump 3 is installed on the top surface of the liquid storage tank 2, the water inlet end of the water pump 3 is communicated with the bottom of the liquid storage tank 2, the water outlet end of the water pump 3 is communicated with a liquid supply pipe 4, the top end of the liquid supply pipe 4 is communicated with an upper working plate of the double-sided polishing machine 1, a gas storage tank 5 is arranged on one side of the liquid storage tank 2, the gas storage tank 5 is filled with argon gas through a gas cylinder, one side of the gas storage tank 5 is fixedly connected with an air suction pump 6, the air inlet end of the air suction pump 6 is communicated with the inside of the gas storage tank 5, the air outlet end of the air suction pump 6 is communicated with a first air pipe 7, a hollow upright rod 8 is fixedly connected to the top surface of the liquid storage tank 2, the bottom end of the hollow upright rod 8 extends into the liquid storage tank 2, a plurality of air grooves 9 are uniformly formed in the outer ring of the hollow upright rod 8, the top end of the hollow upright rod 8 is communicated with the end of the first air pipe 7, a one-way valve is arranged in the middle of the hollow upright pipe 7, and the direction of the one-way valve points to the hollow upright rod 8; the specific surface area of the nano-scale solid abrasive in the polishing solution is large, the self-adsorption force is strong, so that the solid abrasive in the polishing solution can be settled and aggregated with the lapse of time to form larger solid particles, and further the surface of a quartz wafer is scratched in the polishing process; based on the problems, the embodiment of the invention makes up the defects of the prior art; connecting a gas cylinder filled with argon gas with a gas storage tank 5, filling argon gas into the gas storage tank 5, starting an air suction pump 6, injecting the argon gas in the gas storage tank 5 into the liquid storage tank 2 through a first gas pipe 7 and a hollow upright rod 8, exhausting air in the liquid storage tank 2, precipitating the argon gas at the bottom of the liquid storage tank 2 because the density of the argon gas is greater than that of the air, and indicating that the argon gas in the liquid storage tank 2 is full when the argon gas is exhausted from a liquid injection port of the liquid storage tank 2; filling the prepared polishing solution into the liquid storage tank 2, wherein the polishing solution is arranged at the bottom of the liquid storage tank 2, and the argon separates air from the polishing solution to prevent fixed impurities such as dust in the air from entering the polishing solution; simultaneously, when argon gas got into the inside polishing solution of liquid reserve tank 2 by hollow pole setting 8, argon gas splashes all around, and when argon gas upwards floated in the polishing solution, the production was broken for the polishing solution produced the vibration, and simultaneously, the argon gas of injection makes the polishing solution at the inside motion of liquid reserve tank 2, makes the solid abrasive material in the polishing solution be difficult to static, thereby has reduced the solid abrasive material of the solid abrasive material aggregation into big granule in the polishing solution, has then reduced the probability that causes the fish tail on quartz wafer surface.
As shown in fig. 3, 5 and 6, a plurality of arc-shaped guide plates 10 are uniformly and fixedly connected to the outer ring of the hollow upright 8, and the arc-shaped guide plates 10 and the air grooves 9 are alternately distributed; during operation, the argon gas receives the direction that blocks of arc baffle 10 when getting into the inside polishing solution of liquid reserve tank 2 by hollow pole setting 8 for the polishing solution produces rotatory vortex in the inside of liquid reserve tank 2, simultaneously, because the square structure of liquid reserve tank 2, makes the polishing solution striking liquid reserve tank 2's inner wall and produce broken reposition of redundant personnel, reduces the probability of the solid abrasive material gathering in the polishing solution.
As shown in fig. 3, 5 and 6, a plurality of partition plates 11 are fixedly connected between adjacent arc-shaped guide plates 10, and the partition plates 11 and the air grooves 9 are alternately distributed; during operation, when argon gas gets into the inside polishing solution of liquid reserve tank 2 by hollow pole setting 8, receive the direction that blocks of arc baffle 10, cut apart by a plurality of baffles 11 simultaneously, form the rotatory rivers of stranded, take place to strike between the rotatory rivers, form the mixed flow to improve the irregularity that the polishing solution flows, improved the irregularity of the solid abrasive motion in the polishing solution then, reduced the probability of the solid abrasive mass gathering in the polishing solution.
As shown in fig. 5, 7, 8 and 9, a bucket 12 is fixedly connected to the bottom surface of the inside of the air storage tank 5, pure water is filled in the bucket 12, a second air pipe 13 is fixedly connected to the top surface of the air storage tank 5, the second air pipe 13 penetrates through the top surface of the air storage tank 5, the bottom end of the second air pipe 13 extends into the bottom of the bucket 12, the top end of the second air pipe 13 is communicated with the top of the air storage tank 5, a check valve is arranged in the middle of the second air pipe 13, and the direction of the check valve points to the air storage tank 5; during operation, 2 inside because the continuous injection of argon gas of liquid reserve tank, the pressure increase of the inside of liquid reserve tank 2 for 2 inside argon gas of liquid reserve tank arrange back the inside of gas holder 5 through No. two trachea 13, and the argon gas is filtered by leading-in cask 12's bottom, through 12 inside pure water in cask, and the gas holder 5 is arranged back to clean argon gas carries out reuse, has improved the utilization ratio of argon gas, has practiced thrift the cost.
As shown in fig. 7 to 9, a plurality of baffles 14 are spirally fixed on the inner wall of the water barrel 12; during operation, argon is introduced into the pure water in the water bucket 12, and when the argon upwards passes through the pure water, the pure water splashes, and the splashed pure water is blocked by the baffle 14 arranged in a spiral shape, so that the probability of splashing of the pure water out of the water bucket 12 is reduced, and the waste of the pure water is reduced.
As shown in fig. 7 to 8, a water outlet 15 is formed in one side of the bottom of the air storage tank 5, a valve body 16 is fixedly connected inside the water outlet 15, a sealing block 17 is slidably installed inside the valve body 16, a sliding rod 18 is fixedly connected to the top end of the sealing block 17, the sliding rod 18 slidably penetrates through the top of the valve body 16, a connecting rod 19 is hinged to the top end of the sliding rod 18, and a floating ball 20 is fixedly connected to one end, away from the sliding rod 18, of the connecting rod 19; when the water storage tank works, after pure water splashes out of the water barrel 12, the pure water falls to the bottom of the air storage tank 5, after the liquid level of the waste water at the bottom of the air storage tank 5 rises, the waste water pushes the floating ball 20 to rise to drive the connecting rod 19 to rotate, when the connecting rod 19 rotates to be coaxial with the sliding rod 18, the sliding rod 18 is pulled to slide upwards to drive the sealing block 17 to slide upwards, the through hole of the valve body 16 is opened, so that the waste water at the bottom of the air storage tank 5 is discharged from the water outlet 15, after the waste water is discharged, the liquid level of the waste water descends, the height of the floating ball 20 descends, the sealing block 17 descends, and the water outlet 15 is sealed and blocked; because the liquid level of waste water is higher than outlet 15 to block the inside argon gas of gas holder 5 and leak, then improved gas holder 5's security.
As shown in fig. 7, a plurality of reinforcing ribs 21 are uniformly and fixedly connected to the inner wall of the gas storage tank 5, the cross section of each reinforcing rib 21 is in a pointed cone shape, and a plurality of vertical grooves are formed in the surface of each reinforcing rib 21; the integral strength of the air storage tank 5 is improved by the arrangement of the reinforcing ribs 21; meanwhile, moisture carried in the argon gas is in contact with the reinforcing ribs 21, and the moisture is gathered on the surfaces of the reinforcing ribs 21 to form large water drops which slide along the vertical grooves, so that the dryness of the argon gas is improved, and the influence of the moisture in the argon gas on the polishing solution is reduced.
As shown in fig. 4 and 7, a base 22 is arranged on one side of the liquid storage tank 2, a pair of straight grooves 23 are formed in four corners of the base 22, a clamping block 24 is slidably mounted at the top of each pair of straight grooves 23, the clamping blocks 24 are fixedly connected with the straight grooves 23 through bolts, and inner rings of the clamping blocks 24 are in sliding fit with outer rings of the air storage tank 5; through the sliding fit between the straight groove 23 and the clamping block 24, the gas storage tanks 5 with different specifications and sizes can be fixed and clamped conveniently, and the whole application range of the polishing device is further widened.
As shown in fig. 11, a quartz wafer polishing method using the above-mentioned one quartz wafer polishing apparatus, and the polishing method comprises the steps of:
s1: injecting pure water into a bucket 12 in the gas storage tank 5, connecting a gas cylinder filled with argon gas with the gas storage tank 5, injecting argon gas into the gas storage tank 5, starting an air pump 6, injecting the argon gas in the gas storage tank 5 into the liquid storage tank 2, and exhausting air in the liquid storage tank 2;
s2: polishing liquid is prepared in a sterile workshop, the prepared polishing liquid is filled into the liquid storage tank 2, and the argon gas is higher than the air in density, so that the air is prevented from entering the liquid storage tank 2;
s3: when argon enters the polishing solution in the liquid storage tank 2 from the hollow upright rod 8, the argon is divided by the partition plate 11, and the arc-shaped guide plate 10 is blocked and guided, so that the polishing solution generates a rotating vortex in the liquid storage tank 2, and meanwhile, due to the square structure of the liquid storage tank 2, the polishing solution impacts the inner wall of the liquid storage tank 2 to generate crushing and shunting, so that the probability of gathering solid grinding materials in the polishing solution is reduced;
s4: the pressure in the liquid storage tank 2 is increased due to the continuous injection of argon gas in the liquid storage tank 2, so that the argon gas in the liquid storage tank 2 is discharged back to the inside of the gas storage tank 5 through the second gas pipe 13, is filtered by pure water in the water bucket 12, and the clean argon gas is discharged back to the gas storage tank 5 for recycling;
s5: the water pump 3 injects the polishing solution into an upper working disc of the double-sided polishing machine 1 through a liquid supply pipe 4; the mechanical arm puts the quartz wafer to be polished on the lower working disc of the double-sided polishing machine 1, fixes the quartz wafer, uniformly sprays polishing solution on the surface of the quartz wafer, contacts with the surface of the quartz wafer to generate corrosion reaction, so that the surface of the quartz wafer is corroded and softened, and solid grinding materials in the polishing solution help mechanical polishing to remove the corroded surface of the quartz wafer, thereby polishing the quartz wafer.
Example two
As shown in fig. 10, a first comparative example, in which another embodiment of the present invention is: the middle parts of the liquid supply pipe 4 and the first air pipe 7 are both communicated with a connecting ring 25, a connecting pipe 26 is communicated between the two connecting rings 25, the middle part of the connecting pipe 26 is provided with an electric valve 27, and the direction of the electric valve 27 points to the liquid supply pipe 4; after polishing of the quartz wafer is completed, polishing liquid remains in the liquid supply pipe 4, and solid abrasive in the liquid supply pipe 4 is gathered and attached to the inner wall of the liquid supply pipe 4 to influence the next polishing work; therefore, after the polishing of the quartz wafer is completed, the electric valve 27 is opened to allow the first gas pipe 7 to communicate with the liquid supply tube 4 through the connection pipe 26, so that high-speed argon gas is introduced into the inside of the liquid supply tube 4, and the polishing liquid remaining in the inside of the liquid supply tube 4 is discharged, so that the inside of the liquid supply tube 4 is maintained in a dry state.
The working principle is as follows: injecting pure water into a bucket 12 in the gas storage tank 5, connecting a gas cylinder filled with argon gas with the gas storage tank 5, injecting argon gas into the gas storage tank 5, starting an air extracting pump 6, injecting the argon gas in the gas storage tank 5 into the liquid storage tank 2 through a first gas pipe 7 and a hollow upright rod 8, exhausting air in the liquid storage tank 2, precipitating the argon gas at the bottom of the liquid storage tank 2 because the density of the argon gas is greater than that of the air, and indicating that the argon gas in the liquid storage tank 2 is full when the argon gas is exhausted from a liquid injection port of the liquid storage tank 2; the method comprises the following steps of (1) preparing polishing solution in an aseptic workshop, filling the prepared polishing solution into a liquid storage tank 2, wherein the polishing solution is arranged at the bottom of the liquid storage tank 2, and argon separates air from the polishing solution to prevent fixed impurities such as dust in the air from entering the polishing solution;
when argon enters polishing liquid in the liquid storage tank 2 from the hollow upright rod 8, the argon is blocked and guided by the arc-shaped guide plate 10 and is simultaneously divided by the plurality of partition plates 11 to form a plurality of strands of rotating water flows, the rotating water flows are impacted to form mixed flow, and due to the square structure of the liquid storage tank 2, the polishing liquid impacts the inner wall of the liquid storage tank 2 to generate crushing and shunting, so that the probability of gathering solid abrasive materials in the polishing liquid is reduced; the pressure inside the liquid storage tank 2 is increased due to the continuous injection of argon gas inside the liquid storage tank 2, so that the argon gas inside the liquid storage tank 2 is discharged back to the inside of the gas storage tank 5 through the second gas pipe 13, the argon gas is introduced into the pure water in the water bucket 12, when the argon gas upwards passes through the pure water, the pure water is splashed, the splashed pure water is blocked by the baffle 14 which is spirally arranged, the argon gas is filtered through the pure water inside the water bucket 12, and the clean argon gas is discharged back to the gas storage tank 5 for recycling; when pure water splashes out of the water barrel 12, the pure water falls to the bottom of the gas storage tank 5, after the liquid level of the waste water at the bottom of the gas storage tank 5 rises, the waste water pushes the floating ball 20 to rise to drive the connecting rod 19 to rotate, when the connecting rod 19 rotates to be coaxial with the sliding rod 18, the sliding rod 18 is pulled to slide upwards to drive the sealing block 17 to slide upwards, the through hole of the valve body 16 is opened, so that the waste water at the bottom of the gas storage tank 5 is discharged from the water outlet 15, after the waste water is discharged, the liquid level of the waste water descends, so that the height of the floating ball 20 descends, the sealing block 17 descends, the water outlet 15 is sealed and blocked, and the liquid level of the waste water is higher than the water outlet 15, so that argon gas inside the gas storage tank 5 is prevented from leaking;
the water pump 3 injects the polishing solution into an upper working disc of the double-sided polishing machine 1 through a liquid supply pipe 4; the mechanical arm puts the quartz wafer to be polished on the lower working disc of the double-sided polishing machine 1, fixes the quartz wafer, the polishing solution is uniformly sprayed on the surface of the quartz wafer and contacts with the surface of the quartz wafer to generate corrosion reaction, so that the surface of the quartz wafer is corroded and softened, and the solid abrasive in the polishing solution helps mechanical polishing to remove the corroded surface of the quartz wafer, thereby realizing polishing of the quartz wafer.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (10)
1. A quartz wafer polishing apparatus characterized in that: comprises a double-sided polishing machine (1) and a liquid supply structure; the back of the double-sided polishing machine (1) is provided with a liquid supply structure;
the liquid supply structure comprises a liquid storage tank (2), a water pump (3), a liquid supply pipe (4), a gas storage tank (5), a suction pump (6), a first gas pipe (7) and a hollow upright rod (8); the back of two-sided polishing machine (1) is provided with liquid reserve tank (2), the inside filling of liquid reserve tank (2) has the polishing solution, water pump (3) are installed to the top surface of liquid reserve tank (2), the bottom of the end intercommunication liquid reserve tank (2) of intaking of water pump (3), the play water end intercommunication of water pump (3) has feed pipe (4), the last working disc of the two-sided polishing machine (1) of top intercommunication of feed pipe (4), one side of liquid reserve tank (2) is provided with gas holder (5), gas holder (5) have argon gas through the gas cylinder filling, one side rigid coupling of gas holder (5) has aspiration pump (6), the inside of the end intercommunication gas holder (5) of intaking of aspiration pump (6), the end intercommunication of giving vent to anger of aspiration pump (6) has trachea (7) No. one, the top surface of liquid reserve tank (5) has hollow trachea (8), the bottom of hollow pole setting (8) stretches into the inside of liquid reserve tank (2), and the outer lane of hollow pole setting (8) has evenly seted up a plurality of gas grooves (9), the hollow pole setting (8) and hollow pole setting (8) one-way directional end of hollow pole setting (7) and hollow pole setting (8) one-way directional end of hollow pole setting one-way valve (7) are provided with one-way tracheal end.
2. A quartz wafer polishing apparatus according to claim 1, wherein: the outer ring of the hollow upright rod (8) is uniformly and fixedly connected with a plurality of arc guide plates (10), and the arc guide plates (10) and the air grooves (9) are alternately distributed.
3. A quartz wafer polishing apparatus as set forth in claim 2, wherein: a plurality of partition plates (11) are fixedly connected between the adjacent arc-shaped guide plates (10), and the partition plates (11) and the air grooves (9) are alternately distributed.
4. A quartz wafer polishing apparatus as set forth in claim 1, wherein: the inside bottom surface rigid coupling of gas holder (5) has cask (12), the inside filling of cask (12) has the pure water, the top surface rigid coupling of gas holder (5) has No. two trachea (13), no. two trachea (13) run through the top surface of gas holder (5), and the bottom of No. two trachea (13) stretches into the bottom of cask (12), the top of No. two trachea (13) communicates the top of gas holder (5), the middle part of No. two trachea (13) is provided with the check valve, and the directional gas holder of direction (5) of check valve.
5. A quartz wafer polishing apparatus as set forth in claim 4, wherein: the inner wall of the bucket (12) is fixedly connected with a plurality of baffles (14) in a spiral shape.
6. A quartz wafer polishing apparatus according to claim 4, wherein: the bottom one side of gas holder (5) has been seted up outlet (15), the inside rigid coupling of outlet (15) has valve body (16), the inside slidable mounting of valve body (16) has sealed piece (17), the top rigid coupling of sealed piece (17) has slide bar (18), slide bar (18) slide and run through the top of valve body (16), the top of slide bar (18) articulates there is connecting rod (19), the one end rigid coupling that slide bar (18) were kept away from in connecting rod (19) has floater (20).
7. A quartz wafer polishing apparatus as set forth in claim 1, wherein: the even rigid coupling of inner wall of gas holder (5) has a plurality of strengthening ribs (21), the cross-section of strengthening rib (21) is sharp toper, and a plurality of vertical recesses have been seted up on the surface.
8. A quartz wafer polishing apparatus as set forth in claim 1, wherein: one side of liquid reserve tank (2) is provided with base (22), a pair of straight flute (23) have all been seted up in the four corners of base (22), and is every right there is clamp splice (24) at the equal slidable mounting in top of straight flute (23), pass through bolt rigid coupling between clamp splice (24) and straight flute (23), it is a plurality of the inner circle of clamp splice (24) and the outer lane sliding fit of gas holder (5).
9. A quartz wafer polishing apparatus as set forth in claim 8 wherein: feed pipe (4) all communicate with the middle part of a trachea (7) has go-between (25), two the intercommunication has connecting pipe (26) between go-between (25), the middle part of connecting pipe (26) sets up electric valve (27), and the directional feed pipe (4) of direction of electric valve (27).
10. A quartz wafer polishing method characterized by: the polishing method employs a quartz wafer polishing apparatus according to any one of claims 1 to 9, and the polishing method comprises the steps of:
s1: injecting pure water into a bucket (12) in a gas storage tank (5), connecting a gas cylinder filled with argon gas with the gas storage tank (5), injecting argon gas into the gas storage tank (5), starting an air suction pump (6), injecting the argon gas in the gas storage tank (5) into a liquid storage tank (2), and exhausting air in the liquid storage tank (2);
s2: polishing liquid is prepared in a sterile workshop, the prepared polishing liquid is filled into the liquid storage tank (2), and the argon gas is higher than the air in density, so that the air is prevented from entering the liquid storage tank (2);
s3: when argon enters polishing liquid in the liquid storage tank (2) from the hollow upright rod (8), the argon is divided by the partition plate (11) and guided by the arc guide plate (10), so that the polishing liquid generates a rotating vortex in the liquid storage tank (2), and meanwhile, due to the square structure of the liquid storage tank (2), the polishing liquid impacts the inner wall of the liquid storage tank (2) to generate crushing and shunting, so that the probability of gathering solid abrasives in the polishing liquid is reduced;
s4: the pressure in the liquid storage tank (2) is increased due to the continuous injection of argon in the liquid storage tank (2), so that the argon in the liquid storage tank (2) is discharged back to the inside of the gas storage tank (5) through the second gas pipe (13), and is filtered by pure water in the water bucket (12), and the clean argon is discharged back to the gas storage tank (5) for recycling;
s5: the water pump (3) injects polishing solution into an upper working disc of the double-sided polishing machine (1) through the liquid supply pipe (4); the mechanical arm puts the quartz wafer to be polished on a lower working disc of the double-sided polishing machine (1), fixes the quartz wafer, the polishing solution is uniformly sprayed on the surface of the quartz wafer and contacts with the surface of the quartz wafer to generate corrosion reaction, so that the surface of the quartz wafer is corroded and softened, and the solid abrasive in the polishing solution helps mechanical polishing to remove the corroded surface of the quartz wafer, so that the polishing of the quartz wafer is realized.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211736932.3A CN115890459A (en) | 2022-12-30 | 2022-12-30 | Quartz wafer polishing device and polishing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211736932.3A CN115890459A (en) | 2022-12-30 | 2022-12-30 | Quartz wafer polishing device and polishing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115890459A true CN115890459A (en) | 2023-04-04 |
Family
ID=86488229
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211736932.3A Pending CN115890459A (en) | 2022-12-30 | 2022-12-30 | Quartz wafer polishing device and polishing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115890459A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117564917A (en) * | 2024-01-15 | 2024-02-20 | 北京芯美达科技有限公司 | Polycrystalline diamond polishing equipment |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6293849B1 (en) * | 1997-10-31 | 2001-09-25 | Ebara Corporation | Polishing solution supply system |
| TW467200U (en) * | 2001-05-23 | 2001-12-01 | Ching-Jr Lin | Exhaust pipe structure capable of reducing exhaust gas and noise |
| CN105458908A (en) * | 2015-12-30 | 2016-04-06 | 天通吉成机器技术有限公司 | Workpiece fixed-size compensation type double-sided grinding device and method |
| CN208913880U (en) * | 2018-10-19 | 2019-05-31 | 德淮半导体有限公司 | Lapping liquid filtration system, lapping liquid supply pipe system and chemical-mechanical grinding device |
| CN111633563A (en) * | 2020-06-15 | 2020-09-08 | 衢州学院 | Polishing medium preparation device and method, and mechanical chemical polishing equipment and method |
| CN113118964A (en) * | 2021-04-23 | 2021-07-16 | 长鑫存储技术有限公司 | Chemical mechanical polishing device |
| CN115464561A (en) * | 2022-09-22 | 2022-12-13 | 上海集成电路装备材料产业创新中心有限公司 | Grinding fluid supply device, system and method |
-
2022
- 2022-12-30 CN CN202211736932.3A patent/CN115890459A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6293849B1 (en) * | 1997-10-31 | 2001-09-25 | Ebara Corporation | Polishing solution supply system |
| TW467200U (en) * | 2001-05-23 | 2001-12-01 | Ching-Jr Lin | Exhaust pipe structure capable of reducing exhaust gas and noise |
| CN105458908A (en) * | 2015-12-30 | 2016-04-06 | 天通吉成机器技术有限公司 | Workpiece fixed-size compensation type double-sided grinding device and method |
| CN208913880U (en) * | 2018-10-19 | 2019-05-31 | 德淮半导体有限公司 | Lapping liquid filtration system, lapping liquid supply pipe system and chemical-mechanical grinding device |
| CN111633563A (en) * | 2020-06-15 | 2020-09-08 | 衢州学院 | Polishing medium preparation device and method, and mechanical chemical polishing equipment and method |
| CN113118964A (en) * | 2021-04-23 | 2021-07-16 | 长鑫存储技术有限公司 | Chemical mechanical polishing device |
| CN115464561A (en) * | 2022-09-22 | 2022-12-13 | 上海集成电路装备材料产业创新中心有限公司 | Grinding fluid supply device, system and method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117564917A (en) * | 2024-01-15 | 2024-02-20 | 北京芯美达科技有限公司 | Polycrystalline diamond polishing equipment |
| CN117564917B (en) * | 2024-01-15 | 2024-04-02 | 北京芯美达科技有限公司 | Polycrystalline diamond polishing equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN115890459A (en) | Quartz wafer polishing device and polishing method | |
| CN87103450A (en) | The equipment that is used for Treatment Solution or processing mud solution | |
| CN105689157A (en) | Swinging-stirring flotation equipment with self-slurry-mixing function | |
| CN210474009U (en) | Adsorption resin countercurrent cleaning device | |
| CN107838814A (en) | A kind of grinding machine waste material magnetic separation device | |
| CN105880035A (en) | Pulp drive agitating type flotation equipment with self pulp conditioning and self defoaming functions | |
| CN101322972A (en) | Method for cleaning container inner wall and cleaner thereof | |
| CN211676947U (en) | Dust collector of production premixed concrete | |
| CN110227604B (en) | Quartz sand district tailing recovery processing device | |
| CN201235307Y (en) | Ore separator for river sand | |
| CN101298063A (en) | River sand ore separator | |
| CN207943965U (en) | Sewage disposal device | |
| CN113996439B (en) | Magnetic separation automatic auxiliary separation device for magnetic mineral materials | |
| CN114160314B (en) | Flotation device of mining flotation process | |
| CN115159652A (en) | Electrolyte processing system | |
| CN213887384U (en) | Raw and other materials preprocessing device is used in macromolecular material production | |
| CN108940201B (en) | Carbon washing tank and production method of low-ash water purification activated carbon | |
| CN114433567A (en) | Dust collecting equipment for repairing instruments and meters | |
| CN211051579U (en) | Compound cone crusher for ore | |
| CN203408788U (en) | Full-automatic permanent magnet deironing machine | |
| CN217796458U (en) | Anticorrosive paint production is with grinding quick-witted belt cleaning device | |
| CN216396669U (en) | Ore sand washing equipment with detachable inclined tube flow stabilizing mechanism | |
| CN216759296U (en) | Base for grinding ball | |
| CN1640523A (en) | Multi-dimensional space filter material scrubbing method | |
| CN220514418U (en) | Waste silicon material recovery device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |