CN115884521B - High-frequency circuit board material layer coating forming method - Google Patents
High-frequency circuit board material layer coating forming method Download PDFInfo
- Publication number
- CN115884521B CN115884521B CN202211556541.3A CN202211556541A CN115884521B CN 115884521 B CN115884521 B CN 115884521B CN 202211556541 A CN202211556541 A CN 202211556541A CN 115884521 B CN115884521 B CN 115884521B
- Authority
- CN
- China
- Prior art keywords
- spraying
- plate
- shaped
- liquid
- cylinder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000463 material Substances 0.000 title claims abstract description 46
- 238000000034 method Methods 0.000 title claims abstract description 24
- 239000011248 coating agent Substances 0.000 title claims abstract description 19
- 238000000576 coating method Methods 0.000 title claims abstract description 19
- 230000007246 mechanism Effects 0.000 claims abstract description 101
- 238000005507 spraying Methods 0.000 claims abstract description 99
- 239000007788 liquid Substances 0.000 claims abstract description 77
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 44
- 239000011889 copper foil Substances 0.000 claims abstract description 44
- 238000001035 drying Methods 0.000 claims abstract description 33
- 238000007790 scraping Methods 0.000 claims abstract description 33
- 239000007921 spray Substances 0.000 claims abstract description 17
- 239000000758 substrate Substances 0.000 claims abstract description 4
- 238000003825 pressing Methods 0.000 claims description 22
- 238000010008 shearing Methods 0.000 claims description 13
- 239000003638 chemical reducing agent Substances 0.000 claims description 7
- 238000012546 transfer Methods 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 230000008569 process Effects 0.000 abstract description 10
- 239000007787 solid Substances 0.000 abstract description 5
- 238000005520 cutting process Methods 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 29
- 238000004519 manufacturing process Methods 0.000 description 11
- 230000008054 signal transmission Effects 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000004891 communication Methods 0.000 description 4
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 4
- 239000004810 polytetrafluoroethylene Substances 0.000 description 4
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 2
- 229910001431 copper ion Inorganic materials 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
- 230000005012 migration Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Spray Control Apparatus (AREA)
Abstract
The invention discloses a high-frequency circuit board material layer coating forming method, which relates to the technical field of circuit boards, and comprises the steps of putting a copper foil disc on an unreeling roller on a spraying machine, taking copper foil as a substrate, spraying coating liquid on the copper foil through a spraying mechanism, and scraping the spraying liquid to be flat through a scraping plate mechanism to form a liquid film; sending the copper foil containing the liquid film into a drying box for drying, wherein the drying temperature is not higher than 400 ℃; a cured film was formed on the copper foil to obtain a single panel. According to the invention, through the arrangement of the spraying machine, the equipment can be sprayed twice, after spraying, spraying liquid can be scraped more uniformly, subsequent drying is facilitated, then cutting is performed, and the automation degree of the whole equipment is high; the invention can process the solid spraying liquid stuck on the spray head by the structural arrangement of the spraying mechanism, and is convenient for continuous use.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a high-frequency circuit board material layer coating forming method.
Background
At present, from a communication network to terminal application, the communication frequency is comprehensively and high-frequency, and high-speed and high-capacity application layers are endless. In recent years, as wireless networks transition from 4G to 5G and 6G, network frequencies continue to increase. Future communication frequencies will be boosted in two stages according to the 5G and 6G development roadmaps shown in the relevant data. The first phase aims to boost the communication frequency to 6GHz before 2020, and the second phase aims to further boost to 30-60GHz after 2020. In the aspect of market application, signal frequency of terminal antennas such as smart phones is continuously improved, high-frequency applications are more and more, and high-speed and high-capacity requirements are more and more. To accommodate the current trend of high frequency and high speed from wireless networks to terminal applications, flexible boards are also being upgraded as antennas and transmission lines in terminal devices.
In the preparation process, the problems of multiple process flows, complex manufacture, high cost, increased power consumption and signal transmission loss and the like in the aspect of circuit board performance exist in common no matter the traditional multilayer flexible circuit board or the multilayer rigid-flex board; meanwhile, no automatic production equipment for attaching the process is provided.
Disclosure of Invention
The invention aims to provide a high-frequency circuit board material layer coating and forming method, which solves the following technical problems: in the preparation process, the problems of multiple process flows, complex manufacture, high cost, increased power consumption and signal transmission loss and the like in the aspect of circuit board performance exist in common no matter the traditional multilayer flexible circuit board or the multilayer rigid-flex board; meanwhile, no automatic equipment for attaching the process exists.
The aim of the invention can be achieved by the following technical scheme:
a high-frequency circuit board material layer coating forming method comprises the following steps:
firstly, placing a copper foil disc on an unreeling roller on a spraying machine, taking copper foil as a substrate, spraying liquid on the copper foil through a spraying mechanism, and scraping the spraying liquid to be smooth through a scraping plate mechanism to form a liquid film;
step two, sending the copper foil containing the liquid film into a drying box for drying, wherein the drying temperature is not higher than 400 ℃; forming a cured film on the copper foil to obtain a single panel;
step three, coating a layer of laminated liquid high-frequency material layer on the solidified film of the single panel through a spraying mechanism I, and scraping the liquid high-frequency material layer to be flat through a scraping mechanism I;
and step four, conveying the single panel coated with the synthetic liquid high-frequency material layer into a first drying box, drying at a baking temperature of not higher than 200 ℃, and changing the synthetic liquid high-frequency material layer on the single panel into a semi-cured high-frequency material layer to obtain a high-frequency circuit board material layer structure.
As a further scheme of the invention: the coating machine comprises an operation table, an unreeling roller frame is arranged at the top of the operation table, an unreeling roller is arranged on the unreeling roller frame, a copper foil disc is placed on the unreeling roller, a conveying track is arranged on one side of the unreeling roller frame, a spraying mechanism, a scraping plate mechanism, a drying box, a spraying mechanism I, a scraping plate mechanism I and a drying box I are sequentially arranged on the conveying track, a pressing mechanism is arranged on one side of the drying box I, a shearing mechanism is arranged on one side of the pressing mechanism, a transferring mechanism is arranged on the opposite side of the shearing mechanism, and a supporting mechanism is arranged at the end part of the conveying track.
As a further scheme of the invention: the spraying mechanism and the first spraying mechanism comprise supporting rods fixedly mounted on an operating platform, the supporting plates are fixedly mounted at the tops of the supporting rods, the first motor is fixedly mounted at the tops of the supporting plates, an output shaft of the first motor is connected with a speed reducer, a first screw rod is arranged at the bottom of the speed reducer, an L-shaped lifting plate is connected to the first screw rod in a threaded mode, a plurality of first cylinders are fixedly mounted at the tops of the L-shaped lifting plates, each spraying box is fixedly mounted at the end portions of piston rods of the first cylinders, one side of each spraying box is in sliding connection with the L-shaped lifting plate, the top of each spraying box is connected with a cylinder mounting plate through a supporting column, a second motor is fixedly mounted at the top end of each cylinder mounting plate, an output shaft of the second motor penetrates through the cylinder mounting plate and is connected with a first gear, one side of the second motor is fixedly mounted with a second cylinder, a middle through pipe is fixedly mounted at the bottom of the piston rod of the second cylinder, the second gear is sleeved with the second gear in a meshed mode, the middle through pipe is connected with an upper disc, a spraying box is connected with a plurality of spraying pipes in the spraying box, a plurality of liquid inlet holes are formed in the spraying box, the spraying pipe is fixedly connected with a spray pipe, and the spray pipe is fixedly connected with the spray pipe.
As a further scheme of the invention: the upper disc is characterized in that a plurality of rocker arms are equidistantly arranged on the peripheral surface of the upper disc through movable blocks, clamping jaws are movably connected to the bottoms of the rocker arms, a scraper is fixedly arranged on the inner sides of the clamping jaws, the plurality of rocker arms are all arranged on the lower disc, the lower disc is sleeved on a liquid spraying pipe, a rotary jacket is arranged on the middle through pipe, and the upper disc, the rocker arms and the lower disc are arranged in the rotary jacket.
As a further scheme of the invention: the first scraping plate mechanism and the first scraping plate mechanism comprise a first frame fixedly installed on the operating platform, a third cylinder is fixedly installed on the first frame, two symmetrically arranged movable arms are movably connected to a piston rod of the third cylinder, an L-shaped movable plate is movably connected to the end portion of each movable arm, and an L-shaped scraping plate is fixedly installed at the end portion of each L-shaped movable plate.
As a further scheme of the invention: the pressing mechanism comprises a second frame fixedly arranged on the operation table, a fourth cylinder is movably connected to the second frame, a U-shaped block is movably connected to a piston rod of the fourth cylinder, a movable pressing block is fixedly arranged at the bottom of the U-shaped block and is arranged on the base plate through a rotating shaft, and the base plate is fixedly arranged on the operation table.
As a further scheme of the invention: the shearing mechanism comprises a Y-shaped vertical plate fixed on the pressing mechanism, one end of the Y-shaped vertical plate is fixedly provided with a cylinder five, a piston rod of the cylinder five is fixedly provided with a Y-shaped push plate, the Y-shaped push plate is in sliding connection with a sliding rail arranged on the Y-shaped vertical plate, the end part of the Y-shaped push plate is provided with a through hole, two inclined slots are symmetrically arranged on the Y-shaped push plate, each inclined slot is matched with a pin shaft arranged on the Y-shaped vertical plate, two pin shafts are respectively provided with an upper cutter and a lower cutter, and the upper cutter and the lower cutter are in sliding connection with the Y-shaped vertical plate.
As a further scheme of the invention: the transfer mechanism comprises a frame III fixedly mounted on the operation table, a rotating motor which is vertically arranged is fixedly mounted on the frame III, a rotating cylinder is fixedly mounted on an output shaft of the rotating motor, a cylinder six is fixedly mounted on a piston rod of the rotating cylinder through an L-shaped plate, a driving mechanism is arranged on a piston rod of the cylinder six, and a clamping plate is arranged at the end part of the driving mechanism.
As a further scheme of the invention: the driving mechanism comprises a movable rod I, a movable arm I and an L-shaped movable plate I, wherein the piston rod I is movably connected with the movable arm I which is symmetrically arranged, and the end part of the movable arm I is movably connected with the L-shaped movable plate I.
As a further scheme of the invention: the supporting mechanism comprises a frame IV fixedly arranged on the operating platform, an air cylinder seven is fixedly arranged on the frame IV, and a U-shaped supporting plate is fixedly arranged on a piston rod of the air cylinder seven.
The invention has the beneficial effects that:
the circuit board material layer structure manufactured by the process is used as an integral structure, can be used as a circuit board manufacturing material in the subsequent circuit board manufacturing process, and can be used for manufacturing circuit board structures such as a single-layer circuit board, a multi-layer flexible circuit board and a multi-layer soft and hard combined board through the subsequent processes such as direct hot pressing with other materials or circuit boards, thereby bringing great convenience to the subsequent manufacturing of the circuit board, simplifying the manufacturing process, accelerating the circuit board manufacturing speed, shortening the product processing time, improving the processing capacity of the manufacturing process and reducing the production cost; in addition, the product structure is optimized, and the product performance is improved.
According to the invention, through the arrangement of the spraying machine, the equipment can be sprayed twice, after spraying, spraying liquid can be scraped more uniformly, subsequent drying is facilitated, then cutting is performed, and the automation degree of the whole equipment is high;
the invention can process the solid spraying liquid stuck on the spray head by the structural arrangement of the spraying mechanism, and is convenient for continuous use.
Drawings
The invention is further described below with reference to the accompanying drawings.
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the overall structure of the spraying mechanism of the present invention;
FIG. 3 is a schematic side view of the spray mechanism of the present invention;
FIG. 4 is a schematic view of the internal structure of the through pipe of the present invention;
FIG. 5 is a schematic view of the overall structure of the squeegee mechanism of the invention;
FIG. 6 is a schematic view of the internal structure of the third cylinder of the present invention;
FIG. 7 is a schematic view of the overall structure of the hold-down mechanism of the present invention;
FIG. 8 is a schematic view of the overall structure of the movable compact of the present invention;
FIG. 9 is a schematic view of the overall structure of the shearing mechanism of the present invention;
FIG. 10 is a schematic view of the overall structure of the Y-shaped riser of the present invention;
FIG. 11 is a schematic view of the overall structure of the transfer mechanism of the present invention;
fig. 12 is a schematic view of the overall structure of the support mechanism of the present invention.
In the figure: 1. an operation table; 2. an unreeling roller; 3. a conveying rail; 4. a spraying mechanism; 5. a drying box; 6. a scraper mechanism; 7. a compressing mechanism; 8. a shearing mechanism; 9. a transfer mechanism; 10. a support mechanism; 41. a support rod; 42. a support plate; 43. a first motor; 44. a first cylinder; 45. a second motor; 46. a second cylinder; 47. a cylinder mounting plate; 48. a spraying box; 49. rotating the outer sleeve; 410. a clamping jaw; 411. a first screw rod; 412. an L-shaped lifting plate; 413. a first gear; 414. a second gear; 415. a rocker arm; 416. a scraper; 417. a spray head; 418. a lower plate; 419. a top plate; 420. a middle through pipe; 421. a liquid spraying pipe; 422. a control valve; 423. a liquid inlet hole; 61. a first frame; 62. a third cylinder; 63. a first piston rod; 64. a movable arm; 65. an L-shaped movable plate; 66. an L-shaped scraping plate; 71. a second frame; 72. a fourth cylinder; 73. a U-shaped block; 74. a movable pressing block; 75. a rotating shaft; 76. a backing plate; 81. y-shaped vertical plates; 82. a fifth cylinder; 83. a slide rail; 84. a Y-shaped push plate; 85. a chute; 86. a through hole; 87. a pin shaft; 88. an upper cutter; 89. a lower cutter; 91. a third frame; 92. a rotating electric machine; 93. a rotary cylinder; 94. a sixth air cylinder; 95. a driving mechanism; 96. a clamping plate; 101. a fourth frame; 102. a cylinder seven; 103. u-shaped backup pad.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1
Referring to fig. 1-12, the present invention is a method for coating and forming a high frequency circuit board material layer, comprising the following steps:
firstly, placing a copper foil disc on an unreeling roller 2 on a spraying machine, taking copper foil as a substrate, when the copper foil moves below a spraying mechanism 4, spraying liquid enters a liquid spraying pipe 421 through a liquid inlet 423, then spraying the surface of the copper foil through spray heads 417, and uniformly spraying a plurality of spray heads 417; meanwhile, the piston rod I63 pushes the movable arm 64 to move, so that the L-shaped movable plate 65 is driven to move to two sides, and the lower L-shaped scraping plate 66 is pushed to contact with the surface of the copper foil, so that the spraying liquid is uniformly scraped to form a liquid film; the liquid film is any one of a synthetic liquid PI film, a synthetic liquid MPI film, a synthetic liquid LCP film, a synthetic liquid TFP film and a synthetic liquid PTFE film;
step two, sending the copper foil containing the liquid film into a drying box 5 for drying, wherein the drying temperature is not higher than 400 ℃; forming a cured film on the copper foil to obtain a single panel;
step three, coating a layer of laminated liquid high-frequency material layer on the solidified film of the single panel through a spraying mechanism I, and scraping the liquid high-frequency material layer to be flat through a scraping mechanism I;
the synthetic liquid high-frequency material layer is a synthetic liquid MPI film, a synthetic liquid LCP film, a synthetic liquid TFP film, a synthetic liquid PTFE film or a synthetic liquid Low-Dk high-frequency functional adhesive;
the synthetic liquid Low-Dk high-frequency functional glue is obtained by adding a teflon or LCP material into liquid Adhesive glue;
adding an ion trapping agent into the synthetic liquid high-frequency material layer to obtain a synthetic liquid high-frequency material with a copper ion migration resistance function;
the MPI film, the LCP film, the TFP film or the PTFE film is adopted to replace the traditional PI film, and is used as a base material required by preparing a novel material layer structure of the high-frequency circuit board, so that the stability and the dimensional stability of the overall performance of the circuit board can be improved, the circuit board has high heat resistance, high-frequency characteristics, high-frequency signals can be transmitted, the transmission speed of the high-frequency signals can be accelerated, the high-speed transmission of the high-frequency signals is realized, the power consumption and the high-frequency signal transmission loss are low, the signal transmission performance of the circuit board is improved, the circuit board can adapt to the high-frequency and high-speed trend from a wireless network to terminal application at present, and the circuit board is particularly suitable for novel 5G and 6G technology products;
the semi-cured high-frequency material layer is adopted to replace the traditional semi-cured Adhesive, and the semi-cured high-frequency material layer has
The material can be an MPI film, an LCP film, a TFP film, a PTFE film, a Low-Dk high-frequency functional adhesive or a semi-solidified high-frequency material with a copper ion migration resistance function, so that the prepared novel material layer structure of the high-frequency circuit board has stronger and better high-heat resistance and high-frequency characteristics, can transmit high-frequency signals and accelerate the transmission speed of the high-frequency signals, realizes the high-speed transmission of the high-frequency signals, has Low power consumption and high-frequency signal transmission loss, further improves the signal transmission performance of the circuit board, can adapt to the current high-frequency and high-speed trend from a wireless network to terminal application, and is particularly suitable for novel 5G and 6G technological products;
step four, the single panel coated with the synthetic liquid high-frequency material layer is sent into a first drying box for drying, the drying temperature is not higher than 200 ℃, the synthetic liquid high-frequency material layer on the single panel is changed into a semi-solidified high-frequency material layer, and a high-frequency circuit board material layer structure is obtained;
step five, when the dried copper foil reaches the shearing mechanism 8, the cylinder 102 is driven to push the U-shaped supporting plate 103 to move, the U-shaped supporting plate 103 supports the end part of the copper foil, then the cylinder four 72 is started to push the U-shaped block 73 to rotate, further the movable pressing block 74 is pushed to rotate, the other end of the copper foil is pressed, at the moment, the cylinder five 82 is restarted to push the Y-shaped pushing plate 84 to move, the lower cutter and the upper cutter are pushed to move towards the middle to shear the copper foil, finally the U-shaped supporting plate 103 is reset, the rotary cylinder 93 is started at the moment, the cylinder six 94 is pushed to horizontally move, the clamping plate 96 is driven by the cylinder six 94 through the driving mechanism 95 to clamp the copper foil on the U-shaped supporting plate 103, and finally reset is carried out, and the rotary motor 2 drives the copper foil to rotate to output.
Example two
Referring to fig. 1-4, the spraying machine comprises an operation table 1, an unreeling roller frame is mounted at the top of the operation table 1, an unreeling motor is mounted on the unreeling roller frame, an unreeling roller 2 is arranged on the unreeling roller frame, a copper foil disc is placed on the unreeling roller 2, a conveying track 3 is arranged on one side of the unreeling roller frame, a plurality of inverted U-shaped pressing plates are arranged on the conveying track 3, copper foil passes through the lower portion of the U-shaped pressing plates and is used for limiting the copper foil, a spraying mechanism 4, a scraping plate mechanism 6, a drying box 5, a spraying mechanism I, a scraping plate mechanism I and a drying box I are sequentially arranged on the conveying track 3, a pressing mechanism 7 is arranged on one side of the drying box I, a shearing mechanism 8 is arranged on one side of the pressing mechanism 7, a transfer mechanism 9 is arranged on the opposite side of the shearing mechanism 8, and a supporting mechanism 10 is arranged at the end of the conveying track 3.
The first spraying mechanism 4 and the first spraying mechanism comprise a supporting rod 41 fixedly installed on the operating platform 1, a supporting plate 42 is fixedly installed at the top of the supporting rod 41, a first motor 43 is fixedly installed at the top of the supporting plate 42, an output shaft of the first motor 43 is connected with a speed reducer, a first screw rod 411 is arranged at the bottom of the speed reducer, an L-shaped lifting plate 412 is connected to the first screw rod 411 in a threaded manner, a plurality of first air cylinders 44 are fixedly installed at the top of the L-shaped lifting plate 412, and a spraying box 48 is fixedly installed at the end part of a piston rod of each first air cylinder 44; the first motor 43 is started, the first screw rod 411 is driven to rotate through the speed reducer, the first screw rod 411 drives the L-shaped lifting plate 412 to lift, and then the height of the spray head 417 can be adjusted, so that copper foils with different thicknesses can be conveniently used; meanwhile, the first cylinder 44 can be driven to push the spray head 417 to lift and lower, so that more accurate adjustment can be performed; a feeding pipe is arranged on one side of the spraying box 48 and used for feeding, one side of the spraying box 48 is slidably connected with the L-shaped lifting plate 412 to ensure that the spraying box is more stable in movement, the top of the spraying box 48 is connected with the cylinder mounting plate 47 through a supporting column, one end of the top of the cylinder mounting plate 47 is fixedly provided with the second motor 45, an output shaft of the second motor 45 penetrates through the cylinder mounting plate 47 and is connected with the first gear 413, one side of the second motor 45 is fixedly provided with the second cylinder 46, the bottom of a piston rod of the second cylinder 46 is fixedly provided with the second middle through pipe 420, the second gear 414 is sleeved on the second middle through pipe 420 and is rotatably connected with the spraying box 48 through a hollow shaft to support the second gear 414, the second gear 414 is connected with the second middle through a long key, and the second gear 414 is not driven to lift in the telescopic process of the second middle through pipe 420, the middle through pipe 420 can be driven to rotate through the rotation of the gear II 414, the gear II 414 is meshed with the gear I413, the middle through pipe 420 penetrates through the spraying box 48 and is connected with the upper disc 419, a sealing structure is arranged between the middle through pipe 420 and the spraying box 48, the tightness of the rotation and lifting movement of the middle through pipe 420 is ensured, a plurality of liquid inlet holes 423 are formed in the middle through pipe 420 and in the spraying box 48, the feeding is convenient, a liquid spraying pipe 421 is arranged in the middle through pipe 420, the upper end of the liquid spraying pipe 421 is in a horn mouth shape, the diameter is the same as the inner diameter of the middle through pipe 420, the feeding is convenient to be faster, the middle through pipe 420 is connected with the liquid spraying pipe 421 in a rotating manner, the liquid spraying pipe 421 is fixedly connected with the inner wall at the bottom of the spraying box 48, the lifting and the rotation of the middle through pipe 420 are convenient, the feeding and spraying of the liquid spraying pipe 421 are not affected, the liquid spraying pipe 421 penetrates through the middle through pipe 420 to be connected with the spray head 417, and a control valve 422 is arranged on the liquid spraying pipe 421.
A plurality of rocker arms 415 are equidistantly arranged on the outer peripheral surface of the upper disc 419 through movable blocks, clamping jaws 410 are movably connected to the bottoms of the rocker arms 415, scraping blades 416 are fixedly arranged on the inner sides of the clamping jaws 410, the plurality of rocker arms 415 are arranged on a lower disc 418, the lower disc 418 is sleeved on a liquid spraying pipe 421 and can not only play a supporting role, but also rotate, a rotary jacket 49 is arranged on a through pipe 420, and the upper disc 419, the rocker arms 415 and the lower disc 418 are arranged in the rotary jacket 49; the principle of the structure is equivalent to a clamping jaw manipulator.
When the copper foil moves below the spraying mechanism 4, spraying liquid enters the liquid spraying pipe 421 through the liquid inlet 423, then the surface of the copper foil is sprayed through the spray heads 417, and the plurality of spray heads 417 can realize uniform spraying; in the process of spraying for a long time, a lot of solid spraying liquid exists on the spray head 417, at this time, the driving cylinder II 46 drives the middle through pipe 420 to descend, and then drives the rocker 415 to move through the upper disc 419, and then drives the clamping jaw 410 to move inwards, the scraper 416 contacts with the solid spraying liquid, then the driving motor II 45 rotates, the driving gear I413 rotates, the gear I413 drives the gear II 414 to rotate, and then drives the scraper 416 to rotate, so that the solid spraying liquid on the spray head 417 is scraped.
Example III
On the basis of the second embodiment, referring to fig. 5-6, the first scraping plate mechanism 6 and the first scraping plate mechanism each comprise a first frame 61 fixedly installed on the operation platform 1, a third cylinder 62 is fixedly installed on the first frame 61, a first piston rod 63 of the third cylinder 62 is movably connected with two symmetrically arranged movable arms 64, an L-shaped movable plate 65 is movably connected to the end part of the movable arm 64, and an L-shaped scraping plate 66 is fixedly installed at the end part of the L-shaped movable plate 65; the movable arm 64 is pushed to move through the first piston rod 63, the L-shaped movable plate 65 is driven to move to two sides, the lower L-shaped scraping plate 66 is pushed to be in contact with the surface of the copper foil, spraying liquid is evenly scraped, subsequent drying is facilitated, and copper foils with different thicknesses are simultaneously processed.
Example IV
On the basis of the third embodiment, referring to fig. 7-12, the pressing mechanism 7 includes a second frame 71 fixedly installed on the console 1, a fourth cylinder 72 is movably connected to the second frame 71, a U-shaped block 73 is movably connected to a piston rod of the fourth cylinder 72, a movable pressing block 74 is fixedly installed at the bottom of the U-shaped block 73, the movable pressing block 74 is installed on a base plate 76 through a rotating shaft 75, and the base plate 76 is fixedly installed on the console 1.
The shearing mechanism 8 comprises a Y-shaped vertical plate 81 fixed on the pressing mechanism 7, one end of the Y-shaped vertical plate 81 is fixedly provided with a cylinder five 82, a piston rod of the cylinder five 82 is fixedly provided with a Y-shaped push plate 84, the Y-shaped push plate 84 is in sliding connection with a sliding rail 83 arranged on the Y-shaped vertical plate 81, the end part of the Y-shaped push plate 84 is provided with a through hole 86, two chute 85 are symmetrically arranged on the Y-shaped push plate 84, each chute 85 is matched with a pin shaft 87 arranged on the Y-shaped vertical plate 81, two pin shafts 87 are respectively provided with an upper cutter 88 and a lower cutter 89, and the upper cutter 88 and the lower cutter 89 are in sliding connection with the Y-shaped vertical plate 81.
The transfer mechanism 9 comprises a frame III 91 fixedly mounted on the operation table 1, a rotating motor 92 which is vertically arranged is fixedly mounted on the frame III 91, a rotating cylinder 93 is fixedly mounted on an output shaft of the rotating motor 92, a cylinder six 94 is fixedly mounted on a piston rod of the rotating cylinder 93 through an L-shaped plate, a driving mechanism 95 is arranged on a piston rod of the cylinder six 94, and a clamping plate 96 is arranged at the end part of the driving mechanism 95. The driving mechanism 95 comprises a first movable rod, a first movable arm and a first L-shaped movable plate, the first piston rod is movably connected with the first movable arm which is symmetrically arranged, the first L-shaped movable plate is movably connected with the end part of the first movable arm, and the principle of the structure is the same as that of the scraping plate mechanism 6. The supporting mechanism 10 comprises a frame IV 101 fixedly arranged on the operating platform 1, an air cylinder IV 102 is fixedly arranged on the frame IV 101, and a U-shaped supporting plate 103 is fixedly arranged on a piston rod of the air cylinder IV 102.
When the dried copper foil reaches the shearing mechanism 8, the cylinder 102 is driven to push the U-shaped supporting plate 103 to move, the U-shaped supporting plate 103 supports the end part of the copper foil, then the cylinder IV 72 is started to push the U-shaped block 73 to rotate, then the movable pressing block 74 is pushed to rotate, the other end of the copper foil is pressed, the cylinder V82 is restarted at the moment to push the Y-shaped pushing plate 84 to move, the lower cutter and the upper cutter are pushed to move towards the middle to shear the copper foil through the arrangement of the chute 85 and the pin shaft 87, finally the U-shaped supporting plate 103 is reset, the rotary cylinder 93 is started at the moment, the cylinder VI 94 is pushed to horizontally move, the cylinder VI drives the clamping plate 96 to clamp the copper foil on the U-shaped supporting plate 103 through the driving mechanism 95, and finally reset is carried out, and the rotary motor 2 drives the copper foil to rotate to output.
The foregoing describes one embodiment of the present invention in detail, but the description is only a preferred embodiment of the present invention and should not be construed as limiting the scope of the invention. All equivalent changes and modifications within the scope of the present invention are intended to be covered by the present invention.
Claims (7)
1. The high-frequency circuit board material layer coating and forming method is characterized by comprising the following steps of:
firstly, placing a copper foil disc on an unreeling roller (2) on a spraying machine, taking copper foil as a substrate, spraying liquid on the copper foil through a spraying mechanism (4), and scraping the spraying liquid to be flat through a scraping plate mechanism (6) to form a liquid film;
step two, sending the copper foil containing the liquid film into a drying box (5) for drying, wherein the drying temperature is not higher than 400 ℃; forming a cured film on the copper foil to obtain a single panel;
step three, coating a layer of laminated liquid high-frequency material layer on the solidified film of the single panel through a spraying mechanism I, and scraping the liquid high-frequency material layer to be flat through a scraping mechanism I;
step four, the single panel coated with the synthetic liquid high-frequency material layer is sent into a first drying box for drying, the drying temperature is not higher than 200 ℃, the synthetic liquid high-frequency material layer on the single panel is changed into a semi-solidified high-frequency material layer, and a high-frequency circuit board material layer structure is obtained;
the spraying machine comprises an operating table (1), an unreeling roller frame is arranged at the top of the operating table (1), an unreeling roller (2) is arranged on the unreeling roller frame, a copper foil disc is placed on the unreeling roller (2), a conveying track (3) is arranged on one side of the unreeling roller frame, a spraying mechanism (4), a scraping mechanism (6), a drying box (5), a spraying mechanism I, a scraping mechanism I and a drying box I are sequentially arranged on the conveying track (3), a pressing mechanism (7) is arranged on one side of the drying box I, a shearing mechanism (8) is arranged on one side of the pressing mechanism (7), a transferring mechanism (9) is arranged on the opposite side of the shearing mechanism (8), and a supporting mechanism (10) is arranged at the end part of the conveying track (3);
the spraying mechanism (4) and the spraying mechanism I both comprise a supporting rod (41) fixedly arranged on an operation table (1), a supporting plate (42) is fixedly arranged at the top of the supporting rod (41), a first motor (43) is fixedly arranged at the top of the supporting plate (42), an output shaft of the first motor (43) is connected with a speed reducer, a first screw rod (411) is arranged at the bottom of the speed reducer, an L-shaped lifting plate (412) is connected onto the first screw rod (411) in a threaded manner, a plurality of first air cylinders (44) are fixedly arranged at the top of the L-shaped lifting plate (412), a spraying box (48) is fixedly arranged at the end part of a piston rod of each first air cylinder (44), one side of the spraying box (48) is in sliding connection with the L-shaped lifting plate (412), an air cylinder mounting plate (47) is connected to the top of the spraying box (48) through a supporting column, an output shaft of the second motor (45) is fixedly arranged at the top of the air cylinder mounting plate (47) and is connected with a gear (413), one side of the second motor (45) is fixedly arranged on the gear (46), a gear (420) is fixedly connected with the gear (420) in the second air cylinder (46), and the gear (420) is fixedly connected with the gear (420) in the second air cylinder (46), the middle through pipe (420) penetrates through the spraying box (48) to be connected with the upper disc (419), a plurality of liquid inlet holes (423) are formed in the middle through pipe (420) and located in the spraying box (48), a liquid spraying pipe (421) is arranged in the middle through pipe (420), the middle through pipe (420) is rotationally connected with the liquid spraying pipe (421), the liquid spraying pipe (421) is fixedly connected with the inner wall of the bottom of the spraying box (48), the liquid spraying pipe (421) penetrates through the middle through pipe (420) to be connected with a spray head (417), and a control valve (422) is arranged on the liquid spraying pipe (421);
a plurality of rocker arms (415) are equidistantly arranged on the outer peripheral surface of the upper disc (419) through movable blocks, clamping jaws (410) are movably connected to the bottoms of the rocker arms (415), scraping blades (416) are fixedly arranged on the inner sides of the clamping jaws (410), the rocker arms (415) are all arranged on the lower disc (418), the lower disc (418) is sleeved on a liquid spraying pipe (421), a rotary outer sleeve (49) is arranged on the middle tube (420), and the upper disc (419), the rocker arms (415) and the lower disc (418) are arranged in the rotary outer sleeve (49).
2. The high-frequency circuit board material layer coating and forming method according to claim 1, wherein the first scraping plate mechanism (6) and the first scraping plate mechanism comprise a first frame (61) fixedly installed on an operation table (1), a third cylinder (62) is fixedly installed on the first frame (61), two symmetrically-arranged movable arms (64) are movably connected to a first piston rod (63) of the third cylinder (62), an L-shaped movable plate (65) is movably connected to the end part of each movable arm (64), and an L-shaped scraping plate (66) is fixedly installed at the end part of each L-shaped movable plate (65).
3. The high-frequency circuit board material layer coating and forming method according to claim 2, wherein the pressing mechanism (7) comprises a second frame (71) fixedly installed on the operation table (1), a fourth cylinder (72) is movably connected to the second frame (71), a U-shaped block (73) is movably connected to a piston rod of the fourth cylinder (72), a movable pressing block (74) is fixedly installed at the bottom of the U-shaped block (73), the movable pressing block (74) is installed on a base plate (76) through a rotating shaft (75), and the base plate (76) is fixedly installed on the operation table (1).
4. The high-frequency circuit board material layer coating forming method according to claim 2, wherein the shearing mechanism (8) comprises a Y-shaped vertical plate (81) fixed on the pressing mechanism (7), one end of the Y-shaped vertical plate (81) is fixedly provided with a cylinder five (82), a piston rod of the cylinder five (82) is fixedly provided with a Y-shaped push plate (84), the Y-shaped push plate (84) is in sliding connection with a sliding rail (83) arranged on the Y-shaped vertical plate (81), the end part of the Y-shaped push plate (84) is provided with a through hole (86), two chute grooves (85) are symmetrically formed in the Y-shaped push plate (84), the chute grooves (85) are matched with pin shafts (87) arranged on the Y-shaped vertical plate (81), an upper cutter (88) and a lower cutter (89) are respectively arranged on the pin shafts (87), and the upper cutter (88) and the lower cutter (89) are in sliding connection with the Y-shaped vertical plate (81).
5. The high-frequency circuit board material layer coating and forming method according to claim 2, wherein the transfer mechanism (9) comprises a frame three (91) fixedly installed on the operation table (1), a rotating motor (92) vertically arranged is fixedly installed on the frame three (91), a rotating cylinder (93) is fixedly installed on an output shaft of the rotating motor (92), a cylinder six (94) is fixedly installed on a piston rod of the rotating cylinder (93) through an L-shaped plate, a driving mechanism (95) is arranged on a piston rod of the cylinder six (94), and a clamping plate (96) is arranged at an end part of the driving mechanism (95).
6. The method for coating and forming a high-frequency circuit board material layer according to claim 5, wherein the driving mechanism (95) comprises a movable rod I, a movable arm I and an L-shaped movable plate I, two movable arms I which are symmetrically arranged are movably connected to a piston rod I, and an L-shaped movable plate I is movably connected to an end part of the movable arm I.
7. The high-frequency circuit board material layer coating and forming method according to claim 2, wherein the supporting mechanism (10) comprises a frame four (101) fixedly installed on the operation table (1), a cylinder seven (102) is fixedly installed on the frame four (101), and a U-shaped supporting plate (103) is fixedly installed on a piston rod of the cylinder seven (102).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211556541.3A CN115884521B (en) | 2022-12-06 | 2022-12-06 | High-frequency circuit board material layer coating forming method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211556541.3A CN115884521B (en) | 2022-12-06 | 2022-12-06 | High-frequency circuit board material layer coating forming method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115884521A CN115884521A (en) | 2023-03-31 |
| CN115884521B true CN115884521B (en) | 2023-11-17 |
Family
ID=85766058
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211556541.3A Active CN115884521B (en) | 2022-12-06 | 2022-12-06 | High-frequency circuit board material layer coating forming method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115884521B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110691469A (en) * | 2019-08-23 | 2020-01-14 | 李龙凯 | Coating forming method of novel material layer structure of high-frequency circuit board and product thereof |
| CN110711680A (en) * | 2019-11-11 | 2020-01-21 | 赣州逸豪新材料股份有限公司 | Be used for copper foil rubber coating to dry and tailor integrative equipment |
| CN111565515A (en) * | 2020-06-09 | 2020-08-21 | 江苏胜帆电子科技有限公司 | Manufacturing method of LCP material high-frequency plate |
| CN111659586A (en) * | 2020-06-12 | 2020-09-15 | 赣州逸豪新材料股份有限公司 | Copper foil gluing and drying equipment with adjustable thickness for aluminum substrate production |
| CN114700232A (en) * | 2022-04-09 | 2022-07-05 | 深圳市智力昌智能设备有限公司 | Coating, drying and rolling mill |
-
2022
- 2022-12-06 CN CN202211556541.3A patent/CN115884521B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110691469A (en) * | 2019-08-23 | 2020-01-14 | 李龙凯 | Coating forming method of novel material layer structure of high-frequency circuit board and product thereof |
| CN110711680A (en) * | 2019-11-11 | 2020-01-21 | 赣州逸豪新材料股份有限公司 | Be used for copper foil rubber coating to dry and tailor integrative equipment |
| CN111565515A (en) * | 2020-06-09 | 2020-08-21 | 江苏胜帆电子科技有限公司 | Manufacturing method of LCP material high-frequency plate |
| CN111659586A (en) * | 2020-06-12 | 2020-09-15 | 赣州逸豪新材料股份有限公司 | Copper foil gluing and drying equipment with adjustable thickness for aluminum substrate production |
| CN114700232A (en) * | 2022-04-09 | 2022-07-05 | 深圳市智力昌智能设备有限公司 | Coating, drying and rolling mill |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115884521A (en) | 2023-03-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110698112B (en) | Preparation method of low-dielectric-constant microwave dielectric substrate containing hollow ceramic powder | |
| CN111634103B (en) | LCP copper-clad plate laminating process based on 5G high-frequency signal transmission | |
| CN115884521B (en) | High-frequency circuit board material layer coating forming method | |
| CN115889115B (en) | Automatic processing system for continuous DBC copper-clad substrate and use method | |
| CN116321760B (en) | Compression molding method for high-frequency circuit board material layer | |
| CN116961344A (en) | Coil paint dipping device for motor rotor winding production | |
| CN115190708A (en) | Press fit technology for preventing inner layer from being lack of glue | |
| CN115921166A (en) | Flexible circuit board spraying device with material loading calibration locate function | |
| CN214800060U (en) | Dead-angle-free baking forming clamp for printed circuit board | |
| CN113660848A (en) | Hot-pressing device of mini-LED board and manufacturing method of mini-LED board | |
| CN112874878A (en) | Printed circuit copper-clad plate laminating equipment for electronic component | |
| CN220094803U (en) | Cutting device for PCB substrate | |
| CN211436878U (en) | Glue baking machine | |
| CN212527903U (en) | Novel cutting device of circuit board substrate | |
| CN215735070U (en) | Hot pressing equipment for producing heat-conducting aluminum substrate circuit | |
| CN216357574U (en) | Raw material processing device for producing multilayer PCB (printed Circuit Board) | |
| CN210868355U (en) | Circuit board surface coating drying device for circuit board production | |
| CN221114542U (en) | Equipment for sticking protective film after molding of flexible circuit board | |
| CN115155936B (en) | Conductive coating processing system and method for improving battery multiplying power and cycle performance | |
| CN219408598U (en) | Removable fiber paper lamination equipment | |
| CN117103367B (en) | Cutting equipment for production and processing on circuit board | |
| CN214419577U (en) | Detachable flowerpot wood-plastic plate surface embossing device | |
| CN116141463B (en) | Forming device of light building block brick | |
| CN208537213U (en) | A kind of portable PCB slice sampling device | |
| CN221010449U (en) | Stable coating device for resistance layer of flexible heating circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: B113, Comprehensive Building, 3rd Branch of Leibai Zhongcheng Life Science Park, No. 22 Jinxiu East Road, Jinsha Community, Kengzi Street, Pingshan District, Shenzhen City, Guangdong Province, 518118 Patentee after: Shida new material (Shenzhen) Co.,Ltd. Country or region after: China Address before: 518118 3rd Floor, Building A1, No. 9 Songzikeng Reservoir Road, Laokeng Community, Longtian Street, Pingshan District, Shenzhen, Guangdong Patentee before: Shida new material (Shenzhen) Co.,Ltd. Country or region before: China |
|
| CP03 | Change of name, title or address |