CN115881701A - Capacitor and chip - Google Patents

Abstract

The embodiment of the application provides a capacitor and a chip, and relates to the field of chip design. Wherein, the condenser includes: the semiconductor device comprises a substrate, a well region, a first active region, a second active region, polycrystalline silicon and a capacitor body. The substrate is doped with ions of a first type, and the well region is formed at a surface of the substrate and extends from the surface of the substrate to an interior of the substrate. The well region is doped with a second type of ions, the first type of ions being of opposite polarity to the second type of ions. The first active region and the second active region are implanted into a partial region of the well region, and polycrystalline silicon is deposited between two adjacent second active regions. The capacitor body is arranged in the upper area of the first active area. The capacitor is applied to a chip, so that the density of an active region and polycrystalline silicon of a capacitor region arranged in the chip can be improved, and the reliability of the chip is further improved.

Description

Capacitor and chip

Technical Field

The embodiment of the application relates to the field of chip design, in particular to a capacitor and a chip.

Background

MIM capacitors are widely used in various integrated circuits in semiconductor manufacturing because they provide better frequency and temperature dependent characteristics, reducing the difficulty and complexity of integration with CMOS front-end processes.

In the prior art, a MIM capacitor mainly includes a top metal, a first plate, and a second plate. The second polar plate is arranged between the first polar plate and the top metal layer, and the second polar plate is also connected with the top metal layer through the through hole.

However, such MIM capacitors are used in chips, which affects the reliability of the chips.

Disclosure of Invention

In view of the above problems, embodiments of the present application provide a capacitor and a chip, which overcome or at least partially solve the problem that the MIM capacitor described above is applied to a chip and affects the reliability of the chip.

According to a first aspect of embodiments of the present application, there is provided a capacitor including: the semiconductor device comprises a substrate, a well region, a first active region, a second active region, polycrystalline silicon and a capacitor body. The substrate is doped with ions of a first type, and the well region is formed on the surface of the substrate and extends from the surface of the substrate to the inside of the substrate. The well region is doped with a second type of ions, the first type of ions being of opposite polarity to the second type of ions. The first active region and the second active region are implanted into a partial region of the well region, the polysilicon is deposited between two adjacent second active regions, and the capacitor body is arranged in an area above the first active region.

In an embodiment of the present application, a capacitor includes: the semiconductor device comprises a substrate, a well region, a first active region, a second active region, polycrystalline silicon and a capacitor body. The capacitor is applied to a chip, so that the density of an active area of a capacitor area in the chip and the density of polycrystalline silicon can be improved, and the reliability of the chip is further improved. In addition, the capacitor body provided by the embodiment is disposed above the first active region, and the first active region is implanted in a partial region of the well region, so that the distance between the first plate and the first active region is relatively long, and parasitic capacitance generated between the first plate and the filling structure below the first plate can be reduced.

In an alternative form, the capacitor body includes: the first polar plate, the second polar plate and the top metal. The second polar plate is arranged between the first polar plate and the top metal, and the top metal is electrically connected with the second polar plate.

In an optional manner, the capacitor further includes: the isolation structure is a hollow structure, and the capacitor body is accommodated in the isolation structure.

In the embodiment, the etching precision of the capacitor can be improved by arranging the isolation structure, and unnecessary parasitic capacitance generated between the peripheral device of the capacitor and the capacitor body can be reduced.

In an alternative form, the isolation structure includes a first metal layer. The second active region is connected with the first metal layer through the first contact hole, and the polycrystalline silicon is connected with the first metal layer through the second contact hole.

Through the first contact hole and the second contact hole, the active region and the polycrystalline silicon can be connected together through the first metal layer, and the effect of reducing the resistance of the trap is achieved.

In an alternative, the sum of the area of the first active region and the area of the second active region is equal to the area of the polysilicon.

Therefore, when the capacitor is used in a chip, the area of the polycrystalline silicon in the area where the capacitor is located in the chip can be equal to the area of the active area, the proportion of the polycrystalline silicon in the chip to the active area can be more balanced, and the performance of the chip can be improved.

In an alternative approach, shallow trench isolation regions are formed beneath the polysilicon.

In an optional manner, the isolation structure further includes a second metal layer, and the first metal layer in the isolation structure is connected to the second metal layer through the first via. The first metal layer and the first pole plate are formed on the basis of the same mask, and the second metal layer and the top metal layer are formed on the basis of the same mask.

The first metal layer and the second metal layer are formed on the side face of the capacitor body, and can surround the capacitor body from the side face, so that the whole noise resistance of the capacitor is enhanced. And the first metal layer and the first pole plate are formed on the basis of the same mask, and the second metal layer and the top metal layer are formed on the basis of the same mask, so that the etching precision of the capacitor can be improved, and the production cost of the capacitor is reduced.

In an optional manner, the isolation structure further includes a second metal layer and a third metal layer. The first metal layer in the isolation structure is connected with the second metal layer through the first through hole, and the second metal layer is connected with the third metal layer through the second through hole. The second metal layer and the first pole plate are formed on the basis of the same mask, and the third metal layer and the top metal layer are formed on the basis of the same mask.

The first metal layer, the second metal layer and the third metal layer are formed on the side face of the capacitor body, and can surround the capacitor body from the side face, so that the whole noise resistance of the capacitor is enhanced. And the second metal layer and the first pole plate are formed on the basis of the same mask, and the third metal layer and the top metal layer are formed on the basis of the same mask, so that the etching precision of the capacitor is improved, the first pole plate of the capacitor body is far away from the substrate below the capacitor body, and the parasitic capacitance generated between the first pole plate and the substrate below the capacitor body is reduced.

In an optional manner, the isolation structure further includes a fourth metal layer, the third metal layer is connected to the fourth metal layer through a third via, and the fourth metal layer is higher than the top metal layer.

By making the fourth metal layer higher than the top metal layer, the parasitic capacitance generated between other devices adjacent to the capacitor and the top metal layer can be reduced, and the parasitic capacitance generated between other devices higher than the capacitor body and the top metal layer can be reduced, further enhancing the overall noise immunity of the capacitor.

In an optional mode, a projection area of the third metal layer on the plane of the substrate is located in a projection area of the fourth metal layer on the plane of the substrate, and an area of the projection area of the fourth metal layer on the plane of the substrate is larger than an area of the projection area of the third metal layer on the plane of the substrate.

Therefore, the fourth metal layer can better surround the capacitor body, and the whole noise resistance of the capacitor can be enhanced.

In an alternative mode, the projection of the fourth metal layer on the plane of the substrate and the projection of the capacitor body on the plane of the substrate have no overlapping area.

Therefore, the fourth metal layer does not exist right above the capacitor body, the integral noise resistance of the capacitor is enhanced, and meanwhile, the parasitic capacitance generated between the top metal layer and the fourth metal layer can be greatly reduced.

In an alternative, the first type is P-type and the second type is N-type.

In an alternative, the first type is N-type and the second type is P-type.

The second aspect of the present application also provides a chip including the capacitor provided in the first aspect of the present application.

The chip provided by the application improves the density of the active area of the capacitor and the density of the polycrystalline silicon, and improves the reliability of the chip.

The foregoing description is only an overview of the technical solutions of the embodiments of the present application, and the embodiments of the present application can be implemented according to the content of the description in order to make the technical means of the embodiments of the present application more clearly understood, and the detailed description of the present application is provided below in order to make the foregoing and other objects, features, and advantages of the embodiments of the present application more clearly understandable.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on the drawings without creative efforts.

Fig. 1 is a schematic layout diagram of a polysilicon and an active region disposed below a capacitor body according to an embodiment of the present disclosure.

Fig. 2 is a schematic cross-sectional view of a capacitor according to an embodiment of the present disclosure.

Description of the reference numerals:

01. a substrate; 02. a well region; 03. a first active region; 04. a second active region; 05. polycrystalline silicon; 06. a first metal layer; 07. a second contact hole; 08. shallow trench isolation regions; 09. a first electrode plate; 10. a top metal layer; 11. a second polar plate; 12. a metal via; 13. a second metal layer; 14. a first through hole; 15. a third metal layer; 16. a second through hole; 17. a fourth metal layer; 18. a third via.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

The terms "comprising" and "having," and any variations thereof, in the description and claims of this application and the description of the drawings are intended to cover, but not to exclude, other elements. The word "a" or "an" does not exclude the presence of a plurality.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase "an embodiment" in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

The following description is given with the directional terms as they are used in the drawings and is not intended to limit the specific structure of a capacitor and a chip of the present application. For example, in the description of the present application, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present application.

Further, expressions of directions indicated for explaining the operation and construction of each member of a capacitor and a chip of the present embodiment, such as the X direction, the Y direction, and the Z direction, are not absolute but relative, and although these indications are appropriate when each member of the capacitor and the chip is in the position shown in the drawings, when the position is changed, the directions should be interpreted differently to correspond to the change.

Furthermore, the terms "first," "second," and the like in the description and claims of the present application or in the above-described drawings are used for distinguishing between different objects and not necessarily for describing a particular sequential order, and may explicitly or implicitly include one or more of the features.

In the description of the present application, unless otherwise specified, "plurality" means two or more (including two), and similarly, "plural" means two or more (including two).

In the description of the present application, it should be noted that, unless explicitly stated or limited otherwise, the terms "mounted," "connected" and "connected" should be interpreted broadly, for example, the mechanical structures "connected" or "connected" may refer to physical connections, for example, the physical connections may be fixed connections, for example, fixed connections by fasteners, such as screws, bolts or other fasteners; the physical connection can also be a detachable connection, such as a mutual clamping or clamping connection; the physical connection may also be an integral connection, for example, a connection made by welding, gluing or integrally forming the connection. "connected" or "coupling" of circuit structures may mean not only physical coupling but also electrical or signal coupling, for example, direct coupling, i.e., physical coupling, or indirect coupling via at least one element therebetween, as long as electrical communication is achieved, or communication between the two elements; signal connection in addition to signal connection through circuitry, may also refer to signal connection through a media medium, such as radio waves. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

In the prior art, with the development of the semiconductor industry, capacitors are widely used in various integrated circuits. The inventor finds that, in the chip manufacturing process, not only the density of the active region and the density of the polysilicon in the whole chip need to reach a certain ratio, but also the density of the active region and the density of the polysilicon in each region in the chip need to reach a certain ratio. However, in a partial region of the chip where the capacitor is disposed, the density of the active region and the density of the polysilicon in the region are low due to the large volume of the capacitor, which affects the reliability of the chip.

Therefore, some embodiments of the present application provide a capacitor, which can improve the reliability of a chip when applied to the chip. Referring to fig. 1 and fig. 2, fig. 1 is a schematic layout diagram of a polysilicon and an active region disposed below a capacitor body according to an embodiment of the present disclosure, and fig. 2 is a schematic cross-sectional diagram of a capacitor according to an embodiment of the present disclosure.

As shown in fig. 1 and fig. 2, a capacitor provided in an embodiment of the present application includes: substrate 01, well region 02, first active region 03, second active region 04, polysilicon 05 and capacitor body. Wherein the substrate 01 is doped with the first type of ions, and the well region 02 is formed on the surface of the substrate 01 and extends from the surface of the substrate 01 to the inside of the substrate 01. The well region 02 is doped with ions of a second type, the first type of ions being of opposite polarity to the second type of ions. The first active region 03 and the second active region 04 are implanted in a partial region of the well region 02, and the polysilicon 05 is deposited between two adjacent second active regions 04. The capacitor body is disposed in an upper region of the first active region 03. For example, as shown in fig. 1, the polysilicon 05 includes 4 rectangular regions with the same shape, and the second active region 04 includes 4 rectangular regions with the same shape, and the inner region surrounded by the polysilicon 05 and the second active region 04 is the first active region 03 compared to the smaller square region of the first active region 03. In this way, the region of the polysilicon 05 and the region of the active region disposed under the capacitor are both regions with regular shapes, which facilitates the implementation of the production process.

In practical applications, the first type of ions may be P-type ions, such as boron, gallium, indium, etc., or N-type ions, such as phosphorus, arsenic, etc. The second type of ions may be either N-type or P-type ions. If the first type is P-type ions, the substrate 01 is a P-type substrate; accordingly, the second type of ions are N-type ions and the well 02 is an N-type well. If the first type is N-type ions, the substrate 01 is an N-type substrate; accordingly, the second type of ions are P-type ions and the well 02 is a P-type well.

Referring to fig. 2, the capacitor body includes: a first plate 09, a second plate 11 and a top metal 10. The second polar plate 11 is arranged between the first polar plate 09 and the top metal 10, the first polar plate 09 and the second polar plate 11 are all arranged in parallel, and the top metal 10 is electrically connected with the second polar plate 11. For example, the top metal 10 is electrically connected to the second plate 11 through a metal via 12, and the number of the metal vias 12 may be plural.

In an embodiment of the present application, a capacitor includes: substrate 01, well region 02, first active region 03, second active region 04, polysilicon 05 and capacitor body. When the capacitor is applied to a chip, the density of an active area of a capacitor area in the chip and the density of polycrystalline silicon 05 can be improved, and the reliability of the chip is further improved. Further, the polysilicon 05 is filled between the capacitor body and the substrate 01, and noise coupling between the capacitor body and the substrate 01 can be well isolated.

In practical applications, the inventors found that the performance of the chip is not only related to the respective densities of the polysilicon 05 and the active region, but also to the density ratio of the polysilicon 05 and the active region. .

Based on this, referring to fig. 1, the area of the polysilicon 05 may alternatively be made 30% -70% of the total area of the layout, for example, the area of the polysilicon 05 may be made 45% of the total area of the layout. In this way, the ratio of the total polysilicon 05 and the active region disposed below the capacitor body can be more equalized.

In an alternative way, the sum of the area of the first active region 03 and the area of the second active region 04 may be equal to the area of the polysilicon 05, and in this case, the area of the polysilicon 05 occupies 50% of the total area of the layout.

Therefore, the area of the polycrystalline silicon 05 arranged below the capacitor body can be equal to the area of the active area, and further, when the capacitor is used in a chip, the area of the polycrystalline silicon 05 in the area where the capacitor is located in the chip can be equal to the area of the active area, so that the proportion of the polycrystalline silicon 05 in the chip to the active area is balanced, and the performance of the chip is improved.

In practical applications, shallow trench isolation region 08 may be formed below polysilicon 05.

In some embodiments, to reduce unnecessary parasitic capacitance generated between devices surrounding the capacitor and the capacitor body, the capacitor provided by the present application may further include an isolation structure. The isolation structure is a hollow structure, and the capacitor body can be accommodated in the isolation structure.

In the embodiment, the etching precision of the capacitor can be improved by arranging the isolation structure, and unnecessary parasitic capacitance generated between the peripheral device of the capacitor and the capacitor body can be reduced.

In the above embodiment, the capacitor includes the well region 02, and in order to prevent the well resistance from affecting the performance of the capacitor, the isolation structure provided in this embodiment may include the first metal layer 06. The second active region 04 is connected to the first metal layer 06 through the first contact hole, and the polysilicon 05 is connected to the first metal layer 06 through the second contact hole 07. The number of the first contact holes and the number of the second contact holes 07 may be plural.

It can be seen that by providing the first contact hole and the second contact hole 07, the active region and the polysilicon 05 can be connected together through the first metal layer, which acts to reduce the well resistance.

In one embodiment, to improve the overall noise immunity of the capacitor, considering that the capacitor may be affected by other devices, the isolation structure may further include a second metal layer 13. The first metal layer 06 in the isolation structure is connected to the second metal layer 13 through a first via 14, where the second metal layer 13 is higher than the first metal layer 06, a projection of the second metal layer 13 on the plane of the substrate 01 may completely coincide with a projection of the first metal layer 06 on the plane of the substrate 01, and there may be a plurality of first vias 14. The first metal layer 06 and the first electrode plate 09 are formed based on the same mask, and the second metal layer 13 and the top metal layer 10 are formed based on the same mask.

At this time, the first metal layer 06 and the second metal layer 13 are formed on the side surfaces of the capacitor body, and can surround the capacitor body from the side surfaces, so that the overall noise immunity of the capacitor is enhanced. Moreover, the first metal layer 06 and the first electrode plate 09 are formed on the basis of the same mask, and the second metal layer 13 and the top metal layer 10 are formed on the basis of the same mask, so that the etching precision of the capacitor can be improved, and the production cost of the capacitor can be reduced.

It is to be noted that the capacitor provided in the above embodiment includes a metal material under the capacitor body, and the first plate 09 of the capacitor also includes a metal material, so that a parasitic capacitance that adversely affects the performance of the capacitor is likely to be generated therebetween.

Therefore, in an alternative manner, the isolation structure may further include the second metal layer 13 and the third metal layer 15. The third metal layer 15 is higher than the second metal layer 13, and a projection of the third metal layer 15 on the plane of the substrate 01 may completely coincide with a projection of the second metal layer 13 on the plane of the substrate 01. The first metal layer 06 in the isolation structure is connected to the second metal layer 13 through a first via 14, the second metal layer 13 is connected to the third metal layer 15 through a second via 16, and the number of the first via 14 and the number of the second via 16 may be multiple. The second metal layer 13 is formed on the basis of the same mask as the first plate 09, and the third metal layer 15 is formed on the basis of the same mask as the top metal layer 10, in which case the second via hole 16 and the metal via hole 12 may be formed together.

The first metal layer 06, the second metal layer 13 and the third metal layer 15 are formed on the side surface of the capacitor body, and can surround the capacitor body from the side surface, so that the whole noise resistance of the capacitor is enhanced. Moreover, the second metal layer 13 and the first electrode plate 09 are formed on the basis of the same mask, and the third metal layer 15 and the top metal layer 10 are formed on the basis of the same mask, so that the etching precision of the capacitor is improved, the first electrode plate 09 can be far away from the lower substrate 01, and the parasitic capacitance generated between the first electrode plate 09 and the lower substrate 01 is reduced.

In an alternative manner, referring to fig. 2, the isolation structure may further include a fourth metal layer 17, wherein the fourth metal layer 17 is higher than the third metal layer 15. The third metal layer 15 is connected to the fourth metal layer 17 through a third via 18, the number of the third vias 18 may be multiple, and the fourth metal layer 17 is higher than the top metal layer 10.

By making the fourth metal layer 17 higher than the top metal 10, the parasitic capacitance generated between other devices adjacent to the capacitor and the top metal 10 can be reduced, and the parasitic capacitance generated between other devices higher than the capacitor body and the top metal 10 can be reduced, further enhancing the overall noise immunity of the capacitor.

In practical applications, in order to make the fourth metal layer 17 better surround the capacitor body, referring to fig. 2, a projection area of the third metal layer 15 on the plane of the substrate 01 is located in a projection area of the fourth metal layer 17 on the plane of the substrate 01, and an area of the projection area of the fourth metal layer 17 on the plane of the substrate 01 is larger than an area of the projection area of the third metal layer 15 on the plane of the substrate 01. Therefore, the fourth metal layer 17 can better surround the capacitor body, and the whole noise resistance of the capacitor can be enhanced.

It should be noted that, since the fourth metal layer 17 and the top metal layer 10 are both made of metal materials, parasitic capacitance is generated between the two,

therefore, in this embodiment, there is no overlapping area between the projection of the fourth metal layer 17 on the plane of the substrate 01 and the projection of the capacitor body on the plane of the substrate 01. In this way, the fourth metal layer 17 does not exist right above the capacitor body, so that the parasitic capacitance generated between the top metal layer 10 and the fourth metal layer 17 can be greatly reduced while the overall noise immunity of the capacitor is enhanced.

It should be noted that, in practical application, the isolation structure of the capacitor provided in this embodiment may include more metal layers according to actual requirements, and the first plate 09 and the top metal layer 10 are formed on the same mask as the several metal layers, or may be changed. The present embodiment does not specifically limit this.

For example, the isolation structure of the capacitor may further include a fifth metal layer and a sixth metal layer, the sixth metal layer being higher than the fifth metal layer, the fifth metal layer being higher than the fourth metal layer 17. For another example, the first plate 09 and the third metal layer 15 are formed on the basis of the same mask, and the top metal layer 10 and the fourth metal layer 17 are formed on the basis of the same mask. At this time, the sixth metal layer is the highest-level metal, and referring to the description of the foregoing embodiment, projections of the first metal layer 06, the second metal layer 13, the third metal layer 15, the fourth metal layer 17, and the fifth metal layer on the plane where the substrate 01 is located may all completely coincide, a projection area of the sixth metal layer on the plane where the substrate 01 is located may be larger than a projection area of the fifth metal layer on the plane where the substrate 01 is located, and a projection of the sixth metal layer on the plane where the substrate 01 is located and a projection of the capacitor body on the plane where the substrate 01 is located have no overlapping area.

That is, one skilled in the art can select the most suitable number of metal layers by combining the noise immunity of the capacitor, the size of the parasitic capacitance that may be generated, and the manufacturing cost, and the first plate 09 and the top metal 12 are formed on the same mask as the second metal layer, which is not limited in the embodiment of the present invention.

Another embodiment of the present application further provides a chip including the capacitor provided in any one of the above embodiments, and details described in the above embodiments are still applicable to this embodiment and are not described herein again.

The chip provided by the embodiment improves the density of the active area of the capacitor and the density of the polysilicon, and improves the reliability of the chip.

Those of skill in the art will understand that while some embodiments herein include certain features included in other embodiments, combinations of features of different embodiments are meant to be within the scope of the application and form different embodiments. For example, in the claims, any of the claimed embodiments may be used in any combination.

The above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present application.

Claims (14)

1. A capacitor, comprising: the semiconductor device comprises a substrate, a well region, a first active region, a second active region, polycrystalline silicon and a capacitor body, wherein the substrate is provided with a first opening and a second opening;

the substrate is doped with ions of a first type;

the well region is formed on the surface of the substrate and extends from the surface of the substrate to the interior of the substrate; the well region is doped with ions of a second type; the first type of ions is of opposite polarity to the second type of ions;

the first active region and the second active region are implanted in the well region partial region;

the polycrystalline silicon is deposited between two adjacent second active regions;

the capacitor body is disposed in an upper region of the first active region.

2. The capacitor of claim 1, wherein the capacitor body comprises: the first polar plate, the second polar plate and the top metal;

the second polar plate is arranged between the first polar plate and the top layer metal, and the top layer metal is electrically connected with the second polar plate.

3. The capacitor of claim 2, further comprising:

the isolation structure is a hollow structure, and the capacitor body is accommodated in the isolation structure.

4. The capacitor of claim 3 wherein said isolation structure comprises a first metal layer, said second active region is connected to said first metal layer through a first contact hole, and said polysilicon is connected to said first metal layer through a second contact hole.

5. The capacitor of claim 1, wherein the sum of the area of the first active region and the area of the second active region is equal to the area of the polysilicon.

6. The capacitor of claim 1 wherein said polysilicon is formed with shallow trench isolation regions thereunder.

7. The capacitor of claim 4, wherein the isolation structure further comprises a second metal layer, wherein the first metal layer in the isolation structure is connected to the second metal layer by a first via;

the first metal layer and the first polar plate are formed on the basis of the same mask;

the second metal layer and the top metal layer are formed on the basis of the same mask.

8. The capacitor of claim 4, wherein the isolation structure further comprises a second metal layer, a third metal layer, the first metal layer in the isolation structure being connected to the second metal layer through a first via, the second metal layer being connected to the third metal layer through a second via;

the second metal layer and the first polar plate are formed on the basis of the same mask;

the third metal layer and the top metal layer are formed on the basis of the same mask.

9. The capacitor of claim 8, wherein the isolation structure further comprises a fourth metal layer, the third metal layer connected to the fourth metal layer by a third via;

the fourth metal layer is higher than the top metal layer.

10. The capacitor according to claim 9, wherein a projection area of the third metal layer on the plane of the substrate is located within a projection area of the fourth metal layer on the plane of the substrate, and an area of the projection area of the fourth metal layer on the plane of the substrate is larger than an area of the projection area of the third metal layer on the plane of the substrate.

11. The capacitor of claim 10 wherein a projection of said fourth metal layer onto a plane of said substrate and a projection of said capacitor body onto a plane of said substrate are free of an overlap region.

12. The capacitor of claim 1, wherein the first type is P-type and the second type is N-type.

13. The capacitor of claim 1 wherein said first type is N-type and said second type is P-type.

14. A chip comprising a capacitor according to any one of claims 1 to 13.

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